Scalable imaging device

Abstract

An expandable imaging device. The imaging device includes: a front shell that forms the appearance of the device; a rear shell that, together with the front shell, forms the appearance of the device; and a board member. At least one of the front shell and the rear shell has an arm portion that extends in a direction substantially parallel to the optical axis of the imaging device and is integrated with at least one of the front shell and the rear shell. The front shell and the rear shell are connected by the arm portion. The board member is fixed to the front shell and the rear shell so as to cover an opening formed in a state where the front shell and the rear shell are connected by the arm portion.

Description

Technical Field

[0001] The present invention relates to a scalable imaging device. Background Art

[0002] In many cases, the appearance of an industrial camera is configured such that an intermediate member is disposed between a front case and a rear case. Further, in many cases, depending on the usage, the industrial camera is used by attaching expansion modules such as a cooling fan and heat radiating fins. Therefore, when a user attaches a desired expansion module, the intermediate member may be replaced or newly manufactured according to the expansion module. As a result, there has been a problem of increased cost.

[0003] Regarding this problem, Japanese Unexamined Patent Application Publication No. 2002-131829 proposes an imaging device (camera) having an appearance formed of a front case, a rear case, side brackets, an upper case, and a lower case. In this imaging device, the side brackets are fastened to the front case and the rear case, an opening is formed between the front case and the rear case, and the upper case and the lower case can be attached to and detached from the side brackets.

[0004] However, since the side brackets are fastened to the front case and the rear case in the imaging device described in the above publication, a new side bracket must be newly manufactured when the imaging device is extended in the optical axis direction. Summary of the Invention

[0005] The present invention provides a scalable imaging device.

[0006] Accordingly, a first aspect of the present invention provides an imaging device including: a front case forming an appearance of the device; a rear case forming the appearance of the device together with the front case; and a plurality of plate members, wherein at least one of the front case and the rear case has a plurality of arm portions extending in a direction substantially parallel to an optical axis of the imaging device and integrated with at least one of the front case and the rear case, the front case and the rear case are connected by the plurality of arm portions, and the plurality of plate members are fixed to the front case and the rear case so as to cover a plurality of openings formed in a state where the front case and the rear case are connected by the arm portions.

[0007] According to the present invention, a scalable imaging device is provided at low cost.

[0008] Other features of the present invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. Brief Description of the Drawings

[0009] Figure 1A 、 Figure 1B and Figure 1C are perspective views showing an imaging device and an imaging system according to a first embodiment.

[0010] Figure 2A and Figure 2B is an exploded perspective view showing the imaging device.

[0011] Figure 3A and Figure 3B is an exploded perspective view showing the housing portion of the imaging device.

[0012] Figure 4A and Figure 4B is a perspective view showing the front shell that constitutes the housing portion of the imaging device. Figure 4C is a front view showing the front shell.

[0013] Figure 5A and Figure 5B is a perspective view showing the rear shell that constitutes the housing portion of the imaging device.

[0014] Figure 6A and Figure 6B is a perspective view showing the state in which the mounting base, front shell, rear shell, and sealing member that constitute the housing portion of the imaging device have been assembled.

[0015] Figure 7A and Figure 7B is a perspective view showing the sealing member that constitutes the housing portion of the imaging device.

[0016] Figure 8A and Figure 8B is showing Figure 6A a YZ cross-sectional view of a partial DD in

[0017] Figure 9 is showing Figure 6A another YZ cross-sectional view of a partial DD in

[0018] Figure 10A and Figure 10B is a cross-sectional view showing the states before and after attaching a side plate to Figure 8B in

[0019] Figure 11A and Figure 11B is a perspective view showing the first mounting module that constitutes the imaging device.

[0020] Figure 12A and Figure 12B is an exploded perspective view showing the main part of the first mounting module.

[0021] Figure 13 is a perspective view showing the mounting member of the first interchangeable lens.

[0022] Figure 14A 、 Figure 14B and Figure 14CIt is a front view showing the positional relationship between the movable mounting member of the first mounting module and the bayonet claw of the first interchangeable lens.

[0023] Figure 15A , Figure 15B and Figure 15C are cross-sectional views taken along line D-D in Figure 14A , line E-E in Figure 14B , and line F-F in Figure 14C respectively.

[0024] Figure 16A , Figure 16B and Figure 16C are enlarged views showing part G in Figure 14A , part H in Figure 14B , and part J in Figure 14C respectively.

[0025] Figure 17A and Figure 17B is an exploded perspective view showing the first mounting module.

[0026] Figure 18A is a front view showing the first mounting module, Figure 18B is a cross-sectional view taken along line C-C in Figure 18A respectively.

[0027] Figure 19 is an exploded perspective view showing the front module constituting the imaging device.

[0028] Figure 20A and Figure 20B are exploded perspective views showing the imaging module constituting the front module.

[0029] Figure 21 is a cross-sectional view taken along line L-L in Figure 19 respectively.

[0030] Figure 22 is an exploded perspective view showing the front module in the state where the first mounting module is attached.

[0031] Figure 23A and Figure 23B are a perspective view and a side view showing the washer used in the front module.

[0032] Figure 24 is a rear view showing the state where the imaging module is attached to the front case.

[0033] Figure 25A and Figure 25B are perspective views showing the state where the imaging module is attached to the front case.

[0034] Figure 26A is alongFigure 25B The sectional view taken along line M-M in Figure 26B is a view showing Figure 26A a partial enlarged view of part K in

[0035] Figure 27A and Figure 27B is an exploded perspective view showing the main substrate of the front module and adjacent components.

[0036] Figure 28 is a rear view showing the main substrate.

[0037] Figure 29A and Figure 29B is an exploded perspective view showing the heat sink unit of the front module.

[0038] Figure 30 is a rear view showing the heat sink unit.

[0039] Figure 31A and Figure 31B is an exploded perspective view showing the rear module that constitutes the imaging device.

[0040] Figure 32 is a rear view of the rear module.

[0041] Figure 33A is a front view showing the imaging device, Figure 33B is along Figure 33A the sectional view taken along line A-A in

[0042] Figure 34A is an exploded perspective view showing a group of components related to the shock-resistant structure of the main substrate, Figure 34B is a view showing Figure 33B an enlarged view of part N in

[0043] Figure 35A is a perspective view showing the state where the fixing module is attached to the imaging device, Figure 35B is a perspective view explaining the attachment method.

[0044] Figure 36 is a perspective view showing the state where the microphone module is attached to the imaging device.

[0045] Figure 37A and Figure 37B is a perspective view explaining the method of attaching the microphone module to the imaging device.

[0046] Figure 38 is a perspective view showing the state where the grip module is attached to the imaging device.

[0047] Figure 39A and Figure 39B is a perspective view explaining the method of attaching the grip part to the imaging device.

[0048] Figure 40 is a perspective view showing the state where the handle module is attached to the imaging device.

[0049] Figure 41A and Figure 41B is a perspective view illustrating a method of attaching the handle portion to the imaging device.

[0050] Figure 42A and Figure 42B is a perspective view showing the state where the recording module is attached to the imaging device.

[0051] Figure 43 is a perspective view showing the state where the extension terminal module is attached to the imaging device.

[0052] Figure 44A is a perspective view showing the state where the wireless module is attached to the imaging device. Figure 44B and Figure 44C is a perspective view illustrating a method of attaching the wireless communication unit to the imaging device.

[0053] Figure 45 is a perspective view showing the state where the display module is attached to the imaging device.

[0054] Figure 46A and Figure 46B is a perspective view showing the state where the battery module is attached to the imaging device.

[0055] Figure 47 is a perspective view showing the state where the operation module is attached to the imaging device.

[0056] Figure 48 is a perspective view showing the state where the lighting module is attached to the imaging device.

[0057] Figure 49A and Figure 49B is a perspective view and a front view showing the state where the heat sink module is attached to the imaging device.

[0058] Figure 50A and Figure 50B are respectively cross-sectional views taken along the lines R - R and S - S in Figure 49B .

[0059] Figure 51A and Figure 51B is a perspective view showing the first state where the cooling fan module and the vent module are attached to the imaging device.

[0060] Figure 52A and Figure 52B is an exploded perspective view showing the cooling fan module and the vent module.

[0061] Figure 53A is a top view showing Figure 51A the state in Figure 53B is a sectional view taken along line T-T in Figure 53A .

[0062] Figure 54A is a top view showing the second state in which the cooling fan module and the vent module are attached to the imaging device. Figure 54B is along Figure 54A is a sectional view taken along line U-U in

[0063] Figure 55A is a top view showing the third state in which the cooling fan module and the vent module are attached to the imaging device. Figure 55B is along Figure 55A is a sectional view taken along line V-V in

[0064] Figure 56 is a perspective view showing the imaging device according to the second embodiment.

[0065] Figure 57A and Figure 57B is a perspective view showing Figure 56 the second mounting module of the imaging device in

[0066] Figure 58A is a perspective view showing the state in which the second interchangeable lens is attached to the imaging device. Figure 58B is a perspective view showing the second interchangeable lens.

[0067] Figure 59 is a perspective view showing the state in which the lens cap is attached to the imaging device.

[0068] Figure 60A is a sectional view showing the state in which the second interchangeable lens and the lens cap are attached to the imaging device. Figure 60B is showing Figure 60A a partial enlarged view of a part of FF in

[0069] Figure 61A and Figure 61B is a perspective view showing the positional relationship between the imaging device before attachment and the mounting adapter.

[0070] Figure 62A and Figure 62B is a perspective view showing the imaging device according to the third embodiment.

[0071] Figure 63 is showing Figure 62A a side view of the imaging device in

[0072] Figure 64A and Figure 64BIt is a perspective view showing a method of attaching a side plate to a imaging device.

[0073] Figure 65A and Figure 65B is an exploded perspective view showing the imaging device.

[0074] Figure 66A is a front-side perspective view showing the imaging device according to the fourth embodiment. Figure 66B is showing Figure 66A an enlarged cross-sectional view of a part EE in Detailed Description of the Invention

[0075] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the front-side perspective view is a view of an object as viewed from the inclined front side of the object, and the back-side perspective view is a view of the object as viewed from the inclined back side of the object. It should be noted that the same expressions are used for the exploded perspective view.

[0076] The first embodiment will be described. Figure 1A and Figure 1B are a front-side perspective view and a back-side perspective view showing the imaging device 1000 according to the first embodiment. Figure 1C is a perspective view showing the appearance of the imaging system in which the first lens barrel 200 (so-called interchangeable lens) is attached to the imaging device 1000.

[0077] For convenience of explanation, as Figure 1A , Figure 1B and Figure 1C shown, an orthogonal coordinate system is defined. The Z direction is parallel to the imaging optical axis (hereinafter referred to as the "optical axis") of the imaging device 1000. The X direction is the width direction of the imaging device 1000 that perpendicularly intersects the Z direction. The Y direction is the height direction of the imaging device 1000 that perpendicularly intersects the Z direction and the X direction. In the Z direction, the direction toward the subject as the imaging object is the positive direction (+Z direction) and the opposite direction is the negative direction (-Z direction). In the X direction, the right direction when viewing the imaging device 1000 from the +Z side is the positive direction (+X direction) and the opposite direction (left direction) is the negative direction (-X direction). In the Y direction, when the X direction and the Z direction are parallel to the horizontal plane, the upward direction is the positive direction (+Y direction) and the opposite direction (downward direction) is the negative direction (-Y direction). It should be noted that the front side, the back side, the left side, the right side, the upper side, and the lower side of the imaging device 1000 are defined as the +Z side, the -Z side, the +X side, the -X side, the +Y side, and the -Y side, respectively.

[0078] On the front surface of the imaging device 1000, a main body side mounting surface 321 is provided for detachably mounting (replacing) the first lens barrel 200. On the upper surface, lower surface, right surface, and left surface of the imaging device 1000, upper mounting internal thread portions S1, lower mounting internal thread portions S2, right mounting internal thread portions S3, and left mounting internal thread portions S4 are respectively provided for fixing the imaging device 1000 to a housing (not shown).

[0079] The upper mounting internal thread portions S1 and the lower mounting internal thread portions S2 are provided at corresponding four corner portions of the upper surface and the lower surface of the imaging device 1000. The right mounting internal thread portions S3 and the left mounting internal thread portions S4 are provided at corresponding two corner portions of the right surface and the left surface on the side where the main body side mounting surface 321 of the imaging device 1000 is located.

[0080] First interface connectors 540, second interface connectors 550, third interface connectors 560, and fourth interface connectors 570 for power supply, signal output, etc. are provided on the back surface of the imaging device 1000.

[0081] Figure 2A and Figure 2B are a front side exploded perspective view and a back side exploded perspective view of the imaging device 1000. The imaging device 1000 has a frame portion as the main body. Side plates (plate members) 610a and 610b are respectively attached to the upper surface and the lower surface of the frame portion by fixing screws 630. Similarly, side plates 610c and 610d are respectively attached to the right surface and the left surface of the frame portion by fixing screws 630. It should be noted that the side plates 610a to 610d are members constituting the appearance of the imaging device 1000. The detailed structure and the attachment to the frame portion will be mentioned later.

[0082] Figure 3A and Figure 3B are a front side exploded perspective view and a back side exploded perspective view of the frame portion of the imaging device 1000. The frame portion of the imaging device 1000 is constituted by successively connecting a first mounting module 300, a front module 400, and a rear module 500 from the front side (+Z side) to the back side (-Z side).

[0083] The first mounting module 300 is provided with a mounting base 310 and a fixing and mounting member 320 (see Figure 12A) The fixed mounting member 320 has a main body side mounting surface 321 capable of loading and unloading the first lens barrel 200. A positioning boss (positioning portion) 311 for positioning the first mounting module 300 to the front module 400 is provided on the back surface of the mounting base 310 (the surface facing the front module 400). It should be noted that the first mounting module 300 is an example of a module that can be attached to the front side of the front module 400 and detached from the front side of the front module 400. Another module can be attached to the front side of the front module 400. Details of the structure of the first mounting module 300 will be mentioned later.

[0084] The main substrate 450 (second substrate, see Figure 19 ) and the image sensor 425 (see Figure 20A ) are provided inside the front module 400. In addition, the front module 400 has a front shell 410 that constitutes the appearance. A positioning hole 411 into which the positioning boss 311 is fitted is provided on the front surface of the front shell 410 (the surface facing the mounting base 310). In a state where the positioning boss 311 of the mounting base 310 is fitted into the positioning hole 411 of the front shell 410, the first mounting module 300 is fastened (connected) to the front module 400 from the +Z side by fixing screws 390.

[0085] A sealing member 620 for ensuring waterproofness is disposed between the front module 400 and the rear module 500. All interfaces of the imaging device 1000 are concentrated in the rear module 500. Therefore, by replacing the rear module 500, it is possible to change to other interfaces. It should be noted that details of the structure that can attach the rear module 500 to the front module 400 and detach it from the front module 400 will be mentioned later.

[0086] The rear module 500 has a rear shell 510 that forms the appearance. A first interface connector 540 and the like are disposed in the rear shell 510. It should be noted that details of the modules constituting the housing portion will be mentioned later.

[0087] Next, the components constituting the appearance will be described. Figure 4A and Figure 4B are a front side perspective view and a back side perspective view showing the front shell 410 constituting the front module 400.

[0088] An approximately rectangular opening 412 as a light guide portion that guides incident light through the first lens barrel 200 to the image sensor is provided in the front shell 410. In addition, the front shell 410 has four arm portions 413a, 413b, 413c, 413d extending in the -Z direction parallel to the Z direction. The front ends of the arm portions 413a to 413d serve as support portions 418a, 418b, 418c, and 418d, and positioning bosses (positioning portions) 414a, 414b, 414c, and 414d are formed in the support portions 418a, 418b, 418c, and 418d, respectively. In addition, recesses 415a, 415b, 415c, and 415d are provided in the upper surface, lower surface, right surface, and left surface of the front shell 410, respectively.

[0089] Figure 4C 4 is a front view showing the front shell 410. When the front shell 410 is viewed from the front side (in the front view), the front shell 410 is formed into a shape inscribed in a dotted circle. The appearance of the arm portions 413a to 413d of the front shell 410 presents an arc shape inscribed in a circle centered on the optical axis in the front view.

[0090] Figure 5A and Figure 5B 2 is a back side stereogram and a front side stereogram showing a rear shell 510 constituting the rear module 500. The rear shell 510 has four holes 511 into which the first interface connector 540 and the like are fitted. In addition, recesses 514a, 514b, 514c and 514d are respectively arranged on the upper surface, lower surface, right surface and left surface of the rear shell 510. The rear shell 510 has four arms 512a, 512b, 512c and 512d extending in parallel to the Z direction toward the +Z direction. The front ends of the arms 512a to 512d serve as pressurizing portions 515a, 515b, 515c and 515d respectively formed with positioning holes 513a, 513b, 513c and 513d.

[0091] The rear shell 510 is positioned to the front shell 410 by fitting the positioning bosses 414a to 414d of the front shell 410 into the positioning holes 513a to 513d of the rear shell 510, respectively. The arm portions 512a to 512d of the rear shell 510 have an arc shape inscribed in the same circle inscribed in the arm portions 413a to 413d in the front view.

[0092] Figure 6A and Figure 6BIt is a front-side perspective view and a back-side perspective view showing a state in which the mounting base 310, the front case 410, the rear case 510, and the sealing member 620 are assembled. The front case 410 and the rear case 510 are connected with the sealing member 620 inserted therebetween. As a result, an upper opening H1, a lower opening H2, a right opening H3, and a left opening H4 are formed by the arm portions 413a to 413d of the front case 410, the arm portions 512a to 512d of the rear case 510, and the second pressing surfaces 622a and 622b of the sealing member 620.

[0093] The arm portions 413a to 413d of the front case 410, the arm portions 512a to 512d of the rear case 510, and the appearance bending portion 626 of the sealing member 620 (see Figure 7A ) present substantially the same arc shape. Therefore, the concave portion 415a of the front case 410, the concave portion 514a of the rear case 510, and the second pressing surfaces 622a and 622b of the sealing member 620 corresponding to these concave portions form substantially the same plane. In the same manner, the concave portions 415b to 415d, the concave portions 514b to 514d, and the second pressing surfaces 622a, 622b of the sealing member 620 corresponding to these concave portions respectively form substantially the same plane.

[0094] In the following description, the four concave portions respectively formed by the concave portions 415a to 415d of the front case 410, the concave portions 514a to 514d of the rear case 510, and the second pressing surfaces 622a and 622b of the sealing member 620 are referred to as square frame concave portions 640.

[0095] The upper opening H1, the lower opening H2, the right opening H3, and the left opening H4 have the same shape, and thus, the side plates 610a to 610d also have the same shape. As Figure 2A and Figure 2B shown, the side plates 610a to 610d respectively cover the upper opening H1, the lower opening H2, the right opening H3, and the left opening H4. The side plates 610a to 610d are respectively fitted into the square frame concave portions 640 and attached. For example, the fixing screw 630 is screwed into the internal thread portions 491a and 491b of the front case 410 and the internal thread portions 519a and 519b of the rear case 510 through the insertion hole 613a of the side plate 610a. Thus, the side plate 610a closes the upper opening H1 and is fastened to the front case 410 and the rear case 510 so as to connect the front case 410 and the rear case 510. Therefore, the description of the side plates 610b to 610d that fasten the front case 410 and the rear case 510 in the same manner as the side plate 610a is omitted.

[0096] It should be noted that the depth of the square frame recess 640 is designed such that the side plates 610a to 610d do not protrude from the surfaces of the front case 410 and the rear case 510 in a state where the side plates 610a to 610d are attached to the frame portion of the imaging device 1000. Additionally, the internal thread portions 491a and 491b are respectively provided at the centers of the abutment recesses 419a and 419b provided in the front case 410. And the internal thread portions 519a and 519b are respectively provided at the centers of the abutment recesses 517a and 517b provided in the rear case 510. The abutment recesses 419a and 419b and the abutment recesses 517a and 517b will be referred to later with reference to Figure 6A 、 Figure 6B 、 Figure 10A and Figure 10B .

[0097] Incidentally, although the arm portions are provided in both the front case 410 and the rear case 510 in the present embodiment, the arm portions may be provided in one of the front case 410 and the rear case 510. Additionally, two arm portions may be provided in each of the front case 410 and the rear case 510. The number of arm portions provided in the front case 410 and the rear case 510 is not limited to four and should be two or more.

[0098] Next, the waterproof structure in the connecting portion between the front case 410 and the rear case 510, that is, the waterproof structure using the sealing member 620, will be described. Figure 7A and Figure 7B are a front-side perspective view and a back-side perspective view showing the sealing member 620. As described above, the sealing member 620 is clamped in the Z direction by the arm portions 413a to 413d of the front case 410 and the arm portions 512a to 512d of the rear case 510. The four sealing members 620 provided in the imaging device 1000 are identical components. As shown by the coordinate axes, for ease of explanation, Figure 7A and Figure 7B show the sealing member 620 disposed between the arm portions 413a and 512a of the imaging device 1000.

[0099] A positioning hole 625 having a shape corresponding to the positioning boss 414a of the front case 410 is formed in the central portion of the sealing member 620. Then, a first pressing surface 621 ( Figure 7B the shaded portion in ) is provided on the rear side (-Z side) of the surface that perpendicularly intersects the central axis of the positioning hole 625. And a first support portion 623 is provided on the opposite front side (+Z side).

[0100] In addition, the sealing member 620 has an outer curved portion 626 that is exposed on the exterior when the imaging device 1000 is assembled, and two outer flat portions 627a and 627b. The two outer flat portions 627a and 627b extend from respective ends of the outer curved portion 626 and intersect each other substantially perpendicularly. In addition, the sealing member 620 has second pressing surfaces 622a and 622b that are parallel to the outer flat portions 627a and 627b, respectively ( Figure 7A the shaded portions in). In the sealing member 620, a second support portion 624a is provided on the opposite side in the Y direction of the second pressing surface 622a, and a second support portion 624b is provided on the opposite side in the X direction of the second pressing surface 622b.

[0101] Figure 8A and Figure 8B are Figure 6A a YZ cross-sectional view of a partial DD in (a view showing a cross-section that intersects perpendicularly to the X direction). Figure 8A and Figure 8B show the states before and after the front housing 410 and the rear housing 510 compress the sealing member 620 in the Z direction. Since the four connecting portions between the front housing 410 and the rear housing 510 through the sealing member 620 have the same structure, only the partial DD shown in Figure 6A is described, and the description of the other connecting portions is omitted.

[0102] The positioning boss 414a provided at the front end of the arm portion 413a of the front housing 410 is inserted into the positioning hole 625 of the sealing member 620. Thus, the sealing member 620 is held by the front housing 410 in a state where the first support portion 623 contacts the support portion 418a of the front housing 410. In a state where the sealing member 620 is not compressed in the Z direction, the thickness in the Z direction near the first pressing surface 621 of the sealing member 620 is d1.

[0103] As Figure 8A shown by the arrow A in, the rear housing 510 is pushed forward from the rear of the sealing member 620 (from the -Z side along the +Z direction) so that the positioning boss 414a is inserted into the positioning hole 513a (see Figure 3A ). In this way, the front housing 410 and the rear housing 510 are connected. It should be noted that by pushing the front housing 410 and the rear housing 510 in the Z direction, the front housing 410 and the rear housing 510 are substantially simultaneously connected at the four connecting portions. As a result, the first pressing surface 621 is compressed in a manner of moving in the +Z direction and the sealing member 620 presents the state shown in Figure 8B . In a state where the sealing member 620 is compressed in the Z direction, the thickness in the Z direction near the first pressing surface 621 of the sealing member 620 is d2. The thickness d2 is smaller than the thickness d1.

[0104] Figure 9 isFigure 6A A YZ cross-sectional view of the partial DD shown, and a cross-section is shown at the position of the central axis including the positioning boss 414a. It should be noted that Figure 8B as in the state where the sealing member 620 is compressed in the Z direction is shown Figure 9 .

[0105] In a state where the positioning boss 414a is inserted into the positioning hole 625, the sealing member 620 is sandwiched between the pressing portion 515a of the rear case 510 and the supporting portion 418a of the front case 410. At the same time, the positioning boss 414a is inserted into the positioning hole 513a of the rear case 510 and the end face S41a of the positioning boss 414a abuts against the bottom face S51a of the positioning hole 513a. Therefore, in a state where the sealing member 620 is compressed, the thickness d2 in the Z direction near the first pressing surface 621 is determined by the difference between the height d4 of the positioning boss 414a and the depth d5 of the positioning hole 513a, and the relationship "d2 = d4 - d5" is satisfied. In this way, the sealing member 620 is compressed by "d1 - d2" in the Z direction.

[0106] In the housing portion of the imaging device 1000, the sealing member 620 functions to prevent a gap from occurring in the Z direction at the connection portion between the supporting portion 418a of the front case 410 and the pressing portion 515a of the rear case 510. Thereby, water is prevented from penetrating into the interior of the imaging device 1000 (housing portion) from the outside through the connection portion.

[0107] It should be noted that the second supporting portion 624a of the sealing member 620 contacts or approaches with a minute gap in the Y direction to the supporting portion 516a of the rear case 510. In addition, the second supporting portion 624b of the sealing member 620 contacts or similarly approaches with a minute gap in the X direction to the supporting portion 516b of the rear case 510. In this way, a structure for doubly preventing water from penetrating into the interior of the imaging device 1000 from the outside is adopted.

[0108] Next, a waterproof structure of the attachment portion of the side plates 610a to 610d to the housing portion will be described. Figure 10A and Figure 10B are cross-sectional views showing the states before and after attaching the side plate 610a to Figure 8B . Since the states before and after attaching the side plates 610b to 610d to the housing portion are the same as the states before and after attaching the side plate 610a to the housing portion, the drawings and descriptions are omitted.

[0109] As Figure 2BAs shown, the plate sealing member 611a is adhered to the back surface of the side plate 610a (the surface opposite to the appearance surface when the side plate 610a is attached to the imaging device 1000). Thus, the plate sealing member 611a is a sheet-like cushioning member having a waterproof function and is formed in a substantially square frame shape so as to cover the square frame recess 640.

[0110] As Figure 10A shown, abutting projections 612 are provided at positions on the side plate 610a fastened by fixing screws 630 (not shown in Figure 10A and Figure 10B ). It should be noted that the abutting projections 612 are provided at the other three positions on the side plate 610a fastened by the fixing screws 630. Thus, the plate sealing member 611a has through holes at positions corresponding to the abutting projections 612. The through holes are formed according to the shape of the abutting projections 612. Therefore, the abutting projections 612 are exposed on the appearance in a state where the side plate 610a is detached from the frame portion and the plate sealing member 611a is adhered to the side plate 610a.

[0111] The side plate 610a is fitted into the square frame recess 640 formed in the upper surface of the frame portion of the imaging device 1000 from the outside of the imaging device 1000 so as to be pushed downward (-Y direction). In this state (before being fastened by the fixing screws 630), the thickness of the plate sealing member 611a is d3, and d3 is the same as the thickness before fitting.

[0112] After being fitted into the square frame recess 640 and the fixing screws 630 are screwed in, the side plate 610a is fastened and fixed to the frame portion in a state where the abutting projections 612 abut against the abutting recesses 517a of the rear case 510 (as Figure 10B shown). Thus, the plate sealing member 611a is compressed in the Y direction and its thickness becomes d6. That is, the plate sealing member 611a is sandwiched between the square frame recess 640 and the side plate 610a and is compressed by "d3 - d4" in the Y direction. It should be noted that the other three abutting projections 612 respectively abut against the abutting recesses 517b of the rear case 510 and the abutting recesses 419a, 419b of the front case 410.

[0113] Since the side plate 610a applies a downward (-Y direction) load to the second pressing surface 622a of the sealing member 620, the sealing member 620 as an elastic member is pushed in the same direction and attempts to retreat. However, since the second support portion 624a provided on the surface opposite to the second pressing surface 622a abuts against the support portion 516a of the rear case 510, the second pressing surface 622a is pushed back in the +Y direction. This prevents a gap from occurring between the plate sealing member 611a and the second pressing surface 622a. That is, the plate sealing member 611a covers the entire circumference of the square frame recess 640 and adheres to the bottom surface of the square frame recess 640 without a gap.

[0114] The plate sealing members 611b, 611c, and 611d are respectively pasted on the side plates 610b, 610c, and 610d. Since the waterproof structures of the side plates 610b, 610c, and 610d are the same as that of the side plate 610a, their descriptions are omitted.

[0115] In this way, the imaging device 1000 realizes the waterproof structures on the upper opening H1, lower opening H2, right opening H3, and left opening H4 formed on the four surfaces of the frame portion through the side plates 610a to 610d (see Figure 6A and Figure 6B ).

[0116] Next, the structure of the first mounting module 300 will be described. Figure 11A and Figure 11B are a front-side perspective view and a back-side perspective view showing the first mounting module 300. Figure 12A and Figure 12B are a front-side exploded perspective view and a back-side exploded perspective view of the main part of the first mounting module 300 shown together with the mounting member 210 of the first lens barrel 200. Figure 13 is a back-side perspective view showing the mounting member 210.

[0117] The first lens barrel 200 with an appearance as shown in Figure 1C is provided with a mounting member 210 having a structure based on a conventional bayonet-type lens mount. As shown in Figure 12B the mounting member 210 has a lens-side mounting surface 211 and bayonet claws 212a, 212b, and 212c. As shown in Figure 13 the bayonet claws 212a, 212b, and 212c respectively have bayonet claw contact surfaces 213a, 213b, and 213c.

[0118] The first mounting module 300 is provided with a mounting base 310, a fixed mounting member 320, a movable mounting member 330, and an operation ring 340. A through hole 312 is provided in the mounting base 310. The fixed mounting member 320 has a main-body-side mounting surface 321, an opening 322, a first threaded portion 323, and an internal threaded portion 324. The movable mounting member 330 has claws 331a, 331b, and 331c, a second threaded portion 332, and grooves 333a and 333b. The operation ring 340 has handles 341a and 341b and protrusions 342a and 342b.

[0119] When the first lens barrel 200 is attached, the body side mounting surface 321 abuts against the lens side mounting surface 211 of the first lens barrel 200. The bayonet claws 212a, 212b, and 212c of the first lens barrel 200 are inserted into the opening 322. The first threaded portion 323 is formed as an internal threaded portion around the optical axis parallel to the Z direction and passing through the center of the opening 322. The fixed mounting member 320 is fixed to the mounting base 310 by inserting the fixing screw 350 through the through hole 312 of the mounting base 310 from the back side (-Z side) of the mounting base 310 and by fastening the fixing screw 350 to the internal threaded portion 324 of the fixed mounting member 320.

[0120] The claws 331a, 331b and 331c of the movable mounting member 330 have claw contact surfaces 334a, 334b ​​and 334c, respectively, which abut against the bayonet claw contact surfaces 213a, 213b and 213c of the bayonet claws 212a, 212b and 212c of the mounting member 210. The second threaded portion 332 is formed as an external threaded portion screwed into the first threaded portion 323 of the fixed mounting member 320.

[0121] The operation ring 340 is arranged between the mounting base 310 and the fixed mounting member 320 , and is positioned by engaging the projections 342 a and 342 b of the operation ring 340 with the grooves 333 a and 333 b of the movable mounting member 330 .

[0122] Figure 14A , Figure 14B and Figure 14C 2 is a front view showing the positional relationship between the bayonet claws 212 a , 212 b , and 212 c of the first lens barrel 200 and the claws 331 a , 331 b , and 331 c of the movable mounting member 330 . Figure 15A It is along Figure 14A The cross-sectional view taken along line DD is shown. Figure 15B It is along Figure 14B The cross-sectional view taken along line EE is shown. Figure 15C It is along Figure 14C A cross-sectional view taken along line FF is shown. Figure 16A It is shown Figure 14A An enlarged view of section G is shown, Figure 16B It is shown Figure 14B An enlarged view of section H is shown, Figure 16C It is shown Figure 14C An enlarged view of section J is shown.

[0123] Figure 14AShows a state where the bayonet claws 212a, 212b, and 212c and the claws 331a, 331b, and 331c do not overlap on the optical axis projection plane when projected onto the optical axis projection plane, and the first lens barrel 200 can be attached to and detached from the imaging device 1000. It should be noted that "on the optical axis projection plane" means "on the projection plane observed along the optical axis direction" (on the XY plane observed from the +Z side to the -Z side). That is, Figure 14A Shows a state where the mounting member 210 of the first lens barrel 200 falls into the first mounting module 300 of the imaging device 1000. In this state, the bayonet claws 212a to 212c of the first lens barrel 200 are inserted into the openings 322 of the fixed mounting member 320, and the lens-side mounting surface 211 of the mounting member 210 abuts against the body-side mounting surface 321 of the fixed mounting member 320.

[0124] Figure 14B Shows a state where when observed from the front side of the imaging device 1000, the movable mounting member 330 rotates counterclockwise about the optical axis to a position where the claws 331a to 331c start to overlap with the bayonet claws 212a to 212c on the optical axis projection plane. In the transition process from Figure 14A the state to Figure 14B the state, the claws 331a to 331c of the movable mounting member 330 move along the optical axis direction toward the mounting base 310. It should be noted that the claws 331a to 331c do not engage with the bayonet claws 212a to 212c in Figure 14B the state.

[0125] Figure 14C Shows a state where when the operation of rotating the movable mounting member 330 counterclockwise about the optical axis is completed and the first lens barrel 200 is firmly attached to the imaging device 1000 when observed from the front side of the imaging device 1000. In this state, the bayonet claws 212a to 212c of the first lens barrel 200 completely overlap with the claws 331a to 331c of the movable mounting member 330 on the optical axis projection plane, and the claw contact surfaces 334a to 334c respectively abut against the bayonet claw contact surfaces 213a to 213c.

[0126] The handles 341a and 341b provided in the operation ring 340 are shaped so as not to protrude from the imaging device 1000 on the optical axis projection plane in the state where the first lens barrel 200 is attached. This reduces the unintentional external force acting on the handles 341a and 341b in the state where the first lens barrel 200 is attached.

[0127] The process of attaching the first lens barrel 200 to the imaging device 1000 is as follows. First, the user aligns a mark (not shown) provided in the first lens barrel 200 with a mark 301 provided in the fixed mounting member 320 (see Figure 14A ) and brings the lens-side mounting surface 211 of the first lens barrel 200 into contact with the body-side mounting surface 321 of the fixed mounting member 320. Thus, the state in Figure 14A is achieved. Next, the user grasps the two handles 341a and 341b and rotates the operation ring 340 counterclockwise when viewed from the +Z side, such that the bayonet claws 212a to 212c overlap the claws 331a to 331c on the optical axis projection plane as shown in Figure 14B .

[0128] After that, the user grasps the two handles 341a and 341b and further rotates the operation ring 340 counterclockwise when viewed from the +Z side, such that the claw contact surfaces 334a to 334c come into contact with the bayonet claw contact surfaces 213a to 213c. Thereby, as shown in Figure 14C , the first lens barrel 200 is fixed to the first mounting module 300. When detaching the first lens barrel 200 from the imaging device 1000, the user can perform the above-described attachment operation of the first lens barrel 200 in reverse and omit its description.

[0129] Next, the structure and waterproof structure of the first mounting module 300 will be described in detail. Figure 17A And Figure 17B are a front-side exploded perspective view and a back-side exploded perspective view showing the first mounting module 300.

[0130] As described above, the first mounting module 300 is provided with a mounting base 310, a fixed mounting member 320, a movable mounting member 330, and an operation ring 340. The first mounting module 300 is also provided with a first O-ring 361, a second O-ring 362, a metal plate member 363, fixing screws 364, an electrical communication contact unit 370, and a rotation detection unit 380.

[0131] The first O-ring 361 is disposed between the fixed mounting member 320 and the operation ring 340. The metal plate member 363 is fixed to the mounting base 310 by the fixing screws 364. The second O-ring 362 is disposed between the metal plate member 363 and the mounting base 310. Although the metal plate member 363 and the mounting base 310 are configured as separate members in the present embodiment, they may be configured as an integral member. When the first lens barrel 200 is attached to the first mounting module 300, the electrical communication contact unit 370 contacts and conducts the electrical communication contact unit of the first lens barrel 200. Thereby, communication between the imaging device 1000 and the first lens barrel 200 becomes possible through the contact members.

[0132] The rotation detection unit 380 is provided with a rotation sensor 381, a support metal plate 382, and a communication cable 314. The rotation sensor 381 is fixed to the support metal plate 382, and the support metal plate 382 is fastened to the mounting base 310 by fixing screws 383. The rotation sensor 381 detects the attachment of the first lens barrel 200 to the imaging device 1000 and switches the on and off states of the electrical communication contact unit 370. The communication cable 314 is connected to the main substrate 450 provided in the front module 400 and enables communication between the rotation sensor 381 and the main substrate 450. The cover 384 is fixed to the mounting base 310 by fixing screws 385 and restricts the routing of the communication cable 314.

[0133] Figure 18A is a front view showing the first mounting module 300, Figure 18B is a cross-sectional view taken along Figure 18A the line C-C shown. In the first mounting module 300, a first O-ring 361 is disposed between the fixed mounting member 320 and the operation ring 340 so that no gap appears between the fixed mounting member 320 and the operation ring 340. Similarly, a second O-ring 362 is disposed between the mounting base 310 and the operation ring 340 so that no gap appears between the mounting base 310 and the operation ring 340. In this way, water and dust are prevented from infiltrating into the interior of the first mounting module 300 from the outside.

[0134] Next, the structure of the front module 400 will be described. Figure 19 is a front-side exploded perspective view showing the front module 400. The front module 400 is provided with a front case 410, washers 490a, 490b, and 490c, an imaging module 420, a substrate holder 430, elastic members 435a and 435b, a main substrate 450, and a heat sink unit 470, which are sequentially arranged from the front side (+Z side) to the rear side (-Z side).

[0135] Two positioning holes 411 are provided on the upper and lower sides of the front surface of the front case 410. The first mounting module 300 is positioned in the front case 410 by inserting two positioning bosses 311 of the first mounting module 300 into the two positioning holes 411. In this way, the first mounting module 300 is in a state of being positioned in the front case 410 and fixed from the front by four fixing screws 390 (see Figure 3A ).

[0136] As described above, by referring to Figure 4A , an opening 412 for guiding incident light to the image sensor 425 is provided at the central portion of the front surface of the front case 410. In addition, the front case 410 has a communication cable insertion hole H41, and a communication cable 314 (see Figure 3B and Figure 17B)It is wired to the inside of the imaging device 1000 through the communication cable insertion hole H41. When the communication cable 314 is connected to a connector (not shown) implemented in the main substrate 450, an electrical connection is established between the electrical communication contact unit 370 and the main substrate 450.

[0137] The elastic member 401, which is shaped to avoid the positioning hole 411, the communication cable insertion hole H41, and the opening 412, is adhered to the front surface of the front case 410 using double-sided tape. The elastic member 401 is a sheet-like buffer member having a waterproof function. Since the elastic member 401 is sandwiched between the front case 410 and the first mounting module 300 in a compressed state, water and dust are prevented from infiltrating into the inside of the imaging device 1000 through the boundary between the front case 410 and the first mounting module 300.

[0138] The imaging module 420 is provided with a sensor substrate 440 (first substrate) and a sensor board 426. The sensor substrate 440 has flexible portions 443a and 443b disposed on the upper and lower sides (Y direction), and the image sensor 425 is attached to the sensor board 426. The imaging module 420 is fixed to the front case 410 by sensor board fixing screws 429a, 429b, and 429c. The sensor substrate 440 has auxiliary rigid portions 442a and 442b, and first board-to-board connectors (B-to-B connectors) 445a and 445b are implemented on the upper side (+Y side) and the lower side (-Y side), respectively.

[0139] Gaskets 490a to 490c are disposed between the front case 410 and the sensor board 426 and are used for flange back adjustment and tilt adjustment of the image sensor 425 during the assembly of the imaging device 1000. The substrate holder 430 is a frame member (metal plate) that holds the auxiliary rigid portions 442a and 442b of the sensor substrate 440 and the main substrate 450, and is fastened and fixed to the front case 410 by substrate holder fixing screws 437a, 437b, and 437c. Substrate support members 431a, 431b, 431c, and 431d extending toward the rear side (-Z side) are respectively provided at the four corners of the substrate holder 430 by riveting. The member 431d is shown in Figure 25A . The substrate support members 431a to 431d are formed in the same shape with internal thread portions (not shown) on the back surface (the surface on the -Z side).

[0140] The main board fixing screws 456b, 456c, and 456d are inserted through the main board 450 and the heat sink unit 470, the main board fixing screw 456a is inserted through the main board 450, and the screws are respectively screwed into the internal threaded portions of the board support members 431a to 431d. Thus, the main board 450 and the heat sink unit 470 are fastened to the board holder 430. The elastic members 435a and 435b are buffer members of the same shape and are attached to the board holder 430.

[0141] The second board-to-board connectors 455a and 455b implemented in the main board 450 are respectively connected to the first board-to-board connectors 445a and 445b implemented in the sensor board 440. By connecting the first board-to-board connectors 445a and 445b to the second board-to-board connectors 455a and 455b respectively, communication between the sensor board 440 and the main board 450 becomes available. Details of the connection between the sensor board 440 and the main board 450 will be mentioned later.

[0142] The heat sink unit 470 is a metal plate unit for dissipating heat generated in the main board 450. By inserting the main board 450, as described above, the heat sink unit 470 is fastened to the board support members 431a to 431d by the main board fixing screws 456b to 456d.

[0143] Figure 20A and Figure 20B are a front-side exploded perspective view and a back-side exploded perspective view showing the camera module 420. The camera module 420 is provided with an optical element 422, a holding member 421, an image sensor 425, a sensor board 426, and a sensor board 440. The optical element 422 is, for example, a low-pass filter having a three-layer structure composed of two crystal birefringent plates with a 90-degree phase difference and a depolarizing plate disposed therebetween. The holding member 421 holds the optical element 422.

[0144] The sensor board 440 is a rigid flexible board. The sensor board 440 has a main rigid portion 441 and auxiliary rigid portions 442a and 442b that branch from the main rigid portion 441 in the vertical direction through flexible portions 443a and 443b. The auxiliary rigid portions 442a and 442b are electrically connected to the main rigid portion 441 through the flexible portions 443a and 443b respectively. In addition, the flexible portions 443a and 443b can be bent at least 180 degrees while maintaining the electrical connection between the main rigid portion 441 and the auxiliary rigid portions 442a and 442b. The flexible portion 443a has an opening H44a through which the sensor board fixing screw 429a can be inserted (see Figure 19 ). The flexible portion 443b has an opening H44b through which the board holder fixing screw 437a can be inserted (see Figure 19)。

[0145] The first board-to-board connectors 445a and 445b that can be connected to the second board-to-board connectors 455a and 455b implemented in the front surface of the main substrate 450 are respectively implemented in the auxiliary rigid portions 442a and 442b. The first board-to-board connectors 445a and 445b are respectively implemented in the auxiliary rigid portions 442a and 442b in such a manner that they face the front side (+Z direction) when the flexible portions 443a and 443b are not bent. When the flexible portions 443a and 443b are bent and the auxiliary rigid portions 442a and 442b are arranged behind the main rigid portion 441 (-Z side), the first board-to-board connectors 445a and 445b face the rear side (-Z direction). In addition, details will be described later with reference to FIG. 25.

[0146] The image sensor 425 is fixed to the front central portion of the sensor board 426 by an ultraviolet curable adhesive or the like. A plurality of holes corresponding to the number and size of the contact pins P of the image sensor 425 are provided in the main rigid portion 441 of the sensor substrate 440. All the contact pins P are inserted through the openings (not shown) provided in the sensor board 426 and the holes provided in the main rigid portion 441 and protrude to the back side (-Z side) of the sensor substrate 440. In addition, the contact pins P are respectively soldered to the pads (not shown) provided in the sensor substrate 440, and the image sensor 425 is electrically connected to the sensor substrate 440.

[0147] The holding member 421 has a substantially rectangular opening H40 that houses the optical element 422 and guides incident light to the image sensor 425. In a state where the optical element 422 and the dust-proof sheet 424 behind the optical element 422 (-Z side) are housed, the holding member 421 is fastened to the sensor board 426 from the front side by the holding member fixing screw 428. Heat dissipation ribs R40 are provided on the front surface (+Z side) of the holding member 421. The heat dissipation ribs R40 not only serve as heat dissipation fins for diffusing the heat of the image sensor 425 transmitted through the sensor board 426 in order to reduce the temperature of the image sensor 425, but also play a role in improving the rigidity of the imaging module 420.

[0148] Figure 21 is along Figure 19 The cross-sectional view taken along the line L-L shown. It should be noted that the auxiliary rigid portions 442a and 442b are not shown in Figure 21Shown in. The holding member 421 has an abutting surface S42, and the abutting surface S42, which is the contact surface of the front surface of the optical element 422, intersects the optical axis (Z direction) substantially perpendicularly. In addition, side walls w1 and w2 extending rearward (-Z direction) from the abutting surface S42 are provided on the upper and lower sides (±Y direction) of the opening H40 of the holding member 421. It should be noted that side walls extending substantially rearward from the abutting surface S42 are provided at the left and right positions (±X direction) of the opening H40.

[0149] The elastic members 423a and 423c are bent so that the cross-sectional shape will become substantially L-shaped and are pasted to the holding member 421 to cover the side walls wl and w2. The elastic members 423b and 423d (see Figure 20A and Figure 20B ) are pasted to the holding member 421 to cover the left and right side walls. In this way, the holding member 421 holds the optical element 422 in a state where its front surface abuts against the abutting surface S42 and its four sides that intersect the abutting surface S42 perpendicularly are surrounded by the elastic members 423a to 423d.

[0150] The dust-proof sheet 424 is disposed between the holding member 421 and the image sensor 425 to prevent the occurrence of a gap. The dust-proof sheet 424 has a substantially rectangular opening that guides incident light at its central portion. It should be noted that the dust-proof sheet 424 is configured to overlap at least a part of the holding member 421, the optical element 422, and the image sensor 425 on the optical axis projection plane. In addition, as described above, the holding member 421 is integrated (assembled) into the imaging module 420 by being fixed to the sensor board 426 using four holding member fixing screws 428. Therefore, in the imaging module 420, the optical element 422 is urged in the +Z direction by the dust-proof sheet 424 and is held by being pressed by the abutting surface S42. Thereby, the image sensor 425 is sealed by the holding member 421, the optical element 422, the dust-proof sheet 424, and the sensor board 426. Therefore, water and dust are prevented from infiltrating from the outside of the imaging module 420 into the image sensor 425.

[0151] In the imaging module 420, since the image sensor 425 is in a sealed state, dust can be prevented from adhering to the image sensor 425 even during the flange back focus adjustment. In addition, the optical element 422 is held in a state where as a whole, it is urged by the dust-proof sheet 424 against the abutting surface S42 in the forward direction (+Z direction) and its sides are surrounded by the elastic members 423a to 423d. Therefore, even when the imaging device 1000 drops or is accidentally impacted and a strong shock is applied, since the dust-proof sheet 424 and the elastic members 423a to 423d act as shock-absorbing dampers, breakage of the optical element 422 is prevented.

[0152] In order to obtain a still image or a moving image with a desired image quality through the imaging device 1000, it is important to adjust the distance (i.e., the back focus) between the subject-side mounting surface 321 and the image sensor 425 in the optical axis direction according to the lens used. Therefore, the back focus adjustment method will be described next.

[0153] Figure 22 FIG. 4 is a rear-side exploded perspective view showing a state in which the front module 400 is equipped with the first mounting module 300. In the front case 410, gasket contact surfaces 416a, 416b, and 416c parallel to the subject-side mounting surface 321 are respectively provided at three positions in the upper part, the lower right part, and the lower left part of the outer side including the opening 412. A pair of gasket positioning bosses 417a, 417b, and 417c are respectively provided in the gasket contact surfaces 416a, 416b, and 416c. During the back focus adjustment, a predetermined number of gaskets 490a to 490c are inserted between each of the gasket contact surfaces 416a to 416c and the sensor board 426. Although each of the gaskets 490a to 490c is simplified and shown as a single gasket in FIG. 4, during the actual back focus adjustment, if necessary, a plurality of gaskets with different thicknesses can be used. Figure 22 FIG. 5 is a perspective view showing gaskets 490s, 490t, and 490u with different thicknesses.

[0154] Figure 23A FIG. 6 is a perspective view showing gaskets 490s, 490t, and 490u with different thicknesses. Figure 23B FIG. 7 is a side view showing the gaskets 490s to 490u. The gaskets 490s to 490u only differ in thickness (thicknesses S, T, and U). Then, a pair of positioning openings H46 corresponding to the gasket positioning bosses 417a, 417b, and 417c are formed in each of the gaskets 490s to 490u. In addition, each of the gaskets 490s to 490u has a screw insertion hole H45 formed between the pair of positioning openings H46. It should be noted that the gaskets with different thicknesses are not limited to the three types of gaskets 490s to 490u. They can be two types, four types, or more.

[0155] The washers 490a to 490c are positioned to the front case 410 by inserting the washer positioning bosses 417a to 417c through the positioning openings H46. Then, the sensor board 426 is positioned to the front case 410 from the rear side (-Z side) and fastened by the sensor board fixing screws 429a to 429c. At this time, the sensor board fixing screws 429a to 429c are inserted through the screw insertion holes H45 of the washers 490a to 490c. In this way, the washers 490a to 490c are respectively inserted between the washer contact surfaces 416a to 416c of the front case 410 and the sensor board 426. During the flange back focus adjustment, based on the dimensional changes of each component that cause the flange back focus deviation, the flange back focus is finely adjusted by selecting the thickness and number of the washers 490a to 490c.

[0156] In the present embodiment, as Figure 22 shown, the washer contact surfaces 416a to 416c are provided at the vertices of the triangle T42 (shown by the double-dot chain line) that overlaps the opening 412 and the image sensor 425 in a wide area on the optical axis projection plane. Thus, it is also possible to adjust the inclination of the imaging surface of the image sensor 425 with respect to the main body side mounting surface 321 by adjusting the flange back focus according to the above method.

[0157] The inclination adjustment is for the state where the imaging surface intersects the optical axis perpendicularly. In order to improve the resolution of the inclination adjustment of the imaging surface by changing the thickness and number of the washers 490a to 490c, the washer contact surfaces 416a to 416c are preferably provided at positions where the triangle T42 becomes as large as possible. This enables highly accurate inclination adjustment. In this imaging device, the flexible part 443a has an opening H44a at a position overlapping the washer contact surface 416a on the optical axis projection plane, and the sensor board fixing screw 429a is inserted through the opening H44a. Thus, a triangle identical to the triangle T42 is also formed in the positional relationship of the sensor board fixing screws 429a to 429c, which realizes a structure with an effective component arrangement.

[0158] It should be noted that the image sensor 425 is one of the heat generating elements that generate heat by operation. The image sensor 425 is attached to the sensor board 426, and the holding member 421 is fastened to the sensor board 426 by screws. Then, as described above, the sensor board 426 is fastened to the front case 410 that forms the exterior of the imaging device 1000. Therefore, the heat generated by the image sensor 425 diffuses to the holding member 421 and is transferred to the front case 410 through the sensor board 426. Finally, the heat is dissipated to the outside air. In this way, the heat generated by the image sensor 425 is effectively diffused to the front case 410 and dissipated to the outside air. From the viewpoint of obtaining high heat dissipation performance, it is preferable to use a material with high thermal conductivity such as aluminum alloy for the holding member 421 and the sensor board 426.

[0159] Next, a method of electrically connecting the sensor substrate 440 and the main substrate 450 will be described. Figure 24 FIG. 4 is a rear view showing a state where the imaging module 420 is attached to the front case 410.

[0160] After the flange back focus adjustment, the substrate holder 430 is fastened to the front case 410 by substrate holder fixing screws 437a to 437c. The substrate holder fixing screw 437a is disposed at a position overlapping with the flexible portion 443b on the optical axis projection plane, inserted through an opening H44b provided in the flexible portion 443b, and screwed onto the front case 410. Thus, the substrate holder fixing screws 437a to 437c are arranged such that a triangle T43 (shown by a dashed line) formed by connecting these set positions by line segments will be substantially symmetric with the above-described triangle T42 (shown by a double-dot chain line) in the Y direction. In this way, by arranging the sensor board fixing screws 429a to 429c and the substrate holder fixing screws 437a to 437c in a manner that forms two triangles T42 and T43, the screw fastening portions are effectively arranged on the front case 410. As a result, miniaturization of the imaging device 1000 can be achieved.

[0161] Figure 25A and Figure 25B FIG. 5 is a rear side perspective view showing a state where the imaging module 420 is attached to the front case 410. More specifically, Figure 25A FIG. 5A shows a state before the flexible portions 443a and 443b are bent, Figure 25B FIG. 5B shows a state after the flexible portions 443a and 443b are bent. The main substrate 450 electrically connected to the sensor substrate 440 is also shown in Figure 25B FIG. 5B. An image processing chip that processes digital image data output from the image sensor 425, a CPU that controls the entire camera, and a DRAM-like storage device used when the image processing chip and the CPU execute processing are mounted on the main substrate 450.

[0162] As described above, the sensor substrate 440 is a rigid flexible substrate, and the auxiliary rigid portions 442a and 442b can be arranged behind the main rigid portion 441 (-Z side) by folding back the flexible members 443a and 443b by 180 degrees, respectively. Elastic members 435a and 435b having the same shape are attached to the back surface of the substrate holder 430 by a double-sided tape (not shown). Openings H43a and H43b are respectively provided near the central portions of the elastic members 435a and 435b. Then, the elastic members 435a and 435b are pasted on the substrate holder 430 such that the cut-up portions 432a and 432b on the upper and lower sides near the center of the substrate holder 430 will be inserted through the openings H43a and H43b, respectively.

[0163] In the central portion of the substrate holder 430, a first support pillar 433 having an elastic member 434 at its front end is provided by riveting so as to extend toward the rear side (-Z direction). During and immediately after the flange back focus adjustment, the sensor substrate 440 is unfolded using the main rigid portion 441 as a reference surface, and the auxiliary rigid portions 442a and 442b and the flexible portions 443a and 443b partially protrude up and down from the outer shape of the imaging device 1000. As Figure 24 shown, the maximum widths L1 of the flexible portions 443a and the auxiliary rigid portion 442a are smaller than the width L2 of the opening 412 provided in the front case 410 ( Figure 24 not shown in the figure). Similarly, the maximum widths of the flexible portion 443b and the auxiliary rigid portion 442b are smaller than the width of the opening 412.

[0164] As Figure 25B shown, by bending the flexible portions 443a and 443b by approximately 180 degrees in the direction of the arrow shown in Figure 25A the figure, the auxiliary rigid portions 442a and 442b are respectively arranged on the rear side (-Z side) of the main rigid portion 441. In this state, a pair of stepped screws 436a and 436b are respectively inserted from the rear side (-Z side) through stepped screw insertion holes 446a and 446b provided in the auxiliary rigid portions 442a and 442b, and are screwed to the substrate holder 430.

[0165] Each of the pair of stepped screw insertion holes 446a and 446b is an elongated hole, the longitudinal direction of which coincides with the vertical direction (Y direction) and has a predetermined clearance with respect to the lower diameter of the heads of the stepped screws 436a and 436b in both the vertical direction (Y direction) and the horizontal direction (X direction). Therefore, the auxiliary rigid portions 442a and 442b are held in a state where their movement relative to the substrate holder 430 is restricted and not completely fixed (floating state).

[0166] In a state where the flexible portions 443a and 443b are bent and the auxiliary rigid portions 442a and 442b are located on the rear side of the main rigid portion 441, the first board-to-board connectors 445a and 445b provided in the auxiliary rigid portions 442a and 442b face the rear side of the imaging device 1000. In addition, the connector implementation surfaces S44a and S44b for implementing the first board-to-board connectors 445a and 445b are arranged in substantially the same plane perpendicular to the Z direction.

[0167] At the same time, second board-to-board connectors 455a and 455b are provided on the same surface on the front side (+Z side) of the main substrate 450 (see Figure 19)。Therefore, since the two first board-to-board connectors implemented in the sensor substrate 440 and the two second board-to-board connectors implemented in the main substrate 450 face each other in the Z direction, the two sets of board-to-board connectors can be easily connected in the Z direction. Specifically, the electrical connection between the main substrate 450 and the sensor substrate 440 is achieved by connecting the second board-to-board connectors 455a and 455b to the first board-to-board connectors 445a and 445b, respectively.

[0168] The four board-to-board connectors are configured such that the left-right direction (X direction) of the imaging device 1000 becomes the longitudinal direction. In this case, in order to absorb the phase difference caused by the implementation of the board-to-board connectors and simultaneously connect the two sets of board-to-board connectors, the amount of movement of the auxiliary rigid portions 442a and 442b in the up-down direction needs to be greater than the amount of movement in the left-right direction. Therefore, in the present embodiment, as described above, a pair of stepped screw insertion holes 446a and 446b are formed as elongated holes whose longitudinal direction coincides with the up-down direction (Y direction). By absorbing the implementation deviation of each board-to-board connector without causing large distortion of the auxiliary rigid portions 442a and 442b and the flexible portions 443a and 443b, simultaneous connection can be easily achieved.

[0169] In this way, the main substrate 450 is temporarily fixed to the auxiliary rigid portions 442a and 442b of the sensor substrate 440 by the fitting force generated by connecting the two sets of board-to-board connectors. In addition, the four corner portions of the main substrate 450 are supported by the substrate support members 431a to 431d extending from the substrate holder 430. In addition, the main substrate 450 is fastened to the heat sink unit 470 from the rear side (-Z side) using the main substrate fixing screws 456a to 456d. As a result, the main substrate 450 is fixed to the substrate holder 430 while maintaining the connection of the two sets of board-to-board connectors.

[0170] When the main substrate 450 is connected to the sensor substrate 440, the main substrate 450 is configured to be substantially parallel to the rigid portions (the main rigid portion 441 and the auxiliary rigid portions 442a and 442b) of the sensor substrate 440. In this way, the main substrate 450 is configured such that most of it will overlap with the rigid portions on the optical axis projection plane. Since the main substrate 450 and the sensor substrate 440 are configured in this way, the projection area of the imaging device 1000 on the optical axis projection plane becomes smaller, and miniaturization of the imaging device 1000 is achieved.

[0171] Figure 2 is along ​ The cross-sectional view taken along the line M-M shown. Although ​ shows the state where the main substrate 450 is not connected to the sensor substrate 440, ​ shows the state after the main substrate 450 is connected to the sensor substrate 440.

[0172] Generally, the number of poles capable of signal transmission between the rigid portions of a rigid-flexible substrate depends on the width of the flexible portion. The wider the width of the flexible portion, the more poles can be provided. In the present embodiment, the main rigid portion 441 is connected to the main substrate 450 through the flexible portions 443a and 443b and the auxiliary rigid portions 442a and 442b. Therefore, signals are transmitted between the main rigid portion 441 and the main substrate 450 through the two transmission paths R1 and R2 indicated by the arrows in ​ . That is, since the wirings from the main rigid portion 441 branch (specifically, branch in two directions) and the auxiliary rigid portions 442a and 442b are provided, multi-pole signals can be transmitted without expanding the sensor substrate 440.

[0173] In addition, in a state where the auxiliary rigid portions 442a and 442b are expanded to the main rigid portion 441, the sensor substrate 440 is substantially symmetric in the vertical direction. Therefore, the signal transmission paths connecting the main rigid portion 441 and the respective auxiliary rigid portions 442a and 442b can be designed as an equal-length wiring structure. This can reduce the timing deviation between the signal transmitted from the main rigid portion 441 to the main substrate 450 through the auxiliary rigid portion 442a and the signal transmitted from the main rigid portion 441 to the main substrate 450 through the auxiliary rigid portion 442b.

[0174] ​ is a magnified view of a part K shown in ​ . The substrate holder 430 has a cutout portion 432a extending in the -Z direction on the front side (+Z side) of the first board-to-board connector 445a. When the first board-to-board connector 445a and the second board-to-board connector 455a are fitted (connected), when a fitting force in the +Z direction is applied to the auxiliary rigid portion 442a from the main substrate 450, the cutout portion 432a functions to support the auxiliary rigid portion 442a from the +Z side.

[0175] In addition, an elastic member 435a is disposed between the substrate holder 430 and the auxiliary rigid portion 442a. Since the auxiliary rigid portion 442a is pressed in the +Z direction by the main substrate 450 through the first board-to-board connector 445a and the second board-to-board connector 455a, the elastic member 435a is held in a state of being compressed along the Z direction. Thus, in a state where the first board-to-board connector 445a and the second board-to-board connector 455a are connected, the auxiliary rigid portion 442a is held by the substrate holder 430 through the elastic member 435a. Therefore, even if vibration or shock is externally applied to the imaging device 1000, the occurrence of incorrect connection between the first board-to-board connector 445a and the second board-to-board connector 455a can be reduced.

[0176] Although ​Only the structure near the first board-to-board connector 445a and the second board-to-board connector 455a is shown, but the structure near the first board-to-board connector 445b and the second board-to-board connector 455b is the same as it. Additionally, as Figure 26A shown, the first support pillar 433 with an elastic member 434 provided at the front end is disposed between the auxiliary rigid portions 442a and 442b. In a state where the sensor substrate 440 is connected to the main substrate 450, the elastic member 434 is compressed in the Z direction between the main substrate 450 and the first support pillar 433. Therefore, even if vibration or shock is externally applied to the imaging device 1000, almost no distortion occurs in the central portion of the main substrate 450 due to the compressed elastic member 434. As a result, breakage of the main substrate 450 can be reduced.

[0177] Next, the heat dissipation structure of the main substrate 450 will be described. Figure 27A and Figure 27B are an exploded perspective view of the back side and an exploded perspective view of the front side of the components near the main substrate 450. The heat dissipation system of the imaging device 1000 is composed of the main substrate 450, a heat dissipation rubber 460, a heat sink unit 470, heat dissipation rubbers 480a, 480b, 480c, and 480d, and side plates 610a to 610c. The heat dissipation rubber 460 is disposed on the main heat generating elements implemented in the main substrate 450. The surface size and height of each heat dissipation rubber are determined according to the corresponding heat generating elements. The heat dissipation rubber 460 is compressed by the heat sink unit 470 and transfers the heat generated by the main heat generating elements to the heat sink unit 470.

[0178] Figure 28 is a back view of the main substrate 450. Although multiple heat generating elements are implemented in the main substrate 450, the heat dissipation of the first heat generating element 451 and the second heat generating element 452 shown from Figure 28 will be described. For example, the first heat generating element 451 is an image processing chip, and the second heat generating element is a storage device such as a DRAM. Figure 29A and Figure 29B are an exploded perspective view of the back side and an exploded perspective view of the front side of the heat sink unit 470. Figure 30 is a back view of the heat sink unit.

[0179] The heat sink unit 470 is provided with a support member 471, a thermal insulator 472, a first main heat sink metal plate 473, a second main heat sink metal plate 474, a first auxiliary heat sink metal plate 475, a second auxiliary heat sink metal plate 476, and a third auxiliary heat sink metal plate 477. The thermal insulator 472 is made of, for example, resin or a metal with a low thermal conductivity such as stainless steel. The first main heat sink metal plate 473, the second main heat sink metal plate 474, the first auxiliary heat sink metal plate 475, the second auxiliary heat sink metal plate 476, and the third auxiliary heat sink metal plate 477 are made of, for example, a metal with a high thermal conductivity such as copper or aluminum alloy.

[0180] The first main heat sink metal plate 473 has a bent portion 473a on the upper side and a bent portion 473b on the lower side. Both the bent portion 473a and 473b are parallel to the XZ plane and extend in the +Z direction. The second main heat sink metal plate 474 has a bent portion 474a on the right side. The bent portion 474a is parallel to the YZ plane and extends in the +Z direction. The first auxiliary heat sink metal plate 475 has a bent portion 475a on the upper side. The bent portion 475a is parallel to the XZ plane and extends in the -Z direction. The second auxiliary heat sink metal plate 476 has a bent portion 476a on the lower side. The bent portion 476a is parallel to the XZ plane. The third auxiliary heat sink metal plate 477 has a bent portion 477a on the right side. The bent portion 477a is parallel to the YZ plane.

[0181] As Figure 27A shown, the bent portion 473a of the first main heat sink metal plate 473 and the bent portion 475a of the first auxiliary heat sink metal plate 475 form the same plane. In addition, the bent portion 473b of the first main heat sink metal plate 473 and the bent portion 476a of the second auxiliary heat sink metal plate 476 form the same plane. In addition, as Figure 27B shown, the bent portion 474a of the second main heat sink metal plate 474 and the bent portion 477a of the third auxiliary heat sink metal plate 477 form the same plane. Then, the heat dissipation rubbers 480a to 480d are respectively disposed at the planes formed by these bent portions.

[0182] The first main heat sink metal plate 473 and the first auxiliary heat sink metal plate 475 are fastened to the support member 471 by fixing screws 478. The second main heat sink metal plate 474, the third auxiliary heat sink metal plate 477, the first main heat sink metal plate 473, and the second auxiliary heat sink metal plate 476 are fastened to the thermal insulator 472 by fixing screws 479. The fixing screws 478 and 479 are fastened from the -Z side toward the +Z side and the metal plates can be easily assembled.

[0183] As Figure 30As shown, the first main heat sink metal plate 473 is formed in a substantially U shape. The second main heat sink metal plate 474 is fastened to the heat insulator 472 so as to fit into the U-shaped recess of the first main heat sink metal plate 473. The first main heat sink metal plate 473 and the second main heat sink metal plate 474 are arranged in the same plane at positions where they do not overlap in the optical axis projection plane. In addition, the first main heat sink metal plate 473 and the second main heat sink metal plate 474 are arranged with a gap G1 therebetween and are not directly connected (not in contact). The heat insulator 472 has a shape that avoids the electronic components implemented in the main substrate 450 and does not contact the heat dissipation rubber 460.

[0184] The main heat dissipation path of the main substrate 450 is as follows. That is, the heat generated by the heat generating elements implemented in the main substrate 450 is transferred to the heat sink unit 470 through the heat dissipation rubber 460, and is transferred to the side plates 610a to 610c as exterior members through the heat dissipation rubbers 480a to 480d and dissipated to the outside air. At this time, the heat generated by the first heat generating element 451 is transferred to the first main heat sink metal plate 473, further transferred to the first auxiliary heat sink metal plate 475 and the second auxiliary heat sink metal plate 476, and finally dissipated to the outside air through the side plates 610a and 610b. In addition, the heat generated by the second heat generating element 452 is transferred to the second main heat sink metal plate 474, transferred to the third auxiliary heat sink metal plate 477 connected to the second main heat sink metal plate 474, and finally dissipated to the outside air through the side plate 610c.

[0185] As described above, a gap G1 is provided between the first main heat sink metal plate 473 and the second main heat sink metal plate 474. Therefore, heat hardly transfers from the first main heat sink metal plate 473 that dissipates the heat generated by the first heat generating element 451 to the second main heat sink metal plate 474 that dissipates the heat generated by the second heat generating element 452.

[0186] In the specification, the calorific value Q1 of the first heat generating element 451 should be greater than the calorific value Q2 of the second heat generating element 452, and the operation guaranteed temperature T1 of the first heat generating element 451 should be higher than the operation guaranteed temperature T2 of the second heat generating element 452. Even in this case, the heat generated by the first heat generating element 451 does not cause the temperature of the second heat generating element 452 to rise above the operation guaranteed temperature T2. This reduces the occurrence of operation failures due to the temperature rise of the heat generating elements when using the imaging device 1000.

[0187] Next, the structure of the rear module 500 will be described. Figure 31A and Figure 31BFIG. 0 is a front-side exploded perspective view and a back-side exploded perspective view showing the rear module 500. The rear module 500 is provided with a rear case 510, an interface substrate 520, a support unit 530, a first interface connector 540, and a second interface connector 550. In addition, the rear module 500 is provided with a third interface connector 560, a fourth interface connector 570, a cover 580, and a manual screw 581.

[0188] The predetermined interface connectors are respectively engaged with holes 511 (specifically, four holes) formed in the rear case 510. The interface substrate 520 is fastened to the rear case 510 together with the support unit 530 by fixing screws 590. The support unit 530 has a metal plate 531 and a second support 532. The second support 532 is riveted to the metal plate 531.

[0189] The cover 580 is fixed to the rear case 510 by screwing the manual screw 581 into an internal thread portion 518 provided in the rear case 510. In addition, a waterproof seal member 582 is attached to the cover 580. When the cover 580 is fixed to the rear case 510 by the manual screw 581, the seal member 582 is pressed against the cover 580. Since the seal member 582 prevents a gap from being generated between the rear case 510 and the cover 580, water and dust are prevented from infiltrating into the interior of the imaging device 1000 through the boundary between the rear case 510 and the cover 580.

[0190] The first interface connector 540 is a connector for supplying power to the imaging device 1000 from an external power source. For example, the second interface connector 550 is a connector for controlling the operation of the imaging device 1000, and a remote controller is connected to the second interface connector 550. The third interface connector 560 is a connector for outputting an image to an external monitor or the like. The fourth interface connector 570 is a connector for synchronizing the imaging timing, the video signal output timing, etc. with other imaging devices. The third interface connector 560 and the fourth interface connector 570 are soldered to the interface substrate 520.

[0191] The first interface connector 540 to the fourth interface connector 570 have a waterproof function and are respectively attached to the holes 511 using O-rings (not shown). For example, a threaded portion 541 is provided in the first interface connector 540. When a nut 542 is screwed into the threaded portion 541, the first interface connector 540 is fixed to the rear case 510. At this time, when the O-ring is pressed against the rear case 510, since the O-ring prevents a gap from being generated between the rear case 510 and the first interface connector 540, water and dust are prevented from infiltrating into the interior of the imaging device 1000. The other three interface connectors are fixed to the rear case 510 in the same manner as the first interface connector 540.

[0192] Figure 32It is a rear view showing the state where the cover 580 and the manual screw 581 are removed from the rear module 500. The switch unit 521 is provided in the interface substrate 520. When the cover 580 and the manual screw 581 are removed from the rear case 510, the switch unit 521 is exposed to the outside and can be operated. The switch unit 521 is an operating member for changing the frame rate, output format, etc. regarding imaging. However, the use of the switch unit 521 is not limited to these.

[0193] Next, the shock-resistant structure of the imaging device 1000 (specifically, the shock-resistant structure of the main substrate 450 included in the imaging device 1000) will be described.

[0194] Figure 33A It is a front view showing the imaging device 1000. Figure 33B It is along Figure 33A The cross-sectional view taken along the line A - A in. It should be noted that Figure 33B The components that do not participate in the shock-resistant structure of the main substrate 450 are omitted in. Figure 34A It is an exploded perspective view showing the component group related to the shock-resistant structure of the main substrate 450. Figure 34B It is showing Figure 33B The enlarged view of the part N shown in. The basic components of the shock-resistant structure of the main substrate 450 are the substrate holder 430, the main substrate 450, the heat dissipation rubber 460, the heat sink unit 470, and the support unit 530.

[0195] As described above, the first pillar 433 is provided in the substrate holder 430 of the front module 400, and the second pillar 532 is provided in the support unit 530 of the rear module 500. In addition, the heat dissipation rubber 460 is sandwiched between the main substrate 450 and the heat sink unit 470. The first pillar 433 extends in the -Z direction to the main substrate 450, and the second pillar 532 extends in the +Z direction to the main substrate 450. The first pillar 433 and the second pillar 532 are configured to be inserted into the substantially central portion of the main substrate 450. The elastic member 434 is provided between the first pillar 433 and the main substrate 450, and the elastic member 533 is provided between the second pillar 532 and the heat sink unit 470. In addition, the main substrate 450 is fixed to the substrate support members 431a to 431d (see Figure 19 ) of the substrate holder 430 at the four corners by screws.

[0196] Therefore, the main substrate 450 is urged in the -Z direction by the first pillar 433 and the elastic member 434, and is urged in the +Z direction by the second pillar 532, the elastic member 533, the heat sink unit 470, and the heat dissipation rubber 460. When an impact in the Z direction is applied to the imaging device 1000, this can reduce the deformation of the main substrate 450.

[0197] Next, the configuration of the expansion module will be described. The upper opening H1, lower opening H2, right opening H3, and left opening H4 of the imaging device 1000 to which attachment is possible and various expansion modules that can be detached therefrom will be described. It should be noted that the expansion module refers to a module that adds a predetermined function to the basic configuration of the imaging device 1000 according to the user's usage.

[0198] Figure 35A FIG. is a perspective view showing a state in which the fixing module 800 is attached to the lower opening H2 of the imaging device 1000. Figure 35B FIG. is an exploded perspective view illustrating a method of attaching the fixing module 800 to the imaging device 1000. The fixing module 800 is an expansion module used when the imaging device 1000 is attached to a tripod or a jig during use. The fixing module 800 has a tripod internal thread portion 801 that can be screwed onto an external thread portion of a tripod or the like. When the tripod internal thread portion 801 is screwed onto the external thread portion of the tripod, the imaging device 1000 is fixed to the tripod.

[0199] The fixing module 800 is fitted into the concave portions 415b of the front case 410 and 514b of the rear case 510, and is fastened to the front case 410 and the rear case 510 by fixing screws 630 in the same manner as the side plates 610a to 610d. That is, the fixing module 800 can be attached in place of one of the side plates 610a to 610d.

[0200] Figure 36 FIG. is a perspective view showing a state in which the microphone module 804 is attached to the upper opening H1 of the imaging device 1000. Figure 37A and Figure 37B FIGS. are a front-side exploded perspective view and a rear-side exploded perspective view illustrating a method of attaching the microphone module 804 to the imaging device 1000. The microphone module 804 can be attached to the imaging device 1000 in the same manner as the fixing module 800.

[0201] The microphone module 804 is an expansion module mainly composed of a microphone 805 that collects the sound of an external sound source and a microphone board 807 having a microphone hole 808. A positioning hole 809 is provided at a position corresponding to the microphone hole 808 on the inner surface of the microphone board 807. The microphone 805 is fitted into the positioning hole 809 and held. The microphone 805 is electrically connected to the main substrate 450 through a cable 806. The microphone 805 converts the collected sound into an audio signal (analog signal). A predetermined circuit implemented in the main substrate 450 applies gain control to the audio signal so that the level is controlled to a predetermined level, and converts the controlled audio signal into audio data as a digital signal. The generated audio data is output to an external device together with image data and the like through the third interface connector 560.

[0202] Figure 38A perspective view showing the state where the grip module 810 is attached to the left opening H4 of the imaging device 1000. The grip module 810 is an extension module used when a user takes an image while gripping the imaging device 1000. The grip module 810 is provided with a grip portion 812 and a grip holder 813. The grip portion 812 is the part that a user grips when the imaging device 1000 is equipped with the grip module 810. The grip holder 813 can be attached to the imaging device 1000 in the same manner as the fixing module 800.

[0203] Figure 39A and Figure 39B A front-side perspective view and a back-side perspective view illustrating a method of attaching the grip portion 812 to the grip holder 813. A through-hole 816 and a socket 815a are provided in the attachment surface of the grip portion 812. A fastening bolt 814 is provided to pass through the through-hole 816. An internal thread portion 817 and a socket 815b are provided in the attachment surface of the grip holder 813. It should be noted that the socket is a disk-shaped seat having irregularities extending in the radial direction and formed at uniform phases in the circumferential direction. When a pair of sockets face each other and the irregularities of one socket engage with the irregularities of the other socket, relative rotation in the circumferential direction becomes impossible.

[0204] The socket 815a and the socket 815b can change their phases in units of the irregularity pitch and can engage. In a state where the socket 815a and the socket 815b are joined at a predetermined phase, when the fastening bolt 814 is tightened (screwed into the internal thread portion 817), the grip portion 812 is fixed to the grip holder 813 (imaging device 1000) in a state where rotation relative to the grip holder 813 is restricted. That is, a user can firmly fix the grip portion 812 to the imaging device 1000 at a desired angle. It should be noted that the grip portion 812 has a hollow portion corresponding to the shape of a finger so that a user can easily grip it. In addition, in the basic mode of the grip module 810, the grip module 810 is attached to the left opening H4 and the longitudinal direction of the grip portion 812 becomes parallel to the vertical direction (Y direction) of the imaging device 1000.

[0205] Figure 40 A perspective view showing the state where the handle module 820 is attached to the upper opening H1 of the imaging device 1000. The handle module 820 is an extension module used when a user takes an image while holding the imaging device 1000 or when a user carries the imaging device 1000 to another location. The handle module 820 is provided with a handle 821 and a handle attachment portion 822. The handle 821 is the part that a user grips when the handle module 820 is attached to the imaging device 1000. The handle 821 is formed in a ring shape. The handle attachment portion 822 can be attached to the imaging device 1000 in the same manner as the fixing module 800.

[0206] Figure 41A and Figure 41B are a front-side perspective view and a back-side perspective view illustrating a method of attaching a handle 821 to a handle attachment portion 822 attached to an imaging device 1000. The handle attachment portion 822 has a pair of convex portions 824 extending in the Z direction. The handle 821 has a pair of concave portions 825, and the pair of convex portions 824 are fitted into the pair of concave portions 825 in the Y direction. When the handle 821 is attached to the handle attachment portion 822, the convex portions 824 are inserted into the concave portions 825, and a fastening bolt 823 is tightened. Thus, the handle 821 is fixed to the handle attachment portion 822 in a state where all movements in the X, Y, and Z directions are restricted. In the basic mode of the handle module 820, the handle attachment portion 822 is attached to the upper opening H1 of the imaging device 1000, and the longitudinal direction of the handle 821 becomes substantially parallel to the Z direction.

[0207] Figure 42A is a perspective view showing a state where a recording module 830 is attached to the right opening H3 of the imaging device 1000. The recording module 830 is an expansion module for recording various data such as image data and audio data related to the images captured by the imaging device 1000. The recording module 830 can be attached to the imaging device 1000 in the same manner as the fixing module 800. The recording module 830 has a recording medium slot 832 for housing a storage medium 831. The recording medium slot 832 is electrically connected to the main substrate 450.

[0208] Figure 42B is a perspective view illustrating a method of inserting a recording medium 831 into the recording medium slot 832. The recording medium 831 is inserted into the recording medium slot 832 in the direction of arrow U1. Although the recording module 830 for housing a single recording medium 831 is disclosed, the recording module 830 can be configured to house a plurality of recording mediums. The mechanism for holding and releasing the recording medium 831 is not limited.

[0209] Figure 43 is a perspective view showing a state where an extension terminal module 835 is attached to the right opening H3 of the imaging device 1000. The extension terminal module 835 has extension terminals 836. The extension terminals 836 are electrically connected to the main substrate 450. The extension terminals 836 are, for example, HDMI terminals for connecting to an external device such as a display device. It should be noted that the extension terminals 836 are not limited to HDMI terminals. Another type of terminal such as a USB terminal can be adopted. In addition, the number of the extension terminals 836 can be plural, and in this case, different types of terminals can be provided.

[0210] Figure 44AFIG. 0 is a perspective view showing a state where a wireless module 840 is attached to a left opening H4 of a camera device 1000. The wireless module 840 is provided with a wireless communication unit 841 and a wireless module attachment part 842. The wireless module attachment part 842 can be attached to the camera device 1000 in the same manner as the fixed module 800.

[0211] Figure 44B and Figure 44C FIG. 6 is a front side perspective view illustrating a method of attaching the wireless communication unit 841 to the wireless module attachment part 842 that has already been attached to the camera device 1000. Figure 44B and Figure 44C FIG. 10 shows the camera device 1000 viewed from different directions.

[0212] The wireless communication unit 841 has a communication unit engagement part 843, the wireless module attachment part 842 has an attachment part engagement part 844, and the wireless communication unit 841 is attached to the wireless module attachment part 842 by engaging with these engagement parts. At this time, an attachment part connector 846 of the wireless module attachment part 842 and a communication unit connector 845 of the wireless communication unit 841 are connected, and the attachment part connector 846 is electrically connected to the main substrate 450. When the wireless module 840 is attached to the camera device 1000, the wireless communication unit 841 can wirelessly transmit image data and audio data related to an image captured by the camera device 1000 to an external device.

[0213] Figure 45 FIG. 17 is a front side perspective view showing a state where a display module 847 is attached to an upper opening H1 of the camera device 1000. The display module 847 is an expansion module for checking an image captured by the camera device 1000, for inputting various settings of the camera device 1000, and for checking the input. Therefore, the display module 847 is provided with a display board 848. The display board 848 is electrically connected to the main substrate 450. Although the display board 848 is rigidly fixed to the display module 847 in the present embodiment, the display board 848 can be configured to be able to change its orientation with respect to the camera device 1000.

[0214] Figure 46A FIG. 21 is a perspective view showing a state where a battery module 850 is attached to a right opening H3 of the camera device 1000. Figure 46B FIG. 23 is a perspective view showing a state where a battery 851 is removed from the battery module 850.

[0215] The imaging device 1000 is basically used in a state of being powered by an external power supply through the first interface connector 540. At the same time, a usage state in which power supply from the battery 851 is estimated is considered. In this case, the expansion module used is the battery module 850. The battery module 850 has a battery chamber 852 for housing the battery 851. The battery chamber 852 is electrically connected to the interface substrate 520. The battery 851 can be inserted into the battery chamber 852 along the Figure 46B direction of the arrow U2 in the figure. In a state where the battery 851 is housed in the battery chamber 852, power is supplied from the battery 851 to the imaging device 1000.

[0216] Figure 47 FIG. [X] is a front side perspective view showing a state in which the operation module 855 is attached to the upper opening H1 of the imaging device 1000. The operation module 855 is an expansion module that is operated by a user and gives various user instructions to the imaging device 1000. As an operation unit in the present embodiment, the operation module 855 is provided with a power switch 856, a cross key 857 for adjusting white balance, etc., a REC button 858, a main body operation button 859, and a switch substrate (not shown). The switch substrate is electrically connected to the main substrate 450 and transmits a signal corresponding to the input operation to the main substrate. The button group of the operation module 855 described above is an example. Another operation member such as an aperture dial may be provided instead of or in addition to the members of the button group.

[0217] Figure 48 FIG. [Y] is a front side perspective view showing a state in which the lighting module 860 is attached to the upper opening H1 of the imaging device 1000. The lighting module 860 is an expansion module used when the imaging environment of the imaging device 1000 is low illuminance or when a subject is intentionally illuminated and photographed. The lighting module 860 is provided with a lighting unit 861, and the lighting unit 861 has a light source such as an LED and a lamp attachment portion 862. Power is supplied to the lighting module 860 through the main substrate 450 of the imaging device 1000 or from an external power supply (not shown). When the lighting module 860 is configured to house a battery inside the module, it is possible to supply power from the battery to the lighting unit 861.

[0218] Figure 49A FIG. [Z] is a front side perspective view showing a state in which the heat sink modules 865c, 865a, and 865b are respectively attached to the upper opening H1, the right opening H3, and the left opening H4 of the imaging device 1000. Figure 49B FIG. [W] shows Figure 49A Note: The figures [X], [Y], [Z], [W] in the translation are placeholders for the actual figure numbers which are not provided in the original text. You may need to replace them with the correct figure numbers according to the actual situation.Front view of the structure in []. The heat sink modules 865a to 865c are expansion modules used to increase the surface area of the exterior of the imaging device 1000 when more efficient heat dissipation is required. The heat sink modules 865a, 865b, and 865c respectively have heat sink fins 866a, heat sink fins 866b, and heat sink fins 866c. The heat sink fins 866a to 866c are configured to be substantially parallel to the XY plane. The heat sink fins 866a to 866c are made of a metal with high thermal conductivity such as aluminum alloy, for example. The size and shape of the heat sink fins 866a to 866c are not limited to Figure 49A and Figure 49B shown in [].

[0219] Figure 50A and Figure 50B are cross-sectional views taken along the lines R-R and S-S in Figure 49B respectively. Figure 50A and Figure 50B only show the components related to heat dissipation in the imaging device 1000. The heat transfer paths are indicated by arrows.

[0220] The heat generated by the heat-generating elements implemented in the main substrate 450 is transferred to the heat sink modules 865a and 865c that form the exterior through the heat dissipation rubber 460, the heat sink unit 470, and the heat dissipation rubbers 480a to 480d, and is dissipated from the heat sink fins 866a and 866c to the outside air. The heat generated by the second heat-generating element 452 is transferred to the heat sink fin 866a through the second main heat sink metal plate 474 and the third auxiliary heat sink metal plate 477, and is dissipated from the heat sink fin 866a to the outside air. In addition, the heat generated by the first heat-generating element 451 is transferred to the heat sink fin 866c through the first main heat sink metal plate 473 and the first auxiliary heat sink metal plate 475, and is dissipated from the heat sink fin 866c to the outside air. The heat sink fin 866b functions to dissipate the heat transferred to the exterior by increasing the surface area of the exterior of the imaging device 1000. Although an example of attaching the heat sink modules to three of the four (upper, lower, left, and right) surfaces of the imaging device 1000 is shown, the number and attachment surfaces of the heat sink modules are not limited to the above example. The heat sink modules can be attached to any surface.

[0221] Figure 51A and Figure 51B are a front-side perspective view and a back-side perspective view showing a state where the cooling fan module 870 is attached to the right opening H3 of the imaging device 1000 and the vent module 875a is attached to the left opening H4. Figure 52A and Figure 52BFront and back side exploded perspective views illustrating a method of attaching a cooling fan module 870 and a vent module 875a to a camera device. The cooling fan module 870 and the vent module 875a are expansion modules for forced air cooling of the interior of the camera device 1000. When the camera device 1000 is equipped with the cooling fan module 870 and the vent module 875a, the heat dissipation rubber and the heat sink unit 470 are removed to ensure an air flow path.

[0222] The cooling fan module 870 is provided with a cooling fan 871 for cooling heat generating elements disposed inside the camera device 1000. The cooling fan 871 is fixed to a cooling fan cover 873 having an opening 874 by fixing screws 872. In addition, the cooling fan 871 is electrically connected to the main substrate 450 and receives power supply from the main substrate 450.

[0223] The vent module 875a is provided with vents 876a, each of which is substantially rectangular. Although the vent module 875a equipped with two vents 876a is shown in this example, the number of vents 876a is not limited thereto. The number may be one or more. In addition, when the vent module 875a is attached to the left opening H4, the longitudinal direction of the vents 876a becomes substantially parallel to the Y direction. The shape of the vents 876a is not limited to being substantially rectangular. The air flowing inside the camera device 1000 through the vents 876a by driving the cooling fan 871 cools the heat generating elements on the main substrate 450 through the heat sink unit 470 and is discharged from the opening 874.

[0224] Figure 53A is a top view showing a state in which the cooling fan module 870 is attached to the right opening H3 of the camera device 1000 and the vent module 875a is attached to the left opening H4 ( Figure 51A the state in). Figure 53B is a cross-sectional view taken along the line T-T shown in Figure 53A The air flow in the camera device 1000 is shown by the arrows in Figure 53B .

[0225] The air inhaled into the camera device 1000 from the vents 876a of the vent module 875a provided on the left surface of the camera device 1000 mainly cools the first heat generating element 451 on the main substrate 450. Then, the air warmed by cooling the first heat generating element 451 is discharged to the outside through the opening 874 of the cooling fan 871 provided on the right surface of the camera device 1000 by the cooling fan 871.

[0226] Figure 54AIt is a top view showing a state where the cooling fan module 870 is attached to the right opening H3 of the imaging device 1000 and the vent module 875a is attached to the upper opening H1. Figure 54B It is a cross-sectional view taken along Figure 54A the line U-U shown. The airflow in the imaging device 1000 is shown by Figure 54B the arrows in it.

[0227] Air inside the imaging device 1000 is inhaled mainly through the vent 876a of the vent module 875a provided on the upper surface of the imaging device 1000 to cool the second heating element 452 on the main substrate 450. Then, the air warmed by cooling the second heating element 452 is discharged to the outside through the opening 874 of the cooling fan 871 provided on the right surface of the imaging device 1000 by the cooling fan 871.

[0228] Figure 55A It is a top view showing a state where the cooling fan module 870 is attached to the left opening H4 of the imaging device 1000 and the vent modules 875a and 875b are attached to the right opening H3 and the upper opening H1 respectively. Figure 55B It is a cross-sectional view taken along Figure 55A the line V-V shown. The airflow in the imaging device 1000 is shown by Figure 55B the arrows in it.

[0229] Air inside the imaging device 1000 is inhaled mainly through the vent 876b of the vent module 875b provided on the upper surface of the imaging device 1000 to cool the first heating element 451 on the main substrate 450. Additionally, air inside the imaging device 1000 is inhaled mainly through the vent 876a of the vent module 875a provided on the right surface of the imaging device 1000 to cool the second heating element 452 and the first heating element 451 on the main substrate 450. Then, the air warmed by cooling the first heating element 451 and the second heating element 452 is discharged to the outside through the opening 874 of the cooling fan 871 provided on the left surface of the imaging device 1000 by the cooling fan 871.

[0230] Although examples of attaching one cooling fan module 870 and one vent module 875a or two vent modules 875a and 875b to the imaging device 1000 have been described, these modules can be attached to any of the four (upper, lower, right, and left) surfaces. Therefore, an effective heat dissipation path can be set according to the usage state of the imaging device 1000. For example, when the heat generation amount of the first heating element 451 on the main substrate 450 is large, the heat dissipation paths shown by Figure 53A and Figure 53B will be selected. When the heat generation amount of the second heating element 452 is large, the heat dissipation paths shown by Figure 54A andFigure 54B The heat dissipation path shown. The selection of the heat dissipation path enables effective cooling.

[0231] In addition, the number of the cooling fan modules 870 is not limited to one. Two cooling fan modules can be attached. In addition, when there is a third heat generating element other than the first heat generating element 451 and the second heat generating element 452, a configuration that effectively cools the third heat generating element can be adopted.

[0232] In addition, the intake direction and the exhaust direction of the cooling fan module 870 and the vent modules 875a (875b) can be selected according to the usage state of the imaging device 1000. For example, the cases where various expansion modules are attached to the four (upper, lower, right, and left) surfaces of the imaging device 1000 are estimated as described above. For example, when the grip module 810 is Figure 38 attached to the left opening H4 of the imaging device 1000 as shown in, the left surface cannot be used for the intake and exhaust of forced air cooling. In this case, the cooling fan module 870 and the vent modules 875a and 875b can be attached to the upper surface, the lower surface, and the right surface to which the grip module 810 is not attached. According to the configuration of the heat generating elements, the intake and exhaust directions can be reversed. In this case, air is inhaled from the opening 874 of the cooling fan module 870 and exhausted from the vents 876a (876b) of the vent module 875a (875b).

[0233] Next, a second embodiment will be described. Figure 56 is a perspective view showing an imaging device 2000 according to the second embodiment. It should be noted that the components of the imaging device 2000 that are the same as those of the imaging device 1000 according to the first embodiment are denoted by the same reference numerals and the same component names, and the common description will be omitted. Although the imaging device 1000 is provided with the first mounting module 300, the imaging device 2000 is provided with the second mounting module 700, and the imaging device 2000 differs from the imaging device 1000 only in this respect. Therefore, hereinafter, the second mounting module 700 will be mainly described.

[0234] Figure 57A and Figure 57B are a front-side perspective view and a back-side perspective view showing the second mounting module 700. The second mounting module 700 is provided with a circular opening H70 that guides incident light from a lens (not shown) and a groove 705 formed outside the opening H70 and concentric with the opening H70. In addition, the second mounting module 700 is provided with a main body side mounting surface 701 between the opening H70 and the groove 705. The main body side mounting surface 701 is concentric with the opening H70 and protrudes to the front side (+Z side).

[0235] The internal thread portion 702 is provided on the inner surface of the main body side mounting surface 701, and the external thread portion 703 is provided on the outer surface of the main body side mounting surface 701. The internal thread portion 702 is an internal thread portion to which the second lens barrel 750 (see Figure 58A ) can be attached. In addition, the external thread portion 703 is an external thread portion to which accessories such as a mounting adapter 720 (see Figure 61A ) and a lens cap 730 (see Figure 59 ) can be attached. A notch 704 is provided at the lower part of the front surface of the second mounting module 700.

[0236] Similar to the first mounting module 300, two positioning bosses 707 extending rearward (in the -Z direction) are provided on the back surface of the second mounting module 700. When the two positioning bosses 707 are inserted into two positioning holes 411 provided on the front surface of the front case 410, the second mounting module 700 is positioned to the front case 410.

[0237] In addition, screw insertion holes 708 with central axes parallel to the Z direction are respectively provided at the four corner portions of the second mounting module 700 in the XY plane. In the state of being positioned to the front case 410 as described above, four fixing screws 390 are respectively inserted into the four screw insertion holes 708 from the front side of the second mounting module 700 and tightened. In this way, the second mounting module 700 is fixed to the front case 410, as Figure 56 shown. It should be noted that in the state where the second mounting module 700 is attached to the front module 400, the main body side mounting surface 701 becomes parallel to the image sensor 425.

[0238] Figure 58A is a front side perspective view showing a state where the second lens barrel 750 is attached to the imaging device 2000. Figure 58B is a rear side perspective view showing the second lens barrel 750. A lens side mounting surface 751 and a lens side external thread portion 752 having the same nominal diameter as the internal thread portion 702 of the second mounting module 700 are provided at the rear end (rear side) of the second lens barrel 750. The second lens barrel 750 is fixed to the second mounting module 700 in a state where the lens side external thread portion 752 is screwed into the internal thread portion 702 of the second mounting module 700 and the lens side mounting surface 751 abuts against the main body side mounting surface 701.

[0239] When the second lens barrel 750 is attached to the imaging device 2000, water may penetrate into the interior of the imaging device 2000 through a minute gap between the lens side mounting surface 751 and the main body side mounting surface 701 or a minute gap between components of the second lens barrel 750. To solve this problem, in the state where the second lens barrel 750 has been attached, the lens cap 730 can be attached to the second mounting module 700.

[0240] Figure 59is a front side perspective view showing a state in which the second lens barrel 750 and the lens cap 730 are attached to the imaging device 2000. Figure 60A is a sectional view in the YZ plane including the optical axis, which shows a state in which the second lens barrel 750 and the lens cap 730 are attached to the imaging device 2000. Figure 60B is a view showing Figure 60A an enlarged view of a portion FF shown in. It should be noted that Figure 59 the second lens barrel 750 located inside the lens cap 730 is not shown. Additionally, Figure 60A components inside the imaging device 2000 are not shown. Figure 60A Portion FF in shows the structure near the groove 705 of the second mounting module 700.

[0241] The lens cap 730 has a generally cylindrical shape that is larger in outer diameter than the second lens barrel 750. The lens cap 730 is attached to the second mounting module 700 in such a manner as to cover the second lens barrel 750 attached to the second mounting module 700. The front surface of the cylindrical portion constituting the side surface of the lens cap 730 is sealed by a transparent front glass 731 that allows incident light to pass through. Thus, water is prevented from seeping into the interior from the front surface of the lens cap 730.

[0242] In addition, a cap-side internal thread portion 734 that can be screwed onto the external thread portion 703 of the second mounting module 700 is provided in the inner wall at the rear end of the lens cap 730. The lens cap 730 is attached to the second mounting module 700 by screwing the cap-side internal thread portion 734 onto the external thread portion 703.

[0243] A circular engagement groove 733 is provided in the rear end surface of the lens cap 730, and an O-ring 732 is fitted in the engagement groove 733. Thus, when the lens cap 730 is attached to the second mounting module 700, the O-ring 732 is held in a state of being compressed in the Z direction between the engagement groove 733 and the attachment contact surface 706 provided in the groove 705 of the second mounting module 700. In this way, the O-ring 732 prevents a gap from being generated between the attachment portions of the lens cap 730 and the second mounting module 700. Therefore, water can be prevented from seeping into the interior from the connection portion between the rear end of the lens cap 730 and the second mounting module 700. Although the O-ring 732 is used as a sealing member in this example, a rubber sheet can also be used by forming the rubber sheet into a ring shape.

[0244] Incidentally, the second mounting module 700 is shorter than the first mounting module 300 in the Z direction. Therefore, a lens barrel having a flange back focus as long as that of the first lens barrel 200 cannot be directly attached. By attaching a mounting converter of a predetermined length to the second mounting module 700, a lens barrel with a long flange back focus can be attached by extending the flange back focus. Specifically, a mounting converter having an external thread portion that can be screwed onto the internal thread portion 702 of the second mounting module 700 is attached.

[0245] Meanwhile, since such a mounting adapter is attached to the second mounting module 700 by a rotational operation, there is a possibility that the phase with respect to the second mounting module 700 is uncertain when fixed. If the phase of the mounting adapter with respect to the second mounting module 700 is uncertain, the performance of the lens barrel may not be utilized because the phase of the lens barrel attached to the mounting adapter with respect to the image sensor 425 is uncertain.

[0246] The mounting adapter that solves the above problems will be described below. Figure 61A and Figure 61B are a front-side perspective view and a back-side perspective view showing the positional relationship between the imaging device 2000 and the mounting adapter 720 before attachment. It should be noted that Figure 61A and Figure 61B show a state in which the lower side of the imaging device 2000 is flipped upward.

[0247] The mounting adapter 720 has a structure that can be attached with an appropriate phase when attached to the second mounting module 700. The mounting adapter 720 is provided with a front-side mounting member 721 on the front side and a rear-side mounting surface 725 on the rear side. The front-side mounting member 721 is provided with a known bayonet-type lens mount.

[0248] In addition, the mounting adapter 720 is provided with a positioning member 723 and a locking ring 722. A positioning protrusion 724 extending rearward (-Z side) is provided at the front end of the positioning member 723. When attached to the second mounting module 700, the positioning protrusion 724 of the mounting adapter 720 engages with the notch 704 of the second mounting module 700. This prevents the phase deviation of the mounting adapter 720 with respect to the second mounting module 700.

[0249] In addition, as Figure 61B shown, a locking thread portion 726 is formed in the inner wall of the locking ring 722, and the locking thread portion 726 can be screwed onto the external thread portion 703 of the second mounting module 700. By rotating the locking ring 722 in a state where the positioning protrusion 724 is inserted into the notch 704, the locking thread portion 726 is screwed onto the external thread portion 703 of the second mounting module 700. In this way, the mounting adapter 720 can be attached to the second mounting module 700.

[0250] Next, the third embodiment will be described. Figure 62A and Figure 62B are a front-side perspective view and a back-side perspective view showing the imaging device 3000 according to the third embodiment. Figure 63is a side view showing the imaging device 3000. It should be noted that the components of the imaging device 3000 that are the same as those of the imaging device 1000 according to the first embodiment are denoted by the same reference numerals and the same component names, and the common description will be omitted.

[0251] The first difference between the imaging device 3000 and the imaging device 1000 is that the intermediate parts 3010a, 3010b, 3010c, and 3010d are respectively inserted between the arm parts 413a, 413b, 413c, 413d of the front shell 410 and the arm parts 512a, 512b, 512c, 512d of the rear shell 510. Related to the first point above, the second difference between the imaging device 3000 and the imaging device 1000 is that the side plates 610a, 610b, 610c, 610d are replaced with the side plates 3020a, 3020b, 3020c, and 3020d. The intermediate parts 3010a to 3010d serve to extend the length L of the arm parts 413a to 413d of the front shell 410 in the Z direction. Therefore, the cross-sectional shape of the intermediate parts 3010a to 3010d in the XY plane is substantially the same as that of the arm parts 413a to 413d described later.

[0252] Figure 64A and Figure 64B is a perspective view illustrating a method of attaching the side plates 3020a to 3020d to the imaging device 3000. The side plates 3020a to 3020d are substantially rectangular and are equivalent to the shape obtained by extending the side plates 610a to 610d in the Z direction (optical axis direction) Figure 63 by the length L of the intermediate parts 3010a to 3010d shown. Like the side plates 610a to 610d, the side plates 3020a to 3020d are fastened to the front shell 410 and the rear shell 510 by fixing screws 630 in order to connect the front shell 410, the intermediate parts 3010a to 3010d, and the rear shell 510. In this way, the side plates 3020a to 3020d form the appearance of the four surfaces (upper, lower, right, and left surfaces) of the imaging device 3000.

[0253] The plate sealing member 3021 is also pasted on the side plates 3020a to 3020d in the same manner as the plate sealing member 611 is pasted on the side plates 610a to 610d. The plate sealing member 3021 has a substantially square frame shape and is equivalent to the shape obtained by extending the plate sealing member 611 in the Z direction by the length L. The plate sealing member 3021 is respectively pushed and fitted into the square frame recesses in the state of being pasted on the side plates 3020a to 3020d. It should be noted that the square frame recesses of the imaging device 3000 are also equivalent to the shape obtained by extending the square frame recesses 640 in the Z direction by the length L.

[0254] Next, the overall structure of the imaging device 3000 will be described.Figure 65A and Figure 65B are a front-side exploded perspective view and a back-side exploded perspective view showing a state in which side plates 3020a to 3020d are removed from the imaging device 3000. The imaging device 3000 is provided with a first mounting module 300, a front module 400, intermediate parts 3010a to 3010d, sealing members 620a to 620d, and a rear module 500. It should be noted that the sealing members 620a to 620d may be additionally arranged between the front case 410 and the intermediate parts 3010a to 3010d to improve the waterproof function.

[0255] The intermediate parts 3010a, 3010b, 3010c, 3010d are respectively provided with positioning holes (positioning parts for positioning relative to the front case) 3011a, 3011b, 3011c, 3011d and positioning bosses (positioning parts for positioning relative to the rear case) 3012a, 3012b, 3012c, 3012d. For example, when the intermediate part 3010a is arranged between the front case 410 and the rear case 510, the positioning boss 414a of the front case 410 is fitted into the positioning hole 3011a, and the positioning boss 3012a is fitted into the positioning hole 513a of the rear case 510. Thus, the intermediate part 3010a is positioned between the front case 410 and the rear case 510. The intermediate parts 3010b to 3010d are positioned in the same way as the intermediate part 3010a.

[0256] In addition, the intermediate parts 3010a to 3010d have recesses 3014 on the same plane that respectively form recesses 415a to 415d of the front case 410 and recesses 514a to 514d of the rear case 510. This enables the side plates 3020a to 3020d to be loaded and unloaded and ensures the waterproof function.

[0257] In the above description, the intermediate parts 3010a to 3010d have a cross-sectional shape that is the same as the cross-sectional shape of the arm parts 413a to 413d of the front case 410 in the XY plane and extend the frame part of the imaging device 3000 in the Z direction. However, the shape of the intermediate part is not limited to the above shape. In addition, although the intermediate parts are separately arranged at the arm parts 413a to 413d of the front case 410 or the arm parts 512a to 512d of the rear case 510, this arrangement is not limited to the above arrangement. For example, the intermediate parts 3010a and 3010b may be connected in the X direction, or the intermediate parts 3010a to 3010d may be connected in a ring-forming manner.

[0258] Thus, if necessary, the imaging device 3000 is constructed by extending the housing portion by a desired length in the Z direction using the middle portions 3010a to 3010d, without changing the basic structure of the imaging device 1000. That is, for example, according to the user's needs, by accommodating the unit substrate for expanding the functions of the imaging device 1000 inside the housing portion, the specifications (performance) of the imaging device 1000 can be easily changed. It should be noted that the cooling fan and the heat dissipation module can be accommodated in the housing portion.

[0259] Next, a fourth embodiment will be described. Figure 66A FIG. is a front side perspective view of the imaging device 4000 according to the fourth embodiment in a state where the side plate is removed. Figure 66B is an enlarged view showing Figure 66A The XY cross-sectional view (cross-section in a plane parallel to the XY plane) of the portion EE shown. The imaging device 4000 differs from the imaging device 1000 only in the positional relationship between the main substrate 450 and the sealing member 620. Therefore, the components of the imaging device 4000 that are the same as those of the imaging device 1000 according to the first embodiment are denoted by the same reference numerals and the same component names, and the common description will be omitted.

[0260] Although the imaging device 1000 has achieved a waterproof structure using the sealing member 620, the imaging device 4000 improves the impact resistance of the main substrate 450 by arranging the sealing member 620 around the main substrate 450.

[0261] More specifically, four sealing members 620 are arranged to cover the four corners of the substantially rectangular main substrate 450 in the imaging device 4000. As Figure 66B shown, the second support portions 624a and 624b of the sealing member 620 cover the right side portion S45a and the lower side portion S45b of the main substrate 450, respectively. Thus, when an external force such as an impact acts on the imaging device 4000, the side portions S45a and S45b of the main substrate 450 contact the second support portions 624a and 624b of the sealing member 620 having a buffering property before colliding with the high-rigidity components inside. Therefore, since the sealing member 620 absorbs the external force, the external force applied to the main substrate 450 becomes smaller, which reduces the damage (breakage) of the main substrate 450. Although only the lower right portion EE of the housing portion is described, the upper right portion, the upper left portion, and the lower left portion are configured in the same manner, and their description will be omitted.

[0262] Although the present invention has been described in detail based on suitable embodiments, the scope of the present invention is not limited to the specific embodiments. The present invention includes various configurations that do not depart from the gist of the present invention. In addition, the above embodiments show examples of the present invention, and these embodiments can be appropriately combined.

[0263] Other embodiments

[0264] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the present invention is not limited to the disclosed exemplary embodiments. The scope of the appended claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

[0265] This application claims priority to Japanese Patent Application No. 2020-174795, filed on October 16, 2020, the entire contents of which are incorporated herein by reference.

Claims

1. An imaging device, comprising: A front case, which forms the appearance of the device; A rear case, which forms the appearance of the device together with the front case; And A plurality of board members, Characterized in that at least one of the front case and the rear case has a plurality of arm portions, the plurality of arm portions extending in a direction substantially parallel to the optical axis of the imaging device and being integrated with at least one of the front case and the rear case, The front case and the rear case are connected by the plurality of arm portions, and The plurality of board members are fixed to the front case and the rear case so as to cover a plurality of openings formed by the front case, the rear case, and the plurality of arm portions in a state where the front case and the rear case are connected by the arm portions.

2. The imaging device according to claim 1, wherein, The rear case is provided with an interface.

3. The imaging device according to claim 1, wherein, Positioning portions for positioning the front case and the rear case are provided at the front ends of the arm portions.

4. The imaging device according to claim 1, wherein, When viewed in the direction of the optical axis, the shape of the arm portions appearing on the appearance of the device is an arc shape inscribed in a circle centered on the optical axis.

5. The imaging device according to claim 1, wherein, The openings are formed in the same shape in a plurality of surfaces, and The openings of the surfaces are covered by the board members having the same shape.

6. The imaging device according to claim 1, further comprising a sealing member disposed between the front housing and the rear housing.

7. The imaging device according to claim 1, further comprising a first substrate and a second substrate disposed inside the front housing and substantially parallel to the imaging surface of the image sensor, and, wherein, The image sensor is implemented in one of the first substrate and the second substrate.

8. The imaging device according to claim 7, wherein, The first substrate includes a main rigid portion, an auxiliary rigid portion, and a flexible portion connecting the main rigid portion and the auxiliary rigid portion, In a state where the auxiliary rigid portion at least partially overlaps the main rigid portion when viewed in a direction parallel to the optical axis by bending the flexible portion and the auxiliary rigid portion is configured to be substantially parallel to the main rigid portion, the auxiliary rigid portion is electrically connected to the second substrate.

9. The imaging device according to claim 8, wherein, The first substrate is formed such that the auxiliary rigid portion and the flexible portion are symmetrically arranged with the main rigid portion interposed therebetween.

10. The imaging device according to claim 8, wherein, First board-to-board connectors are respectively implemented in the auxiliary rigid portions, Second board-to-board connectors are arranged on the same surface of the second substrate, and The first board-to-board connectors are respectively electrically connected to the second board-to-board connectors.

11. The imaging device according to claim 8, further comprising: A frame member, which is arranged between the main rigid portion and the auxiliary rigid portion and holds the auxiliary rigid portion; And An elastic member, which is arranged between the auxiliary rigid portion and the frame member.

12. The imaging device according to claim 1, further comprising at least one expansion module, the expansion module being attachable so as to cover at least one of the openings, wherein, The expansion module is fixed by being fastened to the front case and the rear case.

13. The imaging device according to claim 12, wherein,The openings are formed at at least two positions, and The expansion module covering one of the openings is a cooling fan module having a cooling fan, and the expansion module covering the other opening is a vent module having a vent.

14. The imaging device according to claim 13, wherein, The openings are formed at at least three positions, and The cooling fan module and at least one vent module are arbitrarily attached to the openings formed at at least three positions.

15. The imaging device according to claim 12, wherein, The expansion module is a fixing module having at least one tripod internal thread portion.

16. The imaging device according to claim 12, wherein, The expansion module is a microphone module having at least one microphone.

17. The imaging device according to claim 12, wherein, The expansion module is a grip module having a grip portion.

18. The imaging device according to claim 12, wherein, The expansion module is a handle module having a handle.

19. The imaging device according to claim 12, wherein, The expansion module is a recording module having at least one recording medium slot.

20. The imaging device according to claim 12, wherein, The expansion module is an expansion terminal module having at least one expansion terminal.

21. The imaging device according to claim 12, wherein, The extension module is a wireless module having a wireless communication unit.

22. The imaging device according to claim 12, wherein, The extension module is a display module having at least one display board.

23. The imaging device according to claim 12, wherein, The extension module is a battery module having at least one battery chamber.

24. The imaging device according to claim 12, wherein, The extension module is an operation module having at least one operation unit.

25. The imaging device according to claim 12, wherein, The extension module is a lighting module having at least one lighting unit.

26. The imaging device according to claim 12, wherein, The extension module is a heat sink module having at least one heat sink fin.

27. The imaging device according to claim 1, further comprising an arm portion disposed between the front case and the rear case to extend the arm portion in a direction parallel to the optical axis, thereby extending an intermediate portion of the imaging device.

28. The imaging device according to claim 27, wherein, Each of the intermediate portions has a positioning portion positioned relative to the front case and a positioning portion positioned relative to the rear case.

29. The imaging device according to claim 1, wherein, The front case has a lens mount.

30. The imaging device according to claim 1, wherein, The arm portions are provided in both the front case and the rear case, and the arm portion of the front case is longer than that of the rear case.

31. The imaging device according to claim 1, wherein, The plate member is fastened to the front case and the rear case by screws.

Images