LED Base Module, LED Module and LED Light Strip

Abstract

The present invention relates to the technical field of light-emitting diodes, and specifically discloses an LED base module, an LED module, and an LED light strip. The LED base module includes an LED lamp socket and a carrier base for carrying the LED lamp socket. The LED lamp socket includes an insulating base and a plurality of conductive terminals, and the plurality of conductive terminals are fixed to the insulating base; each conductive terminal has a die bonding portion for electrically connecting with an LED chip assembly and a pin portion exposed outside the insulating base; the carrier base has a plurality of conductive portions and at least one avoidance through hole; each conductive portion has a first end and a second end, the first end and the second end are respectively exposed on opposite end faces of the carrier base, the first end is used for electrically connecting with the pin portion, and the second end is used for electrically connecting with a wire; at least one avoidance through hole is used for the punching and avoidance of one of the wires. The structural design of this LED base module is beneficial to improving the yield and reliability of LED light strip processing.

Description

Technical Field

[0001] The present invention relates to the technical field of light-emitting diodes, and particularly to an LED base module, an LED module and an LED light strip. Background Art

[0002] Currently, the mainstream processing method for LED light strips on the market is to encapsulate light-emitting diodes (English full name: light-emitting diode, abbreviation: LED) and drive chips in the mounting grooves of LED brackets with encapsulating glue to form LED lamp beads, and then connect multiple ED lamp beads in series and parallel through power lines, signal lines, etc. to form an LED light strip. However, during the manufacturing process of LED light strips, limited by the structure and pin spacing of LED brackets, the power line and the signal line are directly welded to the pins, and then the part of the signal line located between two pins is cut off to obtain a signal input line and a signal transmission line. However, the power line and the signal line are prone to problems such as poor soldering or insecure soldering during soldering, and the pins are prone to deformation when cutting the signal line, resulting in a high defective rate and poor reliability of the light strip, and a high risk of failure during the service life. Summary of the Invention

[0003] One of the purposes of the embodiments of the present invention is to provide an LED base module, aiming to improve the yield rate of LED light strip processing and the reliability of the LED light strip.

[0004] To achieve the above purpose, the technical solutions adopted in the embodiments of the present invention are as follows:

[0005] The LED base module includes:

[0006] An LED lamp socket, the LED lamp socket includes an insulating base and a plurality of conductive terminals;

[0007] Each of the conductive terminals is fixed to the insulating base, and each of the conductive terminals has a die bonding part for electrically connecting with an LED chip assembly and a pin part exposed outside the insulating base;

[0008] A carrier base for carrying the LED lamp socket; the carrier base has a plurality of conductive parts and at least one avoidance through hole; each of the conductive parts has a first end and a second end, the first end and the second end are respectively exposed on opposite end faces of the carrier base, the first end is used for electrically connecting with the pin part, and the second end is used for electrically connecting with a wire; at least one of the avoidance through holes is used for a wire to cross over to achieve punching avoidance.

[0009] In one embodiment, the insulating base has a bottom end face and a top end face, and the pin portion is exposed from the bottom end face; the conductive portion is disposed on the carrier base and extends in a direction from the bottom end face to the top end face, with the first end portion facing the bottom end face and the second end portion facing away from the bottom end face; the avoidance through hole is formed in the carrier base in a direction from the bottom end face to the top end face.

[0010] In one embodiment, at least some of the conductive portions are spaced apart in pairs to form a first conductive pair, with one of the conductive portions of the first conductive pair being an input terminal and the other being an output terminal; the avoidance through hole is formed between the two conductive portions of a group of the first conductive pairs.

[0011] In one embodiment, the number of the first conductive pairs is one group, the input terminal of the first conductive pair is a first signal input terminal, and the output terminal is a first signal output terminal; the number of the avoidance through holes is one, and the avoidance through hole is disposed between the first signal input terminal and the first signal output terminal;

[0012] Alternatively, the number of the first conductive pairs is one group, the input terminal of the first conductive pair is a first signal input terminal, and the output terminal is a first signal output terminal; the number of the avoidance through holes is two or more, and one of the avoidance through holes is disposed between the first signal input terminal and the first signal output terminal;

[0013] Alternatively, the number of the first conductive pairs is two or more groups. For one group of the first conductive pairs, the input terminal is a first signal input terminal and the output terminal is a first signal output terminal; the number of the avoidance through holes is two or more, and each avoidance through hole is correspondingly formed between the two conductive portions of a group of the first conductive pairs.

[0014] In one embodiment, the orthographic projection of the bottom end face of the LED lamp base on the carrier base does not exceed the area enclosed by the outer edge of the carrier base.

[0015] In one embodiment, the orthographic projection of the bottom end face of the LED lamp base on the carrier base falls within the area enclosed by the outer edge of the carrier base;

[0016] Alternatively, the orthographic projection of the bottom end face of the LED lamp base on the carrier base coincides with the area enclosed by the outer edge of the carrier base.

[0017] In one embodiment, the conductive terminal is fixed to the insulating base by injection molding. The insulating base has a bottom end face and a top end face, and the insulating base has a concave cavity that depresses from the top end face towards the bottom end face for accommodating the LED chip assembly and the LED encapsulation glue; all the die bonding parts penetrate through the insulating base and into the concave cavity.

[0018] Alternatively, the conductive terminal is fixed to the insulating base by compression molding. The insulating base has a bottom end face and a top end face. The die bonding part is exposed on the top end face, and the pin part is exposed on the bottom end face. The top end face is used for compression molding and encapsulation of the LED encapsulation glue.

[0019] Compared with the prior art, the LED base module provided by the embodiment of the present invention includes an LED lamp socket and a carrying base for carrying the LED lamp socket. The LED lamp socket includes an insulating base and a plurality of conductive terminals. Each conductive terminal has a die bonding part for electrically connecting with the LED chip assembly and a pin part exposed outside the insulating base; the carrying base has a plurality of conductive parts adapted to the pin parts and at least one avoidance through hole; the conductive parts are used for electrically connecting with the wire and the pin part, and the avoidance through hole is used for facilitating the punching of the wire. With such a structural design, by introducing the carrying base, wire soldering and punching can be performed on the carrying base, solving problems such as poor soldering, insecure soldering, and pin deformation caused by wire soldering and punching on the LED lamp socket, thus facilitating the improvement of the processing efficiency and the qualified rate of the processed LED strip and the reliability of the obtained LED strip. In addition, the processing precision of the LED strip can also be reduced.

[0020] The second object of the embodiment of the present invention is to provide an LED module, and its specific technical solution is as follows:

[0021] The LED module includes:

[0022] The above-mentioned carrying base, wherein one of the conductive parts in the carrying base is a first signal input terminal, the other conductive part is a first signal output terminal, and one avoidance through hole is provided between the first signal input terminal and the first signal output terminal;

[0023] The LED lamp bead, which includes an LED chip assembly, an LED encapsulation glue, and the above-mentioned LED lamp socket;

[0024] The LED chip assembly is electrically connected to the die bonding part;

[0025] The LED encapsulation glue is used for encapsulating the LED chip assembly and the die bonding part;

[0026] One of the pin parts is a second signal input end, and the other pin part is a second signal output end; the second signal input end is used for mating connection with the first signal input end, and the second signal output end is used for mating connection with the first signal output end.

[0027] In one embodiment, the LED chip assembly includes a driving chip and at least one light-emitting chip, and the driving chip is electrically connected to the light-emitting chip.

[0028] Compared with the prior art, the LED module provided by the embodiment of the present invention includes an LED lamp bead and a carrying base. Since the LED lamp bead uses a carrying base with an avoidance through hole, it is possible to avoid directly welding and punching on the LED lamp bead, but to weld and punch the wire on the carrying base, solving the problems of false soldering, insecure welding, and pin deformation caused by directly welding and punching the wire on the LED lamp socket, thereby being beneficial to improving the yield and reliability of the LED strip processing.

[0029] The third object of the embodiment of the present invention is to provide an LED strip, and its specific technical solution is as follows:

[0030] LED strip, including:

[0031] At least two LED modules as described above; each LED lamp bead is correspondingly welded to one of the carrying bases;

[0032] A wire assembly, the wire assembly at least includes a power line, a signal input line, and at least one signal transmission line;

[0033] Wherein, one end of the signal input line is connected to an external signal source, and the other end is connected to the first signal input end of one of the carrying bases to input a signal to the LED strip; one end of the signal transmission line is connected to the first signal output end of one of the carrying bases, and the other end is connected to the first signal input end of the adjacent carrying base to enable the signal to be cascaded and transmitted between two adjacent LED lamp beads;

[0034] The power line is used for electrically connecting the LED lamp bead to the external power supply.

[0035] In one embodiment, the power line is connected to another conductive part in the carrying base to supply power to the LED strip;

[0036] And / or, the LED strip further includes an insulating sealant, and the insulating sealant at least wraps the part where the LED module and the wire assembly are connected to each other.

[0037] In one embodiment, the LED strip further includes a lamp housing adapted to the LED module. The lamp housing has a receiving cavity, and each LED module is received in the receiving cavity. The wire assembly passes through the lamp housing from the receiving cavity.

[0038] Compared with the prior art, for the LED strip provided by the embodiment of the present invention, since the wire soldering and punching are carried out on the carrier base during the processing, the problems such as poor soldering, insecure soldering and pin deformation caused by directly soldering and punching wires on the LED lamp socket are solved. Thus, the reliability of the LED strip is effectively improved, and the quality of the LED strip is also improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0040] Figure 1 Schematic perspective view of the LED base module provided in Embodiment 1 of the present invention;

[0041] Figure 2 Schematic cross-sectional view of the carrier base provided in Embodiment 1 of the present invention;

[0042] Figure 3 Exploded structural schematic diagram of the LED module provided in Embodiment 1 of the present invention;

[0043] Figure 4 Schematic perspective view of the LED lamp bead with the LED encapsulation glue removed provided in Embodiment 1 of the present invention;

[0044] Figure 5 Schematic perspective view of the LED strip provided in Embodiment 1 of the present invention;

[0045] Figure 6 Schematic perspective view of the lamp housing provided in Embodiment 1 of the present invention;

[0046] Figure 7 Exploded structural schematic diagram of the lamp housing provided in Embodiment 1 of the present invention;

[0047] Figure 8 Schematic perspective view of the LED strip including the lamp housing provided in Embodiment 1 of the present invention;

[0048] Figure 9 Schematic flow chart of the manufacturing method of the LED strip in Embodiment 1 of the present invention;

[0049] Figure 10 Schematic flow chart of the manufacturing method of the LED strip in Embodiment 1 of the present invention;

[0050] Figure 11 Schematic perspective view of the carrier base provided in Embodiment 2 of the present invention;

[0051] Figure 12 Schematic perspective view of the carrier base provided in another embodiment of Embodiment 2 of the present invention;

[0052] Figure 13 Schematic perspective view of the carrier base provided in Embodiment 3 of the present invention;

[0053] Figure 14 Schematic perspective view of the LED lamp bead provided in Embodiment 4 of the present invention;

[0054] Figure 15 Schematic perspective view of the LED lamp bead from another perspective provided in Embodiment 4 of the present invention;

[0055] Figure 16 Schematic perspective view of the LED lamp bead with the LED sealant removed provided in Embodiment 4 of the present invention;

[0056] Figure 17 Exploded structure schematic diagram of the LED lamp bead provided in Embodiment 4 of the present invention.

[0057] Reference numerals:

[0058] 10. LED base module;

[0059] 11. LED lamp socket; 111. Insulating base; 110. Concave cavity; 112. Conductive terminal; 1121. Die bonding part; 1122. Pin part; 11221. Second signal input end; 11222. Second signal output end; 1101. Top end face; 1102. Bottom end face;

[0060] 12. Carrier base; 120. Avoidance through hole; 121. Conductive part; 12101. First end; 12102. Second end; 1211. First signal input end; 1212. First signal output end;

[0061] 20. LED module;

[0062] 21. LED lamp bead; 211. LED chip assembly; 2111. Driving chip; 2112. Light emitting chip; 2113. Connecting wire; 212. LED encapsulant;

[0063] 30. LED strip;

[0064] 31. Conductor assembly; 310. Bare wire core part; 311. Power cord; 312. Signal input wire; 313. Signal transmission line; 314. Ground wire;

[0065] 32. Lamp housing; 320. Accommodating cavity; 3201. Glue injection hole; 3202. Conductor hole; 321. First housing; 322. Second housing;

[0066] 40. Punching equipment; 41. Cutting tool; PQ. First linear trajectory; RS. Second linear trajectory. Specific implementation manner

[0067] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0068] Embodiment 1

[0069] Figures 1 to 5 Shown is a structural schematic diagram of the LED base module 10, the LED module 20, the LED light strip 30 and corresponding components provided in this embodiment; Figures 9 to 10 It is a schematic flowchart of the manufacturing method of the LED light strip 30 provided in this embodiment.

[0070] Please refer to Figure 1 and Figure 3, the LED base module 10 of this embodiment includes an LED lamp socket 11 and a carrier base 12 for carrying the LED lamp socket 11. Among them, the LED lamp socket 11 includes an insulating base 111 and a plurality of conductive terminals 112. The insulating base 111 is formed with a concave cavity 110 for accommodating the LED chip assembly 211 and the LED encapsulant 212; the plurality of conductive terminals 112 are fixed to the insulating base 111 by injection molding, and each conductive terminal 112 has a die bonding portion 1121 and a lead portion 1122. The die bonding portion 1121 penetrates into the concave cavity 110 for electrically connecting with the LED chip assembly 211, while the lead portion 1122 is exposed outside the insulating base 111 for connecting with the carrier base 12. The carrier base 12 has a plurality of conductive portions 121 and at least one avoidance through hole 120; each conductive portion 121 has a first end 12101 and a second end 12102. The first end 12101 and the second end 12102 are respectively arranged on two opposite end faces of the carrier base 12. The first end 12101 is used for electrically connecting with the lead portion 1122, and the second end 12102 is used for electrically connecting with a wire; at least one avoidance through hole 120 is used for the wire straddling the avoidance through hole 120 to perform punching and avoidance. In this embodiment, the carrier base 12 is formed with an avoidance through hole 120, and the avoidance through hole 120 is arranged between two conductive portions 121. When a wire straddles the avoidance through hole 120 and is respectively welded to the two conductive portions 121, a crossover portion is formed at the position of the wire opposite to the avoidance through hole 120. Since the crossover portion is opposite to the avoidance through hole 120, it is convenient to punch the crossover portion to cut off the wire, and during the punching process, the punching device 40 will not impact or damage the LED lamp socket 11, which can effectively protect the LED lamp socket 11. When manufacturing an LED strip 30 using the LED base module 10 of this embodiment, the yield rate can reach more than 99.7%.

[0071] Please refer to Figure 2 and Figure 1, in some embodiments, the insulating base 111 has a bottom end surface 1102 and a top end surface 1101. The concave cavity 110 is recessed from the top end surface 1101 towards the bottom end surface 1102. The die bonding portion 1121 penetrates through the insulating base 111 and the concave cavity 110, and the pin portion 1122 is exposed outside the bottom end surface 1102; the conductive portion 121 extends along the direction from the bottom end surface 1102 to the top end surface 1101 and is disposed on the carrier base 12. The first end portion 12101 formed by the conductive portion 121 faces the bottom end surface 1102, while the second end portion 12102 formed by the conductive portion 121 faces away from the bottom end surface 1102. This is beneficial for the first end portion 12101 to be adaptively electrically connected to the pin portion 1122, and at the same time beneficial for the second end portion 12102 to be adaptively electrically connected to the wire. It can effectively realize that the LED lamp socket 11 and the wire are respectively welded on the opposite sides of the carrier base 12; the avoidance through hole 120 is formed in the carrier base 12 along the direction from the bottom end surface 1102 to the top end surface 1101, so that among the wires welded to the carrier base 12, one of the wires crosses the avoidance through hole 120 on the surface of the carrier base 12 facing away from the LED lamp socket 11. During punching, the cutting tool passes through the avoidance through hole 120, and the wire crossing the avoidance through hole 120 can be cut off.

[0072] Please refer to Figure 1 , in some embodiments, at least part of the conductive portions 121 are spaced apart in pairs to form a first conductive pair. In the same group of the first conductive pairs, one conductive portion 121 is an input end and the other conductive portion 121 is an output end; the avoidance through hole 120 is formed between the two conductive portions 121 of a group of the first conductive pairs. With such a structural design, when a wire is connected between the two conductive portions 121 of the first conductive pair, a part of the wire straddles the avoidance through hole 120 to form a cross-wire portion, and the opposite ends of the cross-wire portion are welding portions. After welding the welding portions to the two conductive portions 121 correspondingly, it is convenient to punch the wire, so that the transmission between the conductive portion 121 as the input end and the conductive portion 121 as the output end cannot be directly transmitted by the wire spanning between the two conductive portions 121, but from the conductive portion 121 as the input end through a pin portion 1122 to the LED chip assembly 211 installed in the concave cavity 110, and then from another pin portion 1122 of the LED chip assembly 211 to the conductive portion 121 as the output end and through the wire to the next LED chip assembly 211, thereby realizing the signal cascade transmission of multiple LED modules 20. And the structural design of the avoidance through hole 120 can improve the processing reliability of the LED strip 30, avoid damaging the LED lamp socket 11 when punching the wire, and can also effectively solve the influence of punching on the welding reliability. In this embodiment, except for the two conductive portions 121 forming the first conductive pair, the remaining conductive portions 121 may not be distributed in pairs or may be distributed in pairs.

[0073] Please refer toFigure 1 and Figure 2 , in some embodiments, the number of the first conductive pairs is one group. In the first conductive pair, the conductive part 121 serving as the input end is the first signal input end 1211, and the conductive part 121 serving as the output end is the first signal output end 1212. At this time, the number of the avoidance through holes 120 is one, and the avoidance through hole 120 is arranged between the first signal input end 1211 and the first signal output end 1212; so that when the wire extends from the first signal input end 1211 to the first signal output end 1212, it can span across the avoidance through hole 120, thereby facilitating the punching of the wire to cut off the jumper part connected between the first signal input end 1211 and the first signal output end 1212, and avoiding the direct connection between the first signal input end 1211 and the first signal output end 1212 through the wire spanning across the avoidance through hole 120. In some embodiments, the number of the first conductive pairs is three groups, and the avoidance through hole 120 is arranged between the two conductive parts 121 of one group of the first conductive pairs. Of course, the number of groups of the first conductive pairs is not limited to one group or three groups, and can also be two groups or more than four groups, and can be specifically set according to actual needs.

[0074] Please refer to Figure 1 or Figure 2 , in some embodiments, the carrier base 12 includes any one of a BT resin substrate (BT), a printed circuit board (PCB), a PCBA board, and a flexible printed circuit board (FPCB). Taking these several boards listed as the carrier base 12 has good insulation performance on the one hand and is convenient for punching processing on the other hand.

[0075] Please refer to Figure 1 , in some embodiments, the LED lamp socket 11 has a limiting protrusion (not marked in the figure), and the limiting protrusion is formed on the surface of the LED lamp socket 11 facing the carrier base 12, that is, the limiting protrusion extends from the bottom end surface 1102 of the LED lamp socket 11 towards the carrier base 12. Thus, when the carrier base 12 installs the LED lamp socket 11, it is convenient for the limiting protrusion to be inserted into the avoidance through hole 120 to improve the positioning reliability and connection reliability between the LED lamp socket 11 and the carrier base 12.

[0076] Please refer to Figure 1, in some embodiments, the orthographic projection of the bottom end surface 1102 of the LED lamp socket 11 on the carrier base 12 does not exceed the area enclosed by the outer edge of the carrier base 12. Such a structural design allows at least one LED lamp socket 11 to be installed on one carrier base 12, thereby achieving the effect of mounting multiple LED lamp beads 21 on one carrier base 12. In some embodiments, the orthographic projection of the bottom end surface 1102 of the LED lamp socket 11 on the carrier base 12 falls within the area enclosed by the outer edge of the carrier base 12. With such a structural design, multiple LED lamp beads 21 can be installed on each carrier base 12. In some embodiments, the orthographic projection of the bottom end surface 1102 of the LED lamp socket 11 on the carrier base 12 coincides with the area enclosed by the outer edge of the carrier base 12. With such a structural design, it is ensured that one LED lamp bead 21 can be installed on each carrier base 12. The structural design of the carrier base 12 and the LED lamp socket 11 enables the soldering of the LED lamp socket 11 to the wire to be no longer limited by the size of the LED lamp socket 11, but rather depends on the carrier base 12. The method of directly soldering the wire to the LED lamp socket 11 is changed to soldering the wire to the carrier base 12, thereby effectively improving the processing efficiency of the LED light strip 30 and the yield rate of manufacturing the LED light strip 30.

[0077] Please refer to Figure 3 and Figure 4 , based on the above LED base module 10, this embodiment further provides an LED module 20. The LED module 20 includes the above-mentioned carrier base 12 and LED lamp beads 21; wherein, one conductive part 121 in the carrier base 12 is the first signal input terminal 1211, and the other conductive part 121 is the first signal output terminal 1212, and an avoidance through hole 120 is provided between the first signal input terminal 1211 and the first signal output terminal 1212. The LED lamp bead 21 includes an LED chip assembly 211, an LED encapsulation glue 212, and the above-mentioned LED lamp socket 11; the LED chip assembly 211 is installed in the concave cavity 110 and is electrically connected to the die bonding part 1121; the LED encapsulation glue 212 is filled in the concave cavity 110; one pin part 1122 in the LED lamp socket 11 is used as the second signal input terminal 11221, and the other pin part 1122 is used as the second signal output terminal 11222; the second signal input terminal 11221 is used for mating connection with the first signal input terminal 1211, and the second signal output terminal 11222 is used for mating connection with the first signal output terminal 1212.

[0078] Please refer to Figure 4, in some embodiments, the LED chip assembly 211 includes a driving chip 2111 (i.e., an IC chip) and at least one light-emitting chip 2112, wherein the driving chip 2111 is electrically connected to the light-emitting chip 2112. In some embodiments, the driving chip 2111 is mounted on one of the die bonding parts 1121, and one type of light-emitting chip 2112 is correspondingly mounted on one die bonding part 1121. In some embodiments, the LED chip assembly 211 further includes a connecting wire 2113. Each type of light-emitting chip 2112 is electrically connected to the driving chip 2111 through the connecting wire 2113. At the same time, the driving chip 2111 is electrically connected to the die bonding part 1121 through the connecting wire 2113, so that the signal input from the first signal input terminal 1211 can be transmitted to the driving chip 2111; each type of light-emitting chip 2112 is electrically connected to the die bonding part 1121 for mounting this type of light-emitting chip 2112 through the connecting wire 2113. In some embodiments, the light-emitting chip 2112 includes a blue LED chip, a green LED chip, a red LED chip, a white LED chip, etc. Each type of light-emitting chip 2112 is correspondingly mounted on one die bonding part 1121; or two or more light-emitting chips 2112 are spacedly mounted on one die bonding part 1121.

[0079] Please refer to Figure 5 and Figure 3 , based on the above LED module 20, this embodiment further provides an LED light strip 30.

[0080] Specifically, the LED light strip 30 includes a wire assembly 31 and at least two LED modules 20. Among them, the wire assembly 31 at least includes a power line 311, a signal input line 312, and at least one signal transmission line 313. At least one LED lamp bead 21 is welded to each carrier base 12; the power line 311 is used to electrically connect the LED lamp bead 21 to an external power supply, and one end of the signal input line 312 is connected to an external signal source and the other end is connected to the first signal input terminal 1211 of one of the carrier bases 12 to input a signal to the LED light strip 30; one end of the signal transmission line 313 is connected to the first signal output terminal 1212 of one of the carrier bases 12 and the other end is connected to the first signal input terminal 1211 of another carrier base 12, so that the signal is cascaded and transmitted between adjacent two LED lamp beads 21.

[0081] Please refer to Figure 5 and Figure 1, in some embodiments, the power supply line 311 is connected to one of the remaining conductive parts 121 of each carrier base 12, so as to supply power to the LED strip 30. In some embodiments, the wire assembly 31 further includes a ground wire 314, and the ground wire 314 is used to ground the LED strip 30. In some embodiments, the LED strip 30 further includes an insulating sealant (not shown in the figure), and the insulating sealant at least wraps the connected parts of the LED module 20 and the wire assembly 31. In some embodiments, the insulating sealant completely seals the exposed parts of the wire assembly 31 and the LED module 20, thereby avoiding leakage of electricity at the welded parts of the LED lamp beads 21 and the carrier base 12, and at the same time avoiding leakage of electricity at the welded parts of the carrier base 12 and the wire assembly 31. In some embodiments, in addition to the power supply line 311, the signal input line 312, the signal transmission line 313, and the ground wire 314, other wires can be added to the wire assembly 31 according to actual needs.

[0082] Please refer to Figure 6 , Figure 7 and Figure 8 , in some embodiments, the LED strip 30 further includes a lamp housing 32, the lamp housing 32 has a receiving cavity 320 for receiving the LED module 20, and the sealant is filled in the receiving cavity 320 to seal the LED module 20, and the lamp housing 32 has light transmittance for the light of the LED lamp beads 21 to pass through. In some embodiments, one LED module 20 is received in one LED lamp housing 32, or two or more LED modules 20 are received in one LED lamp housing 32. In some embodiments, the lamp housing 32 includes a first housing 321 and a second housing 322, the first housing 321 and the second housing 322 are buckled with each other to form the lamp housing 32, and the receiving cavity 320 is formed by enclosing the first housing 321 and the second housing 322. In some embodiments, the lamp housing 32 is formed with a glue injection hole 3201 and a wire hole 3202, wherein the glue injection hole 3021 is used for injecting the sealant to seal the LED module 20, and at the same time the sealant also bonds and fixes the first housing 321 and the second housing 322, while the wire hole 3202 allows the wire assembly 31 welded to the LED module 20 to pass through the lamp housing 32.

[0083] Please refer to Figure 9 and Figure 10 , based on the above LED strip 30, this embodiment further provides a manufacturing method of the LED strip 30.

[0084] Specifically, the manufacturing method of the LED strip 30 includes the following steps:

[0085] Step S01: Extend at least two wires along the first straight line trajectory PQ, and there is a gap between adjacent two wires.

[0086] In step S01, before extending at least two wires along the first linear trajectory PQ, it further includes a step of removing the insulating layer from the at least two wires. By stripping the insulating layer of the wires, each wire forms a core exposed portion 310 that is adapted to the carrier base 12, and each core exposed portion 310 is connected to two conductive portions 121 of a carrier base 12 arranged along the first linear trajectory PQ. When the carrier base 12 is welded to the at least two wires, each core exposed portion 310 is respectively welded to the two conductive portions 121 arranged along the first linear trajectory PQ, and at least one core exposed portion 310 straddles the avoidance through hole 120 between the two conductive portions 121 along the first linear trajectory PQ to form a punching portion. In this embodiment, at least two wires are extended along the first linear trajectory PQ to form a wire assembly 31.

[0087] In some embodiments, the insulating layer of the wire is removed, that is, the enameled wire layer is removed. When removing the insulating layer, the wire is first straightened to keep the wire in a taut state, which is conducive to obtaining a more accurate core exposed portion 310 in the extending direction along the first linear trajectory PQ. An exposed area is formed by enclosing two adjacent core exposed portions 310 of two wires to support a carrier base 12. In some embodiments, three wires are arranged side by side along the first linear trajectory PQ to form a wire assembly 31, and core exposed portions 310 are formed on all three wires with the same extending length. In some embodiments, the wires are guided and extended along the first linear trajectory PQ by a lead rod, and the wires extending along the first linear trajectory PQ are pressed by a pressing plate to prevent the wires from being twisted and deformed. At the same time, a detector and an encoder are used to measure the extending length of the wires to facilitate determining the area where the insulating layer is peeled off. In some embodiments, the number of wires is not limited to two or three, and can also be more than three to form a wire assembly 31.

[0088] Step S02: Dispose at least two carrier bases 12 at intervals along the first linear trajectory PQ on the at least two wires.

[0089] In step S02, the carrier base 12 is placed on the exposed portion 310 of the wire core. In some embodiments, before placing the carrier base 12 on the exposed portion 310 of the wire core, it further includes applying solder paste to the exposed portion 310 of the wire core to improve the welding reliability between the carrier base 12 and the exposed portion 310 of the wire core. In some embodiments, solder paste can also be applied to the carrier base 12, or other methods that can improve the welding effect between the carrier base 12 and the wire can also be used. In some embodiments, the number of carrier bases 12 is at least two, there are two exposed areas formed by at least two wires, and the two exposed areas are spaced along the first straight-line trajectory PQ, so that placement can be carried out in each exposed area. In some embodiments, the number of carrier bases 12 is more than two, the number of exposed areas is the same as the number of carrier bases 12, and one carrier base 12 is correspondingly placed in each exposed area.

[0090] In some embodiments, the carrier base 12 is formed with multiple groups of first conductive pairs, and the multiple groups of first conductive pairs are spaced along the second straight-line trajectory RS. The second straight-line trajectory RS and the first straight-line trajectory PQ are perpendicular to each other. Each group of first conductive pairs corresponds to and faces a wire, so that the two conductive parts 121 of each group of first conductive pairs are respectively welded to a wire.

[0091] Step S03: Weld the carrier base 12 and at least two wires, so that each wire is respectively welded to the two conductive parts 121 arranged along the first straight-line trajectory PQ, and the cross-wire part of at least one wire straddles the avoidance through-hole 120 between the two conductive parts 121 arranged along the first straight-line trajectory PQ to form a punching part.

[0092] In step S03, the carrier base 12 and the wire are welded and fixed by a hot air mechanism. After welding, one wire straddles the avoidance through-hole 120, that is, a cross-wire part (not marked in the figure) is formed, and the opposite ends of the cross-wire part are respectively welded and fixed to the conductive parts 121 on the opposite sides of the avoidance through-hole 120 to facilitate subsequent punching of the wire.

[0093] Step S04: Punch the punching part to cut off the wire.

[0094] In step S04, the cross - wire part of the wire is punched by the punching device 40. During punching, first, the wire welded with the carrier base 12 is flipped so that the wire faces upward and the carrier base 12 faces downward, and the carrier base 12 abuts against the support. The cutting knife 41 feeds downward along the central axis direction of the avoidance through - hole 120 and inserts into the avoidance through - hole 120 to cut off the cross - wire part, so that the wire straddling the avoidance through - hole 120 is divided into two parts. After punching, the cutting knife 41 withdraws from the avoidance through - hole 120 along the central axis of the avoidance through - hole 120 to complete the punching. During the entire punching process, the cutting knife 41 only cuts off the cross - wire part of the wire, does not cut other line segments of the wire, and the cutting knife 41 does not touch the carrier base 12, effectively avoiding damage or even destruction of the carrier base 12 by the punching device 40, and at the same time improving the punching efficiency. The cut - off wire is the signal wire, that is, multiple segments of signal wires are formed, and one of the signal wires is the signal input wire 312, and the remaining segments of the signal wires are signal transmission wires 313. One end of the signal input wire 312 is connected to an external signal source to input a signal to the LED lamp bead 21 through the conductive part 121 of the carrier base 12. Each signal transmission wire 313 is connected between adjacent two carrier bases 12 to realize the cascade of the signal source between the LED lamp beads 21.

[0095] Steps S05 - S06: At least one LED lamp bead 21 is arranged on the surface of each carrier base 12 facing away from the wire.

[0096] In step S05, first, the wire welded with the carrier base 12 is flipped so that the surface of the carrier base 12 facing away from the wire faces upward, thus facilitating the arrangement of the LED lamp bead 21 on the carrier base 12. In some embodiments, before arranging the LED lamp bead 21 on the carrier base 12, it further includes coating solder paste on the carrier base 12 to facilitate the welding of the LED lamp bead 21 and the carrier base 12, improving the welding reliability and firmness. In some embodiments, solder paste can also be coated on the conductive part 121 of the LED lamp bead 21. When arranging the LED lamp bead 21, each pin of the LED lamp bead 21 should be matched with a conductive part 121.

[0097] In some embodiments, the LED lamp socket 11 has a limiting protrusion (not shown in the figure). The limiting protrusion is formed on the surface of the LED lamp socket 11 facing the carrier base 12 and is matched with the avoidance through - hole 120. When arranging the LED lamp bead 21 on the carrier base 12, the limiting protrusion is inserted into the avoidance through - hole 120. By inserting the limiting protrusion into the avoidance through - hole 120, the connection reliability between the LED lamp bead 21 and the carrier base 12 can be effectively improved.

[0098] Step S07: Weld the pin part 1122 and the conductive part 121.

[0099] In step S07, the LED lamp beads 21 and the carrier base 12 are welded by a hot air mechanism to fix the LED lamp beads 21 on the carrier base 12. During welding, ensure that the orthographic projection of the bottom end surface 1102 of the LED lamp socket 11 on the carrier base 12 does not exceed the area enclosed by the outer edge of the carrier base 12. In some embodiments, the orthographic projection of the bottom end surface 1102 of the LED lamp socket 11 on the carrier base 12 falls within the area enclosed by the outer edge of the carrier base 12. In some embodiments, the orthographic projection of the bottom end surface 1102 of the LED lamp socket 11 on the carrier base 12 coincides with the area enclosed by the outer edge of the carrier base 12, so as to ensure that one piece of LED lamp beads 21 is welded on each carrier base 12.

[0100] After step S07, it also includes insulating and sealing the welding parts of the wire and the carrier base 12 and the welding parts of the carrier base 12 and the LED lamp beads 21. Through the insulating and sealing treatment, the welding parts of the LED lamp beads 21 and the carrier base 12 and the welding parts of the carrier base 12 and at least two wires are insulated and sealed to improve the reliability of the LED light strip 30. In some embodiments, sealant is attached to the parts where the carrier base 12 and the wire are welded and the parts where the carrier base 12 and the LED lamp beads 21 are welded, and then UV curing sealing is carried out. In some embodiments, epoxy curing sealing is adopted.

[0101] In some alternative embodiments, after step S07, it also includes loading the carrier base 12 and the LED lamp beads 21 welded to the carrier base 12 into the lamp housing 32, and then sealing the carrier base 12 and the LED lamp beads 21. Specifically, the first housing 321 is covered on the end of the LED lamp beads 21 facing away from the carrier base 12, and the second housing 322 is covered on the end of the carrier base 12 facing away from the LED lamp beads 21. And the first housing 321 and the second housing 322 are buckled with each other to form a receiving cavity 320 for receiving the LED lamp beads 21 and the carrier base 12. The wire assembly 31 welded to the carrier base 12 passes through the wire hole 3202 out of the lamp housing 32, and then glue is injected into the glue injection hole 3201 of the receiving cavity 320 for sealing, and through UV curing or epoxy curing, through curing, the first housing 321 and the second housing 322 are also fixed by the sealant. In some embodiments, one lamp housing 32 houses one carrier base 12 and the LED lamp beads 21 welded to the carrier base 12. In some embodiments, one lamp housing 32 houses and seals more than two carrier bases 12 and the LED lamp beads 21 welded to the carrier base 12.

[0102] Five types of LED light strips 30 are manufactured using the manufacturing method of the LED light strip 30 provided in this embodiment, and each LED light strip 30 is tested. When testing, each LED light strip 30 is powered on with the AC voltage shown in Table 1. After power-on, the number of unlit LED beads 21 in each LED light strip 30 is counted, and the results are shown in Table 1.

[0103] Table 1

[0104]

[0105] As can be seen from Table 1, for the five types of LED light strips obtained by using the manufacturing method of the LED light strip 30 in this embodiment, the qualified product rates all reach more than 99.7%. It can be shown that the manufacturing method provided by the present invention can obtain a high qualified product rate.

[0106] Embodiment 2

[0107] Please refer to Figure 11 、 Figure 12 and Figures 1 to 10 , the main differences between the LED base module 10, the LED lamp module LED module 20, the LED light strip 30 and the manufacturing method of the LED light strip 30 provided in this embodiment and those in Embodiment 1 are the following structural differences:

[0108] For Embodiment 1, an avoidance through hole 120 is formed in the carrier base 12, and the avoidance through hole 120 is provided between two conductive parts 121 of a set of first conductive pairs. In this embodiment, the number of avoidance through holes 120 is two, and the number of the first conductive pairs is one set. One avoidance through hole 120 is provided between the first signal input end 1211 and the first signal output end 1212; the other avoidance through hole 120 is used for fixing the LED lamp socket 11 to fix the LED bead 21. In some embodiments, the number of the first conductive pairs is two sets, and one avoidance through hole 120 is respectively provided between two conductive parts 121 of each set of first conductive pairs. In some embodiments, the number of the first conductive pairs is three sets, and the two avoidance through holes 120 are respectively arranged between two conductive parts 121 of a set of first conductive pairs. In some embodiments, the number of avoidance through holes 120 is three, and each avoidance through hole 120 is correspondingly arranged between two conductive parts 121 of a set of first conductive pairs. Of course, the number of the first conductive pairs and the number of avoidance through holes 120 can be other numbers.

[0109] Except for the above different structural setting schemes from Embodiment 1, the LED base module 10, the LED module 20, the LED light strip 30 and the corresponding components provided in this Embodiment 2, as well as the manufacturing method of the LED light strip 30, etc. can all be designed with reference to Embodiment 1. To save space, it will not be elaborated here.

[0110] Example 3

[0111] Please refer to Figure 13 and Figures 1 to 10 , the main differences in the structure between the LED base module 10, LED lamp module LED module 20, LED light strip 30 provided in this embodiment and the manufacturing method of the LED light strip 30 and those in Embodiment 1 are as follows:

[0112] For Embodiment 1, an avoidance through-hole 120 is formed in the bearing base 12, and the avoidance through-hole 120 is provided between two conductive parts 121 of a set of first conductive pairs, and the avoidance through-hole 120 is provided at the central position of the bearing base 12. In this embodiment, in some embodiments, the avoidance through-hole 120 is arranged close to the edge of the bearing base 12. At the same time, the avoidance through-hole 120 is formed with a notch having an opening facing the circumferential side wall of the bearing base 12, and the notch extends from the first end 12101 to the second end 12102, so that the punching device 40 can not only feed along the central axis direction of the avoidance through-hole 120 to achieve punching, but also feed along the second straight track RS to achieve punching.

[0113] Except for the above different structural setting schemes from Embodiment 1, the LED base module 10, LED module 20, LED light strip 30 provided in this Example 3, the corresponding components, and the manufacturing method of the LED light strip 30 and the like can all be designed with reference to Embodiment 1. To save space, it will not be elaborated here.

[0114] Example 4

[0115] Please refer to Figures 14 to 17 and Figures 1 to 10 , the main differences in the structure between the LED base module 10, LED lamp module LED module 20, LED light strip 30 provided in this embodiment and any one of Embodiments 1 to 3 and the manufacturing method of the LED light strip 30 are as follows:

[0116] For any one of Embodiments 1 to 3, the insulating base 111 is formed with a cavity 110 for accommodating the LED chip assembly 211 and the LED encapsulant 212; a plurality of conductive terminals 112 are fixed to the insulating base 111 by injection molding, and each conductive terminal 112 has a die bonding portion 1121 and a lead portion 1122. The die bonding portion 1121 passes through the cavity 110 for electrically connecting with the LED chip assembly 211, while the lead portion 1122 is exposed outside the insulating base 111 for connecting with the carrier base 12. The carrier base 12 has a plurality of conductive portions 121 and at least one avoidance through hole 120. In this embodiment, the insulating base 111 is not formed with a cavity 110, and the insulating base 111 and the plurality of conductive terminals 112 are fixed and formed by molding, that is, the insulating material is filled in the three-dimensional space formed by the plurality of conductive terminals 112 by molding to form the insulating base 111, and each conductive terminal 112 is fixed to the insulating base 111, and the die bonding portion 1121 and the lead portion 1122 of each conductive terminal 112 are both exposed outside the insulating base 111. For example, the die bonding portion 1121 is partially embedded in the top surface 1101 of the insulating base 111, while the lead portion 1122 is partially embedded in the bottom surface 1102 of the insulating base 111. The LED chip assembly 211 is mounted on the die bonding portion 1121, and finally the LED encapsulant 212 is pressed onto the top surface 1101 of the insulating base 111 by molding to cover the LED chip assembly 211. Such a structural design can enable the LED strip 30 to emit light from multiple sides, that is, emit light from the front of the LED lamp bead 21 and also emit light from the circumferential side surface of the LED lamp bead 21, so that the LED strip 30 has a large irradiation effect.

[0117] Except that the above structural setting scheme is different from those of Embodiments 1, 2, and 3, the LED base module 10, the LED module 20, the LED strip 30 and the corresponding components provided in this Embodiment 4, as well as the manufacturing method of the LED strip 30, etc. can all refer to the corresponding design of any one of Embodiments 1 to 3. For the sake of saving space, it will not be elaborated here.

[0118] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. LED base module, characterized in that, Comprising: An LED lamp socket, the LED lamp socket including an insulating base and a plurality of conductive terminals; The LED lamp socket has a limiting protrusion formed on the surface of the LED lamp socket facing the carrying base, and the limiting protrusion extends from the bottom end surface of the LED lamp socket towards the carrying base; Each of the conductive terminals is fixed to the insulating base, and each of the conductive terminals has a die bonding portion for electrically connecting with an LED chip assembly and a lead portion exposed outside the insulating base; A carrying base for carrying the LED lamp socket; The carrying base has a plurality of conductive portions and at least one avoidance through hole; each of the conductive portions has a first end and a second end, the first end and the second end are respectively exposed on opposite end surfaces of the carrying base, the first end is used for electrically connecting with the lead portion, and the second end is used for electrically connecting with a wire; at least one of the avoidance through holes is for a wire to cross for punching avoidance; the limiting protrusion is inserted into the avoidance through hole to improve the positioning reliability and connection reliability between the LED lamp socket and the carrying base.

2. The LED base module according to claim 1, characterized in that The insulating base has a bottom end surface and a top end surface, and the lead portion is exposed on the bottom end surface; the conductive portion is arranged in the carrying base extending from the bottom end surface to the top end surface, the first end faces the bottom end surface, and the second end faces away from the bottom end surface; the avoidance through hole is formed in the carrying base in the direction from the bottom end surface to the top end surface.

3. The LED base module according to any one of claims 1 to 2, characterized in that At least part of the conductive portions are spaced apart in pairs to form a first conductive pair, one of the conductive portions of the first conductive pair is an input end and the other is an output end; the avoidance through hole is formed between the two conductive portions of a group of the first conductive pairs.

4. The LED base module according to claim 3, wherein The number of the first conductive pairs is one group, the input end of the first conductive pair is a first signal input end and the output end is a first signal output end; the number of the avoidance through holes is one, and the avoidance through hole is arranged between the first signal input end and the first signal output end; Or, the number of the first conductive pairs is one group, the input end of the first conductive pair is a first signal input end and the output end is a first signal output end; the number of the avoidance through holes is two or more, and one of the avoidance through holes is arranged between the first signal input end and the first signal output end; Or, the number of the first conductive pairs is two or more groups, the input end of one group of the first conductive pairs is a first signal input end and the output end is a first signal output end; the number of the avoidance through holes is two or more, and each of the avoidance through holes is correspondingly formed between the two conductive portions of a group of the first conductive pairs.

5. The LED base module according to any one of claims 1 to 2, characterized in that, The orthographic projection of the bottom end surface of the LED lamp socket on the carrying base does not exceed the area enclosed by the outer edge of the carrying base.

6. The LED base module according to claim 5, wherein The orthographic projection of the bottom end surface of the LED lamp socket on the carrying base falls within the area enclosed by the outer edge of the carrying base; Or, the orthographic projection of the bottom end surface of the LED lamp socket on the carrying base coincides with the area enclosed by the outer edge of the carrying base.

7. The LED base module according to any one of claims 1 to 2, characterized in that, The conductive terminal is fixed to the insulating base by injection molding. The insulating base has a bottom end face and a top end face. The insulating base has a concave cavity that is recessed from the top end face towards the bottom end face for accommodating the LED chip assembly and the LED encapsulation glue. All the die bonding parts penetrate through the insulating base and into the concave cavity. Alternatively, the conductive terminal is fixed to the insulating base by compression molding. The insulating base has a bottom end face and a top end face. The die bonding parts are exposed on the top end face, and the pin parts are exposed on the bottom end face. The top end face is used for compression molding and encapsulating the LED encapsulation glue.

8. The LED module is characterized in that, Comprising: The carrier base of the LED base module according to any one of claims 1 to 7. One of the conductive parts in the carrier base is a first signal input terminal, and the other conductive part is a first signal output terminal. One avoidance through hole is provided between the first signal input terminal and the first signal output terminal. An LED lamp bead, which includes an LED chip assembly, an LED encapsulation glue, and an LED lamp socket of the LED base module according to any one of claims 1 to 7. The LED chip assembly is electrically connected to the die bonding part. The LED encapsulation glue is used for encapsulating the LED chip assembly and the die bonding part. One of the pin parts is a second signal input terminal, and the other pin part is a second signal output terminal. The second signal input terminal is used for mating connection with the first signal input terminal, and the second signal output terminal is used for mating connection with the first signal output terminal.

9. The LED module according to claim 8, wherein, The LED chip assembly includes a driving chip and at least one light-emitting chip, and the driving chip is electrically connected to the light-emitting chip.

10. LED strip light, characterized in that, Comprising: At least two LED modules according to any one of claims 8 to 9. Each LED lamp bead is correspondingly welded to one of the carrier bases. A wire assembly, which at least includes a power line, a signal input line, and at least one signal transmission line. Wherein, one end of the signal input line is connected to an external signal source, and the other end is connected to the first signal input terminal of one of the carrier bases to input a signal to the LED light strip. One end of the signal transmission line is connected to the first signal output terminal of one of the carrier bases, and the other end is connected to the first signal input terminal of an adjacent carrier base to enable cascaded transmission of the signal between two adjacent LED lamp beads. The power line is used for electrically connecting the LED lamp bead to an external power source.

11. The LED light strip according to claim 10, characterized in that, The power line is connected to another conductive part in the carrier base to supply power to the LED light strip. And / or, the LED light strip further includes an insulating sealant, and the insulating sealant at least wraps the parts where the LED module and the wire assembly are connected to each other.

12. The LED light strip according to any one of claims 10 to 11, characterized in that The LED light strip further includes a lamp housing adapted to the LED module. The lamp housing has an accommodation cavity, and each LED module is received in the accommodation cavity. The wire assembly passes out of the lamp housing from the accommodation cavity.

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