LED lamp bead structure

Abstract

An original substrate structure is rearranged, a bonding pad comprises a bonding wire part and a die bonding part matched with the bonding wire part, the die bonding part comprises a common electrode part arranged in the center of a substrate and four die bonding sub-parts arranged in the circumferential direction of the common electrode part, and the die bonding sub-parts are used for bearing RGB chips. Wherein the arrangement mode of the RGB chips is changed into circumferential arrangement from linear arrangement, lamp bead abnormity caused by poor die bonding in the manufacturing process is reduced, meanwhile, each die bonding sub-part is electrically connected with the corresponding wire bonding part through a bonding wire, and the wire bonding parts and the common electrode parts are electrically connected with the corresponding pins, so that five pins exist on the back of the substrate, and the reliability of the substrate is improved. And finally, a bowl cup is fixedly arranged on the substrate and used for delineating any die bonding sub-part and the corresponding wire bonding part, the delineating die bonding sub-part is used for die bonding of the blue light chip, and the bowl cup is filled with white light packaging glue and used for displaying white light and improving the overall brightness of the lamp bead.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, in particular to an LED lamp bead structure. Background Art

[0002] As market competition intensifies, the market demands not only high display quality but also product reliability, long-term stability, supply maturity, and cost competitiveness. In terms of product performance, displays primarily require MIP LED lamp beads with high brightness, good airtightness, strong anti-collision capabilities, or product differentiation.

[0003] Existing MIP LED devices are small-pitch LED devices that utilize a flat BT substrate as a support. The substrate is divided into front-side circuitry, back-side circuitry, and substrate. The front-side circuitry is used to bind the light-emitting chip and achieve electrical interconnection, while the back-side circuitry is used for soldering to the LED display module PCB. Through-holes connect the front and back-side circuits. The front-side circuitry of the substrate is divided into a die-bonding area, a wire-bonding area, and an insulation isolation area. Silver glue is used to secure the red light chip to the red die-bonding area, while insulating glue or silver glue is used to secure the blue and green light chips to their respective die-bonding areas. Finally, through molding and cutting processes, individual LEDs that emit RGB primary colors are obtained.

[0004] It should be noted that the layout of the lamp bead chips is an RGB vertical column layout. This layout can easily cause the silver glue or insulating glue to fall off, which may cause a short circuit, or the glue may fall onto the welding wire position, resulting in poor welding. In addition, since there are only three RGB chips, when there is a need for brightness, the brightness is obviously insufficient. Moreover, the pins are a common pole and three RGB single poles, a total of 4 pins, and the anti-collision ability is weak. Utility Model Content

[0005] Based on this, the purpose of this utility model is to provide an LED lamp bead structure, which aims to reduce the packaging process and abnormalities in the process by optimizing the substrate structure, and also add a set of white light chips to increase the brightness of the lamp bead. At the same time, a five-pin structure is designed on the back of the lamp bead to improve the lamp bead's anti-collision ability.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: an LED lamp bead structure, comprising a substrate, a soldering pad fixed to one side of the substrate, and a pin fixed to the other side of the substrate, wherein a portion of the soldering pad is conductively connected to the pin, the soldering pad comprises a soldering wire portion and a die-bonding portion matching the soldering wire portion, the die-bonding portion comprises a common-pole portion provided at the center of the substrate, and four die-bonding sub-portions provided circumferentially along the common-pole portion, the die-bonding sub-portions being used to carry an RGB chip, each die-bonding sub-portion being conductively connected to a corresponding soldering wire portion via a bonding wire, and both the soldering wire portion and the common-pole portion being conductively connected to a corresponding pin;

[0007] The substrate is fixed with a bowl cup for enclosing any one of the die-fixing sub-parts and the corresponding wire bonding part. The enclosed die-fixing sub-part is used to fix the blue light chip, and the bowl cup is filled with white light packaging glue.

[0008] By adopting the above technical solution, the original substrate structure is first rearranged, and the soldering pad includes a soldering wire part and a solid crystal part matching the soldering wire part. The solid crystal part includes a common pole part arranged in the center of the substrate, and four solid crystal sub-parts arranged circumferentially along the common pole part. The solid crystal sub-part is used to carry the RGB chip, wherein the arrangement of the RGB chip is changed from a straight line arrangement to a circumferential arrangement, thereby reducing the abnormality of the lamp beads caused by poor solid crystal during the manufacturing process. At the same time, each solid crystal sub-part is conductively connected to the corresponding soldering wire part through a bonding wire, and the soldering wire part and the common pole part are conductively connected to the corresponding pins, so that there are five pins on the back of the substrate, thereby improving the overall anti-collision ability of the lamp bead. Finally, the substrate is fixed with a bowl cup for encircling any solid crystal sub-part and the corresponding soldering wire part. The encircled solid crystal sub-part is used to solidify the blue light chip, and the bowl cup is filled with white light packaging glue for displaying white light and improving the overall brightness of the lamp bead.

[0009] Furthermore, each of the die-bonding sub-parts and the corresponding wire bonding part is respectively disposed at four corners of the substrate.

[0010] Furthermore, the crystal-fixing sub-portion diagonally opposite to the crystal-fixing sub-portion defined by the bowl is used to fix the green light chip.

[0011] Furthermore, the periphery of the bowl is flush with the side surface of the base plate.

[0012] Furthermore, the height of the bowl is greater than or equal to 250 μm.

[0013] Furthermore, the upper surface of the white light encapsulant is flush with the upper surface of the bowl.

[0014] Furthermore, ink is applied on the common electrode portion and the bonding wire portion near the four corners of the substrate.

[0015] Furthermore, a marking point is provided on one side of the substrate having the pins, and the marking point is provided between the pin corresponding to the common-pole portion and an area formed by any other two pins.

[0016] Furthermore, the substrate is made of BT resin substrate material.

[0017] Furthermore, a side of the substrate away from the pins is covered with RGB packaging glue, and the height of the RGB packaging glue is greater than the height of the bowl. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a top view schematic diagram of the LED lamp bead structure of the utility model;

[0019] Figure 2 This is a bottom view schematic diagram of the LED lamp bead structure of the utility model;

[0020] Figure 3 It is a side view schematic diagram of the LED lamp bead structure of the present utility model.

[0021] In the figure: 1. Substrate; 21. Crystal bonding unit; 22. Wire bonding unit; 3. RGB chip; 4. Bonding wire; 5. Bowl; 6. Ink; 7. Pin; 8. Marking point; 9. White light encapsulation glue; 10. RGB encapsulation glue. DETAILED DESCRIPTION

[0022] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The drawings illustrate several embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0023] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are for the purpose of describing specific embodiments only and are not intended to limit this invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] The following describes an embodiment of the present invention based on its overall structure.

[0026] An LED lamp bead structure, such as Figures 1 to 3 As shown, Figure 1 This is a top view schematic diagram of the LED lamp bead structure of the utility model; Figure 2 This is a bottom view schematic diagram of the LED lamp bead structure of the utility model; Figure 3 This is a side view schematic diagram of the LED lamp bead structure of the present invention. The LED lamp bead structure includes a substrate 1, a soldering pad fixed on one side of the substrate 1, and a pin 7 fixed on the other side of the substrate 1. The material of the substrate 1 is BT resin substrate material. It can be understood that a soldering pad is provided on the front side of the substrate 1, and a pin 7 is provided on the back side of the substrate 1. Some of the soldering pads are conductively connected to the pin 7. The soldering pad includes a soldering wire portion 22 and a solid crystal portion matching the soldering wire portion 22. The solid crystal portion includes a common pole portion (not shown) provided in the center of the substrate 1, and four solid crystal sub-portions 21 provided along the circumference of the common pole portion. The solid crystal sub-portions 21 are used to carry the RGB chip 3. The shapes of the solid crystal sub-portions 21 can be the same or different.

[0027] For example, the top view of the substrate 1 is a square, and the welding wire parts 22 are provided at the four corners of the square. The welding wire parts 22 on the four corners correspond to the four pins 7 on the back of the substrate 1. Similarly, the four solid crystal sub-parts 21 are also arranged in four corners, and the common pole part in the middle of the square corresponds to a pin 7 on the back of the substrate 1, thereby obtaining a design of five pins 7 on the back of the substrate 1. Specifically, the middle pin 7 is the common pole, and the pins 7 at the four corners are the four polarities of RGBW respectively. The design of increasing the pins can effectively improve the overall anti-collision ability of the lamp bead. In some other embodiments of the present invention, the top view of the substrate 1 can also be a circle, and the interval angle between adjacent solid crystal sub-parts 21 is 45°, and finally the four solid crystal sub-parts 21 are also arranged in four corners.

[0028] Furthermore, each die-bonding sub-portion 21 is conductively connected to the corresponding wire bonding portion 22 via a bonding wire 4. The wire bonding portion 22 and the common-pole portion are conductively connected to the corresponding pin 7. In the embodiment of the present invention, the end of the wire bonding portion 22 away from the common-pole portion can extend toward the back surface of the substrate 1 to obtain the corresponding pin 7. Similarly, the common-pole portion also extends toward the back surface of the substrate 1 to obtain the corresponding pin 7.

[0029] Among them, the substrate 1 is fixed with a bowl cup 5, which can be formed by exposure and development, and is used to circle any solid crystal sub-portion 21 and the corresponding welding wire portion 22. The circled solid crystal sub-portion 21 is used to fix the blue light chip, and the bowl cup 5 is filled with white light packaging glue 9.

[0030] In addition, each die-bonding portion 21 and the corresponding wire bonding portion 22 are respectively provided at four corners of the substrate 1 .

[0031] In the embodiment of the present invention, the crystal fixing sub-portion 21 diagonally opposite to the crystal fixing sub-portion 21 circled by the bowl cup 5 is used to fix the green light chip, and the remaining two crystal fixing sub-portions 21 are used to fix the red light chip and the blue light chip respectively. It should be noted that the red light chip is fixed on the corresponding crystal fixing sub-portion 21 by silver glue, and the blue light chip and the green light chip are fixed on the corresponding crystal fixing sub-portion 21 by insulating glue or silver glue, and the bonding wire 4 is electrically interconnected with the welding wire portion 22 through a wire welding process. Finally, the bowl cup 5 is glued with phosphor and silicone, and after curing, it is molded as a whole through a molding process, and cut to obtain individual MIPLED device lamp beads. Among them, the molding process mainly presses liquid or solid materials through a specific mold to produce products with precise size and appearance.

[0032] It should be noted that the periphery of the bowl cup 5 is flush with the side surface of the substrate 1 , and the height of the bowl cup 5 is greater than or equal to 250 μm. Furthermore, the upper surface of the white light encapsulant 9 is flush with the upper surface of the bowl cup 5 .

[0033] To protect the conductive area, ink 6 is applied to the common electrode portion and the bonding wire portion 22 near the four corners of the substrate 1. It should be noted that marking dots 8 are provided on the side of the substrate 1 with the pins 7. Marking dots 8 are provided between the pins 7 corresponding to the common electrode portion and the area formed by any other two pins 7. For example, the pattern of marking dots 8 can be rectangular, circular, or triangular, but is not limited thereto.

[0034] Furthermore, a side of the substrate 1 away from the pins 7 is covered by an RGB encapsulation adhesive 10 , and a height of the RGB encapsulation adhesive 10 is greater than a height of the bowl 5 .

[0035] In summary, the utility model proposes an LED lamp bead structure, which first rearranges the original substrate structure, and the soldering pad includes a soldering wire part and a solid crystal part matching the soldering wire part. The solid crystal part includes a common pole part arranged in the center of the substrate, and four solid crystal sub-parts arranged circumferentially along the common pole part. The solid crystal sub-part is used to carry the RGB chip, wherein the arrangement of the RGB chips is changed from a straight line arrangement to a circumferential arrangement, thereby reducing the abnormality of the lamp bead due to poor solid crystal during the manufacturing process. At the same time, each solid crystal sub-part is conductively connected to the corresponding soldering wire part through a bonding wire, and the soldering wire part and the common pole part are conductively connected to the corresponding pins, so that there are five pins on the back of the substrate, thereby improving the overall anti-collision ability of the lamp bead. Finally, the substrate is fixed with a bowl cup for encircling any solid crystal sub-part and the corresponding soldering wire part. The encircled solid crystal sub-part is used to solidify the blue light chip, and the bowl cup is filled with white light packaging glue for displaying white light and improving the overall brightness of the lamp bead.

[0036] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0037] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An LED lamp bead structure, comprising a substrate, a solder pad fixed on one side of the substrate, and a pin fixed on the other side of the substrate, wherein part of the solder pad is conductively connected to the pin, characterized in that: The pad includes a wire bonding portion and a die-bonding portion matching the wire bonding portion. The die-bonding portion includes a common-pole portion provided at the center of the substrate and four die-bonding sub-portions provided circumferentially along the common-pole portion. The die-bonding sub-portions are used to carry the RGB chip. Each die-bonding sub-portion is conductively connected to the corresponding wire bonding portion via a bonding wire. The wire bonding portion and the common-pole portion are both conductively connected to the corresponding pin. The substrate is fixed with a bowl cup for enclosing any one of the die-fixing sub-parts and the corresponding wire bonding part. The enclosed die-fixing sub-part is used to fix the blue light chip, and the bowl cup is filled with white light packaging glue.

2. The LED lamp bead structure according to claim 1, characterized in that: Each of the die-bonding sub-parts and the corresponding wire bonding part is respectively arranged at four corners of the substrate.

3. The LED lamp bead structure according to claim 2, characterized in that: The crystal-fixing sub-portion diagonally opposite to the crystal-fixing sub-portion encircled by the bowl is used for fixing the green light chip.

4. The LED lamp bead structure according to claim 3, characterized in that: The periphery of the bowl is flush with the side surface of the base plate.

5. The LED lamp bead structure according to claim 4, characterized in that: The height of the bowl is greater than or equal to 250 μm.

6. The LED lamp bead structure according to claim 5, characterized in that: The upper surface of the white light encapsulant is flush with the upper surface of the bowl.

7. The LED lamp bead structure according to claim 1, characterized in that: Ink is applied on the common electrode portion and the bonding wire portion near four corners of the substrate.

8. The LED lamp bead structure according to claim 1, characterized in that: A marking point is provided on one side of the substrate having the pins, and the marking point is provided between the pin corresponding to the common-pole portion and an area formed by any other two pins.

9. The LED lamp bead structure according to claim 1, characterized in that: The substrate is made of BT resin.

10. The LED lamp bead structure according to claim 1, characterized in that: A side of the substrate away from the pins is covered by RGB packaging glue, and a height of the RGB packaging glue is greater than a height of the bowl.

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