Optical element driving mechanism

Abstract

The present disclosure provides an optical element driving mechanism. The optical element driving mechanism includes a fixed part, a movable part, a driving assembly, and a circuit assembly. The fixed part includes a receiving space. The movable part is connected to an optical element including an optical axis. The movable part is movable relative to the fixed part. The movable part is located in the receiving space of the fixed part. The driving assembly drives the movable part to move relative to the fixed part. The circuit assembly is electrically connected to the driving assembly.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a driving mechanism, and in particular, to an optical element driving mechanism. BACKGROUND

[0002] With the development of technology, many electronic devices (e.g. smart phones or tablets) nowadays have the function of taking pictures or videos. Through the optical element and the optical element driving mechanism provided on the electronic device, the user can operate the electronic device to take pictures. When the user uses the electronic device, it may produce shaking or vibration, so that the image taken is blurred. Therefore, it is necessary to improve the quality of the image taken. SUMMARY

[0003] The purpose of the present disclosure is to provide an optical element driving mechanism to solve at least one of the above problems.

[0004] The present disclosure provides an optical element driving mechanism. The optical element driving mechanism includes a fixed part, a movable part, a driving assembly, and a circuit assembly. The fixed part includes a receiving space. The movable part is connected to an optical element including an optical axis. The movable part is movable relative to the fixed part. The movable part is located in the receiving space of the fixed part. The driving assembly drives the movable part to move relative to the fixed part. The circuit assembly is electrically connected to the driving assembly.

[0005] In some embodiments, the circuit assembly includes a first circuit element, a second circuit element, and a first connecting part. The first circuit element has a plate structure, and the first circuit element is perpendicular to a main axis. The second circuit element has a plate structure, and the second circuit element is perpendicular to the main axis. The first connecting part connects the first circuit element and the second circuit element. The first circuit element is electrically connected to the second circuit element through the first connecting part. When viewed along the main axis, the first circuit element and the second circuit element at least partially overlap. In some embodiments, the optical element driving mechanism further includes an adhesive element. The first circuit element is fixedly connected to the second circuit element through the adhesive element, and the adhesive element directly contacts the first circuit element, the second circuit element, and the first connecting part. The first circuit element, the second circuit element, and the first connecting part are integrally formed. The first circuit element is not connected to the first connecting part by any additional means. The second circuit element is not connected to the first connecting part by any additional means. The circuit assembly further includes a base having a plate structure, and the base continuously extends between the first circuit element, the second circuit element, and the first connecting part.

[0006] In some embodiments, the optical element driving mechanism has a polygonal structure including a first side, a second side, a third side, and a fourth side. The first side is opposite to the third side, and the second side is opposite to the fourth side. The first circuit element includes a first side edge, and the second circuit element includes a second side edge. The first side edge of the first circuit element and the second side edge of the second circuit element are located on the first side when viewed along the main axis. The first connecting portion is protruded from the first side edge of the first circuit element and the second side edge of the second circuit element. The first circuit element further includes a first protruding portion protruded from the first side edge of the first circuit element, and a first gap is formed between the first protruding portion and the first connecting portion. The second circuit element further includes a second protruding portion protruded from the second side edge of the second circuit element, and a second gap is formed between the second protruding portion and the first connecting portion. The first protruding portion and the second protruding portion at least partially overlap when viewed along the main axis. The first gap and the second gap at least partially overlap when viewed along the main axis. The thickness of the first circuit element and the thickness of the second circuit element are greater than the thickness of the first connecting portion.

[0007] In some embodiments, the optical element driving mechanism further includes a sensing assembly for sensing the movement of the movable portion relative to the fixed portion. The sensing assembly includes a reference element and a sensing element. The sensing element corresponds to the reference element. The first circuit element includes a first surface, a second surface, a first circuit line, and a substrate. The first surface is opposite to the second surface, and the second surface faces the second circuit element. The first circuit line is at least partially embedded and not exposed on the substrate. The sensing element is disposed on the first surface of the first circuit element, and the sensing element is electrically connected to the first circuit line of the first circuit element.

[0008] In some embodiments, the circuit assembly further includes an external circuit for electrically connecting the first circuit element. The external circuit has a plate-like structure which is not parallel to the first circuit element. The thickness of the external circuit is less than the thickness of the second circuit element. The thickness of the external circuit is the same as the thickness of the first circuit element. The thickness of the first circuit element is different from the thickness of the second circuit element. The substrate extends to the external circuit. The fixed portion includes a base. The base includes a base opening for allowing a light to pass through and a base recess formed on the surface of the base. The base recess has a recessed structure and corresponds to the sensing element. The base recess is in communication with the base opening. In some embodiments, the thickness of the first circuit element is less than the thickness of the second circuit element.

[0009] In some embodiments, the first circuit element further comprises a second trace, the drive assembly comprises a first coil and a second coil, the first coil is disposed on the second circuit element, the second coil is disposed on the first circuit element, the first coil is electrically connected to the second coil and the second trace, wherein the first coil does not overlap the second trace when viewed along the main axis, and wherein the first coil at least partially overlaps the second coil when viewed along the main axis.

[0010] In some embodiments, the first side of the mechanism extends along a first axis that is perpendicular to the main axis, and the second side of the mechanism extends along a second axis that is perpendicular to the main axis. The optical element drive mechanism comprises a first corner, a second corner, a third corner, and a fourth corner, a line connecting the first corner and the second corner is parallel to the first axis, and a line connecting the first corner and the third corner is parallel to the second axis. The first side of the mechanism and the third side of the mechanism are located on opposite sides of the movable portion when viewed along the main axis. The circuit assembly further comprises a third circuit element and a second connecting portion. The third circuit element has a plate-like structure, and the third circuit element is perpendicular to the main axis. The second connecting portion connects the first circuit element and the third circuit element. The third circuit element is electrically connected to the first circuit element through the second connecting portion. The first circuit element and the third circuit element at least partially overlap when viewed along the main axis. The first circuit element further comprises a third side edge, the third circuit element comprises a fourth side edge, the third side edge of the first circuit element and the fourth side edge of the third circuit element are located on the third side of the mechanism when viewed along the main axis. The second connecting portion protrudes from the third side edge of the first circuit element and the fourth side edge of the third circuit element. A thickness of the third circuit element is the same as a thickness of the second circuit element, and a thickness of the first circuit element is the same as the thickness of the second circuit element. The second circuit element and the third circuit element do not overlap when viewed along the main axis. The second circuit element and the third circuit element at least partially overlap when viewed along the second axis. The first circuit element further comprises a third trace, the drive assembly further comprises a third coil and a fourth coil, the third coil is disposed on the third circuit element, the fourth coil is disposed on the first circuit element, the third coil is electrically connected to the fourth coil and the third trace. The third coil does not overlap the third trace when viewed along the main axis. The third coil at least partially overlaps the fourth coil when viewed along the main axis. The first coil and the third coil are electrically independent. The first coil and the third coil do not overlap when viewed along the main axis. The first coil is located in the first corner and the second corner, and the third coil is located in the third corner and the fourth corner when viewed along the main axis.

[0011] In some embodiments, the base includes a first positioning element and a second positioning element corresponding to the circuit assembly. The first positioning element is located at the second side of the mechanism and the second positioning element is located at the fourth side of the mechanism when viewed along the main axis. The first positioning element and the second positioning element are arranged along the first axis when viewed along the main axis. A first spacing is formed between the second circuit element and the third circuit element when viewed along the main axis, and the first spacing is located at the second side of the mechanism. A second spacing is formed between the second circuit element and the third circuit element when viewed along the main axis, and the second spacing is located at the fourth side of the mechanism. A line connecting the center of the first spacing and the center of the second spacing is neither parallel nor perpendicular to the first axis when viewed along the main axis. The first spacing and the second spacing do not overlap when viewed along the first axis. The first spacing and the second spacing do not overlap when viewed along the second axis. The circuit assembly further includes an external circuit, which is integrally formed with the base and at least partially embedded in the base without being exposed to the outside. The circuit assembly is electrically connected to an external circuit through the external circuit. The first surface of the first circuit element faces the external circuit. The circuit assembly further includes an electrical contact located between the first surface and the external circuit. The base further includes a base recess formed on the surface of the base, which has a recessed structure and corresponds to the electrical contact. The external circuit includes an external circuit opening for allowing a light to pass through, which is in communication with the base recess and independent of the base recess. The external circuit further includes a protrusion protruding from the base recess.

[0012] The present application has the advantage that the circuit assembly including the coil and the circuit is formed by folding. Since the circuit assembly can be formed by folding, a separate circuit board is not required. Since the separate circuit board is not required, a conductive material is not required to be additionally provided on the circuit board to electrically connect the circuit board to other elements. Therefore, the number of elements can be reduced, the process can be simplified, and the cost can be saved. BRIEF DESCRIPTION OF DRAWINGS

[0013] To make the features or advantages of the present disclosure more apparent, some embodiments are described below in detail with reference to the accompanying drawings, in which some features can not be drawn to scale. In fact, the size of various features can be arbitrarily enlarged or reduced, and can be schematically drawn.

[0014] Figure 1 is a schematic view of an electronic device, an optical element, and an optical element driving mechanism.

[0015] Figure 2 is a schematic view of an optical element and an optical element driving mechanism.

[0016] Figure 3is an exploded view of the optical element drive mechanism.

[0017] Figure 4 and Figure 5 is a perspective view of the optical element drive mechanism, wherein the omitted elements are not identical.

[0018] Figure 6 is Figure 5 a top view of the optical element drive mechanism of

[0019] Figure 7 is a perspective view of the frame.

[0020] Figure 8 is a perspective view of the carrier seat.

[0021] Figure 9 and Figure 10 are perspective views of the base and the second circuit assembly from different viewing angles.

[0022] Figure 11 is an exploded view of the base and the second circuit assembly.

[0023] Figure 12 is a partial enlarged view of the base and the second circuit assembly.

[0024] Figure 13 and Figure 14 are perspective views of the first circuit assembly from different viewing angles.

[0025] Figure 15 is a top view of the first circuit assembly.

[0026] Figure 16 is a side view of the first circuit assembly.

[0027] Figure 17 and Figure 18 are partial enlarged views of the first circuit assembly from different viewing angles.

[0028] Figure 19 is a schematic view of the first circuit assembly before folding.

[0029] Figure 20 is a schematic view of the first circuit assembly before folding for some other embodiments.

[0030] Figure 21 is a schematic view of the first circuit assembly for some other embodiments.

[0031] Figure 22 is a schematic view of the first circuit assembly before folding of Figure 21

[0032] The reference signs are as follows:

[0033] 1: electronic device​

[0034] 10: optical element

[0035] 100: optical element driving mechanism

[0036] 110: housing

[0037] 111: top wall

[0038] 112: side wall

[0039] 120: base

[0040] 121: base opening

[0041] 122: base recess

[0042] 123: first positioning element

[0043] 124: second positioning element

[0044] 125: base notch

[0045] 130: frame

[0046] 131: frame stop

[0047] 132: frame connection

[0048] 133: frame recess

[0049] 134: frame accommodation

[0050] 140: carrier seat

[0051] 141: carrier seat stop

[0052] 142: carrier seat connection

[0053] 143: carrier seat electrical connection

[0054] 144: carrier seat recess

[0055] 150: first elastic element

[0056] 160: second elastic element

[0057] 170: third elastic element

[0058] 180: autofocus coil

[0059] 181: lead wire

[0060] 190, 190', 190": optical image stabilization coil

[0061] 191: first coil

[0062] 192: second coil

[0063] 193: third coil

[0064] 194: fourth coil

[0065] 200: magnetic element

[0066] 210: reference element

[0067] 220, 220', 220": sensing element

[0068] 230, 230', 230": first circuit element

[0069] 230BS: first surface

[0070] 230T, 230"T: thickness of the first circuit element

[0071] 230TS: second surface

[0072] 230S1: first side edge

[0073] 230S3: third side edge

[0074] 231: first protrusion

[0075] 232: first gap

[0076] 233: first line

[0077] 234: second line

[0078] 235: third line

[0079] 236: substrate

[0080] 238, 248, 258: positioning portion

[0081] 240, 240', 240": second circuit element

[0082] 240S2: second side edge

[0083] 240T, 240"T: thickness of the second circuit element

[0084] 241: second protrusion

[0085] 242: second gap

[0086] 250: third circuit element

[0087] 250S4: fourth side edge

[0088] 250T: thickness of the third circuit element

[0089] 260, 260”: external circuit

[0090] 260T, 260”T: thickness of external circuit

[0091] 265: electrical contact

[0092] 270, 270’, 270”: first connecting part

[0093] 270T: thickness of first connecting part

[0094] 280: second connecting part

[0095] 280T: thickness of second connecting part

[0096] 310: first adhesive element

[0097] 320: second adhesive element

[0098] 1001: first side of mechanism

[0099] 1002: second side of mechanism

[0100] 1003: third side of mechanism

[0101] 1004: fourth side of mechanism

[0102] 2001: first corner

[0103] 2002: second corner

[0104] 2003: third corner

[0105] 2004: fourth corner

[0106] 2451: first distance

[0107] 2452: second distance

[0108] A1: first axis

[0109] A2: second axis

[0110] C1: first circuit component

[0111] C2: second circuit component

[0112] D: drive component

[0113] E: elastic component

[0114] I: fixed part

[0115] M: moving part

[0116] MA: main axis

[0117] O: optical axis

[0118] S: Sensing component Detailed Implementation

[0119] This specification provides numerous different embodiments or examples, and may use relative spatial terms to describe specific examples of the components and their arrangements to implement different features of this disclosure. For example, if this specification describes a first feature formed "on" and / or "above" a second feature, it indicates that it may include embodiments in which the first and second features are in direct contact, or embodiments in which an additional feature is formed between the first and second features, so that the first and second features are not in direct contact. Relative spatial terms are used to facilitate the description of the relationship between elements or features in the drawings and other elements or features. In addition to the orientations shown in the drawings, these spatial terms are intended to encompass different orientations of the device in use or operation. The device may be turned to different orientations (rotated 90 degrees or other orientations), and the relative spatial terms used herein may be interpreted accordingly. Furthermore, the same or similar symbols or letters may be used in different examples of this disclosure.

[0120] In this specification, the terms “comprising” and / or “having” are open-ended terms and should therefore be interpreted as “containing but not limited to…”. Thus, when the terms “comprising” and / or “having” are used in the description of this disclosure, they specify the presence of the corresponding features, areas, steps, operations, and / or elements, but do not exclude the presence of one or more of the corresponding features, areas, steps, operations, and / or elements.

[0121] Please refer to this first. Figure 1 as well as Figure 2 . Figure 1 It is a schematic diagram of an electronic device 1, an optical element 10, and an optical element driving mechanism 100. Figure 2 This is a schematic diagram of optical element 10 and optical element driving mechanism 100. Electronic device 1 can be a tablet computer, smartphone, etc. Optical element 10 can be a lens, for example, a telescope. Optical element 10 can be made of plastic or glass. Optical element 10 can be circular or other shapes. Optical element 10 and optical element driving mechanism 100 can be mounted on electronic device 1 for a user to capture images. Optical element driving mechanism 100 can carry optical element 10 and drive optical element 10 to adjust the position of optical element 10 to capture clear images. Optical element 10 and optical element driving mechanism 100 can be disposed in the top area of ​​electronic device 1 to increase the display area of ​​electronic device 1.

[0122] Optical element 10 has an optical axis O. Optical axis O is a virtual axis passing through the center of optical element 10. Optical element drive mechanism 100 has a main axis MA (refer to [previous reference]).Figure 3 ). The main axis MA is a virtual axis passing through the center of the optical element driving mechanism 100. When the optical element 10 is aligned with the optical element driving mechanism 100, the optical axis O of the optical element 10 substantially coincides with the main axis MA of the optical element driving mechanism 100. Therefore, the relevant features of the optical element driving mechanism 100 can be assisted by the optical axis O of the optical element 10 or the main axis MA of the optical element driving mechanism 100 in the drawings and the specification. It should be understood that since the optical element 10 is movably installed in the optical element driving mechanism 100, the optical axis O of the optical element 10 and the main axis MA of the optical element driving mechanism 100 can not be completely coincident due to the movement, shaking, rotation, tilting, etc. of the optical element driving mechanism 100. The optical element driving mechanism 100 can be connected to an external module, for example, a photosensitive element module (for example, a module including a charge-coupled detector (CCD)), so that the light entering the optical element driving mechanism 100 is imaged on the external module.

[0123] Next, please refer to Figures 3 to 6 to understand the optical element driving mechanism 100. Figure 3 is an exploded view of the optical element driving mechanism 100. Figure 4 and Figure 5 is a perspective view of the optical element driving mechanism 100, in which the omitted elements are not exactly the same. Figure 6 is Figure 5 a top view of the optical element driving mechanism 100 of . When viewed along the main axis MA, the optical element driving mechanism 100 has a polygonal structure, for example, a quadrilateral. For the convenience of description, the four sides of the optical element driving mechanism 100 are defined as a mechanism first side 1001, a mechanism second side 1002, a mechanism third side 1003, and a mechanism fourth side 1004. The mechanism first side 1001, the mechanism second side 1002, the mechanism third side 1003, and the mechanism fourth side 1004 are substantially perpendicular to the main axis MA. The mechanism first side 1001 is opposite to the mechanism third side 1003, and the mechanism second side 1002 is opposite to the mechanism fourth side 1004.

[0124] The first side 1001 is substantially parallel to the third side 1003, and the second side 1002 is substantially parallel to the fourth side 1004. The first side 1001 and the third side 1003 are parallel to and extend along a first axis A1 when viewed along the main axis MA. The first axis A1 is substantially perpendicular to the main axis MA. The second side 1002 and the fourth side 1004 are parallel to and extend along a second axis A2 when viewed along the main axis MA. The second axis A2 is substantially perpendicular to the main axis MA. In addition, the four corners of the optical element driving mechanism 100 are defined as a first corner 2001, a second corner 2002, a third corner 2003, and a fourth corner 2004. The line connecting the first corner 2001 and the second corner 2002 is substantially parallel to the first axis A1. The line connecting the first corner 2001 and the third corner 2003 is substantially parallel to the second axis A2.

[0125] The optical element driving mechanism 100 includes a fixed part I, a movable part M, an elastic assembly E, a driving assembly D, a sensing assembly S, a first circuit assembly C1, and a second circuit assembly C2. The movable part M is connected to the optical element 10 and is movable relative to the fixed part I. The elastic assembly E is connected to the movable part M. The driving assembly D drives the movable part M to move relative to the fixed part I. The sensing assembly S senses the movement of the movable part M relative to the fixed part I. The first circuit assembly C1 and the second circuit assembly C2 form a circuit assembly. The first circuit assembly C1 and the second circuit assembly C2 are electrically connected to the driving assembly D and can pass and transmit current.

[0126] In the present embodiment, the fixed part I includes a housing 110 and a base 120. The movable part includes a frame 130 and a carrier 140. The elastic assembly E includes a first elastic element 150, a second elastic element 160, and a plurality of third elastic elements 170. The driving assembly D includes an auto-focusing coil 180, a plurality of optical anti-shake coils 190, and a plurality of magnetic elements 200. The sensing assembly S includes a plurality of reference elements 210 and a plurality of sensing elements 220. The first circuit assembly C1 includes a first circuit element 230, a second circuit element 240, and a third circuit element 250. The description in the present specification is only for example, and elements can be added or deleted according to actual needs. In addition, some elements can be omitted in the drawings for clarity.

[0127] The housing 110 is disposed above the base 120. The housing 110 can be connected to the base 120 and form a receiving space between the housing 110 and the base 120. The receiving space of the fixed part I can accommodate and protect the movable part M, the elastic assembly E, the driving assembly D, the sensing assembly S, the first circuit assembly C1, the second circuit assembly C2, etc., to increase the overall structural strength of the optical element driving mechanism 100. The housing 110 includes a top wall 111 and a plurality of side walls 112. The top wall 111 is perpendicular to the main axis MA. The side walls 112 extend from the edges of the top wall 111 in a direction parallel to the main axis MA.

[0128] Next, in addition to Figures 3 to 6 , please refer to Figures 9 to 12 to understand the base 120. Figure 9 and Figure 10 are perspective views of the base 120 and the second circuit assembly C2 from different angles.

[0129] Figure 11 is an exploded view of the base 120 and the second circuit assembly C2. Figure 12 is a partially enlarged view of the base 120 and the second circuit assembly C2. The base 120 includes a base opening 121, a plurality of base grooves 122, a first positioning element 123, a second positioning element 124, and a plurality of base notches 125. Light can pass through the base opening 121. The base opening 121 is in communication with the base grooves 122. The base grooves 122 are formed on the surface of the base 120. The base grooves 122 have a recessed structure and correspond to the sensing elements 220. The base grooves 122 are located on the mechanism first side 1001 and the mechanism third side 1003. The first positioning element 123 is located on the mechanism second side 1002, and the second positioning element 124 is located on the mechanism fourth side 1004. The first positioning element 123 and the second positioning element 124 are used to correspond to the first circuit assembly C1. Specifically, the first positioning element 123 and the second positioning element 124 can position the first circuit assembly C1. The first positioning element 123 and the second positioning element 124 are arranged along the first axis A1. The base notches 125 are formed on the surface of the base 120. The base notches 125 have a recessed structure and correspond to an electrical contact 265 (to be described in detail below). The base opening 121 and the base notches 125 are independent. That is, the base opening 121 and the base notches 125 are not in communication.

[0130] Next, in addition to Figures 3 to 6 , please refer to Figure 7 and Figure 8 to understand the movable part M. Figure 7 is a perspective view of the frame 130. Figure 8is a perspective view of the carrier 140. When viewed along the main axis MA, the mechanism first side 1001 and the mechanism third side 1003 are located on two sides of the movable part M, and the mechanism second side 1002 and the mechanism fourth side 1004 are also located on two sides of the movable part M. The frame 130 and the carrier 140 are located in the accommodation space of the fixed part M. The frame 130 includes a plurality of frame stoppers 131, a plurality of frame connectors 132, a plurality of frame grooves 133, and a plurality of frame accommodation parts 134. The frame stoppers 131 and the frame connectors 132 are arranged on the top surface of the frame 130. The frame stoppers 131 and the frame connectors 132 can be protrusions. The frame grooves 133 are formed on the mechanism second side 1002 and the mechanism fourth side 1004. The frame accommodation parts 134 are formed on the four corners of the inner side of the frame 130 to accommodate and protect the magnetic elements 200.

[0131] The carrier 140 is arranged inside the frame 130. The carrier 140 is connected to the frame 130 by the first elastic element 150 and the second elastic element 160. The carrier 140 is hollow to carry the optical element 10. The carrier 140 includes a plurality of carrier stoppers 141, a plurality of carrier connectors 142, a plurality of carrier electrical connectors 143, and a plurality of carrier grooves 144. The carrier stoppers 141 and the carrier connectors 142 are arranged on the top surface of the carrier 140. The carrier stoppers 141 and the carrier connectors 142 can be protrusions. The carrier electrical connectors 143 are located on the mechanism second side 1002 and the mechanism fourth side 1004. The carrier grooves 144 are located on the mechanism first side 1001 and the mechanism third side 1003. Because the carrier electrical connectors 143 and the carrier grooves 144 are located on different sides of the optical element driving mechanism 100, the space can be effectively utilized and miniaturization can be achieved.

[0132] When the driving assembly D drives the carrier 140 to move along the direction parallel to the optical axis O towards the top wall 111 of the housing 110 to the limit range, the frame stoppers 131 and the carrier stoppers 141 will first contact the top wall 111 of the housing 110, and the rest of the frame 130 and the carrier 140 can be prevented from colliding with the housing 110. The bottom surface of the frame 130 and the carrier 140 can also have similar stop structures. Therefore, the stability of the optical element driving mechanism 100 as a whole can be improved.

[0133] Next, please refer to Figure 3 、 Figure 4 、 Figure 7 、 Figure 8to understand the elastic assembly E. The first elastic element 150 is disposed between the top wall 111 of the housing 110 and the frame 130. The second elastic element 160 is disposed between the carrier 140 and the first circuit assembly CI. The first elastic element 150 and the second elastic element 160 are made of elastic or ductile material, such as metal. In the art, the first elastic element 150 and the second elastic element 160 can be referred to as "elastic sheet", "spring sheet", "leaf spring", etc.

[0134] The first elastic element 150 connects the top surface of the frame 130 and the top surface of the carrier 140, while the second elastic element 160 connects the bottom surface of the frame 130 and the bottom surface of the carrier 140. For example, the first elastic element 150 can be disposed at the frame connecting portion 132 and the carrier connecting portion 142. By the first elastic element 150 and the second elastic element 160, the movement range of the carrier 140 can be limited when the movable portion M moves relative to the fixed portion I. Thus, the damage of the carrier 140 and the optical element 10 in the carrier 140 due to the collision of the carrier 140 to the housing 110 or the base 120 when the optical element driving mechanism 100 moves or is impacted by external force can be avoided.

[0135] The third elastic element 170 has its upper end connected to the first elastic element 150 of the elastic assembly E, and its lower end connected to the four corners of the base 120 of the fixed portion I. As mentioned above, the first elastic element 150 is connected to the frame 130 of the movable portion M and the carrier 140 of the movable portion M. Thus, the third elastic element 170 substantially "suspends" the frame 130 of the movable portion M together with the carrier 140 between the housing 110 and the base 120 of the fixed portion I, such that the frame 130 and the carrier 140 are both spaced apart from the housing 110 and the base 120. That is, the frame 130 and the carrier 140 do not directly contact the housing 110 and the base 120. The first elastic element 150 and the third elastic element 170 are both electrically connected to the driving assembly D. By the flexible third elastic element 170, the frame 130 of the movable portion M together with the carrier 140 therein mainly performs two-dimensional movement in the direction of the optical axis O relative to the housing 110 and the base 120 of the fixed portion I.

[0136] Next, please refer to Figures 3 to 6, to understand the driving assembly D. The driving assembly D can drive the movable part M to move, including moving or rotating, etc. The auto focus coil 180 is polygonal and surrounds the carrier 140. The auto focus coil 180 includes a plurality of leads 181. The leads 181 are connected to the carrier electrical connection part 143 after being connected out of the auto focus coil 180. By means of soldering tin or the like on the carrier electrical connection part 143, the auto focus coil 180 can be electrically connected with other elements (for example, the first elastic element 150). For example, one side of the leads 181 can supply current to flow into the auto focus coil 180, and the other side of the leads 181 can supply current to flow out of the auto focus coil 180. The optical image stabilization coil 190 is arranged in the first circuit assembly C1. Specifically, the optical image stabilization coil 190 is arranged in at least one of the first circuit element 230, the second circuit element 240, and the third circuit element 250. The magnetic element 200 is arranged in the frame accommodation part 134 of the frame 130. Each pair of magnetic poles (a pair of N poles and S poles) of the magnetic element 200 is arranged along the direction of the vertical main axis MA.

[0137] When the driving assembly D is powered on, a magnetic force parallel to the direction of the optical axis O is generated between the auto focus coil 180 and the magnetic element 200, which can drive the carrier 140 and the optical element 10 in it to move relative to the fixed part along the direction parallel to the optical axis O, so as to focus on the object being photographed, achieving auto focus (AF). When the driving assembly D is powered on, a magnetic force perpendicular to the direction of the optical axis O is generated between the optical image stabilization coil 190 and the magnetic element 200, which can drive the frame 130 together with the carrier 140 and the optical element 10 in it to move relative to the fixed part I along the direction perpendicular to the optical axis O, so as to compensate for the shift of the imaging relative to the original position caused by the shaking of the user or the impact of external force, thereby solving the problem of image or image blur, and achieving optical image stabilization (OIS).

[0138] Through auto focus and optical image stabilization, the quality of the photographed image can be improved. It is worth noting that the magnetic element 200 corresponds to both the auto focus coil 180 and the optical image stabilization coil 190. In other words, for the driving assembly D, only one set of magnetic elements is needed to achieve auto focus and optical image stabilization. Because two sets of magnetic elements are not needed to correspond to the auto focus coil 180 and the optical image stabilization coil 190 respectively, miniaturization can be achieved.

[0139] Next, please refer to Figures 3 to 6The sensing assembly S is configured to sense the position of the movable portion M. The reference element 210 is disposed in the carrier recess 144 and corresponds to the base recess 122. The sensing element 220 corresponds to the reference element 210 and is disposed on the bottom surface of the first circuit element 230. The reference element 210 can be a magnetic element. The sensing element 220 can be a Hall sensor, a Giant Magneto Resistance (GMR) sensor, a Tunneling Magneto Resistance (TMR) sensor, or the like. The sensing element 220 can sense the reference element 210 to obtain the position of the movable portion M. Specifically, the sensing element 220 can sense the magnetic field variation (including but not limited to the magnetic field density and the magnetic field direction) of the reference element 210 to obtain the position of the carrier 140. Through the sensing assembly S, the position of the movable portion M can be obtained in real time.

[0140] In the present embodiment, the sensing assembly S includes two reference elements 210 and four sensing elements 220 to sense the movement of the carrier 140 relative to the base 120 along the first axis A1 and the second axis A2, and the shaking, rotation, or the like of the carrier 140. However, the number and the position of the reference elements 210 and the sensing elements 220 can be adjusted according to actual needs.

[0141] Next, please refer to Figure 3 and Figures 9 to 12 to understand the second circuit assembly C2. In the present embodiment, the second circuit assembly C2 includes terminals connected to the outside, so the second circuit assembly C2 can also be regarded as an external circuit 260. Specifically, the first circuit assembly C1 is electrically connected to an external circuit through the external circuit 260. Through the external circuit 260, current can be passed into the optical element driving mechanism 100. The external circuit 260 can include several pins for current to flow in or out.

[0142] The external circuit 260 is disposed below the first circuit assembly C1, and the external circuit 260 faces the bottom surface of the first circuit element 230. The external circuit 260 can be formed in the base 120 by insert molding. That is, the external circuit 260 can be integrally formed with the base 120, and at least part of the external circuit 260 is buried and not exposed on the base 120.

[0143] The external circuit 260 includes an external circuit opening 261 and multiple protrusions 262. The external circuit opening 261 allows light to pass through. When viewed along the main axis MA, the area of ​​the external circuit opening 261 is larger than the area of ​​the base opening 121. The external circuit opening 261 communicates with the base recess 122. The external circuit opening 261 is independent of the base recess 125. That is, the external circuit opening 261 does not communicate with the base recess 125. The protrusions 262 protrude from the base recess 125.

[0144] An electrical contact 265 may be included between the first circuit component C1 and the second circuit component C2 (only when...). Figure 12 (Illustrative illustration). For ease of explanation, in... Figure 12 Only one electrical contact 265 is shown, but more electrical contacts 265 may be included. The electrical contact 265 is located between the bottom surface of the first circuit element 230 and the top surface of the external circuit 260. The electrical contact 265 may include a conductive material. The conductive material may be any material that allows the elements to be electrically connected to each other, such as a metal, for example, tin. The conductive material is disposed on the protrusion 262 in the base recess 125, such that the first circuit assembly C1 and the second circuit assembly C2 are electrically connected through the electrical contact 265.

[0145] Next, please refer to Figures 13 to 19 In order to understand the first circuit component C1. Figure 13 as well as Figure 14 These are three-dimensional views of the first circuit component C1 from different perspectives. Figure 15 This is a top view of the first circuit component C1. Figure 16 This is a side view of the first circuit component C1. Figure 17 as well as Figure 18 These are magnified views of the first circuit component C1 from different perspectives. Figure 19 This is a schematic diagram of the first circuit assembly C1 before folding. In this disclosure, the first circuit assembly C1 can be formed by folding. At the fold, the first circuit assembly C1 includes a first connecting portion 270 and a second connecting portion 280. In other words, the first circuit assembly C1 can be formed by two folds.

[0146] Because the first circuit component C1 can be formed by folding, there is no need for a separate circuit board. Since no separate circuit board is needed, and no additional conductive material is required on the circuit board for electrical connection with other components, the number of components can be reduced, the manufacturing process simplified, and costs saved.

[0147] The first circuit element 230, the second circuit element 240, and the third circuit element 250 have a plate-like structure, and are perpendicular to the main axis MA. The second circuit element 240 and the third circuit element 250 are located above the first circuit element 230. When viewed along the main axis MA, the first circuit element 230 and the second circuit element 240 at least partially overlap. When viewed along the main axis MA, the first circuit element 230 and the third circuit element 250 at least partially overlap. When viewed along the main axis MA, the second circuit element 240 and the third circuit element 250 do not overlap. When viewed along the second axis A2, the second circuit element 240 and the third circuit element 250 at least partially overlap. That is, the second circuit element 240 and the third circuit element 250 are arranged along the second axis A2.

[0148] The first circuit element 230 includes a first side 230S1 (see reference) Figure 17 ) and a third side 230S3 (only on the third side) Figure 13 The diagram is schematically marked, and the specific location can be referred to as the first side 230S1 of the first circuit element 230. When viewed along the main axis MA, the first side 230S1 of the first circuit element 230 is located on the first side 1001 of the mechanism, while the third side 230S3 of the first circuit element 230 is located on the third side 1003 of the mechanism.

[0149] The second circuit element 240 includes a second side 240S2 (see reference) Figure 17 When viewed along the main axis MA, the second side 240S2 of the second circuit element 240 is located on the first side 1001 of the mechanism. The third circuit element 250 includes a fourth side 250S4 (only when viewed along the main axis MA). Figure 13 The diagram is schematically marked, and the specific location can be referenced to the second side 240S2 of the second circuit element 240. When viewed along the main axis MA, the fourth side 250S4 of the third circuit element 250 is located on the third side 1003 of the mechanism.

[0150] The first connecting portion 270 is located on the first side 1001 of the mechanism. Specifically, the first connecting portion 270 protrudes from the first side 230S1 of the first circuit element 230 and the second side 240S2 of the second circuit element 240. The first connecting portion 270 connects the first circuit element 230 and the second circuit element 240. The first circuit element 230 is electrically connected to the second circuit element 240 through the first connecting portion 270. In the figures, the outer surface of the first connecting portion 270 is flat, giving it a plate-like structure. However, the first connecting portion 270 may have a curved structure.

[0151] The second connecting portion 280 is located at the third side 1003 of the mechanism. Specifically, the second connecting portion 280 is protruded by the third side edge 230S3 of the first circuit element 230 and the fourth side edge 250S4 of the third circuit element 250. The second connecting portion 280 connects the first circuit element 230 and the third circuit element 250. The first circuit element 230 is electrically connected to the third circuit element 250 through the second connecting portion 280. In the figures, the outer surface of the second connecting portion 280 is flat, such that the second connecting portion 280 has a plate-like structure. However, the second connecting portion 280 can have a curved structure.

[0152] When viewed along the main axis MA, a first spacing 2451 and a second spacing 2452 are formed between the second circuit element 240 and the third circuit element 250. The first spacing 2451 is located at the second side 1002 of the mechanism. The second spacing 2452 is located at the fourth side 1004 of the mechanism. When viewed along the main axis MA, a line connecting the center of the first spacing 2451 and the center of the second spacing 2452 is not parallel to nor perpendicular to the first axis Al. When viewed along the first axis Al, the first spacing 2451 and the second spacing 2452 do not overlap. When viewed along the second axis A2, the first spacing 2451 and the second spacing 2452 do not overlap. In other words, on the first axis Al, the first spacing 2451 and the second spacing 2452 are not aligned. Through the first spacing 2451 and the second spacing 2452, the tolerances of the second circuit element 240 and the third circuit element 250 during production and assembly can be accommodated, and the direction can be easily identified. Therefore, the assembly process can be further simplified.

[0153] Hereinafter, the first circuit element 230, the second circuit element 240, and the first connecting portion 270 will be mainly described. However, it should be understood that the third circuit element 250 and the second connecting portion 280 can also include substantially the same structures and functions as the second circuit element 240 and the first connecting portion 270.

[0154] The first circuit element 230 includes a plurality of first protruding portions 231. The first protruding portions 231 are protruded by the first side edge 230S1 of the first circuit element 230. A first gap 232 is between the first protruding portions 231 and the first connecting portion 270. In other words, the first protruding portions 231 are portions protruding with respect to the first gap 232, and the first gap 232 is located between the first protruding portions 231 and the first connecting portion 270. The second circuit element 240 includes a plurality of second protruding portions 241. The second protruding portions 241 are protruded by the second side edge 240S2 of the second circuit element 240. A second gap 242 is between the second protruding portions 241 and the first connecting portion 270. In other words, the second protruding portions 241 are portions protruding with respect to the second gap 242, and the second gap 242 is located between the second protruding portions 241 and the first connecting portion 270.

[0155] The first protrusion 231 at least partially overlaps the second protrusion 241 when viewed along the major axis MA. The first gap 232 at least partially overlaps the second gap 242 when viewed along the major axis MA. Because of the first gap 232 and the second gap 242 on both sides of the first connecting portion 270, space can be reserved for folding.

[0156] Because the first connecting portion 270 is formed due to folding, the first circuit element 230, the second circuit element 240, and the first connecting portion 270 are integrally formed. The first circuit element 230 does not connect the first connecting portion 270 by any additional means, such as adhesion, soldering, etc. The second circuit element 240 does not connect the first connecting portion 270 by any additional means, such as adhesion, soldering, etc.

[0157] For ease of illustration, a bottom surface of the first circuit element 230 is defined as a first surface 230BS (see FIG. 2B), and a top surface of the first circuit element 230 is defined as a second surface 230TS (see FIG. 2B). The first surface 230BS is opposite to the second surface 230TS. The first surface 230BS faces the external circuit 260. The second surface 230TS faces the second circuit element 240. Figure 14 Figure 17

[0158] The first circuit element 230 can further include a first line 233 (see FIG. 2B), a second line 234, a third line 235, and a substrate 236 (see FIG. 2B). At least part of the first line 233, the second line 234, and the third line 235 are buried and not exposed on the substrate 236 of the first circuit element 230. That is, the substrate 236 is part of the first circuit element 230 that covers the first line 233, the second line 234, and the third line 235. Figure 14 Figure 16

[0159] The first line 233 is used to electrically connect the sensing element 220. Specifically, the sensing element 220 is disposed on the first surface 230BS of the first circuit element 230. For example, the sensing element 220 can be mounted to the first surface 230BS of the first circuit element 230 by surface mount technology (SMT) or the like. In some embodiments, part of the first line 233 is exposed on the first surface 230BS of the first circuit element 230 to facilitate electrical connection between the sensing element 220 and the first line 233. In some embodiments, no adhesive element needs to be applied between the sensing element 220 and the first line 233.

[0160] ​​​​Next, how the optical anti-shake coil 190 of the driving assembly D is arranged in the first circuit assembly C1 will be described. For the convenience of description, the optical anti-shake coil 190 is defined to include a first coil 191, a second coil 192, a third coil 193, and a fourth coil 194. The first coil 191 is arranged in the second circuit element 240. The second coil 192 and the fourth coil 194 are arranged in the first circuit element 230. The third coil 193 is arranged in the third circuit element 250.

[0161] The first coil 191 is electrically connected to the second coil 192 and the second wire 234. The second wire 234 is a portion of the second coil 192. When viewed along the main shaft MA, the first coil 191 and the second wire 234 do not overlap. The third coil 193 is electrically connected to the fourth coil 194 and the third wire 235. The third wire 235 is a portion of the fourth coil 194. When viewed along the main shaft MA, the third coil 193 and the third wire 235 do not overlap.

[0162] The first coil 191 and the second coil 192 are located in the first corner 2001 and the second corner 2002. The third coil 193 and the fourth coil 194 are located in the third corner 2003 and the fourth corner 2004. When viewed along the main shaft MA, the first coil 191 and the second coil 192 at least partially overlap. When viewed along the main shaft MA, the third coil 193 and the fourth coil 194 at least partially overlap. The first coil 191 and the third coil 193 are electrically independent. When viewed along the main shaft MA, the first coil 191 and the third coil 193 do not overlap. In other words, the first coil 191 and the second coil 192 can constitute a separate optical anti-shake coil 190, and the third coil 193 and the fourth coil 194 can constitute a separate optical anti-shake coil 190.

[0163] In some embodiments, a thickness 230T of the first circuit element 230 and a thickness 240T of the second circuit element 240 are both greater than a thickness 270T of the first connecting portion 270 and a thickness 280T of the second connecting portion 280. In some embodiments, a thickness 250T of the third circuit element 250 is the same as the thickness 240T of the second circuit element 240. In some embodiments, the thickness 230T of the first circuit element 230 is the same as the thickness 240T of the second circuit element 240. In some embodiments, the thickness 270T of the first connecting portion 270 is the same as the thickness 280T of the second connecting portion 280. Because the thickness 270T of the first connecting portion 270 and the thickness 280T of the second connecting portion 280 are smaller than the thickness 230T of the first circuit element 230 and the thickness 240T of the second circuit element 240, the space occupied by the first connecting portion 270 and the second connecting portion 280 can be reduced to achieve miniaturization.

[0164] In some embodiments, the first circuit assembly C1 further includes a substrate (not shown). The substrate has a plate-like structure. The substrate extends continuously between the first circuit element 230, the second circuit element 240, and the first connection portion 270. The substrate may be made of a flexible material, and thus may be present simultaneously in the first circuit element 230, the second circuit element 240, and the first connection portion 270, and may be foldable. In some embodiments, the substrate is U-shaped with a 90-degree turn.

[0165] In some embodiments, the first circuit element 230 includes a plurality of positioning portions 238, the second circuit element 240 includes a positioning portion 248, and the third circuit element 250 includes a positioning portion 258 (see reference). Figure 13 Positioning part 238 is located on the second side 1002 and the fourth side 1004 of the mechanism. Positioning part 248 is located on the fourth side 1004 of the mechanism. Positioning part 258 is located on the second side 1002 of the mechanism. Specifically, positioning part 238 and positioning part 258 located on the second side 1002 of the mechanism accommodate the first positioning element 123 of the base 120, while positioning part 238 and positioning part 248 located on the fourth side 1004 of the mechanism accommodate the second positioning element 124 of the base 120. Because the first connecting part 270, the second connecting part 280, and the positioning parts 238, 248, and 258 are located on different sides of the optical element driving mechanism 100, space can be effectively utilized and miniaturization can be achieved.

[0166] In some embodiments, the optical element driving mechanism 100 may include a first adhesive element 310 (only when the optical element driving mechanism 100 includes a first adhesive element 310). Figure 16 (Shown schematically). A first adhesive element 310 is disposed between the first circuit element 230 and the second circuit element 240 and / or between the first circuit element 230 and the third circuit element 250, such that the second circuit element 240 and / or the third circuit element 250 are fixedly connected to the first circuit element 230 via the first adhesive element 310. The first adhesive element 310 directly contacts the top surface (second surface 230TS) of the first circuit element 230, the second circuit element 240, and the first connecting portion 270. Therefore, the connection between the first circuit element 230 and the second circuit element 240 and / or the connection between the first circuit element 230 and the third circuit element 250 can be strengthened.

[0167] Additionally, to strengthen the connection between the housing 110 and the base 120, the optical element drive mechanism 100 may include a second adhesive element 320 (only when...). Figure 10 (Shown schematically). The second adhesive element 320 is disposed on the bottom surface of the base 120, such that the housing 110 is fixedly connected to the base 120 via the second adhesive element 320. The second adhesive element 320 directly contacts the housing 110 and the base 120. Therefore, the connection between the housing 110 and the base 120 can be strengthened.

[0168] It should be noted that the first adhesive element 310 and the second adhesive element 320 can be made of the same or different materials. The first adhesive element 310 and the second adhesive element 320 can be made of an adhesive material, a conductive material, or an insulating material, such as a resin material, optical glue, or the like. The first adhesive element 310 and the second adhesive element 320 can adhere different elements and strengthen the connection between the elements. In addition, the first adhesive element 310 and the second adhesive element 320 generally have good elasticity and covering force, and the application of the first adhesive element 310 and the second adhesive element 320 to the elements can protect the elements and reduce the probability of impurities such as dust and moisture entering the elements. If the first adhesive element 310 and the second adhesive element 320 are insulating materials, an insulating effect can be achieved. The application of the first adhesive element 310 and the second adhesive element 320 can strengthen the connection between the first circuit assembly C1 and the housing 110 and the base 120. Therefore, the overall structural strength of the optical element driving mechanism 100 can be improved.

[0169] In the following content, the same or similar elements will be denoted by the same or similar symbols. Next, please refer to Figures 20 to 22 . Figure 20 is a schematic view of a first circuit assembly C1' of some other embodiments before folding. Figure 21 is a schematic view of a first circuit assembly C1" of some other embodiments. Figure 22 is a schematic view of a first circuit assembly C1' of some other embodiments before folding. Figure 21 is a schematic view of a first circuit assembly C1" of some other embodiments.

[0170] In Figure 20 the embodiment shown, the third circuit element 250 is omitted, and the first circuit assembly C1' includes a first circuit element 230', a second circuit element 240', and a first connecting portion 270'. The plurality of optical anti-shake coils 190' are disposed in the second circuit element 240'. The plurality of sensing elements 220' are disposed on the bottom surface of the first circuit element 230'. In some embodiments, the optical anti-shake coils 190' are disposed only in the second circuit element 240' and not in the first circuit element 230', but are not limited thereto.

[0171] The first circuit element 230' and the second circuit element 240' have a plate-like structure, and the first circuit element 230' and the second circuit element 240' are perpendicular to the main axis MA. The second circuit element 240' is located above the first circuit element 230'. When viewed along the main axis MA, the first circuit element 230' and the second circuit element 240' at least partially overlap. In this embodiment, the first circuit element 230' is connected to the second circuit element 240' by the first connecting portion 270'. In other words, only one folding is required to form the first circuit assembly C1'.

[0172] In Figure 21 and Figure 22 the embodiment shown, the third circuit component 250 is also omitted, similar to Figure 20 The first circuit component C1" includes a first circuit component 230", a second circuit component 240", and a first connecting portion 270". The plurality of optical anti-shake coils 190" are disposed in the second circuit component 240". The plurality of sensing elements 220" are disposed on the bottom surface of the first circuit component 230". The main difference is that an external connecting circuit 260" (especially the terminals for external connection) is disposed on the first circuit component C1", instead of the base 120. In addition to being folded at the first connecting portion 270", the external connecting circuit 260" can be folded at the connection between the external connecting circuit 260" and the first circuit component 230", so that the external connecting circuit 260" is bent downward relative to the first circuit component 230", so that the external connecting circuit 260" is not parallel to the first circuit component 230". In some embodiments, the external connecting circuit 260" is perpendicular to the first circuit component 230".

[0173] In the present embodiment, the external connecting circuit 260" has a plate-like structure. In some embodiments, a thickness 260"T of the external connecting circuit 260" is less than a thickness 240"T of the second circuit component 240". In some embodiments, the thickness 260"T of the external connecting circuit 260" is the same as a thickness 230"T of the first circuit component 230". In some embodiments, the thickness 230"T of the first circuit component 230" is different from the thickness 240"T of the second circuit component 240". In some embodiments, the thickness 230"T of the first circuit component 230" is less than the thickness 240"T of the second circuit component 240".

[0174] As mentioned above, the first circuit component C1 can include a substrate continuously extending between the first circuit component 230,

[0175] the second circuit component 240, and the first connecting portion 270. In embodiments where the external connecting circuit 260" is disposed on the first circuit component C1", the substrate can further extend to the external connecting circuit 260".

[0176] It should be noted that the manner of folding can be determined according to actual needs, and the thickness, structure, shape, etc. of the first circuit component C1, C1', C1" can be changed accordingly.

[0177] Based on the present disclosure, the circuit assembly including the coil and the circuit can be formed by folding. Since the circuit assembly can be formed by folding, a separate circuit board does not need to be additionally provided. Since the separate circuit board is not needed, a conductive material does not need to be additionally provided on the circuit board to electrically connect the circuit board with other elements. Therefore, the effects of reducing the number of elements, simplifying the process, saving costs, etc. can be achieved. In addition, features such as spacing, clearance, positioning portion, etc. can be formed on the circuit assembly to allow for tolerances during production and assembly, facilitate folding, facilitate positioning, etc. Therefore, the process can be further simplified. Moreover, the folding manner can be determined according to actual needs, and the thickness, structure, shape, etc. of the circuit assembly can be changed accordingly. In addition, adhesive elements can be applied as needed to strengthen the connection between elements to strengthen the overall structural strength of the optical element driving mechanism.

[0178] The foregoing outlines features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they can readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and / or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should appreciate that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations can be made therein without departing from the spirit and scope of the present disclosure. In addition, features of the various embodiments can be arbitrarily mixed and used in combination, as long as they do not conflict with each other or the spirit of the present disclosure.

Claims

1. An optical element driving mechanism, comprising: a stationary part comprising a receiving space; a movable part configured to connect an optical element comprising an optical axis, and the movable part is movable relative to the stationary part, wherein the movable part is located in the receiving space of the stationary part; a driving assembly configured to drive the movable part to move relative to the stationary part; and a circuit assembly electrically connected to the driving assembly; wherein the circuit assembly comprises: a first circuit element having a plate-like structure, and the first circuit element is perpendicular to a main axis; a second circuit element having a plate-like structure, and the second circuit element is perpendicular to the main axis; and a first connecting part connecting the first circuit element and the second circuit element, wherein the first circuit element is electrically connected to the second circuit element through the first connecting part; wherein the first circuit element and the second circuit element at least partially overlap when viewed along the main axis; wherein the optical element driving mechanism has a polygonal structure comprising a mechanism first side, a mechanism second side, a mechanism third side, and a mechanism fourth side, the mechanism first side is opposite to the mechanism third side, and the mechanism second side is opposite to the mechanism fourth side; wherein the first circuit element comprises a first side edge, and the second circuit element comprises a second side edge, the first side edge of the first circuit element and the second side edge of the second circuit element are located at the mechanism first side when viewed along the main axis; wherein the first connecting part protrudes from the first side edge of the first circuit element and the second side edge of the second circuit element.

2. The optical element driving mechanism of claim 1, further comprising an adhesive element, wherein the first circuit element is fixedly connected to the second circuit element through the adhesive element, and the adhesive element directly contacts the first circuit element, the second circuit element, and the first connecting part; wherein the first circuit element, the second circuit element, and the first connecting part are integrally formed; wherein the first circuit element is not connected to the first connecting part by any additional means; wherein the second circuit element is not connected to the first connecting part by any additional means; wherein the circuit assembly further comprises a base having a plate-like structure, and the base continuously extends between the first circuit element, the second circuit element, and the first connecting part.

3. The optical element driving mechanism of claim 1, wherein the first circuit element further comprises a first protruding part, the first protruding part protrudes from the first side edge of the first circuit element, and the first protruding part has a first gap with the first connecting part; wherein the second circuit element further comprises a second protruding part, the second protruding part protrudes from the second side edge of the second circuit element, and the second protruding part has a second gap with the first connecting part; wherein the first protruding part and the second protruding part at least partially overlap when viewed along the main axis; wherein the first gap and the second gap at least partially overlap when viewed along the main axis; wherein a thickness of the first circuit element and a thickness of the second circuit element are both greater than a thickness of the first connecting part. ​ 4. The optical element driving mechanism of claim 1, further comprising a sensing assembly configured to sense a movement of the movable portion relative to the fixed portion, wherein the sensing assembly comprises: a reference element; and a sensing element corresponding to the reference element; wherein the first circuit element comprises a first surface opposite to a second surface, the second surface facing the second circuit element, a first wire at least partially embedded and not exposed on a substrate; wherein the sensing element is disposed on the first surface of the first circuit element, and the sensing element is electrically connected to the first wire of the first circuit element.

5. The optical element driving mechanism of claim 4, wherein the circuit assembly further comprises an external circuit electrically connected to the first circuit element, the external circuit having a plate structure not parallel to the first circuit element, the circuit assembly being electrically connected to an external circuit through the external circuit; wherein a thickness of the external circuit is less than a thickness of the second circuit element, the thickness of the external circuit being the same as a thickness of the first circuit element, the thickness of the first circuit element being different from the thickness of the second circuit element; wherein the circuit assembly further comprises a base having a plate structure; wherein the base continuously extends between the first circuit element, the second circuit element, the first connecting portion, and to the external circuit; wherein the fixed portion comprises a base including a base opening configured to pass a light and a base recess formed on a surface of the base, the base recess having a recessed structure and corresponding to the sensing element, wherein the base recess is in communication with the base opening.

6. The optical element driving mechanism of claim 5, wherein the thickness of the first circuit element is less than the thickness of the second circuit element.

7. The optical element driving mechanism of claim 4, wherein the first circuit element further comprises a second wire, the driving assembly comprises a first coil and a second coil, the first coil is disposed on the second circuit element, the second coil is disposed on the first circuit element, the first coil is electrically connected to the second coil and the second wire, wherein the first coil does not overlap the second wire when viewed along the main axis, wherein the first coil at least partially overlaps the second coil when viewed along the main axis.

8. The optical element driving mechanism of claim 7, wherein a first side of the mechanism extends along a first axis perpendicular to the main axis, a second side of the mechanism extends along a second axis perpendicular to the main axis, wherein the optical element driving mechanism comprises a first corner, a second corner, a third corner, and a fourth corner, a line connecting the first corner and the second corner is parallel to the first axis, a line connecting the first corner and the third corner is parallel to the second axis; wherein the first side and the third side of the mechanism are respectively located on two sides of the movable portion when viewed along the main axis; wherein the circuit assembly further comprises: a third circuit element having a plate structure and being perpendicular to the main axis; and a fourth circuit element having a plate structure and being perpendicular to the main axis. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ a second connecting portion connecting the first circuit element and the third circuit element; wherein the third circuit element is electrically connected to the first circuit element through the second connecting portion; wherein the first circuit element and the third circuit element at least partially overlap when viewed along the main axis; wherein the first circuit element further comprises a third side edge and the third circuit element comprises a fourth side edge, the third side edge of the first circuit element and the fourth side edge of the third circuit element are located at the third side of the mechanism when viewed along the main axis; wherein the second connecting portion protrudes from the third side edge of the first circuit element and the fourth side edge of the third circuit element; wherein a thickness of the third circuit element is the same as a thickness of the second circuit element, and a thickness of the first circuit element is the same as the thickness of the second circuit element; wherein the second circuit element and the third circuit element do not overlap when viewed along the main axis; wherein the second circuit element and the third circuit element at least partially overlap when viewed along the second axis; wherein the first circuit element further comprises a third line, and the driving assembly further comprises a third coil and a fourth coil, the third coil is disposed on the third circuit element, the fourth coil is disposed on the first circuit element, the third coil is electrically connected to the fourth coil and the third line; wherein the third coil and the third line do not overlap when viewed along the main axis; wherein the third coil and the fourth coil at least partially overlap when viewed along the main axis; wherein the first coil and the third coil are electrically independent; wherein the first coil and the third coil do not overlap when viewed along the main axis; wherein the first coil is located at the first corner and the second corner, and the third coil is located at the third corner and the fourth corner when viewed along the main axis.

9. The optical element driving mechanism of claim 8, wherein the fixing portion further comprises a base comprising a first positioning element and a second positioning element, the first positioning element and the second positioning element are configured to correspond to the circuit assembly; wherein the first positioning element is located at the second side of the mechanism and the second positioning element is located at the fourth side of the mechanism when viewed along the main axis; wherein the first positioning element and the second positioning element are arranged along the first axis when viewed along the main axis; wherein a first spacing is formed between the second circuit element and the third circuit element when viewed along the main axis, the first spacing is located at the second side of the mechanism; wherein a second spacing is formed between the second circuit element and the third circuit element when viewed along the main axis, the second spacing is located at the fourth side of the mechanism; wherein a line connecting a center of the first spacing and a center of the second spacing is neither parallel nor perpendicular to the first axis when viewed along the main axis; wherein the first spacing and the second spacing do not overlap when viewed along the first axis; wherein the first spacing and the second spacing do not overlap when viewed along the second axis; The circuit assembly further comprises a pair of external circuits integrally formed with the base, and the pair of external circuits are at least partially embedded and not exposed on the base, and the circuit assembly is electrically connected to an external circuit through the pair of external circuits; The first surface of the first circuit element faces the pair of external circuits; The circuit assembly further comprises an electrical contact between the first surface and the pair of external circuits; The base further comprises a base recess formed on a surface of the base, and the base recess has a recessed structure and corresponds to the sensing element, and the base further comprises a base notch formed on a surface of the base, and the base notch has a recessed structure and corresponds to the electrical contact; The pair of external circuits comprises a pair of external circuit openings for allowing a light to pass through, and the pair of external circuit openings are communicated with the base recess, and the pair of external circuit openings are independent of the base notch; The pair of external circuits further comprises a protrusion protruding from the base notch.

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