Display device and backlight module

Abstract

The present application discloses a display device and a backlight module, belonging to the field of display technology. The display device includes: a backlight module, a liquid crystal display panel and a chip-on-chip film. The backlight module may include: a frame, and a side-entry light source, a light guide plate, a reflective strip, a light absorbing strip and an optical film located in the frame. Since there is no bonding relationship between the light absorbing strip and the diffuser in the optical film, and there is a bonding relationship between the reflective strip and the diffuser in the optical film, after the chip-on-chip film is bent and bonded to the side of the frame in the backlight module away from the liquid crystal display panel, under the action of the rebound force of the bent part of the chip-on-chip film, the diffuser will not move with the displacement of the light absorbing strip, but will move with the light absorbing strip following the displacement of the light guide plate. It is ensured that the light guide plate and the diffuser will not separate, thereby improving the light output effect of the backlight module.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device and a backlight module. Background Art

[0002] A liquid crystal display device generally includes a liquid crystal display panel, a backlight module disposed on a backlight surface (ie, a surface away from a light emitting surface) of the liquid crystal display panel, and a driver chip for driving the liquid crystal display panel.

[0003] In order to reduce the size of the frame in the liquid crystal display device, the driver chip in the liquid crystal display device is usually packaged using chip on flex (COF) packaging technology. When the chip on flex technology is used to package the driver chip, one end of the chip on flex is electrically connected to the liquid crystal display panel, and the remaining part needs to be bent to the side of the backlight module away from the liquid crystal display panel and bonded to the side of the backlight module away from the liquid crystal display panel.

[0004] However, the bent portion of the chip-on-cover film has a certain rebound force, which will generate a force on the side of the backlight module away from the liquid crystal display panel. The force will destroy the film structure in the backlight module, resulting in poor light output effect of the backlight module. Summary of the invention

[0005] The embodiment of the present application provides a display device and a backlight module. The problem of poor light output effect of the backlight module in the current display device can be solved. The technical solution is as follows:

[0006] In one aspect, a display device is provided, comprising:

[0007] Liquid crystal display panels, backlight modules and chip-on-film;

[0008] The chip-on-film is electrically connected to the liquid crystal display panel and is connected to a side of the backlight module away from the liquid crystal display panel;

[0009] The backlight module comprises: a frame, and a side-entry light source, a light guide plate, a reflective strip, a light absorbing strip and an optical film located in the frame;

[0010] Wherein, the light emitting surface of the light source faces the side surface of the light guide plate, and the optical film is located on the light guide plate;

[0011] The reflective strip is located on a side of the frame body close to the light source, and is located between the optical film and the light guide plate, and is connected to the optical film;

[0012] The light absorption strip is located on a side of the frame body close to the light source and on a side of the optical film away from the reflection strip, and is disposed separately from the optical film.

[0013] Optionally, the reflective strip is disposed separately from the light guide plate on a surface close to the light guide plate.

[0014] Optionally, a side of the frame body close to the light source has a groove, and a side of the reflective strip away from the light guide plate is connected to a side wall of the groove.

[0015] Optionally, the reflective strip is a white adhesive strip with a single-sided adhesive tape, and the single-sided adhesive tape is located on a side of the white adhesive strip away from the light guide plate, and the single-sided adhesive tape is bonded to the optical film.

[0016] Optionally, the optical film includes: a diffuser located on the light guide plate, the reflective strip is located between the diffuser and the light guide plate, and the optical film further includes: two layers of brightness enhancement films located on a side of the diffuser away from the light guide plate.

[0017] Optionally, a side of the diffusion sheet close to the light source has a strip-shaped light-absorbing structure.

[0018] Optionally, the width of the light absorption structure is greater than the width of the contact area between the diffusion sheet and the reflection strip.

[0019] Optionally, the backlight module further includes: a light-shielding adhesive located between the frame and the liquid crystal display panel, one side of the light-shielding adhesive is bonded to the liquid crystal display panel, and the other side of the light-shielding adhesive is bonded to the light absorption strip.

[0020] Optionally, the light source includes: a flexible circuit board, and a plurality of lamp bodies located on the flexible circuit board, the light emitting surfaces of the lamp bodies are connected to the side surfaces of the light guide plate, and the flexible circuit board is connected to a side of the light guide plate away from the optical film.

[0021] On the other hand, a backlight module is provided, comprising:

[0022] A frame, and a side-entry light source, a light guide plate, a reflective strip, a light absorbing strip and an optical film located in the frame;

[0023] Wherein, the light emitting surface of the light source faces the side surface of the light guide plate, and the optical film is located on the light guide plate;

[0024] The reflective strip is located on a side of the frame body close to the light source, and is located between the optical film and the light guide plate, and is connected to the optical film;

[0025] The light absorption strip is located on a side of the frame body close to the light source and on a side of the optical film away from the reflection strip, and is disposed separately from the optical film.

[0026] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:

[0027] The display device includes: a backlight module, a liquid crystal display panel and a chip-on-chip film. The backlight module may include: a frame, and a side-entry light source, a light guide plate, a reflective strip, a light absorbing strip and an optical film located in the frame. Since there is no bonding relationship between the light absorbing strip and the diffuser in the optical film, and there is a bonding relationship between the reflective strip and the diffuser in the optical film, after the chip-on-chip film is bent and bonded to the side of the frame in the backlight module away from the liquid crystal display panel, under the action of the rebound force of the bent part of the chip-on-chip film, the diffuser will not move with the displacement of the light absorbing strip, but will move with the light absorbing strip following the displacement of the light guide plate. In this way, it can be ensured that the light guide plate and the diffuser will not separate, and that there is always a contact relationship between the two, which effectively reduces the probability of light emitted by the light source in the backlight module leaking between the two, thereby improving the light output effect of the backlight module. Furthermore, the display device does not need to redesign the internal structure, and only introduces a new reflective strip in the backlight module, thereby effectively reducing the manufacturing cost of the display device. Since the reflective strip is closer to the light source than the light absorbing strip, part of the light emitted by the light source will not be directly absorbed by the light absorbing strip, but will be reflected multiple times by the reflective strip, so that the light emitted by the light source is dispersed and emitted from the side of the light guide plate close to the liquid crystal display panel, effectively reducing the probability of the light emitted by the light source being directly absorbed by the light absorbing strip, improving the light emitting efficiency of the light source, further improving the light emitting effect of the backlight module, and ensuring a good display effect of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 is a schematic diagram of a film structure of a display device;

[0030] Figure 2 yes Figure 1 The force analysis diagram of the display device shown;

[0031] Figure 3 is a schematic diagram of a film layer structure of a display device provided in an embodiment of the present application;

[0032] Figure 4 yes Figure 3 The force analysis diagram of the display device shown;

[0033] Figure 5 yes Figure 3 A light path diagram in a light guide plate in a display device shown;

[0034] Figure 6 is a schematic diagram of a film layer structure of another display device provided in an embodiment of the present application;

[0035] Figure 7 It is a schematic diagram of the film layer structure of a backlight module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0036] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0037] Please refer to Figure 1 , Figure 1 The following is a schematic diagram of a film structure of a display device. The display device may include:

[0038] Liquid crystal display panel 01, backlight module 02 and chip on film 03.

[0039] The backlight module 02 is usually disposed on a side of the liquid crystal display panel 01 away from the light emitting surface.

[0040] One end of the chip-on-chip film 03 can be electrically connected to the liquid crystal display panel 01, and after the chip-on-chip film 03 is electrically connected to the liquid crystal display panel 01, the remaining portion of the chip-on-chip film 03 can be bent to the side of the backlight module 02 away from the liquid crystal display panel 01, and bonded to the side of the backlight module 02 away from the liquid crystal display panel 01.

[0041] The backlight module 02 in the display device may include: a frame 021, a side-entry light source 022 located in the frame 021, a light guide plate 023, a black adhesive strip 024 and a plurality of stacked optical films 025, and a light-shielding adhesive strip 026 located between the frame 021 and the liquid crystal display panel 01.

[0042] The light emitting surface of the light source 022 faces the side of the light guide plate 023. The multiple stacked optical films 025 are all located on the light guide plate 023, and one of the multiple stacked optical films 025 that contacts the light guide plate 023 is usually a diffuser 025a. The black adhesive strip 024 is located on the side of the frame 021 close to the light source 022, and the black adhesive strip 024 is located on the side of the diffuser 025a away from the light guide plate 021. The side of the black adhesive strip 024 that contacts the diffuser 025a has a single-sided adhesive tape, and the black adhesive strip 024 can be bonded to the diffuser 025a through the single-sided adhesive tape. The light shielding tape 026 is usually a double-sided tape, one side of which can be bonded to the liquid crystal display panel 01, and the other side of which can be bonded to the end face of the frame 021 close to the liquid crystal display panel 01, and the side of the black tape 024 away from the diffuser 025a.

[0043] After the bent chip-on-film 03 in the display device is bonded to the side of the frame 021 in the backlight module 02 away from the liquid crystal display panel 01, the light source 022 in the backlight module 02 is located on the side of the frame 021 close to the chip-on-film 03. In this case, please refer to Figure 2 , Figure 2 yes Figure 1 The force analysis diagram of the display device shown in FIG. 1 is a diagram showing a force analysis diagram of the display device. The bent portion of the chip-on-chip film 03 has a certain rebound force. Under the action of the rebound force, the portion of the frame 021 in the backlight module 02 that is bonded to the chip-on-chip film 03 will be subjected to the pulling force F of the chip-on-chip film 03. Under the action of the pulling force F, the portion of the frame 021 that is bonded to the chip-on-chip film 03 will be displaced in the direction of the pulling force F, causing the light source 022 in the frame 021 and the portion of the light guide plate 023 close to the light source 022 to follow the displacement of the frame 021 and also displace in the direction of the pulling force F. Since the black rubber strip 024 is bonded to the diffuser 025a, and the diffuser 025a and the light guide plate 013 only have a contact relationship but no bonding relationship, the black rubber strip 024 and the portion of the diffuser 025a that is bonded to the black rubber strip 024 will be displaced in the opposite direction of the pulling force F.

[0044] In this way, the portion of the light guide plate 023 near the light source 022 and the portion of the diffuser 025a bonded to the black adhesive strip 024 will separate, and there will be no contact between the two, resulting in a trumpet-shaped opening between the light guide plate 023 and the diffuser 025a. The light emitted by the light source 022 may be emitted from the area between the light guide plate 023 and the diffuser 025a, that is, the light emitted by the light source 022 in the backlight module 02 will leak, resulting in poor light emission effect of the backlight module 02, affecting the display effect of the display device.

[0045] In order to improve the light output effect of the backlight module 02, the commonly used improvement measures are as follows:

[0046] (1) The light guide plate 023 in the backlight module 02 is redesigned, and denser dots are set in the area of ​​the light guide plate 023 close to the lamp body in the light source 022, and sparser dots are set in the area between the two lamp bodies in the light guide plate 023 close to the light source 022.

[0047] (2) When the chip-on-film 03 is bent, a special jig is used for pressure-maintaining treatment to ensure that the bent chip-on-film 03 is fully bonded to the backlight module 01 to reduce the rebound force at the bent portion of the chip-on-film 03 .

[0048] (3) The chip-on-chip film 03 is redesigned to reduce the thickness of the chip-on-chip film 03 , thereby reducing the rebound force at the bent portion of the chip-on-chip film 03 .

[0049] However, the above three improvement measures cannot effectively suppress the light leakage phenomenon of the light emitted by the light source 022 in the backlight module 02, and the three improvement measures all involve redesigning the structure, which will result in a higher manufacturing cost of the display device.

[0050] Please refer to Figure 3 , Figure 3 Schematic diagram of a film structure of a display device provided in an embodiment of the present application. The display device may include:

[0051] The backlight module 100, the liquid crystal display panel 200 and the chip-on-film 300 are provided. The backlight module 100 is usually arranged on a side of the liquid crystal display panel 200 away from the light emitting surface A.

[0052] The chip-on-chip film 300 is electrically connected to the liquid crystal display panel 200. For example, the non-display area of ​​the liquid crystal display panel 200 has a binding structure, and one end of the chip-on-chip film 300 has a connecting structure. One end of the chip-on-chip film 300 can be electrically connected to the binding structure in the liquid crystal display panel 200 through the connecting structure, so that the electrical connection between the chip-on-chip film 300 and the liquid crystal display panel 200 can be achieved. In a possible implementation, the binding structure in the liquid crystal display panel 200 and the connecting structure in the chip-on-chip film 300 can be bonded by an anisotropic conductive film (English: Anisotropic Conductive Film; abbreviated as: ACF), and the anisotropic conductive film can not only achieve the electrical connection between the liquid crystal display panel 200 and the chip-on-chip film 300, but also ensure that the liquid crystal display panel 200 and the chip-on-chip film 300 can be tightly connected. In the present application, the display device may also include: a driving chip ( Figure 3 The driving chip can be packaged by using the chip-on-film 300 in the display device. Since the chip-on-film 300 can be electrically connected to the liquid crystal display panel 100, the driving chip in the display device can be electrically connected to the liquid crystal display panel 100 through the chip-on-film 300 to control the content displayed on the liquid crystal display panel 200.

[0053] The chip-on-film 300 can also be connected to the side of the backlight module 100 away from the liquid crystal display panel 200. For example, after the chip-on-film 300 is electrically connected to the liquid crystal display panel 200, the chip-on-film 300 can be bent, so that the bent chip-on-film 300 can be bonded to the side of the backlight module 100 away from the liquid crystal display panel 200 by double-sided tape. In the present application, after the chip-on-film 300 is bonded to the side of the backlight module 100 away from the liquid crystal display panel 200, the driver chip encapsulated by the chip-on-film 300 is located on the side of the backlight module 100 away from the liquid crystal display panel 200. In this way, the frame in the display device does not need to block the driver chip, and the width of the frame of the display device can be reduced, thereby improving the screen-to-body ratio of the display device.

[0054] In the embodiment of the present application, the backlight module 100 in the display device may include: a frame 101, and a side-entry light source 102, a light guide plate 103, a reflective strip 104, a light absorption strip 105 and an optical film located in the frame 101.

[0055] The light emitting surface of the light source 102 may face the side of the light guide plate 103. In the present application, the light emitted by the light source 102 may be homogenized by the light guide plate 103 and then emitted from the side of the light guide plate 103 close to the liquid crystal display panel 200.

[0056] The optical film is located on the light guide plate 103 .

[0057] The reflective strip 104 may be located at a side of the frame 101 close to the light source 102, and the reflective strip 104 may be located between the optical film and the light guide plate 103. The reflective strip 104 may be connected to the optical film.

[0058] The light absorbing strip 105 can be located on a side of the frame 101 close to the light source 102, and the light absorbing strip 105 can be located on a side of the optical film away from the reflective strip 104. The light absorbing strip 105 is disposed separately from the diffuser 106. That is, there is no bonding relationship between the light absorbing strip 105 and the optical film.

[0059] For example, the optical film may include: a diffuser 106 located on the light guide plate 103, and in a possible implementation, the diffuser 106 may be in contact with the light guide plate 103. The reflective strip 104 may be located between the diffuser 106 in the optical film and the light guide plate 103, and the reflective strip 104 and the diffuser 106 may be connected by bonding. The light absorbing strip 105 may be located on a side of the diffuser 106 in the optical film away from the reflective strip 104, and the light absorbing strip 105 is separately arranged from the diffuser 106.

[0060] In an embodiment of the present application, after the chip-on-chip film 300 in the display device is bent, the chip-on-chip film 300 can be bonded to the side of the frame 101 in the backlight module 100 away from the liquid crystal display panel 100, and the light source 102 in the backlight module 100 is located in the frame 101 on the side close to the chip-on-chip film 300.

[0061] In this case, please refer to Figure 4 , Figure 4 yes Figure 3 The force analysis diagram of the display device is shown. After the chip-on-chip film 300 in the display device is bent, the bent portion of the chip-on-chip film 300 has a certain rebound force. Under the action of the rebound force, the portion of the frame 101 in the backlight module 100 that is bonded to the chip-on-chip film 300 will be subjected to the tension of the chip-on-chip film 300. Under the action of the tension F, the portion of the frame 101 that is bonded to the chip-on-chip film 300 will displace in the direction of the tension F. At this time, the light source 102 in the frame 101 and the portion of the light guide plate 103 close to the light source 102 will follow the displacement of the frame 101 and will also displace in the direction of the tension F. The light absorption strip 105 usually needs to be aligned with the light shielding strip ( Figure 3 The light absorbing strip 105 is bonded to the substrate 106 (not marked in the figure), so the light absorbing strip 105 will move in the opposite direction of the pulling force.

[0062] In the present application, since there is no bonding relationship between the light absorbing strip 105 and the diffuser 106, and there is a bonding relationship between the reflective strip 104 and the diffuser 106, the diffuser 106 will not follow the displacement of the light absorbing strip 105 and move in the opposite direction of the pulling force F. Under the action of gravity, the diffuser 106 and the light absorbing strip 105 will move together with the part of the light guide plate 103 close to the light source 102 in the direction of the pulling force F. In this way, it can be ensured that the light guide plate 103 and the diffuser 106 will not separate, and then ensure that there is always a contact relationship between the two, effectively reducing the probability of light emitted by the light source 102 in the backlight module 100 leaking from the two, thereby improving the light emitting effect of the backlight module 100, and ensuring that the display effect of the display device is good.

[0063] like Figure 1 As shown, since the black rubber strip 024 is located on a side of the frame 021 close to the light source 022 , part of the light emitted by the light source 022 may be absorbed by the black rubber strip 024 , resulting in lower light extraction efficiency of the light source 022 in the backlight module 02 .

[0064] In the embodiment of the present application, Figure 5 As shown, Figure 5 yes Figure 3 The light path diagram in the light guide plate in the display device is shown. Since the reflective strip 104 in the backlight module 100 in the present application is close to the light source 102 relative to the light absorbing strip 105, the light emitted by the light source 102 will not be directly absorbed by the light absorbing strip 105, but will be reflected multiple times by the reflective strip 104 to disperse the light emitted by the light source 102 and then emit it from the side of the light guide plate 103 close to the liquid crystal display panel 200. The probability of the light emitted by the light source 102 being directly absorbed by the light absorbing strip 105 is effectively reduced, the light emitting efficiency of the light source 102 is improved, and the light emitting effect of the backlight module 100 is further improved.

[0065] In summary, the display device provided by the embodiment of the present application includes: a backlight module, a liquid crystal display panel and a chip-on-chip film. The backlight module may include: a frame, and a side-entry light source, a light guide plate, a reflective strip, a light absorbing strip and an optical film located in the frame. Since there is no bonding relationship between the light absorbing strip and the diffuser in the optical film, and there is a bonding relationship between the reflective strip and the diffuser in the optical film, after the chip-on-chip film is bent and bonded to the side of the frame in the backlight module away from the liquid crystal display panel, under the action of the rebound force of the bent part of the chip-on-chip film, the diffuser will not move with the displacement of the light absorbing strip, but will move with the light absorbing strip following the displacement of the light guide plate. In this way, it can be ensured that the light guide plate and the diffuser will not separate, and that there is always a contact relationship between the two, which effectively reduces the probability of light emitted by the light source in the backlight module leaking between the two, thereby improving the light output effect of the backlight module. Furthermore, the display device does not need to redesign the internal structure, and only introduces a new reflective strip in the backlight module, thereby effectively reducing the manufacturing cost of the display device. Since the reflective strip is closer to the light source than the light absorbing strip, part of the light emitted by the light source will not be directly absorbed by the light absorbing strip, but will be reflected multiple times by the reflective strip, so that the light emitted by the light source is dispersed and emitted from the side of the light guide plate close to the liquid crystal display panel, effectively reducing the probability of the light emitted by the light source being directly absorbed by the light absorbing strip, improving the light emitting efficiency of the light source, further improving the light emitting effect of the backlight module, and ensuring a good display effect of the display device.

[0066] Optional, please refer to Figure 6 , Figure 6 1 is a schematic diagram of the film structure of another display device provided in an embodiment of the present application. A side of the frame 101 in the backlight module 100 close to the light source 102 has a groove 101a. A side of the reflective strip 104 in the backlight module 100 away from the light guide plate 103 can be connected to the side wall of the groove 101a. For example, a side of the reflective strip 104 away from the light guide plate 103 can be connected to the side wall of the groove 101a by bonding.

[0067] In this case, the side of the reflective strip 104 away from the light guide plate 103 can be bonded not only to the diffuser 106, but also to the side wall of the groove 101a in the frame 101. In this way, the diffuser 106 can be prevented from moving in a direction parallel to the diffuser 106, thereby effectively improving the stability of the diffuser 106 in the backlight module 100 and further improving the light output effect of the backlight module 100.

[0068] In the present application, the frame 101 in the backlight module 100 in the display device further has a back plate 101 b , through which the light guide plate 103 in the backlight module 100 can be effectively supported.

[0069] In the embodiment of the present application, the side of the reflective strip 104 in the backlight module 100 close to the light guide plate 103 is separated from the light guide plate 103, that is, there is no bonding relationship between the reflective strip 104 and the light guide plate 103, that is, no adhesive is provided between the reflective strip 104 and the light guide plate 103. Since the adhesive easily forms a focusing effect, it will destroy the optical path of the light emitted by the light source 102 when it is transmitted in the light guide plate 103. Therefore, when no adhesive is provided between the reflective strip 104 and the light guide plate 103, the light emitting effect of the backlight module 100 can be further improved.

[0070] For example, the reflective strip 104 can be a white adhesive strip with a single-sided tape 104a, and the single-sided tape 104a is located on the side of the white adhesive strip away from the light guide plate 103, the white adhesive strip can be bonded to the diffuser 106 through the single-sided tape 104a, and the white adhesive strip can be bonded to the side wall of the groove 101a in the frame 101 through the single-sided tape 104a. It should be noted that the embodiment of the present application is schematically described by taking the reflective strip 104 as a white adhesive strip as an example. In other optional implementations, the reflective strip 104 can also be other types of reflective structures, for example, the reflective strip 104 is a strip-shaped mirror reflective structure, or the reflective strip 104 is a strip-shaped metal reflective structure with an insulating layer, which is not limited in the embodiment of the present application.

[0071] In the embodiment of the present application, the optical film in the backlight module 100 may include: a diffuser 106 located on the light guide plate 103, and the reflective strip 104 in the backlight module 100 may be located between the diffuser 106 and the light guide plate 103. The optical film may also include: two layers of brightness enhancement sheets 107 located on a side of the diffuser away from the light guide plate 103, and the two layers of brightness enhancement sheets 107 need to be stacked on the diffuser 106.

[0072] Optionally, the diffuser 106 in the backlight module 100 has a strip-shaped light-absorbing structure 106a on one side close to the light source 102. The light-absorbing structure 106a in the diffuser 106 can contact the reflective strip 104 in the backlight module 100. In this way, when the reflective strip 104 in the backlight module 100 is a white rubber strip, although the reflective strip 104 can reflect most of the light emitted by the light source 102, a small amount of light will be transmitted through the reflective strip 104, and this part of the light that is transmitted can be absorbed by the light-absorbing structure 106a in the diffuser 106, effectively avoiding the light leakage phenomenon of the light source 102.

[0073] For example, the light absorption structure 106 a in the diffuser 106 may be screen-printed black ink. Thus, the screen-printed black ink may be printed on a side of the diffuser 106 close to the light source 102 using a screen printing process to form the light absorption structure 106 a in the diffuser 106 .

[0074] In the embodiment of the present application, the light absorption structure 106a in the diffuser 106 and the reflective strip 104 in the backlight module 100 are both in strip shape, and the width direction of the strip-shaped light absorption structure 106a is parallel to the width direction of the reflective strip 104. The width of the strip-shaped light absorption structure 106a may be greater than the width of the contact area between the diffuser 106 and the reflective strip 104.

[0075] In this case, the strip-shaped light absorption structure 106a in the diffuser 106 can not only contact the reflective strip 104, but also contact the light guide plate 103. In this way, the strip-shaped light absorption structure 106a in the diffuser 106 can not only absorb the light projected from the reflective strip 104, but also absorb the light emitted from the area of ​​the light guide plate 103 that is not in contact with the diffuser 106 and the reflective strip 104.

[0076] In this application, if Figure 6 As shown, the backlight module 100 in the display device may further include a reflector 108 located on the side of the light guide plate 103 away from the diffuser 106. The reflector 108 can reflect the light transmitted from the light guide plate 103 from the side of the light guide plate 103 close to the diffuser 106 out of the light guide plate 103.

[0077] In the embodiments of the present application, Figure 6 As shown, the light source 102 in the backlight module 100 may include: a flexible circuit board 1021, and a plurality of lamp bodies 1022 located on the flexible circuit board 1021. In the present application, each lamp body 1022 may be a light emitting diode (English: Light Emitting Diode; abbreviated as: LED). The light emitting surface of each lamp body 1022 in the light source 102 may be connected to the side of the light guide plate 103. The flexible circuit board 1021 in the light source 102 may be connected to the side of the light guide plate 103 away from the diffuser 106. In this way, the light emitting surface of each lamp body 1022 and the side of the light guide plate 103 may be connected by bonding, and the flexible circuit board 1021 and the side of the light guide plate 103 away from the diffuser 106 may also be connected by bonding.

[0078] It should be noted that the flexible circuit boards in the light sources of the currently common backlight modules are all bonded to the front of the light guide plate (i.e., the light emitting surface of the light guide plate). Therefore, an area for bonding the flexible circuit board needs to be reserved on the front of the light guide plate, and this area needs to be blocked by the frame in the display device, resulting in a larger width of the frame in the display device. In the embodiment of the present application, when the flexible circuit board 1021 is bonded to the side of the light guide plate 103 away from the diffuser 106, there is no need to reserve an area on the front of the light guide plate 103 for bonding the flexible circuit board 1021, which can further reduce the width of the frame of the display device, thereby further improving the screen-to-body ratio of the display device.

[0079] Optional, such as Figure 6 As shown, the backlight module 100 in the display device may further include: a light shielding glue 109 located between the frame 101 and the liquid crystal display panel 200. The light shielding glue 109 may be a double-sided adhesive tape, so that one side of the light shielding glue 109 may be bonded to the liquid crystal display panel 200, and the other side of the light shielding glue 109 may be bonded to the light absorbing strip 105. For example, the light absorbing strip 105 may be a black adhesive strip without adhesive tape, so that after the black adhesive strip is bonded to the light shielding glue 109, the light that has not passed through the two layers of prism sheets 107 in the backlight module 100 can be absorbed by the black adhesive strip, so that it can be ensured that the light emitted from the backlight module 100 can pass through the light guide plate 103, the diffuser 106 and the two layers of prism sheets 107 in sequence.

[0080] In the present application, one side of the light shielding adhesive 109 can also be bonded to the end surface of the frame 101 close to the liquid crystal display panel 200. In this way, the connection between the backlight module 100 and the liquid crystal display panel 200 can be achieved through the light shielding adhesive 109.

[0081] In the embodiment of the present application, the liquid crystal display panel 200 in the display device generally comprises: an array substrate 201 and a color filter substrate 202 arranged opposite to each other, a liquid crystal layer ( Figure 6 (not shown), as well as a first polarizer 203 located on the light incident side of the liquid crystal display panel 200 and a second polarizer 204 located on the light emitting side of the liquid crystal display panel 200.

[0082] Since the area of ​​the first polarizer 203 located on the light incident side of the liquid crystal display panel 200 is relatively small (usually larger than the area of ​​the display area of ​​the display device), and the first polarizer 203 is bonded to the light shielding glue 109 in the backlight module 100. Therefore, in order to improve the firmness of the connection between the backlight module 100 and the liquid crystal display panel 200, the backlight module 100 may include: a buffer foam 110 located between the light shielding glue 109 and the liquid crystal display panel 200, and the light shielding glue 109 may be bonded to the liquid crystal display panel 200 through the buffer foam 110. For example, the buffer foam 110 has a single-sided tape on one side close to the liquid crystal display panel 200, and the buffer foam 110 may be bonded to the array substrate 201 in the liquid crystal display panel 200 through the single-sided tape. The buffer foam 110 can increase the bonding area between the light shielding glue 110 and the liquid crystal display panel 200 , thereby improving the bonding firmness between the liquid crystal display panel 200 and the backlight module 100 .

[0083] In summary, the display device provided by the embodiment of the present application includes: a backlight module, a liquid crystal display panel and a chip-on-chip film. The backlight module may include: a frame, and a side-entry light source, a light guide plate, a reflective strip, a light absorbing strip and an optical film located in the frame. Since there is no bonding relationship between the light absorbing strip and the diffuser in the optical film, and there is a bonding relationship between the reflective strip and the diffuser in the optical film, after the chip-on-chip film is bent and bonded to the side of the frame in the backlight module away from the liquid crystal display panel, under the action of the rebound force of the bent part of the chip-on-chip film, the diffuser will not move with the displacement of the light absorbing strip, but will move with the light absorbing strip following the displacement of the light guide plate. In this way, it can be ensured that the light guide plate and the diffuser will not separate, and that there is always a contact relationship between the two, which effectively reduces the probability of light emitted by the light source in the backlight module leaking between the two, thereby improving the light output effect of the backlight module. Furthermore, the display device does not need to redesign the internal structure, and only introduces a new reflective strip in the backlight module, thereby effectively reducing the manufacturing cost of the display device. Since the reflective strip is closer to the light source than the light absorbing strip, part of the light emitted by the light source will not be directly absorbed by the light absorbing strip, but will be reflected multiple times by the reflective strip, so that the light emitted by the light source is dispersed and emitted from the side of the light guide plate close to the liquid crystal display panel, effectively reducing the probability of the light emitted by the light source being directly absorbed by the light absorbing strip, improving the light emitting efficiency of the light source, further improving the light emitting effect of the backlight module, and ensuring a good display effect of the display device.

[0084] The present application also provides a backlight module, which can be the backlight module 100 in the display device in the above embodiment. Figure 7 , Figure 7 1 is a schematic diagram of a film structure of a backlight module provided in an embodiment of the present application. The backlight module 100 may include:

[0085] A frame 101, and a side-entry light source 102, a light guide plate 103, a reflection strip 104, a light absorption strip 105 and an optical film located in the frame 101.

[0086] The light emitting surface of the light source 102 may face the side of the light guide plate 103. The optical film is located on the light guide plate 103. For example, the optical film may include: a diffuser 106 located on the light guide plate 103, and the diffuser 106 may contact the light guide plate 103.

[0087] The reflective strip 104 may be located at a side of the frame 101 close to the light source 102, and the reflective strip 104 may be located between the diffuser 106 and the light guide plate 103. The reflective strip 104 and the diffuser 106 may be bonded.

[0088] The light absorbing strip 105 can be located on a side of the frame 101 close to the light source 102, and the light absorbing strip 105 can be located on a side of the diffuser 106 away from the reflective strip 104. The light absorbing strip 105 is disposed separately from the diffuser 106. That is, there is no bonding relationship between the light absorbing strip 105 and the diffuser 106.

[0089] Optionally, a surface of the reflective strip 103 close to the light guide plate 103 may be disposed separately from the light guide plate 103 .

[0090] Optionally, a side of the frame 101 close to the light source 102 has a groove 101 a , and a side of the reflective strip 104 away from the light guide plate 103 can be bonded to a side wall of the groove 101 a .

[0091] Optionally, the frame 101 further has a back plate 101 b , through which the light guide plate 103 in the backlight module 100 can be effectively supported.

[0092] Optionally, the reflective strip 104 may be a white adhesive strip with a single-sided adhesive tape 104 a , and the single-sided adhesive tape 104 a is located on a side of the white adhesive strip away from the light guide plate 103 , and the white adhesive tape 104 a is bonded to the diffuser 106 .

[0093] Optionally, the backlight module 100 may further include: two layers of brightness enhancement sheets 107 located on a side of the diffusion sheet away from the light guide plate 103 .

[0094] Optionally, the diffuser has a strip-shaped light absorption structure 106 a on one side close to the light source 102 .

[0095] Optionally, the width of the light absorption structure 106 a is greater than the width of the contact area between the diffusion sheet and the reflection strip 104 .

[0096] Optionally, the light absorbing structure 106a may be silk-screen black ink.

[0097] Optionally, the backlight module 100 may further include: a reflective sheet 108 located on a side of the light guide plate 103 away from the diffuser 106 .

[0098] Optionally, the backlight module 100 may further include: a light shielding glue 109 located on a side of the frame 101 away from the light guide plate 103 , one side of the light shielding glue 109 is used to bond with the liquid crystal display panel, and the other side of the light shielding glue 109 is bonded with the light absorption strip 105 .

[0099] Optionally, the backlight module 100 may further include: a buffer foam 110 located on a side of the light shielding glue 109 away from the frame 101 , and the light shielding glue 109 is used to bond with the liquid crystal display panel through the buffer foam 110 .

[0100] Optionally, the light source 102 includes: a flexible circuit board 1021, and a plurality of lamp bodies 1022 located on the flexible circuit board 1021, the light emitting surface of the lamp body 1022 can be bonded to the side of the light guide plate 103, and the flexible circuit board 1022 is bonded to the side of the light guide plate 103 away from the diffuser 106.

[0101] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, the working principles and connection relationships of the various structures in the backlight module described above can refer to the corresponding contents in the embodiment of the structure of the aforementioned display device, and will not be repeated here.

[0102] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0103] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0104] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A display device, characterized in that: include: Liquid crystal display panels, backlight modules and chip-on-film; The chip-on-film is electrically connected to the liquid crystal display panel and is connected to a side of the backlight module away from the liquid crystal display panel; The backlight module comprises: a frame, and a side-entry light source, a light guide plate, a reflection strip, a light absorption strip, an optical film and a reflection sheet located in the frame; Wherein, the light emitting surface of the light source faces the side surface of the light guide plate, and the optical film is located on the light guide plate; The reflective strip is located on a side of the frame body close to the light source, and is located between the optical film and the light guide plate, and is connected to the optical film; The light absorbing strip is located on a side of the frame body close to the light source and on a side of the optical film away from the reflecting strip, and is disposed separately from the optical film; The reflective sheet is located at a side of the light guide plate away from the optical film.

2. The display device according to claim 1, characterized in that The reflective strip is disposed separately from the light guide plate at a surface close to the light guide plate.

3. The display device according to claim 1, characterized in that A groove is provided on one side of the frame body close to the light source, and a side of the reflection strip away from the light guide plate is connected to a side wall of the groove.

4. The display device according to any one of claims 1 to 3, characterized in that: The reflective strip is a white adhesive strip with a single-sided adhesive tape, and the single-sided adhesive tape is located on a side of the white adhesive strip away from the light guide plate, and the single-sided adhesive tape is bonded to the optical film.

5. The display device according to claim 1, characterized in that The optical film comprises: a diffusion sheet located on the light guide plate, the reflection strip is located between the diffusion sheet and the light guide plate, and the optical film further comprises: two layers of brightness enhancement sheets located on a side of the diffusion sheet away from the light guide plate.

6. The display device according to claim 5, characterized in that: The side of the diffusion sheet close to the light source has a strip-shaped light absorption structure.

7. The display device according to claim 6, characterized in that: The width of the light absorption structure is greater than the width of the contact area between the diffusion sheet and the reflection strip.

8. The display device according to any one of claims 5 to 7, characterized in that: The backlight module further includes: a light shielding glue located between the frame and the liquid crystal display panel, one side of the light shielding glue is bonded to the liquid crystal display panel, and the other side of the light shielding glue is bonded to the light absorption strip.

9. The display device according to any one of claims 5 to 7, characterized in that: The light source comprises: a flexible circuit board and a plurality of lamp bodies on the flexible circuit board, the light emitting surfaces of the lamp bodies are connected to the side surfaces of the light guide plate, and the flexible circuit board is connected to a side of the light guide plate away from the optical film.

10. A backlight module, characterized in that: include: A frame, and a side-entry light source, a light guide plate, a reflection strip, a light absorption strip, an optical film, and a reflection sheet located in the frame; Wherein, the light emitting surface of the light source faces the side surface of the light guide plate, and the optical film is located on the light guide plate; The reflective strip is located on a side of the frame body close to the light source, and is located between the optical film and the light guide plate, and is connected to the optical film; The light absorbing strip is located on a side of the frame body close to the light source and on a side of the optical film away from the reflecting strip, and is disposed separately from the optical film; The reflective sheet is located at a side of the light guide plate away from the optical film.

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