Wireless seismic acquisition node and method

Abstract

Disclosed is a seismic node for collecting seismic data, the seismic node comprising: a base (310) configured to define a chamber (312) having an open face; a main electronic board (510) having a processor, the main electronic board being placed inside the chamber; a battery pack (530) configured to supply power to the main electronic board and placed inside the chamber; and a digital cover (320) and a sensor device, the digital cover being attached to the open side of the base to seal the chamber, the sensor device being located inside the chamber and attached to the wall of the base to form a digital field unit; or an analog cover and an analog sensor, the analog cover being attached to the open side of the base to seal the chamber, the analog sensor being electrically attached to the analog cover to form an analog field unit.

Description

Technical Field

[0001] Embodiments of the subject matter disclosed herein generally relate to wireless seismic acquisition nodes and, more particularly, to the housing of a wireless seismic acquisition node that can be selectively configured as a digital field unit or an analog field unit. Background Art

[0002] Land seismic data acquisition and processing generate a profile (image) of the subsurface geophysical structure of the earth, known as the subsurface. While such a profile does not provide the exact location of hydrocarbon reservoirs, it indicates to trained personnel in the field the presence or absence of such reservoirs. Thus, providing a high-resolution image of the subsurface geophysical structure (or the structure beneath the earth's surface) is an ongoing process.

[0003] Reflection seismology is a geophysical exploration method used to determine the subsurface characteristics of the earth, which is particularly useful in the oil and gas industry. Land reflection seismology is based on the use of a controlled energy source that sends energy into the earth. By measuring the time it takes for the reflections to return to multiple receivers, the depth of the features causing such reflections can be evaluated. These features may be related to subsurface hydrocarbon deposits.

[0004] A seismic acquisition system for recording the reflections of seismic waves from geological structures present in the subsurface uses seismic nodes. Seismic nodes are capable of providing good data because they facilitate data acquisition using a wide azimuth geometry. Wide azimuth coverage helps to image beneath complex overburden layers, such as those associated with salt bodies. Additionally, seismic nodes can provide multi-component data, i.e., data related to particle motion along one, two, or three different directions (axes). In one application, in addition to recording particle motion data, a seismic node can also record pressure data. However, pressure data is one-dimensional data, while particle motion data can be three-dimensional.

[0005] Figure 1 An example of a seismic acquisition system using autonomous land nodes is shown. The system is manufactured by the assignee of the present application and is disclosed in U.S. Patent No. 8,547,796, the entire content of which is incorporated herein by reference. System 100 includes a plurality of remote acquisition units (RAUs) 110 distributed over an area of interest 102. Each RAU 110 is configured to communicate indirectly with a general controller 126 that is also located in the area of interest 102. To transfer information from the general controller 126 to the RAU unit 110 or vice versa, an aircraft 124 flies over the RAU unit to communicate directly with the RAU unit. The aircraft 124 can be replaced by any other device (referred to herein as a collector) capable of moving across the area of interest 102 to interact with the RAU unit. The collector 124 then travels to the general controller 126 to exchange information.

[0006] The RAU unit is self-powered by an internal power source such as the battery 120 shown in Figure 2 Each RAU includes a transceiver 122 configured to communicate wirelessly with the aircraft 124. The RAU 110 also includes an analog-to-digital (AD) converter 114 and a memory 116 for storing the recorded seismic information. The AD converter 114 can be configured to perform high-precision conversion of analog signals received from one or more analog sensors 112 (such as geophones). It should be noted that the sensors 112 are located outside the housing 111 of the RAU 110. The memory 116 can be any type of memory. The RAU 110 also includes a time reference component 118, which can be implemented as a GPS receiver capable of deriving an accurate time reference from GPS signals. After the RAU 110 captures and stores the seismic data from the sensors 112, the collector 124 can pass by to collect such data, and then transfer the data collected from all RAU units to the general controller 126.

[0007] However, this and other existing land seismic nodes are large in size, not easy to operate, and require a certain degree of disassembly most of the time in order to access the battery and recharge the battery. In addition, all existing seismic acquisition systems use different housings for digital units and analog units, which requires different manufacturing processes and many different components. In addition, the process of recharging the seismic nodes at the end of a seismic survey is complex because the digital nodes need to be retrieved together and recharged at a single recharging station, while the analog units need to be separated from the digital units and recharged at another recharging station.

[0008] Therefore, there is a need for a single seismic node that is easy to maneuver during deployment or retrieval, does not require disassembly for recharging or transferring its data to a server, and can also be reconfigured into different types of nodes, namely digital nodes or analog nodes, with minimal processing and substantially the same internal components. SUMMARY OF THE INVENTION

[0009] According to one embodiment, there is a seismic node for collecting seismic data, the seismic node including: a base configured to define a chamber having an open face; a main electronic board having a processor, the main electronic board being placed in the chamber; a battery pack configured to supply power to the main electronic board and being placed in the chamber; and a cover configured to be attached to the open side of the base to seal the chamber, the seismic node including:

[0010] a sensor device located in the chamber and attached to a wall portion of the base to form a digital field unit, or

[0011] an analog sensor electrically attached to the cover to form an analog field unit.

[0012] Optionally, the main electronic board includes a global positioning module, a transceiver, and an antenna.

[0013] Optionally, there is no additional transceiver and no additional antenna.

[0014] Optionally, the seismic node further includes a spike removably attached to the base.

[0015] Optionally, the seismic node further includes:

[0016] A shock absorber configured to surround the battery pack;

[0017] A first guide formed in the chamber and configured to receive and guide the main electronic board;

[0018] And

[0019] A second guide formed in the chamber and configured to receive and guide the shock absorber of the battery pack.

[0020] Optionally, the battery pack is below the main electronic board along the direction of gravity.

[0021] Optionally, the cover includes a first internal pin and a second internal pin facing the chamber, and the first internal pin and the second internal pin are configured to engage with corresponding first flexible strips and second flexible strips formed on or attached to the main electronic board.

[0022] Optionally, the cover further includes a first external pin and a second external pin extending outside the chamber, and the first internal pin and the second internal pin are electrically connected to the first external pin and the second external pin respectively.

[0023] Optionally, the sensor device is electrically connected to the main electronic board through a flexible cable.

[0024] Optionally, the sensor device includes a microelectromechanical sensor.

[0025] Optionally, the cover further includes an external pin and an external tubular member facing outside the chamber, and the first internal pin and the second internal pin are electrically connected to the external pin and the external tubular member respectively.

[0026] Optionally, the analog sensor is located outside the chamber, there is no sensor inside the chamber, and the analog sensor is a geophone.

[0027] According to one embodiment, there is provided a seismic acquisition system for collecting seismic data. The seismic acquisition system includes: a digital field unit (DFU) that collects a first set of seismic data; and an analog field unit (AFU) that collects a second set of seismic data. The DFU is formed by the above-mentioned seismic nodes, the AFU is formed by the above-mentioned seismic nodes, and the base of the DFU is the same as the base of the AFU.

[0028] Optionally, the sensor device of the DFU includes a microelectromechanical sensor, and the analog sensor includes a geophone.

[0029] According to one embodiment, there is provided a seismic node for collecting seismic data. The seismic node includes: a base configured to define a chamber having an open face; a main electronic board having a processor, the main electronic board being placed in the chamber; a battery pack configured to supply power to the main electronic board and being placed in the chamber; or a digital cover and a sensor device, the digital cover being attached to the open side of the base to seal the chamber, the sensor being located in the chamber and attached to the wall of the base to form a digital field unit; or an analog cover and an analog sensor, the analog cover being attached to the open side of the base to seal the chamber, the analog sensor being electrically attached to the analog cover to form an analog field unit.

[0030] According to another embodiment, there is a seismic acquisition system for collecting seismic data. The seismic acquisition system includes a digital field unit (DFU) that collects a first set of seismic data and an analog field unit (AFU) that collects a second set of seismic data. The DFU includes a first base and a digital cover, the AFU includes a second base and an analog cover, and the first base is the same as the second base. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] To more fully understand the present invention, reference is now made to the following description taken in conjunction with the accompanying drawings, in which:

[0032] Figure 1 is a schematic diagram of a conventional seismic acquisition system including a plurality of seismic nodes;

[0033] Figure 2 is a schematic diagram of a conventional seismic node;

[0034] Figure 3 is a schematic diagram of a digital node having the same base as the analog base;

[0035] Figure 4A and Figure 4B is a schematic diagram of an analog node having the same base as the digital node;

[0036] Figure 5 is a schematic diagram of various internal components of the digital node;

[0037] Figure 6Schematic diagram of the internal components of a digital node housed in a common base;

[0038] Figure 7 Schematic diagram of a docking module configured to recharge multiple seismic nodes;

[0039] Figure 8 Schematic diagram of a main electronic board placed within a common base for both digital and analog nodes;

[0040] Figure 9 Schematic diagram of the back side of a cover added to the common base of a digital sensor;

[0041] Figure 10 Schematic diagram of the electrical connection between the cover and the main electronic card for a digital node;

[0042] Figure 11A and Figure 11B Schematic diagram of a status indicator attached to the common base;

[0043] Figure 12 Schematic diagram of the back side of the common base, which is shaped to fit particularly well in the operator's hand;

[0044] Figure 13 Schematic diagram of a groove formed between the common base and the cover, which is used to facilitate opening the node when needed;

[0045] Figure 14A and Figure 14B Schematic diagram of a peg added to the common base of a digital node;

[0046] Figure 15 Schematic diagram of the various internal components of an analog node;

[0047] Figure 16 Schematic diagram of a cover added to the common base of an analog node;

[0048] Figure 17A and Figure 17B Schematic diagram of the connection between an external sensor and an analog node;

[0049] Figure 18 Schematic diagram of an analog node attached to an external sensor via a cover;

[0050] Figure 19 Schematic diagram of an analog node attached to another external sensor;

[0051] Figure 20 Flowchart of a method for assembling seismic nodes using a common base regardless of node type; and

[0052] Figure 21Shows a seismic acquisition system including digital nodes and analog nodes. Detailed implementation

[0053] The following description of the embodiments refers to the accompanying drawings. The same reference numerals in different drawings denote the same or similar elements. The following detailed description does not limit the present invention. The scope of the present invention is actually defined by the appended claims. For simplicity, the following embodiments are discussed with respect to the housing of a wireless seismic node that can be reconfigured between an analog field unit and a digital field unit. However, the embodiments to be discussed hereinafter are not limited to wireless digital nodes or analog seismic nodes, but can be applied to wired seismic nodes or other types of nodes.

[0054] References to "one embodiment" or "an embodiment" throughout the specification mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the disclosed subject matter. Thus, the phrases "in one embodiment" or "in an embodiment" appearing throughout the specification are not necessarily referring to the same embodiment. Moreover, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0055] According to an embodiment, the wireless seismic node has a housing consisting of two parts, namely a base (or bottom part) and a cover (top part). The base is configured to be common to an analog field unit (AFU) and a digital field unit (DFU), thus simplifying the manufacturing process of these units. In this regard, the AFU node is configured to record and store analog signals related to seismic data, while the DFU node is configured to record and store digital signals related to seismic data. The analog sensor or digital sensor is located inside or outside the node. In one embodiment, the AFU node has only a seismic sensor outside the housing, while the DFU node has only a seismic sensor (s) inside the housing. In another embodiment, there may be seismic sensors inside or outside the housing. The AFU node and the DFU node differ not only in the types of analog and digital sensors, but also in the plugs of the AFU node and the DFU node that allow communication with the recharge docking module.

[0056] The AFU nodes are configured to connect to one or more sensors located outside the AFU nodes, while the DFU nodes include one or more sensors located inside the housing. In one embodiment, the AFU nodes have only seismic sensors outside the housing, while the DFU nodes have only seismic sensors inside the housing. In another embodiment, there may be seismic sensors located both inside and outside the same housing. The AFU nodes and DFU nodes differ not only in the analog and digital signals stored, but also in the plugs of the AFU nodes and DFU nodes that allow communication with the recharge docking module. Depending on the type of unit implemented, the cover is different and unique for each type of unit. Although most of the internal electronics are shared by the AFU nodes and DFU nodes, the sensors are not. Each of the AFU nodes and DFU nodes is configured to communicate autonomously and wirelessly with external devices such as a server or a collection device, and also to autonomously collect seismic data. Each of the AFU nodes and DFU nodes can be used for land acquisition.

[0057] Now discuss the DFU nodes with reference to the accompanying drawings. Figure 3 The DFU node 300 is shown. The DFU node has a housing 302, a handle 304 (e.g., a cord) attached to the housing 302, and a spike 306 removably attached to the housing 302. The handle 304 is optional and is configured to provide a means for an operator of the node to carry the node. The spike 306 is configured to have a sharp tip 306A for penetrating the ground to achieve a good connection between the ground and the seismic sensor (e.g., a MEMS sensor) located inside the housing.

[0058] The housing 302 is composed of two parts, a base 310 and a cover 320. The cover 320 is attached to the base 310 such that the housing 302 forms a sealed internal chamber 312 (discussed later). It should be noted that the chamber 312 is formed within the base 310 and has an open side 312'. When the cover 320 is attached to the base 310, the cover 320 closes the open side 312' and seals the chamber 312. The cover 320 can be attached to the base 310 in various ways. Figure 3 The illustrated embodiment shows the cover attached to the base 310 with screws 322. Any type of screw can be used. In this embodiment, four screws are used. However, those skilled in the art will understand that more or fewer screws can be used. It should be noted that the handle 304 is attached to the base 310, rather than to the cover 320, because the same base is used for other types of sensors, as discussed later. Additionally, the spike 306 is removably attached to the base, and the spike is not required for the AFU nodes.

[0059] In this embodiment, the cover member 320 has only one element, namely the external connection plug 330. The external connection plug 330 has a first pin 332 and a second pin 334 for electrical connection to the docking module. The first pin 332 and the second pin 334 are surrounded by a protective skirt 336 which is configured to not only absorb shock but also prevent water from entering the chamber 312. The protective skirt 336 can be made of rubber or a similar material. In addition, the cover member 320 has a rigid band 338 formed around the protective skirt 336 to prevent any accidental shock to the pins 332 and 334.

[0060] The base 302 is shaped as a box which has a groove-shaped recess 340 formed around three sides of the box. The recess 340 is shaped to conform to a human hand, so that an operator of the node can easily handle the node. This feature implies the size (less than 20 cm) of the base 310 for fitting an operator's hand. Thus, during the recharging process, the node is easy to handle.

[0061] Figure 4A An AFU node 400 is shown which shares the same base 310 as the DFU node 302. Thus, the AFU node 400 has a housing 402 which includes the base 310 and another cover member 420. The handle 304 is the same handle as that of the DFU node 300. The base 310 has the same recess 340 to facilitate easy operation by the operator. The cover member 420 is attached to the base by the same screw 322 as that of the DFU node 300. However, the external connection plug 430 of the AFU node is different from the external connection plug 330 of the DFU node. For example, the external connection plug 430 has an external thread 431, the reason for which will be discussed later. Figure 4B The housing 402 is shown to have a receiving unit 350 formed in the base 310 and the receiving unit is configured to receive the peg 306. The receiving unit 350 can have threads 352 which mate with corresponding threads on the peg 306, such that the peg 306 can be attached to or removed from the base as required. For the AFU unit 400, the peg is not required, thus, Figure 4A and Figure 4B the housing 402 is shown without the peg 306. Thus, the peg 306 can be added or removed relative to the base 310 as required.

[0062] Figure 5Shows an exploded view of the interior of the housing 302 of node 300 and various electronic and non - electronic components stored by the housing. Regarding the interior of the base 310, it should be noted that a chamber 312 that is open only at one face is formed inside the base 310, and the chamber 312 is configured such that when the cover member 320 is attached to the base 310, it completely covers the chamber. As shown, inside the chamber 312, there is a first guide member 314 that extends linearly along the first direction X. The first guide member 314 can be made of the same material as the base 310 or a different material. In one embodiment, both the first guide member 314 and the base 310 are made of plastic or a composite material. However, in another embodiment, the first guide member 314 and the base 310 are made of metal.

[0063] The chamber 312 may further include a second guide member 316 that can extend parallel to the first guide member 314. Both the first guide member and the second guide member extend along opposite sides (or faces) of the base 310, and the first guide member and the second guide member are configured to guide various components. For example, the first guide member 314 is configured to guide the main electronic board 510 into the chamber 312, while the second guide member 316 is configured to guide the battery pack 530 into the chamber 312. The main electronic board 510 includes a printed circuit board on which one or more electronic components 512 are added. The electronic components 512 can be an integrated circuit 514 that serves as a controller, a storage device 515 configured to store the collected seismic data, an antenna 516, a transceiver 517, and a GPS module 518. Other electronic devices may be included if necessary. The antenna 516 is connected to the transceiver 517, and the transceiver 517 is configured to establish wireless communication with the collector, while the GPS module 518 receives GPU signals that may include timestamp and location information. In one application, the node 300 includes a single transceiver and a single antenna to communicate with other nodes and with the collector device. As will be discussed later, the processor 514 can coordinate one or more functions of the node 300.

[0064] The entire main electronic board 510 can be attached to dedicated buffers or damping elements 520A and 520B, and this assembly is inserted into the chamber 312 together along the first guide 314. In other words, the damping elements sandwich the main electronic board, and only the damping elements contact the first guide. Thus, the damping elements 520A and 520B are in direct contact with the first guide, while the main electronic board does not directly contact the first guide. The damping elements are made of a damping material, that is, a material capable of absorbing the kinetic energy caused by an impact and converting the kinetic energy into other forms of energy (such as heat). Examples of such materials are rubber or soft plastic or composite materials. The damping elements can be implemented as beams fixed at both ends, but allowing the rest of the beam to oscillate to attenuate the impact. The purpose of the damping elements is to absorb any kinetic energy that might otherwise be transmitted to the main electronic board (e.g., if the node drops to the ground) or from internal vibrations caused by the transportation of the node, so that the electronic devices on the main electronic board are not damaged. In this way, there is no hard point contact between the main electronic board and the base and between the main electronic board and the molded parts of the housing. The damping elements have a second purpose, which relates to the alignment of the main electronic board with the external connection plug 330, which will be discussed later.

[0065] Figure 6 A base 310 accommodating the main electronic board 510 and the battery pack 530 is shown, with the main electronic board and the battery pack both attached to guides within the chamber 312. Also shown is the sensor device 540 directly attached to the wall of the base 312. It should be noted that the battery pack 530 is much smaller than the batteries previously used in seismic nodes. For example, a typical battery previously used in seismic nodes included 10 unit cells, while the battery pack 530 can include only 4 unit cells. This is because the main electronic board 510 has been optimized to include fewer (less) electronic components and / or low-power processing elements. In addition, the processor 514 is a low-power microcontroller, and the power efficiency of all electronic components has been improved. Additionally, only one transceiver is used to perform the following two tasks: (1) multi-hop routing with other nodes and (2) local data exchange with the collector device (i.e., long-distance and medium-distance operations), which also requires less energy. The combination of all these factors allows the DFU node 300 or the AFU node 400 to use a battery smaller than that of existing seismic nodes.

[0066] Figure 6It is also shown that the main electronic board 510 has two or more connection strips 522 located on one side, such that when the cover member 320 or 420 is attached to the base 310, the connection strips will automatically engage with the corresponding electrical connectors of the external connection plugs 330 or 430. The connection strips 522 provide electrical continuity with the flats of contacts of the cover member by absorbing any misalignment between the relative positions of the contact surfaces in any of the six degrees of freedom. These misalignments can come from several sources: the relative position of the cover member with respect to the housing or the mobility required for shock absorption of the electronic components of the board with respect to the housing or the cover member. Regardless of these misalignments, the support force (or support "against") of the connection strips ensures the transfer of charging (power) and data exchange currents. The shape of the strip can distribute the deformation to maintain the stiffness of the strip, and the slots in the strip maximize the contact surface with the contact flats. On the side opposite the strip, the cover member has a flexible support (or flexible "against") to ensure the position of the board and thus ensure electrical contact. In one application, the strip 522 is flexible to eliminate play when the pins of the cover member contact the strip and to reduce the problem of misalignment when engaging (the cover member is fixed to the base).

[0067] Figure 6 It is also shown that the second guide 316 can include an additional guide 316', which is configured to support the weight of the battery pack 530. The additional guide 316' provides a rigid bottom tray, which is configured to withstand the impact of the node with the ground and also ensure good coupling. The rigidity of the additional guide 316' can be used to eliminate vibration modes. The additional guide 316' can be constructed together with the second guide 316 to ensure that the battery pack 530 is clamped or snapped in place without the need for additional fastening devices. In Figure 6 It can also be seen that a hole 610 is formed on one side of the base 310. This hole can be used to attach a cord or line 304, such that the entire node 300 can be easily transported during on-site deployment.

[0068] Returning to Figure 5 , the battery pack 530 has its own shock absorbers 532A and 532B attached to the battery pack, and these shock absorbers engage with the second guide 316, as Figure 6 shown, to fix the battery pack to the interior of the base 310. The shock absorbers 532A and 532B not only protect the battery 530 from various unwanted shocks (e.g., the node falling to the ground) and internal vibrations during transportation, but also allow the size of the battery pack to expand due to the charging / discharging process and / or temperature. Figure 5 and Figure 6 both show an electrical connection portion 534, which electrically connects the battery pack 530 to the main electronic board 510 for power supply. In Figure 5 and Figure 6In the illustrated embodiment, the electrical connection portion 534 is fixedly attached to the battery pack 530 and removably connected to the main electronic board 510 via the connector 536. It should be noted that by placing the battery pack 530 at the bottom of the base 310, since the second guide member 316 is located below the first guide member 314, the center of gravity of the entire node is lowered, which is desirable because it makes the node more stable and less likely to fall towards the ground when the spike 306 is not fully embedded in the ground.

[0069] Figure 5 Also shown is a sensor device 540 configured to be attached to the base 310 via screws 542. This is because the sensor 544 on the board 546 attached to the sensor device 540 needs to detect parameters related to particle motion, and when there is a good connection between the sensor and the base 310, particle motion can be detected better. It should be noted that in this embodiment, the board 546 includes an analog-to-digital converter for converting the analog signals recorded by the sensor 544 into digital signals. Therefore, the signal sent from the sensor device 540 to the main electronic board 510 is a digital signal. For this reason, the sensor device 540 is also referred to here as a digital sensor device. The particles on the ground where the spike 306 is placed vibrate due to the generated seismic waves. The vibrations of these particles are transmitted to the sensor device 540 through the spike and the base 310. In order to accurately record these particle vibrations, a good connection between the sensor 544 and the base 310 is necessary. The sensor 544 is configured to detect at least one of displacement, velocity, or acceleration of the ground particles. In one embodiment, the sensor 544 is a microelectromechanical system (MEMS) configured to determine acceleration along a single axis or three mutually perpendicular axes. Any other type of sensor can be used to determine parameters related to particle vibration. The sensor device 540 is electrically connected to the main electronic board 510 via a removable electrical connection portion 550. In this embodiment, the electrical connection portion 550 is fixedly attached to the main electronic board and removably attached to the sensor device. However, it can also be the opposite, or both ends can be detachable. Therefore, when the assembly is modified as discussed later to make the assembly an AFU node, the sensor device 540 is removed and the electrical connection portion 550 is not attached to the sensor or can be removed together. In one embodiment, if the electrical connection portion 550 is manufactured to be removably attached to the main electronic board, the electrical connection portion of the AFU node can also be removed.

[0070] Figure 5Also shown is a seal 560 placed between the cover 320 and the base 310 for sealing the chamber 312, thereby preventing water or particles from entering the chamber 312 from outside the node. In this regard, it should be noted that these nodes are sometimes placed in wet or sandy locations, and thus all these potential damaging factors need to be kept away from the electronics of the node. Additionally, Figure 5 shown is that the node 300 may optionally include a desiccant material 570 attached to the cover 320 and an RFID tag 572 also attached to the cover 320. The desiccant material 570 is used to absorb any moisture that may form inside the chamber 312, while the RFID tag 572 provides a unique ID for the node, making it easier to identify which node is placed where. It should be noted that during land seismic surveys, hundreds if not thousands (or even tens of thousands or hundreds of thousands) of nodes may be placed over the area of interest, and keeping track of all these nodes is quite a task. By tagging each node with an RFID having a unique ID, the task of identifying the nodes is made easier.

[0071] Figure 5 Also shown is that a nail 306 may be used together with a seal 307 to attach to the outside of the base 310. To prevent the nail 306 from detaching from the base 310, the nail 306 may be fixed to a receiving unit 350 by a screw 309 (see Figure 3 ). Additionally, Figure 5 and Figure 6 shown is that a soft-molded protective cover 311 may be provided on a portion of the base 310 to further prevent any unwanted kinetic energy that may be transferred to the node due to a fall, thereby protecting the electronic components from shock. In one embodiment, as Figure 6 shown, the end 313 of the soft-molded protective cover 311 may be overmolded to further enhance this protection.

[0072] Figure 5 Also shown is that the cover 320 may have notches or grooves 324 formed on opposite sides, such that the node may be attached to a docking station 702 from the Figure 7 shown docking module 700 and held in place to recharge the battery and transfer the recorded seismic data. Figure 7 Shown are corresponding clips or protrusions 704 in the docking station 702, which are configured to engage the grooves 324 in the node 300 to mechanically engage with the node and hold the node in place during the recharging process. Figure 7 Also shown is a base connection plug 706 configured to be electrically connected to an external connection plug 330 of the node, and through this interface, power is transferred from the docking station 700 to the battery 530 of the node, and the stored seismic data is transferred from the memory 515 of the node to a server associated with the docking station 700.

[0073] Now discuss various possible detailed implementations of the above features (some of which are even optional). In this regard, Figure 8 a main electronic board 510, a processor 514, a memory 515, an antenna 516, a transceiver 517, and a GPS module 518 are shown. It should be noted that in this embodiment, all these elements are directly placed on the main electronic board 510. However, one or more of these elements can be placed on an auxiliary electronic board. Figure 8 Damping elements 520A and 520B that sandwich the main electronic card 510 when installed within the base 310 are also shown. In one application, one of the damping elements is configured to prevent a memory card 810 removably attached to the main electronic board 510 from leaving its position when the node is struck. In this regard, it should be noted that it is common for a person handling the node to drop the node onto the ground or strike the node into a hard surface, which is sufficient to dislodge the memory card from its position unless blocked by the damping element. The memory card 810 can correspond to Figure 5 the memory 515 shown in Figure 8 and can be configured to store the collected seismic data.

[0074] Figure 8 Two connection straps 522 are also shown, which are connected to the main electronic board 510 and are used for electrical connection to two pins of an external connection plug 330. In this regard, Figure 9 the back side of the cover 320 is shown, and the cover 32 has a first internal pin 910 and a second internal pin 912 that extend through the entire thickness of the cover to connect to a first external pin 332 and a second external pin 334 on the front side of the cover (see Figure 3 ). The first pin 910 and the second pin 920 are electrically engaged with the first connection strap and the second connection strap 522 for power and data transfer. The pins 332 and 334 ( Figure 3 and Figure 5 shown in Figure 7 ) electrically connected to the first pin 910 and the second pin 920 are configured to engage with a connection plug 706 of the docking module 700 shown in

[0075] As shown in Figure 10As shown, the first pin 910 and the second pin 912 can be configured to have a semi-flat and semi-circular profile, so that there are flat surfaces 910A and 912A, and the flat surfaces 910A and 912A are configured to directly engage the corresponding belts 522. In one application, as also Figure 10 shown, the support elements 914 and 916 (see Figure 9 and Figure 10 ) can be integrally formed with the cover 320, and these support elements are configured to directly support the first pin 910 and the second pin 912 respectively. Figure 10 It is shown that when the cover is fully engaged with the base 310, each connecting belt 522 directly presses on the corresponding pins 910 and 912, and the pins are clamped between the belt 522 and the support elements 914 and 916. Since the support elements 914 and 916 are rigid and the first and second connecting belts 522 are elastic, for example, made of flexible metal, a very good electrical connection is achieved between the belt 522 and the first pin 910 and the second pin 912. In addition, when the belt 522 and the pins 910, 912 are pre-positioned in the base and the cover respectively, this connection is automatically achieved, so that they come into contact with each other by simply placing the cover 320 on the base 310.

[0076] Returning to Figure 9 , Figure 9 It is also shown how the desiccant material 570 and the RFID tag 572 are attached to the back of the cover 320 at the corresponding positions defined by the dedicated slots 920. The back of the cover 320 can be manufactured to have a honeycomb structure 922 to provide greater mechanical resistance. Figure 9 It is also shown the seal 560 and the notch 324 placed between the cover 320 and the base 310. The hole 924 formed in the cover 320 corresponds to Figure 5 the screw 322 shown.

[0077] There are situations where it is desired to know the state of the node without removing the cover 320 from the base 310, for example, when the battery is depleted, when the memory card is full, when the processor is working, when a component fails, etc. For these situations, an indicator based on a light-emitting diode can be installed to indicate the state of the node. In one application, as Figure 11AAs shown, holes 1110 are formed in the wall portions of the protective cover 311 and the base 310, and a light-transmissive element 1112 is placed in the holes. The light-transmissive element 1112 can be a plastic material that allows light to pass through but does not allow water or other particles to pass through. The light-emitting diode 1120 is disposed within the chamber 312, for example, on the main electronic card 510. The light-emitting diode 1120 is electrically connected to the processor 514. According to the status of various components of the node detected by the processor 514, the processor can instruct the light-emitting diode 1120 to send one or more short pulses or long pulses or a combination thereof through the light-emitting element 1112, so that the operator of the node can see the status of the node without opening the cover. In one embodiment, the light-transmissive element 1112 is formed to have a shape that engages with the wall portion of the base, so that no water can enter the chamber from the outside of the node. To prevent condensate from accumulating on the element, the outer surface of the element can be inclined so that if accumulation occurs, the condensate slides to the edge of the element.

[0078] As previously described, the recess 340 and the hole 610 are shown formed in the wall portion of the base 310. It should be noted that in one embodiment, the protective cover 311 does not extend over these elements. In one application, the hole 610 actually communicates with the recess 340. The recess 340 can be manufactured to have a U-shaped gripping area, which is particularly helpful for the operator when placing the node 300 into a docking station as Figure 12 shown. Figure 7 shown.

[0079] In one embodiment, as Figure 13 shown, a channel 1310 is formed between the base 310 and the cover 320 such that after the screw 322 is removed, a screwdriver can be inserted into the channel to pry the cover off the base. This operation may be required when changing the cover 320 for the DFU node 300 to the cover 420 for the AFU node 400. In one embodiment, the screw 322 is a self-tapping screw without inserts. Other types of screws can be used.

[0080] Figure 14A The nail 306 and how the nail 306 is attached to the corresponding receiving unit 350 formed in the base 310 are shown in more detail. As previously discussed, the nail 306 is attached to the DFU node 300 for implanting the node into the ground. However, when the base is incorporated into the AFU node 400, the nail is removed from the base 310. In one application, the nail 306 is made of plastic to absorb shock if any shock is applied. The profile of the nail can be selected to optimize the ratio between the implanting force and the engaging force. For example, as Figure 14AAs shown, one or more ridges 1410 may be formed along the nail 306. The seal 307 is configured to act as a buffer and may be a rubber seal. The upper end 306A of the nail 306 is configured to engage with the receiving unit 350 and may have a double-threaded half-turn or quarter-turn type installation. As Figure 14B shown, in order to prevent the nail 306 from detaching from the base 310, a screw 309 may be added to the receiving unit 350 to contact the nail 306, thereby fixing the nail relative to the receiving unit. It should be noted that the seal 307 and the screw 309 are configured to allow slight axial movement of the nail relative to the base to further buffer the movement to be transmitted to the base.

[0081] As previously discussed, the base 310 can be used not only for the DFU node 300, but also for Figure 4A and Figure 4B the AFU node 400 shown in. In other words, for these different nodes, the base 310 is interchangeable. This means that the manufacturing process and assembly of these nodes are simplified to use a common base for both nodes. As Figure 15 shown, the base 310 for the AFU node 400 has exactly the same structure as the base 310 for the DFU node 300. Even the electronic devices placed inside the base 310 are almost similar to those of the DFU node 300. More specifically, Figure 15 shows the same main electronic board 510 and battery pack 530 inserted into the guides formed in the base 310 through their shock absorbers. For the AFU node 400, there is no internal sensor device 540, while different external sensors are attached to the node. Therefore, the sensor device 540 and the electrical connection part 550 of the sensor device 540 are omitted in the AFU node 400. In one embodiment, Figure 5 each electronic component shown exists in Figure 15 the embodiment shown in, except for the cover 320, the sensor device 540, and the electrical connection part 550. Therefore, all these common components will not be discussed here. In addition, using so many common components simplifies the manufacturing and assembly process because fewer components need to be manufactured, stored, and assembled for each node.

[0082] The cover 420 of the AFU is different from the cover 320 of the DFU unit 300 in terms of the external connection plug 330 of the cover 320. The cover 420 has an external connection plug 430 different from the cover 320 for the DFU node, and the cover 420 is configured to be attached to one or more external sensors (not shown), such as geophones, through the external connection plug 430. The external connection plug 430 is in Figure 16is shown in more detail and includes a pin 1610 disposed in a hole 1612 formed in a half-body 1614 of the connection plug 430. The half-body 1614 of the connection plug only occupies half of the connection plug. The other half is a recess 1616 from which a tubular portion 1618 rises to the same level as the half-body 1614. A hole 1620 having a tubular metal contact 1622 is formed inside the tubular portion 1618 to receive a pin from an external sensor (not shown).

[0083] A connection mechanism 1700 that mates with the connection plug 430 is shown in Figure 17A and Figure 17B is shown in the figure. Figure 17A The connection mechanism 1700 is shown having a metal pin 1702 and a metal tubular member 1704 that are configured to mate with the tubular metal contact point 1622 and the pin 1610, respectively. The body 1706 of the connection mechanism 1700 is configured to have a raised half and a recessed half to mate with the corresponding recessed half 1616 and raised half 1614 of the connection plug 430. A sleeve 1710 is attached to the connection mechanism and is configured to engage with a corresponding thread 431 (see Figure 4A ) formed on the outer surface of the connection plug 430 by threading. Figure 17B The connection mechanism 1700 is shown and also has a cable 1720 that transfers information and / or power from the pin / tubular member to an external sensor attached to the cable.

[0084] In this regard, Figure 18 the connection mechanism 1700 and a sensor 1800 (e.g., a geophone) are shown, with the connection mechanism 1700 and the sensor 1800 attached to the cable 1720 of the connection mechanism 1700 as if connected to the cover member 420. It should be noted that the connection plug 430 is not visible in Figure 18 because the connection plug 430 is covered by the sleeve 1710 of the connection mechanism 1700. Although Figure 18 only a single sensor 1800 attached to the cable 1720 is shown, multiple sensors can be attached to the cable. In another embodiment, as Figure 19 shown, an external sensor(s) 1800 can be connected to the connection plug 430 by a connection mechanism 1900 that is similar to the connection mechanism 1700 but does not have the sleeve 1710. The external sensor 1800 records the analog data that is thus sent to the main electronic board 510. For this reason, the seismic node 400 is also referred to as an analog field unit. Those skilled in the art will understand that although Figure 17A and Figure 17BThe KCK2 type connector is described, but other connectors can be used as long as the connection mechanism and the connection plug are configured to cooperate with each other. Selecting the KCK2 type connector in these figures is reasonable because conventional sensors 1800 in the industry already have this type of connection, and thus it is desired that the new node 400 be backward compatible with existing sensors. However, this historical reason does not prevent other types of connections from being used for the AFU node 400.

[0085] Based on the above descriptions of the DFU node 300 and the AFU node 400, it should be noted that, regardless of the type of sensor to be deployed for land seismic surveys, the common base 310 is used. If digital sensors (such as MEMS sensors) need to be deployed, the sensor device is placed inside the base 310 and electrically connected to the main electronic board. If analog sensors (such as geophones) need to be deployed, the sensors are not placed inside the base, but are externally attached to the cover member covering the base. The cover member covering the base is different for each type of sensor. For digital sensors, the cover member 320 has an external connection plug 330, which is used to exchange power and / or information with the docking module after or before the seismic survey when the node is ready. For analog sensors, the cover member 420 has an external connection plug 430, which is used to connect to the external seismic sensor 1800 during the seismic survey or to the docking module before or after the seismic survey for maintenance. In addition, the DFU node is configured to receive nails 306 configured to be implanted into the ground to obtain a better connection between the base (the base houses the seismic sensor) and the ground. When the AFU node uses the base 310, there are no nails 306, and at this time the seismic sensor 1800 is directly connected to the ground to record seismic data.

[0086] While the embodiments discussed with reference to the drawings show the side 312' of the base 310 being open to the surrounding environment before the attachment of the cover, and this side is used to load or unload various electronic components of the node into or from the base and then the same side is enclosed with the cover 320 or 420 to seal the chamber 312, those skilled in the art will understand that for the same reasons, these embodiments can also be modified to use the top or bottom surface of the base 310. In other words, the top surface of the base 310 can be made open to load or unload various electrical components and then the top surface is enclosed with the cover 320 or 420. For the same reasons, the bottom surface of the base can be made open and then the bottom surface is covered with the cover 320 or 420. If this structure is selected, the plug 330 or 430 can still be formed on the side of the base. In a variant, one face of the base can be used for loading and unloading electronic devices while another face of the base is used for setting the connection plug 330 or 430. In other words, while the above embodiments use the cover 320 or 430 to both enclose the base and carry the electrical connection associated with the connection plug 330 or 430, these two functions can be separated and distributed on different faces of the base according to the needs of the operator while still having the same base for DFU nodes and AFU nodes. Additionally, while the embodiments discussed herein only relate to MEMS sensors for DFU nodes and geophone sensors for AFU nodes, other sensors can be present in these nodes or other sensors can be externally connected to these nodes or additional sensors. For example, in one application, a gravity sensor can be placed inside the base, either alone or on the sensor device 540 or on the main electronic board 510. Other sensors such as temperature sensors can be placed inside the chamber 312.

[0087] Now refer to Figure 20 a method for assembling a seismic node (DFU or AFU node) is discussed. In step 2000, the base 310 is set up. As discussed with reference to Figure 5 and Figure 15 , the base 310 is the same for both types of nodes. In step 2002, a decision is made as to whether the base should be used for a DFU node or an AFU node. If a DFU node needs to be fabricated, then in step 2004, a digital sensor is electrically attached to the main electronic board via a dedicated flexible cable and the assembly is placed into the base along a first guide. If an ADU node needs to be manufactured, then in step 2006, the main electronic board is slid into the base without a sensor attached to the main electronic board. In step 2008, in either the case of assembling a DFU node or an AFU, a battery pack is slid into the base along a second guide and the battery pack is also electrically connected to the main electronic board via a flexible cable.

[0088] In step 2010, depending on whether the node is a DFU node or an AFU node, the cover 320 or 430 is selected. For a DFU node, the cover 320 is selected to have a connection plug 330 that only needs to mate with the docking station, while for an AFU assembly, the cover 420 is selected to have a connection plug 430 that mates not only with the docking station module but also with the connection mechanism of an external analog sensor. In step 2012, the selected cover and the corresponding seal are attached to the base 310 by screws to completely seal the base so that the chamber 312 in which the electronic devices are placed is not in communication with the surrounding environment. As previously referred to Figure 5 and Figure 15 as described, the cover can be connected to the base with four screws. In step 2014, if the node is an AFU node, the external sensor 1800 is electrically and mechanically connected to the connection plug 430 of the cover 420. Thus, by using a common base 310, the DFU node or the AFU node can be assembled with a minimum number of components and a minimum number of assembly steps, which is advantageous for seismic surveys involving hundreds and thousands of nodes. Moreover, since the number of different components is drastically reduced, such a system reduces the cost of owning and maintaining the equipment associated with seismic surveys. Figure 21 Such a system 2100 shown in

[0089] the disclosed embodiments provides a common platform (base) for different types of seismic nodes. To assemble a desired seismic node, the corresponding sensors and covers are different for one type of seismic node from another type of seismic node, and the sensors and covers are selected during the assembly process. The electronic devices and battery packs placed inside the base are the same. It should be understood that this description is not intended to limit the present invention. On the contrary, the embodiments are intended to cover alternatives, modifications, and equivalents included within the spirit and scope of the present invention as defined by the appended claims. Additionally, in the detailed description of the embodiments, numerous specific details are set forth in order to provide a thorough understanding of the claimed invention. However, those skilled in the art will understand that various embodiments may be practiced without these specific details.

[0090] the disclosed embodiments provide a seismic node that is particularly suitable for use in combination with a docking station described in U.S. Patent Application No. US16 / 569,855, titled "Docking Station for Wireless Seismic Acquisition Nodes," filed by the applicant of the present application, and / or with a device described in U.S. Patent Application No. US16 / 569,846, titled "Multifunctional Acquisition Device and Operating Method," filed by the applicant of the present application, which U.S. patent applications are incorporated herein by reference in their entirety.

[0091] Although the features and elements of the present embodiment are described in a specific combination in the embodiments, each feature or element can be used alone without the other features and elements of the embodiment, or in various combinations with or without other features and elements disclosed herein.

[0092] This written description uses examples of the disclosed subject matter to enable any person skilled in the art to practice the subject matter, including making and using any device or system and performing any incorporated method. The scope of the subject matter is defined by the claims and may include other examples that occur to persons skilled in the art. Such other examples are intended to be within the scope of the claims.

Claims

1. A seismic acquisition system for collecting seismic data, the seismic acquisition system comprising: A digital field unit DFU (300) that collects a first set of seismic data; And An analog field unit AFU (400) that collects a second set of seismic data, characterized in that The digital field unit DFU (300) is formed by digital seismic nodes, and the digital seismic nodes include: A base (310) configured to define a chamber (312) having an open face (312'); A main electronic board (510) having a processor, the main electronic board (510) being placed inside the chamber (312); A battery pack (530) configured to supply power to the main electronic board (510) and being placed inside the chamber (312); and A cover (320) configured to be attached to the open side of the base (310) to seal the chamber (312), The digital seismic node includes: A digital sensor device (540) located inside the chamber (312) and attached to the wall of the base (310) to form the digital field unit (300), Wherein, the analog field unit AFU (400) is formed by analog seismic nodes, and the analog seismic nodes include: A base (310) configured to define a chamber (312) having an open face (312'); A main electronic board (510) having a processor, the main electronic board (510) being placed inside the chamber (312); A battery pack (530) configured to supply power to the main electronic board (510) and being placed inside the chamber (312); and A cover (420) configured to be attached to the open side of the base (310) to seal the chamber (312), The analog seismic node does not include a digital sensor device (540), but includes an external analog sensor (112) electrically attached to the outside of the cover (420) to form the analog field unit AFU (400), Wherein the base (310) of the digital field unit DFU is the same as the base (310) of the analog field unit AFU; And the cover (320) of the digital field unit DFU is different from the cover (420) of the analog field unit AFU.

2. The seismic acquisition system according to claim 1, wherein, The main electronic board (510) includes a global positioning module (518), a transceiver (517), and an antenna (516).

3. The seismic acquisition system according to claim 2, wherein, There is no additional transceiver and no additional antenna.

4. The seismic acquisition system according to claim 1, further comprising: A nail (306) removably attached to the base (310).

5. The seismic acquisition system according to claim 1, wherein, The battery pack (530) is positioned below the main electronic board (510) along the direction of gravity.

6. The seismic acquisition system according to claim 1, wherein, Each of the covers (320, 420) includes a first internal pin and a second internal pin facing the chamber (312), and the first internal pin and the second internal pin are configured to engage with corresponding first flexible strips and second flexible strips (522) formed on or attached to the main electronic board (510).

7. The seismic acquisition system according to claim 6, wherein, The cover (320) of the digital field unit DFU further includes a first external pin and a second external pin extending outside the chamber (312), and the first internal pin and the second internal pin are electrically connected to the first external pin and the second external pin, respectively.

8. The seismic acquisition system according to claim 6, wherein, The cover (420) of the analog field unit AFU further includes an external pin and an external tubular member facing outside the chamber (312), and the first internal pin and the second internal pin are electrically connected to the external pin and the external tubular member, respectively.

9. The seismic acquisition system according to claim 1, wherein, The analog sensor (112) is located outside the chamber (312), there is no sensor inside the chamber (312), and the analog sensor (112) is a geophone.

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