Thin material multi-hole processing device

Abstract

The present invention belongs to the technical field of thin material processing equipment, and in particular, relates to a thin material porous processing device, including a base, a pushing device, a support plate, a pressing device, a suction device and a chip cleaning device. The base is provided with a mounting groove, and the two ends of the mounting groove penetrate the two side surfaces of the base. The pushing device is fixedly installed on the side surface of the base, and the moving end of the pushing device is arranged toward the mounting groove. The support plate is installed in the mounting groove. The chip cleaning device is fixedly installed on the upper surface of the base, and a groove for placing the chip cleaning device is arranged on the combined plane of the support plate and the base. The pressing device is fixedly installed on the base, and the pressing device is located above the chip cleaning device. The pressing device is arranged near the edge of the base, and the pressing device and the pushing device are arranged adjacent to each other. The suction device is fixedly installed at the side edge of the base, and the suction device is arranged adjacent to the pushing device. Through the above arrangement, the thin material porous processing device can avoid deformation of the sheet during the processing when processing thin sheet materials.

Description

Technical Field

[0001] The invention belongs to the technical field of thin material processing equipment, and in particular relates to a thin material multi-hole processing device. Background Art

[0002] The thin material multi-hole processing device processes the holes of the sheet material to obtain a sheet material with a plurality of through holes, and the reprocessing process is mostly achieved by stamping or CNC vacuum suction. The required plurality of through holes are processed on the surface of the thin material sheet by stamping, and the position of the through holes can be at any position on the surface of the thin material sheet. In the prior art, when the sheet material is processed by the punching process, the thin sheet material is placed on a plane, positioned, and then the relevant stamping operations are performed to obtain the through holes at the corresponding positions. However, when the processing method in the prior art is used to punch holes on the surface of the thin sheet material, there is a technical problem that when the holes are located at the edge of the thin sheet material, the thin sheet material itself will be deformed. Summary of the invention

[0003] The purpose of the present invention is to provide a thin material multi-hole processing device, aiming to solve the technical problem of thin material hole processing deformation in the prior art.

[0004] To achieve the above-mentioned objectives, an embodiment of the present invention provides a thin material multi-hole processing device, including a base, a pushing device, a support plate, a pressing device, a suction device and a chip cleaning device, wherein the base is provided with a mounting groove, and the two ends of the mounting groove pass through the two side surfaces of the base, the pushing device is fixedly installed on the side surface of the base, and the pushing device is located at an opening at one end of the mounting groove, the movable end of the pushing device is arranged toward the mounting groove, the support plate is installed in the mounting groove, and the movable end of the pushing device is fixedly connected to the support plate, the chip cleaning device is fixedly installed on the upper surface of the base, and a groove for placing the chip cleaning device is provided on the combined plane of the support plate and the base, the pressing device is fixedly installed on the base, the pressing device is located above the chip cleaning device, the pressing device is arranged adjacent to the edge of the base, and the pressing device is arranged adjacent to the pushing device, the suction device is fixedly installed at the side edge position of the base, and the suction device is arranged adjacent to the pushing device.

[0005] Preferably, the chip cleaning device includes a cleaning rod, a first telescopic rod, a second telescopic rod, a first X-axis cylinder, a second X-axis cylinder, a first Y-axis cylinder, a second Y-axis cylinder, a first lifting plate and a second lifting plate, the first lifting plate and the second lifting plate are both fixedly installed in the groove, the first lifting plate and the second lifting plate are both arranged adjacent to a side edge of the upper surface of the base, and the first lifting plate and the second lifting plate are arranged opposite to each other.

[0006] Further, the first X-axis cylinder and the first Y-axis cylinder are both fixedly mounted on the first lifting plate, the second X-axis cylinder and the second Y-axis cylinder are both fixedly mounted on the second lifting plate, and the moving ends of the first Y-axis cylinder and the second Y-axis cylinder are arranged opposite to each other, the moving ends of the first X-axis cylinder and the second X-axis cylinder are arranged toward the other side edge of the upper surface of the base, and the two ends of the cleaning rod are respectively fixedly connected to the moving ends of the first X-axis cylinder and the second X-axis cylinder, the first telescopic rod and the second telescopic rod are respectively fixedly connected to the moving ends of the first Y-axis cylinder and the second Y-axis cylinder, and the first telescopic rod and the second telescopic rod are both located between the first X-axis cylinder and the second X-axis cylinder.

[0007] Preferably, one end of the first telescopic rod and the second telescopic rod are respectively fixedly connected to the movable ends of the first Y-axis cylinder and the second Y-axis cylinder, and the telescopic ends of the first telescopic rod and the second telescopic rod are both slidably connected to the side of the cleaning rod.

[0008] Preferably, the bottoms of the cleaning rod, the first telescopic rod and the second telescopic rod are arranged flush with each other.

[0009] Preferably, the pressing device includes a first lifting cylinder, a second lifting cylinder and a clamping plate, the first lifting cylinder and the second lifting cylinder are respectively fixedly installed on both side edges of the base, and the moving ends of the first lifting cylinder and the second lifting cylinder are fixedly installed on the bottom of the clamping plate, and the clamping plate is located above the support plate and the chip cleaning device.

[0010] Preferably, the main bodies of the first lifting cylinder and the second lifting cylinder are located below the plane of the upper surface of the base.

[0011] Preferably, assembly grooves are provided on both side surfaces of the base, and the first lifting cylinder and the second lifting cylinder are respectively installed in the two assembly grooves, and the moving ends of the first lifting cylinder and the second lifting cylinder respectively pass through the tops of the two assembly grooves and extend upward to be fixedly connected to the middle positions of the two end edges of the bottom of the splint.

[0012] Preferably, the pushing device includes a mounting plate and a pushing cylinder, the mounting plate is fixedly mounted on the side of the base, and the mounting plate encapsulates one end opening of the mounting groove, the pushing cylinder is fixedly mounted on the mounting plate, and the moving end of the pushing cylinder passes through the mounting plate and extends into the mounting groove, and the moving end of the pushing cylinder is fixedly connected to the side of the support plate.

[0013] Preferably, a plurality of slide rails arranged along the Y-axis direction are provided at the bottom of the installation groove, and the bottom of the support plate is slidably connected to each of the slide rails.

[0014] Preferably, the suction device includes a guide rail, a suction pin, a fixed block and a suction cylinder, the guide rail is fixedly installed on the side of the base along the Y-axis direction, the fixed block is fixedly installed on the side of the base, and the fixed block is arranged adjacent to one end of the guide rail, the suction pin is slidably installed on the guide rail, the suction port of the suction pin is located above the horizontal plane of the upper surface of the base, the suction cylinder is fixedly installed on the fixed block, and the moving end of the suction cylinder passes through the fixed block and is fixedly connected to the side of the suction pin.

[0015] The above one or more technical solutions in the thin material multi-hole processing device provided by the embodiment of the present invention have at least one of the following technical effects:

[0016] The thin material multi-hole processing device in the present invention is assembled by a base, a pushing device, a support plate, a pressing device, a suction device and a chip cleaning device. Before installation, a mounting groove is opened on the upper surface of the base, and the mounting groove needs to penetrate the upper surface of the base. The width of the mounting groove is the same as the width of the support plate, and the depth of the mounting groove is the same as the thickness of the support plate, ensuring that the gap between the support plate and the mounting groove can be reduced after the support plate is installed in the mounting groove. The pushing device is fixedly installed on the side of the base, and the moving end of the pushing device is fixedly connected to the support plate, and the pushing device needs to be fixedly connected to the support plate. Located at the opening at one end of the mounting groove, the pushing device is used to drive the support plate to move in the mounting groove to complete loading and unloading. The chip cleaning device is fixedly installed on the upper surface of the base. At the same time, a groove for the chip cleaning device to be placed is opened on the overall plane formed with the upper surface of the base after the support plate is installed. When the thin material multi-hole processing device performs hole processing, the chip cleaning device is stored in the groove. When the processing is completed, the chip cleaning device rises from the groove to reach a position flush with the top plane of the workpiece, and the chips on the upper surface of the workpiece are collected by the chip cleaning device.

[0017] The pressing device is fixedly mounted on the upper surface of the base, and the pressing device moves up and down. The position of the workpiece is fixed by pressing down, and then the hole processing is performed. A limiting groove is set on the pressing device, and the workpiece is located in the limiting groove. The limiting groove limits the expansion and deformation of the edge position of the workpiece during the hole processing. The corresponding parts of the pressing device are replaced according to different types of workpieces. The suction device is then fixedly mounted on the side of the base and is set adjacent to the pushing device to ensure that it is in the same position as the processing area. When the processing is completed, the suction device moves to the position where the debris is accumulated, and the debris is sucked and collected to prevent the debris from scattering after the processing is completed. Through the above-mentioned settings, the thin-material multi-hole processing device can be used to avoid deformation of the sheet during the processing process when processing thin-material sheets. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 A top view of a thin material porous processing device provided in an embodiment of the present invention.

[0020] Figure 2 A side view of a first state of a thin material porous processing device provided in an embodiment of the present invention.

[0021] Figure 3 A side view of the second state of the thin material porous processing device provided by an embodiment of the present invention.

[0022] Figure 4 A side view of the third state of the thin material porous processing device provided by an embodiment of the present invention.

[0023] Figure 5 A top view without a clamping plate of a thin material multi-hole processing device provided in an embodiment of the present invention.

[0024] Figure 6 A top view of the thin material multi-hole processing device in the first state without a clamping plate provided by an embodiment of the present invention.

[0025] Figure 7 A top view of the thin material multi-hole processing device in the second state without the clamping plate provided by an embodiment of the present invention.

[0026] Figure 8 A top view of a chip cleaning device in a first state of a thin material multi-hole processing device provided by an embodiment of the present invention.

[0027] Fig. 9 A top view of the second state of the chip cleaning device of the thin material multi-hole processing device provided by an embodiment of the present invention.

[0028] Fig.10 A side view of a chip cleaning device for a thin material multi-hole processing device provided in an embodiment of the present invention.

[0029] Among them, the reference numerals in the figure are:

[0030] 10—base 11—installation slot 12—slide rail

[0031] 20—Pushing device 21—Mounting plate 22—Pushing cylinder

[0032] 30—support plate 40—pressing device 41—first lifting cylinder

[0033] 42 - second lifting cylinder 43 - clamping plate 50 - suction device

[0034] 51 - guide rail 52 - suction pin 53 - fixed block

[0035] 54—Suction cylinder 60—Chip cleaning device 61—Cleaning rod

[0036] 62 - first telescopic rod 63 - second telescopic rod 64 - first X-axis cylinder

[0037] 65 - second X-axis cylinder 66 - first Y-axis cylinder 67 - second Y-axis cylinder

[0038] 68—First lifting plate 69—Second lifting plate. DETAILED DESCRIPTION

[0039] The following describes in detail embodiments of the present invention. Examples of the embodiments are shown in the attached Figures 1 to 10 , wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0040] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0042] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0043] In one embodiment of the present invention, Figures 1 to 10 As shown, a thin material multi-hole processing device is provided, including a base 10, a pushing device 20, a support plate 30, a pressing device 40, a suction device 50 and a chip cleaning device 60. The four sides of the base 10 are smoothly connected to prevent collision damage. The suction device 50 is connected to a negative pressure device to provide suction through negative pressure to absorb the debris. The base 10 is provided with a mounting groove 11. The two inner sides of the mounting groove 11 are both provided with side slide rails 12. The sliding connection between the side slide rails 12 and the side of the support plate 30 reduces the friction force when the support plate 30 moves in the mounting groove 11. The two ends of the mounting groove 11 pass through the two side surfaces of the base 10. The two ends of the upper surface of the base 10 are convenient for the movement of the support plate 30 in the installation groove 11, and are convenient for loading and unloading materials and cleaning the installation groove 11. The pushing device 20 is fixedly installed on the side of the base 10, and the pushing device 20 is located at one end of the opening of the installation groove 11. The moving end of the pushing device 20 is arranged toward the installation groove 11. The support plate 30 is installed in the installation groove 11, and the moving end of the pushing device 20 is fixedly connected to the support plate 30. The pushing device 20 is arranged close to one end of the opening of the installation groove 11, and can directly push and pull the support plate 30 located in the installation groove 11 to realize the transportation of loading and unloading materials.

[0044] The chip cleaning device 60 is fixedly installed on the upper surface of the base 10, and a groove for placing the chip cleaning device 60 is provided on the combined plane of the support plate 30 and the base 10, the contour of the groove is the same as the outer contour of the chip cleaning device 60, and the chip cleaning device 60 moves up and down to hide in the groove, the pressing device 40 is fixedly installed on the base 10, the pressing device 40 is located above the chip cleaning device 60, the pressing device 40 is arranged adjacent to the edge of the base 10, the pressing surface of the pressing device 40 is provided with a limiting groove identical to the plane contour of the workpiece, the limiting groove limits the expansion and deformation of the workpiece in all directions, and the pressing device 40 is arranged adjacent to the pushing device 20, the suction device 50 is fixedly installed on the side edge position of the base 10, and the suction device 50 is arranged adjacent to the pushing device 20, the suction device 50 protrudes from the upper surface of the base 10, and effectively absorbs and cleans the debris generated on the base 10.

[0045] The thin material multi-hole processing device in the present invention is assembled by a base 10, a pushing device 20, a support plate 30, a pressing device 40, a suction device 50 and a chip cleaning device 60. Before installation, a mounting groove 11 is opened on the upper surface of the base 10, and the mounting groove 11 needs to pass through the upper surface of the base 10, the width of the mounting groove 11 is the same as the width of the support plate 30, and the depth of the mounting groove 11 is the same as the thickness of the support plate 30, ensuring that the gap between the support plate 30 and the mounting groove 11 can be reduced after the support plate 30 is installed in the mounting groove 11, and the pushing device 20 is fixedly installed on the side of the base 10, and the moving end of the pushing device 20 is fixedly connected to the support plate 30, and the pushing device 20 needs to be located at one end opening of the mounting groove 11, and the support plate 30 is driven to move in the mounting groove 11 by the pushing device 20 to complete loading and unloading. When loading, the clamping plate 43 is in the first lifting air The cylinder 41 rises under the action of the second lifting cylinder 42, and the chip cleaning device 60 rises. The support plate 30 moves to the other end of the installation groove 11 under the action of the pushing device 20. After the loading is completed, the pushing device 20 pulls the support plate 30 back to the other end of the installation groove 11, and the chip cleaning device 60 falls and hides in the groove. The clamping plate 43 falls under the action of the first lifting cylinder 41 and the second lifting cylinder 42 to press the workpiece. The chip cleaning device 60 is fixedly installed on the upper surface of the base 10. At the same time, a groove for the chip cleaning device 60 to be placed is opened on the overall plane formed with the upper surface of the base 10 after the support plate 30 is installed. When the thin material multi-hole processing device performs hole processing, the chip cleaning device 60 is stored in the groove. When the processing is completed, the chip cleaning device 60 rises from the groove to reach a position flush with the top plane of the workpiece, and the chips on the upper surface of the workpiece are collected by the chip cleaning device 60.

[0046] The pressing device 40 is fixedly mounted on the upper surface of the base 10, and the pressing device 40 moves up and down, and the position of the workpiece is fixed by pressing down, and then the hole processing is performed, and a limiting groove is set on the pressing device 40, and the workpiece is located in the limiting groove. The limiting groove limits the expansion and deformation of the edge position of the workpiece during the hole processing. The corresponding parts of the pressing device 40 are replaced according to different types of workpieces, and then the suction device 50 is fixedly mounted on the side of the base 10, and is set near the pushing device 20 to ensure that it is in the same position as the processing area. When the processing is completed, the suction device 50 moves to the position where the debris is accumulated, and the debris is sucked and collected to prevent the debris from scattering after the processing is completed. Through the above-mentioned settings, the thin material multi-hole processing device can be used to avoid deformation of the sheet during the processing process when processing thin sheets.

[0047] In another embodiment of the present invention, Figures 3-4 and Figures 6 to 9 As shown, the chip cleaning device 60 includes a cleaning rod 61, a first telescopic rod 62, a second telescopic rod 63, a first X-axis cylinder 64, a second X-axis cylinder 65, a first Y-axis cylinder 66, a second Y-axis cylinder 67, a first lifting plate 68 and a second lifting plate 69. The installation heights of the first X-axis cylinder 64 and the second X-axis cylinder 65 are lower than the installation heights of the first Y-axis cylinder 66 and the second Y-axis cylinder 67. The two groups of cylinders are staggered to avoid mutual influence of the working routes. The first lifting plate 68 and the second lifting plate 69 are both fixedly installed in the groove. The first lifting plate 68 and the second lifting plate 69 are both arranged near one side edge of the upper surface of the base 10. The lifting and lowering of the first lifting plate 68 and the second lifting plate 69 realize the rising and falling of the entire chip cleaning device 60, and the first lifting plate 68 and the second lifting plate 69 are arranged opposite to each other, and the first lifting plate 68 and the second lifting plate 69 are arranged opposite to each other, as two supporting points of the chip cleaning device 60.

[0048] Further, the first X-axis cylinder 64 and the first Y-axis cylinder 66 are both fixedly mounted on the first lifting plate 68. Driven by the first lifting plate 68, the first X-axis cylinder 64 and the first Y-axis cylinder 66 move up and down, and the first X-axis cylinder 64 and the first Y-axis cylinder 66 are relatively stationary. The first X-axis cylinder 64 and the first Y-axis cylinder 66 are arranged perpendicular to each other. The second X-axis cylinder 65 and the second Y-axis cylinder 67 are both fixedly mounted on the second lifting plate 69. Driven by the second lifting plate 69, the second X-axis cylinder 65 and the second Y-axis cylinder 67 move up and down, and the second X-axis cylinder 65 and the second Y-axis cylinder 67 are relatively stationary. The second X-axis cylinder 65 and the second Y-axis cylinder 67 are arranged perpendicular to each other, and the moving ends of the first Y-axis cylinder 66 and the second Y-axis cylinder 67 are arranged relative to each other, and the moving ends of the first Y-axis cylinder 66 and the second Y-axis cylinder 67 are arranged relative to each other to push the first telescopic rod 62 and the second telescopic rod 63 to move relative to each other.

[0049] The moving ends of the first X-axis cylinder 64 and the second X-axis cylinder 65 are arranged toward the other side edge of the upper surface of the base 10, and the moving ends of the first X-axis cylinder 64 and the second X-axis cylinder 65 are arranged toward a direction away from the first lifting plate 68 and the second lifting plate 69. The covered cleaning area is located above the installation position of the workpiece, and the two ends of the cleaning rod 61 are respectively fixedly connected to the moving ends of the first X-axis cylinder 64 and the second X-axis cylinder 65, and the moving ends of the first X-axis cylinder 64 and the second X-axis cylinder 65 are respectively fixedly connected to the two ends of the cleaning rod 61. The cleaning rod 61 moves by the pulling force at both ends to push and sweep the debris on the surface of the workpiece. The first telescopic rod 62 and the second telescopic rod 63 are fixedly connected to the moving ends of the first Y-axis cylinder 66 and the second Y-axis cylinder 67 respectively, and the first Y-axis cylinder 66 and the second Y-axis cylinder 67 respectively drive the first telescopic rod 62 and the second telescopic rod 63 to move toward each other, so as to gather the debris on both sides of the upper surface of the workpiece toward the middle, and the first telescopic rod 62 and the second telescopic rod 63 are both located between the first X-axis cylinder 64 and the second X-axis cylinder 65, and the first telescopic rod 62 and the second telescopic rod 63 are located between the first X-axis cylinder 64 and the second X-axis cylinder 65, and can complete the complete movement without colliding with the first X-axis cylinder 64 and the second X-axis cylinder 65.

[0050] In another embodiment of the present invention, Figures 3-4 and Figures 6 to 9As shown, one end of the first telescopic rod 62 and the second telescopic rod 63 are fixedly connected to the movable ends of the first Y-axis cylinder 66 and the second Y-axis cylinder 67 respectively, and the telescopic ends of the first telescopic rod 62 and the second telescopic rod 63 are both slidably connected to the side of the cleaning rod 61, and pulleys are arranged at the ends of the first telescopic rod 62 and the second telescopic rod 63, and the pulleys abut against the side of the cleaning rod 61. When the cleaning rod 61 moves driven by the first X-axis cylinder 64 and the second X-axis cylinder 65, the first telescopic rod 62 and the second telescopic rod 63 move toward each other, and the two ends abutting against the cleaning rod 61 can move smoothly, thereby reducing the friction generated during the movement.

[0051] In another embodiment of the present invention, Figures 3-4 and Figures 6 to 9 As shown, the bottoms of the cleaning rod 61, the first telescopic rod 62 and the second telescopic rod 63 are arranged flush, and the bottom planes of the cleaning rod 61, the first telescopic rod 62 and the second telescopic rod 63 are connected flush, so that the upper surface of the workpiece can be cleaned without dead angles when moving on the workpiece.

[0052] In another embodiment of the present invention, Figures 1 to 4 As shown, the pressing device 40 includes a first lifting cylinder 41, a second lifting cylinder 42 and a clamping plate 43. The first lifting cylinder 41 and the second lifting cylinder 42 are respectively fixedly installed on both sides of the base 10. The first lifting cylinder 41 and the second lifting cylinder 42 are respectively located on both sides of the base 10, which is convenient for the position installation of the pressing device 40. The moving ends of the first lifting cylinder 41 and the second lifting cylinder 42 are both fixedly installed on the bottom of the clamping plate 43. The clamping plate 43 is located above the support plate 30 and the chip cleaning device 60. The first lifting cylinder 41 and the second lifting cylinder 42 on both sides drive the clamping plate 43 to move up and down to complete the fixing and removal of the workpiece.

[0053] In another embodiment of the present invention, Figures 1 to 7 As shown, the main bodies of the first lifting cylinder 41 and the second lifting cylinder 42 are located below the plane of the upper surface of the base 10, so that the clamping plate 43 can clamp the workpiece to the maximum extent to prevent the workpiece from loosening during processing.

[0054] In another embodiment of the present invention, Figures 1 to 7As shown, assembly grooves are provided on both side surfaces of the base 10, and the first lifting cylinder 41 and the second lifting cylinder 42 are respectively installed in the two assembly grooves, and the depth of the assembly groove exceeds half of the upper surface of the first lifting cylinder 41 and the second lifting cylinder 42, so that the moving ends of the first lifting cylinder 41 and the second lifting cylinder 42 are located in the assembly grooves, and the moving ends of the first lifting cylinder 41 and the second lifting cylinder 42 respectively extend upward through the tops of the two assembly grooves and are fixedly connected to the middle position of the two end edges of the bottom of the clamping plate 43. The first lifting cylinder 41 and the second lifting cylinder 42 push and pull the clamping plate 43 in the assembly groove, which can make the clamping plate 43 close to the upper surface of the base 10 to the greatest extent, and the position of the first lifting cylinder 41 and the second lifting cylinder 42 is fixed during work through the assembly groove, avoiding the movement of the first lifting cylinder 41 and the second lifting cylinder 42 in the clamped state.

[0055] In another embodiment of the present invention, Figure 1 and Figures 4 to 6 As shown, the pushing device 20 includes a mounting plate 21 and a pushing cylinder 22. The mounting plate 21 is fixedly mounted on the side of the base 10, and the mounting plate 21 encapsulates one end opening of the mounting groove 11. The mounting plate 21 completely covers one end opening of the mounting groove 11 to prevent the debris scattered in the mounting groove 11 during processing from being brought to the open end under the movement of the support plate 30 and falling out of the thin material processing device. The pushing cylinder 22 is fixedly mounted on the mounting plate 21, and the moving end of the pushing cylinder 22 passes through the mounting plate 21 and extends into the mounting groove 11. The moving end of the pushing cylinder 22 is fixedly connected to the side of the support plate 30, and the pushing cylinder 22 supports the support plate 30 in the mounting groove 11 to move along the path of the mounting groove 11.

[0056] In another embodiment of the present invention, Figures 1 to 7 As shown, a plurality of slide rails 12 are arranged along the Y-axis direction at the bottom of the mounting groove 11, the bottom of the support plate 30 is slidably connected to each of the slide rails 12, and each of the slide rails 12 is arranged side by side at intervals, and both ends of the slide rails 12 extend to the edge positions of the openings at both ends of the mounting groove 11 respectively.

[0057] In another embodiment of the present invention, Figures 1 to 7As shown, the suction device 50 includes a guide rail 51, a suction pin 52, a fixed block 53 and a suction cylinder 54. The guide rail 51 is fixedly installed on the side of the base 10 along the Y-axis direction. A connecting block is provided on the side of the guide rail 51, and the connecting block is arranged adjacent to one end of the guide rail 51. The connecting block is fixedly installed on the side of the base 10. The fixed block 53 is fixedly installed on the side of the base 10, and the fixed block 53 is arranged adjacent to the edge of the side of the base 10. The fixed block 53 is arranged adjacent to the pushing device 20, and the fixed block 53 is arranged adjacent to one end of the guide rail 51. The two ends are arranged adjacent to each other, the suction pin 52 is slidably installed on the guide rail 51, one end of the guide rail 51 abuts against the side of the fixed block 53 to prevent the suction pin 52 from sliding out of the guide rail 51 and falling off, the suction port of the suction pin 52 is located above the horizontal plane of the upper surface of the base 10, the suction cylinder 54 is fixedly installed on the fixed block 53, and the moving end of the suction cylinder 54 passes through the fixed block 53 and is fixedly connected to the side of the suction pin 52, the suction cylinder 54 drives the suction pin 52 connected to the negative pressure device to move to the place where the debris is accumulated for suction and collection.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A thin material multi-hole processing device, characterized in that: The cam is an assembly of a plurality of movable parts, each of which is connected to a pair of movable parts, and the movable parts are connected to the movable part of the cam, and the movable part is connected to the movable part of the cam. The chip cleaning device includes a cleaning rod, a first telescopic rod, a second telescopic rod, a first X-axis cylinder, a second X-axis cylinder, a first Y-axis cylinder, a second Y-axis cylinder, a first lifting plate and a second lifting plate, the first lifting plate and the second lifting plate are both fixedly installed in the groove, the first lifting plate and the second lifting plate are both arranged adjacent to a side edge of the upper surface of the base, and the first lifting plate and the second lifting plate are arranged opposite to each other; The first X-axis cylinder and the first Y-axis cylinder are both fixedly mounted on the first lifting plate, the second X-axis cylinder and the second Y-axis cylinder are both fixedly mounted on the second lifting plate, and the moving ends of the first Y-axis cylinder and the second Y-axis cylinder are arranged opposite to each other, the moving ends of the first X-axis cylinder and the second X-axis cylinder are arranged toward the other side edge of the upper surface of the base, and the two ends of the cleaning rod are respectively fixedly connected to the moving ends of the first X-axis cylinder and the second X-axis cylinder, the first telescopic rod and the second telescopic rod are respectively fixedly connected to the moving ends of the first Y-axis cylinder and the second Y-axis cylinder, and the first telescopic rod and the second telescopic rod are both located between the first X-axis cylinder and the second X-axis cylinder; One end of the first telescopic rod and the second telescopic rod are fixedly connected to the movable ends of the first Y-axis cylinder and the second Y-axis cylinder respectively, and the telescopic ends of the first telescopic rod and the second telescopic rod are both slidably connected to the side surface of the cleaning rod; The pushing device includes a mounting plate and a pushing cylinder, wherein the mounting plate is fixedly mounted on the side of the base, and the mounting plate encapsulates an opening at one end of the mounting slot, the pushing cylinder is fixedly mounted on the mounting plate, and the moving end of the pushing cylinder passes through the mounting plate and extends into the mounting slot, and the moving end of the pushing cylinder is fixedly connected to the side of the support plate; A plurality of slide rails arranged along the Y-axis direction are arranged at the bottom of the installation groove, and the bottom of the support plate is slidably connected to each of the slide rails.

2. The thin material multi-hole processing device according to claim 1, characterized in that: The bottoms of the cleaning rod, the first telescopic rod and the second telescopic rod are arranged flush with each other.

3. The thin material multi-hole processing device according to claim 1, characterized in that: The material pressing device includes a first lifting cylinder, a second lifting cylinder and a clamping plate. The first lifting cylinder and the second lifting cylinder are respectively fixedly installed on both side edges of the base, and the moving ends of the first lifting cylinder and the second lifting cylinder are fixedly installed on the bottom of the clamping plate. The clamping plate is located above the support plate and the chip cleaning device.

4. The thin material multi-hole processing device according to claim 3, characterized in that: The main bodies of the first lifting cylinder and the second lifting cylinder are located below the plane of the upper surface of the base.

5. The thin material multi-hole processing device according to claim 3, characterized in that: Assembly grooves are provided on both side surfaces of the base, and the first lifting cylinder and the second lifting cylinder are respectively installed in the two assembly grooves. The moving ends of the first lifting cylinder and the second lifting cylinder respectively pass through the tops of the two assembly grooves and extend upward to be fixedly connected to the middle positions of the two end edges of the bottom of the splint.

6. The thin material porous processing device according to any one of claims 1 to 5, characterized in that: The suction device includes a guide rail, a suction pin, a fixed block and a suction cylinder. The guide rail is fixedly installed on the side of the base along the Y-axis direction, the fixed block is fixedly installed on the side of the base, and the fixed block is arranged adjacent to one end of the guide rail. The suction pin is slidably installed on the guide rail, and the suction port of the suction pin is located above the horizontal plane of the upper surface of the base. The suction cylinder is fixedly installed on the fixed block, and the moving end of the suction cylinder passes through the fixed block and is fixedly connected to the side of the suction pin.

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