PCB board surface bump defect detection method, system, and electronic equipment

Abstract

The embodiment of the present application provides a method, system, computer-readable medium and electronic device for detecting convex point defects on the surface of a PCB board. The method includes first acquiring a first image of the PCB board, the first image including a plurality of convex points; then preprocessing the first image to obtain a second image; then performing image segmentation on the second image to obtain a third image including suspected defective convex points; performing plane fitting on the third image to obtain a fourth image; finally calculating the height of the fourth image, comparing the calculated actual height with a preset height threshold, and determining the surface convex points corresponding to the actual height greater than the height threshold as abnormal, so as to enable efficient, accurate and stable detection.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a method, system, computer-readable medium and electronic device for detecting bump defects on a PCB surface. Background Art

[0002] PCB stands for "Printed Circuit Board", which is a printed circuit board. It is an important electronic component and a support for electronic components. It is mainly made through electronic printing.

[0003] Existing printed circuit boards, also known as PCB boards, have certain drawbacks in the solder mask production process. The main reason is that the printed circuit board ink is a viscous liquid. Due to its unstable flow direction and uneven thermal conductivity, it is very easy to produce unpositioned protrusions on the edge of the hole during curing.

[0004] Regarding the defect detection of raised surfaces on PCB boards, due to the complex surface of PCB boards, high detection accuracy, and difficulty in image processing, there is currently no effective technical solution to efficiently, accurately, and stably detect the defects of raised surfaces on PCB boards. Summary of the invention

[0005] The embodiments of the present application provide a method, system, computer-readable medium and electronic device for detecting convex point defects on the surface of a PCB board, thereby efficiently, accurately and stably detecting convex point defects on the surface of a PCB board.

[0006] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0007] According to one aspect of an embodiment of the present application, a method for detecting surface convex point defects of a PCB board is provided, comprising: acquiring a first image of the PCB board, the first image comprising a plurality of convex points; preprocessing the first image to obtain a second image; performing image segmentation on the second image to obtain a third image comprising suspected defective convex points; performing plane fitting on the third image to obtain a fourth image; performing height calculation on the fourth image, comparing the calculated actual height with a preset height threshold, and determining the surface convex points corresponding to the actual heights greater than the height threshold as abnormal.

[0008] In some embodiments of the present application, based on the above solution, performing image segmentation on the second image to obtain a third image includes:

[0009] Determine suspected salient points by performing threshold processing and edge extraction on the second image;

[0010] A suspected area is determined according to the suspected convex point, and the suspected area is used as the third image.

[0011] In some embodiments of the present application, based on the above solution, plane fitting is performed on the third image to obtain a fourth image, including:

[0012] Select plane points within the preset range around the convex point and perform plane fitting.

[0013] In some embodiments of the present application, based on the aforementioned solution, the preset range is 3 mm.

[0014] In some embodiments of the present application, based on the above solution, plane fitting is performed on the third image, including:

[0015] Calculating the heights of the salient points in the first image to obtain a height data set;

[0016] The height data are sorted in descending order according to the numerical values, the height data with a front preset percentage are determined as candidate salient points, and the heights of the candidate salient points to the fitting plane are calculated respectively.

[0017] According to one aspect of the embodiments of the present application, a PCB surface bump defect detection system is provided, comprising:

[0018] An acquisition module is configured to acquire a first image of the PCB board, wherein the first image includes a plurality of convex points;

[0019] A preprocessing module, configured to preprocess the first image to obtain a second image;

[0020] An image segmentation module is configured to perform image segmentation on the second image to obtain a third image including suspected defect convex points;

[0021] a plane fitting module, configured to perform plane fitting on the third image to obtain a fourth image;

[0022] The calculation module is configured to calculate the height of the fourth image, compare the calculated actual height with a preset height threshold, and determine the surface convex point corresponding to the actual height greater than the height threshold as an abnormality.

[0023] In some embodiments of the present application, based on the above solution, the image segmentation module includes:

[0024] a processing unit configured to determine suspected salient points by performing threshold processing and edge extraction on the second image;

[0025] The determining unit is configured to determine a suspected area according to the suspected salient point, and use the suspected area as the third image.

[0026] In some embodiments of the present application, based on the above solution, the plane fitting module includes:

[0027] The plane fitting unit is configured to select plane points within a preset range around the convex point to perform plane fitting.

[0028] In some embodiments of the present application, based on the above solution, the plane fitting module includes:

[0029] A height calculation unit, configured to calculate the heights of the salient points in the first image to obtain a height data set;

[0030] The computing unit is configured to sort the height data in descending order according to numerical values, determine the height data of the front preset percentage as candidate convex points, and respectively calculate the heights of the candidate convex points to the fitting plane.

[0031] According to one aspect of an embodiment of the present application, a computer-readable medium is provided, on which a computer program is stored, characterized in that when the computer program is executed by a processor, the following steps are implemented: obtaining a first image of a PCB board, the first image including a plurality of convex points; preprocessing the first image to obtain a second image; performing image segmentation on the second image to obtain a third image including suspected defective convex points; performing plane fitting on the third image to obtain a fourth image; performing height calculation on the fourth image, comparing the calculated actual height with a preset height threshold, and determining the surface convex points corresponding to the actual height greater than the height threshold as abnormal.

[0032] According to one aspect of an embodiment of the present application, there is provided an electronic device, including:

[0033] one or more processors;

[0034] A storage device, used to store one or more programs, when the one or more programs are executed by the one or more processors, enables the one or more processors to implement the following steps:

[0035] Acquire a first image of a PCB board, the first image including a plurality of convex points; preprocess the first image to obtain a second image; perform image segmentation on the second image to obtain a third image including suspected defective convex points; perform plane fitting on the third image to obtain a fourth image; perform height calculation on the fourth image, compare the calculated actual height with a preset height threshold, and determine the surface convex points corresponding to the actual height greater than the height threshold as abnormal.

[0036] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0038] Figure 1 A flow chart of a method for detecting bump defects on a PCB surface according to an embodiment of the present application is schematically shown;

[0039] Figure 2 A flow chart of a method for detecting bump defects on a PCB surface according to another embodiment of the present application is schematically shown;

[0040] Figure 3 A schematic diagram of a PCB surface bump defect detection system according to an embodiment of the present application is schematically shown;

[0041] Figure 4 A schematic diagram of the structure of a computer system suitable for implementing an electronic device of an embodiment of the present application is shown. DETAILED DESCRIPTION

[0042] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0043] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, systems, implementations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0044] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0045] The flowcharts shown in the accompanying drawings are only exemplary and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps can be decomposed, and some operations / steps can be combined or partially combined, so the actual execution order may change according to actual conditions.

[0046] The implementation details of the technical solution of the embodiment of the present application are described in detail below:

[0047] Figure 1 The flowchart of the method for detecting bump defects on the surface of a PCB board according to an embodiment of the present application is shown. Figure 1 As shown, the PCB board surface convex point defect detection method at least includes steps S110 to S150, which are described in detail as follows:

[0048] In step S110, a first image of a PCB board is acquired, wherein the first image includes a plurality of bumps.

[0049] The first image of the PCB board can be captured by a high-definition camera.

[0050] In step S120, the first image is preprocessed to obtain a second image.

[0051] Among them, preprocessing is first performed to reduce the noise of the image and smooth it to facilitate image calculation in the subsequent steps.

[0052] In step S130, the second image is segmented to obtain a third image including suspected defect convex points.

[0053] The purpose of performing image segmentation on the second image is to find out salient points that may have defects.

[0054] As an embodiment of the present invention, Figure 2 As shown, the image segmentation is performed on the second image to obtain a third image including suspected salient points, including:

[0055] Step S1301: Determine suspected salient points by performing threshold processing and edge extraction on the second image.

[0056] Step S1302: determining a suspected region according to the suspected salient point, and using the suspected region as a third image.

[0057] In step S140, plane fitting is performed on the third image to obtain a fourth image.

[0058] In some embodiments of the present application, performing plane fitting on the third image to obtain a fourth image includes:

[0059] A plane point is selected within a preset range around the convex point to perform plane fitting. In some embodiments of the present application, preferably, the preset range is 3 mm.

[0060] In some embodiments of the present application, performing plane fitting on the third image includes:

[0061] Step S1401: Calculate the heights of the salient points in the first image to obtain a height data set.

[0062] Step S1402: sorting the height data in descending order according to the numerical values, determining the height data of the front preset percentage as candidate salient points, and calculating the heights of the candidate salient points to the fitting plane respectively.

[0063] The preset percentage is preferably 20%.

[0064] In step S150, the height of the fourth image is calculated, the calculated actual height is compared with a preset height threshold, and the surface convex point corresponding to the actual height greater than the height threshold is determined as abnormal.

[0065] Among them, the height threshold is preferably 0.028 mm.

[0066] The PCB board surface convex point defect detection method in this embodiment first obtains a first image of the PCB board, the first image includes a plurality of convex points; then preprocesses the first image to obtain a second image; then performs image segmentation on the second image to obtain a third image including suspected defective convex points; performs plane fitting on the third image to obtain a fourth image; finally, performs height calculation on the fourth image, compares the calculated actual height with a preset height threshold, and determines the surface convex points corresponding to the actual height greater than the height threshold as abnormal, so as to enable efficient, accurate and stable detection.

[0067] Figure 3 A block diagram of a PCB surface bump defect detection system according to an embodiment of the present application is shown.

[0068] Reference Figure 3 As shown, a PCB board surface bump defect detection system 300 according to an embodiment of the present application includes:

[0069] An acquisition module is configured to acquire a first image of the PCB board, wherein the first image includes a plurality of convex points;

[0070] A preprocessing module, configured to preprocess the first image to obtain a second image;

[0071] An image segmentation module is configured to perform image segmentation on the second image to obtain a third image including suspected defect convex points;

[0072] a plane fitting module, configured to perform plane fitting on the third image to obtain a fourth image;

[0073] The calculation module is configured to calculate the height of the fourth image, compare the calculated actual height with a preset height threshold, and determine the surface convex point corresponding to the actual height greater than the height threshold as an abnormality.

[0074] In some embodiments of the present application, based on the above solution, the image segmentation module includes:

[0075] a processing unit configured to determine suspected salient points by performing threshold processing and edge extraction on the second image;

[0076] The determining unit is configured to determine a suspected area according to the suspected salient point, and use the suspected area as the third image.

[0077] In some embodiments of the present application, based on the above solution, the plane fitting module includes:

[0078] The plane fitting unit is configured to select plane points within a preset range around the convex point to perform plane fitting.

[0079] In some embodiments of the present application, based on the above solution, the plane fitting module includes:

[0080] A height calculation unit, configured to calculate the heights of the salient points in the first image to obtain a height data set;

[0081] The computing unit is configured to sort the height data in descending order according to numerical values, determine the height data of the front preset percentage as candidate convex points, and respectively calculate the heights of the candidate convex points to the fitting plane.

[0082] In this embodiment, the PCB board surface convex point defect detection system can be provided with an acquisition module configured to acquire a first image of the PCB board, wherein the first image includes a plurality of convex points; a preprocessing module configured to preprocess the first image to obtain a second image; an image segmentation module configured to perform image segmentation on the second image to obtain a third image including suspected defective convex points; a plane fitting module configured to perform plane fitting on the third image to obtain a fourth image; and a calculation module configured to perform height calculation on the fourth image, compare the calculated actual height with a preset height threshold, and determine the surface convex points corresponding to the actual height greater than the height threshold as abnormal, thereby enabling efficient, accurate and stable detection.

[0083] Figure 4 A schematic diagram of the structure of a computer system suitable for implementing an electronic device of an embodiment of the present application is shown.

[0084] It should be noted that Figure 4 The computer system 400 of the electronic device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0085] like Figure 4 As shown, the computer system 400 includes a central processing unit (CPU) 401, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 402 or the program loaded from the storage part 408 to the random access memory (RAM) 403, such as executing the method described in the above embodiment. In the RAM 403, various programs and data required for system operation are also stored. The CPU 401, ROM 402 and RAM 403 are connected to each other through a bus 404. An input / output (I / O) interface 405 is also connected to the bus 404.

[0086] The following components are connected to the I / O interface 405: an input section 406 including a keyboard, a mouse, etc.; an output section 407 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 408 including a hard disk, etc.; and a communication section 409 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 409 performs communication processing via a network such as the Internet. A drive 410 is also connected to the I / O interface 405 as needed. A removable medium 411, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 410 as needed so that a computer program read therefrom is installed into the storage section 408 as needed.

[0087] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a computer program for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication section 409, and / or installed from a removable medium 411. When the computer program is executed by a central processing unit (CPU) 401, various functions defined in the system of the present application are executed.

[0088] It should be noted that the computer-readable medium shown in the embodiment of the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, - but not limited to - an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium may be any tangible medium containing or storing a program, which may be used by an instruction execution system, device or device or used in combination with it. In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, wherein a computer-readable computer program is carried. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, which may send, propagate, or transmit programs for use by or in conjunction with an instruction execution system, apparatus, or device. The computer program contained on the computer-readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0089] The flowchart and block diagram in the accompanying drawings illustrate the possible architecture, functions and operations of the system, method and computer program product according to various embodiments of the present application. Wherein, each box in the flowchart or block diagram can represent a module, a program segment, or a part of the code, and the above-mentioned module, program segment, or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of boxes in the block diagram or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0090] The units involved in the embodiments described in this application may be implemented by software or hardware, and the units described may also be set in a processor. The names of these units do not, in some cases, constitute limitations on the units themselves.

[0091] According to one aspect of the present application, a computer program product or a computer program is provided, the computer program product or the computer program comprising computer instructions, the computer instructions being stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes the methods provided in the above-mentioned various optional implementations.

[0092] As another aspect, the present application also provides a computer-readable medium, which may be included in the electronic device described in the above embodiment; or may exist independently without being assembled into the electronic device. The above computer-readable medium carries one or more programs, and when the above one or more programs are executed by an electronic device, the electronic device implements the method described in the above embodiment.

[0093] It should be noted that, although several modules or units of the equipment for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present application, the features and functions of two or more modules or units described above can be embodied in one module or unit. On the contrary, the features and functions of one module or unit described above can be further divided into being embodied by multiple modules or units.

[0094] Through the description of the above implementation methods, it is easy for those skilled in the art to understand that the example implementation methods described here can be implemented by software or by combining software with necessary hardware. Therefore, the technical solution according to the implementation methods of the present application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, and includes several instructions to enable a computing device (which can be a personal computer, a server, a touch terminal, or a network device, etc.) to execute the method according to the implementation methods of the present application.

[0095] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the embodiments disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application.

[0096] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A method for detecting convex point defects on the surface of a PCB board, characterized in that: include: Acquire a first image of a PCB board, wherein the first image includes a plurality of convex points; Preprocessing the first image to obtain a second image; Performing image segmentation on the second image to obtain a third image including suspected defect convex points; Performing plane fitting on the third image to obtain a fourth image; Calculating the height of the fourth image, comparing the calculated height with a preset height threshold, and determining the surface convex point corresponding to the actual height greater than the height threshold as abnormal; The height threshold is 0.028 mm; The performing plane fitting on the third image to obtain a fourth image includes: Select plane points within a preset range around the convex point to perform plane fitting; the preset range is 3mm; The height calculation includes: Calculating the heights of the salient points in the first image to obtain a height data set; The height data are sorted in descending order according to the numerical values, the height data with a front preset percentage are determined as candidate salient points, and the heights of the candidate salient points to the fitting plane are calculated respectively.

2. The method for detecting convex point defects on the surface of a PCB board as claimed in claim 1, characterized in that: The performing image segmentation on the second image to obtain a third image includes: Determine suspected salient points by performing threshold processing and edge extraction on the second image; A suspected area is determined according to the suspected convex point, and the suspected area is used as the third image.

3. A PCB board surface bump defect detection system, characterized in that: include: An acquisition module is configured to acquire a first image of the PCB board, wherein the first image includes a plurality of convex points; A preprocessing module, configured to preprocess the first image to obtain a second image; An image segmentation module is configured to perform image segmentation on the second image to obtain a third image including suspected defect convex points; a plane fitting module, configured to perform plane fitting on the third image to obtain a fourth image; a calculation module configured to calculate the height of the fourth image, compare the calculated height with a preset height threshold, and determine the surface convex point corresponding to the actual height greater than the height threshold as abnormal; The height threshold is 0.028 mm; The plane fitting module comprises: A plane fitting unit is configured to select plane points within a preset range around the convex point to perform plane fitting; the preset range is 3 mm; The height calculation includes: Calculating the heights of the salient points in the first image to obtain a height data set; The height data are sorted in descending order according to the numerical values, the height data with a front preset percentage are determined as candidate salient points, and the heights of the candidate salient points to the fitting plane are calculated respectively.

4. The PCB surface bump defect detection system as claimed in claim 3, characterized in that: The image segmentation module comprises: a processing unit configured to determine suspected salient points by performing threshold processing and edge extraction on the second image; The determining unit is configured to determine a suspected area according to the suspected salient point, and use the suspected area as the third image.

5. A computer readable medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method for detecting bump defects on the surface of a PCB board as described in any one of claims 1 to 2 is implemented.

6. An electronic device, characterized in that: include: one or more processors; A storage device for storing one or more programs, when the one or more programs are executed by the one or more processors, enables the one or more processors to implement the PCB board surface bump defect detection method as described in any one of claims 1 to 2.

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