Stacked electronic module and method of manufacturing the same

Abstract

A stacked electronic module and a manufacturing method thereof are disclosed. The stacked electronic module includes a magnetic device including a magnetic body, a plurality of electrodes of the magnetic device disposed on upper and lower surfaces of the magnetic body, a package encapsulating the magnetic body, and a plurality of conductive layers disposed on the package and electrically connected to the plurality of electrodes.

Description

Technical Field

[0001] This invention relates to an electronic module, and more particularly to a stacked electronic module. Background Technology

[0002] Electronic structures, such as power modules and DC-DC converters, typically include circuit boards, such as PCBs, that carry multiple electronic components, as well as interconnecting circuitry on the PCBs to electrically connect the multiple electronic components. However, PCBs increase the height of the module and the conduction paths between the electronic devices.

[0003] Therefore, the industry needs a better solution to address these issues. Summary of the Invention

[0004] One object of the present invention is to provide a stacked electronic module to effectively reduce the height of the module and shorten the conduction path between electronic components.

[0005] An embodiment of the present invention provides a stacked electronic module, comprising: a magnetic device including a magnetic body, wherein at least one first electrode of the magnetic device is disposed on an upper surface of the magnetic body, and at least one second electrode of the magnetic device is disposed on a lower surface of the magnetic body; a package including a first insulating material to cover the magnetic body, wherein the at least one first electrode and the at least one second electrode are exposed from the package; a second insulating layer disposed on an upper surface of the package and covering the at least one first electrode, wherein a plurality of first conductive patterns are disposed on the second insulating layer and electrically connected to the at least one first electrode; and a third insulating layer disposed on a lower surface of the package and covering the at least one second electrode, wherein a plurality of second conductive patterns are disposed on the third insulating layer and electrically connected to the at least one second electrode.

[0006] In one embodiment, at least one side surface of the magnetic device is provided with a plurality of third conductive patterns, and the plurality of second conductive patterns are electrically connected to the plurality of first conductive patterns through the plurality of third conductive patterns.

[0007] In one embodiment, the magnetic device includes a coil disposed inside the magnetic body, wherein the first electrode and the second electrode are electrically connected to the coil.

[0008] In one embodiment, the magnetic device is a choke, wherein a coil is disposed inside the magnetic body to form the choke, and the first electrode and the second electrode are electrically connected to the coil.

[0009] In one embodiment, the magnetic body has a first coil and a second coil disposed inside it, wherein the at least one first electrode and the at least one second electrode are electrically connected to the first coil and the second coil, respectively.

[0010] In one embodiment, the package includes an ABF.

[0011] In one embodiment, an electronic device is further included, disposed above the package and electrically connected to the first electrode of the magnetic device, wherein the second insulating layer covers the electronic device.

[0012] In one embodiment, an electronic device is further included, disposed above the second insulating layer, wherein the electronic device is electrically connected to the plurality of first conductive patterns.

[0013] In one embodiment, the magnetic device is disposed in a through hole of a circuit board, wherein the package is disposed on the magnetic device and the circuit board.

[0014] In one embodiment, it further includes an active element and a passive element disposed on the second insulating layer, wherein the active element and the passive element are electrically connected to the plurality of first conductive patterns.

[0015] An embodiment of the present invention discloses a method for forming a stacked electronic module. The method includes: providing a magnetic device, wherein the magnetic device includes a magnetic body, wherein at least one first electrode of the magnetic device is disposed on an upper surface of the magnetic body, and at least one second electrode of the magnetic device is disposed on a lower surface of the magnetic body; forming a package, wherein the package includes a first insulating material to cover the magnetic body, wherein at least one first electrode and at least one second electrode are exposed from the package; forming a second insulating layer, wherein the second insulating layer is formed on an upper surface of the package to cover the at least one first electrode, wherein a plurality of first conductive patterns are disposed on the second insulating layer and electrically connected to the at least one first electrode; and forming a third insulating layer, wherein the third insulating layer is formed on a lower surface of the package to cover the at least one second electrode, wherein a plurality of second conductive patterns are disposed on the third insulating layer and electrically connected to the at least one second electrode.

[0016] In one embodiment, at least one side surface of the magnetic device is provided with a plurality of third conductive patterns, and the plurality of second conductive patterns are electrically connected to the plurality of first conductive patterns through the plurality of third conductive patterns.

[0017] In one embodiment, the magnetic device includes a coil disposed inside the magnetic body, wherein the first electrode and the second electrode are electrically connected to the coil.

[0018] In one embodiment, the magnetic device is a choke, wherein a coil is disposed inside the magnetic body to form the choke, and the first electrode and the second electrode are electrically connected to the coil.

[0019] In one embodiment, the coupling coefficient between the first coil and the second coil is zero.

[0020] In one embodiment, an electronic device is disposed above the package and electrically connected to the first electrode of the magnetic device, wherein the second insulating layer covers the electronic device.

[0021] To make the above and other features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings for detailed explanation. Attached Figure Description

[0022] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0023] Figure 1A This is a top view of a stacked electronic module 100 according to an embodiment of the present invention.

[0024] Figure 1B This is a bottom view of a stacked electronic module 100 according to an embodiment of the present invention.

[0025] Figure 1C This is a side view of a stacked electronic module 100 according to an embodiment of the present invention.

[0026] Figure 1D This is a side view of a stacked electronic module 100 according to an embodiment of the present invention.

[0027] Figure 2 This is a flowchart of forming a stacked electronic module according to an embodiment of the present invention.

[0028] Figure 3 This is a flowchart of forming multiple stacked electronic modules according to an embodiment of the present invention.

[0029] Figure 4A This is an exploded view of a stacked electronic module according to an embodiment of the present invention.

[0030] Figure 4B This is a side view of a stacked electronic module according to an embodiment of the present invention.

[0031] Explanation of reference numerals in the attached drawings: 100 - Magnetic device; 101g - Magnetic body; 101a, 101b - First electrode; 101c, 101d - Second electrode; 150 - Package; 102a - Second insulating layer; 104a - First conductive pattern; 103 - Third insulating layer; 105 - Second conductive pattern; 101e, 101f, 101s - Third conductive pattern; 110a, 110b - Electronic device; 110h - Second package; 120 - Passive component; 104v - Conductive via; 106a, 106b - Electrode; 200 - Circuit board; 201 - Conductive via; 300 - Stacked structure. Detailed Implementation

[0032] Figure 1A A top view of a magnetic device 100 according to an embodiment of the present invention is shown. Figure 1B This is a bottom view of the magnetic device 100. Figure 1C This is a side view of a stacked electronic module including the magnetic device 100. (As shown) Figure 1B and Figure 1C As shown, the stacked electronic module includes: a magnetic device 100, including a magnetic body 101g, wherein at least one first electrode 101a, 101b of the magnetic device 100 is disposed on the upper surface of the magnetic body 101g, as shown. Figure 1A As shown. At least one second electrode 101c, 101d of the magnetic device is disposed on the lower surface of the magnetic body 101g, as shown. Figure 1B As shown. The package 150 includes a first insulating material to encapsulate the magnetic body 101g, as... Figure 1C As shown, at least one first electrode 101a, 101b and at least one second electrode 101c, 101d are exposed from the package 150; a second insulating layer 102a is disposed on the upper surface of the package 150 and covers at least one first electrode 101a, 101b, wherein a plurality of first conductive patterns 104a are disposed on the second insulating layer 102a and electrically connected to the first electrodes 101a, 101b; and a third insulating layer 103 is disposed on the lower surface of the package 150 and covers at least one second electrode 101c, 101d, wherein a plurality of second conductive patterns 105 are disposed on the third insulating layer 103 and electrically connected to the second electrodes 101c, 101d. In one embodiment, the package 150 comprises resin. In one embodiment, the package 150 comprises ABF (Ajinomoto Build-up Film). In one embodiment, the package 150 is made of ABF (Ajinomoto Build-up Film).

[0033] In one embodiment, a plurality of third conductive patterns 101e, 101f, and 101s are disposed on at least one side surface of the magnetic device 100, wherein a plurality of second conductive patterns 105 are electrically connected to a plurality of first conductive patterns 104a through the plurality of third conductive patterns 101e, 101f, and 101s.

[0034] In one embodiment, the magnetic device includes a choke, wherein a coil is disposed in the magnetic body to form the choke, and wherein a first electrode and a second electrode are electrically connected to the coil.

[0035] In one embodiment, the magnetomagnetic device is a choke, wherein a coil is disposed in a magnetic body to form the choke, and a first electrode and a second electrode are electrically connected to the coil.

[0036] In one embodiment, a first coil and a second coil are disposed in a magnetic body, wherein a plurality of first electrodes are disposed on the upper surface of the magnetic body, and a plurality of second electrodes are disposed on the lower surface of the magnetic body.

[0037] In one embodiment, the coupling coefficient between the first coil and the second coil is zero.

[0038] In one embodiment, such as Figure 1C As shown, at least one electronic device 110a, 110b is disposed on the upper surface of the package 150 and electrically connected to at least one first electrode 101a, 101b of the magnetic device, wherein the second insulating layer 102a covers at least one electronic device 110a, 110b.

[0039] In one embodiment, such as Figure 1C As shown, a passive element 120 is disposed on the second insulating layer 102a.

[0040] In one embodiment, such as Figure 1C As shown, a plurality of first conductive patterns 104a are electrically connected to at least one electronic device 110a, 110b through at least one conductive via 104v.

[0041] In one embodiment, such as Figure 1C As shown, multiple electrodes 106a and 106b are disposed on the lower surface of the magnetic device.

[0042] In one embodiment, such as Figure 1C As shown, each of the plurality of electrodes 106a, 106b has a surface mount pad.

[0043] Figure 1D This is a side view of a stacked electronic module 100 according to an embodiment of the present invention.

[0044] In one embodiment, such as Figure 1D As shown, at least one second electronic device 110a, 110b is disposed above the second insulating layer 102a, and the at least one electronic device 110a, 110b is electrically connected to a plurality of first conductive patterns 104a.

[0045] In one embodiment, such as Figure 1D As shown, multiple first conductive patterns 104a are electrically connected to at least one first electrode 101a, 101b through at least one conductive via 104v.

[0046] In one embodiment, at least one electronic device 110a, 110b includes an IC.

[0047] In one embodiment, at least one electronic device 110a, 110b includes a passive electronic component.

[0048] In one embodiment, at least one second electronic device includes a flip chip.

[0049] In one embodiment, at least one second electronic device includes active electronic components.

[0050] In one embodiment, at least one second electronic device includes passive electronic components.

[0051] In one embodiment, at least one second electronic device includes active electronic components and passive electronic components.

[0052] In one embodiment, such as Figure 1D As shown, the second package 101h is disposed above a plurality of first conductive patterns 104a and a second insulating layer 102a to cover at least one second electronic device 110a, 110b.

[0053] In one embodiment, a heat sink is disposed above at least one second electronic device 110a, 110b for heat dissipation.

[0054] In one embodiment, at least one second electronic component 110a, 110b includes a flip chip, wherein a heat sink is disposed on the flip chip for heat dissipation.

[0055] In one embodiment, such as Figure 2As shown, a method for forming a stacked electronic module is provided, the method comprising: (S201) providing a magnetic device including a magnetic body, wherein at least one first electrode of the magnetic device is disposed on an upper surface of the magnetic body, and at least one second electrode of the magnetic device is disposed on a lower surface of the magnetic body; (S202) forming a package including a first insulating material to encapsulate the magnetic body, wherein at least one first electrode and at least one second electrode are exposed from the package; (S203) forming a second insulating layer on an upper surface of the package to cover the at least one first electrode, wherein a plurality of first conductive patterns are disposed on the second insulating layer and electrically connected to the at least one first electrode; (S204) forming a third insulating layer on a lower surface of the package to cover the at least one second electrode, wherein a plurality of second conductive patterns are disposed above the third insulating layer and electrically connected to the at least one second electrode.

[0056] In one embodiment, such as Figure 3 As shown, a method for forming a stacked electronic module is provided, the method comprising: (S301) providing a plurality of magnetic devices, wherein each magnetic device includes a magnetic body, wherein at least one first electrode of each magnetic device is disposed on the upper surface of its corresponding magnetic body, and at least one second electrode of the magnetic device is disposed on the lower surface of its corresponding magnetic body; (S302) forming a package, the package including a first insulating material to encapsulate the plurality of magnetic devices, wherein at least one first electrode and at least one second electrode are exposed from the package; (S303) forming a second insulating layer on the upper surface of the package to cover the at least one first electrode, wherein a plurality of first conductive patterns are disposed on the second insulating layer and electrically connected to the at least one first electrode; forming a third insulating layer on the lower surface of the package to cover the at least one second electrode, wherein a plurality of second conductive patterns are disposed on the third insulating layer and electrically connected to the at least one second electrode, wherein the package is cut into pieces, each piece being a single magnetic device.

[0057] Figure 4AThis is an exploded view of a stacked electronic module according to an embodiment of the present invention. Multiple magnetic devices 100 each include a magnetic body. At least one first electrode of each magnetic device 100 is disposed on the upper surface of the magnetic body, and at least one second electrode of each magnetic device 100 is disposed on the lower surface of the magnetic body. A circuit board 200 includes at least one first insulating layer and multiple first conductive patterns separated by the at least one first insulating layer. The circuit board 200 has multiple conductive vias 201. Multiple magnetic devices 100 are respectively disposed in corresponding vias 201 of the circuit board 200, and a second insulating layer is formed above the multiple magnetic devices 100 and the circuit board 200 to form a stacked structure 300 to fix the multiple magnetic devices 100 in the circuit board 200. In one embodiment, the second insulating layer includes ABF (Ajinomoto Build-up Film). In another embodiment, the second insulating layer is formed of ABF (Ajinomoto Build-up Film).

[0058] Figure 4B This is a side view of a stacked electronic module including the magnetic device 100 of FIG1, wherein the stacked electronic module includes: a magnetic device 100 including a magnetic body 101g, wherein at least one first electrode 101a, 101b of the magnetic device 100 is disposed on the upper surface of the magnetic body 101g, and electrodes 101c, 101d of the magnetic device 100 are disposed on the lower surface of the magnetic body 101g; a circuit board 200 including at least one first insulating layer and a plurality of first conductive patterns 101s; a second insulating layer 102a located on the upper surface of the package 101g to cover at least one first electrode 011a, 101b, wherein a plurality of second conductive patterns 104a, 104b are disposed above the second insulating layer 102a and electrically connected to the first electrodes 011a, 101b. At least one first electrode 101a, 101b; and a third insulating layer 103, disposed on the lower surface of the magnetic body 101g and covering at least one second electrode 101c, 101d, wherein a plurality of third conductive patterns 105 are disposed on the third insulating layer 103 and electrically connected to the second electrodes 101c, 101d. In one embodiment, the second insulating layer comprises ABF. In one embodiment, each of the second and third insulating layers comprises ABF. In one embodiment, the second insulating layer is formed of ABF (Ajinomoto Build-up Film). In one embodiment, both the second and third insulating layers are formed of ABF.

[0059] The main advantages of this invention are described as follows: 1. The choke can be embedded in the RDL (Redistribution Layer) on the surface of the choke, effectively reducing the footprint; 2. Insulating layers and circuit layers are fabricated on the choke, eliminating the need for a PCB, which can effectively reduce the module height and shorten the conduction path between electronic components; 3. The flip chip has extremely low upward thermal resistance, and heat sinks can be installed on the flip chip to effectively dissipate module heat.

[0060] Although the present invention has been described with reference to the above embodiments, it will be apparent to those skilled in the art that modifications can be made to the described embodiments without departing from the spirit of the invention. Therefore, the scope of the invention will be defined by the claims, not by the detailed description above.

Claims

1. A stacked electronic module, characterized in that, include: A magnetic device includes a magnetic body, wherein at least one first electrode of the magnetic device is disposed on an upper surface of the magnetic body, and at least one second electrode of the magnetic device is disposed on a lower surface of the magnetic body, and the magnetic device further includes a first coil. An encapsulation comprising a first insulating material to cover the magnetic body, wherein the at least one first electrode and the at least one second electrode are exposed from the encapsulation; A second insulating layer is disposed on an upper surface of the package and covers the at least one first electrode, wherein a plurality of first conductive patterns are disposed on the second insulating layer and electrically connected to the at least one first electrode; A third insulating layer is disposed on a lower surface of the package and covers the at least one second electrode, wherein a plurality of second conductive patterns are disposed on the third insulating layer and electrically connected to the at least one second electrode; as well as A flip chip is disposed above at least one first electrode of the magnetic device and covered by the second insulating layer, and the plurality of first conductive patterns are electrically connected to the flip chip.

2. The stacked electronic module according to claim 1, characterized in that, At least one side surface of the magnetic device is provided with a plurality of third conductive patterns, and the plurality of second conductive patterns are electrically connected to the plurality of first conductive patterns through the plurality of third conductive patterns.

3. The stacked electronic module according to claim 1, characterized in that, The magnetic device is a choke, wherein the first coil is disposed inside the magnetic body to form the choke.

4. The stacked electronic module according to claim 1, characterized in that, The magnetic device also includes a second coil disposed inside the magnetic body, and the coupling coefficient between the first coil and the second coil is zero.

5. The stacked electronic module according to claim 1, characterized in that, It also includes an electronic device disposed above the second insulating layer, wherein the electronic device is electrically connected to the plurality of first conductive patterns.

6. The stacked electronic module according to claim 1, characterized in that, The magnetic device is disposed in a through hole of a circuit board, wherein the package is disposed on the magnetic device and the circuit board.

7. The stacked electronic module according to claim 1, characterized in that, It also includes an active element and a passive element, which are disposed on the second insulating layer, wherein the active element and the passive element are electrically connected to the plurality of first conductive patterns.

8. A method for forming a stacked electronic module, characterized in that, The method includes: A magnetic device is provided, wherein the magnetic device includes a magnetic body, wherein at least one first electrode of the magnetic device is disposed on an upper surface of the magnetic body, and at least one second electrode of the magnetic device is disposed on a lower surface of the magnetic body, and the magnetic device further includes a first coil. A package is formed, wherein the package includes a first insulating material to cover the magnetic body, wherein at least one first electrode and at least one second electrode are exposed from the package; A flip-chip is disposed above the at least one first electrode of the magnetic device; A second insulating layer is formed, wherein the second insulating layer is formed on an upper surface of the package to cover the at least one first electrode and the flip chip, wherein a plurality of first conductive patterns are disposed on the second insulating layer and electrically connected to the at least one first electrode and the flip chip; and A third insulating layer is formed, wherein the third insulating layer is formed on a lower surface of the package to cover the at least one second electrode, wherein a plurality of second conductive patterns are disposed on the third insulating layer and electrically connected to the at least one second electrode.

9. The method according to claim 8, characterized in that, At least one side surface of the magnetic device is provided with a plurality of third conductive patterns, and the plurality of second conductive patterns are electrically connected to the plurality of first conductive patterns through the plurality of third conductive patterns.

10. The method according to claim 8, characterized in that, The magnetic device also includes a second coil, and the first coil and the second coil are disposed inside the magnetic body, with the coupling coefficient between the first coil and the second coil being zero.

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