Electromagnetic shield packaging method and electromagnetic shield packaging structure

Abstract

The application discloses an electromagnetic shielding packaging method and an electromagnetic shielding packaging structure. The electromagnetic shielding method comprises the following steps: arranging a ground layer in an inner layer of a substrate; mounting electronic devices on a first surface of the substrate to form at least two electronic modules; selectively packaging the mounted substrate to form a plastic package covering the electronic modules and two sides of the electronic modules; opening grooves on at least two other sides of the electronic modules, the grooves extending to the ground layer along the thickness direction of the substrate; and covering a conductive layer connected with the ground layer on the substrate, the surface of the plastic package and in the grooves, so that the electronic modules are electromagnetically shielded.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, and more particularly, to an electromagnetic shielding packaging method and an electromagnetic shielding packaging structure. BACKGROUND

[0002] In the field of semiconductor, with the development of SiP (System-in-Package) technology and the demand for miniaturization of electronic devices, the use of packaging technology to integrate active modules and passive devices at the packaging level to form a system to increase the integration of devices, thereby reducing the device area on the circuit board and improving the integration and simplicity of the circuit board.

[0003] SiP technology usually requires an electromagnetic shielding process for the substrate to avoid problems such as electromagnetic interference of the packaged devices or modules. In the prior art, the substrate is usually divided into individual modules after the plastic packaging process, and then the individual modules are subjected to electromagnetic shielding. However, the efficiency of electromagnetic shielding of individual modules is low, and there is a risk of overflow plating. In addition, when the electromagnetic shielding process is performed on individual modules, if the substrate needs to be double-sided mounted, a separate tooling fixture needs to be made, which causes low process flow efficiency and high cost. SUMMARY

[0004] An object of the present application is to provide a new technical solution for an electromagnetic shielding packaging method and an electromagnetic shielding packaging structure.

[0005] According to a first aspect of the present application, an electromagnetic shielding packaging method is provided, comprising:

[0006] providing a ground layer in the inner layer of the substrate;

[0007] mounting electronic devices on the first surface of the substrate to form at least two electronic modules;

[0008] selectively plastic packaging the mounted substrate to form a plastic packaging body covering the electronic modules and covering both sides of the electronic modules;

[0009] respectively opening grooves on at least two other sides of each electronic module, the grooves extending to the ground layer along the thickness direction of the substrate;

[0010] covering a conductive layer connected to the ground layer on the substrate, the surface of the plastic packaging body and the grooves, so that each electronic module is electromagnetically shielded.

[0011] Optionally, the ground layer in the inner layer of the substrate comprises:

[0012] providing a plurality of ground layers in the inner layer of the substrate and connecting each ground layer;

[0013] A cutting path is formed between two adjacent electronic modules, and the ground layer close to the first surface of the substrate is arranged to extend to the cutting path; and

[0014] The remaining ground layers are arranged to avoid the cutting path.

[0015] Optionally, the ground layers are connected by vias.

[0016] Optionally, at least two electronic modules are formed by arranging at least two electronic modules in a matrix, and the plastic package extends along the rows or columns.

[0017] Optionally, a groove is formed between two adjacent electronic modules.

[0018] Optionally, the groove is formed around each electronic module.

[0019] Optionally, the groove is formed by laser processing.

[0020] Optionally, the depth-to-width ratio of the groove is 3:1.

[0021] Optionally, a cutting path is formed between two adjacent electronic modules, and after the electromagnetic shielding of the electronic module, the method further comprises:

[0022] The substrate is cut along the cutting path to obtain a single electronic module; or

[0023] An electronic device is mounted on the second surface of the substrate.

[0024] The substrate is cut along the cutting path to obtain a single electronic module mounted on both surfaces.

[0025] According to a second aspect of the present application, an electromagnetic shielding packaging structure is provided, comprising:

[0026] A substrate, the substrate is provided with a ground layer in the inner layer; the first surface of the substrate has at least two electronic modules;

[0027] A plastic package, the plastic package covers the electronic modules and both sides of the electronic modules; and a groove is formed on at least two other sides of each electronic module, the groove extends to the ground layer in the thickness direction of the substrate;

[0028] A conductive layer, the conductive layer covers the surface of the substrate, the plastic package and the groove, and the conductive layer is connected with the ground layer, and the electromagnetic shielding of each electronic module is formed.

[0029] According to one embodiment of the present application, the present application forms a complete Faraday cage around each electronic module to achieve electromagnetic shielding effect by opening grooves at the other two sides of each electronic module on the substrate after plastic packaging, and covering a conductive layer on the substrate, the surface of the plastic package and the grooves, and connecting the conductive layer with the ground layer arranged in the inner layer of the substrate. The grooves are opened so that the whole board can be electromagnetically shielded without dividing the substrate, avoiding the risk of foreign matter adhesion or overflow plating when electromagnetically shielding a single electronic module, and improving the packaging efficiency.

[0030] Other features and advantages of the present application will become apparent from the following detailed description of illustrative embodiments thereof, which proceeds with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0031] The accompanying drawings incorporated in and forming a part of the specification illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0032] Figure 1 is a schematic diagram of the selective plastic packaging of the substrate in the present application.

[0033] Figure 2 is a side view of Figure 1 .

[0034] Figure 3 is a schematic diagram of the grooves opened at the other two sides of the electronic module in the present application.

[0035] Figure 4 is a schematic diagram of the grooves opened at the four sides of the electronic module in the present application.

[0036] Figure 5 is a side view of Figure 3 or Figure 4 .

[0037] Figure 6 is a schematic diagram of the electromagnetic shielding of the structure in Figure 3 .

[0038] Figure 7 is a schematic diagram of the electromagnetic shielding of the structure in Figure 4 .

[0039] Figure 8 is a side view of Figure 6 or Figure 7 .

[0040] Figure 9 is a schematic diagram of the single electronic module after electromagnetic shielding in the present application.

[0041] Figure 10is a step schematic diagram of the packaging method of the single-sided patch substrate in the present application.

[0042] Figure 11 is a step schematic diagram of the packaging method of the double-sided patch substrate in the present application.

[0043] Wherein: 1, substrate; 2, ground layer; 3, plastic encapsulation; 4, conductive layer; 5, groove; 6, cutting path; 7, electronic module; 71, two sides of the electronic module; 72, the other two sides of the electronic module. DETAILED DESCRIPTION

[0044] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. Note that the relative arrangement, numerical expressions, and numerical values of the components and steps set forth in these embodiments are not limiting to the scope of the present application unless otherwise specifically stated.

[0045] The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application or its application or uses.

[0046] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail herein, but should be considered as part of the specification, where appropriate.

[0047] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary, and not as a limitation. Thus, other examples of exemplary embodiments can have different values.

[0048] Note that like reference numerals and letters indicate like items in the following drawings and that, once an item is defined in one drawing, it need not be discussed further in subsequent drawings.

[0049] According to Figures 1 to 11 As shown, an electromagnetic shielding packaging method is provided, comprising: arranging a ground layer 2 in the inner layer of a substrate 1; mounting electronic devices on the first surface of the substrate 1 to form at least two electronic modules 7; selectively encapsulating the mounted substrate 1 to form a plastic encapsulation 3 covering the electronic modules 7 and covering both sides 71 of the electronic modules as shown in Figure 1 and Figure 2 As shown, a groove 5 is formed at least on the other two sides 72 of each electronic module, extending to the ground layer 2 along the thickness direction of the substrate 1 as shown in Figures 3 to 5 As shown, a conductive layer 4 connected to the ground layer 2 is arranged on the substrate 1, the surface of the plastic encapsulation 3, and the groove 5, so that each electronic module 7 is electromagnetically shielded as shown in Figures 6 to 8 As shown, an electromagnetic shielding packaging method is provided, comprising: arranging a ground layer 2 in the inner layer of a substrate 1; mounting electronic devices on the first surface of the substrate 1 to form at least two electronic modules 7; selectively encapsulating the mounted substrate 1 to form a plastic encapsulation 3 covering the electronic modules 7 and covering both sides 71 of the electronic modules as shown in Figure 1 and Figure 2 As shown, a groove 5 is formed at least on the other two sides 72 of each electronic module, extending to the ground layer 2 along the thickness direction of the substrate 1 as shown in Figures 3 to 5 As shown, a conductive layer 4 connected to the ground layer 2 is arranged on the substrate 1, the surface of the plastic encapsulation 3, and the groove 5, so that each electronic module 7 is electromagnetically shielded as shown in Figures 6 to 8 As shown, an electromagnetic shielding packaging method is provided, comprising: arranging a ground layer 2 in the inner layer of a substrate 1; mounting electronic devices on the first surface of the substrate 1 to form at least two electronic modules 7; selectively encapsulating the mounted substrate 1 to form a plastic encapsulation 3 covering the electronic modules 7 and covering both sides 71 of the electronic modules as shown in Figure 1 and Figure 2 As shown, a groove 5 is formed at least on the other two sides 72 of each electronic module, extending to the ground layer 2 along the thickness direction of the substrate 1 as shown in Figures 3 to 5 As shown, a conductive layer 4 connected to the ground layer 2 is arranged on the substrate 1, the surface of the plastic encapsulation 3, and the groove 5, so that each electronic module 7 is electromagnetically shielded as shown in Figures 6 to 8 As shown, an electromagnetic shielding packaging method is provided, comprising: arranging a ground layer 2 in the inner layer of a substrate 1; mounting electronic devices on the first surface of the substrate 1 to form at least two electronic modules 7; selectively encapsulating the mounted substrate 1 to form a plastic encapsulation 3 covering the electronic modules 7 and covering both sides 71 of the electronic modules as shown in Figure 1 and Figure 2 As shown, a groove 5 is formed at least on the other two sides 72 of each electronic module, extending to the ground layer 2 along the thickness direction of the substrate 1 as shown in Figures 3 to 5 As shown, a conductive layer 4 connected to the ground layer 2 is arranged on the substrate 1, the surface of the plastic encapsulation 3, and the groove 5, so that each electronic module 7 is electromagnetically shielded as shown in Figures 6 to 8

[0050] The order of the above processes can be adjusted according to actual production needs. (Refer to...) Figure 10 and Figure 11 This application does not impose any restrictions on this.

[0051] Specifically, in this embodiment, a ground layer 2 is provided in the inner layer of the substrate 1, extending to the entire board. That is, a ground layer 2 is provided below each of the at least two electronic modules 7 formed by mounting electronic devices, located in the inner layer of the substrate 1, to facilitate grounding of each electronic module 7. The number of electronic modules 7 can be designed according to actual needs. Generally, the configuration of each electronic module 7 is basically the same to facilitate mass production and high efficiency. Placing the ground layer 2 inside the substrate 1 also saves the surface space of the substrate 1, allowing more space on the surface of the substrate 1 for the layout of the electronic modules 7.

[0052] In addition, in this embodiment, the mounted substrate 1 is selectively encapsulated. After encapsulation, a molding compound 3 is formed on each electronic module 7 and on the substrate 1 located on both sides 71 of the electronic modules to protect each electronic module 7 from the influence of the external environment (such as moisture and dust), thereby improving the service life of the electronic modules 7. However, no molding compound 3 is formed on the substrate 1 on the other two sides 72 of the electronic modules, which can save molding compound and reduce the difficulty of subsequent trenching 5. (Refer to...) Figures 1 to 2 The grounding layer 2 is a copper layer. Using copper sheets as the grounding layer 2 effectively ensures its grounding function and improves the performance reliability of each electronic module 7.

[0053] In existing technologies, after molding, the entire molded substrate 1 is typically divided into individual electronic modules 7, and each electronic module 7 is then individually electromagnetically shielded. In one existing method, multiple electronic modules 7 are adhered to a single board before electromagnetic shielding. During this process, adhesive from the board may adhere to the electronic modules 7, making them prone to foreign matter adhesion. Furthermore, during electromagnetic shielding, over-plating of the shielding layer may occur, affecting the functionality of the electronic modules 7.

[0054] In this application, reference is made to Figures 3 to 5 By creating grooves 5 on the substrate 1 at the other two sides 72 of the electronic module not covered by the molding compound 3, and extending the grooves 5 from the surface of the molding compound 3 to the ground layer 2 along the thickness direction of the substrate 1, the electronic module 7 remains a single board when electromagnetically shielded. (Refer to...) Figures 6 to 8 It is not cut into individual pieces and does not need to be glued to a board, which avoids the risk of foreign objects adhering to the electronic module 7.

[0055] The conductive layer 4 contacts the ground layer 2, so that the conductive layer 4 forms a Faraday cage around each electronic module 7, achieving the effect of electromagnetic shielding. In this case, when the conductive layer 4 is formed on the substrate 1, the surface of the plastic package 3, and the groove 5 by sputtering, a film can be sputtered on the inner wall of the groove 5, or the groove 5 can be filled with a conductive material to form the conductive layer 4. The present application does not limit this.

[0056] The groove 5 is formed at least at the other two sides 72 of the electronic module, i.e. at the positions of the substrate 1 where the plastic package 3 is not formed at the other two sides 72 of the electronic module. In this way, the groove 5 can be formed directly from the un-plasticized substrate 1 to the ground layer 2 along the thickness direction of the substrate 1, without the step of forming the plastic package 3, thereby reducing the difficulty of forming the groove 5. As shown in Figure 3 and Figure 6 , which are schematic diagrams of forming the groove 5 at the other two sides 72 of the electronic module.

[0057] After the whole board is subjected to electromagnetic shielding, the whole board can be segmented or subjected to other process treatments according to subsequent processing requirements or production needs. The present application does not limit this.

[0058] Optionally, as shown in Figure 2 , Figure 5 and Figure 8 , the ground layer 2 is arranged in the inner layer of the substrate 1, including: arranging multiple layers of the ground layer 2 in the inner layer of the substrate 1, and connecting each layer of the ground layer 2; a cutting channel 6 is formed between adjacent two electronic modules 7, the ground layer 2 close to the first surface of the substrate 1 is arranged to extend to the cutting channel 6; and the remaining ground layers 2 are arranged to avoid the cutting channel 6.

[0059] Specifically, in this embodiment, the ground layer 2 is arranged in multiple layers, and each layer of the ground layer 2 is connected to each other, which can meet the different current level requirements of each electronic module 7, and enable each electronic module 7 to achieve local grounding to simplify the circuit. In addition, at least two electronic modules 7 are formed by mounting electronic devices on the first surface of the substrate 1, wherein a cutting channel 6 is formed between adjacent two electronic modules 7, the ground layer 2 close to the first surface is arranged to extend to the cutting channel 6, and the remaining ground layers 2 avoid the cutting channel 6, as shown in Figure 2 , Figure 5 and Figure 8 . In this embodiment, the cutting channel 6 refers to the position between adjacent two electronic modules 7, and the width, length, etc. thereof are determined according to the distance between the two electronic modules 7, and do not limit a certain entity structure with a specific size, etc.

[0060] When the groove 5 is formed, the groove 5 can be arranged at the position of the cutting channel 6, as shown inFigure 5 or Figure 6 , the groove 5 extends from the cutting path 6 of the substrate 1 or the plastic package 3 to the ground layer 2, realizing electromagnetic shielding of each electronic module 7. In addition, after the remaining ground layers 2 avoid the cutting path 6, when the whole board needs to be segmented along the cutting path 6, on the one hand, the segmentation efficiency can be improved, and on the other hand, the other ground layers 2 can be avoided to expose the substrate 1 after segmentation, affecting the grounding function of the electronic module 7.

[0061] Optionally, the ground layers 2 between each layer are connected by a via. The via is also called a metalized hole. A common hole (i.e. via, i.e. Figure 2 、 Figure 5 and Figure 8 The black dots shown between the ground layers 2 realize the connection between the ground layers 2, so as to avoid external wiring from the substrate 1 or surface wiring of the substrate 1, further saving the layout space on the substrate 1, and improving the structural compactness and functional reliability of the electronic module 7.

[0062] Optionally, at least two electronic modules 7 are formed, including: arranging the at least two electronic modules 7 in a matrix, and the plastic package 3 extends along the rows or columns.

[0063] Specifically, as shown in Figure 1 、 Figure 3 、 Figure 4 、 Figure 6 and Figure 7 In this application, the selective plastic packaging is used for the substrate 1, not the whole board plastic packaging. Therefore, the setting position of each electronic module 7 needs to be considered during plastic packaging. During mounting, the formed electronic module 7 is arranged in a matrix. During the selective plastic packaging process, the plastic packaging is performed along the rows or columns of the electronic module arrangement, which can reduce the plastic packaging difficulty and improve the packaging efficiency.

[0064] Optionally, a groove 5 is arranged between two adjacent electronic modules 7.

[0065] Specifically, in this embodiment, a groove 5 is arranged between two adjacent electronic modules 7, so that the same groove 5 can be shared by two adjacent electronic modules 7, which reduces the number of grooves and does not affect the final electromagnetic shielding effect of each electronic module 7. When the substrate 1 needs to be segmented into a single electronic module 7, the cutting can be performed along the shared groove 5, which simplifies the packaging steps and improves the packaging efficiency.

[0066] Optionally, as shown in Figure 4 and as shown in Figure 7 The groove 5 is arranged at the periphery of each electronic module 7.

[0067] Specifically, in the embodiment, in addition to the trenches 5 being formed at the two sides 72 of the electronic module where the substrate 1 is not covered by the plastic package 3, the trenches 5 are also formed at the two sides 71 of the electronic module where the plastic package 3 is formed, so that the conductive layer 4 can be connected to the ground layer 2 around the electronic module 7 to form a Faraday cage, thereby improving the electromagnetic shielding effect of the electronic module.

[0068] Optionally, the method of forming the trench 5 is laser processing.

[0069] Laser processing, also known as laser processing, is a processing process in which a high-energy-density light beam is irradiated onto the surface of a material to vaporize or change the color of the material. In the embodiment, the trenches 5 are formed at least at the two sides of the electronic module 7 using laser processing, which does not directly impact the material and thus does not cause mechanical deformation. During laser processing, there is no "tool" wear and no "cutting force" acting on the material. During laser processing, the laser beam has high energy density and fast processing speed, and is a local processing that has little or no effect on non-laser irradiation parts. The above characteristics make it possible to form the trench 5 without damaging the substrate 1 or the plastic package 3, thereby improving the yield of the packaged product.

[0070] Optionally, the depth-to-width ratio of the trench 5 is 3:1.

[0071] Specifically, in the embodiment, the depth-to-width ratio of the trench 5 is further limited. Experimental results show that when the depth-to-width ratio of the trench 5 is 3:1, the electromagnetic shielding effect after the subsequent electromagnetic shielding process is better. If the depth of the trench 5 is too deep, it will affect the coverage thickness of the conductive layer 4 in the trench 5 during the electromagnetic shielding process, and if the thickness of the conductive layer 4 is not enough, it will affect the electromagnetic shielding effect. If the width of the trench 5 is too wide, it will affect the layout space of the substrate 1 and waste the material of the conductive layer 4. The size of the depth and width of the trench 5 in the drawings of the present application is only for illustration and is not in proportion.

[0072] Optionally, as shown in Figures 10 to 11 the cutting channel 6 is formed between the two adjacent electronic modules 7. After the electronic modules 7 are electromagnetically shielded, the method further comprises: cutting the substrate 1 along the cutting channel 6 to obtain a single electronic module 7; or, mounting electronic devices on the second surface of the substrate 1; and cutting the substrate 1 along the cutting channel 6 to obtain a single electronic module 7 with double-sided mounting.

[0073] Specifically, in the embodiment, after the conductive layer 4 is provided for each electronic module 7 to achieve electromagnetic shielding, the substrate 1 can be cut according to actual needs to obtain a single electronic module 7, and the single electronic module 7 can be subjected to other processing procedures. The processing flow is shown in Figure 10 . Figure 10In the embodiment, S101 is a schematic diagram of the substrate 1 after selective plastic packaging; S102 is a schematic diagram of the substrate 1 after at least grooves 5 are formed at the other two sides 72 (non-plastic packaging area) of the electronic module; S103 is a schematic diagram of the substrate 1 after the conductive layer 4 is covered (after electromagnetic shielding); and S104 is a schematic diagram of the single electronic module 7 obtained by dividing the substrate 1 after the conductive layer 4 is covered.

[0074] In addition, according to actual needs, the substrate 1 can be first processed as a whole, for example, electronic devices are attached to the second surface of the substrate 1 to realize more functions. After the attachment, the substrate 1 is divided to obtain the single electronic module 7 with double-sided attachment, which is described with reference to Figure 11 . Figure 11 In the embodiment, S201 is a schematic diagram of the substrate 1 after selective plastic packaging; S202 is a schematic diagram of the substrate 1 after at least grooves 5 are formed at the other two sides 72 (non-plastic packaging area) of the electronic module; S203 is a schematic diagram of the substrate 1 after the conductive layer 4 is covered (after electromagnetic shielding) and electronic devices are attached to the second surface of the substrate 1; and S204 is a schematic diagram of the single electronic module 7 obtained by dividing the substrate 1 after the conductive layer 4 is covered and electronic devices are attached to the second surface of the substrate 1, that is, the single electronic module 7 with double-sided attachment.

[0075] In the prior art, electromagnetic shielding is performed on each electronic module 7 after plastic packaging, and the electronic module 7 needs to be divided. If electronic devices need to be attached to both surfaces of the substrate 1 after the division, the attachment needs to be performed separately. The tooling fixture has requirements on the shape of each small electronic module 7, and has a certain offset tolerance, which may cause that small devices cannot be subjected to SMT on ordinary equipment, and SMT equipment capable of marking and aligning the single small electronic module 7 needs to be purchased, which may cause problems such as low process flow efficiency. In the embodiment, if the substrate 1 needs to be attached with electronic devices on both surfaces, the electronic module 7 does not need to be divided to realize electromagnetic shielding, and therefore the attachment of electronic devices on the second surface of the substrate 1 can be performed as a whole, which reduces the requirements on the tooling fixture and improves the attachment efficiency.

[0076] According to a second aspect of the present application, an electromagnetic shielding packaging structure is provided, which includes a substrate 1, a plastic packaging body 3, and a conductive layer 4. The substrate 1 is provided with a grounding layer 2 in the inner layer. The first surface of the substrate 1 has at least two electronic modules 7. The plastic packaging body 3 covers the electronic modules 7 and the substrate 1 at the two sides 71 of the electronic modules. Grooves 5 are formed at at least the other two sides 72 of each electronic module, and the grooves 5 extend to the grounding layer 2 in the thickness direction of the substrate 1. The conductive layer 4 covers the surface of the substrate 1, the plastic packaging body 3, and the grooves 5, and is connected with the grounding layer 2 to form electromagnetic shielding for each electronic module 7.

[0077] Specifically, reference is made toFigures 1 to 11 In this embodiment, an electromagnetic shielding packaging structure is provided. The grooves 5 allow the substrate 1 to be connected to the ground layer 2 without dividing it into individual electronic modules 7 when covering the conductive layer 4. Each electronic module 7 forms a Faraday cage, achieving electromagnetic shielding. During manufacturing, this packaging structure simplifies the process and improves efficiency. Furthermore, when electronic devices need to be mounted on the second surface of the substrate 1, whole-board mounting is still possible, improving mounting efficiency and reducing packaging costs.

[0078] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0079] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. An electromagnetic shielding encapsulation method, characterized in that, include: A ground layer is provided in the inner layer of the substrate, and the ground layer extends to the entire board; Electronic devices are mounted on the first surface of the substrate to form at least two electronic modules; The substrate after mounting is selectively encapsulated to form an encapsulation covering the electronic module and both sides of the electronic module; Grooves are formed on at least two other sides of each of the electronic modules, the grooves extending along the thickness direction of the substrate to the ground layer; A conductive layer connected to the ground layer is covered on the substrate, the surface of the molding compound, and the trench, so that the conductive layer forms a Faraday cage around each of the electronic modules.

2. The electromagnetic shielding encapsulation method according to claim 1, characterized in that, A ground layer is provided in the inner layer of the substrate, including: Multiple grounding layers are disposed on the inner layer of the substrate, and each grounding layer is connected; A cut-out channel is formed between two adjacent electronic modules, and the ground layer near the first surface of the substrate is configured to extend to the cut-out channel; and, The remaining grounding layers are configured to avoid the cut path.

3. The electromagnetic shielding encapsulation method according to claim 2, characterized in that, Each of the aforementioned grounding layers is connected via vias.

4. The electromagnetic shielding encapsulation method according to claim 1, characterized in that, Forming at least two electronic modules includes: arranging at least two said electronic modules in a matrix, wherein the encapsulation extends along each row or column.

5. The electromagnetic shielding encapsulation method according to claim 4, characterized in that, A groove is formed between two adjacent electronic modules.

6. The electromagnetic shielding encapsulation method according to claim 1, characterized in that, The grooves are respectively opened around each of the electronic modules.

7. The electromagnetic shielding encapsulation method according to claim 1, characterized in that, The method for creating the grooves is laser processing.

8. The electromagnetic shielding encapsulation method according to claim 1, characterized in that, The depth-to-width ratio of the trench is 3:

1.

9. The electromagnetic shielding encapsulation method according to claim 1, characterized in that, A cutting channel is formed between two adjacent electronic modules. After the electronic modules achieve electromagnetic shielding, the system further includes: The substrate is divided along the cutting path to obtain a single electronic module; or, Electronic devices are mounted on the second surface of the substrate; The substrate is divided along the cutting path to obtain a single electronic module with double-sided mounting.

10. An electromagnetic shielding encapsulation structure, formed by encapsulating using the electromagnetic shielding encapsulation method as described in any one of claims 1-9, characterized in that, include: A substrate, wherein a ground layer is provided in the inner layer of the substrate, and the ground layer extends to the entire board; The first surface of the substrate has at least two electronic modules; A molding compound covering the electronic module and both sides of the electronic module; and having grooves on at least the other two sides of each electronic module, the grooves extending along the thickness direction of the substrate to the ground layer; A conductive layer covers the surface of the substrate, the molding compound, and the trench, and is connected to the ground layer, such that the conductive layer forms a Faraday cage around each of the electronic modules.

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