Display device

Abstract

A display device is provided. The display device includes: a display panel including pixels, lower pads electrically connected to the pixels, and first signal lines connecting the pixels and the lower pads; and a touch sensing member disposed on the display panel and including a conductive pattern, an upper pad electrically connected to the conductive pattern, and a second signal line connecting the conductive pattern and the upper pad, wherein the lower pad includes a first lower pad connected to the first signal line and a second lower pad adjacent to the first lower pad, wherein the upper pad includes a first upper pad and a second upper pad adjacent to the first upper pad and connected to the second signal line, wherein the first upper pad is disposed on the first lower pad, and the second upper pad is disposed on the second lower pad.

Description

[0001] This application is a divisional application of the invention patent application with application number 201710638744.X and invention name “Organic Light Emitting Display Module” filed by the applicant with the State Intellectual Property Office of China on July 31, 2017. Technical Field

[0002] The present disclosure herein relates to a display device, and more particularly, to a display device integrated with a touch sensing unit. Background Art

[0003] Various display devices used in multimedia devices such as televisions, mobile phones, desktop computers, navigation devices, and game consoles are being developed. Such display devices include a keyboard or a mouse as an input unit. In addition, in recent years, the display device includes a touch sensing member as an input unit. Summary of the invention

[0004] The present disclosure provides a display device that removes a step portion between a pad unit of a display panel and a pad unit of a touch sensing member to reduce defects occurring in a manufacturing process.

[0005] The present disclosure also provides a display device having improved reliability when a boundary area between an active area and a pad area on a display panel is bent.

[0006] An embodiment of the inventive concept provides an organic light-emitting display module, which includes a base layer, a first circuit layer, a device layer, an encapsulation layer, a plurality of touch electrodes, a second circuit layer and a boundary layer. The base layer includes an active area, a pad area and a boundary area between the active area and the pad area. The first circuit layer is disposed on the active area of ​​the base layer and includes a plurality of inorganic layers and a first conductive pattern. The device layer is disposed on the first circuit layer and includes an organic light-emitting device configured to generate light by using an electrical signal provided from the first conductive pattern. The encapsulation layer is disposed on the device layer. The plurality of touch electrodes are disposed on the encapsulation layer. The second circuit layer is disposed on the pad area of ​​the base layer and includes a plurality of inorganic layers and a second conductive pattern. The boundary layer is disposed on the boundary area of ​​the base layer and includes an organic layer and a third conductive pattern, the third conductive pattern being configured to electrically connect the first conductive pattern to the second conductive pattern. The boundary layer may not include an inorganic layer disposed on the base layer.

[0007] In an embodiment, the plurality of inorganic layers of the first circuit layer may include a first functional layer contacting the base layer, and the plurality of inorganic layers of the second circuit layer may include a second functional layer directly contacting the base layer.

[0008] In an embodiment, the second conductive pattern may include a display panel pad and a touch sensing member pad. The display panel pad may be disposed on the second functional layer and electrically connected to the first conductive pattern. The touch sensing member pad may be disposed adjacent to the display panel pad on the second functional layer, electrically connected to the plurality of touch electrodes, and insulated from the first conductive pattern.

[0009] In an embodiment, the display panel pad may include: a lower display panel pad; and an upper display panel pad disposed on the lower display panel pad and electrically connected to the lower display panel pad.

[0010] In an embodiment, the touch sensing member pad may include: a lower touch sensing member pad; and an upper touch sensing member pad disposed on the lower touch sensing member pad.

[0011] In an embodiment, the first conductive pattern may include a transistor including a control electrode, an input electrode, and an output electrode, and the input electrode, the output electrode, the lower display panel pad, and the lower touch sensing member pad may be disposed on the same layer.

[0012] In an embodiment, the second conductive pattern may further include a dummy electrode disposed on the same layer as the control electrode.

[0013] In an embodiment, the organic light emitting display module may further include a touch signal line extending from at least one of the plurality of touch electrodes to contact the upper touch sensing member pad.

[0014] In an embodiment, the second circuit layer may further include a plurality of insulating layers disposed between the upper display panel pad and the lower display panel pad, and the plurality of insulating layers may be disposed between the upper touch sensing member pad and the lower touch sensing member pad.

[0015] In an embodiment, the lower touch sensing member pads may be electrically insulated from the upper touch sensing member pads.

[0016] In an embodiment, the lower touch sensing member pad may be electrically connected to the upper touch sensing member pad.

[0017] In an embodiment, the upper display panel pad may contact the lower display panel pad, and the upper touch sensing member pad may contact the lower touch sensing member pad.

[0018] In an embodiment, the first functional layer and the second functional layer may include a barrier layer and a buffer layer, respectively.

[0019] In an embodiment, the organic light emitting display module may further include a driving circuit overlapping the pad region and configured to control an electrical signal flowing between the display panel pad and the first conductive pattern.

[0020] In an embodiment, the first circuit layer may further include an organic layer disposed on the first conductive pattern, and the boundary layer may further include an organic layer disposed on the third conductive pattern.

[0021] In an embodiment, the boundary region of the base layer and the boundary layer may be bendable.

[0022] In an embodiment of the inventive concept, an organic light emitting display device includes an organic light emitting display panel and a touch sensing member disposed on the organic light emitting display panel.

[0023] In an embodiment, the organic light emitting display panel may include a base layer, a conductive pattern, a device layer and an encapsulation layer. The base layer may include an active area, a pad area and a boundary area between the active area and the pad area. The conductive pattern may overlap with the active area, be disposed on the base layer, be formed by a low temperature polycrystalline Si (LTPS) process, and include a display panel pad and a touch sensing member pad disposed adjacent to the display panel pad, wherein the touch sensing member pad and the display panel pad may receive an electrical signal from the outside. The device layer may be disposed on the conductive pattern and include an organic light emitting device configured to generate light by using an electrical signal provided from the conductive pattern. The encapsulation layer may be disposed on the device layer.

[0024] In an embodiment, the touch sensing member may include a plurality of touch electrodes and a plurality of touch signal lines. The plurality of touch electrodes may be disposed on the encapsulation layer. The plurality of touch signal lines may extend from the plurality of touch electrodes and be electrically connected to the conductive pattern, wherein a portion of the touch signal line overlapping the boundary region may be disposed between the two organic layers.

[0025] In an embodiment, the organic light emitting display device may further include a printed circuit board electrically connected to the touch sensing member pad and the display panel pad, wherein portions of the organic light emitting display panel and the touch sensing member overlapping the boundary area may be bent.

[0026] In an embodiment of the inventive concept, an organic light emitting display module includes a base layer, a first functional layer, a plurality of transistors, a device layer, an encapsulation layer, a plurality of touch electrodes, a second functional layer, a first display panel pad, a first touch sensing member pad, a second display panel pad, a second touch sensing member pad, and a boundary layer.

[0027] In an embodiment, the base layer may include an active area, a pad area, and a boundary area between the active area and the pad area. The first functional layer may be disposed on the active area of ​​the base layer and include an inorganic material. The plurality of transistors may be disposed on the first functional layer. The device layer may include an organic light emitting device configured to generate light by using an electrical signal provided from at least one of the plurality of transistors. The encapsulation layer may be disposed on the device layer and include an organic material and an inorganic material. The plurality of touch electrodes may be disposed on the encapsulation layer. The second functional layer may be disposed on the pad area of ​​the base layer and include an inorganic material. The first display panel pad may be disposed on the second functional layer and electrically connected to at least one of the plurality of transistors. The first touch sensing member pad may be disposed adjacent to the first display panel pad on the second functional layer and insulated from the plurality of transistors. The second display panel pad may be disposed on the first display panel pad and electrically connected to the first display panel pad. The second touch sensing member pad may be disposed on the first touch sensing member pad and electrically connected to at least one of the plurality of touch electrodes. The boundary layer may be disposed on the boundary area of ​​the base layer and include an organic material. The boundary layer does not include an inorganic layer disposed on the base layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of the inventive concept and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate exemplary embodiments of the inventive concept and together with the description serve to explain the principles of the inventive concept. In the drawings:

[0029] Figure 1A is a perspective view illustrating a first operation mode of a display device according to an embodiment of the inventive concept;

[0030] Figure 1B is a perspective view illustrating a second operation mode of a display device according to an embodiment of the inventive concept;

[0031] Figure 1C is a perspective view illustrating a third operation mode of the display device according to an embodiment of the inventive concept;

[0032] Figure 2A is a perspective view illustrating a first operation mode of a display device according to an embodiment of the inventive concept;

[0033] Figure 2B is a perspective view illustrating a second operation mode of a display device according to an embodiment of the inventive concept;

[0034] Figure 3 is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0035] Figure 4is a cross-sectional view of a display module according to an embodiment of the inventive concept;

[0036] Figure 5 is a plan view of an organic light emitting display panel according to an embodiment of the inventive concept;

[0037] Figure 6 is an equivalent circuit diagram of a pixel according to an embodiment of the inventive concept;

[0038] Figure 7 and Figure 8 is a partial cross-sectional view of an organic light emitting display panel according to an embodiment of the inventive concept;

[0039] Fig. 9 is a plan view of a touch sensing member according to an embodiment of the inventive concept;

[0040] Fig.10 Yes Fig. 9 An enlarged view of part AA;

[0041] Fig.11 is along Fig.10 A cross-sectional view taken along line II';

[0042] Fig.12 yes Figure 5 and Fig. 9 A view of a display panel pad and a touch sensing member pad;

[0043] Fig.13A is along Fig.12 A cross-sectional view taken along line II-II';

[0044] Fig. 13B is along Fig.12 A cross-sectional view taken along line III-III';

[0045] Fig. 13C is along Fig.12 A cross-sectional view taken along line IV-IV';

[0046] Fig.14A is along Fig.12 A cross-sectional view taken along line II-II';

[0047] Fig. 14B is along Fig.12 A cross-sectional view taken along line III-III';

[0048] Fig. 14C and Fig.14D is along Fig.12 A cross-sectional view taken along line IV-IV';

[0049] Fig.15A is along Fig.12A cross-sectional view taken along line II-II';

[0050] Fig. 15B is along Fig.12 A cross-sectional view taken along line III-III';

[0051] Fig. 15C is along Fig.12 A cross-sectional view taken along line IV-IV';

[0052] Fig.16A is along Fig.12 A cross-sectional view taken along line II-II';

[0053] Fig. 16B is along Fig.12 A cross-sectional view taken along line III-III';

[0054] Fig. 16C is along Fig.12 A cross-sectional view taken along line IV-IV';

[0055] Fig.17A is along Fig.12 A cross-sectional view taken along line II-II';

[0056] Fig. 17B is along Fig.12 A cross-sectional view taken along line III-III';

[0057] Fig. 17C and Fig.17D is along Fig.12 A cross-sectional view taken along line IV-IV';

[0058] Fig.18A is along Fig.12 A cross-sectional view taken along line II-II';

[0059] Fig.18B is along Fig.12 A cross-sectional view taken along line III-III';

[0060] Fig.18C is along Fig.12 A cross-sectional view taken along line IV-IV';

[0061] Fig.19A is along Fig.12 A cross-sectional view taken along line II-II';

[0062] Fig.19B is along Fig.12 A cross-sectional view taken along line III-III';

[0063] Fig.19C is along Fig.12A cross-sectional view taken along line IV-IV';

[0064] Fig. 20A is along Fig.12 A cross-sectional view taken along line II-II';

[0065] Fig. 20B is along Fig.12 A cross-sectional view taken along line III-III';

[0066] Fig. 20C is along Fig.12 A cross-sectional view taken along line IV-IV';

[0067] Fig.21A is along Fig.12 A cross-sectional view taken along line II-II';

[0068] Fig. 21B is along Fig.12 A cross-sectional view taken along line III-III';

[0069] Fig. 21C is along Fig.12 A cross-sectional view taken along line IV-IV';

[0070] Fig. 22 and Fig.23 is a plan view of a display module and a printed circuit board according to an embodiment of the inventive concept; and

[0071] Fig.24 is a view illustrating a curved shape of a display module according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0072] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings. In this specification, it will also be understood that when a component (or region, layer, part) is referred to as being "on" another component, "connected to" or "coupled to" another component, the component may be directly disposed on / directly connected to / coupled to the other component, or there may be a third component in between.

[0073] The same reference numerals always represent the same elements. In addition, in the drawings, the thickness, ratio and size of the components are exaggerated for clarity of description. The term "and / or" includes any and all combinations of one or more of the related listed items.

[0074] It will be understood that although terms such as "first" and "second" are used herein to describe various elements, these elements should not be limited by these terms. The terms are used only to separate one component from other component regions. For example, an element referred to as a first element in one embodiment may be referred to as a second element in another embodiment without departing from the scope of the appended claims. Unless indicated to the contrary, terms in the singular may include plural forms.

[0075] In addition, in order to explain the relationship association of components shown in the drawings, “below”, “below”, “above”, “upper”, etc. are used. The terms may be relative concepts and are described based on the directions expressed in the drawings.

[0076] The meaning of “include” or “comprising” indicates a property, a fixed number, a step, an operation, an element, a component or a combination thereof, but does not exclude other properties, fixed numbers, steps, operations, elements, components or a combination thereof.

[0077] Figure 1A is a perspective view illustrating a first operation mode of a display device DD according to an embodiment of the inventive concept. Figure 1B is a perspective view illustrating a second operation mode of the display device DD according to an embodiment of the inventive concept. Figure 1C is a perspective view illustrating a third operation mode of the display device DD according to an embodiment of the inventive concept.

[0078] like Figure 1A As shown in, in the first operating mode, the display surface IS on which the image IM is displayed is parallel to the surface defined by the first direction axis DR1 and the second direction axis DR2. The normal direction of the display surface IS (i.e., the thickness direction of the display device DD) is indicated as the third direction axis DR3. The front surface (or top surface) and the rear surface (or bottom surface) of each component are distinguished by the third direction axis DR3. However, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be relative concepts, and therefore, may become different directions. In the following, the first direction to the third direction may be the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3, respectively, and may be represented by the same reference numerals, respectively. Although a flexible display device is shown in the current embodiment, the embodiments of the inventive concept are not limited thereto. The display device DD according to the current embodiment may be a rigid display device.

[0079] Figures 1A to 1C A foldable display device is shown as an example of the flexible display device DD. Figure 2A and Figure 2BA foldable display device is shown as an example of a flexible display device DD. Alternatively, the display device DD may be a rollable flexible display device, but is not particularly limited. The flexible display device DD according to an embodiment of the inventive concept may be used for large electronic devices such as televisions and monitors and small and medium-sized electronic devices such as mobile phones, desktop PCs, navigation units for vehicles, game consoles, and smart watches.

[0080] like Figure 1A As shown in , the display surface IS of the flexible display device DD may include a plurality of regions. The flexible display device DD includes a display region DD-DA on which an image IM is displayed and a non-display region DD-NDA adjacent to the display region DD-DA. The non-display region DD-NDA may be a region on which no image is displayed. Figure 1A A vase is shown as an example of the image IM. For example, the display area DD-DA may have a rectangular shape. The non-display area DD-NDA may surround the display area DD-DA. However, the embodiments of the inventive concept are not limited thereto. For example, the shapes of the display area DD-DA and the non-display area DD-NDA may be designed relatively.

[0081] The flexible display device DD may include a housing HS. The housing HS may be disposed outside the flexible display device DD to accommodate internal components. Hereinafter, for convenience of description, the housing HS may be shown separately or not described.

[0082] like Figures 1A to 1C As shown in , the display device DD may include a plurality of regions defined according to the form of operation. The display device DD may include a bending area BA that is bent about a bending axis BX, a first non-bending area NBA1 that is not bent, and a second non-bending area NBA2 that is not bent. Figure 1B As shown in FIG. 1 , the display device DD may be bent inwardly so that the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non-bending area NBA2 face each other. Figure 1C As shown in , the display device DD may be bent outward to expose the display surface IS to the outside.

[0083] In an embodiment of the inventive concept, the display device DD may include a plurality of bending areas BA. In addition, the bending area BA may be formed to correspond to the operation of the user for manipulating the display device DD. Figure 1B and Figure 1C Differently, the bending area BA may be formed parallel to the first direction axis DR1 or in a diagonal direction. The bending area BA may have a variable surface area determined according to its curvature radius. In an embodiment of the inventive concept, the display device DD may have only repeated Figure 1A and Figure 1B The shape of the operation mode.

[0084] Figure 2A is a perspective view illustrating a first operation mode of a display device according to an embodiment of the inventive concept. Figure 2B is a perspective view illustrating a second operation mode of a display device according to an embodiment of the inventive concept. Figure 2A and Figure 2B A display device folding the non-display area DD-NDA is shown as an example of a foldable display device DD. As described above, the display device DD according to an embodiment of the inventive concept does not limit the number of the bending area BA and the non-bending area NBA and the position of the bending area.

[0085] Figure 3 is a cross-sectional view of a display device DD according to an embodiment of the inventive concept. Figure 4 is a cross-sectional view of a display module DM according to an embodiment of the inventive concept. Figure 3 shows a cross-sectional view defined by the second direction axis DR2 and the third direction axis DR3, Figure 4 A cross-sectional view defined by the first direction axis DR1 and the third direction axis DR3 is shown.

[0086] like Figure 3 As shown in , the display device DD includes a protective film PM, a window WM, a display module DM, a first adhesive member AM1, and a second adhesive member AM2. The display module DM is disposed between the protective film PM and the window WM. The first adhesive member AM1 is bonded to the display module DM and the protective film PM, and the second adhesive member AM2 is bonded to the display module DM and the window WM. In an embodiment of the inventive concept, the first adhesive member AM1 and the second adhesive member AM2 may be omitted. The protective film PM and the window WM may be continuously manufactured by a coating process.

[0087] The protective film PM protects the display module DM. The protective film PM provides a first outer surface OS-L exposed to the outside and an adhesive surface AS1 bonded to the first adhesive member AM1. The protective film PM prevents external moisture from penetrating into the display module DM and absorbs external impact.

[0088] The protective film PM may include a plastic film. The protective film PM may include one selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone), and combinations thereof.

[0089] The material used to form the protective film PM is not limited to plastic resin. For example, the protective film PM may include an organic / inorganic composite material. The protective film PM may include a porous organic layer and an inorganic material filled into the pores of the porous organic layer. The protective film PM may also include a functional layer disposed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating process.

[0090] The window WM protects the display module DM from external impact and provides an input surface to the user. The window WM provides a second outer surface OS-U exposed to the outside and an adhesive surface AS2 adhered to the second adhesive member AM2. Figures 1A to 1C The display surface IS may be a second outer surface OS-U.

[0091] exist Figure 2A and Figure 2B In the display device DD, the window WM may not be disposed on the curved area BA. However, embodiments of the inventive concept are not limited thereto. For example, in another embodiment of the inventive concept, the window WM may also be disposed on the curved area BA.

[0092] The display module DM includes an organic light emitting display panel DP and a touch sensing unit TS which are integrally formed through a continuous process. The organic light emitting display panel DP generates an image corresponding to input image data (see FIG. Figure 1A The organic light emitting display panel DP provides a first display panel surface BS1-L and a second display panel surface BS1-U facing each other in a thickness direction DR3.

[0093] The touch sensing unit TS acquires coordinate information inputted from the outside. The touch sensing unit TS may be directly disposed on the second display panel surface BS1-U. In the current embodiment, the touch sensing unit TS may be manufactured together with the organic light emitting display panel DP through a continuous process.

[0094] Although not shown separately, the display module DM according to an embodiment of the inventive concept may further include an anti-reflection layer. The anti-reflection layer may include a color filter, a stacked structure of a conductive layer / dielectric layer / conductive layer, or an optical member. The anti-reflection layer may absorb, destructively interfere with, or polarize light incident from the outside to reduce the reflectivity of the external light.

[0095] Each of the first adhesive member AM1 and the second adhesive member AM2 may be an optically transparent adhesive film (OCA), an optically transparent resin (OCR), or a pressure-sensitive adhesive film (PSA). Each of the first adhesive member AM1 and the second adhesive member AM2 may include a photocurable adhesive material or a heat-curable adhesive material. However, embodiments of the inventive concept are not particularly limited thereto.

[0096] Although not specifically shown, the display device DD may further include a frame structure supporting the functional layer to maintain Figures 1A to 2B The frame structure may include an articulated structure or a hinge structure.

[0097] like Figure 4 As shown in , the organic light emitting display panel DP includes a base layer SUB, a first circuit layer CL1 disposed on the base layer SUB, a light emitting device layer ELL, and a thin film encapsulation layer TFE. The base layer SUB may include at least one plastic film. The base layer SUB may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate as a flexible substrate.

[0098] The first circuit layer CL1 may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the first circuit layer CL1 may constitute a signal line or a circuit portion of a pixel. The light emitting device layer ELL may include an organic light emitting diode OLED. The thin film encapsulation layer TFE seals the light emitting device layer ELL. The thin film encapsulation layer TFE may include at least two inorganic thin films and an organic thin film disposed between the at least two inorganic thin films. The thin film encapsulation layer TFE may protect the light emitting device layer ELL from external substances such as moisture and dust particles.

[0099] In the current embodiment of the inventive concept, the touch sensing unit TS may be a single-layer type. That is, the touch sensing unit TS may include a single conductive layer. Here, a single conductive layer means "a conductive layer is not divided by an insulating layer". The stacked structure of the first metal layer / the second metal layer / the metal oxide layer may correspond to a single conductive layer because the first metal layer and the second metal layer are not insulated by the metal oxide layer, while the stacked structure of the first metal layer / the insulating layer / the metal oxide layer may correspond to a double conductive layer.

[0100] The single conductive layer may be patterned to form a plurality of touch electrodes and a plurality of touch signal lines. That is, the sensors of the touch sensing unit TS may be disposed on the same layer. The sensors may be disposed directly on the thin film encapsulation layer TFE. In addition, a portion of each of the touch signal lines may be disposed on the same layer as the sensor. A portion of each of the touch signal lines may be disposed on the first circuit layer CL1. The structure of the touch sensing unit TS will be described in detail later.

[0101] Each of the touch signal line and the sensor may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium tin zinc oxide (ITZO), PEDOT, metal nanowires and graphene. Each of the touch signal line and the sensor may include a metal layer such as molybdenum, silver, titanium, copper, aluminum and alloys thereof. The touch signal line and the sensor may include the same material as each other or different materials from each other.

[0102] When compared with the structure of a display module DM including a multi-layer type touch sensing member, the display module DM according to an embodiment of the inventive concept may include a single-layer type touch sensing member to simplify its structure. Figure 1B and Figure 1C As shown in , however, because the touch sensing unit TS is slender, stress generated in the touch sensing unit TS can be reduced.

[0103] Figure 5 is a plan view of an organic light emitting display panel DP according to an embodiment of the inventive concept. Figure 6 is an equivalent circuit diagram of a pixel PX according to an embodiment of the inventive concept. Figure 7 and Figure 8 is a partial cross-sectional view of an organic light emitting display panel DP according to an embodiment of the inventive concept.

[0104] like Figure 5 As shown in , the organic light emitting display panel DP includes a display area DA and a non-display area NDA. The display area DA and the non-display area NDA of the organic light emitting display panel DP may correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. The display area DA and the non-display area NDA of the organic light emitting display panel DP do not necessarily correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively. For example, the display area DA and the non-display area NDA of the organic light emitting display panel DP may vary according to the structure / design of the organic light emitting display panel DP.

[0105] The organic light emitting display panel DP may include a plurality of signal lines SGL and a plurality of pixels PX. The region on which the plurality of pixels PX are disposed may be defined as a display region DA. In the current embodiment, the non-display region NDA may be defined along the edge of the display region DA and surrounding the display region DA.

[0106] The plurality of signal lines SGL include a gate line GL, a data line DL, a power line PL, and a control signal line CSL. The gate line GL is connected to corresponding pixels among the plurality of pixels PX, and the data lines DL are respectively connected to corresponding pixels PX among the plurality of pixels PX. The power line PL is connected to the plurality of pixels PX. A gate driving circuit DCV connected to the gate line GL may be disposed on one side of the non-display area NDA. The control signal line CSL may provide a control signal to the gate driving circuit DCV.

[0107] Parts of the gate lines GL, data lines DL, power lines PL, and control signal lines CSL may be disposed on the same layer, and the other parts may be disposed on layers different from each other. When a signal line disposed on one layer among the gate lines GL, data lines DL, power lines PL, and control signal lines CSL is defined as a first signal line, a signal line disposed on a different layer may be defined as a second signal line. A signal line disposed on another layer may be defined as a third signal line.

[0108] Each of the gate line GL, the data line DL, the power line PL, and the control signal line CSL may include a signal line unit and a lower pad PD-D connected to an end of the signal line unit. The signal line unit may be defined as a portion other than the lower pad PD-D of each of the gate line GL, the data line DL, the power line PL, and the control signal line CSL.

[0109] In an embodiment of the inventive concept, the lower pad PD-D may include a lower display panel pad PD-DPD and a lower touch sensing member pad PD-TSD. The lower pad PD-D may be formed by the same process as the transistor for driving the pixel PX. For example, the transistor for driving the pixel PX and the lower pad PD-D may be formed by the same low temperature polysilicon (LTPS) process or low temperature polycrystalline oxide (LTPO) process.

[0110] In an embodiment of the inventive concept, the lower display panel pad PD-DPD may include a control pad CSL-P, a data pad DL-P, and a power pad PL-P. Although the gate pad unit is not shown, the gate pad unit may be overlapped with the gate drive circuit DCV and connected to the gate drive circuit DCV. Although not specifically shown, the portion of the non-display area NDA on which the control pad CSL-P, the data pad DL-P, and the power pad PL-P are aligned is defined as a pad area. As described below, the pad of the touch sensing unit TS may be disposed adjacent to the pad of the organic light-emitting display panel DP described above.

[0111] Figure 6 An example of a pixel PX connected to one gate line GL, one data line DL, and a power line PL is shown. However, embodiments of the inventive concept are not limited to the configuration of the pixel PX. For example, the pixel PX may have various configurations.

[0112] The pixel PX includes an organic light emitting diode OLED as a display device. The organic light emitting diode OLED may be a top emission diode or a bottom emission diode. The pixel PX includes a first transistor TFT1 (or a switching transistor), a second transistor TFT2 (or a driving transistor), and a capacitor CP as a circuit unit for driving the organic light emitting diode OLED. The organic light emitting diode OLED generates light in response to an electrical signal provided from the transistors TFT1 and TFT2. The cathode of the organic light emitting diode OLED is connected to a second power supply voltage (ELVSS).

[0113] The gate line GL may be used to receive a first power supply voltage (ELVDD). The first transistor TFT1 outputs a data signal applied to the data line DL in response to a scan signal applied to the gate line GL. The capacitor CP charges a voltage corresponding to the data signal received from the first transistor TFT1.

[0114] The second transistor TFT2 is connected to the organic light emitting diode OLED. The second transistor TFT2 controls a driving current flowing through the organic light emitting diode OLED to correspond to the amount of charge stored in the capacitor CP. The organic light emitting diode OLED emits light during the turn-on period of the second transistor TFT2.

[0115] Figure 7 is with Figure 6 FIG. 1 is a cross-sectional view of a portion of an equivalent circuit corresponding to the first transistor TFT1 and the capacitor CP. Figure 8 is with Figure 6 FIG. 5 is a cross-sectional view of the corresponding parts of the second transistor TFT2 and the organic light emitting diode OLED of the equivalent circuit.

[0116] like Figure 7 and Figure 8 As shown in , the first circuit layer CL1 is disposed on the base layer SUB. The semiconductor pattern AL1 of the first transistor TFT1 (hereinafter, referred to as the first semiconductor pattern) and the semiconductor pattern AL2 of the second transistor TFT2 (hereinafter, referred to as the second semiconductor pattern) are disposed on the base layer SUB. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be selected from amorphous silicon, polycrystalline silicon, and metal oxide semiconductor. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be formed of the same material. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be formed of different materials.

[0117] The first circuit layer CL1 includes a first conductive pattern (see Fig.12 The first conductive pattern (see FIG. 1 ) and the organic / inorganic layers BR, BF, 12, 14 and 16. Fig.12The reference symbol CDP1) may include a first transistor TFT1, a second transistor TFT2, and electrodes E1 and E2. The organic / inorganic layers BR, BF, 12, 14, and 16 may include a first functional layer BR and BF, a first insulating layer 12, a second insulating layer 14, and a third insulating layer 16.

[0118] The first functional layers BR and BF may be disposed on one surface of the base layer SUB. The first functional layers BR and BF may include at least one of a barrier layer BR and a buffer layer BF. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 may be disposed on the barrier layer BR or the buffer layer BF.

[0119] The first insulating layer 12 covering the first semiconductor pattern AL1 and the second semiconductor pattern AL2 is disposed on the base layer SUB. The first insulating layer 12 includes an organic layer and / or an inorganic layer. Specifically, the first insulating layer 12 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

[0120] The control electrode GE1 of the first transistor TFT1 (hereinafter, referred to as the first control electrode) and the control electrode GE2 of the second transistor TFT2 (hereinafter, referred to as the second control electrode) are disposed on the first insulating layer 12. The first electrode E1 of the capacitor CP is disposed on the first insulating layer 12. Figure 5 ) are manufactured by the same photolithography process as the photolithography process of the gate line GL. That is, the first control electrode GE1, the second control electrode GE2 and the first electrode E1 may be formed of the same material as the gate line GL, have the same stacking structure as the gate line GL, and be disposed on the same layer as the gate line GL.

[0121] The second insulating layer 14 covering the first control electrode GE1 and the second control electrode GE2 and the first electrode E1 is disposed on the first insulating layer 12. The second insulating layer 14 includes an organic layer and / or an inorganic layer. Specifically, the second insulating layer 14 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

[0122] Data line DL (see Figure 5) may be disposed on the second insulating layer 14. An input electrode SE1 (hereinafter, referred to as a first input electrode) and an output electrode DE1 (hereinafter, referred to as a first output electrode) of the first transistor TFT1 are disposed on the second insulating layer 14. An input electrode SE2 (hereinafter, referred to as a second input electrode) and an output electrode DE2 (hereinafter, referred to as a second output electrode) of the second transistor TFT2 are disposed on the second insulating layer 14. The first input electrode SE1 branches from a corresponding data line of the data line DL. A power line PL (see Figure 5 ) may be disposed on the same layer as the data line DL. The second input electrode SE2 may be branched from the power line PL.

[0123] The second electrode E2 of the capacitor CP is disposed on the second insulating layer 14. The second electrode E2 may be manufactured by the same photolithography process as that of each of the data line DL and the power line PL. In addition, the second electrode E2 may be formed of the same material as that of each of the data line DL and the power line PL, have the same structure as that of each of the data line DL and the power line PL, and be disposed on the same layer as that of each of the data line DL and the power line PL.

[0124] The first input electrode SE1 and the first output electrode DE1 are connected to the first semiconductor pattern AL1 through the first through hole CH1 and the second through hole CH2 passing through the first insulating layer 12 and the second insulating layer 14, respectively. The first output electrode DE1 may be electrically connected to the first electrode E1. For example, the first output electrode DE1 may be connected to the first electrode E1 through a through hole (not shown) passing through the second insulating layer 14. The second input electrode SE2 and the second output electrode DE2 are connected to the second semiconductor pattern AL2 through the third through hole CH3 and the fourth through hole CH4 passing through the first insulating layer 12 and the second insulating layer 14, respectively. According to another embodiment of the inventive concept, each of the first transistor TFT1 and the second transistor TFT2 may have a bottom gate structure.

[0125] The third insulating layer 16 covering the first input electrode SE1, the first output electrode DE1, the second input electrode SE2 and the second output electrode DE2 is disposed on the second insulating layer 14. The third insulating layer 16 includes an organic layer and / or an inorganic layer. Specifically, the third insulating layer 16 may include an organic material to provide a flat surface.

[0126] One of the first insulating layer 12, the second insulating layer 14, and the third insulating layer 16 may be omitted according to the circuit structure of the pixel. Each of the second insulating layer 14 and the third insulating layer 16 may be defined as an interlayer dielectric layer. The interlayer dielectric layer may be disposed between a lower conductive pattern disposed below the interlayer dielectric layer and an upper conductive pattern disposed above the interlayer dielectric layer to insulate the conductive patterns from each other.

[0127] The first circuit layer CL1 includes a dummy conductive pattern. The dummy conductive pattern is disposed on the same layer as the semiconductor patterns AL1 and AL2, the control electrodes GE1 and GE2, or the output electrodes DE1 and DE2. The dummy conductive pattern may be disposed in the non-display area NDA (see Figure 5 The dummy conductive pattern will be described in detail later.

[0128] The light emitting device layer ELL is disposed on the third insulating layer 16. The pixel defining layer PXL and the organic light emitting diode OLED are disposed on the third insulating layer 16. The anode AE ​​is disposed on the third insulating layer 16. The anode AE ​​is connected to the second output electrode DE2 through a fifth through hole CH5 passing through the third insulating layer 16. An opening OP is defined in the pixel defining layer PXL. The opening OP of the pixel defining layer PXL exposes at least a portion of the anode AE.

[0129] The light emitting device layer ELL may include an emission region PXA and a non-emission region NPXA adjacent to the emission region PXA. The non-emission region NPXA may surround the emission region PXA. In the current embodiment, the emission region PXA is defined to correspond to the anode AE. However, the embodiments of the inventive concept are not limited to the emission region PXA described above. That is, if light is emitted from a region, the region may be defined as the emission region PXA. The emission region PXA may be defined to correspond to a portion of the anode AE ​​exposed by the opening OP.

[0130] The hole control layer HCL may be commonly disposed on the emission region PXA and the non-emission region NPXA. Although not specifically shown, a common layer such as the hole control layer HCL may be commonly disposed on a plurality of pixels PX (see FIG. Figure 5 )superior.

[0131] The organic light emitting layer EML is disposed on the hole control layer HCL. The organic light emitting layer EML may be disposed to cover the opening OP. The organic light emitting layers EML adjacent to each other are electrically separated from each other.

[0132] The electron control layer ECL is disposed on the organic light emitting layer EML. The cathode CE is disposed on the electron control layer ECL. The cathode CE is commonly disposed on the plurality of pixels PX.

[0133] Although the patterned organic light emitting layer EML is shown as an example in the current embodiment, the organic light emitting layer EML may be commonly disposed on a plurality of pixels PX. Here, the organic light emitting layer EML may emit white light. In addition, the organic light emitting layer EML may have a multi-layer structure.

[0134] In the current embodiment, the thin film encapsulation layer TFE directly covers the cathode CE. In the current embodiment, a cover layer covering the cathode CE may also be provided. Here, the thin film encapsulation layer TFE directly covers the cover layer. The thin film encapsulation layer TFE may include an organic layer including an organic material and an inorganic layer including an inorganic material.

[0135] Fig. 9 is a plan view of a touch sensing unit TS according to an embodiment of the inventive concept.

[0136] In the current embodiment, a 1-layer capacitive touch sensing member TS is shown as an example. The 1-layer capacitive touch sensing member TS can be driven in a self-capacitance manner or a mutual capacitance manner. However, the embodiments of the inventive concept are not limited to the driving manner for acquiring coordinate information. In addition, the touch sensing member TS may not be limited to a 1-layer structure. For example, the touch sensing member TS may have a 2-layer structure.

[0137] The touch sensing member TS may include first touch patterns TE1-1 to TE-3, first touch signal lines SL1, second touch patterns TE2-1 to TE2-3, second touch signal lines SL2, and a touch sensing member upper pad PD-U.

[0138] The first touch patterns TE1-1 to TE1-3 extend in the first direction DR1 and are arranged in the second direction DR2. Each of the first touch patterns TE1-1 to TE1-3 may have a mesh shape defining a plurality of touch openings OP-TC.

[0139] Each of the first touch patterns TE1-1 to TE1-3 includes a plurality of first sensing patterns SP1 and a plurality of first connection patterns CP1. The first sensing patterns SP1 are arranged in the first direction DR1. Each of the first connection patterns CP1 connects two adjacent first sensing patterns SP1 arranged along the first direction DR1.

[0140] Each of the first touch signal lines SL1 may be connected to one end of the first touch patterns TE1-1 to TE1-3 and connected to a pad in the pad region. The first touch signal lines SL1 may have the same layer structure as those of the first touch patterns TE1-1 to TE1-3.

[0141] The second touch patterns TE2-1 to TE2-3 are insulated from the first touch patterns TE1-1 to TE1-3 and intersect the first touch patterns TE1-1 to TE1-3. The second touch patterns TE2-1 to TE2-3 are insulated from the first touch patterns TE1-1 to TE1-3 by the insulating pattern IL-P. The insulating pattern IL-P may include an inorganic material or an organic material. The inorganic material may include silicon oxide or silicon nitride. The organic material may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, polyurethane resin, cellulose resin and perylene resin.

[0142] Each of the second touch patterns TE2 - 1 to TE2 - 3 may have a mesh shape defining a plurality of touch openings OP-TC.

[0143] Each of the second touch patterns TE2-1 to TE2-3 includes a plurality of second sensing patterns SP2 and a plurality of second connection patterns CP2. The second sensing patterns SP2 are arranged in the second direction DR2. Each of the second connection patterns CP2 connects two adjacent second sensing patterns SP2 arranged along the second direction DR2.

[0144] Each of the second connection patterns CP2 may have a bridge function. The insulation pattern IL-P is disposed on the first connection pattern CP1, and the second connection pattern CP2 is disposed on the insulation pattern IL-P.

[0145] Each of the second touch signal lines SL2 may also be connected to one end of the second touch patterns TE2-1 to TE2-3 and to a pad in the pad region. The second touch signal lines SL2 may have the same layer structure as the second touch patterns TE2-1 to TE2-3.

[0146] The first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are capacitively coupled to each other. Since the touch sensing signal is applied to the first touch patterns TE1-1 to TE1-3, a capacitor is disposed between the first sensing pattern SP1 and the second sensing pattern SP2.

[0147] The shapes of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 may be merely examples, and therefore, the embodiments of the inventive concept are not limited thereto. For example, the connection patterns CP1 and CP2 may be defined as portions where the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 intersect each other, and the sensing patterns SP1 and SP2 may be defined as portions where the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 do not overlap each other. For example, each of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 may have a strip shape having a predetermined width.

[0148] The touch sensing member pad upper pad PD-U may be disposed on the ends of the first touch signal line SL1 and the second touch signal line SL2. The touch sensing member pad upper pad PD-U may include an upper display panel pad PD-PDU and an upper touch sensing member pad PD-TSU. The touch sensing member pad upper pad PD-U may be formed by the same process as the first touch pattern TE1-1 to TE-3, the first touch signal line SL1, the second touch pattern TE2-1 to TE2-3, and the second touch signal line SL2.

[0149] Fig.10 yes Fig. 9 Magnified view of portion AA. Fig.11 is along Fig.10 A cross-sectional view taken along line II'.

[0150] The display area DA includes a plurality of emission areas PXA and a non-emission area NPXA surrounding the plurality of emission areas PXA. The first sensing pattern SP1 may have a grid shape overlapping the non-emission area NPXA. Although not specifically shown, the second sensing pattern SP2 and the touch signal lines SL1 and SL2 may also have a grid shape overlapping the non-emission area NPXA.

[0151] The first sensing pattern SP1 includes a plurality of vertical portions SP1-C extending in the first direction DR1 and a plurality of horizontal portions SP1-L extending in the second direction DR2. The plurality of vertical portions SP1-C and the plurality of horizontal portions SP1-L may be defined as grid lines. The grid lines may have a line width of several micrometers.

[0152] A plurality of vertical portions SP1-C and a plurality of horizontal portions SP1-L may be connected to each other to define a plurality of touch openings TS-OP. Although a structure in which the touch openings TS-OP correspond one to one with the emission regions PXA is shown, embodiments of the inventive concept are not limited thereto. One touch opening TS-OP may correspond to two or more emission regions PXA. Fig.10 and Fig.11 The grid lines exposed to the outside are shown in FIG. 1 , but the display module DM (see Figure 4 ) may also include an insulating layer disposed on the thin film encapsulation layer TFE to cover the grid lines.

[0153] Fig.12 yes Figure 5 and Fig. 9 1. A view of a display panel pad PD-DP and a touch sensing member pad PD-TS. The display module DM may include an active area AR-ACV, a pad area AR-PD, and a boundary area AR-BD disposed between the active area AR-ACV and the pad area AR-PD.

[0154] In the active area AR-ACV, the display module DM includes a first conductive pattern CDP1. In the pad area AR-PD, the display module DM includes a second conductive pattern CDP2. In the boundary area AR-BD, the display module DM includes a third conductive pattern CDP3. Each of the first to third conductive patterns CDP1 to CDP3 may include a metal as a pattern for conducting an electrical signal for driving the display panel DP or the touch sensing member TS.

[0155] The display panel pad PD-DP and the touch sensing member pad PD-TS may be arranged adjacent to each other. In addition, the display panel pad PD-DP and the touch sensing member pad PD-TS may be arranged parallel to each other. However, the embodiments of the inventive concept are not limited thereto. For example, if necessary, the display panel pad PD-DP and the touch sensing member pad PD-TS may be spaced apart from each other but not arranged parallel to each other.

[0156] Fig.13A is along Fig.12 A cross-sectional view taken along line II-II'. Fig. 13B is along Fig.12 A cross-sectional view taken along line III-III'. Fig. 13C is along Fig.12 A cross-sectional view taken along line IV-IV'. FIG. 13A to FIG. 13C An embodiment of the inventive concept is shown.

[0157] Referring to the diagram showing the touch sensing member pads Fig.13A , the base layer SUB includes an active area AR-ACV, a pad area AR-PD, and a boundary area AR-BD disposed between the active area AR-ACV and the pad area AR-PD.

[0158] In the active area AR-ACV, the pad area AR-PD and the boundary area AR-BD according to the embodiment of the inventive concept, the active area AR-ACV may be an area including the light emitting device layer ELL, the pad area AR-PD may be an area including the display panel pad PD-DP and the touch sensing member pad PD-TS to which a signal is applied from a printed circuit board, and the boundary area AR-BD may be an area between the active area AR-ACV and the pad area AR-PD.

[0159] The circuit layers CL1 and CL2 are disposed on the base layer SUB. The circuit layers CL1 and CL2 include a first circuit layer CL1 and a second circuit layer CL2. The first circuit layer CL1 is disposed on the active region AR-ACV of the base layer SUB. The second circuit layer CL2 is disposed on the pad region AR-PD of the base layer SUB.

[0160] The light emitting device layer ELL and the thin film encapsulation layer TFE are disposed on the first circuit layer CL1. The first circuit layer CL1 and the second circuit layer CL2 may include functional layers BR and BF, respectively. For convenience, among the functional layers BR and BF, the functional layer of the first circuit layer CL1 may be referred to as the first functional layer, and the functional layer of the second circuit layer CL2 may be referred to as the second functional layer.

[0161] because Figure 7 and Figure 8 The first circuit layer CL1, the light emitting device layer ELL and the thin film encapsulation layer TFE are shown in FIG. 1 , so a detailed description thereof will be omitted.

[0162] The touch sensing member TS may be disposed on the thin film encapsulation layer TFE. The touch sensing member TS includes a touch inorganic layer IL-T, an insulating pattern IL-P, a plurality of touch electrodes, and a touch protection layer PVX in cross section. Each of the touch inorganic layer IL-T and the insulating pattern IL-P may include an inorganic material. The touch protection layer PVX may include an organic material.

[0163] Reference Fig. 9 , the plurality of touch electrodes may form first touch patterns TE1-1 to TE1-3, a first touch signal line SL1, second touch patterns TE2-1 to TE2-3, and a second touch signal line SL2.

[0164] The second circuit layer CL2 may include a second conductive pattern CDP2 (see Fig.12 ) and organic / inorganic layers BR, BF, 12, 14 and 16. The second conductive pattern CDP2 may include a display panel pad PD-DP and a touch sensing member pad PD-TS. The organic / inorganic layers BR, BF, 12, 14 and 16 may include a second functional layer BR and BF, a first insulating layer 12, a second insulating layer 14 and a third insulating layer 16.

[0165] The display panel pad PD-DP may be disposed on the second functional layer and electrically connected to the first circuit layer CL1. At least one of the first insulating layer 12 and the second insulating layer 14 may be disposed between the display panel pad PD-DP and the second functional layer.

[0166] The display panel pads PD-DP may include a lower display panel pad PD-DPD and an upper display panel pad PD-DPU. The lower display panel pad PD-DPD is electrically connected to the first conductive pattern CDP1 through the third conductive pattern CDP3. The upper display panel pad PD-DPU is disposed on the lower display panel pad PD-DPD and is electrically connected to the lower display panel pad PD-DPD. Therefore, the electrical signal applied to the upper display panel pad PD-DPU is applied to the first conductive pattern CDP1 of the first circuit layer CL1 via the lower display panel pad PD-DPD.

[0167] The boundary layer BDL is disposed on the boundary region AR-BD of the base layer SUB. The boundary layer BDL may include an organic layer OG and a third conductive pattern CDP3. The organic layer OG may contact the top surface of the base layer SUB and be disposed between the first circuit layer CL1 and the second circuit layer CL2. More specifically, the organic layer OG may be disposed between the first functional layer and the second functional layer.

[0168] Unlike the first and second circuit layers CL1 and CL2 , the boundary layer BDL may not include an inorganic layer including an inorganic material. Therefore, flexibility of the boundary layer BDL may be improved, and a portion of the display panel DP overlapping the boundary area AR-BD may be easily bent.

[0169] The organic layer OG may be further disposed on the third conductive pattern CDP3. The organic layer disposed on the third conductive pattern CDP3 may be formed through the same process as that of the third insulating layer 16 or the pixel defining layer PXL.

[0170] The third conductive pattern CDP3 may be formed by the same process as that of the lower display panel pad PD-DPD. However, embodiments of the inventive concept are not limited thereto. For example, the third conductive pattern CDP3 may be formed by a separate process to contact the lower display panel pad PD-DPD and then electrically connected to the lower display panel pad PD-DPD.

[0171] Reference Fig. 13B, the touch signal line SL2 of the touch sensing member TS is electrically connected to the third conductive pattern CDP3 on the active area AR-ACV. The third conductive pattern CDP3 is electrically connected to the upper touch sensing member pad PD-TSU on the pad area AR-PD. Here, the third conductive pattern CDP3 may be electrically insulated from the lower touch sensing member pad PD-TSD.

[0172] Reference Fig. 9 and Fig. 13B The touch sensing member TS includes first touch patterns TE1-1 to TE1-3 and second touch patterns TE2-1 to TE2-3 disposed on the active area AR-ACV, a touch sensing member pad PD-TS disposed on the pad area AR-PD, and touch signal lines SL1 and SL2 electrically connecting the touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-3 to the touch sensing member pad PD-TS.

[0173] The touch sensing member pads PD-TS may include lower touch sensing member pads PD-TSD and upper touch sensing member pads PD-TSU. The upper touch sensing member pads PD-TSU are electrically connected to the touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-3 through the touch signal lines SL1 and SL2 and the third conductive pattern CDP3. That is, the upper touch sensing member pads PD-TSU are electrically connected to the sensing patterns SP1 and SP2 through the touch signal lines SL1 and SL2 and the third conductive pattern CDP3.

[0174] The lower touch sensing member pad PD-TSD may be electrically insulated from the upper touch sensing member pad PD-TSU. However, embodiments of the inventive concept are not limited thereto. According to another embodiment of the inventive concept, the lower touch sensing member pad PD-TSD may be electrically connected to the upper touch sensing member pad PD-TSU.

[0175] The upper touch sensing member pads PD-TSU are disposed on the lower touch sensing member pads PD-TSD. The upper touch sensing member pads PD-TSU may be disposed at a height increased by a thickness of the lower touch sensing member pads PD-TSD.

[0176] exist Fig. 13B In, with Fig.13A Unlike the third conductive pattern CDP3, the third conductive pattern CDP3 is not electrically connected to the first conductive pattern CDP1. However, embodiments of the inventive concept are not limited thereto. For example, if necessary, Fig. 13B The third conductive pattern CDP3 and the first conductive pattern CDP1 may be electrically connected to each other.

[0177] exist Fig. 13B Because other components and Fig.13AThe components are substantially the same, so descriptions about the other components will be omitted.

[0178] A length HH1 measured from the base layer SUB to the upper display panel pad PD-DPU is substantially the same as a length HH2 measured from the base layer SUB to the upper touch sensing member pad PD-TSU.

[0179] Although not shown, in another embodiment of the inventive concept, at least one of the touch inorganic layer IL-T and the insulating pattern IL-P may be disposed on the boundary region AR-BD. That is, in this case, at least one of the touch inorganic layer IL-T and the insulating pattern IL-P may be disposed on the entire surface of the active region AR-ACV, the pad region AR-PD, and the boundary region AR-BD.

[0180] Reference Fig. 13C , the upper display panel pad PD-DPU and the upper touch sensing member pad PD-TSU may be disposed on the same layer. The upper display panel pad PD-DPU may be electrically connected to the lower display panel pad PD-DPD through the sixth through hole CH6. Although not shown, a dummy electrode may be disposed on the first insulating layer 12.

[0181] Therefore, in the process of attaching the printed circuit board to the display panel pad PD-DP and the touch sensing member pad PD-TS, since the display panel pad PD-DP and the touch sensing member pad PD-TS have the same height, the pressure applied to the pads PD-DP and PD-TS can be the same. Therefore, defects occurring in the process of attaching the printed circuit board can be prevented from occurring. In addition, durability against stress applied from the outside can be improved according to the manipulation operation of the flexible display device DD.

[0182] Fig.14A is along Fig.12 A cross-sectional view taken along line II-II'. Fig. 14B is along Fig.12 A cross-sectional view taken along line III-III'. Fig. 14C and Fig.14D Along Fig.12 A cross-sectional view taken along line IV-IV'. FIG. 14A to FIG. 14C An embodiment of the inventive concept is shown.

[0183] Reference Fig.14A Description and reference Fig.13A The descriptions are basically the same, so their descriptions will be omitted.

[0184] Reference Fig. 14B and Fig. 14C, the upper touch sensing member pad PD-TSU may be electrically connected to the lower touch sensing member pad PD-TSD through the seventh through hole CH7.

[0185] Fig.14D The sixth through hole CH6 and the seventh through hole CH7 each have a ratio Fig. 14C The width of each of the through holes is large.

[0186] Description of other components and FIG. 13A to FIG. 13C The description of the components is basically the same, so their description will be omitted.

[0187] Fig.15A is along Fig.12 A cross-sectional view taken along line II-II'. Fig. 15B is along Fig.12 A cross-sectional view taken along line III-III'. Fig. 15C is along Fig.12 A cross-sectional view taken along line IV-IV'. FIG. 15A to FIG. 15C An embodiment of the inventive concept is shown.

[0188] Reference Fig.15A and Fig. 15C , the upper display panel pad PD-DPU contacts the lower display panel pad PD-DPD. Fig. 15B and Fig. 15C , the upper touch sensing member pad PD-TSU contacts the lower touch sensing member pad PD-TSD.

[0189] Description of other components and FIG. 13A to FIG. 13C The description of the components is basically the same, so their description will be omitted.

[0190] Fig.16A is along Fig.12 A cross-sectional view taken along line II-II'. Fig. 16B is along Fig.12 A cross-sectional view taken along line III-III'. Fig. 16C is along Fig.12 A cross-sectional view taken along line IV-IV'. FIG. 16A to FIG. 16C An embodiment of the inventive concept is shown.

[0191] Different from the third conductive pattern CDP3 described above, Fig.16A and Fig. 16B The third conductive pattern CDP3 is electrically connected to the first conductive pattern CDP1 through the electrode GE3, which is formed by the same process as that of the control electrodes GE1 and GE2.

[0192] about Fig.16A and Fig. 16B Description of other components and Fig.13A and Fig. 13B The description of the components of is basically the same, so the description thereof will be omitted. Fig. 16C Description and reference Fig. 13C The descriptions are basically the same, so their descriptions will be omitted.

[0193] Fig.17A is along Fig.12 A cross-sectional view taken along line II-II'. Fig. 17B is along Fig.12 A cross-sectional view taken along line III-III'. Fig. 17C and Fig.17D is along Fig.12 A cross-sectional view taken along line IV-IV'. 17A to 17D An embodiment of the inventive concept is shown.

[0194] Fig.17A and Fig. 17B The third conductive pattern CDP3 is electrically connected to the first conductive pattern CDP1 through the electrode GE3, which is formed by the same process as that of the control electrodes GE1 and GE2.

[0195] about Fig.17A and Fig. 17B Description of other components and Fig.14A and Fig. 14B The description of the components of is basically the same, so the description thereof will be omitted. Fig. 17C and Fig.17D Description and reference Fig. 14C and 14D The descriptions are basically the same, so their descriptions will be omitted.

[0196] Fig.18A is along Fig.12 A cross-sectional view taken along line II-II'. Fig.18B is along Fig.12 A cross-sectional view taken along line III-III'. Fig.18C is along Fig.12 A cross-sectional view taken along line IV-IV'. 18A to 18C An embodiment of the inventive concept is shown.

[0197] Fig.18A and Fig.18B The third conductive pattern CDP3 is electrically connected to the first conductive pattern CDP1 through the electrode GE3, which is formed by the same process as that of the control electrodes GE1 and GE2.

[0198] about Fig.18A and Fig.18B Description of other components and Fig.15A and Fig. 15BThe description of the components of is substantially the same, so the description thereof will be omitted. Fig.18C Description and About Fig. 15C The descriptions are basically the same, so their descriptions will be omitted.

[0199] Fig.19A is along Fig.12 A cross-sectional view taken along line II-II'. Fig.19B is along Fig.12 A cross-sectional view taken along line III-III'. Fig.19C is along Fig.12 A cross-sectional view taken along line IV-IV'. FIG. 19A to FIG. 19C An embodiment of the inventive concept is shown.

[0200] Reference Fig.19A and Fig.19C , the display panel pad PD-DP has a single-layer structure. Fig.19B and 19C , the touch sensing member pad PD-TS has a single-layer structure.

[0201] Description of other components and FIG. 13A to FIG. 13C The description of the components is basically the same, so their description will be omitted.

[0202] Fig. 20A is along Fig.12 A cross-sectional view taken along line II-II'. Fig. 20B is along Fig.12 A cross-sectional view taken along line III-III'. Fig. 20C is along Fig.12 A cross-sectional view taken along line IV-IV'. FIG. 20A to FIG. 20C An embodiment of the inventive concept is shown.

[0203] Reference Fig. 20A and Fig. 20C , the display panel pad PD-DP has a single-layer structure. Fig. 20B and Fig. 20C , the touch sensing member pad PD-TS has a single-layer structure.

[0204] Description of other components and FIG. 13A to FIG. 13C The description of the components is basically the same, so their description will be omitted.

[0205] As in the embodiment according to the inventive concept FIG. 19A to FIG. 19C and FIG. 20A to FIG. 20C As shown in , since the display panel pad PD-DP and the touch sensing member pad PD-TS are disposed at the same height and have a single-layer structure, defects that may occur in a manufacturing process may be reduced.

[0206] Fig.21A is along Fig.12 A cross-sectional view taken along line II-II'. Fig. 21B is along Fig.12 A cross-sectional view taken along line III-III'. Fig. 21C is along Fig.12 A cross-sectional view taken along line IV-IV'. FIG. 21A to FIG. 21C An embodiment of the inventive concept is shown.

[0207] The second conductive pattern CDP2 may include dummy electrodes ET-D, display panel pads PD-DP, and touch sensing member pads PD-TS.

[0208] The dummy electrode ET-D may include the same material as that of the control electrode GE2 of the first circuit layer CL1. The dummy electrode ET-D may be formed by the same process as that of the control electrode GE2. The dummy electrode ET-D may be insulated from other electrodes and perform a function for adjusting the height of the display panel pad PD-DP on the pad area AR-PD.

[0209] Description of other components and FIG. 13A to FIG. 13C The description of the components is basically the same, so their description will be omitted.

[0210] Fig. 22 and Fig.23 A display module DM and printed circuit boards PCB and PCB- 1 according to an embodiment of the inventive concept are illustrated.

[0211] Reference Fig. 22 , the pads PD-TS and PD-DP of the display module DM are electrically connected to the pads PD-PCB of the printed circuit board PCB. The integrated circuit DIC may be disposed on the printed circuit board PCB. The integrated circuit DIC may be formed in a chip on a flexible printed circuit (COF) manner. The integrated circuit DIC may transmit data information to / receive data information from the display module DM through the pads PD-PCB, PD-TS, and PD-DP.

[0212] Reference Fig.23 , the integrated circuit DIC-1 may be disposed on the pad area AR-PD of the display module DM. Here, the integrated circuit DIC-1 may be formed in a chip on plastic (COP) manner.

[0213] Although the touch signal lines SL1 and SL2 are not connected to Fig.23 In the embodiment of the inventive concept, each of the touch signal lines SL1 and SL2 may have a structure connected to the integrated circuit DIC-1.

[0214] Fig.242 shows a curved shape of a display module DM according to an embodiment of the inventive concept. Fig.24 , the display module DM may be bent in the boundary region AR-BD. As described above, the boundary region AR-BD of the display module DM may not include an inorganic material layer but may include only an organic material layer. Therefore, the boundary region AR-BD may have sufficient flexibility to bend.

[0215] According to an embodiment of the inventive concept, a pad unit of a display panel and a pad unit of a touch sensing member may be disposed at the same height.

[0216] According to an embodiment of the inventive concept, a bent portion of a display panel may have improved flexibility.

[0217] It will be apparent to those skilled in the art that various modifications and changes may be made to the inventive concept. Therefore, the present disclosure is intended to cover modifications and changes of the present invention, provided that they fall within the scope of the appended claims and their equivalents. Therefore, to the maximum extent permitted by law, the scope of the present invention will be determined by the broadest permissible interpretation of the claims and their equivalents, and will not be constrained or limited by the foregoing detailed description.

Claims

1. A display device, comprising: A display panel comprising a pixel, a lower pad electrically connected to the pixel, and a first signal line connecting the pixel and the lower pad; as well as a touch sensing member disposed on the display panel and including a conductive pattern, an upper pad electrically connected to the conductive pattern, and a second signal line connecting the conductive pattern and the upper pad, The lower pads include a first lower pad connected to the first signal line and a second lower pad adjacent to the first lower pad. The upper pad includes a first upper pad and a second upper pad adjacent to the first upper pad and connected to the second signal line, and The first upper pad is disposed on the first lower pad, and the second upper pad is disposed on the second lower pad.

2. The display device according to claim 1, wherein: The first upper pad is electrically connected to the first lower pad.

3. The display device according to claim 1 , further comprising an insulating layer disposed between the first upper pad and the first lower pad, in, The first upper pad and the first lower pad are electrically connected to each other through a through hole penetrating the insulating layer.

4. The display device according to claim 1, wherein: The first upper pad and the second upper pad are disposed on the same layer, and the first lower pad and the second lower pad are disposed on the same layer.

5. The display device according to claim 1, further comprising: A sensing pad portion, comprising the second upper pad and the second lower pad; as well as A display pad portion includes the first upper pad and the first lower pad, Wherein, the length of the sensing pad portion and the length of the display pad portion are the same in the thickness direction of the touch sensing member.

6. The display device according to claim 5, wherein: The sensing pad portion includes a first sensing pad portion and a second sensing pad portion spaced apart from each other in one direction in a plan view, and the display pad portion is disposed between the first sensing pad portion and the second sensing pad portion.

7. The display device according to claim 5, wherein: The sensing pad portion and the display pad portion have the same stacking structure.

8. The display device according to claim 1, wherein: The touch sensing member further includes a touch protection layer covering the upper pad, The touch protection layer has a contact hole for exposing at least a portion of the upper surface of the upper pad to the outside.

9. The display device according to claim 1, wherein: The display panel further includes an encapsulation layer, and the touch sensing member is directly disposed on the encapsulation layer.

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