Display device

Abstract

Disclosed is a display device including a base member, a circuit layer, a display layer, a thin film encapsulation layer, and a touch sensor layer. The base member includes a first area and a second area disposed adjacent to the first area. The circuit layer is disposed on the base member to cover the first area and expose the second area. The display layer is disposed on the circuit layer to display an image. The thin film encapsulation layer is disposed on the display layer. The touch sensor layer is disposed on the thin film encapsulation layer and includes an organic layer extending from an upper portion of the thin film encapsulation layer to cover at least a portion of the exposed second area.

Description

[0001] This application is a divisional application of the patent application with application number 201710598957.4, filed on July 21, 2017, and entitled "Display device". TECHNICAL FIELD

[0002] Exemplary embodiments relate to a display device. More particularly, the present disclosure relates to a display device capable of preventing or reducing breakage in the device. BACKGROUND

[0003] Various display devices for multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game consoles have been developed. As an input device for a display device, a keyboard or a mouse is widely used. In recent years, a touch panel is often used as an input device for a display device.

[0004] The above information disclosed in this BACKGROUND section is only for enhancing the understanding of the background of the present inventive concept, therefore, it can contain information that does not form the prior art that is already known in this country to those of ordinary skill in the art. SUMMARY

[0005] Exemplary embodiments provide a display device capable of preventing breakage when the display device is bent or folded.

[0006] Additional aspects will be set forth in the detailed description to follow, and in part will be apparent from the disclosure, or can be learned by practice of the inventive concept.

[0007] Exemplary embodiments of the present disclosure disclose a display device including a base member, a circuit layer, a display layer, a thin film encapsulation layer, and a touch sensor layer. The base member includes a first area and a second area disposed adjacent to the first area. The circuit layer is disposed on the base member to cover the first area and expose the second area. The display layer is disposed on the circuit layer to display an image. The thin film encapsulation layer is disposed on the display layer. The touch sensor layer is disposed on the thin film encapsulation layer and includes an organic layer extending from an upper portion of the thin film encapsulation layer to cover at least a portion of the exposed second area.

[0008] According to the above, when the device is bent or folded, breakage in the display device can be prevented.

[0009] The foregoing general description and the following detailed description are exemplary and explanatory, and are intended to provide further explanation of the subject matter claimed. BRIEF DESCRIPTION OF DRAWINGS

[0010] The accompanying drawings, which are included to provide a further understanding of the present concept and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the present concept and together with the description serve to explain the principles of the present concept.

[0011] Figure 1A is a perspective view illustrating a display device according to an exemplary embodiment of the present disclosure.

[0012] Figure 1B is a cross-sectional view illustrating a display device according to an exemplary embodiment of the present disclosure.

[0013] Figure 2A is a perspective view illustrating a display device according to an exemplary embodiment of the present disclosure.

[0014] Figure 2B is a cross-sectional view illustrating a display device according to an exemplary embodiment of the present disclosure.

[0015] Figure 3A and Figure 3B is a perspective view illustrating a display device according to an exemplary embodiment of the present disclosure.

[0016] Figure 4A is a plan view illustrating an organic light emitting display panel according to an exemplary embodiment of the present disclosure.

[0017] Figure 4B is a cross-sectional view illustrating a display module according to an exemplary embodiment of the present disclosure.

[0018] Figure 5A is an equivalent circuit diagram illustrating a pixel according to an exemplary embodiment of the present disclosure.

[0019] Figure 5B is a cross-sectional view illustrating a portion of an organic light emitting display panel according to an exemplary embodiment of the present disclosure.

[0020] Figure 5C is a cross-sectional view illustrating a portion of an organic light emitting display panel according to an exemplary embodiment of the present disclosure.

[0021] Figure 6A , Figure 6B and Figure 6C is a cross-sectional view illustrating a thin film encapsulation layer according to an exemplary embodiment of the present disclosure.

[0022] Figure 7A is a cross-sectional view illustrating a touch sensor layer according to an exemplary embodiment of the present disclosure.

[0023] Figure 7B , Figure 7C , Figure 7D and Figure 7Eis a plan view showing a touch sensor layer according to an example embodiment of the present disclosure.

[0024] Figure 7F is a plan view showing a touch sensor layer according to an example embodiment of the present disclosure. Figure 7E is a partial enlarged view of the region BB of

[0025] Figure 8A , Figure 8B , Figure 8C and Figure 8D is a partial enlarged view of the region AA of Figure 4B

[0026] Figure 9A , Figure 9B , Figure 9C , Figure 9D , Figure 9E , Figure 9F , Figure 9G , Figure 9H and Figure 9I are cross-sectional views showing a method of manufacturing a display module shown in Figure 8C DETAILED DESCRIPTION

[0027] In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various example embodiments. It will be apparent, however, that various example embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily complicating the various example embodiments.

[0028] In the drawings, the size and relative sizes of layers, films, panels, regions, etc., can be exaggerated for clarity and descriptive purposes. Also, like reference numerals can denote like elements throughout the specification.

[0029] When an element or layer is referred to as being "on" another element or layer, "connected to" another element or layer or "coupled to" another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers can be present. In contrast, when an element or layer is referred to as being "directly on," "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers present. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted to include only X, only Y, only Z, or any combination of at least two of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout the description. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.​​

[0030] Although the terms first, second, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer and / or section from another element, component, region, layer and / or section. Thus, a first element, component, region, layer and / or section discussed below could be termed a second element, component, region, layer and / or section without departing from the teachings of the present disclosure.

[0031] Spatially relative terms such as "beneath", "below", "lower", "above", "upper" and the like can be used herein for descriptive purposes, for example, to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use, operation and / or manufacture in addition to the orientations depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0032] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, to the extent that the terms "including", "includes", "having", "has", "with", or variants thereof are used in either the detailed description and / or the claims, such terms are intended to be inclusive in a manner similar to the term "comprising".

[0033] Various exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments and / or intermediate structures that are exemplary of the exemplary embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, exemplary embodiments disclosed herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. The regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

[0034] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms, such as "include," "includes," "including," "has," "have," "having," or the like, are used inclusively and in the non-singular sense of "comprise(s)." Unless specifically stated otherwise, terms such as "first," "second," "third," etc., are used in their ordinal sense and can be used interchangeably with terms such as "initial," "primary," "initially," "primary," etc. The use of these terms in the description is not meant to emanate a strict chronological order.

[0035] Hereinafter, the present application will be described in detail with reference to the accompanying drawings.

[0036] Figure 1A is a perspective view illustrating a display device DD according to an exemplary embodiment of the present disclosure.

[0037] Referring to Figure 1A , the display device DD includes a plurality of regions. The display device DD includes a display region DD-DA displaying an image IM and a non-display region DD-NDA disposed adjacent to the display region DD-DA. The image IM is not displayed in the non-display region DD-NDA. FIG. 1 illustrates an image of a vase as the image IM. The display region DD-DA has, for example, a substantially quadrangular shape, and the non-display region DD-NDA surrounds the display region DD-DA, but the present application is not limited thereto or by it.

[0038] The display device DD has a shape in which a portion thereof is bent. For example, as shown in Figure 1A , the display device DD includes a bent region BA having a bent shape and a non-bent region NBA having a flat shape. The bent region BA is disposed adjacent to at least one side of the non-bent region NBA. According to another exemplary embodiment, the bent region BA and the non-bent region NBA can be omitted.

[0039] The non-bent region NBA is substantially parallel to a surface defined by the first direction DR1 and the second direction DR2. A direction orthogonal to the non-bent region NBA indicates a third direction DR3. In each member, the front surface is distinguished from the rear surface by the third direction DR3. The bent region BA bent from the non-bent region NBA displays the image IM toward a fourth direction DR4 intersecting the first direction DR1, the second direction DR2, and the third direction DR3. However, the directions indicated by the first direction DR1 to the fourth direction DR4 are terms relative to each other, and thus, the first direction DR1 to the fourth direction DR4 can be changed to other directions.

[0040] Figure 1B is a cross-sectional view illustrating the display device DD shown in Figure 1A . Figure 1B is a cross-section defined by the first direction DR1 and the third direction DR3.

[0041] Referring to Figure 1B The display device DD includes a protective film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, a second adhesive member AM2, and a third adhesive member AM3. The display module DM is disposed between the protective film PM and the optical member LM. The optical member LM is disposed between the display module DM and the window WM. The first adhesive member AM1 bonds the display module DM and the protective film PM, the second adhesive member AM2 bonds the display module DM and the optical member LM, and the third adhesive member AM3 bonds the optical member LM and the window WM.

[0042] The protective film PM protects the display module DM. The protective film PM includes a first outer surface OS-L exposed to the outside and an adhesive surface adhered to the first adhesive member AM1. The protective film PM prevents external moisture from entering the display module DM and absorbs external impact.

[0043] The protective film PM can include a plastic film as a base substrate. The protective film PM can include a plastic film including one selected from the group consisting of polyether sulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone), and a mixture thereof.

[0044] The material of the protective film PM can include a mixed material of an organic material and an inorganic material, without being limited to a plastic resin. The protective film PM includes a porous organic layer and an inorganic material filled into pores of the organic layer. The protective film PM can further include a functional layer formed in the plastic film. The functional layer includes a resin layer. The functional layer is formed by a coating method. In an exemplary embodiment, the protective film PM can be omitted.

[0045] The window WM protects the display module DM from external impact and provides an input surface to a user. The window WM provides a second outer surface OS-U exposed to the outside and an adhesive surface adhered to the third adhesive member AM3. Figure 1A The display surface IS shown in FIG. 1A can be Figure 1B The second outer surface OS-U shown in FIG. 1A.

[0046] The window WM can include a plastic film. The window WM can have a multi-layer structure that can include a glass substrate, a plastic film, or a plastic substrate. The window WM can further include a bezel pattern. The multi-layer structure of the window WM can be formed by a continuous process or an adhesive process using an adhesive.

[0047] The optical component LM reduces the reflectivity of external light. The optical component LM includes at least a polarizing film. The optical component LM also includes a retardation film. In this exemplary embodiment, the optical component may be omitted.

[0048] The display module DM includes an organic light-emitting display panel DP and a touch sensor layer TS. The touch sensor layer TS is directly disposed on the organic light-emitting display panel DP. In the following description, the statement "the first component is directly disposed on the second component" means that the first component and the second component are formed by a continuous process, without being adhered to each other by using a separate adhesive layer.

[0049] The organic light-emitting display panel (DP) generates an image IM corresponding to the input image data (reference). Figure 1A The organic light-emitting display panel DP includes a first display panel surface BS1-L and a second display panel surface BS1-U facing the first display panel surface BS1-L in the thickness direction DR3. In this exemplary embodiment, the organic light-emitting display panel DP will be described as a representative example of a display panel, but the display panel should not be limited to organic light-emitting display panels.

[0050] The touch sensor layer (TS) acquires the coordinate information of external input. The touch sensor layer (TS) senses external input capacitively.

[0051] Although not shown in the figures, the display module DM according to this exemplary embodiment may also include an anti-reflective layer. The anti-reflective layer may include a color filter or a stacked structure of conductive / insulating / conductive layers. The anti-reflective layer absorbs light from its exterior or polarizes light from its exterior to reduce external light reflectivity. The anti-reflective layer may replace the function of the optical component LM.

[0052] Each of the first adhesive component AM1, the second adhesive component AM2, and the third adhesive component AM3 can be, but is not limited to, an organic adhesive layer such as an optically transparent adhesive film (OCA), an optically transparent resin (OCR), or a pressure-sensitive adhesive film (PSA). The organic adhesive layer can include polyurethane-based adhesives, polyacrylic-based adhesives, polyester-based adhesives, polyepoxy-based adhesives, or polyvinyl acetate-based adhesives. Therefore, an organic adhesive layer can correspond to an organic layer.

[0053] Although not shown in the figure, the display device DD may also include a frame structure that supports the functional layers to maintain... Figure 1A and Figure 1B The state shown is illustrated. The frame structure may include a hinged structure or a hinged chain structure.

[0054] The bent area BA of the display device DD can have a shape bent with a predetermined radius of curvature. Alternatively, the bent area BA can have a shape bent such that the radius of curvature decreases as the distance from the non-bent area NBA increases. However, the bent area BA can be bent with various radii of curvature.

[0055] In the present exemplary embodiment, at least one of the protective film PM, the adhesive members AM1, AM2, and AM3, the optical member LM, and the window WM can be omitted. The display device according to the present exemplary embodiment can include a combination of various members, and should not be limited to a specific structure.

[0056] Figure 2A is a perspective view illustrating a display device DD-1 according to an exemplary embodiment of the present disclosure. Figure 2B is a cross-sectional view illustrating the display device DD-1 according to an exemplary embodiment of the present disclosure. Hereinafter, the display device DD-1 will be described with reference to Figure 2A and Figure 2B The display device DD-1 will be described in detail. In Figure 2A and Figure 2B like reference numerals denote like elements as those in Figure 1A and Figure 1B , and thus detailed descriptions of the same elements will be omitted.

[0057] Referring to Figure 2A , the display device DD-1 includes one non-bent area NBA and first and second bent areas BA1 and BA2 disposed at opposite side surfaces of the non-bent area NBA. Figure 2B A cross section defined by the first and third directions DR1 and DR3 is illustrated.

[0058] The display device DD-1 includes the first and second bent areas BA1 and BA2. The first and second bent areas BA1 and BA2 are defined to be spaced apart from each other such that the non-bent area NBA is disposed between the first and second bent areas BA1 and BA2. The first bent area BA1 is disposed adjacent to one side of the non-bent area NBA and is curved in a convex shape toward the fourth direction DR4. The second bent area BA2 is disposed adjacent to the other side of the non-bent area NBA and is curved in a convex shape toward the fifth direction DR5.

[0059] The display device DD-1 has a generally convex shape toward the third direction DR3. At the same time, according to an exemplary embodiment, the display device DD-1 can have a shape concave upward according to the shape of each of the first and second bent areas BA1 and BA2. The display device DD-1 according to the present exemplary embodiment can have various shapes, and should not be limited to a specific embodiment.

[0060] Although Figures 1A to 2B The curved display device is shown as a representative example of the display device DD and DD-1, but the display device DD and DD-1 can be a foldable display device or a rollable display device. In addition, although the present exemplary embodiments show a flexible display device, it should not be limited thereto or thereby. That is, the display device DD according to the present exemplary embodiments can be a flat rigid display device or a curved rigid display device. The display device DD according to the present exemplary embodiments can be applied to large-sized electronic products such as a television, a monitor, etc. and small- and medium-sized electronic products such as a mobile phone, a tablet, a car navigation, a game machine, a smart watch, etc.

[0061] Figure 3A And Figure 3B is a perspective view showing the display device DD-2 according to the exemplary embodiments of the present disclosure. Figure 3A The display device DD-2 is shown in an unfolded state, Figure 3B The display device DD-2 is shown in a curved state.

[0062] The display device DD-2 includes one curved area BA and one non-curved area NBA. The non-display area DD-NDA of the display device DD-2 is curved. However, the curved area of the display device DD-2 can be changed in the present exemplary embodiments.

[0063] The display device DD-2 can be fixed in one state while in operation. The display device DD-2 can be operated in a curved state as shown in FIG. 1B. Figure 3B The display device DD-2 can be fixed on a frame while being curved, and the frame can be incorporated into a housing of an electronic device.

[0064] The display device DD-2 according to the present exemplary embodiments can have substantially the same cross-sectional structure as shown in FIG. 1A. However, the non-curved area NBA and the curved area BA can have different stacking structures from each other. For example, the non-curved area NBA can have substantially the same cross-sectional structure as shown in FIG. 1A, and the curved area BA can have a different cross-sectional structure from that shown in FIG. 1A. Figure 1B Figure 1B The display device DD-2 according to the present exemplary embodiments can have substantially the same cross-sectional structure as shown in FIG. 1A. However, the non-curved area NBA and the curved area BA can have different stacking structures from each other. For example, the non-curved area NBA can have substantially the same cross-sectional structure as shown in FIG. 1A, and the curved area BA can have a different cross-sectional structure from that shown in FIG. 1A. Figure 1B The optical member LM and the window WM can not be provided in the curved area BA. That is, the optical member LM and the window WM can be provided only in the non-curved area NBA. The second adhesive member AM2 and the third adhesive member AM3 can not be provided in the curved area BA. As described above, since the display device DD-2 is curved, the second adhesive member AM2 and the third adhesive member AM3 can not be provided in the curved area BA. Figure 1B ​At least one of the elements shown can be stacked only with the non-curved region NBA, but not with the curved region BA, so the curved region BA can have a relatively small thickness compared to the non-curved region NBA. Therefore, the curved region can be easily bent.

[0065] Figure 4A This is a plan view illustrating an organic light-emitting display panel DP according to an exemplary embodiment of the present disclosure. Figure 4B This is a cross-sectional view showing a display module DM according to an exemplary embodiment of the present disclosure.

[0066] Reference Figure 4A When viewed in a plan view, the organic light-emitting display panel DP includes a display area DA and a non-display area NDA. The display area DA and the non-display area NDA of the organic light-emitting display panel DP correspond to the display device DD (see reference). Figure 1A The display area DD-DA (refer to) Figure 1A ) and non-display area DD-NDA (refer to) Figure 1A The display area (DA) and non-display area (NDA) of an organic light-emitting display panel (DP) do not need to be connected to the display device (DD) (see reference). Figure 1A The display area DD-DA (refer to) Figure 1A ) and non-display area DD-NDA (refer to) Figure 1A Similar to the organic light-emitting display panel (DP), the display area (DA) and the non-display area (NDA) of the DP can be changed according to the structure and design of the DP.

[0067] An organic light-emitting display panel (DP) includes a plurality of pixels (PX). The area where the pixels (PX) are arranged is called the display area (DA). In this exemplary embodiment, a non-display area (NDA) is defined along the edge of the display area (DA).

[0068] An organic light-emitting display panel (DP) includes gate lines (GL), data lines (DL), light-emitting lines (EL), control signal lines (SL-D), initialization voltage lines (SL-Vint), voltage lines (SL-VDD), power lines (E-VSS), and pads (PD).

[0069] Each of the gate lines GL is connected to a corresponding one of the pixels PX, and each of the data lines DL is connected to a corresponding one of the pixels PX. Each of the emission lines EL can be arranged substantially parallel to a corresponding one of the gate lines GL. The control signal line SL-D applies a control signal to the gate driver circuit GDC. The initialization voltage line SL-Vint applies an initialization voltage to the pixels PX. The voltage line SL-VDD is connected to the pixels PX to apply a first voltage to the pixels PX. The voltage line SL-VDD includes a plurality of lines extending in a first direction DR1 and a plurality of lines extending in a second direction DR2. The power supply line E-VSS is disposed in the non-display area NDA to surround three sides of the display area DA. The power supply line E-VSS applies a common voltage (e.g., a second voltage) to the pixels PX. The common voltage has a level lower than a level of the first voltage.

[0070] The gate driver circuit GDC is disposed at one side of the non-display area NDA and connected to the gate lines GL and the emission lines EL. Some of the gate lines GL, the data lines DL, the emission lines EL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD are disposed on the same layer, and others of the gate lines GL, the data lines DL, the emission lines EL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD are disposed on different layers.

[0071] The pad portion PD is connected to end portions of the data lines DL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD.

[0072] Referring to Figure 4B The organic light emitting display panel DP includes a base member BSM, a circuit layer DP-CL disposed on the base member BSM, a display layer DP-OLED, and a thin film encapsulation layer TFE.

[0073] The base member BSM includes at least one plastic film. The base member BSM can be a flexible substrate and can include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic hybrid material substrate. The plastic substrate includes at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene-based resin.

[0074] The circuit layer DP-CL includes a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The conductive layers of the circuit layer DP-CL can form signal lines or control circuits of pixels.

[0075] The display layer DP-OLED includes a plurality of organic light emitting diodes.

[0076] The thin film encapsulation layer TFE encapsulates the display layer DP-OLED. The thin film encapsulation layer TFE includes inorganic layers and an organic layer. The thin film encapsulation layer TFE includes at least two inorganic layers and an organic layer disposed therebetween. The inorganic layers protect the display layer DP-OLED from moisture and oxygen, and the organic layer protects the display layer DP-OLED from foreign substances such as dust. The inorganic layers can include a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. The organic layer can include an acryl-based organic material, but the organic layer is not limited thereto or thereby.

[0077] The touch sensor layer TS is directly disposed on the thin film encapsulation layer TFE. The touch sensor layer TS includes a touch sensor and a touch signal line. The touch sensor and the touch signal line have a single-layer structure or a multi-layer structure.

[0078] The touch sensor and the touch signal line can include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The touch sensor and the touch signal line can include a metal layer, for example, molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch sensor and the touch signal line can have the same layer structure or different layer structures. The touch sensor layer TS will be described in detail later.

[0079] Figure 5A is an equivalent circuit diagram illustrating a pixel according to an exemplary embodiment of the present disclosure.

[0080] Figure 5A illustrates an i-th pixel PXi connected to a k-th data line DLk among data lines DL (refer to Figure 4A ).

[0081] The i-th pixel PXi includes an organic light emitting diode OLED and a pixel driving circuit that controls the organic light emitting diode OLED. The pixel driving circuit includes seven thin film transistors T1 to T7 and one storage capacitor Cst. The first thin film transistor T1 controls a driving current applied to the organic light emitting diode OLED. An output electrode of the second thin film transistor T2 is electrically connected to the organic light emitting diode OLED. The output electrode of the second thin film transistor T2 directly contacts a first electrode of the organic light emitting diode OLED, or is connected to the first electrode of the organic light emitting diode OLED via another transistor (for example, the sixth thin film transistor T6).

[0082] The control electrode of the control transistor receives a control signal. The control signal applied to the i-th pixel PXi includes an (i-1)-th gate signal Si-1, an i-th gate signal Si, an (i+1)-th gate signal Si+1, a data signal Dk, and an i-th light emission control signal Ei. In the present exemplary embodiment, the control thin film transistor includes a first thin film transistor T1 and a third thin film transistor T3 to a seventh thin film transistor T7.

[0083] The first thin film transistor T1 includes an input electrode connected to the k-th data line DLk, a control electrode connected to the i-th gate line GLi, and an output electrode connected to an output electrode of the second thin film transistor T2. The first thin film transistor T1 is turned on by the gate signal Si (hereinafter, referred to as "i-th gate signal") applied to the i-th gate line GLi to apply the data signal Dk applied to the k-th data line to the storage capacitor Cst.

[0084] Figure 5B is a cross-sectional view illustrating a portion of an organic light emitting display panel according to an exemplary embodiment of the present disclosure, Figure 5C is a cross-sectional view illustrating a portion of an organic light emitting display panel according to an exemplary embodiment of the present disclosure. In detail, Figure 5B illustrates a cross section of a portion corresponding to the first thin film transistor T1 of the equivalent circuit illustrated in Figure 5A Figure 5C illustrates a cross section of a portion corresponding to the second thin film transistor T2, the sixth thin film transistor T6, and the organic light emitting diode OLED of the equivalent circuit illustrated in Figure 5A

[0085] Referring to Figure 5B and Figure 5C , a buffer layer BFL is disposed on the base layer SUB. The buffer layer BFL improves the bonding force between the base layer SUB and a conductive pattern or a semiconductor pattern. The buffer layer BFL includes an inorganic layer. Although not illustrated in the drawings, a barrier layer can be further disposed on the base layer SUB to prevent foreign substances from entering. The buffer layer BFL and the barrier layer can be selectively disposed or omitted.

[0086] A semiconductor pattern OSP1 (hereinafter, referred to as "first semiconductor pattern") of the first thin film transistor T1, a semiconductor pattern OSP2 (hereinafter, referred to as "second semiconductor pattern") of the second thin film transistor T2, and a semiconductor pattern OSP6 (hereinafter, referred to as "sixth semiconductor pattern") of the sixth thin film transistor T6 are disposed on the buffer layer BFL. The first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6 can include amorphous silicon, polysilicon, or a metal oxide semiconductor.

[0087] ​​The first insulating layer 10 is provided on the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6. In Figure 5B and Figure 5C In the first insulating layer 10 is provided in a layer shape to cover the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6, but the present application should not be limited to or by this. That is, the first insulating layer 10 can be provided in a pattern shape corresponding to the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6.

[0088] The first insulating layer 10 can include a plurality of inorganic thin layers. The inorganic thin layers include a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer.

[0089] A control electrode GE1 (hereinafter, referred to as "first control electrode") of the first thin film transistor T1, a control electrode GE2 (hereinafter, referred to as "second control electrode") of the second thin film transistor T2, and a control electrode GE6 (hereinafter, referred to as "sixth control electrode") of the sixth thin film transistor T6 are provided on the first insulating layer 10. The first control electrode GE1, the second control electrode GE2, and the sixth control electrode GE6 are formed by the same photolithography process as the gate line GL (refer to Figure 4A ).

[0090] A second insulating layer 20 is provided above the first insulating layer 10 to cover the first control electrode GE1, the second control electrode GE2, and the sixth control electrode GE6. The second insulating layer 20 provides a flat upper surface. The second insulating layer 20 includes an organic material and / or an inorganic material.

[0091] An input electrode SE1 (hereinafter, referred to as "first input electrode") and an output electrode DE1 (hereinafter, referred to as "first output electrode") of the first thin film transistor T1, an input electrode SE2 (hereinafter, referred to as "second input electrode") and an output electrode DE2 (hereinafter, referred to as "second output electrode") of the second thin film transistor T2, and an input electrode SE6 (hereinafter, referred to as "sixth input electrode") and an output electrode DE6 (hereinafter, referred to as "sixth output electrode") of the sixth thin film transistor T6 are provided on the second insulating layer 20.

[0092] The first input electrode SE1 and the first output electrode DE1 are connected to the first semiconductor pattern OSP1 through a first contact hole CH1 and a second contact hole CH2 formed through the first insulating layer 10 and the second insulating layer 20, respectively. The second input electrode SE2 and the second output electrode DE2 are connected to the second semiconductor pattern OSP2 through a third contact hole CH3 and a fourth contact hole CH4 formed through the first insulating layer 10 and the second insulating layer 20, respectively. The sixth input electrode SE6 and the sixth output electrode DE6 are connected to the sixth semiconductor pattern OSP6 through a fifth contact hole CH5 and a sixth contact hole CH6 formed through the first insulating layer 10 and the second insulating layer 20, respectively. Meanwhile, according to another exemplary embodiment, each of the first thin-film transistor T1, the second thin-film transistor T2, and the sixth thin-film transistor T6 can have a bottom gate structure.

[0093] The third insulating layer 30 is disposed above the second insulating layer 20 to cover the first input electrode SE1, the second input electrode SE2, the sixth input electrode SE6, the first output electrode DE1, the second output electrode DE2, and the sixth output electrode DE6. The third insulating layer 30 can include an organic layer and / or an inorganic layer. In particular, the third insulating layer 30 can include an organic material to provide a flat surface.

[0094] One of the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30 can be omitted according to a circuit structure of the pixel. Both the second insulating layer 20 and the third insulating layer 30 can be referred to as an intermediate layer. The intermediate layer is disposed between conductive patterns (e.g., between an upper conductive pattern and a lower conductive pattern) to insulate the conductive patterns from each other.

[0095] The pixel definition layer PDL and the organic light emitting diode OLED are disposed on the third insulating layer 30. The first electrode AE is disposed on the third insulating layer 30. The first electrode AE is connected to the sixth output electrode DE6 through a seventh contact hole CH7 defined by the third insulating layer 30. The pixel definition layer PDL has an opening OP defined therethrough. At least a portion of the first electrode AE is exposed through the opening OP of the pixel definition layer PDL.

[0096] When viewed in a plan view, the pixel PX is disposed in a pixel area. The pixel area includes a light emitting area PXA and a non-light emitting area NPXA adjacent to the light emitting area PXA. The non-light emitting area NPXA surrounds the light emitting area PXA. In the present exemplary embodiment, the light emitting area PXA is defined as a portion of the first electrode AE exposed through the opening OP.

[0097] The hole control layer HCL is commonly disposed in the light emitting area PXA and the non-light emitting area NPXA. Although not shown in the drawings, a common layer such as the hole control layer HCL can be commonly formed in the pixel PX (refer to FIG. 1A). Figure 4A).

[0098] An organic light-emitting layer (EML) is disposed on a hole control layer (HCL). The EML is disposed in the region corresponding to the opening (OP). That is, the EML can be patterned into multiple portions, which can be disposed in multiple pixels (PX). In this exemplary embodiment, the patterned EML is shown as a representative example, but the EML can be commonly disposed on multiple pixels (PX). In this case, the EML can generate white light. Furthermore, the EML can have a multilayer structure.

[0099] The electronic control layer (ECL) is disposed on the organic light-emitting layer (EML). Although not shown in the figure, the ECL can be commonly disposed in multiple pixel PXs (see reference). Figure 4A ).

[0100] The second electrode CE is disposed on the electronic control layer ECL. The second electrode CE is commonly disposed in multiple pixels PX.

[0101] A thin-film encapsulation layer (TFE) is disposed on the second electrode (CE). The TFE is commonly disposed in multiple pixels (PX). The TFE comprises at least one inorganic layer and at least one organic layer. The TFE may also include multiple inorganic layers and multiple organic layers stacked alternately with the inorganic layers.

[0102] In this exemplary embodiment, the thin-film encapsulation layer TFE can directly cover the second electrode CE. In this exemplary embodiment, a capping layer can be further disposed between the thin-film encapsulation layer TFE and the second electrode CE to cover the second electrode CE. In this case, the thin-film encapsulation layer TFE can directly cover the capping layer.

[0103] Figures 6A to 6C This is a cross-sectional view showing a thin film encapsulation layer according to an exemplary embodiment of the present disclosure. In the following, reference will be made to... Figures 6A to 6C The thin film encapsulation layers TFE1, TFE2 and TFE3 according to this disclosure are described in detail.

[0104] Reference Figure 6A The thin film encapsulation layer TFE1 includes n inorganic thin layers IOL1 to IOLn, wherein the first inorganic thin layer IOL1 of the n inorganic thin layers IOL1 to IOLn is connected to the second electrode CE (refer to...). Figure 6C Contact. The first inorganic thin layer IOL1 can be called the "lower inorganic thin layer", and the inorganic thin layers among the n inorganic thin layers IOL1 to IOLn, excluding the first inorganic thin layer IOL1, can be called the "upper inorganic thin layer".

[0105] The thin film encapsulation layer TFE1 includes n-1 organic thin layers OLi to OLn-1, which are arranged alternately with n inorganic thin layers IOLi to IOLn. Each of the n-1 organic thin layers OLi to OLn-1 can have a thickness greater than a thickness of each of the n inorganic thin layers IOLi to IOLn.

[0106] Each of the n inorganic thin layers IOLi to IOLn can have a single layer structure including one type of material or a multi-layer structure including a plurality of different types of materials. Each of the n-1 organic thin layers OLi to OLn-1 can be formed by depositing an organic monomer. For example, each of the n-1 organic thin layers OLi to OLn-1 can be formed using an inkjet printing method or by coating a component containing an acryl-based monomer. In the present exemplary embodiment, the thin film encapsulation layer TFE1 can further include an nth organic thin layer.

[0107] Referring to Figure 6B and Figure 6C , each of the thin film encapsulation layers TFE2 and TFE3 can include the same inorganic material or different inorganic materials from each other, and can have the same thickness or different thicknesses. Each of the thin film encapsulation layers TFE2 and TFE3 can include the same organic material or different organic materials from each other, and can have the same or different thicknesses.

[0108] As shown in Figure 6B , the thin film encapsulation layer TFE2 includes a first inorganic thin layer IOLi, a first organic thin layer OLi, a second inorganic thin layer IOL2, a second organic thin layer OL2, and a third inorganic thin layer IOL3, which are sequentially stacked.

[0109] The first inorganic thin layer IOLi can have a double layer structure. The first sub-layer S1 and the second sub-layer S2 can have different inorganic materials.

[0110] As shown in Figure 6C , the thin film encapsulation layer TFE2 includes a first inorganic thin layer IOL10, a first organic thin layer OL1, and a second inorganic thin layer IOL20, which are sequentially stacked. The first inorganic thin layer IOL10 can have a double layer structure. The first sub-layer S10 and the second sub-layer S20 can have different inorganic materials. The second inorganic thin layer IOL20 can have a double layer structure. The second inorganic thin layer IOL20 can include a first sub-layer S100 and a second sub-layer S200, which are deposited in different environments from each other. The first sub-layer S100 can be deposited at a low power level, and the second sub-layer S200 can be deposited at a high power. The first sub-layer S100 and the second sub-layer S200 can include the same inorganic material.

[0111] Figure 7Ais a cross-sectional view showing a touch sensor layer according to an exemplary embodiment of the present disclosure.

[0112] Referring to Figure 7A The touch sensor layer TS includes a first conductive layer TS-CL1, a first insulating layer (hereinafter, referred to as "a first touch insulating layer") TS-IL1, a second conductive layer TS-CL2, and a second insulating layer (hereinafter, referred to as "a second touch insulating layer") TS-IL2. The first conductive layer TS-CL1 is disposed directly on the thin film encapsulation layer TFE, but the present disclosure should not be limited thereto or be construed as being limited thereto. That is, another inorganic layer (e.g., a buffer layer, not shown) can be further disposed between the first conductive layer TS-CL1 and the thin film encapsulation layer TFE.

[0113] Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 has a single layer structure or a multi-layer structure in which multiple layers are stacked in the third direction DR3. The conductive layer having the multi-layer structure includes two or more layers of a transparent conductive layer and a metal layer. The conductive layer having the multi-layer structure includes metal layers including different metals from each other. The transparent conductive layer includes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowire, or graphene. The metal layer includes molybdenum, silver, titanium, copper, aluminum, or an alloy thereof.

[0114] Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 includes a plurality of patterns. Hereinafter, the first conductive layer TS-CL1 includes a first conductive pattern, and the second conductive layer TS-CL2 includes a second conductive pattern. Each of the first conductive pattern and the second conductive pattern includes a touch electrode and a touch signal line.

[0115] The first touch insulating layer TS-IL1 includes an inorganic material or an organic material. The inorganic material includes at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic material includes at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene-based resin.

[0116] The second touch insulating layer TS-IL2 has a single layer structure or a multi-layer structure. The organic material includes at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene-based resin.

[0117] Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 has a single layer structure or a multi-layer structure. The first touch insulating layer TS-IL1 includes at least one of an inorganic layer and an organic layer. The second touch insulating layer TS-IL2 includes at least one organic layer. The inorganic layer and the organic layer are formed by a chemical vapor deposition method.

[0118] If the first touch insulating layer TS-IL1 insulates the first conductive layer TS-CL1 from the second conductive layer TS-CL2, the first touch insulating layer TS-IL1 should not be limited to a specific shape. The shape of the first touch insulating layer TS-IL1 is determined according to the shapes of the first conductive pattern and the second conductive pattern. The first touch insulating layer TS-IL1 completely covers the thin film encapsulation layer TFE or includes a plurality of insulating patterns. The insulating patterns are superposed with the first connection part CP1 and the second connection part CP2, which are described later.

[0119] In the present exemplary embodiment, although a two-layer type touch sensor layer has been described, the touch sensor layer should not be limited to the two-layer type. A single-layer type touch sensor layer includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes a touch sensor and a touch signal line connected to the touch sensor. The single-layer type touch sensor layer acquires coordinate information using a self-capacitance method.

[0120] Figures 7B to 7E A plan view of a touch sensor layer according to an exemplary embodiment of the present disclosure is illustrated.

[0121] Referring to Figure 7B , the touch sensor layer TS includes first touch electrodes TE1-1 to TE1-4, first touch signal lines SL1-1 to SL1-4 connected to the first touch electrodes TE1-1 to TE1-4, second touch electrodes TE2-1 to TE2-5, second touch signal lines SL2-1 to SL2-5 connected to the second touch electrodes TE2-1 to TE2-5, and a pad part PADa connected to the first touch signal lines SL1-1 to SL1-4 and the second touch signal lines SL2-1 to SL2-5. Figure 7B A touch sensor layer TS configured to include four first touch electrodes TE1-1 to TE1-4 and five second touch electrodes TE2-1 to TE2-5 is illustrated, but the number of first touch electrodes and the number of second touch electrodes should not be limited to this or by this.

[0122] Each of the first touch electrodes TE1-1 to TE1-4 has a mesh shape defining a plurality of touch openings. Each of the first touch electrodes TE1-1 to TE1-4 includes a plurality of first touch sensor portions SP1 and a plurality of first connection portions CP1. The first touch sensor portions SP1 are arranged on a first direction DR1. Each of the first connection portions CP1 connects two of the first touch sensor portions SP1 adjacent to each other. Although not shown in detail, the first touch signal lines SL1-1 to SL1-4 can have a mesh shape.

[0123] The second touch electrodes TE2-1 to TE2-5 are insulated from the first touch electrodes TE1-1 to TE1-4 while crossing the first touch electrodes TE1-1 to TE1-4. Each of the second touch electrodes TE2-1 to TE2-5 has a mesh shape defining a plurality of touch openings therethrough. Each of the second touch electrodes TE2-1 to TE2-5 includes a plurality of second touch sensor portions SP2 and a plurality of second connection portions CP2. The second touch sensor portions SP2 are arranged on a second direction DR2. Each of the second connection portions CP2 connects two of the second touch sensor portions SP2 adjacent to each other. Although not shown in detail, the second touch signal lines SL2-1 to SL2-5 can have a mesh shape.

[0124] The first touch electrodes TE1-1 to TE1-4 are capacitively coupled to the second touch electrodes TE2-1 to TE2-5. When a touch sensing signal is applied to the first touch electrodes TE1-1 to TE1-4, capacitors are formed between the first touch sensor portions SP1 and the second touch sensor portions SP2.

[0125] Some of the first touch sensor portions SP1, the first connection portions CP1, the first touch signal lines SL1-1 to SL1-4, the second touch sensor portions SP2, the second connection portions CP2, and the second touch signal lines SL2-1 to SL2-5 are formed by patterning a first conductive layer TS-CL1 shown in FIG. 1A, and the others of the first touch sensor portions SP1, the first connection portions CP1, the first touch signal lines SL1-1 to SL1-4, the second touch sensor portions SP2, the second connection portions CP2, and the second touch signal lines SL2-1 to SL2-5 are formed by patterning a second conductive layer TS-CL2 shown in FIG. 1B. Figure 7A Some of the first touch sensor portions SP1, the first connection portions CP1, the first touch signal lines SL1-1 to SL1-4, the second touch sensor portions SP2, the second connection portions CP2, and the second touch signal lines SL2-1 to SL2-5 are formed by patterning a first conductive layer TS-CL1 shown in FIG. 1A, and the others of the first touch sensor portions SP1, the first connection portions CP1, the first touch signal lines SL1-1 to SL1-4, the second touch sensor portions SP2, the second connection portions CP2, and the second touch signal lines SL2-1 to SL2-5 are formed by patterning a second conductive layer TS-CL2 shown in FIG. 1B. Figure 7A Some of the first touch sensor portions SP1, the first connection portions CP1, the first touch signal lines SL1-1 to SL1-4, the second touch sensor portions SP2, the second connection portions CP2, and the second touch signal lines SL2-1 to SL2-5 are formed by patterning a first conductive layer TS-CL1 shown in FIG. 1A, and the others of the first touch sensor portions SP1, the first connection portions CP1, the first touch signal lines SL1-1 to SL1-4, the second touch sensor portions SP2, the second connection portions CP2, and the second touch signal lines SL2-1 to SL2-5 are formed by patterning a second conductive layer TS-CL2 shown in FIG. 1B.

[0126] In order to electrically connect the conductive patterns provided on different layers, a contact hole can be formed through Figure 7A A contact hole is formed through a first touch insulating layer TS-IL1 shown in FIG. 1A. Hereinafter, the touch sensor layer TS will be described with reference to FIG. 1B. Figures 7C to 7E A contact hole is formed through a first touch insulating layer TS-IL1 shown in FIG. 1A. Hereinafter, the touch sensor layer TS will be described with reference to FIG. 1B.

[0127] Referring to Figure 7C , a first conductive pattern is disposed on the thin film encapsulation layer TFE. The first conductive pattern includes a second connection part CP2. The second connection part CP2 is disposed directly on the thin film encapsulation layer TFE. Referring to Figure 7D , a first touch insulating layer TS-IL1 is disposed on the thin film encapsulation layer TFE to cover the second connection part CP. A contact hole CH is defined through the first touch insulating layer TS-IL1 to partially expose the second connection part CP2. The contact hole CH is formed through a photolithography process.

[0128] Referring to Figure 7E , a second conductive pattern is disposed on the first touch insulating layer TS-IL1. The second conductive pattern includes a first touch sensor part SP1, a first connection part CP1, first touch signal lines SL1-1 to SL1-4, a second touch sensor part SP2, and second touch signal lines SL2-1 to SL2-5. Although not separately shown, a second touch insulating layer TS-IL2 is further disposed on the first touch insulating layer TS-IL1 to cover the second conductive pattern. The second touch insulating layer TS-IL2 will be described in detail later.

[0129] According to another exemplary embodiment of the disclosure, the first conductive pattern includes first touch electrodes TE1-1 to TE1-4 and the first touch signal lines SL1-1 to SL1-4. The second conductive pattern includes second touch electrodes TE2-1 to TE2-5 and the second touch signal lines SL2-1 to SL2-5. In this case, the contact hole CH is not defined in the first touch insulating layer TS-IL1.

[0130] In addition, according to another exemplary embodiment of the disclosure, the first conductive pattern and the second conductive pattern can be exchanged with each other. That is, the second conductive pattern can include the second connection part CP2.

[0131] Figure 7F is a partial enlarged view illustrating a region BB of Figure 7E .

[0132] Referring to Figure 7F , the first touch sensor part SP1 overlaps the non-light emitting area NPXA. The first touch sensor part SP1 includes a plurality of first extension parts SP1-A extending along a sixth direction DR6 crossing the first direction DR1 and the second direction DR2, and a plurality of second extension parts SP1-B extending along a seventh direction DR7 crossing the sixth direction DR6. The first extension parts SP1-A and the second extension parts SP1-B can be defined as mesh lines. Each mesh line has a line width of several micrometers.

[0133] The first extension part SP1-A is connected to the second extension part SP1-B to define a plurality of touch openings TS-OP. In other words, the first touch sensor part SP1 has a mesh shape defined by the touch openings TS-OP. The touch openings TS-OP correspond one-to-one to the light emitting areas PXA, but they should not be limited thereto or thereby. That is, one touch opening TS-OP can correspond to two or more light emitting areas PXA.

[0134] The light emitting areas PXA can have various sizes. For example, in the light emitting areas PXA, the size of the light emitting area PXA emitting blue light can be different from the size of the light emitting area PXA emitting red light. Accordingly, the touch openings TS-OP can have various sizes. In Figure 7F In the embodiment, the light emitting areas PXA have various sizes, but the light emitting areas PXA can all have the same size, and the touch openings OP can all have the same size as well.

[0135] Figures 8A to 8D is a cross-sectional view illustrating a display device according to an exemplary embodiment of the present disclosure. For convenience of explanation, Figures 8A to 8D a cross section of the area AA corresponding to Figure 4B is illustrated. Hereinafter, the display device according to various embodiments of the present disclosure will be described in detail with reference to Figures 8A to 8D In the embodiment, the same reference numerals denote the same elements as those in Figures 8A to 8D , and thus detailed description of the same elements will be omitted. Figures 1A to 7F

[0136] Referring to Figures 8A to 8D , the display device includes a base member BSM, a circuit layer DP-CL, a display layer DP-OLED, a thin film encapsulation layer TFE, and a touch sensor layer TS.

[0137] The base member BSM includes a first area AR1 and a second area AR2. The first area AR1 includes a first sub-area AR1-1 and a second sub-area AR1-2. The first area AR1 includes a display area and a non-display area. The first sub-area AR1-1 corresponds to the display area. The second sub-area AR1-2 corresponds to the first non-display area. The second area AR2 corresponds to the second non-display area. The second area AR2 can correspond to an outermost area of the display device.

[0138] The base member BSM includes a base layer SUB and a buffer layer BFL.

[0139] ​The base layer SUB can be a flexible substrate and can include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic hybrid material substrate. The plastic substrate includes at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a silicone-based resin, a polyimide-based resin, a polyamide-based resin, and a perylene-based resin. The buffer layer BFL includes an inorganic material. The buffer layer BFL can include silicon oxide or silicon nitride.

[0140] In Figures 8A to 8D , the buffer layer BFL is provided as a functional layer on the base layer SUB, but a barrier layer can also be provided as a functional layer. According to another exemplary embodiment, the buffer layer BFL can be omitted from the display device.

[0141] In Figures 8A to 8D , the second area AR2 has a planar shape, but the second area AR2 can be curved with a constant curvature in the third direction DR3.

[0142] The circuit layer DP-CL is provided on the base member BSM. The circuit layer DP-CL covers the first area AR1 while exposing the second area AR2. The circuit layer DP-CL covers the first sub-area AR1-1 and the second sub-area AR1-2. The circuit layer DP-CL exposes the second area AR2.

[0143] The circuit layer DP-CL includes a thin film transistor TR, a wire E-VSS and CL, and at least one insulating layer.

[0144] The semiconductor pattern OSP of the thin film transistor TR is provided on the base layer SUB. The semiconductor pattern OSP includes amorphous silicon, polycrystalline silicon, or a metal oxide semiconductor. The insulating layer includes a first insulating layer 10 and a second insulating layer 20. The end portions of the first insulating layer 10 and the second insulating layer 20 are aligned parallel to each other. In other words, one end portion of the first insulating layer 10 and one end portion of the second insulating layer 20 are provided adjacent to the outside of the display device. The end portions of the circuit layer DP-CL are defined by the end portions of the insulating layer provided at the outermost positions among the end portions of the first insulating layer 10 and the second insulating layer 20. The end portions of the insulating layer define a boundary between the first area AR1 and the second area AR2. The end portions of the insulating layer define the end portion of the second sub-area AR1-2 and the second area AR2.

[0145] The first insulating layer 10 is provided over the base layer SUB to cover the semiconductor pattern OSP. The first insulating layer 10 includes an organic layer and / or an inorganic layer. The first insulating layer 10 includes a plurality of inorganic thin layers. The inorganic thin layers include a silicon nitride layer and a silicon oxide layer.

[0146] A control electrode GE of the thin film transistor TR is provided on the first insulating layer 10. The control electrode GE is formed by the same photolithography process as the gate line GL (refer to Figure 4A ). The control electrode GE includes the same material as the gate line and the same stack structure as the gate line, and is provided on the same layer as the gate line.

[0147] A second insulating layer 20 is provided on the first insulating layer 10 to cover the control electrode GE. The second insulating layer 20 includes an organic layer and / or an inorganic layer. The second insulating layer 20 includes a plurality of inorganic thin layers. The inorganic thin layers include a silicon nitride layer and a silicon oxide layer. The second insulating layer 20 includes a different material from the material of the first insulating layer 10.

[0148] An input electrode SE and an output electrode DE of the thin film transistor TR are provided on the second insulating layer 20. A signal line CL and a power supply line E-VSS are provided on the second insulating layer 20.

[0149] A first dam portion DM1 and a second dam portion DM2 are provided in the second sub-region AR1-2. The first dam portion DM1 and the second dam portion DM2 are provided to surround the first sub-region AR1-1 when viewed in a plan view. The first dam portion DM1 and the second dam portion DM2 can prevent an organic monomer from overflowing when the organic monomer is printed to form the organic thin layer OLI of the thin film encapsulation layer TFE.

[0150] The first dam portion DM1 is provided on the power supply line E-VSS. The first dam portion DM1 has a single-layer structure and is formed substantially simultaneously with the pixel definition layer PDL.

[0151] The second dam portion DM2 is provided outside the first dam portion DM1. For example, a distance between the second dam portion DM2 and the first sub-region AR1-1 is greater than a distance between the first dam portion DM1 and the first sub-region AR1-1.

[0152] The second dam portion DM2 covers a portion of the power supply line E-VSS. The second dam portion DM2 includes a plurality of layers, for example, a first layer DM2-L1 and a second layer DM2-L2.

[0153] A third insulating layer 30 is provided on the second insulating layer 20 to cover the input electrode SE and the output electrode DE. The third insulating layer 30 includes an organic layer and / or an inorganic layer. The third insulating layer 30 includes an organic material to provide a flat surface.

[0154] One of the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30 can be omitted depending on the circuit structure of the pixel. Both the second insulating layer 20 and the third insulating layer 30 can be referred to as an "intermediate layer". The intermediate layer is provided between conductive patterns (for example, the upper conductive pattern and the lower conductive pattern) to insulate the conductive patterns from each other.

[0155] The display layer DP-OLED is disposed on the third insulating layer 30. The pixel defining layer PDL and the organic light-emitting diode OLED are disposed on the third insulating layer 30. The first electrode AE ​​is disposed on the third insulating layer 30. The first electrode AE ​​is connected to the output electrode DE through a contact hole defined by the third insulating layer 30. The light-emitting region is defined in the pixel defining layer PDL. At least a portion of the first electrode AE ​​is exposed through the light-emitting region of the pixel defining layer PDL.

[0156] The light-emitting unit EU is disposed on the first electrode AE. The second electrode CE is disposed on the light-emitting unit EU. Although not shown in the figure, the light-emitting unit EU may include, for example... Figure 5C The hole control layer HCL, organic light-emitting layer EML, and electronic control layer ECL are shown in the figure.

[0157] The connecting electrode E-CNT and the first electrode AE ​​are disposed on the same layer. The first electrode AE ​​and the connecting electrode E-CNT are disposed on the third insulating layer 30. The first electrode AE ​​and the connecting electrode E-CNT are formed using the same process. The connecting electrode E-CNT is electrically connected to the power supply line E-VSS. The connecting electrode E-CNT receives the second voltage ELVSS (refer to...) from the power supply line E-VSS. Figure 5A Although not shown in the figure, the connecting electrode E-CNT is configured to partially overlap with the first layer DM2-L1 of the second dam section DM2.

[0158] In this exemplary embodiment, the thin-film encapsulation layer TFE directly covers the second electrode CE. In this exemplary embodiment, the capping layer may further be configured to cover the second electrode CE. In this case, the thin-film encapsulation layer TFE directly covers the capping layer. The thin-film encapsulation layer TFE comprises a first inorganic thin layer IOL10, a first organic thin layer OL1, and a second inorganic thin layer IOL20 stacked sequentially, but the thin-film encapsulation layer TFE should not be limited thereto or thereby restricted. The thin-film encapsulation layer TFE may include multiple inorganic thin layers and multiple organic thin layers.

[0159] The end of the thin film encapsulation layer TFE is disposed on the first region AR1. The end of the thin film encapsulation layer TFE is disposed closer to the center of the display device than the ends of the first insulating layer 10 and the second insulating layer 20.

[0160] The touch sensor layer TS is disposed on the thin film encapsulation layer TFE. The touch sensor layer TS includes a first touch insulating layer TS-IL1, a plurality of conductive patterns disposed on the first touch insulating layer TS-IL1, and a second touch insulating layer TS-IL2 disposed on the conductive patterns. The conductive patterns include a touch sensor portion SP disposed in a first sub-region AR1-1 and a touch signal line SL disposed in a second sub-region AR1-2.

[0161] Touch sensor unit SP corresponds to Figures 7A to 7F The first touch sensor unit SP1 and the second touch sensor unit SP2 shown in the figure correspond to the touch signal line SL. Figure 7A and Figure 7F The first touch signal lines SL1-1 to SL1-4 and the second touch signal lines SL2-1 to SL2-5 are shown in the figure. Although not shown, the conductive pattern may also include a pattern disposed between the first touch insulating layer TS-IL1 and the thin film encapsulation layer TFE. In the following text, repeated descriptions of the touch sensor section SP and the touch signal lines SL will be omitted.

[0162] The end of the first touch insulating layer TS-IL1 is disposed in the first region AR1. The end of the first touch insulating layer TS-IL1 is disposed in the second sub-region AR1-2. The end of the first touch insulating layer TS-IL1 is parallel and aligned with the end of the thin film encapsulation layer TFE. The end of the first touch insulating layer TS-IL1 is disposed closer to the center of the display device than the ends of the first insulating layer 10 and the second insulating layer 20.

[0163] The second touch insulating layer TS-IL2 comprises an organic material. Hereinafter, for ease of explanation, the second touch insulating layer TS-IL2 is referred to as the "organic layer". The organic layer TS-IL2 is superimposed on the first sub-region AR1-1 and the second sub-region AR1-2. The organic layer TS-IL2 is superimposed on at least a portion of the second region AR2. The organic layer TS-IL2 covers the second region AR2. The organic layer TS-IL2 is configured to directly contact the upper part of the touch sensor layer TS. The organic layer TS-IL2 directly contacts and covers the first touch insulating layer TS-IL1 and the conductive patterns disposed on the first touch insulating layer TS-IL1. The organic layer TS-IL2 directly contacts and covers a portion of the first touch insulating layer TS-IL1, covering the touch sensor portion SP and the touch signal line SL disposed on the first touch insulating layer TS-IL1.

[0164] The organic layer TS-IL2 is stacked over the entire surface of the insulating layer. The organic layer TS-IL2 is completely stacked over the first insulating layer 10 and the second insulating layer 20. When in... Figure 8A When viewed in the plan view shown, the organic layer TS-IL2 completely overlaps with the second region AR2 to cover the end of the display device. As another example, when in... Figures 8B to 8D When viewed in the planar diagram shown, the organic layer TS-IL2 can be superimposed on a portion of the second region AR2. The organic layer TS-IL2 can be configured to cover the end of the thin-film encapsulation layer TFE and the touch sensor layer TS.

[0165] Although not shown in the diagram, the pad portion PD (refer to) Figure 4A ) and control signal line SL-D (refer to Figure 4A ) can be set Figures 8A to 8D In the area shown, and in other areas located on the outermost portion of the display panel DP, the pad portion PD is configured to overlap with the second area AR2. In this case, the organic layer TS-IL2 can be configured not to overlap with the pad portion PD. The organic layer TS-IL2 can expose the pad portion PD. The exposed pad portion PD can be easily electrically connected to external electrical components.

[0166] Reference Figure 8B The display device may further include an impact-absorbing member disposed on a second region of the base layer SUB. The impact-absorbing member is disposed on the second region AR2 of the base layer SUB. The impact-absorbing member includes multiple insulating patterns DM-CP. The impact-absorbing member absorbs impacts generated outside the display device to prevent breakage within the insulating layer.

[0167] The insulating patterns DM-CP are arranged on the first direction DR1 and spaced apart from each other. In this exemplary embodiment, the bending axis of the second region AR2 is defined along the second direction DR2. The insulating patterns DM-CP are spaced apart from each other on the first direction DR1 and extend on the second direction DR2. The insulating patterns DM-CP extend in a direction parallel to the bending axis and are spaced apart from each other in a direction intersecting the bending axis, thus reducing the impact of the insulating patterns DM-CP on the display device.

[0168] The organic layer TS-IL2 covers the side and top surfaces of the impact-absorbing component. The organic layer TS-IL2 also covers each insulating pattern DM-CP of the impact-absorbing component. Spaces are defined between the insulating patterns DM-CP. The insulating patterns DM-CP are spaced apart at a regular interval, but the spacing between the insulating patterns DM-CP may not be constant. The organic layer TS-IL2 can fill the spaces between the insulating patterns DM-CP. The organic layer TS-IL2 has a thickness equal to or greater than the thickness of the insulating patterns DM-CP to completely cover them.

[0169] Each of the insulating patterns DM-CP includes a first layer DM-C1 and a second layer DM-C2. The first layer DM-C1 and the second layer DM-C2 can be stacked sequentially. The first layer DM-C1 has the same thickness as the first insulating layer 10. The second layer DM-C2 has the same thickness as the second insulating layer 20.

[0170] The insulating pattern DM-CP includes the same material as that of the first insulating layer 10 and the second insulating layer 20. The first layer DM-C1 includes the same material as that of the first insulating layer 10. The second layer DM-C2 includes the same material as that of the second insulating layer 20. The first layer DM-C1 is formed with the first insulating layer 10 by the same process, and the second layer DM-C2 is formed with the second insulating layer 20 by the same process.

[0171] With reference to Figure 8C , the impact-absorbing member DM-C can further include a cover member DM-CC covering the insulating pattern DM-CP. The cover member DM-CC covers the entire surface of the insulating pattern DM-CP to prevent foreign substances from coming into contact with the insulating pattern DM-CP. The cover member DM-CC is superposed with the second area. The cover member DM-CC is partially superposed with the first area. The cover member DM-CC is partially superposed with the second sub-area AR1-2.

[0172] The organic layer TS-IL2 covers the side surface and the upper surface of the cover member DM-CC. Since the organic layer TS-IL2 covers the side surface and the upper surface of the cover member DM-CC, the organic layer TS-IL2 can completely cover the impact-absorbing member DM-C without exposing the impact-absorbing member DM-C.

[0173] With reference to Figure 8D , the buffer layer BFL of the display device according to the present exemplary embodiment includes a first buffer portion BFL-A and a second buffer portion BFL-B. The first buffer portion BFL-A is spaced apart from the second buffer portion BFL-B. At least one opening BFL-OP is defined between the first buffer portion BFL-A and the second buffer portion BFL-B.

[0174] The first buffer portion BFL-A is disposed in the second area AR2. The first buffer portion BFL-A is superposed with the second area AR2. The opening BFL-OP is defined in the second area AR2. The opening BFL-OP has a predetermined width in the first direction DR1 and extends in the second direction DR2.

[0175] The organic layer TS-IL2 is filled in the opening BFL-OP. Since the organic layer TS-IL2 is filled in the opening BFL-OP, the organic layer TS-IL2 covers the exposed side surface of the first buffer portion BFL-A and the second buffer portion BFL-B.

[0176] The organic layer TS-IL2 according to the present exemplary embodiment covers components causing a step difference on the base member BSM. Accordingly, the organic layer TS-IL2 covers the end portion of the circuit layer DP-CL causing a step difference on the base member BSM as shown in Figure 8A , and covers the end portion of the circuit layer DP-CL causing a step difference on the base member BSM as shown in Figure 8B and Figure 8C The impact absorbing member DM-C shown in FIG. 10. In addition, the organic layer TS-IL2 covers the recessed step difference as shown in FIG. 11. Figure 8D The opening BFL-OP defined by the base member BSM shown in FIG. 12, and thus the recessed step difference can be covered.

[0177] In the present exemplary embodiment, the organic layer TS-IL2 provided on the touch sensor layer TS covers the second area AR2 as the outermost portion of the display module DM, and thus, the breakage in the outer portion can be prevented. Specifically, in the case where the impact absorbing member DM-C is provided in the second area AR2 or the opening BFL-OP of the buffer layer BFL is defined in the second area AR2, the organic layer TS-IL2 covers the impact absorbing member CM-C or fills in the opening BFL-OP to relieve the stress generated when the display device is bent, and thus, the breakage in the outer portion can be prevented.

[0178] Hereinafter, a method of manufacturing a display device will be described in detail.

[0179] Figures 9A to 9I is a sectional view showing a method of manufacturing a display module shown in FIG. 10. Figure 8C is a sectional view showing a method of manufacturing a display module shown in FIG. 10.

[0180] Referring to FIGS. 1 to 3, Figure 9A and Figure 9B , a base layer SUB is prepared. A functional layer such as a buffer layer BFL can be further provided on one surface of the base layer SUB. A semiconductor pattern OSP is formed on at least the base layer SUB, and a first insulating layer 10 is formed on the base layer SUB to cover the semiconductor pattern OSP.

[0181] Referring to FIGS. 1 to 3, Figure 9C , a control electrode GE is formed on the first insulating layer 10. The control electrode GE is formed to be disposed on the semiconductor pattern OSP. The control electrode GE is formed by a photolithography process. A second insulating layer 20 is formed to cover the control electrode GE formed on the first insulating layer 10. The end portion of the first insulating layer 10 and the end portion of the second insulating layer 20 are aligned in parallel with each other. As another example, each of the first insulating layer 10 and the second insulating layer 20 can be formed to be completely overlapped with the base layer SUB.

[0182] Referring to FIGS. 1 to 3, Figure 9DThe method for manufacturing the display device includes etching a portion of a first insulating layer 10 and a second insulating layer 20. In the etching process, the outer portions of the first insulating layer 10 and the second insulating layer 20 are partially etched to form an insulating pattern DM-CP. The insulating pattern DM-CP includes a first layer DM-C1 and a second layer DM-C2. The first layer DM-C1 is formed by etching a portion of the first insulating layer 10, and the second layer DM-C2 is formed by etching a portion of the second insulating layer 20. In the etching process, a via TH1 is formed by etching the first insulating layer 10 and the second insulating layer 20 to expose a portion of the semiconductor pattern OSP. The insulating pattern DM-CP can be formed substantially simultaneously with the first insulating layer 10 and the second insulating layer 20 forming the circuit layer DP-CL using a single mask. Therefore, manufacturing time can be shortened, and manufacturing costs can be reduced.

[0183] Reference Figure 9E Output electrode DE, input electrode SE, signal line CL, and power line E-VSS are formed on the second insulating layer 20. A third insulating layer 30 is formed above the second insulating layer 20 to cover the thin-film transistor TR and the signal line CL. The third insulating layer 30 is formed to completely overlap with the first insulating layer 10 and the second insulating layer 20 and is patterned. In this case, a second dam DM2 can be formed (see reference). Figure 8C The first layer DM2-L1 of the second dam and the cover member DM-CC of the impact absorption member DM-C are formed. The first layer DM2-L1 of the second dam is formed to be superimposed on a portion of the power line E-VSS. The third insulating layer 30, the first layer DM2-L1 of the second dam, and the cover member DM-CC are made of the same material. In the etching process, a through-hole TH2 is formed through the third insulating layer 30 to expose a portion of the input electrode SE.

[0184] Reference Figure 9F A first electrode AE ​​is formed, connected to one of the output electrode DE and the connection electrode E-CNT. The first electrode AE ​​and the connection electrode E-CNT are formed on the same layer. The first electrode AE ​​and the connection electrode E-CNT are formed on the third insulating layer 30. The first electrode AE ​​is connected to the thin-film transistor TR through the third insulating layer 30.

[0185] The connecting electrode E-CNT is electrically connected to the power supply line E-VSS. The connecting electrode E-CNT receives the second voltage ELVSS from the power supply line E-VSS (see reference). Figure 5A Although not shown in the figure, the connecting electrode E-CNT is formed as partly disposed on the first layer DM2-L1 of the second dam DM2.

[0186] The light emitting unit EU, the pixel definition layer PDL, and the second electrode CE are formed on the third insulating layer 30. The light emitting unit EU is formed between the first electrode AE and the second electrode CE. In the process of forming the pixel definition layer PDL, the first dam portion DM1 overlapping the power supply line E-VSS and the second layer DM2-L2 overlapping the first layer DM2-L1 of the second dam portion DM2 are formed. The pixel definition layer PDL, the first dam portion DM1, and the second layer DM2-L2 can be formed by the same material and can include the same material.

[0187] Referring to Figure 9G The thin film encapsulation layer TFE is formed on the display layer DP-OLED. The thin film encapsulation layer TFE is formed by sequentially forming the first inorganic thin layer IOL10, the first organic thin layer OL1, and the second inorganic thin layer IOL20. The first organic thin layer OL1 is formed by providing a liquid organic monomer on the first inorganic thin layer IOL10. The organic monomer does not flow out of the first dam portion DM1 and the second dam portion DM2 through the first dam portion DM1 and the second dam portion DM2, and thus, the organic monomer is stably formed to have a predetermined thickness.

[0188] Referring to Figure 9H The first touch insulating layer TS-IL1 and the conductive pattern are formed on the thin film encapsulation layer TFE. The first touch insulating layer TS-IL1 is formed on the thin film encapsulation layer TFE, and the signal line SL and the touch sensor portion SP are formed on the first touch insulating layer TS-IL1. The touch sensor portion SP is formed on the first sub-area AR1-1, and the signal line SL is formed on the second sub-area AR1-2.

[0189] Referring to Figure 9I The organic layer TS-IL2 is formed on the first touch insulating layer TS-IL1. The organic layer TS-IL2 is formed on the first touch insulating layer TS-IL1 to completely cover the conductive pattern.

[0190] The organic layer TS-IL2 is formed to completely overlap the first insulating layer 10 and the second insulating layer 20. The organic layer TS-IL2 is formed to overlap the first sub-area AR1-1, the second sub-area AR1-2, and the second area AR2.

[0191] The organic layer TS-IL2 is formed to cover the impact absorbing member DM-C formed on the second area AR2. The organic layer TS-IL2 completely covers the circuit layer DP-CL and extends from the touch sensor layer TS to a side surface and an upper surface covering the impact absorbing member DM-C. As described above, since the organic layer TS-IL2 covers the impact absorbing member DM-C disposed at the outermost position and causing a step difference on the base member BSM, stress generated when the display device is bent can be alleviated. Thus, a breakage can be prevented from occurring in the outer portion.

[0192] While specific example embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Accordingly, the inventive concept is not limited to these embodiments, but instead has a broader scope as set out in the appended claims and various obvious modifications and equivalent arrangements.

Claims

1. A display device, the display device comprising: Basic components; A circuit layer is disposed on the basic component; A display layer is disposed on the circuit layer and includes organic light-emitting diodes; A thin film encapsulation layer is disposed on the display layer and comprises a first inorganic film, an organic film, and a second inorganic film stacked sequentially. as well as The touch sensor layer is directly disposed on the thin film encapsulation layer. The touch sensor layer includes a first conductive layer disposed on the thin film encapsulation layer, a first insulating layer disposed on the first conductive layer, a second conductive layer disposed on the first insulating layer, and a second insulating layer disposed on the second conductive layer. The basic component defines a first region that overlaps with the circuit layer and a second region that does not overlap with the circuit layer. The second insulating layer overlaps with the first region and extends to cover at least a portion of the second region of the base member, and The second insulating layer is in direct contact with a portion of the thin film encapsulation layer and a portion of the circuit layer.

2. The display device according to claim 1, wherein, The touch sensor layer further includes an inorganic insulating layer disposed between the first conductive layer and the thin film encapsulation layer, wherein the inorganic insulating layer is in direct contact with the thin film encapsulation layer.

3. The display device according to claim 1, wherein, The boundary between the first region and the second region is defined by the end of the circuit layer.

4. The display device according to claim 1, wherein, The end of the circuit layer protrudes further than the end of the thin film encapsulation layer, and the portion of the circuit layer not covered by the thin film encapsulation layer contacts the second insulating layer.

5. The display device according to claim 1, wherein, The end of the first insulating layer is aligned with the end of the thin film encapsulation layer.

6. The display device according to claim 1, wherein, The first insulating layer is an inorganic layer, and the second insulating layer is an organic layer.

7. The display device according to claim 1, further comprising an impact-absorbing member disposed on the second region of the base member, wherein, The impact-absorbing component comprises patterns spaced apart from each other.

8. The display device according to claim 7, wherein, The second insulating layer covers the entirety of the pattern.

9. The display device according to claim 7, wherein, The impact-absorbing member further includes a covering member that covers the entire pattern, and the second insulating layer completely covers the covering member.

10. The display device according to claim 7, wherein, The pattern is spaced apart from the circuit layer.

11. The display device according to claim 7, wherein, The thickness of the second insulating layer is greater than the thickness of each of the patterns.

12. A display device, the display device comprising: Basic components; A circuit layer is disposed on the basic component; A display layer is disposed on the circuit layer and includes organic light-emitting diodes; A thin film encapsulation layer is disposed on the display layer and comprises a first inorganic film, an organic film, and a second inorganic film stacked sequentially. as well as The touch sensor layer is directly disposed on the thin film encapsulation layer. The touch sensor layer includes a first conductive layer disposed on the thin film encapsulation layer, a first insulating layer disposed on the first conductive layer, a second conductive layer disposed on the first insulating layer, and a second insulating layer disposed on the second conductive layer. The basic component defines a first region that overlaps with the circuit layer and a second region that does not overlap with the circuit layer. The second insulating layer overlaps with the first region and extends to cover at least a portion of the second region of the base member, and The bottom surface of the second insulating layer is not flat.

13. The display device according to claim 12, wherein, The bottom surface of the second insulating layer is in direct contact with the top surface of a portion of the circuit layer.

14. The display device according to claim 13, wherein, The portion of the circuit layer is not covered by the thin-film encapsulation layer, and The second insulating layer extends further than the end of the thin film encapsulation layer.

15. The display device according to claim 12, wherein, The display device further includes an impact-absorbing member disposed on the second region of the base member, wherein the impact-absorbing member includes patterns spaced apart from each other.

16. The display device according to claim 15, wherein, The second insulating layer covers the entirety of the pattern.

17. The display device according to claim 15, wherein, The impact-absorbing member further includes a covering member that covers the entire pattern, and the second insulating layer completely covers the covering member.

18. The display device according to claim 12, wherein, The second insulating layer is an organic layer.

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