An antenna array
By using the design of dielectric substrate, antenna daughter board and antenna frame in the millimeter wave antenna array, the stable arrangement and independent disassembly of antenna daughter boards are achieved by using the grid and the bearing part, the problems of error-prone and high repair costs in the prior art are solved, and coplanarity and maintenance efficiency are improved.
Patent Information
- Application Number
- CN202210261015.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-03-16
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2042-03-16
AI Technical Summary
Existing millimeter wave antenna arrays are easily designed to increase the chance of errors, with high repair costs and long repair time.
An antenna array design is adopted, in which an antenna panel and an antenna frame are arranged on the dielectric substrate. The antenna panel is electrically connected to the dielectric substrate, and the stable arrangement and independent disassembly of the antenna panels are achieved through the grid and the bearing part.
The coplanarity of antenna units in the antenna array is improved, the manufacturing and maintenance process of antennas is simplified, and the repair cost and time is reduced.
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Figure CN114497974B_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present invention relate to the field of communication technology, and in particular to an antenna array. Background Art
[0002] Millimeter waves are electromagnetic waves between microwaves and light waves. Usually, the millimeter wave frequency band refers to 30GHz-300GHz, and the corresponding wavelength is 1mm-10mm. Millimeter wave communication refers to communication that uses millimeter waves as a carrier for transmitting information. Millimeter wave communication relies on antennas to work. The directionality of a single antenna is limited. In order to be suitable for applications in various occasions, two or more single antennas working at the same frequency are fed and arranged in space according to certain requirements to form an antenna array, also called an antenna array.
[0003] In millimeter wave communications, the better the coplanarity of each antenna unit in the antenna array, the better the amplitude and phase consistency, and the higher the measurement accuracy and resolution. Therefore, how to ensure the coplanarity of each antenna unit in the antenna array is one of the key points of antenna design.
[0004] The current millimeter wave antenna mainly adopts a high-frequency large-board design, that is, multiple antenna units are concentrated on a large dielectric substrate to facilitate beamforming and focused transmission. However, this large-board structure is prone to increase the probability of error, and once a wire unit is damaged, the entire system will not work properly, increasing the cost and time of repairing the millimeter wave antenna. Summary of the invention
[0005] The embodiment of the present invention proposes an antenna array to solve the problems of easily increasing the antenna error probability, high antenna repair cost and long repair time existing in the current design of millimeter wave antennas using high-frequency large boards.
[0006] An embodiment of the present invention provides an antenna array, including:
[0007] dielectric substrate;
[0008] An antenna sub-board, wherein an antenna unit is arranged on the antenna sub-board;
[0009] An antenna frame, wherein the antenna frame is provided with at least one grid for accommodating the antenna sub-board, and each of the grids is provided with a bearing portion for bearing the antenna sub-board;
[0010] The antenna sub-board is arranged in the grid and abuts against the bearing portion, the antenna frame is arranged on the dielectric substrate, and the antenna sub-board is electrically connected to the dielectric substrate;
[0011] Wherein, the distance between the bearing part and the dielectric substrate in each grid is equal.
[0012] Optionally, the antenna unit includes a vertical segment and a horizontal segment that are vertically connected, the vertical segment is plugged into the antenna sub-board, and the horizontal segment is attached to a side of the antenna sub-board that is away from the dielectric substrate.
[0013] Optionally, the antenna sub-board further includes a radio frequency chip, the radio frequency chip is located on a side of the antenna sub-board facing the dielectric substrate, and the antenna unit is electrically connected to the radio frequency chip.
[0014] Optionally, the bearing portion is provided with a positioning column, and the antenna sub-board is provided with a positioning hole adapted to the positioning column.
[0015] Optionally, the dielectric substrate includes a plurality of sub-substrates, and the antenna frame is detachably connected to the plurality of sub-substrates.
[0016] Optionally, the grid is a plurality of square grids in an array.
[0017] Optionally, the antenna sub-board is electrically connected to the dielectric substrate via a connecting wire.
[0018] Optionally, the connecting line includes a flexible circuit board, and the flexible circuit board is located between the antenna sub-board and the dielectric substrate.
[0019] Optionally, the antenna sub-board is bonded to the bearing portion.
[0020] Optionally, the antenna sub-board is electrically connected to the dielectric substrate through a flexible circuit board, a first circuit connector is provided on a side of the antenna sub-board facing the dielectric substrate, a wire passing hole is provided on the dielectric substrate, a second circuit connector is provided on a side of the dielectric substrate facing away from the antenna sub-board, one end of the flexible circuit board is connected to the first circuit connector, and the other end is connected to the second circuit connector after passing through the wire passing hole.
[0021] The present invention provides an antenna array, comprising a dielectric substrate, an antenna sub-board and an antenna frame, wherein an antenna unit is arranged on the antenna sub-board, the antenna frame is provided with at least one grid for accommodating the antenna sub-board, each grid is provided with a bearing portion for bearing the antenna sub-board, the antenna sub-board is arranged in the grid and abuts against the bearing portion, the antenna frame is arranged on the dielectric substrate, the antenna sub-board is electrically connected to the dielectric substrate, wherein the bearing portion in each grid is at an equal distance from the dielectric substrate, then when the bearing portion in the grid and the plurality of antenna sub-boards are connected with the bearing portion of the corresponding grid, the surfaces of all the antenna sub-boards are flush, that is, they have good coplanarity, and the plurality of antenna sub-boards are respectively abutted against the grids in the antenna frame, during the manufacturing process and use process of the antenna sub-boards, if a manufacturing error or failure occurs in a certain antenna sub-board, the antenna sub-board can be manufactured and disassembled and replaced separately, which saves time and labor and also reduces the repair cost of the antenna array. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a side view of an ideal rendering of an existing high-frequency large-panel antenna array;
[0023] Figure 2 It is a side view of the actual effect diagram of the existing high-frequency large-plate antenna array;
[0024] Figure 3 is a structural block diagram of an antenna array provided by an embodiment of the present invention;
[0025] Figure 4 A schematic diagram of the structure of an antenna array provided by an embodiment of the present invention;
[0026] Figure 5 A top view of an antenna frame provided by an embodiment of the present invention;
[0027] Figure 6 A schematic diagram of the structure of another antenna frame provided by an embodiment of the present invention;
[0028] Figure 7 A schematic structural diagram of another antenna frame provided in an embodiment of the present invention. DETAILED DESCRIPTION
[0029] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for the convenience of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.
[0030] The phase components of electromagnetic waves include time phase, space phase and initial phase. When several electromagnetic waves meet, only the space phase may change, because the antenna units that make up the antenna array are in different positions, and the electromagnetic waves they emit take different spatial paths when they reach the same receiving area, which will cause the values of the space phase to be different.
[0031] It is precisely because of the difference in spatial phase caused by the electromagnetic waves emitted by antenna units at different positions when they are transmitted to the same receiving area that several electromagnetic waves will form a same-phase superposition in the encounter area, which will enhance the total field strength, and a reverse-phase superposition will weaken the total field strength. When the coplanarity of the antenna unit is poor, the electromagnetic waves emitted by the antenna unit cannot be focused and transmitted, resulting in a weakened total field strength, which is not conducive to signal transmission.
[0032] At present, the antenna array used to transmit millimeter waves mainly adopts a high-frequency large-board design, that is, multiple antenna units are concentrated on a large dielectric substrate to facilitate beam forming, focus transmission, and achieve the effect of enhancing the total field strength. Figure 1 The figure shows a side view of an ideal effect diagram of a high-frequency large-plate antenna array, wherein the antenna array includes a dielectric substrate 10, an antenna sub-board 20, an antenna unit 21, a radio frequency chip 22 and a solder ball 23, wherein the antenna sub-board 20 is electrically connected to the dielectric substrate 10 through the solder ball 23, the antenna unit 21 is plugged into the antenna sub-board 20, and one end of the antenna sub-board 20 is connected to the radio frequency chip 22, and the radio frequency chip 22 is used to feed the antenna unit 21 to form a microwave antenna. In an ideal state, the surface of the dielectric substrate 10 is flush, and the size of the solder balls 23 is the same, then through the solder balls 23 Each antenna sub-board 20 connected to the dielectric substrate 10 is flush as a whole. Further, the antenna units 21 arranged on each antenna sub-board 20 are also flush as a whole, that is, they have coplanarity, which can achieve the effect of enhancing the total field strength. However, it is relatively easy to achieve the flushness of the surface of the dielectric substrate 10, and the size of the solder ball 23 is at the millimeter level. Generally speaking, during industrial production, the size of the solder ball is allowed to have a certain error range. Even if the solder ball 23 is tapped by a high-precision ball welding machine, it is difficult to ensure that the size of the solder ball 23 is the same or very similar, that is, the size of the solder ball 23 is unstable. Figure 2 The figure shows a side view of the actual effect diagram of the high-frequency large-board antenna array. It can be seen that when the size of the solder ball 23 is unstable, the antenna sub-boards 20 are not coplanar, which leads to a position offset d between the antenna units 21. Then, the focusing effect of the electromagnetic wave emitted by the antenna unit 21 will be weakened or poor. For example, the wavelength of a 30GHz signal is 1cm. When the position offset d is 1mm, it will cause a phase offset of 36°. It can be seen that even a smaller position offset will produce a larger phase offset, that is, the focusing emission effect of the antenna array cannot be guaranteed.
[0033] Figure 3 A schematic diagram of an antenna array module provided in an embodiment of the present invention. The antenna array of the present invention is used for millimeter wave communication. The antenna array includes a dielectric substrate 10, an antenna sub-board 20 and an antenna frame 30, and the three are structurally interconnected.
[0034] The dielectric substrate 10 is a semiconductor element used to support and protect various components in the antenna array, and also used to achieve electrical connection or electrical insulation between components. The dielectric substrate 10 can be a PCB board or a ceramic substrate, and its substrate material can be a ceramic substrate or a copper-clad laminate.
[0035] exist Figure 3 The antenna array shown is based on Figure 4 FIG. 4 shows a schematic diagram of the structure of the antenna array. Figure 4As shown, an antenna unit 21 is provided on the antenna sub-board 20, and the antenna frame 30 is provided with at least one grid 31 for accommodating the antenna sub-board 20. A bearing portion 32 for bearing the antenna sub-board 20 is provided in each grid 31, and each bearing portion 32 has a flush surface. The antenna sub-board 20 is arranged in the grid 31 and abuts against the bearing portion 32. The antenna frame 30 is arranged on the dielectric substrate 10, and the antenna sub-board 20 is electrically connected to the dielectric substrate 10, specifically, it can be electrically connected through a connector 40. Among them, the dielectric substrate 10 is a substrate with a flush surface, and the distance between the bearing portion 32 in each grid 31 and the dielectric substrate 10 is equal. The material of the antenna frame 30 can be steel, copper, or polymer material.
[0036] By using the grid 31 in the antenna frame 30 as a scale for setting the antenna sub-board 20 and the antenna unit 21, since the distance between the bearing part 32 in each grid 31 and the dielectric substrate 10 is equal and the surface of the dielectric substrate 10 is flush, when the antenna sub-board 20 abuts against the bearing part 32 in the grid 31, each antenna sub-board 20 can also achieve a flush surface effect. Furthermore, each antenna unit 21 set on each antenna sub-board 20 can also be in the same plane, that is, the antenna unit 21 has coplanarity, and the entire antenna array has a better focusing emission effect. In addition, since each antenna sub-board 20 is placed in a corresponding grid 31, different antenna sub-boards 20 are independent in structure, and the circuit connection with the dielectric substrate 10 can also be independent, so the lines used for circuit connection are not intertwined, and the line structure is simpler and clearer. When an antenna sub-board 20 or antenna unit 21 in a grid 31 fails or is damaged, it can be repaired or replaced separately, which reduces the difficulty of antenna maintenance, improves the speed and efficiency of antenna maintenance, and will not involve other antenna sub-boards 20 or antenna units 21.
[0037] It should be noted that in order to achieve the coplanar effect of the antenna unit 21, in this embodiment, the antenna array is as follows: Figure 4 When the arrangement is as shown in , in the vertical direction, the thickness of each antenna sub-board 20 is the same, and the thickness of each antenna unit 21 is the same. This embodiment does not limit the size and shape of the grid 31, but the size and shape of the grid 31 must be adapted to the corresponding antenna sub-board 20. For example, the cross-section of the grid 31 can be Figure 4 The inverted convex shape shown in FIG. 1 and the antenna array as shown in FIG. Figure 4 In the case of horizontal placement as shown, the antenna sub-board 20 can achieve a stable effect after abutting against the bearing portion 32 on the grid 31, that is, the antenna sub-board 20 will not tilt in the horizontal direction due to unbalanced force. For example, the grid 31 can be a plurality of square grids of an array, and the top view of the antenna frame 30 is as shown in FIG. Figure 5The entire antenna frame 30 can be manufactured by CNC (Computerized Numerical Control) processing or other high-precision machining dedicated equipment to obtain an antenna frame 30 with excellent flatness.
[0038] The antenna array in this embodiment can be applied to the design of antenna boards of large-scale antenna arrays, such as antenna boards of 5G base stations, smart reflective surfaces, and other antenna board designs. The present invention provides an antenna array, including a dielectric substrate, an antenna sub-board, and an antenna frame, wherein an antenna unit is arranged on the antenna sub-board, and the antenna frame is provided with at least one grid for accommodating the antenna sub-board, wherein a bearing portion for carrying the antenna sub-board is arranged in each grid, and the antenna sub-board is arranged in the grid and abuts against the bearing portion, and the antenna frame is arranged on the dielectric substrate, and the antenna sub-board is electrically connected to the dielectric substrate, wherein the distance from the bearing portion in each grid to the dielectric substrate is equal, and then the bearing portion in the grid, when multiple antenna sub-boards are connected with the bearing portion of the corresponding grid, all antenna sub-board surfaces are flush, that is, they have good coplanarity, and multiple antenna sub-boards are respectively abutted against the grids in the antenna frame, and during the manufacturing process and use of the antenna sub-board, if a certain antenna sub-board is manufactured incorrectly or fails, the antenna sub-board can be manufactured and disassembled and replaced separately, which saves time and labor and reduces the repair cost of the antenna array.
[0039] In an optional embodiment of the present invention, Figure 4 As shown, the antenna array also includes a radio frequency chip 22, which is located on the side of the antenna sub-board 20 facing the dielectric substrate 10, and the antenna unit 21 is electrically connected to the radio frequency chip 22. The antenna unit 21 includes a vertical segment and a horizontal segment that are vertically connected. The vertical segment is inserted into the antenna sub-board 20 and connected to the radio frequency chip 22. The horizontal segment is attached to the side of the antenna sub-board 20 that is not facing the dielectric substrate 10. The radio frequency chip 22 is equivalent to a microwave integrated circuit. The radio frequency chip 22 feeds the horizontal segment through the vertical segment, and the electromagnetic wave is emitted by the horizontal segment. In this embodiment, the surface of the antenna sub-board 20 is used as a ruler to set the horizontal segment of the antenna unit 21. When the surface of the antenna sub-board 20 is flush and coplanar, the antenna unit 21 attached to the surface of the antenna sub-board 20 also has coplanarity, and the structure is simple and easy to implement.
[0040] In an optional embodiment of the present invention, the bearing portion 32 is provided with a positioning post, and the antenna sub-board 20 is provided with a positioning hole adapted to the positioning post. The antenna sub-board 20 is fixed to the bearing portion 32 by the matching connection between the positioning post and the positioning hole. Of course, in addition to the use of positioning posts and positioning holes to fix the antenna sub-board 20 as shown in this embodiment, positioning holes can also be provided on both the bearing portion 32 and the antenna sub-board 20, and then the two can be fixedly connected by screws, or the two can be fixedly connected by chamfering the frame, etc., and the present invention does not limit this. By providing positioning holes, etc., the antenna sub-board 20 can be accurately positioned and placed, making the design of the antenna array simple and reasonable.
[0041] After the antenna sub-board 20 is precisely positioned by setting positioning holes, the antenna sub-board 20 can be further fixed by pressing and bonding with a thermosetting adhesive sheet so as to be tightly combined with the bearing portion 32. The thermosetting adhesive sheet can also play the role of sealing, heat conduction, moisture resistance, etc.
[0042] In an optional embodiment of the present invention, the dielectric substrate 10 includes multiple sub-substrates, the antenna frame 30 is detachably connected to the multiple sub-substrates, each sub-substrate corresponds to a grid 31 and an antenna sub-board 20, then the dielectric substrate 10 in this embodiment is not a whole substrate, but a substrate formed by splicing multiple sub-substrates, the dielectric substrate 10 carries a circuit structure, plug holes, etc., and the structure is relatively complex, and by dividing the dielectric substrate 10 into multiple sub-substrates, etching circuits, arranging lines, drilling holes, etc. on the sub-substrates for each antenna sub-board 20, the circuit structure can be simplified, and similarly, when a sub-substrate fails or is damaged, only the sub-substrate can be maintained without involving other sub-substrates, and further, the antenna sub-boards 20 and antenna units 21 corresponding to other sub-substrates will not be involved.
[0043] The fixed connection between the sub-base plate and the grid 31 in this embodiment can refer to the connection method between the antenna sub-board 20 and the grid 31, and the present invention is not limited to this.
[0044] In an optional embodiment of the present invention, the connecting member 40 may include a connecting wire and a connector.
[0045] The antenna sub-board 20 can be electrically connected to the dielectric substrate 10 only through a connecting wire. The connecting wire can be a flexible printed circuit board. The number of flexible printed circuit boards is generally more than one. It may also be a coaxial cable or other wiring harness. The two ends of the flexible printed circuit board can be soldered to the antenna sub-board 20 and the dielectric substrate 10 respectively by soldering. The soldering method can include laser welding, ultrasonic welding, etc.
[0046] The antenna sub-board 20 can also be electrically connected to the dielectric substrate 10 through a connecting wire combined with a connector, and the connector can be a board-to-board connector or a ZIF (Zero Insertion Force) connector. Figure 6 As shown, the connecting member 40 includes a connector 41 and a connecting wire 42. The connectors 41 are respectively arranged on the antenna sub-board 20 and the dielectric substrate 10 on opposite sides of each other. The connecting wire 42 is located between the antenna sub-board 20 and the dielectric substrate 10. The two ends of the connecting wire 42 are respectively connected to the two connectors 41, so that the antenna sub-board 20 is electrically connected to the dielectric substrate 10.
[0047] Among them, the flexible printed circuit board is referred to as a soft board, which is used to transmit control signals, data signals and provide power, etc. It has the characteristics of small size, light weight, bendability, flexibility, etc. It can be used in precision small electronic equipment applications and can also be installed in equipment bodies of any geometric shape. Therefore, it can be applied to the antenna array of the present invention. When the flexible printed circuit board is located between the antenna sub-board 20 and the dielectric substrate 10, the flexible printed circuit board is only responsible for signal connection and electrical connection, and has no effect on the flatness of components such as the antenna sub-board 20 and the dielectric substrate 10.
[0048] Generally speaking, the circuit of the dielectric substrate 10 is a medium frequency or low frequency circuit, and the circuit on the antenna sub-board 20 is a high frequency circuit. Figure 1 As shown in the figure, the antenna sub-board 20 is directly soldered to the dielectric substrate 10 using solder balls 23, so all the intermediate frequency or low frequency and high frequency circuits are integrated on the dielectric substrate 10, that is, the circuit layout is relatively complex. Taking the dielectric substrate 10 as a PCB board as an example, if the circuit to be integrated is complex, the number of hard board layers of the PCB board may be large. For the PCB board, the more hard board layers there are, the higher the cost, the greater the difficulty of processing and debugging, and the lower the yield. By connecting the antenna sub-board 20 and the dielectric substrate 10 in the above manner, the high-frequency circuit can be set on the antenna sub-board 20, and the intermediate frequency or low-frequency circuit can be set on the dielectric substrate 10, so as to reduce the number of hard board layers in the dielectric substrate 10, thereby achieving the effect of reducing costs, processing difficulty and improving yield.
[0049] In an optional embodiment of the present invention, Figure 7As shown, the connection line 42 is a flexible circuit board, the antenna sub-board 20 is electrically connected to the dielectric substrate 10 through the connection line 42, a first line connector 43 is provided on the side of the antenna sub-board 20 facing the dielectric substrate 10, the dielectric substrate 10 is provided with a line hole, and a second line connector 44 is provided on the side of the dielectric substrate 10 facing away from the antenna sub-board 20, one end of the connection line 42 is connected to the first line connector 43, and the other end is connected to the second line connector 44 after passing through the line hole. Among them, the line hole can be a hole reserved on the dielectric substrate 10 and adapted to the diameter of the connection line 42. When producing components, the first line connector 43 can be fixedly connected to the antenna sub-board 20, and then the dielectric substrate 10 can be fixedly connected to the second line connector 44 and a wire hole can be set at the corresponding position. When assembling the antenna array, one end of the connecting wire 42 is first plugged into the first line connector 43. After the antenna sub-board 20 is abutted against the bearing portion 32, the connecting wire 42 plugged into the first line connector 43 can be pulled out from the wire hole, and the other end of the connecting wire 42 can be buckled onto the second line connector 44, so as to realize the circuit connection between the dielectric substrate 10 and the antenna sub-board 20 and complete the assembly of the antenna array.
[0050] The first line connector 43 and the second line connector 44 may be equivalent to the connector 41 , or may be metal holes, plugs, etc. that are provided according to the ports of the connection line 42 and can be used for electrical connection.
[0051] In this embodiment, by providing a first line connector 43 and a second line connector 44 for plugging the connection line 42, the installation of the antenna array can be facilitated, simplified, and time-saving and labor-saving.
[0052] It is worth noting that in the above-mentioned antenna array embodiment, the various units and modules included are only divided according to functional logic, but are not limited to the above-mentioned division, as long as the corresponding functions can be achieved; in addition, the specific names of the functional units are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of the present invention.
[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. An antenna array, characterized in that: include: dielectric substrate; An antenna sub-board, wherein an antenna unit is arranged on the antenna sub-board; An antenna frame, wherein the antenna frame is provided with at least one grid for accommodating the antenna sub-board, and each of the grids is provided with a bearing portion for bearing the antenna sub-board; The antenna sub-board is arranged in the grid and abuts against the bearing portion, the antenna frame is arranged on the dielectric substrate, and the antenna sub-board is electrically connected to the dielectric substrate; The distance between the bearing part and the dielectric substrate in each grid is equal; the bearing part is flush with the surface of the dielectric substrate; in the vertical direction, the thickness of each antenna sub-board is the same, and the thickness of each antenna unit is the same; The antenna sub-board is electrically connected to the dielectric substrate via a connecting wire; The connecting line includes a flexible circuit board; The flexible circuit board is located between the antenna sub-board and the dielectric substrate.
2. The antenna array according to claim 1, characterized in that The antenna unit comprises a vertical section and a horizontal section which are vertically connected. The vertical section is plugged into the antenna sub-board, and the horizontal section is attached to a side of the antenna sub-board which is away from the dielectric substrate.
3. The antenna array according to claim 1, characterized in that: The antenna sub-board further includes a radio frequency chip, the radio frequency chip is located on a side of the antenna sub-board facing the dielectric substrate, and the antenna unit is electrically connected to the radio frequency chip.
4. The antenna array according to claim 1, characterized in that: The bearing portion is provided with a positioning column, and the antenna sub-board is provided with a positioning hole adapted to the positioning column.
5. The antenna array according to claim 1, characterized in that: The dielectric substrate includes a plurality of sub-substrates, and the antenna frame is detachably connected to the plurality of sub-substrates.
6. The antenna array according to claim 1, characterized in that: The grid is a plurality of square grids in an array.
7. The antenna array according to claim 1, characterized in that: The antenna sub-board is bonded to the carrying portion.
8. The antenna array according to claim 1, characterized in that: The antenna sub-board is electrically connected to the dielectric substrate through a flexible circuit board. A first line connector is provided on a side of the antenna sub-board facing the dielectric substrate, and a wire-through hole is provided on the dielectric substrate. A second line connector is provided on a side of the dielectric substrate facing away from the antenna sub-board. One end of the flexible circuit board is connected to the first line connector, and the other end is connected to the second line connector after passing through the wire-through hole.
Citation Information
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