Package and method for manufacturing the same

Abstract

According to the present invention, the first frame (101) includes a first short side portion (101a) and a first long side portion (101b), and a plurality of conductor layers and a plurality of insulating layers are stacked. Each of the conductor layers is connected to each of a plurality of DC electrode terminals (109), and the insulating layers are disposed between the respective conductor layers. Meanwhile, the second frame (105) includes a second short side portion (105a) and a second long side portion (105b), and is not made into a stacked structure such as a conductive layer.

Description

Technical Field

[0001] The present invention relates to the packaging of high-frequency signal devices and a manufacturing method thereof. Background Art

[0002] In devices configured to process high-speed differential signals including digital coherent optical transmission, high-frequency signal device packages including differential coplanar lines are used, in which two ground lines are arranged across two adjacent signal lines.

[0003] This type of package needs to meet the standards defined by the OIF (Optical Internetworking Forum). As standards for such packages, there are CDM (Coherent Driver Modulator) and ICR (Intradyne Coherent Receiver) (see Non-Patent Documents 1, 2, and 3).

[0004] Related Technical Literature

[0005] Non-Patent Literature

[0006] Non-Patent Document 1: Physical and Link Layer (PLL) Working Group, Implementation Agreement for High Bandwidth Coherent Driver Modulator, Implementation Agreement created and approved by the Optical Internetworking Forum, 2018.

[0007] Non-Patent Document 2: Physical and Link Layer (PLL) Working Group, “Implementation Agreement for Intradyne Coherent Receivers IA#OIF-DPC-RX-01.1”, Implementation Agreement to be revised and approved by the Optical Internetworking Forum, 2011.

[0008] Non-Patent Document 3: Physical and Link Layer (PLL) Working Group, “Implementation Agreement for Intradyne Coherent Receivers IA#OIF-DPC-RX-01.2”, Implementation Agreement to be revised and approved by the Optical Internetworking Forum, 2013. Summary of the Invention

[0009] Problems to be Solved by the Invention

[0010] In the ICR described in the OIF standard specifications, 20 DC pins are provided on each of the left and right sides in the longitudinal direction of the package. In the CDM, 40 DC pins are provided on one side. In order to wire the DC lines independently connected to these 40 DC pins through the conductor layers forming the ceramic package housing, the number of conductor layers in the CDM is almost twice the number of conductor layers of the DC lines required in the ICR because all the DC pins are arranged on one side. This means that the number of ceramic layers arranged between the conductor layers also almost triples. The cost of the ceramic package is roughly proportional to the number of layers of the ceramic package housing. Therefore, compared with the cost in the ICR, the package occupies most of the cost in the CDM, and cost reduction is required.

[0011] As described above, generally, in the CDM, it is difficult to manufacture the package at a low cost compared with the ICR because although the same insulating material is used, the number of stacked insulators increases.

[0012] The present invention has been made to solve the above problems, and an object of the present invention is to manufacture the package of the CDM at a lower cost.

[0013] Means for Solving the Problems

[0014] According to the present invention, a method for manufacturing a package is provided. The package includes: a rectangular bottom plate portion, the bottom plate portion including a long side and a short side, a first short side surface and a second short side surface disposed on corresponding portions of the two short sides of the bottom plate portion at opposite positions, and a first long side surface and a second long side surface disposed on corresponding portions of the two long sides of the bottom plate portion at opposite positions; a plurality of high-frequency internal terminals arranged in an internal terminal portion inside the first short side surface and connected to high-frequency optical devices installed inside; a plurality of high-frequency external terminals arranged in a first external terminal portion outside the bottom plate portion outside the first short side surface, connected to the internal terminals and connected to pins; and a plurality of DC electrode terminals arranged in a second external terminal portion outside the first long side surface. The method includes: a first step of manufacturing a first frame, the first frame having a substantially L shape in a plan view and including a portion of the first short side surface and a portion of the first long side surface, a plurality of conductor layers and a plurality of insulating layers being stacked in the first frame, the plurality of DC electrode terminals being connected to the plurality of conductor layers, and the plurality of insulating layers being disposed between the plurality of conductor layers; a second step of manufacturing a second frame, the second frame having a substantially L shape in a plan view and including a portion of the second short side surface and a portion of the second long side surface; a third step of manufacturing a plate-like substrate serving as the bottom plate portion; and a fourth step of combining the first frame, the second frame, and the substrate to form the package.

[0015] According to the present invention, a package is also provided. The package includes: a rectangular bottom plate portion, the bottom plate portion including a long side and a short side, a first short side surface and a second short side surface disposed on corresponding portions of the two short sides of the bottom plate portion at opposite positions, and a first long side surface and a second long side surface disposed on corresponding portions of the two long sides of the bottom plate portion at opposite positions; a plurality of high-frequency internal terminals arranged in an internal terminal portion inside the first short side surface and connected to high-frequency optical devices installed inside; a plurality of high-frequency external terminals arranged in a first external terminal portion outside the bottom plate portion outside the first short side surface, connected to the internal terminals and connected to pins; and a plurality of DC electrode terminals arranged in a second external terminal portion outside the first long side surface. The package includes: a first frame, the first frame having a substantially L shape in a plan view and including a portion of the first short side surface and a portion of the first long side surface, a plurality of conductor layers and a plurality of insulating layers being stacked in the first frame, the plurality of DC electrode terminals being connected to the plurality of conductor layers, and the plurality of insulating layers being disposed between the plurality of conductor layers; a second frame, the second frame having a substantially L shape in a plan view and including a portion of the second short side surface and a portion of the second long side surface; and a plate-like substrate serving as the bottom plate portion.

[0016] Effects of the present invention

[0017] As described above, according to the present invention, since the multi-layer structure of multiple conductor layers and multiple insulating layers forms only a part of the first frame, the package of the CDM can be manufactured at a lower cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1A is a perspective view showing the state of the package in an intermediate step for explaining the manufacturing method of the package according to the first embodiment of the present invention;

[0019] Figure 1B is a perspective view showing the state of the package in an intermediate step for explaining the manufacturing method of the package according to the first embodiment of the present invention;

[0020] Figure 1C is a perspective view showing the state of the package in an intermediate step for explaining the manufacturing method of the package according to the first embodiment of the present invention;

[0021] Figure 1D is a perspective view showing the state of the package in an intermediate step for explaining the manufacturing method of the package according to the first embodiment of the present invention;

[0022] Figure 1E is a perspective view showing the state of the package in an intermediate step for explaining the manufacturing method of the package according to the first embodiment of the present invention;

[0023] Figure 1F is a perspective view showing the state of the package in an intermediate step for explaining the manufacturing method of the package according to the first embodiment of the present invention;

[0024] Figure 1G is a perspective view showing the state of the package in an intermediate step for explaining the manufacturing method of the package according to the first embodiment of the present invention;

[0025] Figure 1H is a perspective view showing the state of the package in an intermediate step for explaining the manufacturing method of the package according to the first embodiment of the present invention;

[0026] Figure 1I is a perspective view showing the state of the package in an intermediate step for explaining the manufacturing method of the package according to the first embodiment of the present invention;

[0027] Figure 1J is a perspective view showing the state of the package in an intermediate step for explaining the manufacturing method of the package according to the first embodiment of the present invention;

[0028] Figure 2Ais a perspective view showing the state of the package in an intermediate step to explain a method of manufacturing a package according to a second embodiment of the present invention;

[0029] Figure 2B is a perspective view showing the state of the package in an intermediate step to explain a method of manufacturing the package according to a second embodiment of the present invention;

[0030] Figure 2C is a perspective view showing the state of the package in an intermediate step to explain a method of manufacturing the package according to a second embodiment of the present invention;

[0031] Figure 2D is a perspective view showing the state of the package in an intermediate step to explain a method of manufacturing the package according to a second embodiment of the present invention;

[0032] Figure 2E is a perspective view showing the state of the package in an intermediate step to explain a method of manufacturing the package according to a second embodiment of the present invention;

[0033] Figure 2F is a perspective view showing the state of the package in an intermediate step to explain a method of manufacturing the package according to a second embodiment of the present invention;

[0034] Figure 2G is a perspective view showing the state of the package in an intermediate step to explain a method of manufacturing the package according to a second embodiment of the present invention;

[0035] Figure 2H is a perspective view showing the state of the package in an intermediate step to explain a method of manufacturing the package according to a second embodiment of the present invention;

[0036] Figure 2I is a perspective view showing the state of the package in an intermediate step to explain a method of manufacturing the package according to a second embodiment of the present invention; and

[0037] Figure 2J is a perspective view showing the state of the package in an intermediate step to explain a method of manufacturing the package according to a second embodiment of the present invention. DETAILED DESCRIPTION

[0038] A package and a method of manufacturing the same according to an embodiment of the present invention will be described below.

[0039]

First Embodiment

[0040] First, reference will be made to Figures 1A to 1J describe a method of manufacturing a package according to a first embodiment of the present invention.

[0041] First, a first frame (first step) is fabricated, which has a substantially L shape in a plan view.

[0042] For example, as Figure 1A and Figure 1B shown, a component 120 is fabricated, in which a plurality of frame components 121 are integrated, and each frame component 121 forms two first frames 101. In the frame component 121, two first frames 101 that are rotated 180° relative to each other in a plan view are integrated.

[0043] For example, a polyvinyl adhesive and a surfactant are added to a powder of a predetermined metal oxide such as Al2O3 (having an average particle diameter of, for example, 0.5 μm to 0.6 μm), and they are dispersed in a dispersion medium composed of an organic solvent such as 2-propanol to fabricate a slurry. The fabricated slurry is molded by a known doctor blade method, for example, to form a slurry layer, and the slurry layer is dried by removing the dispersion medium therefrom to form a green sheet.

[0044] On the other hand, a conductive paste in which metal fine particles such as tungsten are dispersed is applied to fabricate a conductor layer sheet. On the conductor layer sheet, a paste pattern formed of the conductive paste and used as a wiring pattern is formed.

[0045] Next, a plurality of conductive sheets and green sheets are alternately laminated to fabricate a multilayer sheet before sintering, and the multilayer sheet becomes the above-mentioned component 120. Then, the multilayer sheet is baked at a temperature of about 900 °C to 1000 °C to obtain a component 120 in which a plurality of first frames 101 are integrated, and a plurality of conductor layers and a plurality of insulating layers are laminated in the first frame 101, and the plurality of insulating layers are disposed between the plurality of conductor layers.

[0046] The component 120 fabricated in this way is divided into a plurality of parts. For example, as Figure 1C shown, and each divided part of the component 120 is further divided into frame components 121 ( Figure 1D ). As a result, as Figure 1E shown, a first frame 101 can be fabricated, which has a substantially L shape in a plan view and includes a first short side (side wall) 101a and a first long side (side wall) 101b. For example, the first short side 101a and the first long side 101b are perpendicular to each other in a plan view.

[0047] In each of the first frames 101, a plurality of conductor layers and a plurality of insulating layers are stacked, a plurality of DC electrode terminals are connected to the plurality of conductor layers, and the plurality of insulating layers are disposed between the plurality of conductor layers. The DC electrode terminals will be described later. In addition, a plurality of high-frequency internal terminals 103 are formed in an internal terminal portion 102 inside the first short side surface 101a. Further, in this example, each first frame 101 includes a first joint 104 for joining a second frame 105 described later. In the first embodiment, when the frame assembly 121 is divided, two first frames 101 can be fabricated. The first frame 101 is formed of a sintered body in which a ceramic layer and a conductor layer are stacked.

[0048] Next, as Figure 1F shown, a second frame 105 is fabricated, which has a substantially L shape in a plan view and includes a second short side surface (side wall) 105a and a second long side surface (side wall) 105b (second step). The second short side surface 105a and the second long side surface 105b are perpendicular to each other in a plan view, for example. In this example, the second frame 105 includes a second joint 107 for joining the first frame 101. In the second frame 105, the second short side surface 105a includes a through hole 108. The through hole 108 can be used as an optical signal input / output window for a high-frequency optical device stored (mounted) in the package. Further, a plate-like base material 106 serving as a bottom plate portion is fabricated (third step). The bottom plate portion will be described later. The second frame 105 and the base material 106 can be made of, for example, Kovar, which is an alloy of iron, cobalt, and nickel. Kovar is an alloy characterized by having a linear expansion coefficient close to that of ceramics. Further, from the viewpoint of heat dissipation of a high-frequency optical device mounted in the package, an alloy of copper and tungsten, CuW, is often used as the base material 106. As a feature, CuW has a high thermal conductivity and a low linear expansion coefficient and can be used as a peripheral material for ceramics or Kovar.

[0049] Next, as Figure 1G shown, a plurality of DC electrode terminals 109 are formed on the outer surface of the first long side surface 101b. Next, as Figure 1H shown, the first frame 101, the second frame 105, and the base material 106 are combined to form a package (fourth step). In this example, the first joint 104 of the first frame 101 and the second joint 107 of the second frame 105 are mortise-and-tenon joined, thereby combining the first frame 101 and the second frame 105. Although mortise-and-tenon joining is used in this example, of course, a planar permanent connection using silver solder or the like can also be implemented. For example, a first joint surface is provided in the joint portion of the first frame 101 with the second frame 105, and a second joint surface is provided in the joint portion of the second frame 105 with the first frame 101. The first joint surface and the second joint surface are permanently joined, thereby combining the first frame 101 and the second frame 105.

[0050] The package includes a rectangular bottom plate portion 106a, which includes: a long side and a short side; a first short side surface 101a and a second short side surface 105a arranged on a part of the short side of the bottom plate portion 106a; and a first long side surface 101b and a second long side surface 105b arranged on a part of the long side of the bottom plate portion 106a. The first short side surface 101a and the second short side surface 105a are arranged on parts of the two opposite short sides of the bottom plate portion 106a. The first long side surface 101b and the second long side surface 105b are arranged on parts of the two opposite long sides of the bottom plate portion 106a.

[0051] In addition, the package includes a plurality of high-frequency internal terminals 103, which are arranged in an internal terminal portion 102 inside the first short side surface 101a and are connected to high-frequency optical devices installed inside. Further, the package includes a plurality of high-frequency external terminals (not shown), which are arranged in a first external terminal portion outside the bottom plate portion 106a on one side of the first short side surface 101a, are connected to the high-frequency internal terminals 103 and are connected to pins. In addition, the package includes a plurality of DC electrode terminals 109, which are arranged in a second external terminal portion outside the first long side surface 101b.

[0052] Here, the package is formed by a first frame 101 having a substantially L shape in a plan view, a second frame 105 having a substantially L shape in a plan view, and a base material 106 serving as the bottom plate portion 106a, as described above. The first frame 101 includes a part of the first short side surface 101a and a part of the first long side surface 101b. A plurality of conductor layers and a plurality of insulating layers are laminated in the first frame 101, and the plurality of DC electrode terminals 109 are connected to the plurality of conductor layers, and the plurality of insulating layers are arranged between the plurality of conductor layers. On the other hand, the second frame 105 includes a part of the second short side surface 105a and a part of the second long side surface 105b, and does not have a structure including alternately laminated insulating layers and conductor layers.

[0053] In addition, in this example, the first frame 101 includes a first joint 104 provided at a joint portion with the second frame 105, the second frame 105 includes a second joint 107 provided at a joint portion with the first frame 101, and the first joint 104 of the first frame 101 and the second joint 107 of the second frame 105 are mortise-jointed. Although mortise joint is used in this example, as described above, of course, planar permanent connection using silver solder or the like can also be implemented.

[0054] In the package according to the first embodiment, a high-frequency optical device or an optical component can be installed in a bathtub-shaped structure surrounded by the first frame 101 and the second frame 105 on the bottom plate portion 106a.

[0055] Note that, as Figure 1I and 1J shown, the DC pin 110 is connected to a plurality of DC electrode terminals 109. In addition, a plurality of high-frequency external terminals 112 are arranged in a first external terminal portion 111 outside the bottom plate portion 106a on the side of the first short side surface 101a, and the RF pin 113 is connected to the plurality of high-frequency external terminals 112.

[0056] As described above, according to the first embodiment, the multilayer structure of the plurality of conductor layers and the plurality of insulating layers is formed only in a part of the first frame. Therefore, the package of the CDM can be manufactured at a lower cost.

[0057]

Second Embodiment

[0058] Next, a method for manufacturing a package according to a second embodiment of the present invention will be described with reference to Figures 2A to 2J description.

[0059] First, a first frame (first step) is fabricated, which has a substantially L shape in a plan view.

[0060] For example, as Figure 2A and 2B shown, a component 120a is fabricated, in which a plurality of frame components 121a are integrated, and each frame component 121a forms a plurality of first frames 101'. In the frame component 121a, a plurality of first frames 101' are stacked and integrally connected by a connecting portion 122 while maintaining the positional relationship of the first frames translated in the longitudinal direction of the package in the plan view so that the internal terminal portion 102 is visible from the outside.

[0061] For example, a polyvinyl adhesive and a surfactant are added to a powder of a predetermined metal oxide such as Al2O3, and they are dispersed in a dispersion medium to fabricate a slurry. The fabricated slurry is molded to form a slurry layer, and the slurry layer is dried by removing the dispersion medium therefrom to form a green sheet.

[0062] On the other hand, a conductive paste in which metal fine particles such as tungsten are dispersed is applied to fabricate a conductor layer sheet. On the conductor layer sheet, a paste pattern formed of the conductive paste and serving as a wiring pattern is formed.

[0063] Next, a plurality of conductive sheets and green sheets are alternately stacked to fabricate a multilayer sheet before sintering, which becomes the above-described component 120a. Then, the multilayer sheet is baked at a temperature of about 900°C to 1000°C to obtain the component 120a. In the component 120a, a plurality of first frames 101' are connected and integrated by the connecting portion 122. The plurality of first frames 101' are formed by stacking a plurality of conductor layers and a plurality of insulating layers disposed between the plurality of conductor layers.

[0064] The component 120a fabricated in this way is divided into a plurality of parts. For example, as Figure 2C shown, and by separating the connecting portion 122, each of the divided parts of the component 120a is further divided into a frame component 121a ( Figure 2D ). As a result, as Figure 2E shown, a first frame 101' can be fabricated, which has a substantially L shape in a plan view. The first frame 101' is formed of a sintered body in which a ceramic layer and a conductor layer are laminated.

[0065] Next, as Figure 2F shown, a second frame 105' is fabricated, which has a substantially L shape in a plan view and includes a second short side surface 105a, a second long side surface 105b, and a spacer 114 (second step). The second short side surface 105a and the second long side surface 105b are perpendicular to each other in a plan view, for example. In this example, the second frame 105' includes a second joint 107 for joining the first frame 101'. In addition, in the second frame 105', the second short side surface 105a includes a through hole 108. The through hole 108 can be used as a light signal input / output window for an optical module stored (mounted) in the package. Note that the spacer 114 and the second frame 105' can be integrally formed or separately formed.

[0066] Furthermore, a plate-like base material 106 serving as a bottom plate portion is fabricated (third step). In the second embodiment, the base material 106 includes a flange 115, which is a thin flat plate protruding structure. The second frame 105', the spacer 114, and the base material 106 can be made of, for example, an alloy of Kovar and nickel. In addition, from the perspective of heat dissipation, the base material 106 can also be made of an alloy of copper and tungsten. The flange 115 is not limited to one. A plurality of flanges can be provided on one side of the second short side surface and one side of the second long side surface of the base material 106 in a state where the position of the flange matches the bottom surface of the base material 106.

[0067] Next, as Figure 2G shown, a plurality of DC electrode terminals 109 are formed on the outer surface of the first long side surface 101b. Here, the frame component 121a includes a part of the first short side surface 101a and a part of the first long side surface 101b, and the first short side surface 101a and the first long side surface 101b are perpendicular to each other in a plan view, for example.

[0068] In the first frame 101', a plurality of conductor layers and a plurality of insulating layers are stacked, a plurality of DC electrode terminals 109 are connected to the plurality of conductor layers, and the plurality of insulating layers are disposed between the plurality of conductor layers. Further, in the internal terminal portion 102 inside the first short side surface 101a, a plurality of high-frequency internal terminals 103 are formed. In addition, in this example, each first frame 101' includes a first joint 104 for joining a second frame 105' described later.

[0069] Next, as Figure 2H and Figure 2I shown, the first frame 101', the second frame 105', the substrate 106, and the spacer 114 are combined to form a package (fourth step). In this example, the first joint 104 of the first frame 101' and the second joint 107 of the second frame 105' are mortise-jointed, thereby combining the first frame 101' and the second frame 105'. In addition, in this example, the spacer 114 is disposed between the internal terminal portion 102 and the substrate 106.

[0070] Further, a conductor layer is formed on the lower surface of the internal terminal portion 102 in contact with the spacer 114, and they can be electrically connected. Therefore, the internal terminal portion 102 is provided with a plurality of ground GSSG differential high-frequency line ends (high-frequency internal terminals 103), and the line ends and the electronic devices installed inside are electrically connected to each other to propagate high-frequency signals. Since the spacer 114 and the surface of the ground conductor film inside the package are electrically connected, the ground potential for forming the GSSG differential high-frequency line ends can reliably match the package ground wire, and it is expected that the high-frequency characteristics of the package can be stably obtained. More specifically, this helps to reduce crosstalk between multiple GSSG differential high-frequency lines.

[0071] Here, the package includes a rectangular bottom plate portion 106a, which includes: a long side and a short side, a first short side surface 101a and a second short side surface 105a disposed on a part of the short side of the bottom plate portion 106a, and a first long side surface 101b and a second long side surface 105b disposed on a part of the long side of the bottom plate portion 106a. The first short side surface 101a and the second short side surface 105 are disposed on parts of the two short sides of the bottom plate portion 106a at opposite positions to each other. The first long side surface 101b and the second long side surface 105b are disposed on parts of the two long sides of the bottom plate portion 106a at opposite positions to each other.

[0072] In addition, the package includes a plurality of high-frequency internal terminals 103, which are arranged in an internal terminal portion 102 inside the first short side surface 101a and are connected to the storage element. Further, the package includes a plurality of high-frequency external terminals (not shown), which are arranged in a first external terminal portion outside the bottom plate portion 106a on one side of the first short side surface 101a, are connected to the high-frequency internal terminals 103 and are connected to the pins. In addition, the package includes a plurality of DC electrode terminals 109, which are arranged in a second external terminal portion outside the first long side surface 101b.

[0073] As described above, as in the first embodiment, a plurality of conductor layers and a plurality of insulating layers disposed between the plurality of conductors are laminated in the first frame 101' of the package, and the plurality of DC electrode terminals 109 are connected to the plurality of conductor layers. On the other hand, the second frame 105' includes a portion of the second short side surface 105a and a portion of the second long side surface 105b, and does not have a structure including alternately laminated insulating layers and conductor layers.

[0074] Similarly, in the package according to the second embodiment, as in the first embodiment, a high-frequency optical device or an optical component can be mounted in a bathtub-shaped structure surrounded by the first frame 101' and the second frame 105' on the bottom plate portion 106a.

[0075] Note that, as Figure 2J shown, the DC pins 110 are connected to the plurality of DC electrode terminals 109. Further, a plurality of high-frequency external terminals 112 are arranged in a first external terminal portion 111 outside the bottom plate portion 106a on the first short side surface 101a side, and the RF pins 113 are connected to the plurality of high-frequency external terminals 112.

[0076] As described above, according to the second embodiment, the multi-layer structure of the plurality of conductor layers and the plurality of insulating layers is formed only in a part of the first frame. Therefore, the package of the CDM can be manufactured at a lower cost.

[0077] In addition, in the second embodiment, the substrate 106 includes a flange 115. Therefore, when the package is mounted on a mounting board for mounting the package, stress loads generated on the pins and the solder can be suppressed.

[0078] For example, when an optical module including a high-frequency optical device or an optical component mounted in a package is mounted on a mounting board, solder mounting is usually performed. The RF pins or DC pins are fixed to the mounting board by solder. Generally, the coefficient of linear expansion of the mounting board is greater than that of the package. Therefore, if the mounting substrate thermally expands or contracts with changes in the ambient temperature, stress loads acting on the pins and the solder fixing the pins are generated in regions where the solder mounting density of the pins is relatively low. In the worst case, they will break, causing the RF pins to open and hindering the propagation of high-frequency signals.

[0079] To address the above problems, a flange integrated with a base material is used. When the flange is connected and fixed to the mounting substrate by solder or the like, the generation of the above stress loads can be suppressed. Therefore, the opening of the RF pins can be prevented, and an optical module stable against changes in the ambient temperature can be provided.

[0080] As described above, according to the present invention, since the multilayer structure of a plurality of conductor layers and a plurality of insulating layers forms a part of the first frame, the package of the CDM can be manufactured at a lower cost.

[0081] Note that the present invention is not limited to the above embodiments. Obviously, those skilled in the art can make many modifications and combinations within the technical scope of the present invention.

[0082] Description of Reference Numerals

[0083] 101... First frame, 101a... First short side surface, 101b... First long side surface, 102... Internal terminal portion, 103... High-frequency internal terminal, 104... First joint, 105... Second frame, 105a... Second short side surface, 105b... Second long side surface, 106... Base material, 107... Second joint, 108... Through hole, 109... DC electrode terminal, 110... DC pin, 111... First external terminal portion, 112... High-frequency external terminal, 113... RF pin, 120... Component, 121... Frame component.

Claims

1. A method for manufacturing a package, the package comprising: A rectangular bottom plate portion, the bottom plate portion comprising: A long side and a short side, A first short side surface and a second short side surface, disposed on corresponding portions of opposite positions of the two short sides of the bottom plate portion, and A first long side surface and a second long side surface, disposed on corresponding portions of opposite positions of the two long sides of the bottom plate portion; A plurality of high-frequency internal terminals, arranged in an internal terminal portion inside the first short side surface and connected to high-frequency optical devices installed inside; A plurality of high-frequency external terminals, arranged in a first external terminal portion outside the bottom plate portion outside the first short side surface, connected to the internal terminals and connected to pins; and A plurality of DC electrode terminals, arranged in a second external terminal portion outside the first long side surface, The method comprises: The first step: fabricating a first frame, the first frame having an L shape in a plan view and comprising a portion of the first short side surface, a portion of the first long side surface, a portion of the second long side surface, and the internal terminal portion, in which a plurality of conductor layers and a plurality of insulating layers are stacked in the first frame, the plurality of DC electrode terminals are connected to the plurality of conductor layers, and the plurality of insulating layers are disposed between the plurality of conductor layers, wherein the length of the portion of the first long side surface in a first direction parallel to the length direction of the first long side surface is greater than the length of the internal terminal portion in the first direction, and the length of the portion of the second long side surface in the first direction is equal to the length of the internal terminal portion in the first direction; The second step: fabricating a second frame, the second frame having an L shape in a plan view and comprising a portion of the second short side surface and another portion of the second long side surface; The third step: fabricating a plate-like substrate serving as the bottom plate portion; and The fourth step: combining the first frame, the second frame, and the substrate to form the package.

2. The method for manufacturing a package according to claim 1, wherein In the first step, a frame assembly is fabricated, in which two first frames rotated 180° relative to each other in a plan view are integrated, and the frame assembly is divided into the two first frames, thereby fabricating the first frame.

3. The method for manufacturing a package according to claim 1, wherein In the first step, a frame assembly is fabricated, in which a plurality of first frames are stacked and the plurality of first frames are integrated by connecting portions, while maintaining the positional relationship of the first frames translated along the long side direction of the package in a plan view such that the internal terminal portion is visible from the outside, and the connecting portions are removed to divide the frame assembly into a plurality of first frames, thereby fabricating the first frame.

4. The method for manufacturing a package according to claim 2, wherein In the first step, an assembly integrating a plurality of frame assemblies is fabricated, and the assembly is divided into a plurality of frame assemblies, thereby fabricating the frame assembly.

5. The method for manufacturing a package according to claim 3, wherein In a first step, a component integrating a plurality of frame components is fabricated, and the component is divided into a plurality of frame components, thereby fabricating the frame components.

6. The method for manufacturing a package according to any one of claims 1 to 5, wherein In a fourth step, the first frame, the second frame, the substrate, and a spacer disposed between the internal terminal portion and the substrate are combined to form the package.

7. The method for manufacturing a package according to claim 6, wherein The spacer and the second frame are integrally formed.

8. The method for manufacturing a package according to any one of claims 1 to 5, wherein The first frame includes one of a first joint and a first joint surface provided in a joint portion with the second frame, The second frame includes one of a second joint and a second joint surface provided in a joint portion with the first frame, and In the fourth step, the first joint of the first frame and the second joint of the second frame are tenoned, or the first joint surface of the first frame and the second joint surface of the second frame are permanently joined, thereby combining the first frame and the second frame.

9. The method for manufacturing a package according to any one of claims 1 to 5, wherein The substrate includes at least one thin flat protrusion structure on one side of the second short side and one side of the second long side, and the thin flat protrusion structure matches the position of the bottom surface of the substrate.

10. A package, comprising: A rectangular bottom plate portion, the bottom plate portion including: Long sides and short sides, A first short side and a second short side, disposed on corresponding portions of opposite positions of the two short sides of the bottom plate portion, and A first long side and a second long side, disposed on corresponding portions of opposite positions of the two long sides of the bottom plate portion; A plurality of high-frequency internal terminals, arranged in an internal terminal portion inside the first short side and connected to high-frequency optical devices installed inside; A plurality of high-frequency external terminals, arranged in a first external terminal portion outside the bottom plate portion outside the first short side, connected to the internal terminals and connected to pins; and A plurality of DC electrode terminals, arranged in a second external terminal portion outside the first long side, characterized in that the package includes: A first frame, the first frame having an L shape in a plan view and including a portion of the first short side, a portion of the first long side, a portion of the second long side, and the internal terminal portion, a plurality of conductor layers and a plurality of insulating layers are stacked in the first frame, the plurality of DC electrode terminals are connected to the plurality of conductor layers, and the plurality of insulating layers are disposed between the plurality of conductor layers, wherein the length of the portion of the first long side in a first direction parallel to the length direction of the first long side is greater than the length of the internal terminal portion in the first direction, and the length of the portion of the second long side in the first direction is equal to the length of the internal terminal portion in the first direction; A second frame, the second frame having an L shape in a plan view and including a part of the second short side and another part of the second long side; and A plate-like substrate serving as the bottom plate portion.

11. The package according to claim 10, wherein: Further comprising Spacers disposed between the internal terminal portion and the substrate.

12. The package according to claim 11, wherein The spacers are integrally formed with the second frame.

13. The package according to any one of claims 10 to 12, wherein The first frame includes one of a first joint and a first joint surface provided in a joint portion with the second frame, The second frame includes one of a second joint and a second joint surface provided in a joint portion with the first frame, and The first joint of the first frame and the second joint of the second frame are mortise-and-tenon jointed, or the first joint surface of the first frame and the second joint surface of the second frame are permanently joined.

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