Touch display screen integrated with microphone function

Abstract

The application discloses a touch display screen integrated with a microphone function, which is characterized in that the touch display screen comprises a cover plate, a glue layer is arranged on one side of the cover plate, the cover plate is connected to the glue layer in a glued manner, an upper line capacitor layer is arranged on the side, away from the cover plate, of the glue layer, the glue layer is connected to the upper line capacitor layer in a glued manner, a lower glue layer is arranged on the side, away from the upper line capacitor layer, of the upper line capacitor layer, the upper line capacitor layer is connected to the lower glue layer in a glued manner, a lower line capacitor layer is arranged on the side, away from the lower glue layer, of the lower glue layer, the lower glue layer is connected to the lower line capacitor layer in a glued manner, an adhesive is arranged on the side, away from the lower line capacitor layer, of the lower line capacitor layer, and the touch display screen integrated with the microphone function has the beneficial effects that the microphone device is cancelled, the original position of the microphone does not need to be perforated, and no diaphragm and other components are needed, so that the whole machine structure is optimized, the problem that the existing microphone function and the display screen are two independent components and the whole machine structure is relatively loose and inconvenient for normal use of the microphone and the display screen at the same time is avoided.

Description

Technical Field

[0001] This invention relates to the field of microphone technology, and more specifically to a touch display screen with integrated microphone functionality. Background Technology

[0002] The sound propagation of a microphone device relies on a diaphragm. The basic principle is that the sound emitted by a person travels through the air, causing the diaphragm to vibrate. This changes the distance between the upper diaphragm and the lower metal plate, altering its capacitance and creating a current-capacitive reactance. After being processed by the CPU, this becomes an electrical signal, thus completing the sound-to-electric conversion. In contrast, a touch screen allows users to operate the computer host simply by lightly touching the icons or text on the screen with their fingers.

[0003] Currently, the microphone function and the display screen are often separate, forming two independent components. This results in a loose overall structure, making it difficult to use the microphone and display screen simultaneously. Furthermore, the microphone manufacturing process is quite complex, significantly increasing manufacturing costs. Summary of the Invention

[0004] To address the aforementioned problems in existing technologies, this invention provides a touch display screen with integrated microphone functionality. By creating grooves in the substrates of the upper and lower capacitor layers, and further grooves in the adhesive layer adhering to the lower capacitor layer, a space is created between the upper and lower capacitor layers, forming a diaphragm. The cover plate is also grooved, allowing sound to propagate through it to the upper capacitor layer. This vibration causes changes in the capacitance of both the upper and lower capacitor layers, creating a current-capacitive reactance. After processing by the CPU, this forms an electrical signal, thus completing the sound-to-electrical conversion. This solves the problem of existing microphone and display functions being two separate components, resulting in a loose overall structure and hindering simultaneous normal operation of both the microphone and display.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a touch display screen with integrated microphone function, comprising a cover plate, an upper adhesive layer on one side of the cover plate, the cover plate being bonded to the upper adhesive layer, an upper capacitor layer on the side of the upper adhesive layer away from the cover plate, the upper adhesive layer being bonded to the upper capacitor layer, a lower adhesive layer on the side of the upper capacitor layer away from the upper adhesive layer, the upper capacitor layer being bonded to the lower adhesive layer, a lower capacitor layer on the side of the lower adhesive layer away from the upper capacitor layer, the lower adhesive layer being bonded to the lower capacitor layer, an adhesive on the side of the lower capacitor layer away from the lower adhesive layer, the lower capacitor layer being bonded to the adhesive, and a liquid crystal display module on the side of the adhesive away from the lower capacitor layer, the adhesive being bonded to the liquid crystal display module.

[0006] Preferably, the cover plate is made of materials including CG, PC, PMMA, PET, TAC, PI, including two-layer composite plates and three-layer composite plates made of PC and PMMA copolymer, and also including IML made of PC and PMMA injection molded.

[0007] Preferably, the cover plate plane includes a 2D plane, and also includes a 2.5D or 3D cover plate, and the thickness of the cover plate is set to 0.2mm-3mm.

[0008] Preferably, the cover plate is configured with an ink area around its perimeter, and a slot A is provided at one corner of the ink area. The slot A is located at one corner of the cover plate, and the cross-sectional shape of the slot A includes a circle with a diameter of 0.5mm-2mm, and also includes a square or rectangle with a length and width between 0.5mm-2mm.

[0009] Preferably, both the upper and lower adhesive layers are made of OCA material, which is a solid optically transparent adhesive with high transmittance and strong adhesion. The thickness of the upper and lower adhesive layers includes a conventional thickness of 0.025mm-0.3mm and an unconventional thickness of 0.3mm-2mm.

[0010] Preferably, a groove C is provided at one corner of the lower adhesive layer, and the groove C has the same shape and size as the groove A, and the groove C is located directly below the cover plate groove A.

[0011] Preferably, an upper conductive layer is fixedly connected to one side surface of the upper capacitor layer. The thickness of the upper conductive layer is set to 20nm-2um. A slot B is formed on the side surface of the upper capacitor layer away from the upper conductive layer. The slot B has the same shape and size as the slot A. The slot B is located directly below the slot A of the cover plate.

[0012] Preferably, a lower conductive layer is fixedly connected to one side surface of the lower capacitor layer, the thickness of the lower conductive layer is set to 20nm-2um, and a slot B is formed on the side surface of the lower capacitor layer away from the lower conductive layer. The slot D has the same shape and size as the slot A, and the slot D is located directly below the slot A of the cover plate.

[0013] Preferably, the adhesive is prepared from solid optically transparent adhesive, liquid silicone adhesive or acrylic adhesive, which has high transmittance and high viscosity. The thickness of the adhesive includes conventional thickness of 0.1mm-0.25mm and unconventional thickness of 0.3mm-2cm.

[0014] Preferably, the liquid crystal display module includes a TFT liquid crystal display module, and also includes an IPS liquid crystal display module or a flexible OLED display.

[0015] The embodiments of the present invention have the following advantages:

[0016] 1. This invention consists of a cover plate, an upper adhesive layer, an upper capacitor layer, a lower adhesive layer, a lower capacitor layer, an adhesive, a liquid crystal display module, etc. This touch display screen with integrated microphone function eliminates the microphone device, so there is no need to make a hole in the original position of the microphone. At the same time, there is no need for components such as a diaphragm, which optimizes the overall structure and avoids the problem that the existing microphone function and display screen are two independent components, the overall structure is relatively loose, and it is not convenient for the microphone and display screen to be used normally at the same time.

[0017] 2. This invention simplifies the process and reduces costs by providing an upper conductive layer and a lower conductive layer on one side of the upper and lower capacitor layers, respectively, and integrating the diaphragm system onto the touch screen, making it a single layer with the touch screen capacitor layer. Attached Figure Description

[0018] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0019] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 A structural cross-sectional view of the cover plate is provided for this invention;

[0022] Figure 3 A cross-sectional view of the lower adhesive layer is provided for this invention;

[0023] Figure 4 A cross-sectional view of the structure of the upper capacitor layer is provided for this invention;

[0024] Figure 5 A cross-sectional view of the lower capacitor layer is provided for this invention.

[0025] In the diagram: 1. Cover plate; 2. Upper adhesive layer; 3. Upper capacitor layer; 4. Lower adhesive layer; 5. Lower capacitor layer; 6. Adhesive; 7. Liquid crystal display module; 8. Ink area; 9. Slot A; 10. Slot C; 11. Slot B; 12. Slot D. Detailed Implementation

[0026] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] See attached document Figure 1-4 This invention provides a touch display screen with integrated microphone function, comprising a cover plate 1, an upper adhesive layer 2, an upper capacitor layer 3, a lower adhesive layer 4, a lower capacitor layer 5, an adhesive 6, and a liquid crystal display module 7, etc. Figure 1 As shown;

[0028] The cover plate 1 can be made of CG, PC, PMMA, PET, TAC, or PI. It can be a two-layer or three-layer composite board made of PC and PMMA copolymer, or an IML injection molded from PC and PMMA. It can be a flat 2D cover plate 1, or a 2.5D or 3D cover plate 1, with a thickness of 0.2mm-3mm. The cover plate 1 needs to be grooved. The groove shape can be a circle with a diameter of 0.5mm-2mm, or a square or rectangle with a length and width of 0.5mm-2mm. The groove A9 is located in the ink area 8 of the cover plate 1, generally on the opposite side of the earpiece hole of the cover plate 1, i.e., on the bottom side of the four sides of the product. Figure 2 As shown.

[0029] The upper adhesive layer 2 and the lower adhesive layer 4 are solid optically transparent adhesives with high transmittance and strong adhesion. Their thickness can be a standard 0.025mm-0.3mm or an unconventional 0.3mm-2cm. The lower adhesive layer 4 requires grooving, and the shape and dimensions of the groove in the lower adhesive layer 4 are consistent with those of the groove in the cover plate 1. The groove C10 of the lower adhesive layer 4 is located directly below the groove A9 in the cover plate 1. Figure 3 As shown.

[0030] The upper capacitor layer 3 is first deposited on the front side of the substrate, and then a groove is cut on the back side of the substrate. That is, a conductive layer with a thickness of 20nm-2um is deposited on the front side of the substrate. Edge traces and in-plane patterns are obtained through photolithography or imprinting processes involving exposure, development, and etching. The conductive material of the conductive layer can be Cu, AgBr, or ITO. The linewidth and spacing of the edge traces can be 10um / 10um-40um / 40um. A trace is needed on the front side of the upper capacitor layer 3 below the groove in the cover plate 1. This trace, along with the edge trace, reaches the bending area. The FPC needs to add an extra Pin B. This trace and the Pin B together form a loop. This trace can be L-shaped or straight, and can be on the left or right side. After coating and etching, a groove is made on the back of the upper capacitor layer 3 substrate below the groove A9 of the cover plate 1. The shape and size of the groove are consistent with the shape and size of the groove of the cover plate 1, resulting in the groove B11 of the upper capacitor layer 3, as shown in Figure 4.

[0031] The lower capacitor layer 5 is created by first slotting the front side of the substrate, and then depositing a film on the front side of the substrate. That is, the slot D12 on the front side of the substrate is located directly below the slot A9 on the cover plate 1, and the shape and size of the slot are consistent with those of the slot on the cover plate 1. After slotting the substrate, a conductive layer with a thickness of 20nm-2um is deposited on the front side of the substrate. Edge traces and in-plane patterns are obtained through photolithography (photolithography), development, and etching processes or imprinting processes. The conductive material of the conductive layer can be Cu or AgBr, or ITO. The linewidth and spacing of the edge traces can be 10um / 10um-40um / 40um. A trace is needed on the front side of the lower capacitor layer 5 below the slot on the cover plate 1. This trace, along with the edge trace, reaches the bending area. The FPC needs to add an extra PinD. This trace and the PinD form a loop after imprinting. This trace can be L-shaped or straight, and can be on the left or right side, such as... Figure 5 As shown.

[0032] Adhesive 6 can be a solid optically transparent adhesive, or a liquid silicone adhesive or acrylic adhesive, with high transmittance and strong adhesion. Its thickness can be a conventional thickness such as 0.1mm-0.25mm, or an unconventional thickness such as 0.3mm-2cm.

[0033] The liquid crystal display module 7 can be a TFT liquid crystal display module 7, an IPS liquid crystal display module 7, or a flexible OLED display.

[0034] The usage process of this invention is as follows: When using this invention, the back groove B11 of the upper capacitor layer 3 substrate serves as the upper diaphragm, and the front groove D of the lower capacitor layer 5 serves as the lower diaphragm. The groove depth on the back of the upper capacitor layer 3 substrate, the thickness of the lower adhesive layer 4, and the groove depth on the front of the lower capacitor layer 5 constitute the diaphragm space. When a person's voice is transmitted to the upper capacitor layer 3 through the groove A9 of the cover plate 1, the upper capacitor layer 3 will vibrate, and the diaphragm space formed by the upper capacitor layer 3 and the lower capacitor layer 5 will change. When the upper capacitor layer 3 vibrates upward, the diaphragm space will increase; when the upper capacitor layer 3 vibrates downward, the diaphragm space will decrease. When the upper capacitor layer 3 vibrates continuously upward and downward, the diaphragm space will correspondingly increase and decrease continuously. The change in the diaphragm space distance will change its capacitance. The current capacitive reactance is formed through the traces of the groove B11, Pin B, the traces of the groove D12, and Pin D. After processing by the CPU, an electrical signal is formed, thus completing the sound-to-electric conversion.

[0035] In the fabrication process of this touchscreen display with integrated microphone functionality, a conductive layer with a thickness of 20nm-2um is deposited on the front side of the substrate of the upper capacitor layer 3. The conductive layer after substrate deposition is aged, and then edge traces and in-plane patterns are obtained through photolithography or imprinting processes involving exposure, development, and etching. After deposition and etching, a groove is created on the back side of the upper capacitor layer 3 substrate below the groove A9 in the cover plate 1, with the groove shape and size consistent with the groove shape and size of the cover plate 1. A groove is also created on the front side of the lower capacitor layer 5 substrate, with groove D12 located directly below the groove A9 in the cover plate 1, and its shape and size are consistent with the groove shape and size of the cover plate 1. After grooving the substrate, the substrate is first aged, and then a conductive layer with a thickness of 20nm-2um is deposited on the front side of the substrate. Edge traces and in-plane patterns are obtained through photolithography or imprinting processes involving exposure, development, and etching.

[0036] Cut the upper adhesive layer 2 and the lower adhesive layer 4 into middle pieces. After visual inspection, make holes in the upper adhesive layer 2 in the bonding area. Cut grooves in the lower adhesive layer 4, with the groove shape and size matching those in the cover plate 1. The groove C10 in the lower adhesive layer 4 is located directly below the groove A9 in the cover plate 1. Remove the light release film from the upper adhesive layer 2 and attach it to the front of the upper capacitor layer 3 using a precision bonding machine. Then, make grooves in the bonding area to reserve space for the FPC. Remove the light release film from the lower adhesive layer 4 and attach it to the back of the upper capacitor layer 3. Remove the heavy release film from the lower adhesive layer 4. Use the lower adhesive layer 4 to bond the upper capacitor layer 3 and the lower capacitor layer 5 together to form the sensor middle piece.

[0037] The sensor chip is punched to obtain a small sensor chip. After the appearance and dummy piezoelectric test are OK, it flows into the next process. ACF is attached to FPC. The FPC with ACF and sesnor are pressed together to connect the sesnor and FPC to form FOG. After the appearance and electrical test are OK, CG is assembled. The release film of the top adhesive layer 2 in FOG is removed. The top adhesive layer 2 is used to precisely bond with the cover plate 1 to obtain the touch screen TP. After degassing under pressure, electrical test is performed. After the electrical test is OK, it is sealed. Then adhesive 6 is bonded to the TP. The liquid crystal display module 7 is bonded using adhesive 6 and a precision vacuum assembly machine. After the appearance and electrical properties are OK, film is applied and packaged to prepare the touch screen display.

[0038] The above description is merely a preferred embodiment of the present invention. Any person skilled in the art can modify the present invention or modify it into an equivalent technical solution using the technical solutions described above. Therefore, any simple modifications or equivalent substitutions made based on the technical solutions of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A touch display screen with integrated microphone function, comprising a cover plate (1), characterized in that: One side of the cover plate (1) is provided with an upper adhesive layer (2), and the cover plate (1) is bonded to the upper adhesive layer (2). On the side of the upper adhesive layer (2) away from the cover plate (1), an upper line capacitor layer (3) is provided, and the upper adhesive layer (2) is bonded to the upper line capacitor layer (3). On the side of the upper line capacitor layer (3) away from the upper adhesive layer (2), a lower adhesive layer (4) is provided, and the upper line capacitor layer (3) is bonded to the lower adhesive layer (4). On the side of the lower adhesive layer (4) away from the upper line capacitor layer (3), a lower line capacitor layer (5) is provided, and the lower adhesive layer (4) is bonded to the lower line capacitor layer (5). The lower capacitor layer (5) is provided with an adhesive (6) on the side away from the lower adhesive layer (4), and the lower capacitor layer (5) is bonded to the adhesive (6). A liquid crystal display module (7) is provided on the side of the adhesive (6) away from the lower capacitor layer (5), and the adhesive (6) is bonded to the liquid crystal display module (7). The cover plate (1) is surrounded by an ink area (8), and a slot A (9) is provided at one corner of the ink area (8). The slot A (9) is located at one corner of the cover plate (1), and the cross-sectional shape of the slot A (9) includes straight... The circle has a diameter of 0.5mm-2mm, and also includes a square or rectangle with a length and width between 0.5mm-2mm; a groove C (10) is provided at one corner of the lower adhesive layer (4), the groove C (10) and the groove A (9) have the same shape and size, and the groove C (10) is located directly below the groove A (9) of the cover plate (1); an upper conductive layer is fixedly connected to one side surface of the upper line capacitor layer (3), the thickness of the upper conductive layer is set to 20nm-2um, and a groove B (…) is provided on the side surface of the upper line capacitor layer (3) away from the upper conductive layer. 11) The groove B (11) has the same shape and size as the groove A (9). The groove B (11) is located directly below the groove A (9) of the cover plate (1). A lower conductive layer is fixedly connected to one side surface of the lower line capacitor layer (5). The thickness of the lower conductive layer is set to 20nm-2um. A groove D (12) is opened on the side surface of the lower line capacitor layer (5) away from the lower conductive layer. The groove D (12) has the same shape and size as the groove A (9). The groove D (12) is located directly below the groove A (9) of the cover plate (1).

2. A touch display screen with integrated microphone function according to claim 1, characterized in that: The materials used to prepare the cover plate (1) include CG, PC, PMMA, PET, TAC, and PI, including two-layer composite plates and three-layer composite plates made of PC and PMMA copolymer, and also include IML made of PC and PMMA injection molded.

3. A touch display screen with integrated microphone function according to claim 1, characterized in that: The cover plate (1) includes a 2D plane and also includes a 2.5D or 3D cover plate (1), and the thickness of the cover plate (1) is set to 0.2mm-3mm.

4. A touch display screen with integrated microphone function according to claim 1, characterized in that: The upper adhesive layer (2) and the lower adhesive layer (4) are both made of OCA material. OCA is a solid optical transparent adhesive with high transmittance and high adhesion. The thickness of the upper adhesive layer (2) and the lower adhesive layer (4) includes a conventional thickness of 0.025mm-0.3mm and an unconventional thickness of 0.3mm-2mm.

5. A touch display screen with integrated microphone function according to claim 1, characterized in that: The adhesive (6) is prepared from solid optical transparent adhesive, liquid silicone water adhesive or acrylic water adhesive, which has high transmittance and high viscosity. The thickness of the adhesive (6) includes conventional thickness of 0.1mm-0.25mm and unconventional thickness of 0.3mm-2cm.

6. A touch display screen with integrated microphone function according to claim 1, characterized in that: The liquid crystal display module (7) includes a TFT liquid crystal display module (7), and also includes an IPS liquid crystal display module (7) or a flexible OLED display.

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