Substrate holding mechanism, substrate placement method, and substrate separation method

Abstract

A substrate holding mechanism capable of holding a warped substrate on a stage is provided. A substrate holding mechanism according to an embodiment includes: a stage for placing a substrate; a plurality of holding portions including an upper surface for holding a lower surface of a peripheral portion of the substrate and a lower surface for pressing an upper surface of the peripheral portion of the substrate placed on the stage; a protrusion portion provided to the plurality of holding portions for contacting an end surface of the substrate placed on the stage to correct a position of the substrate; a lifting mechanism for lifting the plurality of holding portions; and a horizontal movement mechanism for horizontally moving the plurality of holding portions.

Description

Technical Field

[0001] This invention relates to a substrate holding mechanism, a substrate placement method, and a substrate removal method. Background Technology

[0002] It is known to have a platform having a substrate holding surface for adsorbing and holding the lower surface of a substrate, and an attraction groove divided into multiple regions for adsorbing a wafer on the substrate holding surface (for example, see Patent Document 1). In Patent Document 1, by repeatedly adsorbing a portion of the substrate in at least one region of the multiple regions, and then adsorbing other portions of the substrate in a region adjacent to that region, the entire substrate is adsorbed and held on the platform.

[0003] <Prior art documents>

[0004] <Patent Documents>

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-197707 Summary of the Invention

[0006] <Problem to be solved by this invention>

[0007] This invention provides a technique for adsorbing and holding a warped substrate on a mounting stage.

[0008] <Methods for solving problems>

[0009] One embodiment of the substrate holding mechanism of the present invention includes: a mounting stage for holding a substrate; a plurality of holding portions, each including an upper surface for holding a lower surface of a peripheral portion of the substrate and a lower surface for pressing down the upper surface of the peripheral portion of the substrate placed on the mounting stage; a protrusion provided on the plurality of holding portions for contacting an end face of the substrate placed on the mounting stage to correct the position of the substrate; a lifting mechanism for lifting the plurality of holding portions; and a horizontal moving mechanism for moving the plurality of holding portions horizontally.

[0010] <The Effects of the Invention>

[0011] According to the present invention, a warped substrate can be adsorbed and held on a mounting stage. Attached Figure Description

[0012] Figure 1 This is a diagram used to illustrate the warping of a substrate.

[0013] Figure 2 This diagram is used to illustrate the problems that may arise due to substrate warping.

[0014] Figure 3This diagram is used to illustrate the problems that may arise due to substrate warping.

[0015] Figure 4 This diagram is used to illustrate the problems that may arise due to substrate warping.

[0016] Figure 5 This diagram is used to illustrate the problems that may arise due to substrate warping.

[0017] Figure 6 This is a diagram illustrating an example of an inspection apparatus including a substrate holding mechanism according to an embodiment.

[0018] Figure 7 yes Figure 6 A top view of the inspection device.

[0019] Figure 8 This is a schematic top view illustrating an example of a substrate holding mechanism according to an embodiment.

[0020] Figure 9 This is a schematic cross-sectional view illustrating an example of a substrate holding mechanism according to an embodiment.

[0021] Figure 10 This is a diagram illustrating an example of a substrate mounting method according to an embodiment.

[0022] Figure 11 This is a diagram illustrating an example of a substrate mounting method according to an embodiment.

[0023] Figure 12 This is a diagram illustrating an example of a substrate mounting method according to an embodiment.

[0024] Figure 13 This is a diagram illustrating an example of a substrate mounting method according to an embodiment.

[0025] Figure 14 This is a diagram illustrating an example of a substrate mounting method according to an embodiment.

[0026] Figure 15 This is a diagram illustrating an example of a substrate mounting method according to an embodiment.

[0027] Figure 16 This is a diagram illustrating an example of a substrate mounting method according to an embodiment.

[0028] Figure 17 This is a diagram illustrating an example of a substrate removal method according to an embodiment.

[0029] Figure 18 This is a diagram illustrating an example of a substrate removal method according to an embodiment.

[0030] Figure 19This is a diagram illustrating an example of a substrate removal method according to an embodiment.

[0031] Figure 20 This is a diagram illustrating an example of a substrate removal method according to an embodiment.

[0032] Figure 21 This is a diagram illustrating an example of a substrate removal method according to an embodiment.

[0033] Figure 22 This is a diagram illustrating an example of a substrate removal method according to an embodiment. Detailed Implementation

[0034] Hereinafter, non-limiting exemplary embodiments of the present invention will be described with reference to the accompanying drawings. Throughout the drawings, identical or corresponding reference numerals are used for the same or corresponding parts, and repeated descriptions are omitted.

[0035] (Substrate warping)

[0036] Reference Figure 1 The warping of the substrate is explained. Figure 1 This is a diagram used to illustrate the warping of the substrate; it is a diagram showing the substrate viewed from the side.

[0037] like Figure 1 As shown in (a), there exists a case where the substrate W has an upwardly warped shape that is curved in a manner that makes its upper surface convex. Additionally, as... Figure 1 As shown in (b), there are cases where the substrate W has a downward warping shape that is convex below it. For example, in the case of a rectangular substrate with dimensions of 300mm × 300mm, a thickness of 500μm to 3000μm, and a weight of 100g to 1000g, there are cases where the substrate warping P is about 10mm.

[0038] Reference Figures 2-5 The problems that may arise due to the warping of the substrate W are explained. Figures 2-5 This diagram illustrates the problems that may arise due to the warping of the substrate W, and is a side view of the substrate W. The following explanation will use the case where the substrate W is placed on the mounting surface 911 of the mounting stage 910 and vacuum adsorption is performed as an example.

[0039] like Figure 2 As shown, when the substrate W is received by the transport arm (not shown) above the stage 910 via the three support pins 912 near the lower surface of the substrate W's central portion, the substrate W may slide on the three support pins 912 due to the warping of the substrate W. Therefore, it is difficult to transport the substrate W stably.

[0040] In addition, such as Figure 3As shown in (a), when the substrate W has an upwardly warped shape, vacuum may leak from the gap 913 between the mounting surface 911 and the substrate W during vacuum adsorption of the substrate W. Therefore, it is difficult to adsorb the substrate W onto the mounting surface 911. Furthermore, as... Figure 3 As shown in (b), the same applies when the substrate W has a downwardly warped shape. When vacuum adsorption is performed on the substrate W, the vacuum may leak from the gap 913 between the mounting surface 911 and the substrate W. Therefore, it is difficult to adsorb the substrate W onto the mounting surface 911.

[0041] In addition, such as Figure 4 As shown, when the substrate W has a downwardly warped shape, the substrate W may slide on the mounting surface 911 (refer to arrow 914) because the contact area between the mounting surface 911 and the substrate W is small. Therefore, it is difficult to place the substrate W at the desired position on the mounting stage 910.

[0042] In addition, such as Figure 5 As shown in (a), when the substrate W, which is vacuum-adsorbed onto the mounting surface 911, is released from adsorption, as... Figure 5 As shown in (b), there is concern that the substrate W may bounce or slide due to the restoring force of warping.

[0043] The following describes a substrate holding mechanism, a substrate placing method, and a substrate detachment method that are capable of adsorbing and holding a warped substrate on a mounting stage.

[0044] [Inspection device]

[0045] Reference Figure 6 as well as Figure 7 As an example of the device used in the substrate holding mechanism of the embodiment, the inspection device will be described. However, the substrate holding mechanism of the embodiment can also be applied to devices other than the inspection device.

[0046] The inspection apparatus 1 includes a loading unit 10, an inspection unit 20, and an apparatus controller 30. Under the control of the apparatus controller 30, the inspection apparatus 1 transports the substrate W to be inspected from the loading unit 10 to the inspection unit 20, and applies electrical signals to the device under test (DUT) formed on the substrate W, thereby inspecting various electrical characteristics. The substrate W can be, for example, a rectangular substrate. Examples of rectangular substrates include PLP (Panel Level Package).

[0047] The loading unit 10 includes a loading port 11, an aligner 12, and a substrate transport mechanism 13. The loading port 11 is used to hold the housing C containing the substrate W. The aligner 12 aligns the substrate W. The substrate transport mechanism 13 transports the substrate W between the housing C placed in the loading port 11, the aligner 12, and the mounting stage 21 (described later). In the loading unit 10, firstly, the substrate transport mechanism 13 transports the substrate W contained in the housing C to the aligner 12. Next, the aligner 12 aligns the substrate W. Then, the substrate transport mechanism 13 transports the aligned substrate W from the aligner 12 to the mounting stage 21 provided in the inspection unit 20.

[0048] The inspection unit 20 is arranged adjacent to the loading unit 10. The inspection unit 20 includes a loading platform 21, a lifting mechanism 22, an XY platform 23, a probe card 24, and an alignment mechanism 25.

[0049] The stage 21 has a rectangular mounting surface. The stage 21 holds the substrate W on the mounting surface. The stage 21 may include, for example, a vacuum chuck.

[0050] A lifting mechanism 22 is located at the lower part of the platform 21, which enables the platform 21 to be raised and lowered relative to the XY platform 23. The lifting mechanism 22 includes, for example, a stepper motor.

[0051] The XY platform 23 is located below the lifting mechanism 22, enabling the platform 21 and the lifting mechanism 22 to move in two axes (the X and Y directions in the figure). The XY platform 23 is fixed to the bottom of the inspection unit 20. The XY platform 23 may include, for example, a stepper motor.

[0052] The probe card 24 is positioned above the stage 21. Multiple probes 24a are formed on one side of the stage 21 of the probe card 24. The probe card 24 is detachably mounted on the top plate 24b. A tester (not shown) is connected to the probe card 24 via a test head T.

[0053] The alignment mechanism 25 includes a camera 25a, a guide rail 25b, and an alignment bridge 25c. The camera 25a is mounted downwards at the center of the alignment bridge 25c and is used to capture images of the mounting stage 21, substrate W, etc. The camera 25a can be, for example, a CCD camera or a CMOS camera. The guide rail 25b supports the alignment bridge 25c, allowing it to move in the horizontal direction (Y direction in the figure). The alignment bridge 25c is supported by a pair of guide rails 25b on the left and right sides, moving along the guide rails 25b in the horizontal direction (Y direction in the figure). Thus, the camera 25a moves between a standby position and directly below the center of the probe card 24 (hereinafter referred to as the "probe center") via the alignment bridge 25c. During alignment, the camera 25a, located at the probe center, captures images of the electrode pads of the substrate W above the mounting stage 21 from above while the mounting stage 21 moves in the XY direction, performs image processing, and displays the captured image on the display device 40.

[0054] In the inspection unit 20, firstly, the alignment mechanism 25 aligns the electrode pads of the device under inspection on the substrate W formed on the stage 21 with the plurality of probes 24a of the probe card 24. Next, the lifting mechanism 22 raises the stage 21, thereby bringing the plurality of probes 24a of the probe card 24 into contact with the corresponding electrode pads. Next, the device controller 30 applies an inspection signal from the detector to the device under inspection formed on the substrate W via the test head T and the plurality of probes 24a of the probe card 24, thereby inspecting the electrical characteristics of the device under inspection.

[0055] The device controller 30 is located below the stage 21 to control the overall operation of the inspection device 1. The CPU in the device controller 30 performs the desired inspection based on product parameters stored in memory such as ROM or RAM. It should be noted that the product parameters can be stored in semiconductor memory other than hard disks, ROM, and RAM. Furthermore, the product parameters can be inserted into a predetermined location while stored in a computer-readable storage medium such as a CD-ROM or DVD for reading.

[0056] (Substrate holding mechanism)

[0057] Reference Figure 8 as well as Figure 9 An example of a substrate holding mechanism according to an embodiment will be described. Figure 8 This is a schematic top view illustrating an example of a substrate holding mechanism according to an embodiment. Figure 9 This is a schematic cross-sectional view illustrating an example of a substrate holding mechanism according to an embodiment, showing that in Figure 8 The cross-section after cutting along the single-dotted dashed line IX-IX. The substrate holding mechanism of the embodiment can be used as, for example, the mounting stage 21 of the inspection device 1 described above.

[0058] The substrate holding mechanism 100 includes a mounting stage 110, multiple holding portions 120, protrusions 130, a lifting mechanism 140, and a horizontal moving mechanism 150.

[0059] The stage 110 has a rectangular mounting surface 111. The stage 110 mounts a substrate W on the mounting surface 111. The substrate W can be, for example, a rectangular substrate. The stage 110 includes, for example, a vacuum chuck. The stage 110 is raised and lowered by a lifting mechanism 112 connected at the bottom.

[0060] Multiple holding portions 120 are provided corresponding to the four sides of the mounting surface 111. The multiple holding portions 120 include holding portions 120a to 120e. A holding portion 120a is provided corresponding to one of the two sides of the four sides of the mounting surface 111 that are opposite to each other in a first direction, and a holding portion 120c is provided corresponding to the other side. That is, holding portions 120a and 120c are arranged opposite each other across the mounting surface 111. Additionally, a holding portion 120b is provided corresponding to one of the two sides of the four sides of the mounting surface 111 that are opposite to each other in a second direction orthogonal to the first direction, and holding portions 120d and 120e are provided corresponding to the other side. That is, holding portions 120b and 120d and 120e are arranged opposite each other across the mounting surface 111. The holding portions 120a to 120e are generally rectangular in shape, with their length direction parallel to the sides of the mounting surface 111. Each of the holding portions 120a to 120c has a length in the longitudinal direction that is approximately the same as one side of the mounting surface 111. Each of the holding portions 120d and 120e has a length in the longitudinal direction that is approximately one-third the length of one side of the mounting surface 111. Holding portion 120d is located at one end of one side of the mounting surface 111, and holding portion 120e is located at the other end of that side of the mounting surface 111. Thus, a gap D is formed between holding portions 120d and 120e, through which a transport arm (not shown) is inserted from above the mounting stage 110. Each of the holding portions 120a to 120e includes an upper surface 121, a lower surface 122, and a wall portion 123. The upper surface 121 is used to hold the lower surface of the peripheral portion of the substrate W. The lower surface 122 is used to press down the upper surface of the peripheral portion of the substrate W placed on the mounting stage 110. The wall portion 123 is configured to extend upward from the upper surface 121, thereby enabling it to contact the end face of the substrate W held on the upper surface 121.

[0061] The protrusion 130 protrudes from the lower surface of each of the holding portions 120a-120e and contacts the end face of the substrate W placed on the stage 110 to correct the position of the substrate W. The protrusion 130 is, for example, rod-shaped. Two protrusions 130 are symmetrically provided at the center of each of the holding portions 120a-120c along their length. Additionally, the protrusion 130 is provided approximately at the center of each of the holding portions 120d and 120e along their length. However, the number of protrusions 130 is only one example and is not limited thereto. Furthermore, the protrusion 130 may be, for example, plate-shaped, extending along the length of each of the holding portions 120a-120e.

[0062] A lifting mechanism 140 is provided on the outer peripheral wall of the mounting platform 110. The lifting mechanism 140 causes the plurality of holding parts 120 to move up and down relative to the mounting platform 110. The lifting mechanism 140 can be, for example, a cylinder with a guide.

[0063] The horizontal moving mechanism 150 is mounted on the lifting mechanism 140 in a lifting manner. The horizontal moving mechanism 150 causes the plurality of holding portions 120 to move horizontally between a closed position and an open position. The closed position is a position where the lower surface of the peripheral portion of the substrate W is held and the upper surface of the peripheral portion of the substrate W is pressed down; this position is where the plurality of holding portions 120 approach the mounting stage 110. The open position is a position where the substrate W is moved away from the mounting stage 110 compared to the closed position. The horizontal moving mechanism 150 can be, for example, a rotary actuator.

[0064] [Substrate placement method]

[0065] Reference Figures 10-16 As an example of the operation of the substrate holding mechanism 100 in the embodiment, a method for placing the substrate W on the mounting stage 110 (hereinafter referred to as the "substrate mounting method") will be described.

[0066] like Figure 10 As shown in (a), in the initial state, the substrate W is not placed on the mounting surface 111 of the mounting stage 110, and the multiple holding parts 120 are set to a standby state in the closed position when they are in the lowered state.

[0067] First, such as Figure 10 As shown in (b), the device controller 30 controls the lifting mechanism 140 to raise the multiple holding parts 120.

[0068] Next, as Figure 10 (c) and Figure 11 As shown in (a), the transport arm 200 holding the substrate W is inserted above the stage 110. In this embodiment, the substrate W has a downwardly curved shape. The transport arm 200 corresponds to... Figure 6 as well as Figure 7 The substrate transport mechanism 13 in the inspection device 1 shown.

[0069] Next, as Figure 11 As shown in (b), when the transport arm 200 descends, the lower surface of the peripheral portion of the substrate W held by the transport arm 200 is held by the upper surface 121 of the plurality of holding portions 120. At this time, since the plurality of holding portions 120 hold the lower surface of the peripheral portion of the substrate W, the substrate W can be reliably held even if the substrate W is warped. In addition, since the transport arm 200 descends through the gap D between the holding portions 120d and 120e, the transport arm 200 does not contact the holding portions 120d and 120e.

[0070] Next, as Figure 11 As shown in (c), if the transport arm 200 descends further, the substrate W separates from the transport arm 200 and is transferred from the transport arm 200 to the plurality of holding portions 120.

[0071] Next, as Figure 12 (a) and Figure 12 As shown in (b), the conveyor arm 200 retracts from above the mounting platform 110. At this time, since the conveyor arm 200 retracts through the gap D between the holding part 120d and the holding part 120e, the conveyor arm 200 does not contact the holding parts 120d and 120e.

[0072] Next, as Figure 12 As shown in (c), the device controller 30 controls the lifting mechanism 140 to lower the plurality of holding parts 120. At this time, the plurality of holding parts 120 hold the lower surface of the peripheral portion of the substrate W on the upper surface 121, and the movement of the substrate W can be restricted by the wall portion 123, so that the substrate W can be lowered in a stable state.

[0073] Next, as Figure 13 As shown in (a), if the plurality of holding portions 120 are lowered further, the substrate W is placed on the mounting surface 111 of the mounting stage 110.

[0074] Next, as Figure 13 As shown in (b), the device controller 30 controls the horizontal movement mechanism 150 to move the plurality of holding parts 120 from the closed position to the open position.

[0075] Next, as Figure 13 As shown in (c), the device controller 30 controls the lifting mechanism 140 to raise the plurality of holding parts 120 until their lower surface 122 is above the uppermost part Wa of the substrate W.

[0076] Next, as Figure 14 (a)~ Figure 14 As shown in (c), the device controller 30 controls the horizontal movement mechanism 150 to gradually close the plurality of holding portions 120 from their open positions. As a result, the protrusion 130 contacts the end face of the substrate W, and the position of the substrate W is corrected. For example, if the center position of the substrate W is misaligned from the center position of the stage 110, and the plurality of holding portions 120 begin to close, then... Figure 14 As shown in (a), a protrusion 130 protruding from the lower surface of at least one of the holding portions 120b of the plurality of holding portions 120 contacts the end face of the substrate W. Then, if the plurality of holding portions 120 are further closed, then as Figure 14 As shown in (b), under the action of the protrusion 130 protruding from the lower surface of the holding portion 120b, the substrate W moves in the direction of the holding portion 120d opposite to the holding portion 120b. Furthermore, if the plurality of holding portions 120 are further closed, then as... Figure 14As shown in (c), the protrusions 130 protruding from the lower surfaces of all the holding portions 120a to 120e of the plurality of holding portions 120 contact the end face of the substrate W. As a result, the center of the substrate W is aligned with the center of the stage 110.

[0077] Next, as Figure 15 (a) and Figure 15 As shown in (b), the device controller 30 controls the lifting mechanism 140 to lower the plurality of holding parts 120, thereby pressing down the upper surface of the periphery of the substrate W placed on the stage 110 through the lower surface 122.

[0078] Next, as Figure 15 As shown in (b), the device controller 30 begins adsorption based on the vacuum chuck, thereby adsorbing the substrate W, whose upper surface of the periphery is pressed down, onto the mounting surface 111 of the mounting stage 110.

[0079] Next, as Figure 15 As shown in (c), the device controller 30 controls the lifting mechanism 140 to raise the multiple holding parts 120.

[0080] Next, as Figure 16 As shown in (a), the device controller 30 controls the horizontal movement mechanism 150 to move the plurality of holding parts 120 from the closed position to the open position.

[0081] Next, as Figure 16 As shown in (b), the device controller 30 controls the lifting mechanism 140 to lower the plurality of holding parts 120.

[0082] Next, Figure 16 As shown in (c), the device controller 30 controls the horizontal movement mechanism 150 to move the plurality of holding portions 120 from the open position to the closed position. As a result, the substrate holding mechanism 100 returns to the standby state. As described above, the substrate mounting method of this embodiment ends.

[0083] As described above, in the substrate placement method according to the embodiment, when the substrate W is received by the transport arm 200, the plurality of holding portions 120 hold the lower surface of the peripheral portion of the substrate W by means of the upper surface 121. Therefore, even if the substrate W is warped, the substrate W can be reliably held.

[0084] Furthermore, according to the substrate placement method of the embodiment, the multiple holding portions 120 are lowered while holding the lower surface of the peripheral portion of the substrate W by the upper surface 121 of the multiple holding portions 120, thereby placing the substrate W on the placement surface 111. As a result, the substrate W can be lowered in a stable state.

[0085] Furthermore, according to the substrate placement method of the embodiment, the protrusion 130 contacts the end face of the substrate W placed on the placement surface 111, thereby correcting the position of the substrate W. As a result, even if the substrate W slides on the placement surface 111 when it is placed on the placement surface 111 and the center of the substrate W is misaligned from the center of the placement stage 110, the center of the substrate W can be aligned with the center of the placement stage 110.

[0086] Furthermore, according to the substrate placement method of the embodiment, while the upper surface of the peripheral portion of the substrate W placed on the placement surface 111 is pressed down by the lower surface 122 of the plurality of holding portions 120, the substrate W is adsorbed onto the placement surface 111 by a vacuum chuck. This suppresses vacuum leakage during the adsorption of the substrate W based on the vacuum chuck.

[0087] (Substrate detachment method)

[0088] Reference Figures 17-22 As another example of the operation of the substrate holding mechanism 100 in the embodiment, a method for detaching the substrate W that is vacuum-adsorbed by the stage 110 (hereinafter referred to as the "substrate detachment method") will be described.

[0089] like Figure 17 As shown in (a), in the initial state, a substrate W is placed on the placement surface 111 of the stage 110, and the multiple holding parts 120 are set to a standby state in the closed position when they are in the lowered state.

[0090] First, such as Figure 17 As shown in (b), the device controller 30 controls the horizontal movement mechanism 150 to move the plurality of holding parts 120 from the closed position to the open position.

[0091] Next, as Figure 17 As shown in (c), the device controller 30 controls the lifting mechanism 140 to raise the plurality of holding parts 120 until their lower surface 122 is above the upper surface of the substrate W.

[0092] Next, as Figure 18 As shown in (a), the device controller 30 controls the horizontal movement mechanism 150 to gradually close the multiple holding parts 120 from the open position, thereby making the protrusion 130 contact the end face of the substrate W and gently press the substrate W.

[0093] Next, as Figure 18As shown in (b), the device controller 30 contacts the vacuum chuck for adsorption. At this time, since the end face of the substrate W is gently pressed by the protrusion 130, even if the substrate W is warped, it is possible to prevent the substrate W from bouncing and sliding under the restoring force of warping. In addition, even if the substrate W bounces up, since the substrate W is pressed down by the lower surface 122 of the multiple holding portions 120, misalignment caused by rebound is prevented.

[0094] Next, as Figure 18 As shown in (c), the device controller 30 controls the horizontal movement mechanism 150 to move the plurality of holding parts 120 to the open position.

[0095] Next, as Figure 19 As shown in (a), the device controller 30 controls the lifting mechanism 140 to lower the plurality of holding parts 120.

[0096] Next, as Figure 19 As shown in (b), the device controller 30 controls the horizontal movement mechanism 150 to move the plurality of holding parts 120 from the open position to the closed position.

[0097] Next, as Figure 19 As shown in (c), the device controller 30 controls the lifting mechanism 140 to raise the plurality of holding parts 120. At this time, since the plurality of holding parts 120 can hold the lower surface of the periphery of the substrate W by the upper surface 121 and restrict the movement of the substrate W by the wall part 123, the substrate W can be raised in a stable state.

[0098] Next, as Figure 20 (a) and Figure 20 As shown in (b), the transport arm 200, which does not hold the substrate W, is inserted between the mounting surface 111 of the mounting stage 110 and the lower surface of the substrate W. At this time, since the transport arm 200 is inserted through the gap D between the holding part 120d and the holding part 120e, the transport arm 200 does not contact the holding parts 120d and 120e.

[0099] Next, as Figure 20 As shown in (c), if the conveying arm 200 rises, the substrate W held by the plurality of holding portions 120 is held by the conveying arm 200. At this time, since the conveying arm 200 rises through the gap D between the holding portions 120d and 120e, the conveying arm 200 does not contact the holding portions 120d and 120e.

[0100] Next, as Figure 21 As shown in (a), if the transport arm 200 rises further, the substrate W separates from the plurality of holding portions 120 and is transferred from the plurality of holding portions 120 to the transport arm 200.

[0101] Next, as Figure 21 (b) and Figure 21 As shown in (c), the transport arm 200 holding the substrate W retracts from above the stage 110.

[0102] Next, as Figure 22 As shown, the device controller 30 controls the lifting mechanism 140 to lower the plurality of holding portions 120. Consequently, the substrate holding mechanism 100 returns to the standby state. As described above, the substrate detachment method of this embodiment ends.

[0103] As described above, according to the substrate detachment method of the embodiment, the multiple holding portions 120 are raised while holding the lower surface of the peripheral portion of the substrate W by the upper surface 121 of the multiple holding portions 120, thereby separating the substrate W from the mounting surface 111. As a result, the substrate W can be raised in a stable state.

[0104] Furthermore, according to the substrate detachment method of the embodiment, the substrate W is gently pressed against the end face of the substrate W through the protrusion 130, and then adsorbed by the contact vacuum chuck. Therefore, even if the substrate W is warped, it is possible to prevent the substrate W from bouncing or sliding under the restoring force of warping.

[0105] The embodiments of the present invention should be considered as illustrative examples and are not intended to be limiting. The above embodiments may be omitted, substituted, or modified in various ways without exceeding the scope of the claims and their spirit.

[0106] In the above embodiments, although the case where the substrate W is a rectangular substrate has been described, the present invention is not limited thereto. For example, the substrate W can be a circular substrate. As a circular substrate, WLP (Wafer Level Package) can be cited as an example. When the substrate W is a circular substrate, for example, the stage is configured to have a circular mounting surface, and the plurality of holding portions are configured to have a generally arc shape.

Claims

1. A substrate holding mechanism, comprising: A mounting stage, used to mount a substrate; Multiple holding portions include an upper surface for holding the lower surface of the peripheral portion of the substrate, and a lower surface for contacting the upper surface of the peripheral portion of the substrate placed on the mounting stage and pressing down the upper surface of the peripheral portion. The protrusion is provided on the plurality of holding portions and is used to contact the end face of the substrate placed on the mounting stage to correct the position of the substrate. A lifting mechanism for raising and lowering the aforementioned plurality of holding parts; and A horizontal moving mechanism is used to move the plurality of holding portions and the protrusions horizontally as a whole until the protrusions come into contact with the end face of the substrate placed on the mounting stage. in, The substrate, whose upper surface of the peripheral portion is pressed down, is adsorbed onto the mounting stage.

2. The substrate holding mechanism according to claim 1, wherein, The aforementioned protrusions are provided such that they protrude downward from the respective lower surfaces of the plurality of retaining portions.

3. The substrate holding mechanism according to claim 1 or 2, wherein, The aforementioned platform has a rectangular mounting surface.

4. The substrate holding mechanism according to claim 3, wherein, The aforementioned multiple retaining parts are provided corresponding to at least two of the four sides of the aforementioned mounting surface that are opposite each other.

5. The substrate holding mechanism according to claim 3, wherein, The aforementioned multiple retaining parts are provided corresponding to all four sides of the aforementioned mounting surface.

6. The substrate holding mechanism according to claim 1 or 2, wherein, Each of the aforementioned holding portions has a wall portion that extends upward from the aforementioned upper surface and is capable of contacting the end face of the aforementioned substrate held by the aforementioned upper surface.

7. The substrate holding mechanism according to claim 1 or 2, wherein, The aforementioned lifting mechanism is used to raise and lower the aforementioned holding part, the aforementioned protrusion, and the aforementioned horizontal moving mechanism.

8. The substrate holding mechanism according to claim 1 or 2, wherein, The aforementioned stage includes a vacuum chuck for adsorbing the aforementioned substrate.

9. A substrate placement method, wherein a substrate is placed on a placement stage by a plurality of holding portions, the plurality of holding portions including an upper surface for holding a lower surface of a peripheral portion of the substrate, and a lower surface for pressing down the upper surface of the peripheral portion of the substrate placed on the placement stage. The substrate mounting method has the following features: The holding process involves holding the lower surface of the peripheral portion of the substrate above the aforementioned placement stage via the upper surfaces of the aforementioned plurality of holding portions; The placement process involves lowering the plurality of holding portions that hold the lower surface of the peripheral portion of the substrate, thereby placing the substrate on the placement stage. The calibration process involves moving the plurality of holding portions and the protrusions provided on the plurality of holding portions horizontally as a single unit until the protrusions come into contact with the end face of the substrate placed on the mounting table, thereby calibrating the position of the substrate using the protrusions. The pressing process involves pressing down the upper surface of the peripheral portion of the substrate by means of the lower surfaces of the plurality of holding portions, which are brought into contact with the upper surface of the peripheral portion of the substrate whose position has been corrected; and The adsorption process causes the substrate, whose upper surface of the peripheral portion is pressed down, to be adsorbed onto the mounting stage.

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