Upper cover and semiconductor packaging device

Abstract

The present disclosure relates to an upper cover and a semiconductor packaging device. The upper cover is designed to include a vertical part which is an annular column and surrounds a receiving space, one end of the vertical part is provided with a first extension part, one end of the first extension part extends out of the receiving space, the first extension part cooperates with the outer wall of the vertical part to allow a waterproof rubber sleeve ring to be arranged, and the first extension part can be formed by folding, thereby simplifying the structure of the upper cover.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor packaging technology, specifically to a cover and a semiconductor packaging device. Background Technology

[0002] The industry is increasingly demanding higher waterproofing performance for MEMS (Micro-Electro-Mechanical System) components, with waterproofing requirements being particularly important for portable consumer electronics.

[0003] To accommodate the waterproof rubber O-ring and prevent it from falling off, the lid used for MEMS components must have an outer edge structure (brim-shaped) design, and electromagnetic shielding requirements must also be considered. Therefore, metal lids are usually used to avoid electromagnetic interference.

[0004] Current common top cover designs used to avoid electromagnetic interference are mostly achieved through CNC (Computerized Numerical Control Machine) lathes for metal processing or multiple punch forming processes, which result in relatively high manufacturing costs and are detrimental to the product's market competitiveness. Summary of the Invention

[0005] In a first aspect, this disclosure provides a cover, comprising:

[0006] The upright part is an annular column and surrounds an accommodating space. One end of the upright part is provided with a first extension, one end of which extends outward from the accommodating space.

[0007] In some optional embodiments, a second extension is provided at one end of the first extension, and a turning portion is provided between the first extension and the second extension.

[0008] The turning portion includes a first turning angle connecting the first extension, a third turning angle connecting the second extension, and a second turning angle disposed between the first turning angle and the third turning angle, wherein the first turning angle, the second turning angle, and the third turning angle are arc-shaped.

[0009] In some alternative embodiments, one end of the second extension extends toward the axis of the upright portion.

[0010] In some alternative embodiments, the second extension is provided with an opening, the width of which is smaller than the width of the accommodating space.

[0011] In some alternative embodiments, the top cover further includes:

[0012] The base is connected to the other end of the upright part, and an opening is provided in the base corresponding to the accommodating space.

[0013] In some alternative embodiments, the line containing the axis of the upright portion is perpendicular to the plane containing at least a portion of the upper surface of the first extension portion.

[0014] In some alternative embodiments, the line containing the axis of the upright portion is perpendicular to the plane containing at least a portion of the upper surface of the second extension.

[0015] In some alternative embodiments, the cover is made of metal.

[0016] In some alternative embodiments, the side of the top cover is provided with a groove.

[0017] In a second aspect, this disclosure provides a semiconductor packaging apparatus, comprising:

[0018] The carrier is provided with a receiving cavity;

[0019] A first electronic component is disposed in the receiving cavity and on the carrier;

[0020] The second electronic component is stacked on top of the first electronic component;

[0021] A filler adhesive is used to encapsulate the first electronic component and the second electronic component;

[0022] A top cover, corresponding to the receiving cavity, is disposed on the carrier. The top cover includes an upright portion, which is an annular cylinder surrounding a receiving space. One end of the upright portion has a first extension portion, one end of which extends outward from the receiving space. A groove is provided on the side of the top cover. The device further includes:

[0023] A waterproof rubber collar is fitted onto the side of the upper cover, corresponding to the groove.

[0024] In some alternative embodiments, the carrier includes a substrate and a sidewall disposed on the substrate, the sidewall surrounding the receiving cavity.

[0025] In some alternative embodiments, a sensor is disposed on the second electronic component, the sensor being at least partially exposed through the filler adhesive.

[0026] In some alternative embodiments, the surface of the second electronic component is covered with a protective layer, and the surface on which the sensor is disposed is exposed through the protective layer.

[0027] In some optional embodiments, a second extension is provided at one end of the first extension, and a turning portion is provided between the first extension and the second extension.

[0028] The turning portion includes a first turning angle connecting the first extension, a third turning angle connecting the second extension, and a second turning angle disposed between the first turning angle and the third turning angle, wherein the first turning angle, the second turning angle, and the third turning angle are arc-shaped.

[0029] In some alternative embodiments, one end of the second extension extends toward the axis of the upright portion.

[0030] In some alternative embodiments, the second extension is provided with an opening, the width of which is smaller than the width of the accommodating space.

[0031] In some alternative embodiments, the top cover further includes:

[0032] The base is connected to the other end of the upright part, and an opening is provided in the base corresponding to the accommodating space.

[0033] In some alternative embodiments, the line containing the axis of the upright portion is perpendicular to the plane containing at least a portion of the upper surface of the first extension portion.

[0034] In some alternative embodiments, the line containing the axis of the upright portion is perpendicular to the plane containing at least a portion of the upper surface of the second extension.

[0035] In some alternative embodiments, the cover is made of metal.

[0036] In the top cover and semiconductor packaging device provided in this disclosure, the top cover is designed to include: an upright portion, which is an annular column and surrounds an accommodating space. A first extension portion is provided at one end of the upright portion, and one end of the first extension portion extends outward from the accommodating space. In this way, the first extension portion cooperates with the outer wall of the upright portion to accommodate a waterproof rubber collar. Moreover, the first extension portion can be formed by folding the tubular material forming the upright portion, which simplifies the manufacturing process and reduces the manufacturing cost. Attached Figure Description

[0037] Other features, objects, and advantages of this disclosure will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0038] Figure 1 This is a schematic diagram of a longitudinal cross-sectional structure of the cover according to an embodiment of the present disclosure;

[0039] Figure 2This is a longitudinal cross-sectional structural schematic diagram of one embodiment of the semiconductor packaging device according to the present invention;

[0040] Figure 3 This is a longitudinal cross-sectional structural schematic diagram of another embodiment of the semiconductor packaging device according to the present invention;

[0041] Figure 4 This is a schematic diagram of a method for manufacturing a semiconductor packaging apparatus according to an embodiment of the present disclosure;

[0042] Figures 5A to 5E This is a partial structural diagram of a semiconductor packaging apparatus during the manufacturing stage according to an embodiment of the present disclosure.

[0043] Symbol explanation:

[0044] 11-Upright part; 11a-Axis; 12-First extension; 13-Second extension; 14-Base; 15-Turn part; 151-First turning angle; 152-Second turning angle; 153-Third turning angle; 16-Accommodation space; 17-Groove; 18-Opening; 21-Carrier; 22-Top cover; 23-First electronic component; 24-Second electronic component; 25-Sensor; 26-Waterproof rubber collar; 31-Substrate; 32-Side wall; 33-Accommodation cavity; 34-Filling adhesive; 35-Protective layer; 36-Tape. Detailed Implementation

[0045] The specific embodiments of this disclosure will be described below with reference to the accompanying drawings and examples. Those skilled in the art can easily understand the technical problems solved by this disclosure and the resulting technical effects through the content described herein. It is understood that the specific embodiments described herein are merely illustrative of the relevant invention and not intended to limit the invention. Furthermore, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0046] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content described herein, and are not intended to limit the implementation conditions of this disclosure. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this disclosure, should still fall within the scope of the technical content disclosed herein. Furthermore, terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this disclosure. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this disclosure's implementation.

[0047] It should also be noted that the longitudinal section corresponding to the embodiments of this disclosure can be the section corresponding to the front view direction, the transverse section can be the section corresponding to the right view direction, and the horizontal section can be the section corresponding to the top view direction.

[0048] Furthermore, the embodiments and features described herein can be combined with each other, unless otherwise specified.

[0049] refer to Figure 1 , Figure 1 This is a schematic diagram of a longitudinal cross-sectional structure of an embodiment of the cover according to the present disclosure.

[0050] like Figure 1 As shown, the upper cover 22 may include an upright portion 11.

[0051] The upright part 11 is a ring-shaped column and surrounds a receiving space 16. One end of the upright part 11 is provided with a first extension 12, and one end of the first extension 12 extends outward from the receiving space 16.

[0052] In this embodiment, the first extension 12, in conjunction with the outer wall of the upright portion 11, can be fitted with a waterproof rubber collar to achieve a waterproof effect. Furthermore, the first extension 12 can be formed by folding the tubular material forming the upright portion 11, simplifying the manufacturing process and reducing manufacturing costs.

[0053] In some alternative implementations, such as Figure 1 As shown, a second extension 13 is provided at one end of the first extension 12, and a turning part 15 is provided between the first extension 12 and the second extension 13.

[0054] The turning portion 15 includes a first turning angle 151 connecting the first extension portion 12, a third turning angle 153 connecting the second extension portion 13, and a second turning angle 152 disposed between the first turning angle 151 and the third turning angle 153. The first turning angle 151, the second turning angle 152 and the third turning angle 153 are arc-shaped.

[0055] In some alternative implementations, such as Figure 1 As shown, one end of the second extension 13 extends toward the axis 11a of the upright portion 11.

[0056] In some alternative implementations, such as Figure 1 As shown, the second extension 13 is provided with an opening 18, the width of which is smaller than the width of the accommodating space 16. Here, the width of the opening 18 is... Figure 1 The transverse cross-sectional diameter of the central opening 18 and the width of the accommodating space 16 are... Figure 1 The transverse cross-sectional diameter of the central accommodating space 16.

[0057] The opening 18, together with the accommodating space 16, forms a hole that can be used by the MEMS components located below the top cover 22 for sensing.

[0058] In some alternative implementations, such as Figure 1 As shown, the upper cover 22 also includes:

[0059] The base 14 is connected to the other end of the upright part 11, and one end of the base 14 extends outward from the accommodating space 16. The base 14 can be used to connect with the substrate when the upper cover 22 is set on the substrate.

[0060] In some alternative implementations, such as Figure 1 As shown, the axis 11a of the upright part 11 is perpendicular or approximately perpendicular to the plane where the first extension part 12 is located.

[0061] In some alternative implementations, such as Figure 1 As shown, the straight line containing the axis 11a of the upright portion 11 is perpendicular to the plane containing at least a portion of the upper surface of the second extension portion 13.

[0062] In some alternative embodiments, the cover 22 is made of metal to achieve electromagnetic interference shielding. The metal cover 22 can be adhered to the grounding requirement for electromagnetic shielding using an adhesive containing conductive material (e.g., metallic silver paste). Compared to plastic materials, the metal cover 22 provides a strong, rigid structure with a smaller thickness and reduces manufacturing costs.

[0063] In some alternative implementations, such as Figure 1 As shown, the side of the top cover 22 is provided with a groove 17.

[0064] It is understood that the groove 17 is composed of an upright portion 11, a first extension portion 12, and a base 14. The groove 17 is provided for a waterproof rubber collar to cooperate with the waterproof rubber sleeve to improve the waterproof sealing effect.

[0065] refer to Figure 2 , Figure 2 This is a longitudinal cross-sectional structural schematic diagram of one embodiment of the semiconductor packaging device according to the present invention.

[0066] like Figure 2 As shown, the semiconductor packaging device 200 may include:

[0067] The carrier 21 is provided with a receiving cavity 33.

[0068] The first electronic component 23 is disposed in the receiving cavity 33 and on the carrier 21.

[0069] The second electronic component 24 is stacked on top of the first electronic component 23.

[0070] Filler adhesive 34 covers the first electronic component 23 and the second electronic component 24.

[0071] The upper cover 22 is disposed on the carrier 21, corresponding to the receiving cavity. The upper cover 22 may include, for example, Figure 1 The specific structure of the upper cover 22 in any of the above embodiments is not described in detail here. Figure 2 For the specific structure of the unmarked upper cover 22, please refer to [the provided text]. Figure 1 As shown.

[0072] The first electronic component 23 may include an ASIC (Application Specific Integrated Circuit) chip.

[0073] The second electronic component 24 may include a MEMS component.

[0074] Here, the carrier 21 is not specifically limited, as long as the carrier 21 can provide the function of carrying the first electronic component 23 and the second electronic component 24.

[0075] In some alternative implementations, such as Figure 2 As shown, the carrier 21 may include a substrate 31 and a sidewall 32 disposed on the substrate 31, the sidewall 32 surrounding a receiving cavity 33.

[0076] The sidewall 32 can be a substrate, circuit layer, or redistribution layer disposed on the substrate 31, or other materials capable of providing support. Here, the sidewall 32 functions to enclose the receiving cavity 33, and the top cover 22 is disposed on the sidewall 32. In some alternative embodiments, the sidewall 32 can be made of a metallic material, or at least a portion of the surface of the sidewall 32 can be provided with a metallic material to further enhance the electromagnetic shielding effect in conjunction with the metallic top cover 22.

[0077] The filler 34 may include liquid and / or thin film organic materials, such as: non-conductive plastic (NCP), non-conductive film (NCF), anisotropic conductive adhesive film (ACF), anisotropic conductive adhesive plastic (ACP), polyimide (PI), epoxy resin, resin, PP (Prepreg, also known as prepreg or semi-cured resin, semi-cured sheet), ABF (Ajinomoto Build-up Film), glue, gel filling, etc.

[0078] The first electronic component 23 and the second electronic component 24 are protected by filler adhesive 34 to form a chemical and corrosion resistant protective layer, which can block dust particles and moisture, thus meeting the requirements for the use of sensing components in harsh environments.

[0079] In some alternative embodiments, the first electronic component 23 and the second electronic component 24 are stacked face up on the carrier 21. The first electronic component 23 is electrically connected to the second electronic component 24 via wire bonding, and the second electronic component 24 is electrically connected to the carrier 21 via wire bonding. The filler adhesive 34 covers the wire bonding area to provide protection for the wire bonding.

[0080] In some alternative implementations, such as Figure 2 As shown, the semiconductor packaging device 200 may further include: a waterproof rubber collar 26, which is fitted onto the side of the upper cover 22 corresponding to the groove 17 of the upper cover 22.

[0081] In some alternative embodiments, a sensor 25 is disposed on the second electronic component 24, with the sensor 25 at least partially exposed through the filler adhesive 34. The second electronic component 24 can sense the external environment through the sensor 25 through the opening 18 of the top cover 22 and the hole formed by the accommodating space 16.

[0082] Continue to refer to Figure 3 , Figure 3 This is a longitudinal cross-sectional structural schematic diagram of another embodiment of the semiconductor packaging device according to the present invention. Figure 3 The semiconductor packaging device 300 shown is similar to Figure 2 The semiconductor packaging device 200 shown is different in that the active surface of the second electronic element 24, on which the sensor 25 is disposed, is higher than the side wall 32. The end of the active surface of the second electronic element 24 is disposed in the accommodating space 16 of the upper cover 22. The surface of the second electronic element 24 is covered with a protective layer 35, and the surface on which the sensor 25 is disposed is exposed through the protective layer 35.

[0083] The protective layer 35 can be formed from various molding compounds. For example, molding compounds may include epoxy resin, filler, catalyst, pigment, release agent, flame retardant, coupling agent, hardener, low stress absorber, adhesion promoter, ion trapping agent, etc.

[0084] In this embodiment, the height of the second electronic component 24 exceeds the receiving cavity 33, and the filler adhesive 34 may not be able to adequately protect the second electronic component 24. By providing a protective layer 35, the waterproof effect of the part of the second electronic component 24 not covered by the filler adhesive 34 can be improved.

[0085] Figure 4 This is a schematic diagram of a semiconductor packaging manufacturing method flow 400 according to an embodiment of the present disclosure, as shown below. Figure 4 As shown, the manufacturing process 400 of a semiconductor packaging device may include the following steps:

[0086] Step 401, provide substrate 31.

[0087] Step 402, set the sidewall 32.

[0088] Here, the sidewall 32 can be bonded to the substrate 31 using an adhesive.

[0089] Step 403, sidewall 32 connection and curing.

[0090] Here, curing can be achieved by heating the adhesive.

[0091] Step 404: Attach the first electronic component 23.

[0092] Here, the non-active surface of the first electronic component 23 can be bonded to the substrate 31 using an adhesive.

[0093] The first electronic component 23 can be transmitted via, for example, Figure 4 Steps 501 to 504 shown herein yield the following results:

[0094] Step 501: Provide a wafer of the first electronic component 23.

[0095] Step 502: Grinding the wafer of the first electronic component 23.

[0096] It is understandable that, in order to correspond to the size of the semiconductor packaging device 300, the wafer can be ground to reduce the wafer thickness, thereby reducing the space occupied by the first electronic component 23 in the vertical direction.

[0097] Step 503: Install the wafer of the first electronic component 23.

[0098] Step 504: Mechanically cut the wafer of the first electronic component 23 to obtain the first electronic component 23.

[0099] Here, mechanical cutting may include cutting using a wafer saw.

[0100] Step 405: The bonding and curing of the first electronic component 23.

[0101] Here, curing can be achieved by heating the adhesive.

[0102] Step 406: Attach the second electronic component 24.

[0103] Here, the non-active surface of the second electronic component 24 can be bonded to the first electronic component 23 using an adhesive.

[0104] The second electronic component 24 can be accessed via, for example... Figure 4 Steps 601 to 604 shown herein yield the following results:

[0105] Step 601, providing a wafer of the second electronic component 24.

[0106] Step 602: Grinding the wafer of the second electronic component 24.

[0107] It is understandable that, to accommodate the size of the semiconductor packaging device 300, the wafer can be ground to reduce the wafer thickness, thereby reducing the vertical space occupied by the second electronic component 24. Here, step 602 is an optional step, and can be performed according to the actual packaging size requirements.

[0108] Step 603: Install the wafer of the second electronic component 24.

[0109] Step 604: Mechanically cut the wafer of the second electronic component 24 to obtain the second electronic component 24.

[0110] Here, mechanical cutting may include cutting using a wafer saw.

[0111] Step 407: Bonding and curing of the second electronic component 24.

[0112] Here, curing can be achieved by heating the adhesive.

[0113] Step 408, Plasma clean.

[0114] Step 409, connect the wires.

[0115] Here, the substrate 31 and the first electronic component 23, as well as the first electronic component 23 and the second electronic component 24, can be connected by wire bonding.

[0116] Step 410, Visual inspection.

[0117] Step 411, gel filling.

[0118] Here, the gel covers at least a portion of the first electronic component 23 and the second electronic component 24.

[0119] Step 412, gel solidification.

[0120] Here, the gel can be cured by heating to form filler 34.

[0121] Step 413: Wire bonding coating of the second electronic component 24.

[0122] In some embodiments, the portion of the wires connecting the second electronic component 24 is not fully covered in step 411. Therefore, the wires connected to the second electronic component 24 are coated here by coating the wires with a gel material.

[0123] Step 414: Curing of the coating material.

[0124] Here, the coating material can be cured by heating to form a shape such as Figure 3 The filler adhesive 34 structure is shown.

[0125] Step 415, connect the top cover 22.

[0126] Here, the top cover 22 can be glued to the side wall 32 using an adhesive.

[0127] Step 416, top cover 22 connection and curing.

[0128] Here, curing can be achieved by heating the adhesive.

[0129] Step 417, laser marking.

[0130] Step 418, mechanical cutting (saw simulation).

[0131] Step 419, ultraviolet irradiation (UV irradiator).

[0132] Step 420, Final Visual Inspection.

[0133] Step 421, Packaging

[0134] Here, steps 417 to 421 are conventional semiconductor packaging processes, which will not be described in detail in this disclosure.

[0135] The method for manufacturing semiconductor structures disclosed herein can achieve similar technical effects to the aforementioned semiconductor structures, and will not be described in detail here.

[0136] Figures 5A to 5E This is a partial structural diagram of a semiconductor packaging apparatus during the manufacturing stage according to an embodiment of the present disclosure, as shown below. Figures 5A to 5E As shown, it illustrates the manufacturing process as follows: Figure 3 A schematic diagram of the longitudinal cross-sectional structure of the second electronic component 24, which is covered by the protective layer 35 in the semiconductor packaging device 300, during the manufacturing stage.

[0137] refer to Figure 5A A second electronic component 24 is provided, and a sensor 25 is provided on the active surface of the second electronic component 24.

[0138] Here, the manufacturing method of the second electronic component 24 is described. Figure 4 Steps 601 to 604 have already been disclosed and will not be repeated here.

[0139] refer to Figure 5B Flip it over and place the active side of the second electronic component 24 onto the tape 36.

[0140] refer to Figure 5C A protective layer 35 is provided, which covers the surface of the second electronic component 24 except for the active surface.

[0141] Here, the protective material can be coated using a spry coating process and then heated and baked to form a protective layer 35.

[0142] refer to Figure 5D The second electronic component 24, which is covered by the protective layer 35, is transferred, and the tape 36 is removed.

[0143] refer to Figure 5E A second electronic component 24 with a protective layer 35 is obtained. The protective layer 35 serves as a covering surrounding the sidewalls and can provide protection for the surface of the second electronic component 24 other than the active surface.

[0144] here, Figure 5E The second electronic component 24, which is covered by the protective layer 35, can be used as follows: Figure 3 The manufacturing process of the semiconductor packaging device 300 shown, including specific packaging steps, can be found in [reference needed]. Figure 4The manufacturing method of the semiconductor packaging device shown herein will not be described in detail here. Although this disclosure has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not limiting of this disclosure. It will be readily understood by those skilled in the art that various changes can be made and equivalent components can be substituted within the embodiments without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Differences may exist between the technical representation in this disclosure and actual implementation due to variables in the manufacturing process, etc. Other embodiments of this disclosure may exist that are not specifically described. The specification and illustrations should be regarded as illustrative and not restrictive. Modifications may be made to adapt particular circumstances, materials, composition of matter, methods, or processes to the object, spirit, and scope of this disclosure. All such modifications fall within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit this disclosure.

Claims

1. A top cover, comprising: An upright portion, which is an annular column and surrounds an accommodating space, has a first extension portion at one end of the upright portion, and one end of the first extension portion extends outward from the accommodating space. Wherein, a second extension is provided at one end of the first extension, and a turning part is provided between the first extension and the second extension; The turning portion includes a first turning angle connecting the first extension, a third turning angle connecting the second extension, and a second turning angle disposed between the first turning angle and the third turning angle, wherein the first turning angle, the second turning angle, and the third turning angle are arc-shaped. One end of the second extension extends toward the axis of the upright portion, and the second extension is provided with an opening, the width of which is smaller than the width of the accommodating space.

2. The top cover according to claim 1, wherein, The top cover also includes: The base is connected to the other end of the upright part, and an opening is provided in the base corresponding to the accommodating space.

3. The top cover according to claim 1, wherein, The material of the top cover is metal.

4. The top cover according to claim 1, wherein, The side of the top cover is provided with a groove.

5. A semiconductor packaging apparatus, comprising: The carrier is provided with a receiving cavity; A first electronic component is disposed in the receiving cavity and on the carrier; The second electronic component is stacked on top of the first electronic component; A filler adhesive is used to encapsulate the first electronic component and the second electronic component; The top cover is disposed on the carrier corresponding to the receiving cavity. The top cover includes an upright part, which is an annular column and surrounds the receiving space. One end of the upright part is provided with a first extension part, and one end of the first extension part extends outward from the receiving space. Wherein, a second extension is provided at one end of the first extension, and a turning part is provided between the first extension and the second extension; The turning portion includes a first turning angle connecting the first extension, a third turning angle connecting the second extension, and a second turning angle disposed between the first turning angle and the third turning angle, wherein the first turning angle, the second turning angle, and the third turning angle are arc-shaped. One end of the second extension extends toward the axis of the upright part, and the second extension is provided with an opening, the width of which is smaller than the width of the accommodating space. The upper cover has a groove on its side, and the device further includes: A waterproof rubber collar is fitted onto the side of the upper cover, corresponding to the groove.

6. The apparatus according to claim 5, wherein, The carrier includes a substrate and a sidewall disposed on the substrate, the sidewall surrounding the receiving cavity.

7. The apparatus according to claim 5, wherein, The second electronic component is provided with a sensor, which is at least partially exposed through the filler adhesive.

8. The apparatus according to claim 7, wherein, The surface of the second electronic component is covered with a protective layer, and the surface on which the sensor is located is exposed through the protective layer.

9. The apparatus according to claim 5, wherein, The top cover also includes: The base is connected to the other end of the upright part, and an opening is provided in the base corresponding to the accommodating space.

10. The apparatus according to claim 5, wherein, The material of the top cover is metal.

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