Separate wafer needle testing system

Abstract

The present application provides a kind of needle testing system, utilizes vacuum adsorption wafer, can adjust its vertical distance and carries out needle testing, with the loss caused by probe in long time use, the needle testing system of the present application can automatically adjust the height of vacuum suction nozzle, to achieve the best test needle pressure.

Description

Technical Field

[0001] This invention relates to a probe testing system, and more particularly to a probe testing system utilizing vacuum adsorption for inspecting wafers. Background Technology

[0002] In the general semiconductor device manufacturing process, the produced wafers are subjected to electrical checks during or after the process. Usually, a probe prober is used to move the wafer upwards to contact the probe for testing. However, this method cannot perform electrical measurements on discrete wafers and can easily cause damage to the movable parts of discrete wafers due to downward pressure. Summary of the Invention

[0003] To address the aforementioned problems, particularly for wafers with discrete structures, the present invention provides a probe testing system for inspecting a wafer. The probe testing system includes a vacuum nozzle for vacuum adsorption of at least one adsorption region on the surface of the wafer; and an electrical detection substrate having a plurality of probes electrically contacting a plurality of probe regions on the surface of the wafer.

[0004] This invention utilizes a movable structure on a vacuum-adsorbed wafer to adjust its vertical distance for probe testing. This enables automated mass production testing of discrete wafer structures (Wafer Sort or Circuit Probing). As the probe wears out over time, the probe testing system of this invention can automatically adjust the height of the vacuum nozzle to achieve optimal test probe pressure. Attached Figure Description

[0005] Figure 1 This is a top view of a split wafer.

[0006] Figure 2 for Figure 1 A schematic diagram of the needle detection system of the present invention with the A-A' tangent section in the unadsorbed state.

[0007] Figure 3 for Figure 1 A schematic diagram of the needle detection system of the present invention with the A-A' tangent section in an adsorption state.

[0008] Figure 4 This is a top view of a needle-testing system according to another embodiment of the present invention.

[0009] Figure 5 for Figure 4 Schematic diagram of the needle-testing system at the B-B' tangent section.

[0010] Figure 6 This is a schematic diagram of the adsorption process of an embodiment of the needle detection system of the present invention.

[0011] Figure 7 This is a schematic diagram of the adsorption process of another embodiment of the needle detection system of the present invention.

[0012] Explanation of reference numerals in the attached figures

[0013] 10. Split wafer

[0014] 101 Fixed Part

[0015] 102 Movable parts

[0016] 103 needle testing area

[0017] 104 Connection Area

[0018] 105 Adsorption Zone

[0019] 11 Flexible stents

[0020] 12 Actuators

[0021] 13 Vacuum nozzle

[0022] 133 Vacuum Channel

[0023] 14 probes

[0024] 15 Through Holes

[0025] 16. Branch pipes

[0026] 17 Lifting Shaft

[0027] 18 drive units

[0028] 19 Electrical detection substrate

[0029] A-A' tangent

[0030] B-B' tangent Detailed Implementation

[0031] The following details various embodiments of the present invention, illustrated in the accompanying drawings. Besides these detailed descriptions, the present invention can be widely implemented in other embodiments, and any easy substitutions, modifications, or equivalent changes to the described embodiments are included within the scope of the present invention and are subject to the claims. In the description of the specification, many specific details are provided to give the reader a more complete understanding of the present invention; however, the present invention may still be implemented even with some or all of these specific details omitted. Furthermore, well-known steps or elements are not described in the details to avoid unnecessarily limiting the present invention. Identical or similar elements in the drawings will be represented by the same or similar symbols. It should be noted that the drawings are for illustrative purposes only and do not represent the actual size or quantity of elements; some details are not fully drawn for the sake of simplicity.

[0032] Please see Figure 1 and Figure 2This is a top view of a split wafer and Figure 1 A schematic diagram of the probe testing system of the present invention with a tangential cross-section along line A-A' and in a non-adsorbed state. The present invention provides a probe testing system for inspecting wafers, particularly discrete wafers 10, which has a movable portion 102, a fixed portion 101, and an actuator 12. The fixed portion 101 can be fixed or placed on a platform (not shown), and multiple probe testing areas 103 on the surface of the movable portion 102 and multiple connection areas 104 on the surface of the fixed portion 101 are connected by multiple flexible supports 11. In this embodiment, the fixed portion 101 of the discrete wafer 10 is arranged around the movable portion 102, and the actuator 12 is disposed in the center of the movable portion 102 and connected thereto, enabling the movable portion 102 to move horizontally.

[0033] The needle-testing system of the present invention uses the vacuum channel 133 in the vacuum nozzle 13 to vacuum adsorb at least one adsorption area 105 on the surface of the movable part 102. When the vacuum nozzle 13 adsorbs the movable part 102, the movable part 102 will move vertically upward, such as... Figure 3 As shown, a plurality of probes 14 on the electrical detection substrate (not shown) make electrical contact with a plurality of probe areas 103 on the surface of the movable portion 102 for electrical detection. In some embodiments, the movable portion 102 and / or the fixed portion 101 of the discrete wafer 10 and the vacuum nozzle 13 may be multiple.

[0034] In one embodiment, the probe testing system of the present invention may further include a drive unit (not shown) connected to a platform and a vacuum nozzle 13, which enables the platform and the vacuum nozzle 13 to move vertically. The vertical movement distance can be measured by a measurement unit (not shown) measuring the distance between multiple probes 14 and the discrete wafer 10, and measuring the distance between multiple probes 14 and the vacuum nozzle 13. The distance signals are then transmitted to a control unit (not shown). After receiving the distance signals, the control unit transmits control signals to the drive unit to adjust the vertical position of the vacuum nozzle 13 and the discrete wafer 10.

[0035] Please see Figure 4 and Figure 5 This is a top view of a needle-measuring system according to another embodiment of the present invention. Figure 4 A schematic diagram of the probe testing system with a tangent section at B-B'. In this embodiment, the electrical detection substrate 19 has a through hole 15, a vacuum nozzle 13 is disposed in the through hole 15 and connected to a manifold 16, and the manifold 16 is connected to a drive unit 18 by a lifting shaft 17, and the drive unit 18 causes the vacuum nozzle 13 to move further vertically.

[0036] In one embodiment, when the vacuum nozzle 13 is in a ready state, the head of the vacuum nozzle 13 is at a distance H1 from the movable portion 102 of the discrete wafer 10, and is at the same height as the heads of the plurality of probes 14, such as... Figure 6As shown in (a), when the vacuum nozzle 13 is in operation and in an adsorption state, the movable part 102 moves vertically upward and contacts the multiple probes 14, as... Figure 6 As shown in (b), the drive unit 18 then moves the vacuum nozzle 13 vertically by a distance H2, causing the multiple probes 14 to generate a contact pressure with the discrete wafer 10, as shown in (b). Figure 6 As shown in (c).

[0037] In another embodiment, when the vacuum nozzle 13 is in the ready state, the head of the vacuum nozzle 13 is already at a distance H2 from the plurality of probes 14, such as Figure 7 As shown in (a), when the vacuum nozzle 13 is in operation and in an adsorption state, the movable part 102 moves vertically upward and directly contacts the multiple probes 14, generating a contact pressure, as... Figure 7 As shown in (b), when the vacuum nozzle 13 is in operation, the vertical movement distance of the movable part 102 is H1+H2, without the need for further adjustment of the vertical position of the vacuum nozzle 13.

[0038] The probe testing system of the present invention utilizes a movable structure on a vacuum adsorption-separated wafer to adjust its vertical distance for probe testing. As the probe wears out after prolonged use, the probe testing system of the present invention can automatically adjust the height of the vacuum nozzle to achieve optimal test needle pressure and realize the feasibility of mass production.

Claims

1. A probe testing system for inspecting a discrete wafer, the discrete wafer comprising a movable portion, a fixed portion, and an actuator, characterized in that, The probe testing system includes: A vacuum nozzle is used to vacuum adsorb at least one adsorption area on the surface of the wafer; An electrical detection substrate has multiple probes that are in electrical contact with multiple probe areas on the surface of the wafer. A platform for supporting the wafer, wherein the platform and the vacuum nozzle are located on different sides of the wafer; and A drive unit is connected to the vacuum nozzle; Before the wafer is vacuum-adsorbed, the multiple probes are at a first vertical distance from the wafer, and the vacuum nozzle is at the same vertical height as the multiple probes before vacuum adsorbing the wafer. When the vacuum nozzle operates to be in the adsorption state, the movable part moves vertically upward by the first distance and contacts the multiple probes and the vacuum nozzle. Then, the drive unit drives the vacuum nozzle, the movable part, and the multiple probes to move vertically upward by a second distance. Alternatively, the vacuum nozzle is positioned at a second distance from the plurality of probes in the vertical direction before vacuum adsorbing the wafer. When the vacuum nozzle is operated to be in the adsorption state, the movable part moves vertically upward a first distance and contacts the plurality of probes. Then, the movable part moves together with the plurality of probes a second distance, so that the movable part contacts the vacuum nozzle.

2. The probe testing system as described in claim 1, characterized in that, Also includes: A control unit, electrically connected to the drive unit, is used to transmit a control signal to the drive unit; and A measurement unit is electrically connected to the control unit. The measurement unit is used to measure the second distance between the plurality of probes and the vacuum nozzle or the first distance between the plurality of probes and the wafer, and transmits a distance signal to the control unit.

3. The needle probe system as described in claim 1, characterized in that, The electrical detection substrate has a through hole, and the vacuum nozzle is disposed in the through hole.

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