Evaluation method, evaluation system, and laser processing system

Abstract

The evaluation method is a method for evaluating laser processing for relatively moving an irradiation region (R1) of a laser beam with respect to an object (71) to perform processing of the object (71), and includes a measurement step and an evaluation step. The measurement step measures a change in intensity of light accompanying movement of a measurement region (R2) with respect to the object (71) to measure the change in intensity of light accompanying movement of the measurement region (R2). The evaluation step evaluates the laser processing based on the change in intensity of light accompanying movement of the measurement region (R2). The measurement step relatively moves the measurement region (R2) with respect to the object (71) so that a movement path (M2) of the measurement region (R2) has a plurality of intersection points (P3) with a movement path (M1) of the irradiation region (R1).

Description

Technical Field

[0001] Generally, this disclosure relates to evaluation methods, evaluation systems, and laser processing systems. More specifically, this disclosure relates to evaluation methods, evaluation systems, and laser processing systems that evaluate laser processing by using the light generated on an object caused by the irradiation of a laser beam onto the object. Background Technology

[0002] Existing laser welding quality evaluation methods randomly assess the quality of laser welding based on the peak intensity or integral value of the welding light (thermal radiation light, plasma light, and laser reflection light, etc.) generated in the molten region during laser welding. For example, Patent Document 1 uses the peak intensity of plasma light or reflected light generated in the molten region during laser welding to determine welding defects. Furthermore, Patent Document 2 uses the time integral intensity of reflected light, plasma light, and infrared light generated in the molten region during laser welding to determine welding defects.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent No. 3154177

[0006] Patent Document 2: Japanese Patent Application Publication No. 2007-98442 Summary of the Invention

[0007] One aspect of this disclosure is an evaluation method for laser processing, in which a laser beam from a laser oscillator is moved relative to an irradiation area of ​​an object to process the object. The evaluation method includes a measurement step and an evaluation step. In the measurement step, the measurement area of ​​a photometer used to measure light intensity is moved relative to the object, and the photometer measures the change in light intensity accompanying the movement of the measurement area. The evaluation step evaluates the laser processing based on the change in light intensity accompanying the movement of the measurement area, as measured in the measurement step. The measurement step moves the measurement area relative to the object such that the movement path of the measurement area intersects the movement path of the irradiation area at multiple points.

[0008] One aspect of this disclosure is a laser processing evaluation system that processes an object by moving a laser beam from a laser oscillator relative to the object in an irradiation area. The evaluation system includes processing devices for performing measurement processing and evaluation processing. In the measurement processing, the measurement area of ​​a photometer used to measure light intensity is moved relative to the object, and the photometer measures the change in light intensity accompanying the movement of the measurement area. The evaluation processing evaluates the laser processing based on the change in light intensity accompanying the movement of the measurement area, as measured by the measurement processing. The measurement processing moves the measurement area relative to the object such that the movement path of the measurement area intersects the movement path of the irradiation area at multiple points.

[0009] One aspect of this disclosure is a laser processing system. The laser processing system includes: a laser oscillator for irradiating a laser beam onto an object; a photometer for measuring the intensity of the light; and a processing unit connected to the laser oscillator and the photometer. The processing unit performs processing, measurement, and evaluation processing. The processing involves moving the irradiation area of ​​the laser beam from the laser oscillator relative to the object to process the object. The measurement processing involves moving the measurement area of ​​the photometer relative to the object, and measuring the change in light intensity accompanying the movement of the measurement area. The evaluation processing evaluates the processing based on the change in light intensity accompanying the movement of the measurement area, as measured by the measurement processing. The measurement processing moves the measurement area relative to the object such that the movement path of the measurement area intersects the movement path of the irradiation area at multiple points. Attached Figure Description

[0010] Figure 1 This is a block diagram illustrating a structural example of a laser processing system according to one embodiment.

[0011] Figure 2 yes Figure 1 A flowchart of the operation of a laser processing system.

[0012] Figure 3 This indicates that there is an abnormality in the molten part of the object. Figure 2 The diagram illustrates the relationship between the measured waveform obtained from the measurement process and the object.

[0013] Figure 4 yes Figure 2 An explanatory diagram showing the appearance of the object before processing.

[0014] Figure 5 yes Figure 2 An explanatory diagram showing the appearance of the object after processing.

[0015] Figure 6 It means Figure 2 The graph shows an example of the relationship between the laser beam irradiation time and output during processing.

[0016] Figure 7 yes Figure 2 The image shows an actual photograph of the object's appearance after processing.

[0017] Figure 8 yes Figure 1 A diagram illustrating the operation of the measurement system within the laser processing system.

[0018] Figure 9 yes Figure 1 Another diagram illustrating the operation of the measurement system in the laser processing system.

[0019] Figure 10 yes Figure 1 Another diagram illustrating the operation of the measurement system in the laser processing system.

[0020] Figure 11 yes Figure 2 This diagram illustrates an example of how the movement path of the measurement area is set in the measurement process.

[0021] Figure 12 This indicates that there is an abnormality in the molten part of the object. Figure 2 The diagram illustrates the relationship between the measured waveform obtained from the measurement process and the object.

[0022] Figure 13 This indicates that there is an abnormality in the molten part of the object. Figure 2 Another diagram illustrating the relationship between the measured waveform obtained from the measurement process and the object.

[0023] Figure 14 This indicates that there is an anomaly on one side of the molten part of the object. Figure 2 The diagram illustrates the relationship between the measured waveform obtained from the measurement process and the object.

[0024] Figure 15 This indicates that there is an anomaly on the other side of the molten part of the object. Figure 2 The diagram illustrates the relationship between the measured waveform obtained from the measurement process and the object.

[0025] Figure 16 This indicates that there is an anomaly on the other side of the molten part of the object. Figure 2 Another diagram illustrating the relationship between the measured waveform obtained from the measurement process and the object.

[0026] Figure 17This is an explanatory diagram illustrating the movement of the measurement area during the measurement treatment of Comparative Example 1.

[0027] Figure 18A This is an explanatory diagram showing the relationship between the measurement waveform obtained through the measurement process of Comparative Example 1 and the object.

[0028] Figure 18B This is another explanatory diagram showing the relationship between the measurement waveform obtained through the measurement process of Comparative Example 1 and the object.

[0029] Figure 18C This is another explanatory diagram showing the relationship between the measurement waveform obtained through the measurement process of Comparative Example 1 and the object.

[0030] Figure 18D This is another explanatory diagram showing the relationship between the measurement waveform obtained through the measurement process of Comparative Example 1 and the object.

[0031] Figure 19A This is an explanatory diagram showing the relationship between the measurement waveform obtained through the measurement process of Comparative Example 2 and the object.

[0032] Figure 19B This is an explanatory diagram showing the relationship between the measurement waveform obtained through the measurement process of Comparative Example 3 and the object.

[0033] Figure 20 This is an explanatory diagram showing the relationship between the measured waveform obtained through the measurement process of the modified example and the object.

[0034] -Symbol Explanation-

[0035] 1. Laser processing system

[0036] 21 Laser Oscillator

[0037] 3 Measurement System

[0038] 31. Light meter

[0039] 33 Optical components

[0040] 36 Adjustment device

[0041] 5. Processing device

[0042] 71 Objects

[0043] L1 laser beam

[0044] L2 light

[0045] R1 Irradiation Area

[0046] R2 measurement area

[0047] M1 movement path

[0048] M2 movement path

[0049] P3 intersection

[0050] D1 Movement direction

[0051] S1 Processing

[0052] S2 Measurement Processing

[0053] S3 Evaluation Processing. Detailed Implementation

[0054] Previous methods for evaluating laser welding quality aligned the monitoring area (measurement area) with the laser irradiation location, measuring light intensity only within the molten region. Therefore, they could not accurately detect melting anomalies occurring around the weld area, even if not within the molten region itself. Specifically, they could not accurately detect whisker-like molten material or spatter adhering to the outer edge of the molten region.

[0055] This disclosure provides an evaluation method, an evaluation system, and a laser processing system that can improve the accuracy of laser processing evaluation.

[0056] The embodiments will now be described in detail with appropriate reference to the accompanying drawings. However, unnecessary details may be omitted. For example, detailed descriptions of known matters and repetitive descriptions of substantially the same structures may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Furthermore, the inventors have provided the drawings and the following description to enable those skilled in the art to fully understand this disclosure, but do not intend to limit the subject matter of the claims by these.

[0057] (Implementation Method)

[0058] [1-1. Summary]

[0059] Figure 1 This is a block diagram illustrating a structural example of a laser processing system 1 according to one embodiment. The laser processing system 1 includes: a laser oscillator 21, a photometer 31, and a processing device 5. The laser processing system 1 processes an object 71 by irradiating it with a laser beam L1 from the laser oscillator 21. Figure 1 In this process, laser processing system 1 is used for laser welding to join object 71 to another object 72. Object 72 is positioned below object 71. By irradiating object 71 with laser beam L1 and melting a portion of object 71 and object 72 to form a molten portion 74, object 71 and object 72 are fused together.

[0060] In the laser processing system 1, the processing device 5 is as follows: Figure 2As shown, the processing steps are S1, S2, and S3, respectively.

[0061] Processing S1 such as Figure 3 As shown, the laser beam L2 from the laser oscillator 21 is moved relative to the irradiation area R1 of the object 71 to process the object 71. Figure 3 In the process S1, the irradiation area R1 is moved relative to the object 71 from the initial irradiation area R1s to the final irradiation area R1e. The movement path M1 of the irradiation area R1 is set to obtain the desired shape of the molten portion 74. Figure 3 In the middle, the molten part 74 is linear, and the moving path M1 is also linear.

[0062] Measurement treatment S2 as Figure 1 As shown, the intensity of light L2 from object 71 resulting from the irradiation of object 71 by laser beam L1 is measured. Figure 1 In the diagram, for ease of understanding, laser beams L1 and L2 are depicted offset, but they are actually coaxial. Measurement processing S2 is as follows... Figure 3 As shown, the measurement area R2 of the photometer 31 is moved relative to the object 71, and the photometer 31 measures the change in the intensity of light L2 accompanying the movement of the measurement area R2. Figure 3 In the process, the measurement area R2 moves relative to the object 71 from the initial measurement area R2s to the final measurement area R2e. Specifically, the measurement process S2 moves the measurement area R2 relative to the object 71 such that the movement path M2 of the measurement area R2 has the movement path M1 of the irradiated area R1 and multiple intersection points P3.

[0063] Evaluation process S3 assesses laser processing based on the change in intensity of light L2 accompanying the movement of the measurement region R2 as measured by measurement process S2. The change in intensity of light L2 accompanying the movement of the measurement region R2... Figure 3 The diagram illustrates the change in signal strength over time. Signal strength is the intensity of the detection signal from measurement system 3, which corresponds to the intensity of light L2.

[0064] exist Figure 1In the laser processing system 1, the measurement process S2 moves the measurement area R2 relative to the object 71, such that the movement path M2 of the measurement area R2 intersects the movement path M1 of the irradiation area R1 at multiple points P3. The measurement process S2 does not ensure that the movement path M1 of the measurement area R2 is always consistent with that of the irradiation area R1; instead, it sets up the measurement area R2 in areas where the movement path M1 differs from that of the irradiation area R1. Therefore, the evaluation process S3 evaluates not only laser processing anomalies in areas consistent with the movement path M1 of the irradiation area R1 based on the intensity of light L2, but also laser processing anomalies in areas where the movement path M1 differs from that of the irradiation area R1. Therefore, through... Figure 1 The laser processing system 1 can improve the accuracy of laser processing evaluation.

[0065] [1-2. Details]

[0066] The following is about Figure 1 The laser processing system 1 will be described in further detail. The laser processing system 1 includes a laser irradiation system 2, a measuring system 3, a moving system 4, and a processing device 5.

[0067] [1-2-1. Laser Irradiation System]

[0068] exist Figure 1 In this laser irradiation system 2, a laser beam L1 is irradiated onto the object 71 for laser processing. The laser irradiation system 2 includes a laser oscillator 21, a collimating lens 22, a dichroic mirror 23, and a condenser lens 24. The laser oscillator 21 outputs the laser beam L1 for laser processing of the object 71. The wavelength of the laser beam L1 is, for example, 1070 nm, but can be appropriately set. The laser beam L1 can be a continuous wave or a pulsed wave. The collimating lens 22, the dichroic mirror 23, and the condenser lens 24 constitute the optical system that guides the laser beam L1 to the object 71. Figure 1 In this process, the laser beam L1 output from the laser oscillator 21 is converted into a parallel beam by the collimating lens 22, reflected at a right angle to the object 71 by the dichroic mirror 23, focused by the condenser lens 24, and then irradiates the object 71. The surface of the dichroic mirror 23 performs total internal reflection of light with the same wavelength as the laser beam L1, and is specially coated to transmit light with a wavelength different from that of the laser beam L1.

[0069] [1-2-2. Measurement System]

[0070] Figure 1In this system, the measurement system 3 measures the intensity of light L2 generated at the object 71 during laser processing and outputs a detection signal representing the intensity of light L2. Light L2 may include, for example, thermal radiation light resulting from the melting of the object 71 due to the irradiation of the laser beam L1 onto it. The intensity of the thermal radiation light is corresponding to the melting state, such as melting temperature and melting area. Furthermore, light L2 may include not only thermal radiation light but also reflected light from the object 71 by the laser beam L1 and inherent light generated by the excitation of the material of the object 71. The measurement system 3 includes: a photometer 31, a detection signal amplifier 32, an optical component 33, a bandpass filter 34, an imaging lens 35, and an adjustment device 36.

[0071] The photometer 31 measures the intensity of light L2 at the measurement area R2. The photometer 31 includes a light-receiving sensor. The photometer 31 measures the intensity of light L2 incident on the light-receiving sensor and outputs a detection signal representing the intensity of light L2 to a detection signal amplifier 32. The detection signal amplifier 32 amplifies the detection signal from the photometer 31 and outputs it to the processing device 5.

[0072] The optical component 33, the bandpass filter 34, and the imaging lens 35 constitute an optical system for setting the measurement area R2 of the photometer 31 on the object 71.

[0073] Optical component 33 is positioned on the opposite side of dichroic mirror 23 from condenser lens 24. Optical component 33 guides light L2 from measurement area R2 to photometer 31. Optical component 33 can adjust its position relative to photometer 31 so that measurement area R2 can move relative to object 71. Figure 1 In this optical component 33, the optical element 33 is capable of rotating clockwise and counterclockwise. The position of the optical element 33 relative to the photometer 31 is the rotational position of the optical element 33 about its rotation axis. The optical element 33 may include, for example, a movable total internal reflection mirror. The movable total internal reflection mirror may be, for example, a current mirror. The current mirror is capable of rotating with high precision and high speed. In the optical element 33, the rotation axis of the movable total internal reflection mirror is along the movement direction D2 of the stage 41. Therefore, the optical element 33 can move the measurement area R2 in a direction orthogonal to the movement direction D2 of the stage 41, but cannot move the measurement area R2 in the movement direction D2 of the stage 41. The optical element 33 is configured such that, regardless of the rotation of the optical element 33, the measurement area R2 coincides with the illumination area R1 in the movement direction D2. Figure 1 In the middle, the optical component 33 can rotate clockwise and counterclockwise.

[0074] A bandpass filter 34 and an imaging lens 35 are sequentially positioned between optical component 33 and photometer 31. The bandpass filter 34 allows light of a specified wavelength to pass through and be incident on the imaging lens 35. The specified wavelength range is, for example, 1300 nm to 1350 nm. In this case, only light in the 1300 nm to 1350 nm wavelength range is incident on the photometer 31. The imaging lens 35 uses the photometer 31 to image the light L2 passing through the bandpass filter 34. Figure 1 In the optical system, light L2 from the measurement area R2 passes through the condenser lens 24 and the dichroic mirror 23 and is incident on the optical component 33. The light L2 incident on the optical component 33 is reflected by the optical component 33, passes through the bandpass filter 34 and the imaging lens 35, and is incident on the photometer 31.

[0075] The adjustment device 36 adjusts the position of the optical component 33 relative to the photometer 31. Figure 1 In this configuration, the optical component 33 is capable of rotating clockwise and counterclockwise. The adjustment device 36 is, for example, a motor driver that controls the motor that rotates the optical component 33.

[0076] [1-2-3. Mobile System]

[0077] exist Figure 1 In this process, the moving system 4 moves the object 71 relative to the irradiation area R1 of the laser beam L1 from the laser irradiation system 2. The moving system 4 includes a worktable 41 and a moving device 42. The worktable 41 supports the object 71 to be laser-processed. Figure 1 In this configuration, object 72 is positioned below object 71. Objects 71 and 72 are fixed to the worktable 41. The moving device 42, equipped with a power source such as a motor, moves the worktable 41. As the worktable 41 moves, both object 71 and object 72 also move. Figure 1 In the middle, the moving device 42 causes the worktable 41 to move along the same path as the worktable 41. Figure 1 It moves in a straight line in a direction orthogonal to the paper. Figure 1 The laser processing system 1 and the worktable 41 move in sync, irradiating the object 71 with the laser beam L1, thereby joining the object 71 and the object 72 by laser welding.

[0078] [1-2-4. Processing device]

[0079] Figure 1 In this system, the processing device 5 is connected to the laser irradiation system 2, the measurement system 3, and the moving system 4. The processing device 5 performs overall control of the laser processing system 1. The processing device 5 has the function of synchronously controlling the laser oscillator 21, the adjustment device 36, and the moving device 42, and performing calculation and processing of the detection signal from the detection signal amplifier 32.

[0080] Processing device 5, such as Figure 2 As shown, processing steps S1, measurement steps S2, and evaluation steps S3 are performed. The processing device 5 can be implemented, for example, by a computer system containing one or more processors (microprocessors) and one or more memories. Processing steps S1, measurement steps S2, and evaluation steps S3 are performed by executing programs (stored in one or more memories) through one or more processors. Here, the program is pre-recorded in one or more memories, but it can also be provided via electrical communication lines such as the Internet, or via a non-transitory recording medium such as a memory card.

[0081] [1-2-4-1. Processing]

[0082] Processing S1 such as Figure 3 As shown, the laser beam L1 from the laser oscillator 21 is moved relative to the irradiation area R1 of the object 71 to process the object 71. Figure 4 yes Figure 3 An explanatory diagram showing the appearance of the object 71 before processing S1. Figure 4 (a) and Figure 4 (b) represents the cross-section and top view of object 71 before processing S1, respectively. Figure 4 As shown in (b), a predetermined melting region 73 is set in object 71 for melting and joining object 71 and object 72.

[0083] Processing S1 moves the irradiation area R1 relative to the object 71 so that the object 71 melts in the predetermined melting area 73. Processing S1 moves the object 71 and 72 by moving the worktable 41 via the moving system 4, thereby moving the irradiation area R1 relative to the object 71. The direction D1 of the relative movement of the irradiation area R1 relative to the object 71 is opposite to the direction D2 of the movement of the worktable 41. Figure 4 In this context, the irradiation area R1 is the region centered on the irradiation position P1 of the laser beam L1 onto the object 71. The irradiation area R1 is, for example, the region where the object 71 is melted by the irradiation of the laser beam L1 onto it. The irradiation area R1 is circular, and its diameter is equal to the width of the predetermined melting area 73.

[0084] Figure 5 This is an explanatory diagram of the appearance of the object after processing S1. Figure 5 (a) and Figure 5 (b) represents the cross-section and top view of object 71 after processing S1, respectively.

[0085] Figure 5(c) represents the cross-section of the object 71 after processing S1, located at the plane orthogonal to the movement direction D1. For example... Figure 5 (a) and Figure 5 As shown in (b), the processing S1 moves the irradiation area R1 relative to the object 71 from the irradiation area R1 corresponding to the initial irradiation position P1s to the irradiation area R1 corresponding to the final irradiation position P1e. ​​Thus, as... Figure 5 As shown in (a) to (c), the portion corresponding to the predetermined melting region 73 melts on the objects 71 and 72, forming a molten portion 74 of a certain depth. The movement path M1 of the irradiation region R1 is determined according to the shape of the predetermined melting region 73. The predetermined melting region 73 is set to obtain the desired shape of the molten portion 74. Figure 5 In the middle, the molten part 74 is linear, and the moving path M1 is also linear.

[0086] Figure 6 This is a graph illustrating an example of the relationship between the irradiation time [ms] and output [w] of the laser beam L1 in processing S1. The output waveform of the laser beam L1 is a trapezoidal waveform, including a rising section, a flat section, and a falling section. The output w1 of the laser beam L1 in the flat section is, for example, 400W. The total irradiation time t1 of the laser beam L1 is, for example, 4ms. The rising and falling sections are provided to prevent spatter and dents during laser welding. Thus, the output waveform of the laser beam L1 is a trapezoidal waveform, therefore... Figure 5 As in (b), the shape of the molten portion 74 is also an inverted trapezoid. Furthermore, the moving system 4 moves the worktable 41 at a speed of 500 mm / s. The width of the predetermined melting area 73 and the molten portion 74 is approximately 300 μm. The depth of the molten portion 74 is approximately 400 μm.

[0087] Figure 7 It is an actual photograph of the appearance of object 71 after processing S1. Figure 7 In the diagram, object 71 is an aluminum plate with a thickness of 0.2 mm. Object 72 is an aluminum plate with a thickness of 1.0 mm.

[0088] Figure 7 (a) is a photograph of the appearance of object 71 under normal conditions when the molten portion 74 of object 71 is free from abnormalities. Under normal conditions, the molten portion 74 has a certain width and conforms to the shape of the moving path M1 of the irradiation area R1 of the laser beam L1.

[0089] Figure 7 (b) is a photograph of the appearance of object 71 when there is an abnormality in the molten part 74 of object 71. Figure 7 In (b), an abnormal part 75 is generated near the center of the molten part 74. Figure 7In (b), the abnormal part 75 is, for example, a hole. The abnormal part 75 is caused by a perforation. A perforation is a state where a part of the predetermined melting area 73 is not properly melted, there is an opening in the object 71, or the melting part 74 is recessed, indicating insufficient melting. In addition to holes, the abnormal part 75 may also be a protrusion, a depression, etc. When such an abnormal part 75 occurs, the temperature at the abnormal part 75 is higher than that at the melting part 74, and therefore the intensity of light L2 also increases. Therefore, if there is an abnormal peak in the change of light L2 intensity, it can be inferred that an abnormality occurs at the location where the peak occurs.

[0090] Figure 7 (c) A photograph of the appearance of object 71 when an anomaly exists around the molten portion 74 of object 71. Figure 7 In (c), an abnormal part 76 is generated on one side of the molten portion 74 of the object 71. The abnormal part 76 is located on the side orthogonal to the moving direction D1 of the laser beam L1 relative to the molten portion 74. Figure 7 (c) The upper side of the molten portion 74. Due to the presence of the abnormal portion 76, the width of the molten portion 74 increases near the abnormal portion 76. The abnormal portion 76 is formed, for example, due to excessive heat generated when there are foreign objects such as resin between the object 71 and the object 72, causing the object 71 to melt outside the predetermined melting area 73.

[0091] Figure 7 (d) is a photograph of the appearance of object 71 when an anomaly exists around the molten portion 74 of object 71. Figure 7 In (d), an abnormal part 76 is generated on the other side of the molten part 74 of the object 71. The abnormal part 76 is located on the opposite side from the molten part 74, orthogonal to the moving direction D1 of the laser beam L1. Figure 7 (d) The lower side of the molten portion 74. Due to the presence of the abnormal portion 76, the width of the molten portion 74 increases near the abnormal portion 76. The abnormal portion 76 is formed, for example, due to excessive heat generated when there are foreign objects such as resin between the object 71 and the object 72, causing the object 71 to melt outside the predetermined melting area 73.

[0092] Therefore, abnormalities may occur during laser processing in process S1. Figure 1 The laser processing system 1 executes an evaluation method for evaluating the processing in processing S1. The evaluation method includes a measurement step and an evaluation step. The measurement step corresponds to... Figure 2 The determination process S2. The evaluation steps correspond to... Figure 2 Evaluation processing S3.

[0093] [1-2-4-2. Measurement Processing]

[0094] Measurement treatment S2 as Figure 1 As shown, the intensity of light L2 from object 71 caused by the irradiation of object 71 by laser beam L1 is measured using measurement system 3. Measurement process S2 is executed in parallel with processing process S1. Measurement process S2 is as follows... Figure 3 As shown, the measurement area R2 of the photometer 31 is moved relative to the object 71, and the photometer 31 measures the change in the intensity of light L2 that accompanies the movement of the measurement area R2. The position of the measurement area R2 is referenced to the position of the center P2 of the measurement area R2. Figure 3 In the process, the measurement area R2 moves relative to the object 71 from the initial measurement area R2s to the final measurement area R2e. Specifically, the measurement process S2 moves the measurement area R2 relative to the object 71 such that the movement path M2 of the measurement area R2 intersects the movement path M1 of the irradiation area R1 at multiple intersection points P3. Further, the measurement process S2 moves the measurement area R2 relative to the object 71 such that at at least one of the multiple intersection points P3, the measurement area R2 overlaps with at least a portion of the irradiation area R1.

[0095] exist Figure 1 In the measurement system 3 of the laser processing system 1, the adjustment device 36 can adjust the position of the optical component 33 relative to the photometer 31. By adjusting the position of the optical component 33 relative to the photometer 31, the position of the measurement area R2 on the object 71 can be adjusted.

[0096] Figures 8-10 This is an explanatory diagram of the operation of the measuring system 3. Additionally, in Figure 9 (a) and Figure 10 In (a), the illustration of the processing device 5 is omitted for the sake of simplicity. Furthermore, Figures 8-10 In the width direction of the molten part 74, the size of the measuring region R2 is the same as the size of the molten part 74.

[0097] Figure 8 yes Figure 1 An enlarged view of the area R1 irradiated by the laser beam L1 of object 71. Figure 1 In this configuration, the optical component 33 is in a basic position relative to the photometer 31. In this basic position, the rotation angle of the optical component 33 is set such that the optical axis of the light L1 passing through the condenser lens 24 is aligned with the optical axis of the laser beam L1 passing through the condenser lens 24. In other words, with the optical component 33 in its basic position, the measurement area R2 is located on the molten portion 74 and coincides with the irradiation area R1. Therefore, the photometer 31 is able to measure the intensity of the light L2 from the molten portion 74. Figure 3In this context, the measurement area R21 corresponds to the case where the optical component 33 is in its basic position. The center P2 of the measurement area R21 coincides with the illumination position P1 of the illumination area R1 and the intersection point P3.

[0098] Figure 9 In this position, the optical component 33 is in a first position relative to the photometer 31. The first position is the position where the optical component 33 has rotated clockwise from its base position. In the first position, as... Figure 9 As shown in (a), the rotation angle of the optical component 33 is set such that the optical axis of the light L1 passing through the condenser lens 24 has a predetermined first angle relative to the optical axis of the laser beam L1 passing through the condenser lens 24. Figure 9 (b) is Figure 9 A magnified view of the area near R1 irradiated by the laser beam L1 of object 71 in (a). Figure 9 As shown in (b), the specified first angle is, for example, set such that the measuring region R2 is not located on the molten part 74 but on one side of the width direction of the molten part 74. Figure 9 (Left side of (b)). In other words, when the optical component 33 is in the first position, the measurement area R2 is not on the molten part 74 and does not overlap with the irradiation area R1. In this case, the photometer 31 is able to measure the intensity of light L2 from the area on one side of the molten part 74 in the width direction. Figure 3 In the measurement area R22, the optical component 33 is in the first position.

[0099] Figure 10 In this position, the optical component 33 is in a second position relative to the photometer 31. The second position is the position where the optical component 33 has rotated counterclockwise from its basic position. In the second position, as... Figure 10 As shown in (a), the rotation angle of the optical component 33 is set such that the optical axis of the light L1 passing through the condenser lens 24 has a predetermined second angle relative to the optical axis of the laser beam L1 passing through the condenser lens 24. Figure 10 (b) is Figure 10 A magnified view of the area near R1 irradiated by the laser beam L1 of object 71 in (a). Figure 10 As shown in (b), the specified second angle is, for example, set such that the measuring region R2 is not located on the molten portion 74, but on the other side of the width direction of the molten portion 74. Figure 10 (The right side of (b)). In other words, when the optical component 33 is in the second position, the measurement area R2 is not on the molten part 74 and does not overlap with the irradiation area R1. In this case, the photometer 31 is able to measure the intensity of light L2 from the area on the other side of the width direction of the molten part 74. Figure 3 In the measurement area R23, the optical component 33 is in the second position.

[0100] like Figures 8-10 As shown, the measurement process S2 adjusts the position of the optical component 33 relative to the photometer 31 by using the adjustment device 36 of the measurement system 3, so that the measurement area R2 moves relative to the object 71.

[0101] Determination of treatment S2 in Figure 5 (a) and Figure 5 The direction of movement D1 of the irradiation area R1 shown in (b) causes the measurement area R2 to move relative to the object 71, so that the measurement area R2 overlaps with at least a portion of the irradiation area R1. Figure 1 In the laser processing system 1, the moving system 4 moves the object 71 together with the worktable 41 in the moving direction D2. The measurement area R2 is aligned with the irradiation area R1 in the moving direction D2. Therefore, by simply moving the object 71 together with the worktable 41 in the moving direction D2, the moving system 4 achieves a relative movement of the object 71 in the moving direction D1 while the measurement area R2 is aligned with the irradiation area R1.

[0102] On the other hand, the measurement process S2 measures the reciprocating motion of the measurement area R2 relative to the object 71 in a predetermined direction intersecting the movement direction D1 of the irradiated area R1, using the movement path M1 of the irradiated area R1 as a reference. The predetermined direction is, for example, a direction orthogonal to the movement direction D1. Figure 5 The width direction of the molten portion 74 shown in (c) Figure 5 (c) in the left and right direction). Measurement process S2 adjusts the optical component 33 by adjusting device 36. Figure 9 The first position shown is... Figure 10 The device moves back and forth between the second position shown. The basic position is the midpoint between the first and second positions. Thus, the measurement area R2 moves back and forth relative to the object 71 in a specified direction, with the movement path M1 of the irradiation area R1 as a reference.

[0103] During the reciprocating movement of the measurement area R2 based on the adjustment device 36, the moving system 4 also causes the object 71 to move together with the worktable 41 in the moving direction D2, so the measurement area R2 is as follows: Figure 3 As shown, the object 71 is moved relative to the measurement area R2 so that the movement path M2 is serpentine. Thus, the measurement process S2 is as follows: Figure 3As shown, the measurement area R2 is moved relative to the object 71 so that the movement path M2 of the measurement area R2 is serpentine. Furthermore, in the movement direction D1 of the irradiation area R1, the measurement area R2 coincides with the irradiation area R1. When the optical component 33 is in its basic position, in a direction orthogonal to the movement direction D1 of the irradiation area R1, the measurement area R2 also coincides with the irradiation area R1. Therefore, at multiple intersection points P3 of the movement path M2 of the measurement area R2 and the movement path M1 of the irradiation area R1, the measurement area R2 overlaps with the irradiation area R1.

[0104] Figure 11 This is an explanatory diagram illustrating an example of how the movement path M2 of the measurement area R1 in the measurement process S2 is set. Figure 11 This indicates the state of object 71 during laser processing.

[0105] like Figure 11 As shown, the measurement process S2 aligns the measurement area R2 in a predetermined direction consistent with the width direction of the molten portion 74. Figure 11 The measurement path M2 moves back and forth in the specified direction (up and down). The specified width W is the scanning width of the measurement area R2. The specified width W is the width of the movement path M2 in the specified direction. The specified width W is the distance between measurement areas R22 and R23 in the specified direction.

[0106] The specified width W is set such that the state around the molten portion 74 of the object 71 can be evaluated in the width direction of the molten portion 74. For example, the specified width W is set such that the intensity of light L2 at least on both sides of the molten portion 74 in the width direction can be evaluated. If the width of the molten portion 74 is set to d [mm], then the specified width W is set to satisfy W ≥ 2 × d. The width of the molten portion 74 is equal to the width of the predetermined melting region 73 of the object 71 based on the irradiation of the object 71 by the laser beam L1.

[0107] On the other hand, in the movement path M2 of the measurement area R2, the scanning interval in the melting section 74 is set to P [mm], and the end spacing at the ends of the reciprocating movement of the measurement area R2 is set to Pt [mm]. The scanning interval P is the distance between the centers P2 of the measurement area R21 when the optical component 33 is in the basic position. The end spacing Pt is the distance between the centers P2 of the measurement area R22 when the optical component 33 is in the first position, or the distance between the centers P2 of the measurement area R23 when the optical component 33 is in the second position.

[0108] Furthermore, the moving speed of the irradiation area R1 is set to V [mm / s], and the reciprocating frequency of the measurement area R2 in a specified direction is set to F [Hz]. The moving speed V is based on the speed of the stage 41 of the moving system 4. The frequency F is based on the reciprocating frequency of the optical component 33 of the adjustment device 36 of the measurement system 3. The frequency F is, for example, the reciprocal of the time taken for the optical component 33 to move from the first position and return to the first position.

[0109] In this case, the scan spacing P is P = V / (F / 2). The end spacing Pt is Pt = P / 2. Therefore, the end spacing Pt is Pt = V / F.

[0110] The end-to-end spacing Pt is set such that the entire molten portion 74 of the object 71 can be evaluated in the moving direction D1 of the irradiation area R1. Here, if the size of the measurement area R2 in the moving direction D1 of the irradiation area R1 is set to D [mm], then the end-to-end spacing Pt is set to satisfy Pt≤D.

[0111] Based on the above, the frequency F of round trip in the specified direction of the measurement area R2 is set to satisfy F≥V / D.

[0112] As described above, by setting the width W and frequency F of the movement path M2, it is possible to evaluate the overall state of the molten part 74 in the movement direction D1 of the irradiation area R1, and to evaluate the state around the molten part 74 of the object 71 in a predetermined direction intersecting the movement direction D1 of the irradiation area R1.

[0113] In laser processing system 1, if the size of the measurement area R2 is set as dm [mm], it is expressed as dm=ds×f1 / f2. Figure 11 In this context, the measuring distance R2 is a circular region. The size of the measuring region R2 is equal to its diameter. In other words, dm = D. Here, ds [mm] is the size of the light-receiving part of the light meter 31. The light-receiving part is, for example, circular. The size of the light-receiving part is equal to its diameter. f1 [mm] is the focal distance of the condenser lens 24. f2 [mm] is the focal distance of the imaging lens 35 relative to the light meter 31.

[0114] Thus, the size dm of the measurement area R2 is set according to the size ds of the light-receiving part of the photometer 31, the focal distance f1 of the condenser lens 24, and the focal distance f2 of the imaging lens 35 relative to the photometer 31. By adjusting ds, f1, and f2, the size dm of the measurement area R2 can be adjusted. Figure 11In this process, the size dm of the measurement area R2 is equal to the width d of the molten part 74. For example, if the width d of the molten part 74 is 300 μm, the size ds of the light-receiving part of the photometer 31 can be set to 300 μm, f1 can be set to 100 mm, and f2 can be set to 100 μm.

[0115] The above-described measurement process S2 is as follows: Figure 3 As shown, measurement process S2 moves the measurement area R2 relative to the object 71 from the initial measurement area R2s to the final measurement area R2e. The photometer 31 outputs a detection signal representing the intensity of light L2 from the measurement area R2. The detection signal from the photometer 31 is amplified by the detection signal amplifier 32 and input to the processing device 5. The processing device 5 is as follows... Figure 3 As shown, a measurement waveform representing the change in the intensity of the detection signal with respect to elapsed time is obtained. The elapsed time corresponds to the distance the measurement area R2 moves along the moving path M2. Measurement processing S2 is executed in parallel with processing processing S1. In other words, laser processing is performed, and the measurement area R2 moves back and forth in the vertical direction relative to the irradiation area R1 in the direction D1. Therefore, the intensity of light L2 from the measurement area R2 weakens as it moves away from the molten part 74, reaching its minimum at the very end, and then reaching its maximum when passing through the molten part 74. Therefore, the measurement waveform is... Figure 3 The diagram shows a sine wave. Figure 3 This indicates the measurement waveform obtained by measuring the melt portion 74 of the object 71 when there is no abnormality.

[0116] In more detail, Figure 3 In the diagram, ts corresponds to the initial measurement region R2s. Measurement region R2s is located in the width direction of the molten portion 74, at the same position as measurement region R22. Measurement region R22 is furthest from the molten portion 74 and does not coincide with the irradiation region R1. Therefore, the signal intensity is at its minimum at ts. t11, t12, t13, and t14 correspond to measurement regions R21, R23, R21, and R22, respectively. Measurement region R21 coincides with the irradiation region R1 on the molten portion 74. Therefore, the signal intensity is at its maximum at t11 ​​and t13. Measurement regions R22 and R23 are furthest from the molten portion 74 and do not coincide with the irradiation region R1. Therefore, the signal intensity is at its minimum at t12 and t14. Te corresponds to the final measurement region R2e. Measurement region R2e is located in the width direction of the molten portion 74, at the same position as measurement region R23. Therefore, the signal intensity is at its minimum at te. Thus, the change in the intensity of the detection signal over time corresponds to the change in the intensity of light L2 that accompanies the movement of the measurement region R2 measured by the measurement process S2. Figure 3The measured waveforms include a normal molten waveform A1 and a normal unmolded waveform A2. The normal molten waveform A1 represents the signal intensity change near its maximum value in the variation of light L2 intensity as the measurement region R2 moves. When the optical component 33 is in its basic position, the signal intensity is maximum in the measurement region R21, which corresponds to the molten portion 74 of the object 71. Therefore, the normal molten waveform A1 represents the waveform of the normal intensity of light L2 from the molten portion 74. The normal unmolded waveform A2 represents the signal intensity change near its minimum value in the variation of light L2 intensity as the measurement region R2 moves. When the optical component 33 is in its first or second position, the signal intensity is minimum in the measurement regions R22 and R23, which correspond to the unmolded portion of the object 71. Therefore, the normal unmolded waveform A2 represents the waveform of the normal intensity of light L2 from the unmolded portion.

[0117] Next, refer to Figure 12 as well as Figure 13 This describes the measurement waveform obtained by measuring the melting part 74 of the object 71 when there is an abnormality. Figure 12 as well as Figure 13 It means and Figure 7 Similarly, in the case where an abnormal part 75 is generated near the center of the molten part 74, an explanatory diagram showing the relationship between the measurement waveform obtained by the measurement process S2 and the object 71 is presented.

[0118] Figure 12 In the middle, the measurement area R2 passes through the abnormal part 75 once. Figure 12 The measured waveform includes the abnormal melting waveform A3 at the moment when the abnormal part 75 is generated. The abnormal melting waveform A3 represents the change in signal intensity caused by the abnormality of the melting part 74, i.e., the abnormal part 75. Figure 12 In the waveform, the abnormal melt waveform A3 contains a peak. The peak of the abnormal melt waveform A3 is larger than the peak of the normal melt waveform A1.

[0119] Figure 13 In the middle, the measurement area R2 passed through the abnormal part 75 twice. Figure 13 The measured waveform includes an abnormal melting waveform A4 with two peaks, occurring near the moment an anomaly 75 occurs. The two peaks of the abnormal melting waveform A4 are larger than the peaks of the normal melting waveform A1. The abnormal melting waveform A4 represents the change in signal intensity caused by the anomaly 75 in the melting section 74.

[0120] Next, refer to Figures 14-16 This describes the measurement waveform obtained by measuring the process S2 when there is an abnormality around the molten part 74 of the object 71.

[0121] Figure 14 It means and Figure 7 Similarly, (c) when an abnormal part 76 is generated on one side of the melted part 74 of the object 71, an explanatory diagram of the relationship between the measurement waveform obtained by the measurement process S2 and the object 71 is shown. Figure 14 In the measurement area R2, after passing through the molten section 74 and the abnormal section 76, it passes through the abnormal section 76 again and then through the molten section 74. Figure 14 In the measurement region R2, the abnormal section 76 is passed twice, but the time interval between the first and second passage through the abnormal section 76 is shorter than the time corresponding to the scanning interval P. Figure 14 The measured waveform includes an abnormal melt waveform A5 with two peaks, occurring near the moment when the abnormal portion 76 is generated. The two peaks of the abnormal melt waveform A5 are larger than the peaks of the normal melt waveform A1. Furthermore, the signal intensity of the valleys between the two peaks of the abnormal melt waveform A5 is greater than the signal intensity of the valleys between the peaks in the normal unmelted waveform A2. The aforementioned abnormal melt waveform A5 represents the change in signal intensity caused by the abnormality 76 in the melt portion 74. As described above, the abnormal melt waveform A5 differs from both the normal melt waveform A1 and the normal unmelted waveform A2. Furthermore, the abnormal melt waveform A5 also differs from the abnormal melt waveforms A3 and A4 corresponding to the case where an abnormal portion 75 is generated near the center of the melt portion 74. Therefore, it is possible to distinguish between the case where an abnormal portion 76 is generated on one side of the melt portion 74 of the object 71 and the case where an abnormal portion 75 is generated near the center of the melt portion 74.

[0122] Figure 15 It means and Figure 7 Similarly, in the case where an abnormal part 77 is generated on the other side of the melted part 74 of the object 71, an explanatory diagram of the relationship between the measurement waveform obtained by the measurement process S2 and the object 71 is presented. Figure 15 In the measurement area R2, after passing through the molten section 74 and the abnormal section 77, it passes through the abnormal section 77 again and then through the molten section 74. Figure 15 In the measurement region R2, the abnormal section 77 is passed twice, but the time interval between the first and second passage through the abnormal section 77 is shorter than the time corresponding to the scanning interval P. Figure 15The measured waveform includes an abnormal melt waveform A6 containing two peaks near the moment when the abnormal portion 77 occurs. The two peaks of the abnormal melt waveform A6 are larger than the peaks of the normal melt waveform A1. Furthermore, the signal intensity of the valleys of the two peaks of the abnormal melt waveform A6 is greater than the signal intensity of the valleys of the peaks in the normal unmelted waveform A2. The abnormal melt waveform A6 described above indicates the change in signal intensity caused by the abnormality of the melt portion 74, i.e., the abnormal portion 77. As described above, the abnormal melt waveform A6 is different from the normal melt waveform A1 and the normal unmelted waveform A2. Furthermore, the abnormal melt waveform A6 is also different from the abnormal melt waveforms A3 and A4 corresponding to the case where the abnormal portion 75 occurs near the center of the melt portion 74. Therefore, it is possible to distinguish between the case where the abnormal portion 77 occurs on the other side of the melt portion 74 of the object 71 and the case where the abnormal portion 75 occurs near the center of the melt portion 74.

[0123] Figure 14 The abnormal melting waveform A5 corresponds to the case where an abnormal part 76 is generated on one side of the molten part 74 of the object 71. Figure 15 The abnormal melting waveform A6 corresponds to the case where an abnormal part 77 is generated on the other side of the molten part 74 of the object 71. Figure 14 Abnormal melting waveform A5 and Figure 15 The abnormal melting waveform A6 corresponds to different abnormal portions 76 and 77, but they have almost the same shape. To determine whether the waveform observed during the specified period corresponds to abnormal melting waveforms A5 or A6, the movement direction of the optical component 33 during the specified period can be used. When the movement direction of the optical component 33 changes from the direction from the basic position to the first position to the direction from the first position to the basic position during the specified period, the measurement area R2 is on one side of the melting portion 74. Therefore, the waveform observed during the specified period is abnormal melting waveform A5. When the movement direction of the optical component 33 changes from the direction from the basic position to the second position to the direction from the second position to the basic position during the specified period, the measurement area R2 is on the other side of the melting portion 74. Therefore, the waveform observed during the specified period is abnormal melting waveform A6.

[0124] Figure 16 It means and Figure 7 Similarly, in the case where an abnormal part 77 is generated on the other side of the melted part 74 of the object 71, an explanatory diagram of the relationship between the measurement waveform obtained by the measurement process S2 and the object 71 is presented. Figure 16 In the middle, the measurement area R2 passes through the abnormal section 77 and then through the molten section 74, and then passes through the molten section 74 and then through the abnormal section 77 again. Figure 16 In the measurement region R2, the abnormal section 77 is passed twice, but the time interval between the first and second passage through the abnormal section 77 is longer than the time corresponding to the scanning interval P. Figure 16 The measured waveform includes an abnormal melt waveform A7 containing two peaks near the moment when the abnormal portion 77 occurs. The two peaks of the abnormal melt waveform A7 are larger than the peaks of the normal melt waveform A1. The signal intensity of the valleys of the two peaks of the abnormal melt waveform A7 is equal to the signal intensity of the valleys of the peaks in the normal unmelted waveform A2. The signal intensity of the valley on the opposite side of the valleys of the two peaks of the abnormal melt waveform A7 is greater than the signal intensity of the valleys of the peaks in the normal unmelted waveform A2. The abnormal melt waveform A7 described above indicates the change in signal intensity caused by the abnormality of the melt portion 74, i.e., the abnormal portion 77. As described above, the abnormal melt waveform A7 is different from the normal melt waveform A1 and the normal unmelted waveform A2. Furthermore, the abnormal melt waveform A7 is also different from the abnormal melt waveforms A3 and A4 corresponding to the case where the abnormal portion 75 occurs near the center of the melt portion 74. Therefore, it is possible to distinguish between the case where the abnormal portion 77 occurs on the other side of the melt portion 74 of the object 71 and the case where the abnormal portion 75 occurs near the center of the melt portion 74.

[0125] Through the measurement process S2 described above, a measurement waveform representing the change in intensity of light L2 accompanying the movement of the measurement region R2 can be obtained. The measurement waveform and... Figure 3 Unlike the case where the molten portion 74 of the object 71 shown does not exhibit any abnormalities, such as... Figures 12-16 As shown, abnormal melting waveforms A3, A4, A5, A6, and A7 are included when an abnormality exists in the molten portion 74 of the object 71. Therefore, by analyzing the measurement waveform obtained through the measurement process S2 (the change in the intensity of light L2 accompanying the movement of the measurement area R2), the abnormality of the molten portion 74 can be detected, and the laser processing can be evaluated. Furthermore, based on the position of the measurement area R2 near the time when the abnormality occurs, it is possible to evaluate the location of the abnormality in the object 71.

[0126] Here, in order to confirm the advantages of the measurement process S2 in this embodiment, refer to Figure 17 The determination process of Comparative Example 1 will be explained below. To simplify the explanation, the following will describe... Figure 1 The laser processing system 1 performs the measurement process of Comparative Example 1. Figure 17 This is an explanatory diagram illustrating the movement of the measurement area R2 during the measurement treatment of Comparative Example 1. Figure 17 This indicates the state of the object 71 during laser processing. In Comparative Example 1, the measurement process used measurement system 3 to measure the intensity of light L2 from the object 71 caused by the laser beam L1 irradiating the object 71. The measurement process of Comparative Example 1 is as follows: Figure 17 As shown, the measurement area R2 of the photometer 31 is moved relative to the object 71, and the photometer 31 measures the change in the intensity of light L2 that accompanies the movement of the measurement area R2. Figure 17 In Comparative Example 1, the measurement process causes the measurement area R2 to move relative to the object 71 so that the movement path M21 of the measurement area R2 is consistent with the movement path M1 of the irradiation area R1.

[0127] Next, refer to Figures 18A to 18D The measurement waveform obtained by the measurement process of Comparative Example 1 will be explained. Figure 18A It means and Figure 7 Similarly, (a) is an explanatory diagram showing the relationship between the measurement waveform obtained by the measurement process of Comparative Example 1 and the object 71 when there is no abnormality in the melt section 74. Figure 18A The measured waveform at times t21 to t22, the signal strength and Figure 6 The output of the laser beam L1 changes in the same way.

[0128] Figure 18B It means and Figure 7 Similarly, in the case where an abnormal part 75 is generated in the molten part 74, an explanatory diagram showing the relationship between the measurement waveform obtained by the measurement process of Comparative Example 1 and the object 71 is presented. Figure 18B The measured waveform shows a significant increase in signal intensity between t23 and t24, when the measurement region R2 overlaps with the abnormal portion 75. When the abnormal portion 75 is generated, it becomes abnormally hot compared to the normal molten portion 74, thus causing a sharp increase in the signal intensity of light L2. Therefore, if a large peak is observed in the measured waveform, it is assumed that a melting anomaly has occurred at the location of the object 71 corresponding to that large peak.

[0129] Figure 18C It means and Figure 7 Similarly, in the case where an abnormal part 76 is generated on one side of the molten part 74, an explanatory diagram showing the relationship between the measurement waveform obtained by the measurement process of Comparative Example 1 and the object 71 is presented. Figure 18C The measured waveform at times t23 to t24 overlaps with a portion of the anomaly 76 in the measurement region R2, but is not visible. Figure 18B Such a large change in signal strength. Figure 18C The signal strength changes shown are almost identical to general signal strength changes, making it difficult to determine whether a melting anomaly has occurred.

[0130] Figure 18D It means and Figure 7 Similarly, in the case where an abnormal part 77 is generated on the other side of the molten part 74, an explanatory diagram showing the relationship between the measurement waveform obtained by the measurement process of Comparative Example 1 and the object 71 is presented. Figure 18D The measured waveform at times t23 to t24 shows that the measured region R2 overlaps with a portion of the anomaly 77, but is not visible. Figure 18BSuch a large change in signal strength. Figure 18D The signal strength changes shown are almost identical to general signal strength changes, making it difficult to determine whether a melting anomaly has occurred.

[0131] Figure 18C The measured waveform corresponds to the case where an abnormal part 76 is generated on one side of the molten part 74 of the object 71. Figure 18D The measured waveform corresponds to the case where an abnormal part 77 is generated on the other side of the melted part 74 of the object 71. Figure 18C The measured waveform and Figure 18D The measured waveforms correspond to different abnormal parts 76 and 77, but are almost identical in shape. Therefore, it is possible to obtain... Figure 18C as well as Figure 18D In cases where the measured waveform is similar to the measured waveform, it is difficult to determine whether the measured waveform corresponds to... Figure 18C Measurement waveform and Figure 18D Which waveform is being measured?

[0132] As described in the measurement process of Comparative Example 1 above, if the measurement area R2 is moved relative to the object 71 so that the movement path M21 of the measurement area R2 is consistent with the movement path M1 of the irradiation area R1, it is difficult to determine that there is an abnormality in the laser processing even if there is an abnormality 76 on one side of the molten part 74 or an abnormality 77 on the other side.

[0133] Reference Figure 19A The determination process for Comparative Example 2 will now be explained. To simplify the explanation, the following will describe... Figure 1 The laser processing system 1 performs the measurement process of Comparative Example 2. Figure 19A It means and Figure 7 (c) Similarly, in the case where an abnormality 76 is generated in the molten section 74, an explanatory diagram showing the relationship between the measurement waveform obtained by the measurement process of Comparative Example 2 and the object 71 is provided. In the measurement process of Comparative Example 2, the measurement area R2 is moved relative to the object 71 so that the movement path M22 of the measurement area R2 is parallel to the movement path M1 of the irradiation area R1 but does not pass through the molten section 74. Figure 19A In the middle, the moving path M22 is located on one side of the molten section 74. Figure 19A The measured waveform shows an increased signal strength at the time t23-t24 when the abnormal part 76 overlaps with the measurement area R2. The measurement process of Comparative Example 2 can detect the abnormal part 76, but for the abnormal parts 75 and 77, the changes in signal strength are almost unchanged compared to normal signal strength variations. Therefore, it is difficult to detect the abnormal parts 75 and 77 in the measurement process of Comparative Example 2.

[0134] Reference Figure 19BThe determination process for Comparative Example 3 will now be explained. To simplify the explanation, the following will describe... Figure 1 The laser processing system 1 was subjected to the measurement process of Comparative Example 3. Figure 19B It means and Figure 7 Similarly, in the case where an abnormality 77 is generated in the molten section 74, an explanatory diagram showing the relationship between the measurement waveform obtained by the measurement process of Comparative Example 3 and the object 71 is provided. In the measurement process of Comparative Example 3, the measurement area R2 is moved relative to the object 71 so that the movement path M22 of the measurement area R2 is parallel to the movement path M1 of the irradiation area R1 but does not pass through the molten section 74. Figure 19B In the middle, the moving path M22 is located on the other side of the molten section 74. Figure 19B The measured waveform shows an increased signal strength at the time t23-t24 when the abnormal part 77 overlaps with the measurement area R2. The measurement process of Comparative Example 3 can detect the abnormal part 77, but for the abnormal parts 75 and 76, the changes in signal strength are almost unchanged compared to normal signal strength variations. Therefore, it is difficult to detect the abnormal parts 75 and 76 in the measurement process of Comparative Example 3.

[0135] As described above, in the measurement waveforms of the measurement processes in Comparative Examples 1 to 3, it was difficult to reliably detect all of the abnormal parts 75, 76, and 77. However, the measurement waveforms of the measurement process S2 of this embodiment enable the detection of the abnormal parts 75, 76, and 77.

[0136] [1-2-4-3. Evaluation and Processing]

[0137] Evaluation process S3 evaluates the laser processing based on the change in intensity of light L2, measured as the measurement area R2 moves, as determined by measurement process S2. In other words, it evaluates the processing in processing process S1. As described above, the measurement waveform obtained by measurement process S2 includes abnormal melting waveforms such as abnormal melting waveforms A3 to A7, in cases where abnormalities exist in the laser processing. Therefore, it is possible to evaluate whether the laser processing is normal or abnormal based on the presence or absence of abnormal melting waveforms.

[0138] Evaluation process S3 evaluates the laser processing based on a comparison between the measured waveform and a reference waveform. The measured waveform represents the change in intensity of light L2 as measured by measurement process S2, accompanying the movement of the measurement area R2. For example, a measured waveform may be described... Figure 3 , Figures 12-16The measured waveform is shown. The reference waveform represents the change in intensity of light L2 as the measurement area R2 moves under conditions where there are no abnormalities in the laser processing. Under conditions where there are no abnormalities in the laser processing, the intensity of light L2 from the measurement area R2 is maximum when passing through the molten section 74, weakens as it moves away from the molten section 74, and is minimum at the very end. The reference waveform is, for example,... Figure 3 The waveform shown is a schematic sine wave, similar to the measured waveform.

[0139] Evaluation process S3, based on a comparison between the measured waveform and the reference waveform, determines whether there is a change in the intensity of light L2 in the measured waveform that is not present in the reference waveform. If there is no change in the intensity of light L2 in the measured waveform that is not present in the reference waveform, evaluation process S3 determines that there is no abnormality in the laser processing. For example, in the measurement process S2... Figure 3 In the case of the measured waveform shown, evaluation process S3 determines that there is no abnormality in the laser processing. If the measured waveform shows a change in the intensity of light L2 that is not present in the reference waveform, then evaluation process S3 determines that there is an abnormality in the laser processing. For example, in the case obtained through measurement process S2... Figure 12 In the case of the measured waveform shown, since the measured waveform contains an abnormal melting waveform A3 that represents a change in the intensity of light L2, which is not present in the reference waveform, the evaluation process S3 determines that an anomaly exists in the laser processing. Similarly, after measurement process S2, the following is obtained: Figures 13-16 In the case of the measured waveform shown, since there are abnormal melting waveforms A4, A5, A6, and A7 in the measured waveform that represent changes in the intensity of light L2 that are not present in the reference waveform, the evaluation process S3 judges that there is an abnormality in the laser processing.

[0140] Furthermore, the evaluation process S3 determines the location of the laser processing anomaly in the object 71 based on the position of the measurement region R2 when a change in the intensity of light L2, which is not present in the reference waveform, occurs in the measured waveform. In the measured waveform, the elapsed time corresponds to the distance the measurement region R2 moves along the movement path M2. Therefore, the evaluation process S3 determines the position of the measurement region R2 on the object 71 based on the time elapsed due to the change in the intensity of light L2, which is not present in the reference waveform. The evaluation process S3 determines the location of the laser processing anomaly in the object 71 based on the position of the measurement region R2 on the object 71.

[0141] The evaluation process S3 outputs the evaluation result of the laser processing. For example, the evaluation process S3 can output the information representing the evaluation result of the laser processing to an external device such as a terminal device via wireless or wired communication. Furthermore, the evaluation process S3 can, for example, output the information representing the evaluation result of the laser processing to an image display device.

[0142] [1-3. Effects, etc.]

[0143] As mentioned above, Figure 1 The laser processing system 1 includes: a laser oscillator 21 for irradiating a laser beam L1 onto an object 71; a photometer 31 for measuring the intensity of light L2; and a processing device 5 connected to the laser oscillator 21 and the photometer 31. The processing device 5 performs a processing process S1, a measurement process S2, and an evaluation process S3. The processing process S1 involves moving the laser beam L1 from the laser oscillator 21 relative to the irradiation area R1 of the object 71 relative to the object 71 to process the object 71. The measurement process S2 involves moving the measurement area R2 of the photometer 31 relative to the object 71, and measuring the change in the intensity of light L2 accompanying the movement of the measurement area R2 using the photometer 31. The evaluation process S3 evaluates the processing in the processing process S1 based on the change in the intensity of light L2 accompanying the movement of the measurement area R2 measured by the measurement process S2. The measurement process S2 moves the measurement area R2 relative to the object 71 so that the movement path M2 of the measurement area R2 and the movement path M1 of the irradiation area R1 have multiple intersection points P3.

[0144] exist Figure 1 In the laser processing system 1, the measurement area R2 for measuring thermal radiation L2 moves back and forth at high speed in a direction intersecting the moving direction D1 of the irradiation area R1 of the laser beam L1. Therefore, it is possible to evaluate not only the molten portion 74 melted by the laser beam L1 in the object 71, but also the overall quality of the laser processing, including the unmelted portion 74 surrounding the molten portion 74 and unaffected by the laser beam L1. Furthermore, in Figure 1 In the laser processing system 1, laser processing evaluation can be performed within a two-dimensional range, encompassing the movement direction D1 of the irradiation area R1 and the direction intersecting with D1. Therefore, the possibility of providing an object 71 with defects present during laser processing to subsequent processes can be reduced.

[0145] exist Figure 1In the laser processing system 1, a laser processing evaluation method is performed, wherein the processing device 5 moves the laser beam L1 from the laser oscillator 21 relative to the irradiation area R1 of the object 71 to process the object 71. The evaluation method includes a measurement step and an evaluation step. In the measurement step, the measurement area R2 of a photometer 31 used to measure the intensity of light L2 is moved relative to the object 71, and the photometer 31 measures the change in the intensity of light L2 accompanying the movement of the measurement area R2. The evaluation step evaluates the laser processing based on the change in the intensity of light L2 accompanying the movement of the measurement area R2 measured in the measurement step. In the measurement step, the measurement area R2 is moved relative to the object 71 such that the movement path M2 of the measurement area R2 intersects the movement path M1 of the irradiation area R1 at multiple intersection points P3, and at least a portion of the measurement area R2 overlaps with the irradiation area R1 at at least one of the multiple intersection points P3. This evaluation method improves the accuracy of laser processing evaluation.

[0146] From another perspective, the processing device 5 constitutes a laser processing evaluation system that processes the object 71 by moving the laser beam L1 from the laser oscillator 21 relative to the irradiation area R1 of the object 71. The evaluation system includes the processing device 5 performing a measurement process S2 and an evaluation process S3. The measurement process S2 moves the measurement area R2 of the photometer 31, which measures the intensity of light L2, relative to the object 71, and measures the change in the intensity of light L2 accompanying the movement of the measurement area R2. The evaluation process S3 evaluates the laser processing based on the change in the intensity of light L2 accompanying the movement of the measurement area R2, as measured by the measurement process S2. The measurement process S2 moves the measurement area R2 relative to the object 71 such that the movement path M2 of the measurement area R2 intersects the movement path M1 of the irradiation area R1 at multiple intersection points P3, and at least a portion of the measurement area R2 overlaps with at least one portion of the irradiation area R1 at at least one intersection point P3. This evaluation system improves the accuracy of laser processing evaluation.

[0147] Furthermore, the evaluation system also includes a measurement system 3. The measurement system 3 includes: a photometer 31; an optical component 33 that guides light L2 from the measurement area R2 to the photometer 31, causing the measurement area R2 to move relative to the object 71 by changing its position relative to the photometer 31; and an adjustment device 36 that changes the position of the optical component 33 relative to the photometer 31. The measurement process S2 uses the adjustment device 36 to change the position of the optical component 33 relative to the photometer 31, thereby causing the measurement area R2 to move relative to the object 71. This evaluation system improves the accuracy of laser processing evaluation.

[0148] In addition, Figure 1 In the laser processing system 1, the measurement process S2 moves the measurement area (R2) relative to the object (71) so that at least a portion of the measurement area (R2) overlaps with the irradiation area (R1) at at least one of the plurality of intersection points (P3). This allows for the measurement of the change in the intensity of light L2 at the irradiation area (R1).

[0149] In addition, Figure 1 In the laser processing system 1, the measurement process S2 moves the measurement area R2 relative to the object 71, causing the movement path M2 of the measurement area R2 to meander. This allows for the measurement of the change in the intensity of light L2 accompanying the movement of the measurement area R2 within only one measurement area R2.

[0150] In addition, Figure 1 In the laser processing system 1, the measurement process S2 moves the measurement area R2 relative to the object 71 in the movement direction D1 of the irradiation area R1, so that at least a portion of the measurement area R2 overlaps with the irradiation area R1. The measurement process S2 then moves the measurement area R2 back and forth relative to the object 71 in a predetermined direction intersecting the movement direction D1, using the movement path M1 of the irradiation area R1 as a reference. Thus, with a simple structure, the change in the intensity of light L2 accompanying the movement of the measurement area R2 can be measured.

[0151] In addition, Figure 1 In the laser processing system 1, the measurement process S2 uses the measurement system 3 to measure the change in intensity of light L2 relative to the movement of the measurement area R2. The measurement system 3 includes: a photometer 31; an optical component 33 that guides light L2 from the measurement area R2 to the photometer 31 and can be adjusted relative to the photometer 31 to allow the measurement area R2 to move relative to the object 71; and an adjustment device 36 that adjusts the position of the optical component 33 relative to the photometer 31. The measurement process S2 uses the adjustment device 36 to adjust the position of the optical component 33 relative to the photometer 31, thereby causing the measurement area R2 to move relative to the object 71. Thus, the change in intensity of light L2 accompanying the movement of the measurement area R2 can be measured with a simple structure.

[0152] In addition, Figure 1 In the laser processing system 1, the measurement process S2 moves the measurement area R2 back and forth in a specified direction with a specified width. If the specified width is set as W [mm], and the width of the predetermined melting area 73 of the object 71 caused by the irradiation of the laser beam L1 onto the object 71 is set as d [mm], then W satisfies W≥2×d. Therefore, the state around the molten portion 74 of the object 71 can be evaluated in a specified direction intersecting the movement direction D1 of the irradiation area R1.

[0153] In addition, Figure 1 In the laser processing system 1, if the moving speed of the irradiation area R1 is set to V [mm / s], the size of the measurement area R2 in the moving direction D1 of the irradiation area R1 is set to D [mm], and the reciprocating frequency in the specified direction of the measurement area R2 is set to F [Hz], then F satisfies F≥V / D. Therefore, the overall state of the molten portion 74 of the object 71 can be evaluated in the moving direction D1 of the irradiation area R1.

[0154] In addition, Figure 1 In the laser processing system 1, the evaluation process S3 evaluates the laser processing based on a comparison between the measured waveform and the reference waveform. The measured waveform represents the change in intensity of light L2 as the measurement area R2 moves, as measured by the measurement process S2. The reference waveform represents the change in intensity of light L2 as the measurement area R2 moves, assuming no abnormalities occur during laser processing. This improves the accuracy of the laser processing evaluation.

[0155] In addition, Figure 1 In the laser processing system 1, the evaluation process S3 identifies changes in the intensity of light L2, which is not present in the reference waveform, in the measured waveform and determines that an anomaly exists in the laser processing. This improves the accuracy of the laser processing evaluation.

[0156] In addition, Figure 1 In the laser processing system 1, the evaluation process S3 determines the location of the laser processing anomaly in the object 71 based on the position of the measurement area R2 when the intensity of light L2, which is not present in the reference waveform, exists in the measurement waveform. Thus, the location of the anomaly in the laser processing evaluation can be identified.

[0157] (Modified Example)

[0158] The embodiments disclosed herein are not limited to the embodiments described above. Various modifications can be made to the above embodiments based on design, etc., to achieve the objectives of this disclosure. Hereinafter, variations of the above embodiments are listed. The variations described below can be appropriately combined and applied.

[0159] In the above embodiment, the measurement process S2 adjusts the optical component 33 using the adjustment device 36. Figure 9 The first position shown is... Figure 10 The system moves back and forth between the first and second positions as shown. The basic position is the midpoint between the first and second positions. In a variation, the basic position is not the midpoint between the first and second positions, but the first and second positions can be adjusted so that the basic position is closer to one of the first and second positions than the other.

[0160] Figure 20 This is an explanatory diagram showing the relationship between the measured waveform obtained through the measurement process of the modified example and the object. In the measurement process of the modified example, a movement path M24 is set such that the movement path M1 does not pass through the center of the movement path M24 in a specified direction. The distance W2 between the measurement area R21 and the measurement area R23 in the specified direction is smaller than the distance W1 between the measurement area R21 and the measurement area R22 in the specified direction. Figure 20 In a variation, the first and second positions can be adjusted so that the basic position is closer to the second position than the first position.

[0161] Figure 20 The measured waveforms include: waveform A21 corresponding to the peak, and waveforms A22 and A23 corresponding to the valleys between the peaks. Waveform A21 corresponds to the intensity change of light L2 in the measurement region R21. Waveforms A22 and A23 are both valleys between peaks, but the intensity of the valley in waveform A22 is lower than that in waveform A23. In the moving path M24, the measurement region R22 is farther from the molten part 74 than the measurement region R23. Therefore, the intensity of light L2 in the measurement region R22 is smaller than that in the measurement region R23. Therefore, waveform A22 corresponds to the intensity change of light L2 in the measurement region R22, and waveform A23 corresponds to the intensity change of light L2 in the measurement region R23. Thus, in Figure 20 In the measured waveform, the intensity of light L2 in measurement region R22 or measurement region R23 can be determined by the signal intensity.

[0162] In a variation, the measurement process S2 may not necessarily require the measurement area R2 to move relative to the object 71 such that at least a portion of the measurement area R2 overlaps with the irradiation area R1 at at least one of the plurality of intersection points P3. In other words, at the intersection point P3, the measurement area R2 may not coincide with the irradiation area R1. For example, at the intersection point P3, the measurement area R2 may coincide with the previously irradiated area R1. In other words, the measurement area R2 can be scanned back and forth at high speed in a predetermined direction intersecting the movement direction D1, with the position behind the moving direction D1 of the irradiation area R1 as the center. In this way, the quality of the laser processing of the molten portion 74, the area surrounding the molten portion 74, and the solidified portion after time has passed since the melting based on the laser beam L1 can be evaluated, not during the melting based on the laser beam L1.

[0163] In one variation, the laser processing system 1 may also be used for welding objects 71 and 72 that are arranged horizontally, rather than for welding objects that are vertically overlapping. Furthermore, the laser processing in the laser processing system 1 is not limited to laser welding; it can also be laser cutting.

[0164] In a modified embodiment, the structures of the laser irradiation system 2, the measuring system 3, and the moving system 4 are not limited to those of the embodiments described above. The structures of the laser irradiation system 2, the measuring system 3, and the moving system 4 can be appropriately modified.

[0165] In the laser illumination system 2, the number of laser oscillators 21 is not particularly limited. The structure and configuration of the optical system, including the collimating lens 22, the dichroic mirror 23, and the condenser lens 24, are not particularly limited.

[0166] In the measurement system 3, the number of photometers 31 is not particularly limited. Multiple measurement areas R2 can move along the movement path M2. Multiple measurement areas R2 can move along different movement paths M2. The structure and configuration of the optical system including the bandpass filter 34 and the imaging lens 35 are not particularly limited. The structure of the optical component 33 and the adjustment device 36 are not particularly limited. The measurement system 3 can also be structured such that the measurement area R2 reciprocates with a predetermined width in the movement direction D1 of the illumination area R1. In this case, the measurement process can reciprocate relative to the object 71 in the movement direction D1 of the illumination area R1, with the illumination area R1 as a reference. Such a structure can be achieved by setting the orientation of the rotation axis of the optical component 33 to be orthogonal to the movement direction D1. Therefore, the measurement area R2 can move back and forth at high speed in the same direction as the movement direction D1 of the irradiation area R1, so that the quality of laser processing of the molten part 74, the area around the molten part 74, and the solidified part before and after the melting based on the laser beam L1 can be evaluated, rather than during the melting based on the laser beam L1.

[0167] The moving system 4 is not limited to a structure that moves the worktable 41, which holds the object 71, in a straight line. The moving system 4 can move the worktable 41 along a desired movement path.

[0168] The movement path of the worktable 41 can be appropriately determined according to the content of the laser processing. In addition, the moving system 4 may move the laser irradiation system 2 and the measuring system 3 instead of the worktable 41.

[0169] (Way)

[0170] As can be seen from the above embodiments and variations, this disclosure includes the following methods. Hereinafter, symbols are appended in parentheses merely to illustrate the correspondence with the embodiments.

[0171] The first method is a laser processing evaluation method that processes an object (71) by moving a laser beam (L1) from a laser oscillator (21) relative to the object (71) to an irradiation area (R1). The evaluation method includes a measurement step and an evaluation step. In the measurement step, the measurement area (R2) of a photometer (31) used to measure the intensity of light (L2) is moved relative to the object (71), and the photometer (31) measures the change in the intensity of light (L2) accompanying the movement of the measurement area (R2). The evaluation step evaluates the laser processing based on the change in the intensity of light (L2) accompanying the movement of the measurement area (R2) measured by the measurement step. In the measurement step, the measurement area (R2) is moved relative to the object (71) such that the movement path (M2) of the measurement area (R2) and the movement path (M1) of the irradiation area (R1) have multiple intersection points (P3). This method can improve the accuracy of laser processing evaluation.

[0172] The second method is an evaluation method based on the first method. In the second method, the measurement step involves moving the measurement area (R2) relative to the object (71) such that at least a portion of the measurement area (R2) overlaps with at least one portion of the irradiated area (R1) at at least one of the plurality of intersection points (P3). This method enables the measurement of changes in the intensity of light L2 in the irradiated area (R1).

[0173] The third method is an evaluation method based on the first or second method. In the third method, the measurement step causes the measurement area (R2) to move relative to the object (71) so that the movement path (M2) of the measurement area (R2) meanders. In this way, it is possible to measure the change in light intensity (L2) accompanying the movement of the measurement area (R2) in only one measurement area (R2).

[0174] The fourth method is an evaluation method based on any of the first to third methods. In the fourth method, the measurement step moves the measurement area (R2) relative to the object (71) in the direction of movement (D1) of the irradiated area (R1), such that at least a portion of the measurement area (R2) overlaps with the irradiated area (R1). The measurement step moves the measurement area (R2) back and forth relative to the object (71) in a predetermined direction intersecting the direction of movement (D1), with the movement path (M1) of the irradiated area (R1) as a reference. This method allows for the measurement of changes in light intensity (L2) accompanying the movement of the measurement area (R2) using a simple structure.

[0175] The fifth method is an evaluation method based on the fourth method. In the fifth method, the measurement step uses a measurement system (3) to measure the change in the intensity of light (L2) relative to the movement of the measurement area (R2). The measurement system (3) includes: a photometer (31); an optical component (33) that guides light (L2) from the measurement area (R2) to the photometer (31) and can adjust its position relative to the photometer (31) so that the measurement area (R2) moves relative to the object (71); and an adjustment device (36) that adjusts the position of the optical component (33) relative to the photometer (31). The measurement step uses the adjustment device (36) to adjust the position of the optical component (33) relative to the photometer (31), thereby causing the measurement area (R2) to move relative to the object (71). In this way, the change in the intensity of light (L2) accompanying the movement of the measurement area (R2) can be measured with a simple structure.

[0176] The sixth method is an evaluation method based on the fourth or fifth method. In the sixth method, the measurement step causes the measurement area (R2) to move back and forth in the predetermined direction with a predetermined width. If the predetermined width is set to W [mm], and the width of the predetermined melting area (73) of the object (71) irradiated by the laser beam (L1) is set to d [mm], then W satisfies W≥2×d. In this way, the state around the molten part (74) of the object (71) can be evaluated in the predetermined direction intersecting the movement direction (D1) of the irradiated area (R1).

[0177] Method 7 is an evaluation method based on any of Methods 4 to 6. In Method 7, if the moving speed of the irradiated area (R1) is set to V [mm / s], the size of the measurement area (R2) in the moving direction (D1) of the irradiated area (R1) is set to D [mm], and the reciprocating frequency of the measurement area (R2) in the specified direction is set to F [Hz], then F satisfies F≥V / D. By this method, the overall state of the molten portion (74) of the object (71) can be evaluated in the moving direction (D1) of the irradiated area (R1).

[0178] Method 7 is an evaluation method based on any of Methods 1 through 7. In Method 8, the evaluation step evaluates the laser processing based on a comparison of a measured waveform and a reference waveform. The measured waveform represents the change in intensity of light (L2) as the measured area (R2) moves, as measured by the measurement step. The reference waveform represents the change in intensity of light (L2) as the measured area (R2) moves, assuming no abnormalities are present in the laser processing. This method improves the accuracy of the laser processing evaluation.

[0179] Method 9 is an evaluation method based on Method 8. In Method 9, the evaluation step identifies changes in the intensity of light (L2) that is not present in the reference waveform within the measured waveform, and determines this as an anomaly in the laser processing. This method improves the accuracy of laser processing evaluation.

[0180] Method 10 is an evaluation method based on method 8 or 9. In method 10, the evaluation step determines the location of the laser processing abnormality in the object (71) based on the position of the measurement area (R2) when the intensity of light (L2) not present in the reference waveform changes in the measured waveform. This method allows identification of the location of the abnormality in the laser processing evaluation.

[0181] The 11th method is a laser processing evaluation system that processes an object (71) by moving a laser beam (L1) from a laser oscillator (21) relative to the irradiation area (R1) of the object (71). The evaluation system includes a processing device (5) that performs a measurement process (S2) and an evaluation process (S3). The measurement process (S2) involves moving the measurement area (R2) of a photometer (31) used to measure the intensity of light (L2) relative to the object (71), and measuring the change in the intensity of light (L2) accompanying the movement of the measurement area (R2) using the photometer (31). The evaluation process (S3) evaluates the laser processing based on the change in the intensity of light (L2) accompanying the movement of the measurement area (R2) measured by the measurement process (S2). The measurement process (S2) moves the measurement area (R2) relative to the object (71) so that the movement path (M2) of the measurement area (R2) intersects the movement path (M1) of the irradiation area (R1) at multiple points (P3). In this way, the accuracy of the evaluation of laser processing can be improved.

[0182] The 12th method is an evaluation system based on the 11th method. In the 12th method, the evaluation system further includes a measurement system (3). The measurement system (3) includes: a photometer (31); an optical component (33) that guides light (L2) from the measurement area (R2) to the photometer (31) and moves the measurement area (R2) relative to the object (71) by changing its position relative to the photometer (31); and an adjustment device (36) that changes the position of the optical component (33) relative to the photometer (31). The measurement process (S2) moves the measurement area (R2) relative to the object (71) by changing the position of the optical component (33) relative to the photometer (31) using the adjustment device (36). In this way, the accuracy of the evaluation of laser processing can be improved.

[0183] The 13th method is a laser processing system (1). The laser processing system (1) includes: a laser oscillator (21) for irradiating a laser beam (L1) onto an object (71); a photometer (31) for measuring the intensity of light (L2); and a processing device (5) connected to the laser oscillator (21) and the photometer (31). The processing device (5) performs a processing process (S1), a measurement process (S2), and an evaluation process (S3). The processing process (S1) involves moving the laser beam (L1) from the laser oscillator (21) relative to the irradiation area (R1) of the object (71) relative to the object (71) to process the object (71). The measurement process (S2) involves moving the measurement area (R2) of the photometer (31) relative to the object (71) and measuring the change in the intensity of light (L2) accompanying the movement of the measurement area (R2) by the photometer (31). The evaluation process (S3) evaluates the processing in the processing process (S1) based on the change in the intensity of light (L2) accompanying the movement of the measurement area (R2) as measured by the measurement process (S2). The measurement process (S2) moves the measurement area (R2) relative to the object (71) such that the movement path (M2) of the measurement area (R2) intersects with the movement path (M1) of the irradiation area (R1) at multiple points (P3). This improves the accuracy of the laser processing evaluation.

[0184] As described above, embodiments have been illustrated as technical examples in this disclosure. Therefore, accompanying drawings and detailed descriptions are provided. Thus, the structural elements described in the drawings and detailed descriptions include not only those essential for solving the problem, but also those not essential for solving the problem, but also those used to illustrate the above-described technology. Therefore, while these non-essential structural elements are described in the drawings and detailed descriptions, they should not be directly considered as essential. Furthermore, since the above-described embodiments are for illustrating the technology in this disclosure, various modifications, substitutions, additions, omissions, etc., can be made within the scope of the claims or their equivalents.

[0185] Industrial availability

[0186] This disclosure can be applied to evaluation methods, evaluation systems, and laser processing systems. Specifically, this disclosure can be applied to evaluation methods, evaluation systems, and laser processing systems that evaluate laser processing by using the light generated on an object due to the irradiation of a laser beam onto the object.

Claims

1. An evaluation method for laser processing, which involves moving a laser beam from a laser oscillator relative to the object's irradiation area to process the object. The evaluation method includes: The measurement step involves moving the measurement area of ​​a photometer used for measuring light intensity relative to the object, and measuring the change in light intensity produced on the object as a result of the movement of the measurement area; and The evaluation step assesses the laser processing based on the change in light intensity as measured during the measurement step, which is performed along with the movement of the measurement area. The measurement step involves moving the measurement area relative to the object from an initial measurement area to a final measurement area, such that the movement path of the measurement area is serpentine and has multiple intersection points with the movement path of the irradiation area. The measurement area is also set in a region with a different movement path than the irradiated area.

2. The evaluation method according to claim 1, wherein, The measurement step causes the measurement area to move relative to the object, such that at least a portion of the measurement area overlaps with at least one portion of the irradiated area at at least one of the plurality of intersection points.

3. The evaluation method according to claim 1 or 2, wherein, The measurement step involves moving the measurement area relative to the object in the direction of movement of the irradiated area, such that at least a portion of the measurement area overlaps with the irradiated area. The measurement step is performed in a predetermined direction intersecting the direction of movement, using the movement path of the irradiated area as a reference, so that the measurement area moves back and forth relative to the object.

4. The evaluation method according to claim 3, wherein, The measurement step uses a measurement system to measure the change in light intensity relative to a movement within the measurement area. The measuring system includes: The photometer; An optical component guides light from the measurement area to the photometer and can adjust its position relative to the photometer so that the measurement area can move relative to the object. and The adjustment device adjusts the position of the optical component relative to the photometer. The measurement step involves adjusting the position of the optical component relative to the photometer using the adjustment device, thereby causing the measurement area to move relative to the object.

5. The evaluation method according to claim 3, wherein, The measurement step involves moving the measurement area back and forth in the specified direction with a specified width. If the specified width is set to W [mm], and the width of the predetermined melting region of the object based on the laser beam irradiation of the object is set to d [mm], then W satisfies the following formula: W≥2×d.

6. The evaluation method according to claim 3, wherein, If the moving speed of the irradiated area is set as V [mm / s], the size of the measuring area in the moving direction of the irradiated area is set as D [mm], and the reciprocating frequency of the measuring area in the specified direction is set as F [Hz], then F satisfies the following formula: F≥V / D.

7. The evaluation method according to claim 1 or 2, wherein, The evaluation step is based on a comparison between the measured waveform and a reference waveform to evaluate the laser processing. The measured waveform is a waveform representing the change in light intensity as measured by the measurement step, accompanying the movement of the measurement area. The reference waveform represents the change in light intensity that occurs as the measurement area moves, assuming no abnormalities are present during the laser processing.

8. The evaluation method according to claim 7, wherein, The evaluation step identifies changes in light intensity that are not present in the reference waveform in the measured waveform, and determines that there is an abnormality in the laser processing.

9. The evaluation method according to claim 7, wherein, The evaluation step determines the location of the abnormal part of the object where the laser processing occurred based on the position of the measurement area when the intensity of light that does not exist in the reference waveform is present in the measured waveform.

10. An evaluation system for laser processing of an object by moving a laser beam from a laser oscillator relative to the object in an irradiation area, the evaluation system comprising: Processing apparatus for performing measurement and evaluation processes. The measurement process involves moving the measurement area of ​​a photometer used to measure light intensity relative to the object, and measuring the change in light intensity produced on the object as a result of this movement of the measurement area. The evaluation process is based on the change in light intensity as measured by the measurement process, which occurs as the measurement area moves, to evaluate the laser processing. The measurement process moves the measurement area relative to the object from an initial measurement area to a final measurement area, such that the movement path of the measurement area is serpentine and has multiple intersection points with the movement path of the irradiation area. The measurement area is also set in a region with a different movement path than the irradiated area.

11. The evaluation system according to claim 10, wherein, The evaluation system also includes a measurement system. The measuring system includes: The photometer; An optical component guides light from the measurement area to the photometer, thereby causing the measurement area to move relative to the object by changing its position relative to the photometer. and The adjustment device changes the position of the optical component relative to the photometer. The measurement process involves using the adjustment device to change the position of the optical component relative to the photometer, thereby causing the measurement area to move relative to the object.

12. A laser processing system, comprising: A laser oscillator is used to project a laser beam onto an object. A light meter, used to measure the intensity of light; and The processing device is connected to the laser oscillator and the photometer. The processing device performs processing, measurement, and evaluation. The processing involves moving the laser beam from the laser oscillator relative to the object's irradiation area to process the object. The measurement process causes the measurement area of ​​the photometer to move relative to the object, and the photometer measures the change in the intensity of light generated on the object accompanying the movement of the measurement area. The evaluation process is based on the change in light intensity accompanying the movement of the measurement area, as measured by the measurement process, to evaluate the processing in the processing. The measurement process moves the measurement area relative to the object from an initial measurement area to a final measurement area, such that the movement path of the measurement area is serpentine and has multiple intersection points with the movement path of the irradiation area. The measurement area is also set in a region with a different movement path than the irradiated area.

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