Sensor package structure and packaging method

Abstract

The application provides a sensor packaging structure and a packaging method. The sensor packaging structure comprises: a substrate comprising a bearing surface; a sensor chip arranged above the bearing surface, the sensor chip comprising a light sensing area, the light sensing area being away from the bearing surface; an encapsulation layer covering the substrate and the sensor chip, the encapsulation layer comprising a top surface away from the bearing surface, the top surface comprising an opening, the light sensing area being exposed from the opening; a light-transmitting cover plate fixed in the opening, the light-transmitting cover plate covering the light sensing area and forming a cavity with the light sensing area; and an air hole extending from the top surface towards the encapsulation layer and communicating with the cavity; wherein the cavity communicates with the outside through the air hole.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor packaging, and in particular to a sensor packaging structure and a packaging method. BACKGROUND

[0002] Optical sensors are measured according to optical principles, have characteristics such as non-contact and non-destructive measurement, almost no interference, high-speed transmission, and remote measurement and remote control, and are widely used in aerospace, aviation, national defense scientific research, information industry, machinery, power, energy, transportation, biology, medicine and other fields. At present, optical sensors mainly include optical image sensors, transmission-type optical sensors, optical measurement sensors, optical mouse sensors, and reflection-type optical sensors.

[0003] Taking an optical image sensor as an example, it converts optical image signals into electronic signals for processing. In order to protect the chip of the image sensor, make it work stably for a long time, and maintain good sensing sensitivity for a long time, a stable and reliable packaging structure needs to be designed. When packaging the image sensor, on the one hand, the light sensing area of the sensing chip needs to be protected; on the other hand, the electrical connection line between the sensor and the external circuit needs to be protected to prevent external factors from affecting the normal acquisition and processing of the sensing signal.

[0004] In the prior art, when packaging the image sensor, the light-transmitting cover plate and the encapsulating layer are adhered and fixed to cover the light sensing area to form a cavity, and the cavity is a sealed cavity. When reflowing, the gas in the cavity expands due to heat and will push the light-transmitting cover plate out, resulting in abnormal packaging of the packaging structure. In addition, when the optical image sensor is working, the sensor chip generates heat, causing water vapor to appear in the cavity. The long-term retention of this water vapor in the cavity will affect the performance of the sensor chip. SUMMARY

[0005] The purpose of the present application is to provide a sensor packaging structure and a packaging method to overcome the defects of the existing sensor packaging structure and improve the yield, performance, etc. of the packaging structure.

[0006] The technical scheme of the present application provides a sensor packaging structure, which comprises: a substrate comprising a bearing surface; a sensor chip arranged above the bearing surface, the sensor chip comprising a light sensing area, the light sensing area being away from the bearing surface; an encapsulation layer covering the substrate and the sensor chip, the encapsulation layer comprising a top surface away from the bearing surface, the top surface comprising an opening, the light sensing area being exposed from the opening; a light-transmitting cover plate fixed in the opening, the light-transmitting cover plate covering the light sensing area and forming a cavity with the light sensing area; and an air hole extending from the top surface towards the inside of the encapsulation layer and communicating with the cavity; wherein the cavity communicates with the outside through the air hole.

[0007] As an optional technical scheme, the air hole comprises a bottom end away from the top surface, and the light-transmitting cover plate comprises an inner surface facing the light sensing area, wherein the bottom end is located below the inner surface and does not contact the inner surface.

[0008] As an optional technical scheme, the encapsulation layer comprises a protrusion covering the edge of the sensor chip, the protrusion being located in the opening and outside the light sensing area, and a groove being provided on the protrusion, wherein the groove and the cavity communicate, and are connected with the outside through the air hole.

[0009] As an optional technical scheme, the opening, the air hole, the groove and the encapsulation layer are integrally formed.

[0010] As an optional technical scheme, the protrusion is a stepped structure protrusion, the stepped structure protrusion comprising a lateral surface facing the light-transmitting cover plate, and the groove being located on the lateral surface, wherein part of the lateral surface is recessed in a direction away from the light-transmitting cover plate to form the groove.

[0011] As an optional technical scheme, the lateral surface does not contact the inner surface of the light-transmitting cover plate facing the light sensing area.

[0012] As an optional technical scheme, the lateral surface comprises a first lateral surface and a second lateral surface connected to each other, and the groove is located on the first lateral surface, wherein in the thickness direction of the substrate, the first lateral surface is flush with or lower than the second lateral surface.

[0013] As an optional technical scheme, the air hole comprises a bottom end away from the top surface, and the bottom end is located below the lateral surface.

[0014] As an optional technical solution, the air hole and the opening are communicated, and the light-transmitting cover plate comprises a side edge facing the air hole, and the side edge corresponds to a region of the air hole and is suspended in the opening.

[0015] As an optional technical solution, the sensor chip comprises a plurality of first conductive connection points; the bearing surface comprises a plurality of second conductive connection points; and the plurality of first conductive connection points and the plurality of second conductive connection points are connected by a plurality of metal wires.

[0016] The application further provides a packaging method of the sensor packaging structure, and the packaging method comprises the following steps:

[0017] A to-be-packaged assembly is provided, the to-be-packaged assembly comprises a substrate and a sensor chip, the substrate comprises a bearing surface, the sensor chip is arranged above the bearing surface, and the sensor chip comprises a light-sensitive region away from the bearing surface;

[0018] A plastic packaging mold and a packaging material are provided, the plastic packaging mold comprises an injection cavity, the to-be-packaged assembly is placed in the injection cavity, and the packaging material is filled into the injection cavity to form a packaging layer covering the to-be-packaged assembly, the packaging layer comprises a top surface away from the bearing surface, the top surface is provided with an opening, the light-sensitive region is exposed from the opening, an air hole is formed in the packaging layer, and the air hole extends from the top surface towards the inside of the packaging layer; and

[0019] A light-transmitting cover plate is provided, and the light-transmitting cover plate is fixed in the opening, the light-transmitting cover plate covers the light-sensitive region and forms a cavity between the light-sensitive region, and the cavity is communicated with the outside through the air hole.

[0020] Compared with the prior art, the application provides a sensor packaging structure and a packaging method, an air hole is arranged in a packaging layer of the sensor packaging structure and is communicated with a cavity in the sensor packaging structure, the cavity is communicated with the outside through the air hole, and the light-transmitting cover plate covering the cavity is prevented from being knocked out due to the increase of the gas expansion pressure in the cavity during the packaging process. In addition, a groove is arranged on a flow path communicated between the cavity and the air hole, water vapor generated due to the heat generated by the sensor chip is accumulated in the groove, and then is discharged to the outside through the air hole, so that the influence of the water vapor on the performance of the sensor chip is avoided, and the use performance of the packaging structure is improved.

[0021] The application will be described in detail below in combination with the drawings and specific embodiments, but is not limited to the application. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the description of the embodiments or the prior art. Obviously, the drawings described below are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0023] Figure 1 A top view of a sensor packaging structure provided by an embodiment of the present application.

[0024] Figure 2 A cross-sectional view along the dashed line AA. Figure 1

[0025] Figure 3 A cross-sectional view along the dashed line BB. Figure 1

[0026] Figure 4 A cross-sectional view of a sensor packaging structure provided by another embodiment of the present application.

[0027] Figure 5 A flow chart of a packaging method of a sensor packaging structure provided by an embodiment of the present application.

[0028] Figure 6 A cross-sectional view of a forming process of an encapsulation layer including an air hole and a groove in a sensor packaging structure. DETAILED DESCRIPTION

[0029] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the embodiments and drawings. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0030] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0031] ​​The present application aims to provide a sensor packaging structure and a packaging method. A cavity communication hole is arranged on an encapsulation layer of the sensor packaging structure and communicates with a cavity in the sensor packaging structure. The cavity communicates with the outside through the hole, so as to avoid the problem of abnormal packaging of a light-transmitting cover plate covering the cavity during the packaging process. In addition, a groove is arranged on a path where the cavity and the hole communicate. Water vapor generated by heat generated by the sensor chip is accumulated in the groove and then discharged to the outside through the hole, so as to avoid the influence of the water vapor on the performance of the sensor chip and improve the use performance of the packaging structure.

[0032] As shown in Figures 1 to 3 An embodiment of the present application provides a sensor packaging structure 100, which comprises a substrate 10, a sensor chip 20, an encapsulation layer 30, a light-transmitting cover plate 40 and a hole 33. The substrate 10 comprises a bearing surface 11. The sensor chip 20 is arranged above the bearing surface 11. The sensor chip 20 comprises a light-sensing area 20a, and the light-sensing area 20a is away from the bearing surface 11. The encapsulation layer 30 covers the substrate 10 and the sensor chip 20. The encapsulation layer 30 comprises a top surface 31 away from the bearing surface 11. The top surface 31 comprises an opening 32, and the light-sensing area 20a is exposed from the opening 32. The light-transmitting cover plate 40 is fixed in the opening 32. The light-transmitting cover plate 40 covers the light-sensing area 20a. A cavity 50 is formed between the light-transmitting cover plate 40 and the light-sensing area 20a. The hole 33 extends from the top surface 31 towards the inside of the encapsulation layer 30. The hole 33 communicates with the cavity 50. The cavity 50 communicates with the outside through the hole 33.

[0033] In the embodiment, the hole 33 is introduced on the encapsulation layer 30. The upper end of the hole 33 is located on the top surface 31. The opposite bottom end 331 of the hole 33 is located inside the encapsulation layer 30. The bottom end 331 is located below the inner surface of the light-transmitting cover plate 40 facing the light-sensing area 20a and does not contact the inner surface. A flow channel (as shown by the dashed line and arrow in Figure 3 ) is formed between the inner surface and the bottom end 331. The cavity 50 communicates with the hole 33 through the flow channel and then communicates with the outside. During the reflow process, the cavity 50 communicates with the outside through the hole 33. The gas in the cavity 50 is expanded and discharged from the hole 33 after being heated. The pressure in the cavity 50 is balanced with the atmospheric pressure of the outside, so that the light-transmitting cover plate 40 will not be pushed out of the opening 32.

[0034] As shown in Figure 1 and Figure 3 , the hole 33 communicates with the opening 32. That is, the hole 33 can be regarded as a hole extending out of the opening 32 in a direction away from the light-sensing area 20a. The upper end of the hole is located on the top surface 31. The bottom end of the hole extends to below the light-transmitting cover plate 40 and communicates with the cavity 50. The hole is, for example, a blind hole structure. Of course, in other embodiments of the present application, the hole can also be a through hole structure penetrating through the encapsulation layer according to actual packaging needs.

[0035] The vent 33 and the opening 32 are connected, and the light-transmitting cover 40 includes a side 41 facing the vent 33, with the area of ​​the side 41 corresponding to the vent 33 suspended in the opening 32.

[0036] like Figures 2 to 3 As shown, the encapsulation layer 30 includes a protrusion 301 covering the edge of the sensor chip 20. The protrusion 301 is located in the opening 32 and outside the photosensitive area 20a. The protrusion 301 is provided with a groove 34, which communicates with the cavity 50 and is connected to the outside through the vent 33.

[0037] The protrusion 301 is a stepped protrusion, which includes a transverse surface 302 facing the light-transmitting cover plate 40, and a groove 34 is located on the transverse surface 302, wherein a portion of the transverse surface 302 is recessed in a direction away from the light-transmitting cover plate 40 to form the groove 34.

[0038] In addition, the transverse surface 302 does not contact the inner surface of the light-transmitting cover plate 40 facing the photosensitive area 20a, and a flow channel can be formed between the two to ensure that the cavity 50 and the groove 34 can be connected to the air hole 33 through the above-mentioned flow channel, and then connected to the outside through the air hole 33.

[0039] The groove 34 is located between the photosensitive area 20a and the vent 33, and is situated within the aforementioned flow channel. During operation of the sensor chip 20, water vapor appears inside the cavity 50. This water vapor flows through the aforementioned flow channel and deposits into the groove 34. On one hand, this prevents water vapor from flowing into the cavity 50, thus avoiding any impact on the performance of the sensor packaging structure 100. On the other hand, the heat generated by the continuous operation of the sensor chip 20 can evaporate the water vapor deposited in the groove 34 and discharge it into the external environment through the vent 33 along the aforementioned flow channel, thereby improving the performance of the packaging structure.

[0040] like Figure 3 As shown, the protrusion 301, for example, surrounds the outside of the photosensitive area 20a and protrudes upwards away from the photosensitive area 20a. The surface of the protrusion 301 facing the transverse surface 302 of the light-transmitting cover plate 40, where the groove 34 is provided, is flush with the surface of the other areas where the groove 34 is not provided. In other words, with Figure 3 With reference to the illustrated viewpoint, the height of the convex 301 on the lateral surfaces on both sides of the photosensitive area 20a is consistent.

[0041] like Figure 4As shown in the sensor package structure 200 provided by another embodiment of the present application, the protrusion 301' is arranged outside the light sensing area 20a, and protrudes away from the top of the light sensing area 20a. The lateral surface of the protrusion 301' facing the light-transmitting cover plate 40 comprises a first lateral surface 302' and a second lateral surface 303 connected to each other. The groove 34 is arranged in the first lateral surface 302', and preferably, the first lateral surface 302' is located below the second lateral surface 303 along the thickness direction of the substrate 10, so as to ensure that there is always a gap between the inner surface of the light-transmitting cover plate 40 and the protrusion 301' of the encapsulation layer 30, and maintain the unobstructed communication between the flow channel and the air hole 33.

[0042] In addition, Figure 4 With Figure 3 the same reference numerals representing the same elements having similar functions, the above description of the elements with the same reference numerals in Figure 3 will not be repeated.

[0043] As Figure 3 shown, the bottom end 331 of the air hole 33 is located below the lateral surface 302, so that the water vapor and / or dust from the external environment moving into the cavity 50 will first deposit in the bottom end 331 of the air hole 33, avoiding direct entry into the inside of the cavity 50 and affecting the sensor chip 20.

[0044] In some embodiments of the present application, the substrate 10 comprises one or more insulating layers and conductive layers stacked alternately, which can be a PCB circuit board. The bearing surface 11 of the substrate 10 is used to bear and fix the chip 20. The bearing surface 11 comprises a plurality of second conductive connection points, such as pad structures.

[0045] The chip 20 comprises a first chip 21 and a second chip 22 electrically connected to each other. The second chip 22 is fixed above the bearing surface 11, and the first chip 21 is stacked above the second chip 22.

[0046] The first chip 21 can be a complementary metal oxide semiconductor (CMOS) image sensor chip or a charged couple device (CCD), which can be used to sense light. The upper surface of the first chip 21 is formed with a light sensing area 20a. The periphery of the light sensing area 20a is provided with a plurality of first conductive connection points. The plurality of first conductive connection points and the light sensing components in the light sensing area 20a are electrically connected. The plurality of first conductive connection points on the first chip 21 and the plurality of second conductive connection points on the bearing surface 11 are electrically connected by means of wire bonding with the metal wires 70.

[0047] The second chip 22 is made of a semiconductor material (silicon) and comprises an active surface comprising one or more electrical components (for example, an integrated circuit), which can be an analog or digital circuit. In particular, the second chip 22 comprises electrical components forming an application-specific integrated circuit (ASIC).

[0048] In addition, an adhesive material 23 can be provided on the carrier surface 11, by which the second chip 22 is fixed to the carrier surface 11.

[0049] The light-transmitting cover plate 40 is used to protect the light-sensitive region 20a of the chip 20 from contamination by contaminants, wherein external light is transmitted through the light-transmitting cover plate 40 and is incident on the light-sensitive region 20a. The light-transmitting cover plate 40 can be a transparent resin cover plate, a transparent glass cover plate, etc. The light-transmitting cover plate 40 covers the light-sensitive region 20a and forms a cavity 50 between the light-sensitive region 20a, without affecting the function of the light-sensitive region 20a for sensing light.

[0050] The material of the adhesive layer 60 can be selected from, for example, epoxy resin, etc. The adhesive layer 60 is, for example, coated on the lateral surface 302 of the protrusion 301 and the inner wall of the opening 32, and the light-transmitting cover plate 40 is adhered and fixed to the inner wall of the opening 32 and the lateral surface 302 by the adhesive layer 60. In addition, the part of the lateral surface 302 where the groove 34 is provided is not coated with the adhesive layer 60.

[0051] As shown in Figure 5 The application also provides a packaging method 1000 of a sensor packaging structure, which comprises:

[0052] A to-be-packaged assembly is provided, which comprises a substrate and a sensor chip, the substrate comprises a carrier surface, and the sensor chip is arranged above the carrier surface, and the sensor chip comprises a light-sensitive region away from the carrier surface;

[0053] A plastic packaging mold and an encapsulating material are provided, the to-be-packaged assembly is placed in an injection cavity of the plastic packaging mold, and the encapsulating material is filled into the injection cavity to form an encapsulating layer covering the to-be-packaged assembly, the encapsulating layer comprises a top surface away from the carrier surface, the top surface is provided with an opening, the light-sensitive region is exposed from the opening, an air hole is formed in the encapsulating layer, and the air hole extends from the top surface towards the inside of the encapsulating layer; and

[0054] A light-transmitting cover plate is provided, and the light-transmitting cover plate is fixed in the opening, the light-transmitting cover plate covers the light-sensitive region and forms a cavity between the light-sensitive region, and the cavity is in communication with the outside through the air hole.

[0055] The following will be described in detail Figure 1 , Figure 2 , Figure 3 and Figure 6 Figure 5 ​The encapsulation method 1000 shown in the figure.

[0056] As shown in Figure 2 , Figure 3 and Figure 6 , the component to be encapsulated includes a substrate 10 and a sensor chip 20, the substrate 10 includes a bearing surface 11, the sensor chip 20 is arranged above the bearing surface 11, and the sensor chip 20 includes a light sensing area 20a away from the bearing surface 11.

[0057] A plastic encapsulation mold and an encapsulation material 30a are provided, the plastic encapsulation mold includes a lower mold 2000 and an upper mold 3000 assembled with each other, an injection cavity 5000 is formed between the lower mold 2000 and the upper mold 3000, and a side surface structure of the upper mold 3000 toward the lower mold 2000 is adapted to the shape of a top surface 31 of the encapsulation layer 30 formed. The side surface of the upper mold 3000 toward the lower mold 2000 includes a first protrusion 3001 and a second protrusion 3002, wherein the first protrusion 3001 is adapted to the air hole 33, the second protrusion 3002 is adapted to the groove 34, and the first protrusion 3001 is located outside the second protrusion 3002.

[0058] In addition, corresponding to the opening 32 on the encapsulation layer 30, the upper mold 3000 further includes a T-shaped protrusion, the T-shaped protrusion includes a horizontal structure and a vertical structure, wherein the first protrusion 3001 and the second protrusion 3002 extend from the horizontal structure and are parallel to each other.

[0059] The encapsulation material 30a is filled in the injection part of the plastic encapsulation mold, and the injection part further includes a push rod 4000, the push rod 4000 extrudes the encapsulation material 30a into the injection cavity 5000, and after the encapsulation material 30a is solidified, the encapsulation layer 30 encapsulating the component to be encapsulated is formed.

[0060] Specifically, the component to be encapsulated is placed on the loading platform of the lower mold 2000, the lower mold 2000 is moved toward the upper mold 3000, the lower mold 2000 and the upper mold 3000 are aligned, and after the molds are closed, the injection cavity 5000 is formed between the lower mold 2000 and the upper mold 3000.

[0061] After the encapsulation material 30a in the injection part of the plastic encapsulation mold is melted, it is pushed into the injection cavity 5000 by the push rod 4000, and after the encapsulation material 30a is solidified and formed, the encapsulation layer 30 covering the substrate 10 and the sensor chip 20 is obtained.

[0062] The lower mold 2000 is moved, and the encapsulation layer 30 is demolded from the upper mold 3000, and the top surface 31 of the encapsulation layer 30 forms the opening 32, the air hole 33 and the groove 34.

[0063] Further, the adhesive layer 60 is coated on the inner wall and the lateral surface 302 of the opening 32, and the light-transmitting cover plate 40 is provided and placed in the opening 32, and the edge of the light-transmitting cover plate 40 is adhered and fixed on the inner wall and the lateral surface 302 of the opening 32. The inner surface of the lateral surface 302 and the light-transmitting cover plate 40 facing the photosensitive area 20a is not in contact and forms a communication channel. At this time, the cavity 50 between the light-transmitting cover plate 40 and the photosensitive area 20a and the groove 34 are respectively communicated with the air hole 33 through the above-mentioned communication channel, and communicated with the outside through the air hole 33.

[0064] In summary, the present application provides a sensor packaging structure and a packaging method. The packaging structure is provided with an air hole in the sealing layer, which is communicated with the cavity in the packaging structure. The cavity is communicated with the outside through the air hole, which avoids the light-transmitting cover plate from being pushed out due to the increase of the gas expansion pressure in the cavity during the packaging process. In addition, a groove is arranged in the flow path between the cavity and the air hole, which accumulates the water vapor caused by the heat generated by the sensor chip, and then discharges the water vapor to the outside through the air hole, which avoids the influence of the water vapor on the performance of the sensor chip and improves the use performance of the packaging structure.

[0065] The present application has been described by the above-mentioned related embodiments, however, the above-mentioned embodiments are only examples for implementing the present application. In addition, the technical features involved in the different embodiments of the present application described above can be combined with each other as long as they do not conflict with each other. It must be pointed out that the present application can have other various embodiments, and those skilled in the art can make various corresponding changes and modifications according to the present application without departing from the spirit and essence of the present application. However, these corresponding changes and modifications should belong to the protection scope of the claims attached to the present application.

Claims

1. A sensor package structure, characterized by, The sensor packaging structure comprises: a substrate comprising a bearing surface; a sensor chip disposed above the bearing surface, the sensor chip comprising a light sensing region distal to the bearing surface; an encapsulation layer covering the substrate and the sensor chip, the encapsulation layer comprising a top surface distal to the bearing surface, the top surface comprising an opening, the light sensing region being exposed from the opening; a light-transmissive cover plate fixed in the opening, the light-transmissive cover plate covering the light sensing region and forming a cavity with the light sensing region; and an air hole extending from the top surface towards the encapsulation layer and communicating with the cavity; wherein the cavity communicates with the outside through the air hole, the encapsulation layer comprises a protrusion covering the edge of the sensor chip, the protrusion comprises a lateral surface facing the light-transmissive cover plate, the lateral surface comprises a first portion and a second portion, the sensor packaging structure further comprises an adhesive layer located at the first portion to fix the light-transmissive cover plate and the encapsulation layer, a gap is formed between the second portion and the light-transmissive cover plate, the air hole comprises the gap; the protrusion is provided with a groove, wherein the groove and the cavity communicate and further communicate with the outside through the air hole; the air hole comprises a bottom end distal to the top surface, the light-transmissive cover plate comprises an inner surface facing the light sensing region, wherein the bottom end is located below the inner surface and does not contact the inner surface; the air hole communicates with the opening, the light-transmissive cover plate comprises a side edge facing the air hole, and the side edge corresponding to the region of the air hole is suspended in the opening.

2. The sensor package structure of claim 1, wherein, The protrusion is located in the opening and outside the light sensing region.

3. The sensor package structure of claim 2, wherein, The opening, the air hole, the groove and the encapsulation layer are integrally formed.

4. The sensor package structure of claim 2, wherein, The protrusion is a stepped protrusion, the stepped protrusion comprises a lateral surface facing the light-transmissive cover plate, and the groove is located on the lateral surface, wherein part of the lateral surface is recessed in a direction away from the light-transmissive cover plate to form the groove.

5. The sensor package structure of claim 4, wherein, The lateral surface does not contact the inner surface of the light-transmissive cover plate facing the light sensing region.

6. The sensor package structure of claim 5, wherein, The lateral surface comprises a first lateral surface and a second lateral surface connected to each other, and the groove is located on the first lateral surface, wherein in the thickness direction of the substrate, the first lateral surface is flush with or lower than the second lateral surface.

7. The sensor package structure of claim 4, wherein, The air hole comprises a bottom end distal to the top surface, and the bottom end is located below the lateral surface.

8. The sensor packaging structure according to claim 1, characterized in that, The sensor chip comprises a plurality of first conductive connection points; the bearing surface comprises a plurality of second conductive connection points; wherein the plurality of first conductive connection points and the plurality of second conductive connection points are connected by a plurality of metal wires.

9. A packaging method of a sensor package structure, characterized by, The packaging method comprises: providing a component to be packaged, the component to be packaged comprising a substrate and a sensor chip, the substrate comprising a bearing surface, the sensor chip being disposed above the bearing surface, the sensor chip comprising a light sensing region distal to the bearing surface; The application provides a plastic sealing mold and a sealing material. The plastic sealing mold comprises an injection cavity. The component to be encapsulated is placed in the injection cavity, and the sealing material is filled into the injection cavity to form a sealing layer covering the component to be encapsulated. The sealing layer comprises a top surface away from the bearing surface. The top surface is provided with an opening. The photosensitive area is exposed from the opening. A gas hole is formed in the sealing layer and extends from the top surface towards the sealing layer. A light-transmitting cover plate is fixed in the opening. The light-transmitting cover plate covers the photosensitive area and forms a cavity between the photosensitive area. The cavity is communicated with the outside through the gas hole. The sealing layer comprises a protrusion covering the edge of the sensor chip. The protrusion comprises a transverse surface facing the light-transmitting cover plate. The transverse surface comprises a first part and a second part. The sensor package structure further comprises an adhesive layer. The adhesive layer is located on the first part to fix the light-transmitting cover plate and the sealing layer. The second part forms a gap with the light-transmitting cover plate. The gas hole comprises the gap. The protrusion is provided with a groove. The groove and the cavity are communicated and communicated with the outside through the gas hole. The gas hole comprises a bottom end away from the top surface. The light-transmitting cover plate comprises an inner surface facing the photosensitive area. The bottom end is located below the inner surface and does not contact the inner surface. The gas hole and the opening are communicated. The light-transmitting cover plate comprises a side edge facing the gas hole. The side edge corresponding to the area of the gas hole is suspended in the opening.

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