Flexible circuit board, manufacturing method and display device

Abstract

The present invention discloses a flexible circuit board, a manufacturing method and a display device, wherein the flexible circuit board includes a circuit area and a binding area, wherein the binding area includes pins arranged at intervals, wherein the pins include: a substrate; and a conductive layer having a concave-convex pattern arranged on the substrate, wherein the dyne value of the conductive layer is greater than a preset dyne value threshold. The flexible circuit board provided in the embodiment of the present application increases the dyne value of the pin by arranging a conductive layer having a concave-convex pattern on the substrate of the pin, thereby increasing the pull-out force of the binding area of ​​the flexible circuit board, and can avoid the loosening of the binding area of ​​the flexible circuit board due to insufficient pull-out force in the prior art, causing functional abnormality. The flexible circuit board provided in the embodiment of the present application is applied to the display device to improve the product yield and the waterproof performance of the product, and has practical application value.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a flexible circuit board, a manufacturing method and a display device. Background Art

[0002] In recent years, with the development of wearable device technology, the demand for display devices has become more and more diversified. As a new generation of display technology, OLED (Organic Light-Emitting Diode) wearable display devices have put forward higher requirements on the performance of the binding area between the display panel and the flexible circuit board in order to pursue higher reliability and waterproofness. However, in the prior art, flexible circuit boards are often limited by process or manufacturing materials, which affects the product yield, reliability and waterproofness of the product. Summary of the invention

[0003] In order to solve at least one of the above problems, the first embodiment of the present invention provides a flexible circuit board, including a circuit area and a binding area, wherein the binding area includes pins arranged at intervals, and the pins include:

[0004] substrate; and

[0005] A conductive layer having a concave-convex pattern is disposed on the substrate, and the dyne value of the conductive layer is greater than a preset dyne value threshold.

[0006] In a specific embodiment, the conductive layer includes a convex portion and a concave portion, wherein:

[0007] The convex portion includes a conductive first portion disposed on the substrate and spaced apart, and a conductive second portion disposed on the conductive first portion;

[0008] The concave portion includes three conductive parts arranged on the substrate between adjacent convex portions, and the three conductive parts and the two conductive parts are arranged in the same layer.

[0009] In a specific embodiment, the conductive layer includes a convex portion and a concave portion, wherein:

[0010] The convex portion includes four conductive portions disposed at intervals on the substrate;

[0011] The concave portion includes a conductive portion disposed on the substrate between adjacent convex portions.

[0012] In a specific embodiment, the protrusion is a strip-shaped structure parallel to the extension direction of the pin.

[0013] In a specific embodiment, the protrusion is a strip-shaped structure perpendicular to the extension direction of the pin.

[0014] In a specific embodiment, the pin further includes a protection layer disposed on the conductive layer for protecting the conductive layer.

[0015] A second embodiment of the present invention provides a method for manufacturing a flexible circuit board as described in the first embodiment, comprising:

[0016] forming a circuit area;

[0017] A binding area including pins arranged at intervals is formed, wherein the pins include a conductive layer having a concave-convex pattern formed on a substrate, and a dyne value of the conductive layer is greater than a preset dyne value threshold.

[0018] In a specific embodiment, forming a bonding area including pins arranged at intervals further comprises:

[0019] forming a conductive portion disposed at intervals on the substrate;

[0020] A plating layer is formed to cover the conductive portion and the exposed substrate, wherein the plating layer includes a conductive portion 2 covering the conductive portion 1 and a conductive portion 3 covering the exposed substrate, wherein the conductive portion 1 and the conductive portion 2 form a convex portion of the conductive layer, and the conductive portion 3 forms a concave portion of the conductive layer.

[0021] In a specific embodiment, forming a bonding area including pins arranged at intervals further comprises:

[0022] forming four conductive portions spaced apart on the substrate to form convex portions of the conductive layer;

[0023] Conductive five portions are formed on the substrate between adjacent conductive four portions to form recessed portions of the conductive layer.

[0024] In a specific embodiment, after forming the bonding area including the pins arranged at intervals, the manufacturing method further includes:

[0025] forming a metal protective layer on the conductive layer;

[0026] An alloy protective layer is formed on the metal protective layer, and the metal protective layer and the alloy protective layer undergo a replacement reaction to form a protective layer covering the conductive layer.

[0027] A third embodiment of the present invention provides a display device, comprising:

[0028] display panel; and

[0029] The flexible circuit board as described in the first embodiment;

[0030] The binding area of ​​the flexible circuit board is bound to the display panel.

[0031] The beneficial effects of the present invention are as follows:

[0032] In view of the existing problems, the present invention proposes a flexible circuit board, a manufacturing method and a display device. By arranging a conductive layer with a concave-convex pattern on the substrate of the pins of the flexible circuit board, and making the dyne value of the conductive layer greater than a preset dyne value threshold, the pulling force of the binding area of ​​the flexible circuit board is improved, which can avoid the loosening of the binding area of ​​the flexible circuit board due to insufficient pulling force in the prior art, causing functional abnormality. The flexible circuit board provided in this embodiment is applied to the display device to improve the product yield and the waterproof performance of the product, and has practical application value. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 A schematic diagram showing the structure of a flexible circuit board according to an embodiment of the present invention is shown;

[0035] Figure 2 A schematic diagram showing a water drop on a flat surface according to an embodiment of the present invention;

[0036] Figure 3 A schematic diagram showing a water drop on a rough surface according to an embodiment of the present invention;

[0037] Figure 4 A schematic plan view showing pins of a flexible circuit board according to an embodiment of the present invention;

[0038] Figure 5 A schematic diagram showing the structure of a flexible circuit board according to another embodiment of the present invention is shown;

[0039] Figure 6 A schematic plan view showing pins of a flexible printed circuit board according to another embodiment of the present invention;

[0040] Figure 7a-7c A schematic diagram showing a manufacturing process of a flexible circuit board according to an embodiment of the present invention is shown;

[0041] Figure 8a and 8b A schematic plan view showing pins of a flexible printed circuit board according to another embodiment of the present invention;

[0042] Fig. 9A schematic plan view showing pins of a flexible printed circuit board according to another embodiment of the present invention;

[0043] Fig.10 A schematic diagram showing the structure of a flexible circuit board according to another embodiment of the present invention is shown;

[0044] Fig.11 A schematic plan view showing pins of a flexible printed circuit board according to another embodiment of the present invention;

[0045] Fig.12 A method for manufacturing a flexible circuit board according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0046] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present invention.

[0047] It should be noted that the terms “on…”, “formed on…” and “disposed on…” described herein may indicate that one layer is directly formed or disposed on another layer, or may indicate that one layer is indirectly formed or disposed on another layer, i.e., there are other layers between the two layers. In this article, unless otherwise specified, the term “located on the same layer” used means that two layers, parts, components, elements or parts can be formed by the same patterning process, and the two layers, parts, components, elements or parts are generally formed of the same material. In this article, unless otherwise specified, the expression “patterning process” generally includes steps such as coating, exposure, development, etching and stripping of photoresist. The expression “one-time patterning process” means a process of forming patterned layers, parts, components, etc. using a mask.

[0048] In view of the above situation, the inventors have found through extensive research and experiments that if the surface dyne value of the binding area of ​​the flexible circuit board of the display device is low, for example, less than 32A, its pull-out force generally does not reach 7N / CM, which leads to poor display function or touch function due to loose binding area during reliability testing, affecting product yield.

[0049] According to the above problems and the causes of the problems, such as Figure 1 As shown, an embodiment of the present invention provides a flexible circuit board, including a circuit area and a binding area, wherein the binding area includes pins arranged at intervals, and the pins include:

[0050] a substrate 10; and

[0051] A conductive layer 20 having a concave-convex pattern is disposed on the substrate, and the dyne value of the conductive layer is greater than a preset dyne value threshold.

[0052] The flexible circuit board proposed in this embodiment increases the pull-out force of the binding area of ​​the flexible circuit board by arranging a conductive layer with a concave-convex pattern on the substrate of the pins of the flexible circuit board, and making the dyne value of the conductive layer greater than a preset dyne value threshold. This can avoid the loosening of the binding area of ​​the flexible circuit board due to insufficient pull-out force in the prior art, causing functional abnormalities. The flexible circuit board provided in this embodiment is applied to display devices to improve product yield and improve the waterproof performance of the product, and has practical application value.

[0053] like Figure 2 As shown, the water drop contact angle θ C It is an intuitive criterion used to describe the wetting behavior of solid surfaces. For a flat surface, the size of the contact angle is determined by the surface tension of a water droplet at the solid-liquid-gas three-phase equilibrium point on the solid surface. On an ideal rigid smooth surface, the size of the angle can usually be obtained from Young's equation:

[0054] γ SG =γ SL +γ LG .cosθ C

[0055] Among them, γ SG , γ SL , γ LG Corresponding to solid-gas, solid-liquid, and liquid-gas interfacial tension.

[0056] Considering that there is no ideal smooth interface in actual situation, Figure 3 As shown in Figure 2, the Wenzel equation model is proposed based on the Young equation. This equation takes into account the solid-liquid contact angle θ under the rough interface. W The equation is as follows:

[0057] cosθ W =γ.cosθ C

[0058] Where γ is the roughness of the rough surface.

[0059] From the above equation, it can be seen that when θ C When it is less than 90°, the object is hydrophilic; when γ (γ ≥ 1) increases, the solid-liquid contact angle θ W With cosθ W The value increases and decreases, that is, the more hydrophilic. C When it is greater than 90°, the object is hydrophobic; when γ (γ ≥ 1) increases, the solid-liquid contact angle θ W With cosθ WThe value decreases and increases, the more hydrophobic it is.

[0060] It can be seen that increasing the surface roughness of the flexible circuit board can make its surface more hydrophilic, so that the dyne value of the conductive layer is greater than the preset dyne value threshold, so that the binding area meets the pull-out force requirement. For example, the preset dyne value threshold is set to 32A, so that the dyne value of the conductive layer is greater than 32A, so that its pull-out force can meet the requirement of being greater than or equal to 7N / CM.

[0061] The plan view of the pins of the flexible circuit board is as follows Figure 4 As shown, in order to improve the surface roughness of the flexible circuit board to further improve its dyne value, in an optional embodiment, as shown in FIG. Figure 5 As shown, the conductive layer includes a convex portion and a concave portion, wherein:

[0062] The convex portion includes a conductive first portion 201 disposed on the substrate and spaced apart therefrom, and a conductive second portion 202 disposed on the conductive first portion;

[0063] The concave portion includes three conductive parts 203 arranged on the substrate between adjacent convex portions. The three conductive parts and the two conductive parts are arranged in the same layer, that is, formed using the same process steps, which can simplify the process flow and save production costs.

[0064] In one optional embodiment, Figure 6 As shown, the protrusion is a strip structure parallel to the extension direction of the pin, and the cross-sectional view of the pin along the AA line is as shown in Figure 5 As shown,

[0065] In a specific embodiment, the manufacturing of the above-mentioned flexible circuit board is described in detail as an example.

[0066] First, a circuit area is formed;

[0067] Secondly, a binding area including pins arranged at intervals is formed, wherein the pins include a conductive layer having a concave-convex pattern formed on a substrate, and the dyne value of the conductive layer is greater than a preset dyne value threshold.

[0068] Specific: such as Figure 7a As shown, a first plating layer is formed on the substrate,

[0069] like Figure 7b As shown, a film is laid on the first plating layer along the extension direction parallel to the pin, an exposure, development and etching process is performed to etch away the first plating layer not covered by the film, and then a stripping process is performed to remove the film to form a conductive portion arranged at intervals.

[0070] In this embodiment, if Figure 6As shown, the Y direction is the extension direction of the pin, and the X direction is the extension direction perpendicular to the pin. In this embodiment, the protrusion is set as a strip structure extending along the Y direction, and the position of the first coating covered by the film corresponds to the position of the conductive part.

[0071] It is understandable that those skilled in the art may also form the conductive portion by other means, for example, laying a mask on the first coating layer along an extension direction parallel to the pin, performing exposure, development, etching and stripping to form a spaced conductive portion, wherein the position of the first coating layer covered by the mask corresponds one-to-one to the position of the conductive portion; for another example, performing laser etching on the first coating layer, and the first coating layer not laser etched corresponds one-to-one to the position of the conductive portion.

[0072] like Figure 7c As shown, a plating layer is formed to cover the conductive portion one and the exposed substrate, and the plating layer includes a conductive portion two covering the conductive portion one, and a conductive portion three covering the exposed substrate.

[0073] In this embodiment, the conductive part one 201 and the conductive part two 202 form a convex part of the conductive layer, and the conductive part three 203 forms a concave part of the conductive layer, thereby forming a conductive layer with a concave-convex pattern, and the dyne value of the conductive layer is greater than a preset dyne value threshold, thereby improving the pulling force of the binding area of ​​the flexible circuit board, and avoiding the loosening of the binding area of ​​the flexible circuit board due to insufficient pulling force in the prior art, causing functional abnormality.

[0074] It is worth noting that the present application does not specifically limit the materials of the conductive part 1, conductive part 2 and conductive part 3, which can be copper or other conductive metals. In addition, due to the tip effect when forming the plating layer covering the conductive part 1 and the exposed substrate, the thickness of the conductive part 3 formed in the same layer and located in the concave part relative to the substrate is greater than the thickness of the conductive part 2 located in the convex part relative to the substrate, but as long as the sum of the thicknesses of the conductive part 1 and the conductive part 2 arranged on the conductive part 1 relative to the substrate is greater than the thickness of the conductive part 3 relative to the substrate, for example, the thickness of the conductive part 1 is 8-12um, the thickness of the conductive part 2 is 4-9um, and the thickness of the conductive part 3 is 7-11um. Although the thickness of the conductive part 3 is greater than the thickness of the conductive part 2 arranged in the same layer, since the sum of the thicknesses of the conductive part 1 and the conductive part 2 is greater than the thickness of the conductive part 3, it can still play a role in increasing the surface roughness of the conductive layer of the pin of the flexible circuit board, thereby improving the pull-out force of the binding area of ​​the flexible circuit board, and can avoid the loosening of the binding area of ​​the flexible circuit board due to insufficient pull-out force in the prior art, causing functional abnormality, so the thickness of the conductive part 1, conductive part 2 and conductive part 3 is not specifically limited here.

[0075] It should be noted that in Figure 6 In the embodiment, since each convex portion is in the shape of a strip, the concave portion between the convex portions is also in the shape of a strip, and the length direction of the convex portion is parallel to the Y direction. However, the present application does not specifically limit this, and the convex portion may also be in other shapes, such as Figure 8a The rectangle shown, Figure 8b The ellipse and the like shown in the figure, those skilled in the art should select an appropriate concave-convex pattern according to actual application requirements, which will not be elaborated here.

[0076] Taking into account the limitation of the size of the manufacturing materials, for example, the size of a single pin of a common flexible circuit board is 0.75 mm in length, 0.14 mm in width, and a gap of 0.10 mm between the pins, the conductive portion arranged at intervals along the substrate parallel to the extension direction of the pin is not sufficient to meet the pulling force requirement of the binding area of ​​the flexible circuit board. In an optional embodiment, as shown in Figure 7, the protrusion is a strip structure perpendicular to the extension direction of the pin.

[0077] In this embodiment, if Fig. 9 As shown, the Y direction is the extension direction of the pin, and the X direction is perpendicular to the extension direction of the pin. In this embodiment, the protrusion is set as a strip structure extending along the X direction. The cross-sectional view of the pin along the BB line is as shown in FIG. Figure 5 As shown. According to the Wenzel equation model, compared with the convex portion extending along the Y direction in the aforementioned embodiment, the convex portion extending along the X direction in this embodiment further increases the roughness of the surface of the flexible circuit board, and increases the dyne value of the surface to meet the pull-out force requirement of the binding area of ​​the flexible circuit board, thereby avoiding the loosening of the binding area of ​​the flexible circuit board in the prior art due to insufficient pull-out force, causing functional abnormality. The flexible circuit board provided in this embodiment is applied to the display device to improve the product yield and the waterproof performance of the product, and has practical application value. It should be noted that in Figure 8, since each convex portion is in the shape of a strip, each concave portion between each convex portion is also in the shape of a strip, and the length direction of the concave and convex portion is parallel to the Y direction. However, this application does not make specific limitations on this, but the present invention is not limited to this. In actual applications, the concave and convex portions may also be other shapes, for example, the convex portion is rectangular, elliptical, etc. Those skilled in the art should select appropriate concave and convex patterns according to actual application requirements, which will not be repeated here.

[0078] In this embodiment, the length direction of the convex portion is parallel to the X direction, but the present invention is not limited thereto. In practical applications, the angle between the length direction of the convex portion and the Y direction may be greater than 0 degrees and less than 45 degrees. For example, the length direction of the convex portion is the A direction, and the angle b between the A direction and the Y direction is greater than 0 degrees and less than 45 degrees.

[0079] In the embodiment of the present application, the substrate is made of a flexible material, such as PI (Polyimide), PET (Polyethylene Terephthalate), PDMS (Polydimethylsiloxane), PMMA (Polymethyl Methacrylate), etc.

[0080] It is worth noting that the present application does not specifically limit the flexible circuit board, and the flexible circuit board may be a touch flexible circuit board TFPC, a main flexible circuit board MFPC, or other flexible circuit boards bound to a display panel.

[0081] Since the conductive layer is easily oxidized, in a specific embodiment, Fig.10 As shown, the flexible circuit board further includes: the pin further includes a protection layer 30 disposed on the conductive layer for protecting the conductive layer.

[0082] In a specific embodiment, the manufacturing of the above-mentioned flexible circuit board is described in detail as an example.

[0083] First, a circuit area is formed;

[0084] Secondly, a binding area including pins arranged at intervals is formed, wherein the pins include a conductive layer having a concave-convex pattern formed on a substrate, and the dyne value of the conductive layer is greater than a preset dyne value threshold, specifically:

[0085] forming a conductive portion disposed at intervals on a substrate;

[0086] A plating layer is formed to cover the conductive portion and the exposed substrate, wherein the plating layer includes a conductive portion 2 covering the conductive portion 1 and a conductive portion 3 covering the exposed substrate, wherein the conductive portion 1 and the conductive portion 2 form a convex portion of the conductive layer, and the conductive portion 3 forms a concave portion of the conductive layer.

[0087] Finally, a protective layer for protecting the conductive layer is formed on the conductive layer, specifically:

[0088] forming a metal protective layer on the conductive layer;

[0089] In this embodiment, the materials of the first conductive part, the second conductive part and the third conductive part are copper, and the material of the metal protection layer is palladium.

[0090] The conductive part one, the conductive part two and the conductive part three undergo a replacement reaction with the palladium ions, the copper on the surface of the conductive part one, the conductive part two and the conductive part three releases electrons to form copper ions, and the palladium ions obtain electrons to form metallic palladium, thereby forming a layer of palladium on the conductive part one, the conductive part two and the conductive part three as a metal protective layer. Since the catalytic active center of palladium can easily absorb hydrogen ions, it can be used as a catalyst to facilitate the subsequent formation of a protective layer of the conductive layer.

[0091] An alloy protective layer is formed on the metal protective layer, and a protective layer covering the conductive layer is formed through a replacement reaction.

[0092] In this embodiment, the material of the alloy protection layer is a nickel-phosphorus alloy layer, and the material of the protection layer covering the conductive layer is gold.

[0093] When the alloy protective layer is formed, the hypophosphite is oxidized to form hydrogen ions and release electrons, the nickel ions obtain electrons and are reduced to metallic nickel, the hydrogen ions obtain electrons and are reduced to hydrogen, and the hypophosphite obtains electrons to form metallic phosphorus, thereby forming a nickel-phosphorus alloy layer, which serves as a barrier layer for the mutual migration or diffusion of copper and gold.

[0094] Then, the nickel in the nickel-phosphorus alloy layer undergoes a replacement reaction with the gold ions, the nickel releases electrons to form nickel ions, and the gold ions obtain electrons to form metallic gold, thereby forming a protective layer covering the conductive layer.

[0095] In this embodiment, since the protective layer is formed by sending a replacement reaction on the conductive layer using chemical principles, the thickness of the protective layer is uniform, thereby preventing the conductive layer from being oxidized and the concave-convex pattern of the conductive layer from being destroyed, ensuring that the dyne value of the conductive layer is greater than the preset dyne value threshold, thereby increasing the pulling force of the binding area of ​​the flexible circuit board, and avoiding the loosening of the binding area of ​​the flexible circuit board due to insufficient pulling force in the prior art, causing functional abnormalities. The flexible circuit board provided in this embodiment is applied to a display device to improve the product yield and improve the waterproof performance of the product.

[0096] It can be understood that the above examples are only examples listed for a better understanding of the technical solutions of the embodiments of the present invention, and are not the only limitations on the embodiments of the present invention. The protective layer covering the conductive layer with the metal protective layer or the alloy protective layer can also be made of other materials as long as the conductive layer can be prevented from oxidation.

[0097] In order to further simplify the structure of the flexible circuit board, in another optional embodiment, as Fig.11 As shown, the conductive layer includes a convex portion and a concave portion, wherein:

[0098] The convex portion includes four conductive portions 204 disposed at intervals on the substrate;

[0099] The concave portion includes a conductive portion 205 disposed on the substrate between adjacent convex portions.

[0100] Compared with the need to form a conductive second part covering a conductive first part in the aforementioned embodiment, the present embodiment does not need to form a conductive second part covering a conductive fourth part. Instead, a conductive fifth part having a thickness less than that of the conductive fourth part is directly formed between each of the conductive fourth parts to form a conductive layer having a concave-convex pattern, so that the dyne value of the conductive layer is greater than a preset dyne value threshold, thereby increasing the pulling force of the binding area of ​​the flexible circuit board, further simplifying the structure of the flexible circuit board and saving manufacturing costs.

[0101] In a specific embodiment, the manufacturing of the above-mentioned flexible circuit board is taken as an example for detailed description, specifically:

[0102] First, a circuit area is formed;

[0103] Secondly, a binding area including pins arranged at intervals is formed, wherein the pins include a conductive layer having a concave-convex pattern formed on a substrate, and the dyne value of the conductive layer is greater than a preset dyne value threshold, specifically:

[0104] forming four conductive portions spaced apart on the substrate to form convex portions of the conductive layer;

[0105] Conductive five portions are formed on the substrate between adjacent conductive four portions to form recessed portions of the conductive layer.

[0106] In this embodiment, since the thickness of the fourth conductive part 204 is greater than the thickness of the fifth conductive part 205, a conductive layer with a concave-convex pattern is formed, which not only makes the dyne value of the conductive layer greater than the preset dyne value threshold, thereby improving the pulling force of the binding area of ​​the flexible circuit board, but also avoids the loosening of the binding area of ​​the flexible circuit board due to insufficient pulling force in the prior art, causing functional abnormalities, and further simplifies the structure of the flexible circuit board and saves production costs.

[0107] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0108] It is also worth noting that the flexible circuit board proposed in the embodiment of the present invention is not limited to the specific structure formed by the manufacturing method of the above embodiment of the present invention, and the specific structure of the flexible circuit board can also be formed by other processing techniques by those skilled in the art.

[0109] Corresponding to the flexible circuit board provided in the above embodiment, as Fig.12 As shown, one embodiment of the present application further provides a method for manufacturing the flexible circuit board described in the above embodiment, comprising:

[0110] forming a circuit area;

[0111] A binding area including pins arranged at intervals is formed, wherein the pins include a conductive layer having a concave-convex pattern formed on a substrate, and a dyne value of the conductive layer is greater than a preset dyne value threshold.

[0112] The manufacturing method of the flexible circuit board provided in the present embodiment increases the pull-out force of the binding area of ​​the flexible circuit board by arranging a conductive layer with a concave-convex pattern on the substrate of the pins of the flexible circuit board, and making the dyne value of the conductive layer greater than a preset dyne value threshold, thereby avoiding the loosening of the binding area of ​​the flexible circuit board due to insufficient pull-out force in the prior art, resulting in functional abnormality. The flexible circuit board provided in the present embodiment is applied to a display device to improve the product yield and the waterproof performance of the product, and has practical application value.

[0113] In an optional embodiment, forming a binding area including pins arranged at intervals further comprises:

[0114] forming a conductive portion disposed at intervals on the substrate;

[0115] A plating layer is formed to cover the conductive portion and the exposed substrate, wherein the plating layer includes a conductive portion 2 covering the conductive portion 1 and a conductive portion 3 covering the exposed substrate, wherein the conductive portion 1 and the conductive portion 2 form a convex portion of the conductive layer, and the conductive portion 3 forms a concave portion of the conductive layer.

[0116] In this embodiment, the above-mentioned manufacturing method is used to form Figure 5 The conductive part 1 201, the conductive part 202 and the conductive part 3 203 shown in the figure, since the sum of the thickness of the conductive part 1 201 and the conductive part 202 is greater than the thickness of the conductive part 3 203, a conductive layer with a concave-convex pattern is formed, and the dyne value of the conductive layer is made greater than the preset dyne value threshold, thereby improving the pulling force of the binding area of ​​the flexible circuit board, which can avoid the loosening of the binding area of ​​the flexible circuit board due to insufficient pulling force in the prior art and causing functional abnormality. The flexible circuit board provided in this embodiment is applied to the display device to improve the product yield and improve the waterproof performance of the product, and has practical application value.

[0117] In another optional embodiment, forming the binding area including the pins arranged at intervals further comprises:

[0118] forming four conductive portions spaced apart on the substrate to form convex portions of the conductive layer;

[0119] Conductive five portions are formed on the substrate between adjacent conductive four portions to form recessed portions of the conductive layer.

[0120] In this embodiment, compared with the previous embodiment where the second conductive part covering the first conductive part is required, this embodiment does not need to form a conductive part covering the fourth conductive part. Fig.11 As shown, a conductive fifth part 205 having a thickness less than that of the conductive fourth part 204 is directly formed between each conductive fourth part 204 to form a conductive layer with a concave-convex pattern. This not only makes the dyne value of the conductive layer greater than a preset dyne value threshold, thereby increasing the pulling force of the binding area of ​​the flexible circuit board, but also can avoid the loosening of the binding area of ​​the flexible circuit board due to insufficient pulling force in the prior art, causing functional abnormalities, and can further save production costs.

[0121] In an optional embodiment, after forming the binding area including the pins arranged at intervals, the manufacturing method further includes:

[0122] forming a metal protective layer on the conductive layer;

[0123] An alloy protective layer is formed on the metal protective layer, and a protective layer covering the conductive layer is formed through a replacement reaction.

[0124] In this embodiment, the above-mentioned manufacturing method is used to form Fig.10 The protective layer 30 shown can not only prevent the oxidation of the conductive layer with the concave-convex pattern, but also ensure that the dyne value of the conductive layer is greater than the preset dyne value threshold, thereby increasing the pulling force of the binding area of ​​the flexible circuit board, and can avoid the loosening of the binding area of ​​the flexible circuit board due to insufficient pulling force in the prior art, causing functional abnormalities.

[0125] Since the method for manufacturing a flexible circuit board provided in the embodiment of the present application corresponds to the flexible circuit boards provided in the above-mentioned embodiments, the previous implementation is also applicable to the method for manufacturing a flexible circuit board provided in the present embodiment and will not be described in detail in the present embodiment.

[0126] Another embodiment of the present invention provides a display device, including:

[0127] display panel; and

[0128] The flexible circuit board as described in the above embodiment;

[0129] The binding area of ​​the flexible circuit board is bound to the display panel.

[0130] In this embodiment, by binding the binding area of ​​the flexible circuit board to the display panel and making the dyne value on the surface of the flexible circuit board greater than a preset dyne value threshold, the pull-out force of the binding area of ​​the flexible circuit board is increased, thereby avoiding functional abnormalities of the display device in the prior art caused by loosening of the binding area due to insufficient pull-out force of the binding area of ​​the flexible circuit board, thereby improving the product yield of the display device and the waterproof performance of the display device, and having practical application value.

[0131] In a specific embodiment, a display panel includes: a substrate;

[0132] A driving circuit layer is arranged on the substrate, and the driving circuit layer includes a thin film transistor, specifically including an active layer, a gate, a source electrode and a drain electrode arranged on the substrate.

[0133] A light emitting device layer is arranged on the driving circuit layer, the light emitting device layer comprises an anode, a light emitting material and a cathode, the anode is electrically connected to a source or a drain through a via hole, and the thin film transistor is used to drive the light emitting device layer to emit light.

[0134] The encapsulation layer is arranged on the light emitting device layer, and the encapsulation layer includes an inorganic layer and an organic layer arranged at intervals, for example, a three-layer encapsulation structure of inorganic layer-organic layer-inorganic layer, or a five-layer encapsulation structure.

[0135] The anode and cathode electrodes, as well as the signal lines for display and control, are connected to the binding area of ​​the display panel via leads, thereby connecting to the binding area of ​​the flexible circuit board, that is, binding the flexible circuit board to the display panel.

[0136] It is understandable that the display device described in this embodiment can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame or a navigator.

[0137] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A flexible circuit board, characterized in that: It includes a circuit area and a binding area, wherein the binding area includes pins arranged at intervals, and the pins include: substrate; and A conductive layer having a concave-convex pattern disposed on the substrate, wherein the dyne value of the conductive layer is greater than a preset dyne value threshold; The pin further includes a protective layer disposed on the conductive layer for protecting the conductive layer, wherein the protective layer is formed by a replacement reaction between a metal protective layer and an alloy protective layer covering the conductive layer.

2. The flexible circuit board according to claim 1, characterized in that: The conductive layer includes convex portions and concave portions, wherein The convex portion includes a conductive first portion disposed on the substrate and spaced apart, and a conductive second portion disposed on the conductive first portion; The concave portion includes three conductive parts arranged on the substrate between adjacent convex portions, and the three conductive parts and the two conductive parts are arranged in the same layer.

3. The flexible circuit board according to claim 1, characterized in that: The conductive layer includes a convex portion and a concave portion, wherein The convex portion includes four conductive portions disposed at intervals on the substrate; The concave portion includes a conductive portion disposed on the substrate between adjacent convex portions.

4. The flexible circuit board according to claim 2 or 3, characterized in that: The protrusion is a strip-shaped structure parallel to the extension direction of the pin.

5. The flexible circuit board according to claim 2 or 3, characterized in that: The protrusion is a strip-shaped structure perpendicular to the extension direction of the pin.

6. A method for manufacturing a flexible circuit board as claimed in any one of claims 1 to 3, characterized in that: include: forming a circuit area; forming a binding area including pins arranged at intervals, wherein the pins include a conductive layer having a concave-convex pattern formed on a substrate, and a dyne value of the conductive layer is greater than a preset dyne value threshold; A protective layer covering the conductive layer is formed, wherein the conductive layer is formed by: forming a metal protective layer on the conductive layer; An alloy protective layer is formed on the metal protective layer, and the metal protective layer and the alloy protective layer undergo a replacement reaction to form a protective layer covering the conductive layer.

7. The manufacturing method according to claim 6, characterized in that: The forming of the bonding area including the pins arranged at intervals further comprises: forming a conductive portion disposed at intervals on the substrate; A plating layer is formed to cover the conductive portion and the exposed substrate, wherein the plating layer includes a conductive portion 2 covering the conductive portion 1 and a conductive portion 3 covering the exposed substrate, wherein the conductive portion 1 and the conductive portion 2 form a convex portion of the conductive layer, and the conductive portion 3 forms a concave portion of the conductive layer.

8. The manufacturing method according to claim 6, characterized in that: The forming of the bonding area including the pins arranged at intervals further comprises: forming four conductive portions spaced apart on the substrate to form convex portions of the conductive layer; Conductive five portions are formed on the substrate between adjacent conductive four portions to form recessed portions of the conductive layer.

9. A display device, characterized in that: include: Display panel; as well as The flexible circuit board as claimed in any one of claims 1 to 5; The binding area of ​​the flexible circuit board is bound to the display panel.

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