Fabricating a fabric hybrid electronic integrated system by laser fusion - Patent Application 20100122633

The laser-fused fabric hybrid electronic system integrates rigid components with flexible fabrics, ensuring comfort and functional versatility by forming conductive patterns and sensors on both fabric sides, enabling stable wireless signal monitoring.

JP7777379B1Active Publication Date: 2025-11-28ZHEJIANG UNIV
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Patent Information

Application Number
JP2025135708
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2025-01-03
Filing Date
2025-08-18
Publication Date
2025-11-28
Estimated Expiration
2045-08-18

AI Technical Summary

Technical Problem

Existing fabric electronic systems face challenges in integrating rigid components with flexible fabrics, leading to mechanical incompatibility, limited functional versatility, and wearing discomfort.

Method used

A fabric hybrid electronic integrated system is manufactured by laser fusion, combining laser-induced flexible sensors, vertical interconnect vias, conductive fabric lines, and silicon-based chips, using CO2 and ultraviolet lasers to form conductive patterns and integrate components on both sides of the fabric substrate.

Benefits of technology

The system achieves stable performance, withstands washing and rubbing, and enables versatile circuit functions with improved portability and functional density, allowing wireless monitoring of physiological signals like heart rate, respiration, and electrocardiogram.

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Abstract

To provide a fabric hybrid electronic system that can realize multiple functions such as sensing detection and signal transmission, and also has stable performance that can withstand washing and rubbing. [Solution] The system includes a chip component, a laser-induced flexible sensor, a fabric substrate, a conductive fabric line, a physiological electrode, and a vertical interconnection via, and uses the laser's material modification ability to form a patterned sensor 131 on the surface 111 of the fabric substrate, uses the laser's micro-cutting ability to form patterned flexible electrodes and interconnection wires, and forms highly stable vertical interconnection vias by infiltrating a conductive composite into the inherent structure of the fabric, and welds the chip electronic device to form a fabric hybrid electronic integrated system.
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