Electronic device

JP2024099989A5Pending Publication Date: 2026-01-19JAPAN DISPLAY INC
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Patent Information

Application Number
JP2023003662
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-01-13
Publication Date
2026-01-19

AI Technical Summary

Technical Problem

Stretchable electronic devices experience stress and connection issues at the terminal portion due to the mismatch in flexibility and expandability between flexible wiring boards and the display device, leading to peeling and increased connection resistance, which results in noise.

Method used

The active and terminal areas of the stretchable electronic device are integrated with meandering scanning and signal lines, and the terminal area has a Young's modulus equal to or greater than the active area, with terminal wiring also having a meandering structure, ensuring continuous formation and reduced stress.

Benefits of technology

This configuration minimizes stress at the connection between the flexible wiring board and the electronic device, preventing peeling and noise, thereby enhancing the reliability and expandability of the device.

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Abstract

To provide a stretchable electronic device with high reliability.SOLUTION: A configuration of the present invention includes a stretchable electronic device in which an active region 5 and a terminal region 6 are formed continuously. In the active region 5, a scan line with a meander structure and a signal line with a meander structure are formed. In the terminal region 6, a terminal 210 connected to a wiring board 300 is formed on the opposite side of the active region 5. In the terminal region 6, an electronic component 220 is mounted. A first terminal wire 200 with the meander structure is formed between the active region 5 and the electronic component 220. A second terminal wire 200 with the meander structure is formed between the electronic component 220 and the terminal 210.SELECTED DRAWING: Figure 10
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Description

[Technical field]

[0001] The present invention relates to flexible and stretchable electronic devices. [Background technology]

[0002] There is an increasing demand for electronic devices that are flexible or stretchable. Applications of such stretchable electronic devices include, for example, attaching them to the housing of an electronic device having a curved surface, attaching them to a display medium having a curved surface, attaching them to the human body as a sensor, etc. Examples of elements include sensors such as touch sensors, temperature sensors, pressure sensors, and acceleration sensors, as well as light-emitting elements and light valves that constitute various display devices.

[0003] In a sensor device, scanning lines and signal lines are used to control each element. In a stretchable electronic device, the device needs to be able to withstand bending and stretching. Patent Document 1 describes a structure in which the scanning lines and video signal lines are made to meander (hereinafter also referred to as a meandering structure) to be able to withstand bending and stretching. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2021-106199 A Summary of the Invention [Problem to be solved by the invention]

[0005] By making the scanning lines and signal lines meandering, it is possible to obtain a certain degree of resistance to stretching and bending of the stretchable electronic device. Even a stretchable display device needs to be supplied with power and signals from the outside. Such power and signal supply is performed via a flexible wiring substrate.

[0006] However, although a flexible wiring board can be bent flexibly, it cannot be expected that it will expand or contract. Therefore, when a stretchable electronic device is stretched, stress is generated between the flexible wiring board and the display device. In addition, flexible wiring boards are often used in a bent state, and when they are bent, stress is likely to be generated between the flexible wiring board and the stretchable electronic device.

[0007] The flexible wiring board and the stretchable display device are connected via a plurality of terminals. Therefore, this stress occurs in the terminal portion. If the stress becomes large, the terminal portion may peel off. Even if peeling does not occur, the connection resistance at the terminal increases. This change in connection resistance is observed as noise.

[0008] The object of the present invention is to avoid stress at the connection between a flexible wiring board and a stretchable electronic device, to prevent connection failure or noise at the connection, and to realize a highly reliable stretchable electronic device. [Means for solving the problem]

[0009] The present invention achieves the above object, and representative means thereof are as follows.

[0010] (1) A stretchable electronic device in which an active area and a terminal area are formed continuously, wherein meander-structured scan lines and meander-structured signal lines are formed in the active area, a terminal for connecting to a wiring board is formed on the opposite side of the active area in the terminal area, an electronic component is mounted in the terminal area, a first terminal wiring having a meander structure is formed between the active area and the electronic component, and a second terminal wiring having a meander structure is formed between the electronic component and the terminal.

[0011] (2) A stretchable electronic device in which an active area and a terminal area are continuously formed, wherein meander-structured scanning lines and meander-structured signal lines are formed in the active area, terminals for connecting to a wiring board are formed on the opposite side of the active area in the terminal area, and meander-structured terminal wiring is formed in the terminal area, and the Young's modulus in the planar direction of the terminal area is greater than the Young's modulus in the planar direction of the active area.

[0012] (3) A stretchable electronic device in which an active area and a terminal area are continuously formed, wherein meander-structured scanning lines and meander-structured signal lines are formed in the active area, a terminal for connecting to a wiring board is formed in the terminal area on the opposite side of the active area, linear terminal wiring is formed in the terminal area, and the Young's modulus in the planar direction of the terminal area is greater than the Young's modulus in the planar direction of the active area. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view of a stretchable electronic device as a comparative example. [Diagram 2] 2 is a cross-sectional view taken along line AA in FIG. 1. [Diagram 3] FIG. 2 is an enlarged plan view of an active area. [Figure 4] FIG. 4 is a cross-sectional view of FIG. [Diagram 5] 3C is a cross-sectional view taken along line CC in FIG. [Figure 6] FIG. 2 is a plan view showing the element and its periphery. [Figure 7] FIG. 7 is a cross-sectional view taken along the line DD in FIG. 6. [Figure 8] FIG. 1 is a plan view of a stretchable electronic device according to a first embodiment. [Figure 9] 9 is a cross-sectional view of FIG. 8 taken along line E-E. [Figure 10] FIG. 2 is a plan view of a terminal portion of the stretchable electronic device of the first embodiment. [Figure 11]FIG. 11 is a cross-sectional view of FIG. 10 taken along line F-F. [Figure 12] FIG. 11 is a cross-sectional view of FIG. [Figure 13] FIG. 11 is a plan view of a stretchable electronic device showing another aspect of the first embodiment. [Figure 14] FIG. 11 is a plan view of the terminal area of ​​the stretchable electronic device of the second embodiment. [Figure 15] FIG. 15 is a cross-sectional view of FIG. 14 . [Figure 16] FIG. 15 is a cross-sectional view of FIG. 14 in accordance with II. [Figure 17] FIG. 11 is a plan view of a stretchable electronic device according to another aspect of the second embodiment. [Figure 18] FIG. 18 is a cross-sectional view of FIG. 17 . DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The present invention will be described in detail below with reference to the following examples. Hereinafter, the electronic device that can be expanded or contracted is also called a stretchable electronic device. EXAMPLES

[0015] The present invention relates particularly to the configuration of the terminal region of the stretchable electronic device. Since the terminal region 6 is formed simultaneously with the active region 5, the configuration of the active region 5 will be described first. FIG. 1 is a plan view of a stretchable electronic device 1 as a comparative example 1 for explaining the configuration of the active region 5. The active region 5 of the comparative example and the embodiment described later have almost the same configuration. The stretchable electronic device 1 of FIG. 1 is flat overall, but can be curved in the z direction or stretched on the xy plane. The breaking elongation rate, that is, the elongation rate until the stretchable electronic device 1 breaks, varies depending on the material constituting the stretchable electronic device 1. When the stretchable electronic device 1 is mainly made of ductile organic materials, the elongation rate can be about 30%, and in some cases, about 60%. On the other hand, when a relatively large amount of inorganic materials is used, the elongation rate is about 10% to 15%.

[0016] In FIG. 1, the stretchable electronic device 1 has an active area 5 occupying a large area. Electronic elements 100 are arranged in a matrix in the active area 5. The electronic elements 100 may be, for example, sensors, semiconductor elements, actuators, etc. The sensors may be, for example, optical sensors that detect visible light or infrared light, temperature sensors, pressure sensors, touch sensors, etc. The semiconductor elements may be, for example, light-emitting elements, light-receiving elements, diodes, transistors, etc. The actuators may be, for example, piezoelectric elements, etc.

[0017] Each electronic element 100 is connected to a scanning line 110 and a signal line 120. The scanning line 110 extends in the horizontal direction (x direction) and is arranged in the vertical direction (y direction), while the signal line 120 extends in the vertical direction and is arranged in the horizontal direction. In FIG. 1, both the scanning line 110 and the signal line 120 extend in a straight line, but this is for the purpose of not complicating the drawing. In reality, as shown in FIG. 3, the scanning line 110 extends in the horizontal direction and the signal line 120 extends in the vertical direction in a meandering manner.

[0018] In Fig. 1, driving circuits 115, 125 and a terminal area 6 are arranged outside the active area 5. Scanning line driving circuits 115 are arranged on both sides of the active area 5 in the x direction, a power supply circuit 130 for supplying power to the electronic element 100 exists on the upper side of the active area 5 in the y direction, and a signal line driving circuit 125 is arranged on the lower side of the active area 5 in the y direction. The terminal area 6 is arranged further below the signal line driving circuit 125. A flexible wiring board 150 is connected to the terminal area 6 for supplying power and signals to the stretchable electronic device 1 and for sending signals to the outside. Although not shown, the flexible wiring board 150 is further connected to another wiring board 300 (described later).

[0019] Fig. 2 is a cross-sectional view taken along the line AA in Fig. 1. Fig. 2 is a schematic cross-sectional view. In Fig. 2, the electronic elements 100, scanning lines 110, signal lines 120, etc. described in Fig. 1 are present in an element layer 2. In other words, the function of the stretchable electronic device 1 is present in the element layer 2. This element layer 2 is covered from above by an upper protective layer 3 and from below by a lower protective layer 4. Both the upper protective layer 3 and the lower protective layer 4 are formed from materials that are easily elastically deformed, i.e., materials with a small Young's modulus.

[0020] 2, the active region 5 and the driving circuits 115, 125, etc. are covered by an upper protective layer 3 and a lower protective layer 4. An end portion of the element layer 2 has a portion that is not covered by the upper protective layer 3, and this portion serves as a terminal region 6 in the comparative example. The terminal region 6 is protected only by the lower protective layer 4. A flexible wiring board 150 is connected to the terminal region 6.

[0021] Fig. 3 is an enlarged plan view of the active region 5. Fig. 3 shows the main components of the element layer 2 shown in Fig. 2. That is, the element layer 2 shown in Fig. 2 does not exist as a single planar substrate, but is composed of a base material 10 having a meandering structure 102 in which scanning lines 110 and signal lines 120 are formed, and an element region 101 formed at the intersection of the scanning lines 110 and the signal lines 120, as shown in Fig. 3. In other words, the base material 10 has a mesh-like structure.

[0022] In Fig. 3, the meandering structure 102 and the element region 101 present at the intersection are made of a resin such as polyimide. This resin is used as the base material 10, and scanning lines 110, signal lines 120, elements 100, etc. are formed thereon. In Fig. 3, the element 100 exists in the element region 101. This configuration is used in order to reduce stress on each component even when the stretchable electronic device 1 is stretched.

[0023] 3, the diameter of the element 100 in the x direction and the diameter in the y direction are each, for example, 100 μm. The pitch of the elements 100 in the x direction and the pitch in the y direction are, for example, 250 μm. The width of the substrate 10 including the scanning lines 110, the video signal lines 120, etc. in the meandering structure 102 is, for example, 30 μm.

[0024] Fig. 4 is a BB cross-sectional view of Fig. 3, and is a cross-sectional view of the meander structure 102 including the scanning line 110. In Fig. 4, a first organic insulating film 20 is formed on the substrate 10. The scanning line 110 is formed on the first organic insulating film 20. A second organic insulating film 30 is formed covering the scanning line 110. The plan view of the meander structure 102 including the scanning line 110 in Fig. 3 represents the planar shape of the substrate 10.

[0025] The substrate 10, the first organic insulating film 20, and the second organic insulating film 30 are formed of, for example, polyimide. Polyimide has excellent performance in terms of mechanical strength, heat resistance, and the like, and is therefore suitable as the substrate 10 for the scan lines 110 and the signal lines 120. That is, when the stretchable electronic device 1 is stretched, the stress generated in the meandering structure 102 is borne by the polyimide forming the substrate 10 and the first organic insulating film 20, etc., and therefore the stress applied to the scan lines 110, etc., formed of metal, is reduced.

[0026] The scanning line 110 has, for example, a TAT (Ti-Al-Ti, titanium-aluminum-titanium) structure. In the three-layer structure, Al is mainly responsible for electrical conductivity, and Ti is used to protect Al or to improve the connection with other wiring. In addition, the material of the scanning line 110 can be MoW (molybdenum tungsten alloy), etc., and can have various configurations depending on the application of the stretchable electronic device 1.

[0027] As shown in Fig. 3, the meandering structure 102 having the scanning lines 110 (hereinafter simply referred to as the scanning lines 110) has an unstable shape, so it is fixed from above and below with protective layers (3 and 4 shown in Fig. 2). First, the meandering structure 102 on which the scanning lines 110 are formed is covered with an upper buffer layer 40 made of an organic material. This is then covered with a protective layer 50 made of an organic material. A lower buffer layer 60 made of an organic material is disposed on the lower surface of the substrate 10, and a lower protective layer 70 made of an organic material is formed underneath.

[0028] In this way, the shape is stabilized by the buffer layers 40, 60 and protective layers 50, 70 arranged above and below. Since the electronic device of the present invention is a stretchable electronic device, it is necessary that it is expandable and contractible against external tensile stress. Therefore, it is desirable that the buffer layers 40, 60 and protective layers 50, 70 sandwiching the meander structure 102 are made of a material that is easier to stretch than the polyimide that forms the base material 10 and the first organic insulating film 20, i.e., a material with a small Young's modulus. Examples of such materials include resins such as acrylic, urethane, epoxy, and silicone silicone.

[0029] FIG. 5 is a cross-sectional view taken along the CC line in FIG. 3, and is a cross-sectional view of the meander structure 102 having the signal line 120. In the meander structure 102 in FIG. 5, a first organic insulating film 20 and a second organic insulating film 30 are continuously formed on a substrate 10. The signal line 120 is formed on the second organic insulating film 30. In the first embodiment, the signal line 120 has the same material as the scanning line, that is, a TAT (Ti-Al-Ti) structure, but may be changed to another material depending on the application of the stretchable electronic device. The other structure is the same as the cross-sectional shape of the scanning line 110 portion described in FIG. 4.

[0030] Fig. 6 is an enlarged plan view of the element region 101. The element region 101 is made of a substrate 10 formed in an island shape. The element region 101 in Fig. 6 is roughly octagonal in shape, but may have other shapes. In Fig. 6, both the scanning lines 110 and the signal lines 120 are straight lines, but outside Fig. 6, they have a meandering structure as shown in Fig. 3.

[0031] In Fig. 6, an element 100 is arranged in an element region 101. In the element region 101, a signal line 120 and a scanning line 110 cross each other via an insulating film. However, Fig. 6 is a schematic diagram, and in an actual device, both the scanning line 110 and the video signal line 120 are connected to transistors that drive the element 100.

[0032] Fig. 7 is a DD cross-sectional view of Fig. 6. In Fig. 7, an inorganic insulating film 80 is formed on a substrate 10. The inorganic insulating film 80 blocks impurities and the like that may invade from below toward the elements 100 and the like formed above it. In Fig. 7, the inorganic insulating film 80 is formed on the substrate 10, but this is an example, and the inorganic insulating film 80 may be formed in a layer closer to the elements 100 as necessary.

[0033] The inorganic insulating film 80 is formed of a silicon nitride film (SiN film), a silicon oxide film (SiO film), or a laminated film of these. In some cases, an aluminum oxide film (AlO) may be used. Although the inorganic insulating film 80 has high rigidity, since it is formed only in the element region 101, it has little effect on the stretchability of the stretchable electronic device 1.

[0034] A first organic insulating film 20 is formed of, for example, polyimide, covering the inorganic insulating film 80. Scanning lines 110 extend in the lateral direction (x direction) on the first organic insulating film 20. A second organic insulating film 30 is formed of, for example, polyimide, covering the scanning lines 110 and the first organic insulating film 20. A signal line 120 extends in the y direction on the second organic insulating film 30.

[0035] 7 is a schematic diagram, and does not show the connection structure between the element 100 and the scanning line 110 or the signal line 120. As an example, a thin film transistor (TFT) is disposed between the element 100 and the scanning line 110 or the signal line 120, and the thin film transistor is controlled by a scanning line control circuit 115 or a signal line control circuit 125 to control a signal from the element 100 or a signal to the element 100.

[0036] 7, the wiring structure between the element 100 and the signal line 120 in Fig. 7 varies depending on what is arranged as the element 100. In the element region 101, there is a possibility that a plurality of organic or inorganic insulating films may be formed.

[0037] The planar structure shown in FIG. 6 corresponds to the cross-sectional structure from the substrate 10 to the element 100 in FIG. 7. If left as is, the planar shape will be as shown in FIG. 3, which is unstable. Therefore, as explained in FIG. 4, the upper buffer layer 40, the upper protective layer 50, the lower buffer layer 60, and the lower protective layer 70 are formed, and the whole is put together in a flat plate shape to stabilize the shape. Also, as explained in FIG. 4, the upper buffer layer 40, the upper protective layer 50, the lower buffer layer 60, and the lower protective layer 70 use materials with smaller Young's modulus than the substrate 10, the first organic insulating film 20, the second organic insulating film 30, etc., and therefore, the stretchability of the stretchable electronic device 1 is not impaired.

[0038] Fig. 8 is a plan view of the stretchable electronic device 1 according to the first embodiment. In Fig. 8, the configuration of the active area 5 is the same as that described in the comparative example. Unlike the first embodiment, Fig. 8 does not include a flexible wiring board 150. In the configuration of Fig. 8, the terminal area 6 is elongated in the vertical direction (y direction), and the wiring board 300 is directly connected to the terminal area 6.

[0039] The wiring board 300 may be rigid rather than flexibly curved. An example of a rigid wiring board is a glass epoxy board on which electronic components such as ICs are mounted. The Young's modulus of the rigid wiring board 300 is greater than that of the flexible wiring board 150.

[0040] 8, terminal area 6 which is elongated in the vertical direction is made to function as flexible wiring board 150 shown in Fig. 1. In other words, not only terminal wiring 200 for connecting active area 5 and wiring board 300, but also driver ICs, capacitors, resistors, etc. which were mounted on flexible wiring board 150 are mounted on terminal area 6. Hereinafter, driver ICs, capacitors, resistors, etc. will be simply represented by the term electronic components 220.

[0041] Although the terminal wiring 200 is depicted as a straight line in Fig. 8, in reality it has a meandering structure as shown in Fig. 10. The cross-sectional structure of the terminal region 6 is also the same as that of the active region 5. In other words, the terminal region 6 also has a stretchable configuration.

[0042] 8, the signal lines 120 or the scanning lines 110 in the active region 5 are continuously extended to the terminal region 6 as terminal wiring 200. In the terminal region 6, the signal lines 120 or the scanning lines 110 are connected to a wiring board 300 via an electronic component 220.

[0043] Furthermore, the terminal area 6 of the stretchable electronic device 1 is configured to be more flexible than the flexible wiring board 150. Therefore, even if the terminal area 6 is curved, it easily follows the curved shape, so the stress generated in the terminal area 6 is small. Also, by connecting directly to the wiring board 300 without using the flexible wiring board 150, the number of connection areas with other members can be reduced. With such a configuration, the reliability of the connection in the electronic device 1 connected to the wiring board 300 can be improved.

[0044] Fig. 9 is an E-E cross-sectional view of Fig. 8. In Fig. 9, the length of the terminal region 6 in the y direction is relatively longer than that in Fig. 2. In Fig. 9, the terminal region 6 is connected to a wiring board 300, not to a flexible wiring board 150. In Fig. 9, the active region having the element layer 2 and the terminal region 6 are separated by a dotted line, but the terminal region 6 and the active region 5 are formed integrally.

[0045] FIG. 10 is a detailed plan view of the terminal region 6. In FIG. 10, the boundary between the active region 5 and the terminal region 6 is indicated by a dotted line. However, the active region 5 and the terminal region 6 are formed continuously. That is, the active region 5 and the terminal region 6 are formed on the same substrate 10. In the example shown in FIG. 10, the terminal wiring 200 also has a meander structure, similar to the signal line 120 and the scanning line 110 in the active region 5. As shown in FIG. 10, an electronic component 220 is mounted in the terminal region 6. The electronic component 220 and the terminal 210 are also connected by the terminal wiring 200 having a meander structure. The wiring board 300 is connected to the terminal region 6 via the multiple terminals 210.

[0046] Fig. 11 is a cross-sectional view taken along the line FF of Fig. 10. Fig. 11 is the same as Fig. 5 showing a cross-sectional view of the active region 5, except that two columns are shown. In Fig. 11, the wiring arranged on the second organic insulating film 30 is the terminal wiring 200, which is continuous with the signal line 120 in the active region 3.

[0047] Fig. 12 is a cross-sectional view taken along line GG of Fig. 10. Fig. 10 has basically the same configuration as Fig. 11, except that electronic component 220 is mounted on terminal wiring 200. However, in the cross-section taken along line GG shown in Fig. 12, the width of terminal wiring 200 is larger by the amount that electronic component 220 is mounted.

[0048] 11 and 12 show the case where the terminal wiring 200 is formed in the same layer as the signal lines 120 in the active region 5. On the other hand, the terminal wiring 200 may be formed in the same layer as the scanning lines 110 in the active region 5.

[0049] Fig. 13 is a plan view showing an example of a configuration in which the terminal region can be easily extended in the horizontal direction (x direction) or vertical direction (y direction). In Fig. 14, terminal wiring 200 having a meandering structure extends in the vertical direction (y direction) and is arranged in the horizontal direction. Between the rows of terminal wiring 200, a cut 230 like a perforation is formed in the upper protective layer 3 and the lower protective layer 4 shown in Fig. 9. This cut 230 makes it possible to make the extensibility of the terminal region 6 greater than that of the active region 5. EXAMPLES

[0050] In the first embodiment, electronic components 220 are mounted on the extensible terminal area 6, and the flexible wiring board 150 is formed on a base material having an active area 5. As a result, stress occurring at the connection with the flexible wiring board is reduced, improving reliability. However, even with the configuration of the first embodiment, it is difficult to completely eliminate stress in the terminals connecting the terminal area 6 and the wiring board 300.

[0051] In the stretchable electronic device of the second embodiment, the extensibility of the terminal area 6 is made smaller than that of the active area 5, thereby preventing excessive stress from occurring in the connection area with the wiring board 300. Fig. 14 is a plan view of the stretchable electronic device 1 in the second embodiment, and the appearance is the same as Fig. 10 in the first embodiment.

[0052] However, in Example 2, the cross-sectional structure of the terminal region 6 is different from that in FIG. 1. FIG. 15 is an HH cross-sectional view of FIG. 14. In FIG. 15, the base material 10 is formed in a flat plate shape rather than a meandering structure. However, the first organic insulating film 20 and the second organic insulating film 30 maintain the meandering structure. Therefore, the extensibility of the terminal region 6 is smaller than that of the active region. As a result, the stress between the wiring substrate 300 and the terminal region 6 caused by the difference in extensibility can be reduced.

[0053] Fig. 16 is an example of a cross-sectional view taken along line II in Fig. 14. In Fig. 16, the base material 10 and the first organic insulating film 20 are formed in a flat plate shape, not in a meandering structure. However, the second organic insulating film 30 maintains the meandering structure. Therefore, in the cross-section taken along line II, the extensibility of the terminal region 6 is smaller than the extensibility of the active region 5 and the extensibility of the terminal region 6 in the HH cross-section. In other words, the extensibility of the terminal region 6 is smaller near the wiring substrate 300 than in other parts. Therefore, the stress between the wiring substrate 300 and the terminal region 6 in the terminal 210 can be made smaller.

[0054] In FIG. 14, the cross-sectional configuration of the terminal region 6 is changed in two stages, but it is not necessary to have two stages, and the same effect can be obtained with just one stage.

[0055] Fig. 17 is a plan view of the terminal area 6 of the stretchable electronic device 1, showing another configuration of the embodiment 2. In Fig. 17, the terminal wiring 200 in the terminal area 6 is straight, not in a meandering structure. In other words, the terminal area 6 does not have an extension structure.

[0056] Fig. 18 is a cross-sectional view taken along line JJ of Fig. 18. In Fig. 18, the base material 10, the first organic insulating film 20, and the second organic insulating film 30 all have a planar structure, and do not have an extended structure.

[0057] 17, even in the case of the stretchable electronic device 1, the terminal region 6 is not stretchable, so stress caused by the difference in extensibility does not occur at the connection between the wiring board 300 and the terminal region 6. On the other hand, although the Young's modulus in the planar direction differs between the active region 5 and the terminal region 6, the signal line 120 in the active region 5 and the terminal wiring 200 in the terminal region 6 are formed continuously, so noise caused by the connection does not occur. [Explanation of symbols]

[0058] 1...stretchable electronic device, 2...element layer, 3...upper protective layer, 4...lower protective layer, 5...active area, 6...terminal area, 10...substrate, 20...first organic insulating film, 30...second organic insulating film, 40...upper buffer layer, 50...upper protective film, 60...lower buffer layer, 70...lower protective film, 80...inorganic insulating film, 100...element, 101...element area, 102...meander structure, 110...scanning line, 115...scanning line driving circuit, 120...signal line, 125...signal line driving circuit, 130...power supply circuit, 150...flexible wiring board, 200...terminal wiring, 210...terminal, 220...electronic component, 230...perforation, 300...wiring board

Claims

1. a substrate having a meandering structure and an element region; Wiring located in the meandering structure; an element located in the element region and connected to the wiring, The electronic device has an active area and a terminal area; a plurality of the element regions are provided in the active region, and the meander structure is formed so as to connect the element regions; A terminal for connecting to a wiring board is formed in the terminal area, An electronic component is mounted between the active area and the terminal of the terminal area, the electronic component is connected to the wiring via a first terminal wiring located between the active region and the electronic component; The terminal is connected to the electronic component via a second terminal wiring located between the electronic component and the terminal.

2. 2. The electronic device according to claim 1, wherein the first terminal wiring has the same layer structure as the signal lines in the active region.

3. 2. The electronic device according to claim 1, wherein the first terminal wiring has the same layer structure as a scanning line of the active area.

4. 2. The electronic device according to claim 1, wherein a plurality of the electronic components are formed, and a third terminal wiring connecting the plurality of electronic components has a meandering structure.

5. The electronic device according to claim 1 , wherein the Young's modulus of the wiring board is greater than the Young's modulus of the base material.

6. An electronic device in which an active area and a terminal area are formed continuously, A meander-structured scanning line and a meander-structured signal line are formed in the active region, The terminal area is provided with a terminal for connection to a wiring board, A terminal wiring having a meandering structure is formed in the terminal region, An electronic device, wherein the terminal region has a Young's modulus in a planar direction greater than a Young's modulus in a planar direction of the active region.

7. a first organic insulating film located in the active region and the terminal region, and a second organic insulating film formed on the first organic insulating film; In the active region, the first organic insulating film and the second organic insulating film have a meander structure, 7. The electronic device according to claim 6, wherein in the terminal region, the first organic insulating film is flat, and the second organic insulating film has a meandering structure.

8. The electronic device according to claim 6 , further comprising a substrate having a meandering structure in which the scanning lines and the signal lines are formed, and an element region in which elements connected to the scanning lines and the signal lines are formed.

9. 9. The electronic device according to claim 8, wherein the Young's modulus of the wiring board is greater than the Young's modulus of the base material.

10. a substrate having a meandering structure and an element region; Wiring located in the meandering structure; an element located in the element region and connected to the wiring, The electronic device has an active area and a terminal area; a plurality of the element regions are provided in the active region, and the meander structure is formed so as to connect the element regions; In the terminal region, the base material is formed in a flat plate shape, and a terminal for connecting to a wiring board is formed, A linear terminal wiring is formed in the terminal region, An electronic device, wherein the terminal region has a Young's modulus in a planar direction greater than a Young's modulus in a planar direction of the active region.

11. The electronic device according to claim 10 , wherein the Young's modulus of the wiring board is greater than the Young's modulus of the base material.