Preparation method of flexible light strip, flexible light strip and display device

Abstract

The present application discloses a method for preparing a flexible light strip, a flexible light strip, and a display device. The method for preparing the flexible light strip includes: providing a flexible reflective sheet, wherein the material of the flexible reflective sheet includes polyethylene terephthalate and titanium dioxide; forming a circuit structure on the flexible reflective sheet; fixing a plurality of light-emitting chips on the circuit structure and electrically connecting the plurality of light-emitting chips to the circuit structure; and forming an encapsulation layer on the flexible reflective sheet to cover each light-emitting chip. In the embodiment of the present application, the circuit structure is directly disposed on the flexible reflective sheet. When the circuit structure is energized, the light-emitting chip emits light, and the flexible reflective sheet can reflect the light emitted by the light-emitting chip toward itself. That is, the circuit board of the embodiment of the present application itself has a reflective effect. Compared with existing LED light strips, there is no need to apply a reflective coating on the circuit board. That is, the process step of applying the reflective coating is omitted, thereby simplifying the production process of the flexible light strip and improving the production efficiency of the flexible light strip.

Description

Technical Field

[0001] The present application relates to the field of display devices, and in particular to a method for preparing a flexible light strip, a flexible light strip, and a display device. Background Art

[0002] Liquid crystal display devices are widely used in electronic display equipment. Currently, most of the display devices on the market are backlit liquid crystal displays, which include a liquid crystal display panel and a backlight module. Since the liquid crystal display panel itself does not emit light, it needs the light source provided by the backlight module to display images normally. Therefore, the backlight module has become one of the key components of the liquid crystal display device. The backlight module is divided into two types according to the different incident positions of the backlight source: side-entry backlight module and direct-type backlight module. The direct-type backlight module is widely used in the market. The direct-type backlight module is to set the backlight source, such as LED lamp (light-emitting diode), behind the liquid crystal display panel to directly form a surface light source provided to the liquid crystal display panel.

[0003] In the related art, the current direct-lit backlight module includes a back panel and an LED light bar disposed on one side of the back panel. However, the current production process of the LED light bar is long and the production efficiency of the LED light bar is low. Summary of the Invention

[0004] The embodiments of the present application provide a method for preparing a flexible light bar, a flexible light bar, and a display device to simplify the production process of the flexible light bar and improve the production efficiency of the flexible light bar.

[0005] In a first aspect, an embodiment of the present application provides a method for preparing a flexible light strip, comprising:

[0006] Providing a flexible reflective sheet, wherein the material of the flexible reflective sheet includes polyethylene terephthalate and titanium dioxide;

[0007] forming a circuit structure on the flexible reflective sheet;

[0008] Fixing a plurality of light-emitting chips on the circuit structure and electrically connecting the plurality of light-emitting chips to the circuit structure;

[0009] A packaging layer covering each of the light-emitting chips is formed on the flexible reflective sheet.

[0010] Optionally, forming a circuit structure on the flexible reflective sheet includes:

[0011] The circuit structure is printed on the flexible reflective sheet by using a screen printing process or a nano-imprinting process.

[0012] Optionally, fixing a plurality of light-emitting chips on the circuit structure and achieving circuit connection between the plurality of light-emitting chips and the circuit structure includes:

[0013] The light-emitting chip is a MiniLED chip, and a MiniLED die bonder is used to fix the MiniLED chip on the circuit structure; and

[0014] Circuit sintering is performed to achieve electrical connection between the MiniLED chip and the circuit structure.

[0015] Optionally, forming a circuit structure on the flexible reflective sheet includes:

[0016] Coating the flexible reflective sheet with copper foil; and

[0017] The circuit structure is etched on the copper foil using a photolithography process.

[0018] Optionally, fixing a plurality of light-emitting chips on the circuit structure and achieving circuit connection between the plurality of light-emitting chips and the circuit structure includes:

[0019] Printing electrical connectors on the circuit structure, wherein the material of the electrical connectors is nano-conductive material or low-temperature sintering solder paste; and

[0020] The light-emitting chip is a MiniLED chip, and the MiniLED chip is connected to the electrical connector by circuit sintering to achieve electrical connection between the MiniLED chip and the circuit structure.

[0021] Optionally, forming an encapsulation layer covering each of the light-emitting chips on the flexible reflective sheet includes:

[0022] The packaging glue is sprayed onto each of the light-emitting chips by a spraying device to form the packaging layer.

[0023] In a second aspect, an embodiment of the present application further provides a flexible light strip, comprising:

[0024] A circuit board comprising a flexible reflective sheet and a circuit structure disposed on one side of the flexible reflective sheet;

[0025] a plurality of light-emitting chips electrically connected to the circuit structure; and

[0026] an encapsulation layer, covering each of the light-emitting chips;

[0027] The flexible reflective sheet comprises polyethylene terephthalate and titanium dioxide, and can reflect the light emitted by the light-emitting chip.

[0028] Optionally, the reflectivity of the flexible reflective sheet is greater than 90%.

[0029] Optionally, the encapsulation layer includes a plurality of sub-encapsulation parts that are spaced apart from each other, and each of the sub-encapsulation parts is coated on one of the light-emitting chips.

[0030] In a third aspect, an embodiment of the present application further provides a display device, comprising a display module and a backlight module disposed on one side of the display module, wherein the backlight module comprises the flexible light strip as described in any of the above embodiments.

[0031] In the preparation method of the flexible light strip of the embodiment of the present application, a flexible reflective sheet is provided, the material of the flexible reflective sheet includes polyethylene terephthalate (PET) and titanium dioxide, a circuit structure is formed on the flexible reflective sheet, and multiple light-emitting chips are fixed on the circuit structure, and the multiple light-emitting chips are electrically connected to the circuit structure; when the circuit structure is energized, the light-emitting chip emits light in all directions. Since the flexible reflective sheet is prepared by adopting polyethylene terephthalate and titanium dioxide, it has a reflective effect, so that the light irradiated by the light-emitting chip onto the flexible reflective sheet can be reflected out by the flexible reflective sheet itself, that is, the flexible light strip of the embodiment of the present application contains the light emitted by the light-emitting chip and the light reflected by the flexible reflective sheet, thereby enhancing the luminous brightness. The embodiment of the present application forms a circuit board by directly setting the circuit structure on a flexible reflective sheet. Since the flexible reflective sheet itself has reflective properties, the circuit board in the embodiment of the present application itself has reflective properties. Compared with the LED light strips currently on the market, there is no need to apply a reflective coating on the circuit board, that is, the process step of applying the reflective coating is omitted, thereby simplifying the production process of the flexible light strip, improving the production efficiency of the flexible light strip, and saving the material cost of applying the reflective coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and beneficial effects of the present application apparent.

[0033] Figure 1 A flowchart of a method for preparing a flexible light strip provided in an embodiment of the present application.

[0034] Figure 2 This is a structural diagram of the flexible light strip preparation process according to an embodiment of the present application.

[0035] Figure 3 for Figure 1 Specific flow chart of step 30 in an embodiment.

[0036] Figure 4 This is a structural diagram of the flexible light strip in accordance with an embodiment of the present application performing step 20.

[0037] Figure 5 for Figure 1 A specific flow chart of another embodiment of step 30 in FIG.

[0038] Figure 6 This is a structural diagram of an embodiment of a flexible light strip provided in an embodiment of the present application.

[0039] Figure 7 This is a structural diagram of another embodiment of the flexible light strip provided in the embodiment of the present application. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0041] In the related art, a display device includes a display panel and a backlight module. Taking a direct-lit backlight module as an example, the backlight module includes a backplate and an LED light strip disposed on one side of the backplate. The brightness of the LED light strip determines the brightness of the backlight module, and thus determines the display effect of the display device. In the existing LED light strip production process, in order to improve the brightness of the LED light strip, most light strip manufacturers currently apply a reflective coating to the surface of the circuit board to increase the brightness of the LED light strip by reflecting the light emitted by the LED lamp. This adds a process step to the original production process of the LED light strip, resulting in a longer production process line for the light strip, which affects the production efficiency of the light strip.

[0042] To solve the above problems, an embodiment of the present application provides a method for preparing a flexible light strip, so as to ensure that the flexible light strip has sufficient luminous brightness while simplifying the production process of the flexible light strip and improving the production efficiency of the flexible light strip.

[0043] Please refer to Figure 1 and Figure 2 , Figure 1 This is a flow chart of a method for preparing a flexible light strip 100 provided in an embodiment of the present application. Figure 2 Schematic diagram of the manufacturing process of the flexible light strip according to an embodiment of the present application; In the embodiment of the present application, the manufacturing method of the flexible light strip 100 includes:

[0044] S10: Provide a flexible reflective sheet 11, such as Figure 2 As shown in stage a, the material of the flexible reflective sheet 11 includes polyethylene terephthalate (PET) and titanium dioxide; wherein, the flexible reflective sheet 11 is prepared by polyethylene terephthalate (PET) and titanium dioxide, so that it has a reflective effect and can reflect the light irradiated by the external light-emitting structure to itself.

[0045] S20: forming a circuit structure 12 on the flexible reflective sheet 11, such as Figure 2 By forming a circuit structure 12 on the flexible reflective sheet 11, the flexible reflective sheet 11 and the circuit structure 12 are integrally combined to form a circuit board 10, and the flexible reflective sheet 11 supports and insulates the circuit structure 12.

[0046] S30: Fixing a plurality of light emitting chips 20 on the circuit structure 12 and electrically connecting the plurality of light emitting chips 20 to the circuit structure 12, such as Figure 2 Stage c is shown in the middle;

[0047] S40: forming a packaging layer 30 covering each of the light emitting chips 20 on the flexible reflective sheet 11, such as Figure 2 Stage d is shown in the middle; wherein, the encapsulation layer 30 is used to isolate the light emitting chip 20 from the outside world, and the material of the encapsulation layer 30 is a transparent material so that the light emitted by the light emitting chip 20 when powered on can pass through.

[0048] As can be understood, the embodiment of the present application disposes the circuit structure 12 on the flexible reflective sheet 11 and electrically connects the light-emitting chip 20 to the circuit structure 12. When the circuit structure 12 is energized, the light-emitting chip 20 emits light in all directions. Since the flexible reflective sheet 11 has a reflective effect, the light emitted by the light-emitting chip 20 onto the flexible reflective sheet 11 can be reflected by the flexible reflective sheet 11 itself. Therefore, the light emitted by the flexible light strip 100 of the embodiment of the present application includes the light emitted by the light-emitting chip 20 itself and the light reflected by the flexible reflective sheet 11, thereby enhancing the luminous brightness. Moreover, the flexible reflective sheet 11 of the present application, made of polyethylene terephthalate (PET) and titanium dioxide, has a reflectivity of greater than 90% for light, which is higher than the reflectivity of existing reflective coatings (white oil) and has a superior reflective effect. Therefore, compared with LED light strips currently on the market that are coated with reflective coatings on circuit boards, the flexible light strip 100 of the embodiment of the present application can emit higher brightness.

[0049] In the above-mentioned method for preparing the flexible light strip, the embodiment of the present application forms a circuit board 10 by directly setting the circuit structure 12 on the flexible reflective sheet 11. Since the flexible reflective sheet 11 itself has reflective properties, the circuit board 10 of the embodiment of the present application itself has reflective properties. Compared with the LED light strips currently on the market, there is no need to apply a reflective coating on the circuit board 10, that is, the process step of applying the reflective coating is omitted, thereby simplifying the production process of the flexible light strip 100, improving the production efficiency of the flexible light strip 100, and saving the material cost of applying the reflective coating.

[0050] Specifically, there are various process technologies for forming the circuit structure 12 on the flexible reflective sheet 11. For example, in one embodiment of the present application, forming the circuit structure 12 on the flexible reflective sheet 11 includes: printing the circuit structure 12 on the flexible reflective sheet 11 using a screen printing process or a nanoimprinting process.

[0051] Taking the screen printing process as an example, the specific steps of printing the circuit structure 12 on the flexible reflective sheet 11 are as follows:

[0052] A screen printing plate is provided; wherein the screen printing plate is printed with a pattern corresponding to the circuit structure 12;

[0053] Apply conductive paste on the screen printing stencil, the conductive paste is made of nano silver or nano copper material;

[0054] The conductive paste on the screen printing plate is squeezed by a scraper so that the conductive paste passes through the mesh holes on the screen printing plate and is printed onto the flexible reflective sheet 11;

[0055] The conductive paste is baked to solidify the conductive paste, and the circuit structure 12 is formed after the conductive paste is solidified.

[0056] Furthermore, to further enhance the brightness of the flexible light strip 100, in the embodiment of the present application, the light-emitting chip 20 utilizes a MiniLED chip. Because MiniLED chips are small and the spacing between adjacent MiniLED chips is small, more MiniLED chips can be arranged on a circuit board 10 of the same area. This not only enhances the brightness of the flexible light strip 100 but also ensures uniform light distribution, resulting in a display device employing the flexible light strip 100 with a delicate display effect and high brightness.

[0057] Please refer to Figure 3 After the flexible reflector 11 is formed by screen printing or nano-imprinting, a plurality of light-emitting chips 20 are fixed on the circuit structure 12 and the plurality of light-emitting chips 20 are electrically connected to the circuit structure 12, including:

[0058] S31: The light emitting chip 20 is a MiniLED chip, and a MiniLED die bonder is used to fix the MiniLED chip on the circuit structure 12; and

[0059] S32: performing circuit sintering to achieve electrical connection between the MiniLED chip and the circuit structure 12; wherein the sintering temperature is less than 150°C.

[0060] Please refer to Figure 4 In another embodiment of the present application, forming the circuit structure 12 on the flexible reflective sheet 11 may further include: covering the flexible reflective sheet 11 with a copper foil 12a, and etching the circuit structure 12 on the copper foil 12a using a photolithography process.

[0061] like Figure 4 As shown, in this embodiment, the specific process steps of "covering the flexible reflective sheet 11 with a copper foil 12a and etching the circuit structure 12 on the copper foil 12a using a photolithography process" are as follows:

[0062] Copper foil 12a is attached to the entire surface of the flexible reflective sheet. Figure 4 As shown in stage a;

[0063] A photoresist is coated on the copper foil 12a, and a cured photoresist structure 13 is formed by exposure and development. Figure 4 As shown in stage b;

[0064] The copper foil 12a not covered by the photoresist structure 13 is removed by etching solvent to form the circuit structure 12. Figure 4 Stage c is shown in the middle;

[0065] The photoresist structure 13 on the circuit structure 12 is dissolved and removed by using a photoresist solvent, such as Figure 4 Stage d is shown in the figure.

[0066] Please refer to Figure 5 After etching a circuit structure 12 on the flexible reflective sheet 11 using a photolithography process, fixing a plurality of light-emitting chips 20 on the circuit structure 12 and electrically connecting the plurality of light-emitting chips 20 to the circuit structure 12 includes:

[0067] S33: Printing electrical connectors on the circuit structure 12, where the material of the electrical connectors is nano-conductive material or low-temperature sintering solder paste; and

[0068] S34: The light-emitting chip 20 is a MiniLED chip, and the MiniLED chip is connected to the electrical connector by circuit sintering to achieve electrical connection between the MiniLED chip and the circuit structure 12; wherein the sintering temperature is less than 150°C.

[0069] Furthermore, in order to further improve the production efficiency of the flexible light strip 100, in an embodiment of the present application, forming an encapsulation layer 30 covering each light-emitting chip 20 on the flexible reflective sheet 11 includes: spraying encapsulation glue to each light-emitting chip 20 through a spraying device to form an encapsulation layer 30.

[0070] The packaging glue can be sprayed only on the light emitting chip 20 so that the packaging glue only covers each light emitting chip 20 ; the packaging glue can also be sprayed on the entire circuit board 10 so that the packaging glue covers the entire circuit board surface and covers each light emitting chip 20 .

[0071] The present application also provides a flexible light strip 100, please refer to Figure 6 , Figure 6This is a structural diagram of a flexible light strip 100 provided in an embodiment of the present application. In the embodiment of the present application, the flexible light strip 100 includes a circuit board 10, a light-emitting chip 20 and an encapsulation layer 30.

[0072] like Figure 6 As shown, the circuit board 10 includes a flexible reflective sheet 11 and a circuit structure 12 disposed on one side of the flexible reflective sheet 11. The circuit structure 12 can be printed on the flexible reflective sheet 11 by screen printing, nanoimprinting, or photolithography.

[0073] Specifically, the flexible reflective sheet 11 is made of a composite material of polyethylene terephthalate and titanium dioxide, so that the flexible reflective sheet 11 has a light-reflecting effect and can reflect the light irradiated by the light-emitting structure onto itself.

[0074] The plurality of light emitting chips 20 are electrically connected to the circuit structure 12. When the circuit structure 12 is powered, the plurality of light emitting chips 20 are powered and emit light. In the embodiment of the present application, in order to further improve the brightness of the flexible light strip 100, the light emitting chips 20 of the embodiment of the present application are MiniLED chips.

[0075] It can be understood that the embodiment of the present application adopts MiniLED chips. Since the MiniLED chip particles are small and the spacing between adjacent MiniLED chips is small, more MiniLED chips can be arranged on the circuit board 10 of the same area. This can not only enhance the luminous brightness of the flexible light strip 100, but also ensure that the emitted light is uniform, so that the display effect of the display device using the flexible light strip 100 is delicate and the display brightness is high.

[0076] The encapsulation layer 30 is coated around each light-emitting chip 20 and serves to isolate the light-emitting chip 20 from the external environment. The encapsulation layer 30 is made of a light-transmitting material to allow light emitted by the light-emitting chip 20 to pass through. In the present embodiment, the encapsulation layer 30 is formed by curing an encapsulant. Specifically, the encapsulation layer 30 is formed by spraying the encapsulant onto each light-emitting chip 20 using a spraying device.

[0077] It can be understood that in the embodiment of the present application, when the circuit structure 12 is energized, the light-emitting chip 20 is energized and emits light in all directions, part of which is irradiated onto the flexible reflective sheet 11. Since the flexible reflective sheet 11 itself has a reflective effect, the light irradiated by the light-emitting chip 20 onto the flexible reflective sheet 11 can be reflected out by the flexible reflective sheet 11 itself, that is, the light emitted by the flexible light strip 100 includes the light emitted by the light-emitting chip 20 itself and the light reflected by the flexible reflective sheet 11, thereby enhancing the luminous brightness.

[0078] In the embodiment of the present application, the circuit board 10 is formed by directly setting the circuit structure 12 on the flexible reflective sheet 11. Since the flexible reflective sheet 11 itself has a reflective effect, the circuit board 10 in the embodiment of the present application itself has a reflective effect. Compared with the LED light strips currently on the market, there is no need to apply a reflective coating on the circuit board 10, that is, the process step of applying the reflective coating is omitted, thereby simplifying the production process of the flexible light strip 100 and improving the production efficiency of the flexible light strip 100; moreover, since the reflective coating is omitted, the material cost of applying the reflective coating is saved, thereby reducing the production cost of the flexible light strip 100.

[0079] It should also be pointed out that in the production process of existing LED light strips, the reflective coating is coated on the circuit board 10, and the encapsulation layer 30 is directly arranged on the reflective coating, that is, the encapsulation layer 30 is not in direct contact with the circuit board 10. During long-term operation, the encapsulation layer 30 is prone to degumming, exposing the LED lamp and the conductive circuit, thereby affecting the service life of the light strip. The embodiment of the present application sprays the encapsulation layer 30 directly on the circuit board 10. Compared with the existing LED light strip, the encapsulation layer 30 is in direct contact with the circuit structure 12. Since the circuit structure 12 is uneven, the tightness of the connection of the encapsulation layer 30 can be enhanced, thereby avoiding the encapsulation layer 30 from easily degumming and ensuring the service life of the light strip.

[0080] Furthermore, in the embodiment of the present application, the reflectivity of the flexible reflective sheet 11 is greater than 90%.

[0081] Among them, reflectivity refers to the ratio of the intensity of light reflected on an object to the total intensity of light projected onto the object. The reflectivity of the flexible reflective sheet 11 of the embodiment of the present application is greater than 90%, that is, it absorbs less light and reflects more light. Compared with the existing reflective coating (the reflectivity of white oil is between 80% and 85%), it has a strong ability to reflect light, thereby significantly improving the luminous brightness of the flexible light strip 100.

[0082] Please refer to Figure 6 In the embodiment of the present application, the encapsulation layer 30 includes a plurality of sub-encapsulation parts 30a arranged at intervals, and each sub-encapsulation part 30a is coated on a light emitting chip 20. Specifically, the sub-encapsulation part 30a is formed by applying glue to each light emitting chip 20 by a spraying device. Figure 6 As shown, each sub-encapsulation portion 30a is shaped like a convex mirror structure, which has the function of diverging light. The light emitted by the light emitting chip 20 is diverged to the surroundings through the sub-encapsulation portion 30a, so that the light emitted by the flexible light strip 100 is uniform.

[0083] Of course, in other embodiments of this application, please refer to Figure 7 The packaging layer 30 can also be formed by spraying packaging glue on the entire circuit board 10 using a spraying device.

[0084] In order to further improve the production efficiency of the flexible light strip 100, in the embodiment of the present application, the light emitting chip 20 is packaged on the circuit board 10 by using chip-on-board packaging technology (ie, COB packaging technology).

[0085] Chip-on-board (COB) packaging technology involves attaching a bare chip to a circuit board using conductive or non-conductive adhesive, then performing wire bonding to achieve electrical connections. The chip and bonding wires are then encapsulated with adhesive. Compared to traditional chip packaging, this COB process eliminates the reflow and SMT process steps, significantly improving packaging efficiency and, in turn, overall production efficiency for the flexible light strip 100.

[0086] The present application also provides a display device comprising a display module and a backlight module disposed on one side of the display module, wherein the backlight module comprises a flexible light strip based on the above-mentioned inventive concept. Specifically, the display device can be a product or device with a display function, such as a television, computer, or monitor.

[0087] Since the display device includes a flexible light bar based on the above-mentioned inventive concept, the circuit board of the flexible light bar includes a flexible reflective sheet and a circuit structure arranged on one side of the flexible reflective sheet, and the light-emitting chip is electrically connected to the circuit structure. When the light-emitting chip is energized and emits light, the flexible reflective sheet can reflect the light emitted by the light-emitting chip to itself, that is, the circuit board itself has a reflective effect. Compared with the LED light bars currently on the market, there is no need to apply a reflective coating on the circuit board, which eliminates the process step of applying the reflective coating, saves the production process of the flexible light bar, improves the production efficiency of the flexible light bar, and thus improves the overall production efficiency of the display device.

[0088] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0089] The above is a detailed introduction to the preparation method of the flexible light strip, the flexible light strip and the display device provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for preparing a flexible light strip, characterized in that: include: Providing a flexible reflective sheet, wherein the material of the flexible reflective sheet includes polyethylene terephthalate and titanium dioxide; forming a circuit structure on the flexible reflective sheet; Fixing a plurality of light-emitting chips on the circuit structure and electrically connecting the plurality of light-emitting chips to the circuit structure; forming an encapsulation layer covering each of the light-emitting chips on the flexible reflective sheet, such that the encapsulation layer is in direct contact with the circuit structure; The forming of a circuit structure on the flexible reflective sheet comprises: Printing the circuit structure on the flexible reflective sheet using a screen printing process or a nano-imprinting process; Or forming a circuit structure on the flexible reflective sheet includes: Coating the flexible reflective sheet with copper foil; and The circuit structure is etched on the copper foil using a photolithography process.

2. The method for preparing a flexible light strip according to claim 1, wherein: The step of fixing a plurality of light-emitting chips on the circuit structure and electrically connecting the plurality of light-emitting chips to the circuit structure comprises: The light-emitting chip is a MiniLED chip, and a MiniLED die bonder is used to fix the MiniLED chip on the circuit structure; and Circuit sintering is performed to achieve electrical connection between the MiniLED chip and the circuit structure.

3. The method for preparing a flexible light strip according to claim 1, wherein: The step of fixing a plurality of light-emitting chips on the circuit structure and electrically connecting the plurality of light-emitting chips to the circuit structure comprises: Printing electrical connectors on the circuit structure, wherein the material of the electrical connectors is nano-conductive material or low-temperature sintering solder paste; and The chip is a MiniLED chip, and the MiniLED chip is connected to the electrical connector by circuit sintering to achieve electrical connection between the MiniLED chip and the circuit structure.

4. The method for preparing a flexible light strip according to claim 1, wherein: The encapsulation layer formed on the flexible reflective sheet and covering each of the light-emitting chips comprises: The packaging glue is sprayed onto each of the light-emitting chips by a spraying device to form the packaging layer.

5. A flexible light strip, characterized in that: include: A circuit board comprising a flexible reflective sheet and a circuit structure disposed on one side of the flexible reflective sheet; a plurality of light-emitting chips electrically connected to the circuit structure; as well as an encapsulation layer, covering each of the light-emitting chips, wherein the encapsulation layer is in direct contact with the circuit structure; The flexible reflective sheet comprises polyethylene terephthalate and titanium dioxide, and can reflect the light emitted by the light-emitting chip.

6. The flexible light strip according to claim 5, characterized in that: The reflectivity of the flexible reflective sheet is greater than 90%.

7. The flexible light strip according to claim 5, characterized in that: The packaging layer includes a plurality of sub-packaging parts that are spaced apart from each other, and each of the sub-packaging parts covers one of the light-emitting chips.

8. A display device, characterized in that: It comprises a display module and a backlight module arranged on one side of the display module, wherein the backlight module comprises the flexible light strip according to any one of claims 5 to 7.

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