Display substrate and display device

Abstract

The present invention provides a display substrate and display device, belonging to the field of display technology. The display substrate comprises a base substrate, a driving circuit layer, a light-emitting device layer, and an encapsulation layer sequentially stacked on the base substrate. The display substrate comprises a display area and a non-display area. The display area comprises: a first display area; and a second display area, the orthographic projection of the second display area on the base substrate overlapping the orthographic projection of an under-screen sensing area on the display substrate, which is located away from the light-emitting side. The pixel density of the second display area is lower than that of the first display area, and a light-transmitting portion is provided between adjacent pixels in the second display area. The driving circuit layer comprises an inorganic insulating layer, and the total thickness of the inorganic insulating layer at the light-transmitting portion is less than 200 nm. The present invention can improve the operating performance of under-screen sensor devices.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display substrate and a display device. Background Art

[0002] With the development of display technology, the market demand for display panels with high screen-to-body ratio is becoming more and more urgent. Display panels are developing towards full-screen and thinner designs. The realization of full-screen is inseparable from under-screen sensing technology.

[0003] However, since the sensor area requires a higher optical transmittance, the transmittance of the normal light-emitting area is far from meeting the sensor's requirements. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a display substrate and a display device that can improve the working performance of the under-screen sensor device.

[0005] To solve the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0006] In one aspect, a display substrate is provided, comprising a base substrate, a driving circuit layer, a light-emitting device layer, and an encapsulation layer sequentially stacked on the base substrate, wherein the display substrate comprises a display area and a non-display area, wherein the display area comprises:

[0007] a first display area; and

[0008] a second display area, wherein the orthographic projection of the second display area on the base substrate covers the orthographic projection of an under-screen sensing area on the base substrate, which is arranged on a side of the display substrate away from the light emitting side;

[0009] The pixel density of the second display area is smaller than that of the first display area, and a light-transmitting portion is provided between two adjacent pixels in the second display area;

[0010] The driving circuit layer includes an inorganic insulating layer, and the total film thickness of the inorganic insulating layer at the light-transmitting portion is less than 200 nm.

[0011] In some embodiments, the encapsulation layer at the light-transmitting portion includes a first organic encapsulation layer and a second inorganic encapsulation layer stacked together, the second inorganic encapsulation layer is located between the first organic encapsulation layer and the base substrate, the refractive index of the first organic encapsulation layer is n1, the refractive index of the second inorganic encapsulation layer is n2, and the refractive index of the first organic encapsulation layer is less than the refractive index of the second inorganic encapsulation layer.

[0012] In some embodiments, within the light-transmitting portion, a boundary of the first organic encapsulating layer close to a surface of one side of the base substrate defines a first region, and within the first region, a film thickness of the first organic encapsulating layer is substantially uniform.

[0013] In some embodiments, within the light-transmitting portion, a film thickness of the first organic encapsulation layer at a first position is smaller than a film thickness of the first organic encapsulation layer at a second position, and a distance between the first position and the center of the light-transmitting portion is greater than a distance between the second position and the center of the light-transmitting portion.

[0014] In some embodiments, the thickness of the first organic encapsulating layer gradually decreases from the center of the light-transmitting portion to the edge of the light-transmitting portion.

[0015] In some embodiments, the refractive index n1 of the first organic encapsulation layer and the refractive index n2 of the second inorganic encapsulation layer satisfy:

[0016]

[0017] Wherein, θ is the angle between the side surface of the first organic encapsulation layer and the base substrate at the boundary of the light-transmitting portion.

[0018] In some embodiments, at the boundary of the light-transmitting portion, the sidewall of the groove formed by the inorganic insulating layer is stepped, and the size of the light-transmitting portion away from the base substrate is larger than the size of the light-transmitting portion close to the base substrate.

[0019] In some embodiments, the light-transmitting portion includes a plurality of mutually independent prism portions formed by the first organic encapsulation layer, and a surface of the prism portion close to the base substrate is a spherical surface, which protrudes toward the base substrate.

[0020] In some embodiments, the diameter of the prism portion is 5-10 um.

[0021] In some embodiments, the inorganic insulating layer includes a first inorganic insulating portion and a second inorganic insulating portion that are stacked, the first inorganic insulating portion is located between the second inorganic insulating portion and the base substrate, and at the boundary of the light-transmitting portion, the first angle between the side surface of the first inorganic insulating portion and the base substrate is 75-90°, and the second angle between the side surface of the second inorganic insulating portion and the base substrate is 55-85°.

[0022] In some embodiments, the total thickness of the inorganic insulating layer at the light-transmitting portion is 0.

[0023] In some embodiments, within the second display area,

[0024] In a first direction parallel to the base substrate, the light-transmitting portion and the pixel area are arranged at intervals;

[0025] In a second direction parallel to the base substrate, the light-transmitting portion and the pixel area are arranged at intervals;

[0026] The first direction intersects the second direction.

[0027] In some embodiments, the area of ​​the light-transmitting portion is less than 5 mm 2 .

[0028] In some embodiments, the driving circuit layer includes metal traces, and the minimum distance between the edge of the light-transmitting portion and an adjacent metal trace is no greater than 20 μm.

[0029] An embodiment of the present invention further provides a display device including the display substrate as described above.

[0030] The embodiments of the present invention have the following beneficial effects:

[0031] In the above scheme, the inorganic insulating layer at the light-transmitting part is etched so that the total film thickness of the inorganic insulating layer at the light-transmitting part is less than 200nm. This reduces the film thickness of the light-transmitting part, improves the transmittance of the light-transmitting part, and further improves the working effect of the under-screen sensor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1-Figure 5 A schematic structural diagram of a display substrate according to an embodiment of the present invention;

[0033] Figure 6 Schematic diagram of the arrangement of the light-transmitting portion and the pixel area according to an embodiment of the present invention.

[0034] Reference numerals

[0035] A. Translucent part

[0036] P pixel area

[0037] B Prism

[0038] 01 The first flexible substrate

[0039] 02 Second flexible substrate

[0040] 03 Buffer layer

[0041] 04 Barrier layer

[0042] 05 First gate insulation layer

[0043] 06 Second gate insulation layer

[0044] 07 Interlayer insulation layer

[0045] 08 Passivation layer

[0046] 09 Conductive Pattern

[0047] 10 pixel defined layer

[0048] 11. Luminescent layer

[0049] 12 cathode

[0050] 13 Spacers

[0051] 14 Drain

[0052] 15 Gate

[0053] 16 Active layer

[0054] 17 Source

[0055] 18 Anode

[0056] 19. Second inorganic encapsulation layer

[0057] 20 First organic encapsulation layer

[0058] 21 third inorganic encapsulation layer DETAILED DESCRIPTION

[0059] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, they will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0060] Embodiments of the present invention provide a display substrate and a display device, which can improve the working performance of an under-screen sensor device.

[0061] An embodiment of the present invention provides a display substrate, including a base substrate, a driving circuit layer, a light-emitting device layer, and an encapsulation layer sequentially stacked on the base substrate, wherein the display substrate includes a display area and a non-display area, wherein the display area includes:

[0062] a first display area; and

[0063] a second display area, wherein the orthographic projection of the second display area on the base substrate covers the orthographic projection of an under-screen sensing area on the base substrate, which is arranged on a side of the display substrate away from the light emitting side;

[0064] The pixel density of the second display area is smaller than that of the first display area, and a light-transmitting portion is provided between two adjacent pixels in the second display area;

[0065] The driving circuit layer includes an inorganic insulating layer, and the total film thickness of the inorganic insulating layer at the light-transmitting portion is less than 200 nm.

[0066] In this embodiment, the inorganic insulating layer at the light-transmitting portion is etched so that the total film thickness of the inorganic insulating layer at the light-transmitting portion is less than 200 nm. This reduces the film thickness of the light-transmitting portion, improves the transmittance of the light-transmitting portion, and further improves the working performance of the under-screen sensor device.

[0067] Among them, the under-screen sensor devices include cameras, fingerprint recognition units and other sensor devices.

[0068] In a specific example, Figure 1 As shown, the substrate may be a flexible substrate, including a first flexible substrate 01 and a second flexible substrate 02 stacked together. Of course, the substrate is not limited to a flexible substrate, and may also be a rigid substrate.

[0069] A driving circuit layer, a light-emitting device layer and an encapsulation layer are arranged on the base substrate. The driving circuit layer includes a buffer layer 03, a barrier layer 04, a first gate insulation layer 05, a second gate insulation layer 06, an interlayer insulation layer 07, a passivation layer 08, a drain 14, a gate 15, an active layer 16 and a source 17 in sequence. The light-emitting device layer includes a pixel defining layer 10, an anode, a light-emitting layer 11 and a cathode 12.

[0070] In this embodiment, after fabricating the driver circuit layer, the inorganic insulating layer of the transparent portion A is etched to reduce its total thickness to less than 200 nm. This thinning of the transparent portion improves its transmittance, thereby enhancing the performance of the under-display sensor. The inorganic insulating layer of the transparent portion A includes a buffer layer 03, a barrier layer 04, a first gate insulating layer 05, a second gate insulating layer 06, an interlayer insulating layer 07, and a passivation layer 08.

[0071] Specifically, the inorganic insulating layer of the light-transmitting part A can be etched multiple times, for example, the inorganic insulating layer of the light-transmitting part A can be etched twice. During the first etching, the first inorganic insulating part in the inorganic insulating layer of the light-transmitting part A is removed, and during the second etching, the second inorganic insulating part in the inorganic insulating layer of the light-transmitting part A is removed; wherein the first inorganic insulating part can be a part of the inorganic insulating layer composed of the buffer layer 03, the barrier layer 04, the first gate insulating layer 05, the second gate insulating layer 06, the interlayer insulating layer 07, the passivation layer 08, etc., and the second inorganic insulating part is another part of the inorganic insulating layer.

[0072] When the inorganic insulating layer of the light-transmitting portion A is etched multiple times, the range of each etching may be different.

[0073] In some embodiments, the inorganic insulating layer includes a first inorganic insulating portion and a second inorganic insulating portion that are stacked, the first inorganic insulating portion is located between the second inorganic insulating portion and the base substrate, and at the boundary of the light-transmitting portion, the first angle between the side surface of the first inorganic insulating portion and the base substrate is 75-90°, and the second angle between the side surface of the second inorganic insulating portion and the base substrate is 55-85°.

[0074] That is, at the edge of the light-transmitting part A, the slope angle of the first inorganic insulating part is 75-90°, and the slope angle of the second inorganic insulating part is 55-85°. In this way, in the light-transmitting part A, the side wall of the groove formed by the inorganic insulating layer is stepped, which can gather more light and improve the working effect of the under-screen sensor device.

[0075] In some embodiments, in order to minimize the thickness of the film layer in the light-transmitting portion and improve the transmittance of the light-transmitting portion, the total film thickness of the inorganic insulating layer in the light-transmitting portion may be 0.

[0076] In some embodiments, such as Figure 2 As shown, at the boundary of the light-transmitting portion A, the sidewalls of the groove formed by the inorganic insulating layer are stepped, and the dimension of the light-transmitting portion away from the base substrate is larger than the dimension of the light-transmitting portion closer to the base substrate. Specifically, the sidewalls of the groove formed by the inorganic insulating layer may include two step surfaces, three step surfaces, or more step surfaces.

[0077] Specifically, the inorganic insulating layer of the light-transmitting portion A can be etched for multiple times, with the range of each etching being different. For example, the range of the latter etching is larger than the range of the previous etching, so that the following can be formed: Figure 2 In the structure shown, at the boundary of the light-transmitting portion A, the sidewalls of the groove formed by the inorganic insulating layer are stepped, and the dimension of the light-transmitting portion farther from the base substrate is larger than the dimension of the light-transmitting portion closer to the base substrate. Specifically, the sidewalls of the groove formed by the inorganic insulating layer may include two, three, or more step surfaces.

[0078] Specifically, if Figure 2 As shown, a conductive pattern 09 can be formed at a corresponding position. When the inorganic insulating layer is etched by dry etching, the conductive pattern 09 can limit the range of dry etching. By limiting the range of dry etching, the side wall of the groove formed by the inorganic insulating layer can be formed into a step shape.

[0079] This can increase the opening area of ​​the light-transmitting part A, and thus increase the light-gathering area of ​​the light-transmitting part A, allowing more light to enter the light-transmitting part A, enhancing the light transmission intensity, and thus improving the working performance of the under-screen sensor device.

[0080] In some embodiments, such as Figure 3As shown, the encapsulation layer includes a second inorganic encapsulation layer 19, a first organic encapsulation layer 20 and a third inorganic encapsulation layer 21 stacked in sequence, the second inorganic encapsulation layer is located between the first organic encapsulation layer and the base substrate, the refractive index of the first organic encapsulation layer is n1, the refractive index of the second inorganic encapsulation layer is n2, and the refractive index of the first organic encapsulation layer is less than the refractive index of the second inorganic encapsulation layer. When light is incident from the high refractive index film layer to the low refractive index film layer, the light will be totally reflected. Therefore, in this embodiment, the refractive index of the first organic encapsulation layer is designed to be less than the refractive index of the second inorganic encapsulation layer. In this way, when light is incident from the second inorganic encapsulation layer (high refractive index film layer) to the interface of the first organic encapsulation layer (low refractive index film layer), due to the difference in refractive index between the first organic encapsulation layer and the second inorganic encapsulation layer, this part of the incident light is reflected, the exit angle is changed, the incident light intensity is enhanced, and the transmittance of the incident light is improved, thereby improving the recognition rate of under-screen sensor devices such as under-screen cameras.

[0081] In some embodiments, n1 may be approximately 1.3, and n2 may be between 1.5 and 1.9.

[0082] To ensure the formation of a total reflection interface between the second inorganic encapsulation layer and the first organic encapsulation layer, in some embodiments, the refractive index n1 of the first organic encapsulation layer and the refractive index n2 of the second inorganic encapsulation layer satisfy:

[0083]

[0084] Wherein, θ is the angle between the side surface of the first organic encapsulation layer and the base substrate at the boundary of the light-transmitting portion, that is, the slope angle of the first organic encapsulation layer.

[0085] In order to reduce the influence of the optical path distortion of the transparent part on the camera imaging effect, the organic film layer in the central area of ​​the transparent part is flattened, such as Figure 3 As shown, in the light-transmitting portion A, the boundary of the first organic encapsulation layer close to the surface of one side of the base substrate defines a first region. In the first region, the film thickness of the first organic encapsulation layer is substantially equal within the process fluctuation range, as shown in FIG. Figure 3 As shown, the thickness of the first organic encapsulation layer in the edge area of ​​the light-transmitting portion is equal to the thickness of the first organic encapsulation layer in the center area of ​​the light-transmitting portion, both of which are D. This can avoid the distortion of the light path in the light-transmitting portion and ensure the imaging effect of the under-screen camera. In some embodiments, in order to further enhance the transmittance of the light-transmitting portion to external light, the film thickness of the first organic encapsulation layer in the light-transmitting portion can be differentiated. In the light-transmitting portion, the film thickness of the first organic encapsulation layer at the first position is less than the film thickness of the first organic encapsulation layer at the second position, and the distance between the first position and the center of the light-transmitting portion is greater than the distance between the second position and the center of the light-transmitting portion. Figure 4As shown, the thickness D1 of the first organic encapsulation layer in the edge area of ​​the light-transmitting portion is less than the thickness D of the first organic encapsulation layer in the center area of ​​the light-transmitting portion. This allows the light-transmitting portion to act as a lens, enhancing the transmittance of external light, allowing more external light to reach the under-screen camera, and improving the imaging effect of the under-screen camera.

[0086] In some embodiments, the thickness of the first organic encapsulation layer gradually decreases from the center of the light-transmitting portion to the edge of the light-transmitting portion, so that the light-transmitting portion is equivalent to a convex lens, which can greatly enhance the transmittance of external light.

[0087] In some embodiments, in order to further improve the transmittance of external light, Figure 5 As shown, the light-transmitting portion includes a plurality of independent prism portions B formed by the first organic encapsulation layer, and the surface of the prism portion B close to the base substrate is a spherical surface, and the spherical surface protrudes toward the base substrate. The prism portions B are independent of each other, that is, adjacent prism portions B do not overlap and do not affect each other. The prism portion B can enhance the transmittance of external light, so that more external light reaches the under-screen camera, thereby improving the imaging effect of the under-screen camera. In some embodiments, the diameter of the prism portion B can be 5-10um. Of course, the diameter of the prism portion B is not limited to 5-10um, and can also be adjusted according to the size of the light-transmitting portion and designed to other values. For example, 3-10 prism portions can be set in a light-transmitting portion, and the size of the prism portion can be determined according to the size of the light-transmitting portion.

[0088] In some embodiments, in order to ensure that the second display area can still display, such as Figure 6 As shown, in the second display area,

[0089] In a first direction parallel to the base substrate, the light-transmitting portion A and the pixel area P are arranged at intervals;

[0090] In a second direction parallel to the base substrate, the light-transmitting portion A and the pixel area P are arranged at intervals;

[0091] The first direction intersects the second direction.

[0092] In this way, the light-transmitting portions A are evenly distributed between the pixel areas P, thereby avoiding the appearance of large light-transmitting portions A and ensuring the display effect of the second display area. One pixel area P can be set between adjacent light-transmitting portions A, or multiple pixel areas P can be set, and each pixel area P can include multiple pixels.

[0093] In some embodiments, the driving circuit layer includes metal traces. After the driving circuit layer is manufactured, the metal traces and the inorganic insulating layer in the area where the light-transmitting portion is located need to be removed to form the light-transmitting portion. Wet etching is required to etch the metal traces in the area where the light-transmitting portion is located to remove the metal traces at the position of the light-transmitting portion. In order to ensure the transmittance of the light-transmitting portion, the etching range can be slightly larger than the range of the light-transmitting portion, so as to ensure that there is no metal layer residue at the edge of the light-transmitting portion. However, if the etching range is too large, the etching effect will be reduced. If the etching effect is affected, metal layer residue will appear. Therefore, the etching range should not be too large, and the minimum distance between the edge of the light-transmitting portion and the adjacent metal trace is not more than 20um.

[0094] In addition, the area of ​​a single light-transmitting portion A can be less than 5 mm 2 On the one hand, this can avoid the appearance of a large area of ​​light-transmitting portion A, ensuring the display effect of the second display area; on the other hand, it can avoid the etching range being too large, ensuring the etching effect, and avoiding the appearance of metal layer residue.

[0095] An embodiment of the present invention further provides a display device including the display substrate as described above.

[0096] The display device includes, but is not limited to, components such as a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will appreciate that the structure of the above-mentioned display device does not limit the display device, and the display device may include more or fewer of the above-mentioned components, or a combination of certain components, or a different arrangement of components. In embodiments of the present invention, the display device includes, but is not limited to, a monitor, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.

[0097] The display device can be any product or component with a display function, such as a television, a monitor, a digital photo frame, a mobile phone, a tablet computer, etc., wherein the display device also includes a flexible circuit board, a printed circuit board and a backplane.

[0098] An embodiment of the present invention further provides a method for manufacturing a display substrate, the display substrate comprising a base substrate, a driving circuit layer, a light-emitting device layer, and an encapsulation layer sequentially stacked on the base substrate, the display substrate comprising a display area and a non-display area, the display area comprising:

[0099] a first display area; and

[0100] a second display area, wherein the orthographic projection of the second display area on the base substrate covers the orthographic projection of an under-screen sensing area on the base substrate, which is arranged on a side of the display substrate away from the light emitting side;

[0101] The pixel density of the second display area is smaller than that of the first display area, and a light-transmitting portion is provided between two adjacent pixels in the second display area;

[0102] The driving circuit layer includes an inorganic insulating layer,

[0103] The production method comprises:

[0104] The inorganic insulating layer at the light-transmitting portion is etched so that the total film thickness of the inorganic insulating layer is less than 200 nm.

[0105] In this embodiment, the inorganic insulating layer at the light-transmitting portion is etched so that the total film thickness of the inorganic insulating layer at the light-transmitting portion is less than 200 nm. This reduces the film thickness of the light-transmitting portion, improves the transmittance of the light-transmitting portion, and further improves the working performance of the under-screen sensor device.

[0106] In a specific example, Figure 1 As shown, the substrate may be a flexible substrate, including a first flexible substrate 01 and a second flexible substrate 02 stacked together. Of course, the substrate is not limited to a flexible substrate, and may also be a rigid substrate.

[0107] A driving circuit layer, a light-emitting device layer and an encapsulation layer are arranged on the base substrate. The driving circuit layer includes a buffer layer 03, a barrier layer 04, a first gate insulation layer 05, a second gate insulation layer 06, an interlayer insulation layer 07, a passivation layer 08, a drain 14, a gate 15, an active layer 16 and a source 17 in sequence. The light-emitting device layer includes a pixel defining layer 10, an anode, a light-emitting layer 11 and a cathode 12.

[0108] In this embodiment, after fabricating the driver circuit layer, the inorganic insulating layer of the transparent portion A is etched to reduce its total thickness to less than 200 nm. This thinning of the transparent portion improves its transmittance, thereby enhancing the performance of the under-display sensor. The inorganic insulating layer of the transparent portion A includes a buffer layer 03, a barrier layer 04, a first gate insulating layer 05, a second gate insulating layer 06, an interlayer insulating layer 07, and a passivation layer 08.

[0109] Specifically, the inorganic insulating layer of the light-transmitting part A can be etched multiple times, for example, the inorganic insulating layer of the light-transmitting part A can be etched twice. During the first etching, the first inorganic insulating part in the inorganic insulating layer of the light-transmitting part A is removed, and during the second etching, the second inorganic insulating part in the inorganic insulating layer of the light-transmitting part A is removed; wherein the first inorganic insulating part can be a part of the inorganic insulating layer composed of the buffer layer 03, the barrier layer 04, the first gate insulating layer 05, the second gate insulating layer 06, the interlayer insulating layer 07, the passivation layer 08, etc., and the second inorganic insulating part is another part of the inorganic insulating layer.

[0110] In some embodiments, the inorganic insulating layer includes a first inorganic insulating portion and a second inorganic insulating portion that are stacked, the first inorganic insulating portion is located between the second inorganic insulating portion and the base substrate, and at the boundary of the light-transmitting portion, the first angle between the side surface of the first inorganic insulating portion and the base substrate is 75-90°, and the second angle between the side surface of the second inorganic insulating portion and the base substrate is 55-85°.

[0111] That is, at the edge of the light-transmitting part A, the slope angle of the first inorganic insulating part is 75-90°, and the slope angle of the second inorganic insulating part is 55-85°. In this way, in the light-transmitting part A, the side wall of the groove formed by the inorganic insulating layer is stepped, which can gather more light and improve the working effect of the under-screen sensor device.

[0112] In some embodiments, in order to maximize the reduction of the film thickness of the transparent portion and improve the transmittance of the transparent portion, the entire inorganic insulating layer of the transparent portion can be etched away so that the total film thickness of the inorganic insulating layer at the transparent portion can be 0.

[0113] In some embodiments, the inorganic insulating layer of the light-transmitting portion A can be etched multiple times, with each etching having a different range. For example, the range of the subsequent etching is larger than the range of the previous etching, so that the following structure can be formed: Figure 2 In the structure shown, at the boundary of the light-transmitting portion A, the sidewalls of the groove formed by the inorganic insulating layer are stepped, and the dimension of the light-transmitting portion farther from the base substrate is larger than the dimension of the light-transmitting portion closer to the base substrate. Specifically, the sidewalls of the groove formed by the inorganic insulating layer may include two, three, or more step surfaces.

[0114] Specifically, if Figure 2 As shown, a conductive pattern 09 can be formed at a corresponding position. When the inorganic insulating layer is etched by dry etching, the conductive pattern 09 can limit the range of dry etching. By limiting the range of dry etching, the side wall of the groove formed by the inorganic insulating layer can be formed into a step shape.

[0115] This can increase the light-gathering area of ​​the light-transmitting part A, allowing more light to enter the light-transmitting part A, enhancing the light transmission intensity, and thereby improving the working performance of the under-screen sensor device.

[0116] In some embodiments, such as Figure 3As shown, forming the encapsulation layer includes: forming a second inorganic encapsulation layer 19, a first organic encapsulation layer 20 and a third inorganic encapsulation layer 21 stacked in sequence, the second inorganic encapsulation layer is located between the first organic encapsulation layer and the base substrate, the refractive index of the first organic encapsulation layer is n1, the refractive index of the second inorganic encapsulation layer is n2, and the refractive index of the first organic encapsulation layer is less than the refractive index of the second inorganic encapsulation layer. When light is incident from the high refractive index film layer to the low refractive index film layer, the light will be totally reflected. Therefore, in this embodiment, the refractive index of the first organic encapsulation layer is designed to be less than the refractive index of the second inorganic encapsulation layer. In this way, when light is incident from the second inorganic encapsulation layer (high refractive index film layer) to the interface of the first organic encapsulation layer (low refractive index film layer), due to the difference in refractive index between the first organic encapsulation layer and the second inorganic encapsulation layer, this part of the incident light is reflected, the exit angle is changed, the incident light intensity is enhanced, and the transmittance of the incident light is improved, thereby improving the recognition rate of under-screen sensor devices such as under-screen cameras.

[0117] In some embodiments, n1 may be approximately 1.3, and n2 may be between 1.5 and 1.9.

[0118] To ensure the formation of a total reflection interface between the second inorganic encapsulation layer and the first organic encapsulation layer, in some embodiments, the refractive index n1 of the first organic encapsulation layer and the refractive index n2 of the second inorganic encapsulation layer satisfy:

[0119]

[0120] Wherein, θ is the angle between the side surface of the first organic encapsulation layer and the base substrate at the boundary of the light-transmitting portion, that is, the slope angle of the first organic encapsulation layer.

[0121] In order to reduce the influence of the optical path distortion of the transparent part on the camera imaging effect, the organic film layer in the central area of ​​the transparent part is flattened, such as Figure 3 As shown, in the light-transmitting portion A, the boundary of the first organic encapsulation layer close to the surface of one side of the base substrate defines a first region. In the first region, the film thickness of the first organic encapsulation layer is substantially equal within the process fluctuation range, as shown in FIG. Figure 3 As shown, the thickness of the first organic encapsulation layer in the edge area of ​​the light-transmitting part is equal to the thickness of the first organic encapsulation layer in the center area of ​​the light-transmitting part, both of which are D. This can avoid the distortion of the optical path in the light-transmitting part and ensure the imaging effect of the under-screen camera.

[0122] In some embodiments, in order to further enhance the transmittance of the light-transmitting portion to external light, the film thickness of the first organic encapsulation layer in the light-transmitting portion can be differentiated. Specifically, the first organic encapsulation layer can be made by a half-tone mask or a gray tone mask, so that the film thickness of the first organic encapsulation layer in the light-transmitting portion is differentiated. For example, in the light-transmitting portion, the film thickness of the first organic encapsulation layer at a first position is smaller than the film thickness of the first organic encapsulation layer at a second position, and the distance between the first position and the center of the light-transmitting portion is larger than the distance between the second position and the center of the light-transmitting portion. Figure 4 As shown, the thickness D1 of the first organic encapsulation layer in the edge area of ​​the light-transmitting portion is less than the thickness D of the first organic encapsulation layer in the center area of ​​the light-transmitting portion. This allows the light-transmitting portion to act as a lens, enhancing the transmittance of external light, allowing more external light to reach the under-screen camera, and improving the imaging effect of the under-screen camera.

[0123] In some embodiments, the thickness of the first organic encapsulation layer gradually decreases from the center of the light-transmitting portion to the edge of the light-transmitting portion, so that the light-transmitting portion is equivalent to a convex lens, which can greatly enhance the transmittance of external light.

[0124] In some embodiments, in order to further improve the transmittance of external light, Figure 5 As shown, the formation of the light-transmitting portion includes: forming a plurality of independent prism portions B formed by the first organic encapsulation layer, the surface of the prism portion B close to the substrate is a spherical surface, and the spherical surface protrudes toward the substrate. The prism portions B are independent of each other, that is, adjacent prism portions B do not overlap and do not affect each other. The prism portion B can enhance the transmittance of external light, so that more external light reaches the under-screen camera, thereby improving the imaging effect of the under-screen camera. In some embodiments, the diameter of the prism portion B can be 5-10um. Of course, the diameter of the prism portion B is not limited to 5-10um, and can also be adjusted according to the size of the light-transmitting portion and designed to other values. For example, 3-10 prism portions can be set in a light-transmitting portion, and the size of the prism portion can be determined according to the size of the light-transmitting portion.

[0125] In some embodiments, the driving circuit layer includes metal traces. After the driving circuit layer is manufactured, the metal traces and the inorganic insulating layer in the area where the light-transmitting portion is located need to be removed to form the light-transmitting portion. Wet etching is required to etch the metal traces in the area where the light-transmitting portion is located to remove the metal traces at the position of the light-transmitting portion. In order to ensure the transmittance of the light-transmitting portion, the etching range can be slightly larger than the range of the light-transmitting portion, so as to ensure that there is no metal layer residue at the edge of the light-transmitting portion. However, if the etching range is too large, the etching effect will be reduced. If the etching effect is affected, metal layer residue will appear. Therefore, the etching range should not be too large, and the minimum distance between the edge of the light-transmitting portion and the adjacent metal trace is not more than 20um.

[0126] It should be noted that the various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences from other embodiments. In particular, since the embodiments are generally similar to the product embodiments, the description is relatively simple. For relevant parts, refer to the partial description of the product embodiments.

[0127] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0128] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0129] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0130] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display substrate comprising a base substrate, a driving circuit layer, a light-emitting device layer, and an encapsulation layer sequentially stacked on the base substrate, characterized in that: The display substrate includes a display area and a non-display area, and the display area includes: a first display area; and a second display area, wherein the orthographic projection of the second display area on the base substrate covers the orthographic projection of an under-screen sensing area on the base substrate, which is arranged on a side of the display substrate away from the light emitting side; The pixel density of the second display area is smaller than that of the first display area, and a light-transmitting portion is provided between two adjacent pixels in the second display area; The driving circuit layer includes an inorganic insulating layer, and the total film thickness of the inorganic insulating layer at the light-transmitting portion is less than 200 nm; A conductive pattern is formed at the corresponding position. When the inorganic insulating layer is etched by dry etching, the conductive pattern can limit the range of dry etching. By limiting the range of dry etching, the side wall of the groove formed by the inorganic insulating layer can be formed into a step shape.

2. The display substrate according to claim 1, wherein: The encapsulation layer at the light-transmitting portion includes a first organic encapsulation layer and a second inorganic encapsulation layer stacked together, the second inorganic encapsulation layer is located between the first organic encapsulation layer and the base substrate, the refractive index of the first organic encapsulation layer is n1, the refractive index of the second inorganic encapsulation layer is n2, and the refractive index of the first organic encapsulation layer is less than the refractive index of the second inorganic encapsulation layer.

3. The display substrate according to claim 2, wherein: In the light-transmitting portion, a boundary of the first organic encapsulating layer close to a surface of one side of the base substrate defines a first region. In the first region, the film thickness of the first organic encapsulating layer is substantially uniform.

4. The display substrate according to claim 2, wherein: In the transparent portion, the thickness of the first organic encapsulation layer at a first position is smaller than that at a second position, and the distance between the first position and the center of the transparent portion is larger than the distance between the second position and the center of the transparent portion.

5. The display substrate according to claim 4, wherein: The film thickness of the first organic encapsulating layer gradually decreases in a direction from the center of the light-transmitting portion to the edge of the light-transmitting portion.

6. The display substrate according to claim 2, wherein: The refractive index n1 of the first organic encapsulation layer and the refractive index n2 of the second inorganic encapsulation layer satisfy: Wherein, θ is the angle between the side surface of the first organic encapsulation layer and the base substrate at the boundary of the light-transmitting portion.

7. The display substrate according to claim 2, wherein: The dimension of the light-transmitting portion at a side away from the base substrate is larger than the dimension of the light-transmitting portion at a side close to the base substrate.

8. The display substrate according to claim 2, wherein: The light-transmitting portion includes a plurality of mutually independent prism portions formed by the first organic encapsulation layer. A surface of the prism portion close to the base substrate is a spherical surface, and the spherical surface is convex toward the base substrate.

9. The display substrate according to claim 8, wherein: The diameter of the prism portion is 5-10 μm.

10. The display substrate according to claim 1, wherein The display substrate according to claim 1 is characterized in that the inorganic insulating layer includes a first inorganic insulating portion and a second inorganic insulating portion stacked together, the first inorganic insulating portion is located between the second inorganic insulating portion and the base substrate, and at the boundary of the light-transmitting portion, a first angle between the side surface of the first inorganic insulating portion and the base substrate is 75-90°, and a second angle between the side surface of the second inorganic insulating portion and the base substrate is 55-85°.

11. The display substrate according to claim 1, wherein The total film thickness of the inorganic insulating layer in the light-transmitting portion is 0.

12. The display substrate according to claim 1, wherein In the second display area, In a first direction parallel to the base substrate, the light-transmitting portion and the pixel area are arranged at intervals; In a second direction parallel to the base substrate, the light-transmitting portion and the pixel area are arranged at intervals; The first direction intersects the second direction.

13. The display substrate according to claim 1, wherein The area of ​​the light-transmitting portion is less than 5 mm 2 .

14. The display substrate according to claim 1, wherein The driving circuit layer includes metal traces, and the minimum distance between the edge of the light-transmitting portion and an adjacent metal trace is no more than 20 μm.

15. A display device, characterized in that: The display substrate comprises the display substrate according to any one of claims 1 to 14.

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