Electronic device

Abstract

The present application provides an electronic device, which includes an air flow driving member, a middle frame, a main board and a structural member that are sequentially stacked along a first direction. A first guiding portion and a second guiding portion are provided between the structural member and the main board, and the first guiding portion, the second guiding portion and the structural member jointly enclose a first air duct. A third guiding portion and a fourth guiding portion are provided between the middle frame and the main board, and the third guiding portion, the fourth guiding portion and the middle frame jointly enclose a second air duct. The air flow driving member is located on the first air duct and the second air duct or on the path where the first air duct and the second air duct communicate with the outside of the electronic device. The air flow driving member is configured to drive air to blow from the air inlets of the first air duct and the second air duct to the air outlets of the first air duct and the second air duct respectively. The first air duct and the second air duct are respectively provided on two surfaces of the main board to dissipate heat from the two surfaces of the main board, thereby improving the heat dissipation efficiency. Moreover, the first guiding portion, the second guiding portion, the third guiding portion and the fourth guiding portion can reduce the air resistance of the cold air in the electronic device.

Description

Technical Field

[0001] This application relates to the technical field of terminals, and particularly to an electronic device. Background Art

[0002] With the development of smart phones, features such as CPU, charging, and camera have become the key to measuring the performance of a product. While the functions of the mobile phone are increasing, the heat generation of the mobile phone is also increasing. If the temperature of the mobile phone rises too high, it will affect the normal use of the mobile phone functions. Currently, the air-cooling heat dissipation solutions mainly include two categories. One is to externally install a fan on the mobile phone to blow the surface of the mobile phone for heat dissipation. This type is not convenient to carry and affects the operation. The other is to internally install a fan in the mobile phone. Currently, it is mainly to stack the fan on the main board and set up an independent air duct structure to cool the mobile phone. The cold air cannot directly contact the heat-generating components, resulting in poor heat dissipation effect, and the overall stacking thickness of the whole machine is large, which is not enough to meet the current development direction of thin, light, and high-performance products. Summary of the Invention

[0003] This application provides an electronic device that can directly dissipate heat from the upper and lower surfaces of the main board and reduce wind resistance.

[0004] The electronic device provided by this application includes an air flow driving member, and a middle frame, a main board, and a structural member that are sequentially stacked along a first direction. Among them, the middle frame is the main load-bearing member in the electronic device. The middle frame can be a carrier for carrying internal devices of the electronic device. One side of the middle frame is used to install a display screen, and the other side is used to install devices such as a battery and a main board. The main board, also known as the mainboard, system board, or motherboard, is a component that integrates the circuits of the electronic device. There are general standards for the layout arrangement, size, shape, and power supply specifications used for each component on the main board. When each component on the main board is working in the electronic device, a lot of heat will be generated, which is the main heat source of the electronic device. If the temperature of the main board rises too high, it will affect the performance of the components on the main board, and it is necessary to cool and dissipate heat from the main board in time. Among them, the air flow driving member is a fan, including a centrifugal fan or an axial flow fan, and the shape of the fan can be cylindrical, columnar, or other shapes.

[0005] The middle frame and the structural member are arranged on both sides of the main board along the first direction. In this embodiment, the first direction is the thickness direction of the electronic device. Among them, the structural member can be a rear cover or a support member. The support member is used to support the main board, and the main board is fixed between the support member and the middle frame. The support member can also be used to support other electronic components in the electronic device.

[0006] A first guiding portion and a second guiding portion are provided between the structural member and the main board and are oppositely arranged along a second direction. The first guiding portion, the structural member, the second guiding portion, and the main board together enclose a first air duct. Among them, the second direction intersects the first direction. In this embodiment, the second direction is perpendicular to the first direction. The second direction is parallel to the plane where the display screen or the back cover of the electronic device is located, and the second direction can be the width direction or the length direction of the electronic device. In this embodiment, the second direction is the width direction of the electronic device. Among them, when the structural member is the back cover, only a part of the back cover participates in forming the first air duct. When the structural member is the support member, the entire support member or a part of the support member can participate in forming the first air duct.

[0007] Among them, the first guiding portion and the second guiding portion can be continuous blocks or blocks with pores. In this embodiment, the first guiding portion and the second guiding portion are continuous blocks. When the cold air outside the electronic device enters the first air duct, the cold air will not leak to the area outside the first air duct, but only dissipate heat from the surface of the main board inside the first air duct, improving the heat dissipation efficiency of the main board.

[0008] In some embodiments, the first guiding portion and the second guiding portion are discontinuous blocks. The first guiding portion has a plurality of first guiding sub-portions, and the second guiding portion has a plurality of second guiding sub-portions. There is a first gap between two adjacent first guiding sub-portions, and there is a second gap between two adjacent second guiding sub-portions. Among them, the lengths of the plurality of first guiding sub-portions can be the same or different, and the widths of the first gaps between two adjacent first guiding sub-portions can be the same or different. The lengths of the plurality of second guiding sub-portions can be the same or different, and the widths of the second gaps between two adjacent second guiding sub-portions can be the same or different. In this embodiment, the first guiding portion and the second guiding portion can also guide most of the cold air to flow through the first air duct, so as to accelerate the heat dissipation efficiency of the surface of the main board located in the first air duct. In this embodiment, the first guiding portion and the second guiding portion are discontinuous blocks, which is beneficial for the main board to be electrically connected to other electronic components in the electronic device through connecting wires. For example, one end of the connecting wire passes through the first gap or the second gap and is electrically connected to the surface of the main board facing the structural member, and the other end of the connecting wire is connected to an electronic component outside the main board. The setting of the first gap or the second gap is beneficial for the surface of the main board facing the structural member to be electrically connected to the surrounding electronic components.

[0009] A third guiding portion and a fourth guiding portion are provided between the middle frame and the main board and are oppositely arranged along a third direction. The third guiding portion, the middle frame, the fourth guiding portion, and the main board together enclose a second air duct. The first direction intersects the second direction and the third direction respectively. In this embodiment, the third direction is perpendicular to the first direction and is the same as the second direction, and the first air duct and the second air duct are arranged in parallel. In some embodiments, the third direction and the second direction can be different and intersect each other.

[0010] The third guiding portion and the fourth guiding portion may be continuous blocks or blocks with pores. In this embodiment, the third guiding portion and the fourth guiding portion are continuous blocks. When the cold air outside the electronic device enters the second air duct, the cold air will not leak to the area outside the second air duct, but only dissipate the heat of the main board surface in the second air duct. The first air duct and the second air duct dissipate the heat of the two surfaces of the main board respectively, thereby improving the heat dissipation efficiency of the main board.

[0011] In some embodiments, the third guiding portion and the fourth guiding portion are discontinuous blocks. The third guiding portion has a plurality of third guiding sub-portions, the fourth guiding portion has a plurality of fourth guiding sub-portions, there is a third gap between two adjacent third guiding sub-portions, and there is a fourth gap between two adjacent fourth guiding sub-portions. Among them, the lengths of the plurality of third guiding sub-portions may be the same or different, and the widths of the third gaps between two adjacent third guiding sub-portions may be the same or different. The lengths of the plurality of fourth guiding sub-portions may be the same or different, and the widths of the fourth gaps between two adjacent fourth guiding sub-portions may be the same or different. In this embodiment, the third guiding portion and the fourth guiding portion can also guide the cold air to flow through the second air duct to accelerate the heat dissipation efficiency of the surface of the main board located in the second air duct. In this embodiment, the third guiding portion and the fourth guiding portion are discontinuous blocks, which is beneficial to the electrical connection of the main board and other electronic components in the electronic device through connecting wires. For example, one end of the connecting wire passes through the third gap or the fourth gap and is electrically connected to the surface of the main board facing the middle frame, and the other end of the connecting wire is connected to an electronic component outside the main board. The setting of the third gap or the fourth gap is beneficial to the electrical connection between the surface of the main board facing the middle frame and the surrounding electronic components.

[0012] The air flow driving member is located on the first air duct and the second air duct or on the path where the first air duct and the second air duct communicate with the outside of the electronic device. The first air duct and the second air duct both have air inlets and air outlets that are oppositely arranged and communicate with the outside of the electronic device. The air flow driving member is used to drive the air to blow from the air inlets of the first air duct and the second air duct to the air outlets of the first air duct and the second air duct respectively.

[0013] Among them, the first air duct and the second air duct include the interiors of the first air duct and the second air duct, as well as the air outlets or air inlets of the first air duct and the second air duct. That is, the air flow driving member can be located inside the first air duct and the second air duct, or at the air outlets or air inlets of the first air duct and the second air duct. In this application, the air inlet refers to the position where air enters the component, and the air outlet refers to the position where air leaves the component. For example, the air inlet and air outlet of the air flow driving member are denoted as the first air inlet and the first air outlet. When the air flow driving member is working, it drives air to enter from the first air inlet and leave from the first air outlet, where the first air inlet and the first air outlet are located on opposite sides of the air flow driving member. For another example, the air inlet and air outlet of the first air duct are denoted as the second air inlet and the second air outlet, and the second air inlet and the second air outlet are respectively located at both ends of the first air duct. When the air flow driving member is working, it drives air to enter from the second air inlet of the first air duct, and then after passing through the interior of the first air duct, it leaves from the second air outlet. For another example, the air inlet and air outlet of the second air duct are denoted as the third air inlet and the third air outlet, and the third air inlet and the third air outlet are respectively located at both ends of the second air duct. When the air flow driving member is working, it drives air to enter from the third air inlet of the second air duct, and then after passing through the interior of the second air duct, it leaves from the third air outlet.

[0014] The number of air flow driving members can be set to 1, 2, 3 or more according to actual needs. In some embodiments, there are two air flow driving members, and the two air flow driving members are respectively located inside the first air duct and the second air duct. For the air flow driving member located in the first air duct, the first air inlet of the air flow driving member and the second air inlet of the first air duct are on the same side, and the first air outlet of the air flow driving member and the second air outlet of the first air duct are on the same side. When the air flow driving member is working, air enters the second air inlet of the first air duct, then enters the first air inlet of the air flow driving member, and then leaves the air flow driving member from the first air outlet of the air flow driving member, and then leaves the first air duct through the second air outlet. For the air flow driving member located in the second air duct, the first air inlet of the air flow driving member and the third air inlet of the second air duct are on the same side, and the first air outlet of the air flow driving member and the third air outlet of the second air duct are on the same side. When the air flow driving member is working, air enters the third air inlet of the second air duct, then enters the first air inlet of the air flow driving member, and then leaves the air flow driving member from the first air outlet of the air flow driving member, and then leaves the second air duct through the third air outlet. In this embodiment, the second air inlet and the third air inlet are arranged on the same side, and the second air outlet and the third air outlet are arranged on the same side. In some embodiments, the second air inlet and the third air outlet are arranged on the same side, and the second air outlet and the third air inlet are arranged on the same side. That is to say, the blowing directions of the air flow driving members in the first air duct and the second air duct are opposite, and the flowing directions of the air in the first air duct and the second air duct are opposite. In some embodiments, 2 or more air flow driving members can be respectively arranged in the first air duct and the second air duct to increase the air volume or accelerate the flow rate, thereby improving the cooling efficiency.

[0015] Among them, the air flow driving member is located on the path where the first air duct and the second air duct communicate with the outside of the electronic device, including the path where the air flow driving member is located on the path where the air inlets of the first air duct and the second air duct communicate with the outside of the electronic device, or the path where the air flow driving member is located on the path where the air outlets of the first air duct and the second air duct communicate with the outside of the electronic device. In one embodiment, the air flow driving member is located on the path where the second air inlet of the first air duct communicates with the outside of the electronic device. For example, when the electronic device includes a rear cover, the air inlet of the electronic device is provided on one side wall of the rear cover. In this embodiment, an air inlet hole can be opened on the second guiding portion to enable the second air inlet of the first air duct to communicate with the outside. The air flow driving member is located between the second air inlet of the first air duct and the air inlet of the rear cover. When the air flow driving member works, it drives the air to enter the electronic device from the air inlet of the rear cover, and then the air enters the second air inlet of the first air duct. In one embodiment, the air flow driving member is located on the path where the second air outlet of the first air duct communicates with the outside of the electronic device. For example, the air outlet of the electronic device is provided on the other side wall of the rear cover. In this embodiment, an air outlet hole can be opened on the first guiding portion to enable the second air outlet of the first air duct to communicate with the outside. The air flow driving member is located between the second air outlet of the first air duct and the air outlet of the rear cover. When the air flow driving member works, it will form a negative pressure in the internal space of the electronic device, and then it can drive the air flowing through the first air duct to leave from the second air outlet after flowing through the first air duct, enter the first air inlet of the air flow driving member, and then leave from the first air outlet of the air flow driving member, and then leave the electronic device from the air outlet of the rear cover. The specific implementation manners for the air flow driving member located on the path where the air inlet or the air outlet of the second air duct communicates with the outside of the electronic device are similar to the above, and will not be elaborated here. Similarly, in the above embodiments, 2 or more air flow driving members can be provided to increase the air volume or accelerate the flow rate, thereby improving the cooling efficiency.

[0016] In the present application, a first air duct and a second air duct are respectively provided on two surfaces of the main board to dissipate heat from the two surfaces of the main board, which can improve the heat dissipation efficiency. Moreover, a first guiding portion and a second guiding portion are provided on two sides of the first air duct, and a third guiding portion and a fourth guiding portion are provided on two sides of the second air duct. On the one hand, it can prevent the cold air from flowing into other spaces outside the first air duct and the second air duct, resulting in a reduction in the air volume in the first air duct and the second air duct and a decrease in the heat dissipation efficiency. On the other hand, it can also reduce the air resistance of the cold air in the electronic device. The first guiding portion and the second guiding portion guide a part of the cold air so that this part of the cold air flows in the first air duct, and the third guiding portion and the fourth guiding portion guide another part of the cold air so that this part of the cold air flows in the second air duct. With the same air volume entering the electronic device, it can prevent a part of the cold air from flowing in other spaces outside the first air duct and the second air duct, so as to reduce the air resistance of the overall air volume entering the electronic device, accelerate the flow speed of the cold air in the electronic device, and further improve the heat dissipation efficiency of the heat-generating components on the main board.

[0017] In a possible implementation manner, the air outlets of the first air duct and the second air duct are arranged on the same side and communicate with each other. The air flow driving member is located on one side of the air outlets of the first air duct and the second air duct, and the air inlet of the air flow driving member communicates with the air outlets of the first air duct and the second air duct, and the air outlet of the air flow driving member communicates with the outside of the electronic device. In this embodiment, the second air inlet of the first air duct and the third air inlet of the second air duct are arranged on the same side, the second air outlet of the first air duct and the third air outlet of the second air duct are arranged on the same side. The first air inlet of the air flow driving member is the opening of the air flow driving member facing the second air duct, and the first air outlet of the air flow driving member is the opening of the air flow driving member facing the structural member. When the air flow driving member works, a negative pressure is formed at the first air inlet of the air flow driving member, so that the air in the first air duct and the second air duct flows towards the air flow driving member, causing a negative pressure in the first air duct and the second air duct, and then driving the cold air outside the electronic device communicated with the first air duct and the second air duct to enter the first air duct and the second air duct, thereby dissipating heat from the two surfaces of the main board. The heated air is sucked into the air flow driving member and leaves the electronic device from the first air outlet of the air flow driving member.

[0018] In a possible implementation manner, the air inlets of the first air duct and the second air duct are arranged on the same side and communicate with each other. The air flow driving member is located on one side of the air inlets of the first air duct and the second air duct, and the air inlet of the air flow driving member communicates with the outside of the electronic device, and the air outlet of the air flow driving member communicates with the air inlets of the first air duct and the second air duct. When the air flow driving member works, the first air inlet of the air flow driving member sucks the cold air outside the electronic device, and this cold air blows from the first air outlet of the air flow driving member to the first air duct and the second air duct, thereby dissipating heat from the main board. Among them, the air flow driving member can be clamped at the position of the structural member corresponding to the air inlets of the first air duct and the second air duct, or arranged at the position of the main board corresponding to the air inlets of the first air duct and the second air duct.

[0019] In some embodiments, the electronic device includes two air flow driving components. One air flow driving component is located on one side of the air outlets of the first air duct and the second air duct, and the air inlet of this air flow driving component is communicated with the air outlets of the first air duct and the second air duct, and the air outlet of this air flow driving component is communicated with the outside of the electronic device; the other air flow driving component is located on one side of the air inlets of the first air duct and the second air duct, and the air inlet of this air flow driving component is communicated with the outside of the electronic device, and the air outlet of this air flow driving component is communicated with the air inlets of the first air duct and the second air duct. The two air flow driving components are respectively arranged at the air inlets and air outlets of the first air duct and the second air duct to accelerate the air flow speed, improve the heat exchange rate between the main board and the cold air, and thus enhance the heat dissipation efficiency of the main board.

[0020] In a possible implementation, the orthographic projections of the first air duct and the second air duct on the main board at least partially overlap. In some embodiments, the orthographic projections of the first air duct and the second air duct on the main board completely overlap, so that the cold air in the first air duct and the second air duct dissipates heat from the main board with the highest efficiency. In some embodiments, the orthographic projections of the first air duct and the second air duct on the main board may intersect.

[0021] In a possible implementation, the lengths of the first guiding portion and the second guiding portion along the fourth direction are the same as the length of the main board, and the lengths of the third guiding portion and the fourth guiding portion along the fourth direction are the same as the length of the main board. So that the lengths of the first air duct and the second air duct along the fourth direction are the same as the length of the main board along the fourth direction, and thus the main board can be cooled with the highest efficiency. Wherein, the fourth direction is perpendicular to the first direction, and is coplanar and perpendicular to the second direction. In this embodiment, the fourth direction is the length direction of the electronic device, the first direction is the thickness direction of the electronic device, and the second direction is the width direction of the electronic device.

[0022] In some embodiments, the lengths of the first guiding portion, the second guiding portion, the third guiding portion and the fourth guiding portion along the fourth direction can be set according to the positions of the main heat generating components on the main board. When the positions of the main heat generating components on the main board are located in a part of the main board close to the air flow driving component, the lengths of the first guiding portion, the second guiding portion, the third guiding portion and the fourth guiding portion along the fourth direction can be set shorter than the main board, so that the first air duct and the second air duct only dissipate heat from the part with heat generating components. Setting the air ducts in this targeted manner can not only dissipate heat from the main board, but also save the space occupied by the air ducts.

[0023] In a possible implementation, the structural member in the area of the first air duct is provided with a first air inlet hole and a first air outlet hole that penetrate through the opposite two surfaces of the structural member. The first air inlet hole and the first air outlet hole are respectively located at opposite ends of the first air duct. The first air inlet hole and the first air outlet hole are respectively communicated with the outside of the electronic device, and the first air outlet hole is communicated with the air outlet (the first air outlet) of the air flow driving member; so that air enters from the first air inlet hole, flows through the first air duct and the air flow driving member and exits from the first air outlet hole. Specifically, after the cold air enters from the first air inlet hole, a part of the cold air flows through the first air duct and is heated to become hot air. The hot air enters the air inlet of the air flow driving member from the air outlet of the first air duct and leaves the electronic device from the air outlet of the air flow driving member. The shapes of the first air inlet hole and the first air outlet hole can be any one of circular, square, elliptical or irregular shapes.

[0024] In a possible implementation, the main board is provided with a second air inlet hole that penetrates through the opposite two surfaces of the main board. The second air inlet hole is communicated with the first air inlet hole, so that air enters from the first air inlet hole into the second air inlet hole, flows through the second air duct and the air flow driving member and exits from the first air outlet hole. Specifically, after the cold air enters from the first air inlet hole, another part of the cold air enters the second air duct from the second air inlet hole, and is heated to become hot air after flowing through the second air duct. The hot air enters the air inlet of the air flow driving member from the air outlet of the second air duct and leaves the electronic device from the air outlet of the air flow driving member. In this embodiment, the cold air outside the electronic device is split after entering the first air inlet hole. One part of the cold air enters the first air duct, and the other part of the cold air enters the second air duct through the second air inlet, so that the cold air is cooled on the two air ducts on the upper and lower surfaces of the main board. In this embodiment, the air inlet side of the cold air can be set on the side of the structural member away from the main board. For example, when the structural member is the rear cover, the first air inlet hole of the structural member communicates the inside and the outside of the electronic device, and the cold air enters the electronic device from the first air inlet hole.

[0025] In some embodiments, the cold air can first enter the second air duct and then enter the first air duct from the air inlet hole on the main board. That is to say, in this embodiment, the air inlet side of the cold air can be set on the display screen side or the frame of the middle frame, or on the rear cover, and enter the second air duct through other air ducts in the rear cover.

[0026] In a possible implementation, the air flow driving member is located on the side of the main board away from the second air inlet hole, that is, the air flow driving member and the main board are not stacked in the thickness direction, but are arranged parallel in the width or length direction, which can reduce the stacked thickness of the electronic device. In some embodiments, the thickness of the air flow driving member in the first direction is the same as the thickness of the main board in the first direction, and the surfaces on both sides of the air flow driving member along the first direction are respectively parallel and aligned with the surfaces on both sides of the main board along the first direction, so that the thickness of the two components, namely the air flow driving member and the main board, in the first direction is only the thickness of one main board or one air flow driving member, in order to reduce the stacked thickness of the electronic device. In addition, in this embodiment, the air flow driving member is located on the side of the main board away from the second air inlet hole, so that the cold air entering the first air inlet hole can blow and cool the main board between the first air inlet hole and the air flow driving member. When the lengths of the first air duct and the second air duct in the fourth direction are the same as that of the main board, the cold air can blow and cool the entire main board, improving the cooling and heat dissipation efficiency.

[0027] In a possible implementation, the orthographic projection of the second air inlet hole on the main board at least partially overlaps with that of the first air inlet hole, so as to connect the first air inlet hole and the second air inlet hole. In this embodiment, the orthographic projections of the second air inlet hole and the first air inlet hole on the main board completely overlap, increasing the air volume of the cold air entering the second air duct and reducing the wind resistance. In an embodiment, when the air flow driving member is located on one side of the air inlets of the first air duct and the second air duct, a second air outlet hole penetrating the main board is further provided at one end of the main board away from the second air inlet hole, and the orthographic projection of the first air outlet hole on the main board at least partially overlaps with that of the second air outlet hole, so as to connect the first air outlet hole and the second air outlet hole and increase the speed of the air leaving the electronic device.

[0028] In the embodiments of the present application, the shapes of the first air duct and the second air duct are not limited and can be set according to the shape of the main board. Among them, the main board can be square, T-shaped or L-shaped, etc., and the shapes of the first air duct and the second air duct can also be square, T-shaped or L-shaped.

[0029] In a possible implementation, the orthographic projection of the first air outlet hole on the structural member at least partially overlaps with that of the air flow driving member. In this embodiment, the orthographic projection of the first air outlet hole on the structural member overlaps with that of the air flow driving member, and the length of the air flow driving member in the second direction is the same as the length of the main board in the second direction. In this embodiment, one ends of the first guiding portion and the second guiding portion adjacent to the air flow driving member are arranged between the air flow driving member and the structural member.

[0030] In a possible implementation, there is a fifth gap between the air flow driving member and the main board, and the first air duct communicates with the air inlet of the air flow driving member through the fifth gap. When the air flow driving member works, the cold air in the first air duct will be sucked into the air flow driving member through the fifth gap. Since the air inlet (the first air inlet) of the air flow driving member communicates with the first air duct, when the air flow driving member works, part of the cold air flows through the first air duct and enters the air flow driving member from the fifth gap, and the other part of the cold air flows through the second air duct and enters the air flow driving member from the air outlet (the third air outlet) of the second air duct. One end of the second air duct adjacent to the air flow driving member is the air outlet of the second air duct. The length of the fifth gap in the fourth direction can be set according to the actual product situation, for example, set to 5 mm or 8 mm.

[0031] In a possible implementation, the structural member is the rear cover, and the first guiding portion and the second guiding portion are connected to the rear cover. The first guiding portion and the second guiding portion are arranged between the rear cover and the main board. In this embodiment, when the structural member is the rear cover, the first air duct is formed by part of the rear cover participating, that is, the first guiding portion and the second guiding portion are fixedly connected to the middle part of the rear cover. The first guiding portion and the second guiding portion can be connected between the rear cover and the main board by connection means such as adhesives, screws, and buckles. In some embodiments, the first guiding portion and the second guiding portion can be formed by bosses protruding from the rear cover to the main board, that is, the first guiding portion and the second guiding portion are integrally formed with the rear cover. In some embodiments, it can also be that the rear cover itself is grooved to form the first air duct, and the groove walls on both sides are respectively the first guiding portion and the second guiding portion.

[0032] In an embodiment, the first air inlet hole and the first air outlet hole are arranged on the rear cover. The side of the rear cover away from the main board is the external environment of the electronic device. The cold air in the external environment enters the electronic device from the first air inlet hole. Part of the cold air flows through the first air duct and enters the air flow driving member from the fifth gap, and the other part of the cold air enters the second air duct from the second air inlet hole, flows through the second air duct and then enters the air flow driving member, and then leaves the electronic device from the first air outlet hole. In order to reduce the water in the external environment from entering the electronic device through the first air inlet hole and the first air outlet hole, a water-repellent and breathable film layer can be arranged in the first air inlet hole and the first air outlet hole to block water vapor. In some embodiments, the first air inlet hole and the first air outlet hole can be arranged on the side wall of the rear cover protruding towards the display screen to prevent the user's hand from blocking the first air inlet hole and the first air outlet hole when holding the rear cover.

[0033] In a possible implementation, the structural member is a support member, and the first guiding portion and the second guiding portion are oppositely arranged at the edge of the support member and connected to the support member. The support member can be used to support the main board or other electronic components in the electronic device. The shape of the support member and the main board can be the same or different. When the shapes of the support member and the main board are the same, the first guiding portion and the second guiding portion are oppositely arranged at the edge of the main board and connected to the main board. At this time, the entire support member, the main board, the first guiding portion, and the second guiding portion jointly enclose and form a first air duct. In some embodiments, the first guiding portion and the second guiding portion can be formed by bosses protruding from the support member to the main board, that is, the first guiding portion and the second guiding portion are integrally formed with the support member. In some embodiments, the first air duct can also be formed by grooving the support member itself, and the two side walls of the groove are respectively the first guiding portion and the second guiding portion.

[0034] In a possible implementation, the first side wall and the second side wall are provided at both ends of the support member along the fourth direction. The first side wall is connected to one end of the first guiding portion and the second guiding portion, and the second side wall is connected to the other end of the first guiding portion and the second guiding portion. The first side wall is adjacent to the air inlet of the first air duct, and the second side wall is adjacent to the air outlet of the first air duct. The fourth direction is perpendicular to the first direction, coplanar with and perpendicular to the second direction. In this embodiment, the fourth direction is the length direction of the electronic device, the first direction is the thickness direction of the electronic device, and the second direction is the width direction of the electronic device. The first side wall, the first guiding portion, the second side wall, and the second guiding portion are sequentially connected end to end, and together with the support member and the main board on both sides along the first direction, they enclose and form a first air duct. The first side wall and the second side wall can be formed by bosses protruding from the support member to the main board, that is, the first side wall and the second side wall are integrally formed with the support member, or they can be separate components connected between the main board and the support member by connection means such as adhesives, screws, and snaps.

[0035] In this embodiment, the electronic device further includes a rear cover located on the side of the support member away from the main board. The rear cover is provided with a third air inlet hole and a third air outlet hole penetrating through the opposite two surfaces of the rear cover. The third air inlet hole communicates with the outside of the electronic device and is respectively connected to the first air duct and the second air duct. The third air outlet hole communicates with the outside of the electronic device and is respectively connected to the first air duct and the second air duct. Specifically, the third air inlet hole is connected to the first air duct and the second air duct respectively by connecting the first air inlet hole and the second air inlet hole. The third air outlet hole is connected to the first air duct and the second air duct respectively by connecting the first air outlet hole and the air outlet of the air flow driving member. In this embodiment, a third air inlet hole and a third air outlet hole communicating with the external environment are provided on the rear cover, that is, the side of the rear cover away from the support member is the external environment of the electronic device. The cold air in the external environment enters the first air inlet hole from the third air inlet hole. Part of the cold air flows through the first air duct and enters the air flow driving member from the fifth gap. The other part of the cold air enters the second air duct from the second air inlet hole, flows through the second air duct and then enters the air flow driving member, and then leaves the electronic device through the first air outlet hole and the third air outlet hole in sequence. In order to reduce the water in the external environment from entering the electronic device through the third air inlet hole and the third air outlet hole, a water-proof and breathable film layer can be provided in the third air inlet hole and the third air outlet hole to block water vapor.

[0036] In a possible implementation manner, the orthographic projections of the first air inlet hole, the second air inlet hole, and the third air inlet hole on the rear cover at least partially overlap, so that the cold air outside the electronic device can enter the first air duct and the second air duct with higher efficiency. The orthographic projections of the first air outlet hole, the third air outlet hole, and the air outlet of the air flow driving member on the rear cover at least partially overlap, so that the hot air that has cooled the heat-generating components on the main board can be smoothly discharged from the electronic device. This setting can reduce wind resistance and accelerate the cooling efficiency of the heat-generating components on the main board. Among them, the sizes of the first air inlet hole, the second air inlet hole, and the third air inlet hole can be set according to the actual product situation.

[0037] In a possible implementation manner, the third guiding portion and the fourth guiding portion are connected to the middle frame. In this embodiment, the second air duct is formed by part of the rear middle frame, that is, the third guiding portion and the fourth guiding portion are fixedly connected to the middle part of the middle frame. The third guiding portion and the fourth guiding portion can be connected between the middle frame and the main board by connection methods such as adhesives, screws, and buckles. Among them, the third guiding portion and the fourth guiding portion can be adapted to the shape of the main board, and the third guiding portion and the fourth guiding portion are connected to the edge of the main board. In some embodiments, the third guiding portion and the fourth guiding portion can be formed by bosses protruding from the middle frame to the main board, that is, the third guiding portion and the fourth guiding portion are integrally formed with the middle frame. In some embodiments, the second air duct can also be formed by slotting the middle frame itself.

[0038] In some embodiments, the third guiding part and the fourth guiding part can be a separate first boss and second boss respectively. The first boss and the second boss can be connected between the main board and the middle frame by connection means such as adhesives, screws, and buckles to form the third guiding part and the fourth guiding part of the second air duct.

[0039] In a possible implementation, the air inlet of the air flow driving member is disposed adjacent to the main board and intersects the main board, so that the air inlet of the air flow driving member turns to the air outlet of the first air duct, increasing the air inlet area of the hot air in the first air duct entering the air flow driving member and improving the air intake volume. In some embodiments, there is a preset angle between the surface of the air flow driving member having the air inlet and the main board. In a specific embodiment, the preset angle is 45°.

[0040] In a possible implementation, the air flow driving member is electrically connected to the main board. Electrical energy is provided to the air flow driving member through the main board to make the air flow driving member work. In some embodiments, the air flow driving member is electrically connected to the driving circuit on the main board through an electrical connection line.

[0041] In a possible implementation, the electronic device further includes a first battery and a second battery. The first battery and the second battery are disposed at intervals along the second direction on the side of the middle frame facing the main board. The first battery is located on the side of the third guiding part away from the second air duct, and the second battery is located on the side of the fourth guiding part away from the second air duct. The height of the first battery and the second battery along the first direction is greater than the height of the third guiding part and the fourth guiding part. The main board is disposed between the first battery and the second battery along the second direction. In this embodiment, the main board is in a T shape. The middle frame is provided with a first receiving position for receiving the first battery and the second battery, and a second receiving position for receiving the air flow driving member. Among them, the first receiving position is located on both sides of the main board, and the second receiving position is located at one end of the main board adjacent to the first air outlet hole. Among them, the third guiding part and the fourth guiding part are the parts of the T-shaped main board having a bent section along the second direction.

[0042] In some embodiments, the shapes of the third guiding part and the fourth guiding part can be set according to the shape of the main board, and are not limited to long strips, arcs, bent line segments, etc. In this embodiment, the third guiding part and the fourth guiding part are used on the one hand to form the receiving positions for receiving the first battery and the second battery, and on the other hand to form the wind direction guiding parts of the second air duct, that is, the components in the electronic device that originally house the batteries are used as the guiding parts, saving space and making the structural arrangement in the electronic device more concise.

[0043] The first battery and the second battery can be connected in series or in parallel according to product requirements, or operate independently. In this embodiment, the arrangement of the two batteries can sandwich the main board between them. On the one hand, it can fix the main board and improve the structural strength. On the other hand, it is beneficial to form the second air duct and avoid the air from flowing through each area of the electronic device and increasing the wind resistance.

[0044] In some embodiments, third sidewalls and fourth sidewalls are provided at both ends of the third guiding portion and the fourth guiding portion along a fourth direction. The third sidewalls, the third guiding portion, the fourth sidewalls, and the fourth guiding portion are sequentially connected end to end, and together with the main board and a part of the middle frame, they enclose a second air duct. The third sidewalls, the third guiding portion, the fourth sidewalls, and the fourth guiding portion seal the periphery of the second air duct, enabling the air to flow only in the second air duct, preventing the air from leaking from the periphery of the second air duct, increasing the air volume in the second air duct, and improving the cooling efficiency. The third sidewalls and the fourth sidewalls may be formed by bosses protruding from the middle frame towards the main board, that is, the third sidewalls and the fourth sidewalls are integrally formed with the middle frame, or they may be separate components connected between the main board and the middle frame by connection means such as adhesives, screws, and snaps.

[0045] In some embodiments, the lengths of the third sidewalls and the fourth sidewalls along the fourth direction are set to be relatively large. The fourth direction is the length direction of the electronic device. After placing the main board on the surfaces of the third sidewalls, the fourth sidewalls, the third guiding portion, and the fourth guiding portion away from the middle frame, the main board is fixedly connected to the third sidewalls and the fourth sidewalls by screws, and no other components are used to fix between the main board and the third guiding portion and the fourth guiding portion. Such a setting can save the design space of the electronic device in the second direction (width direction).

[0046] In a possible implementation, the electronic device further includes a shielding member provided on the surface of the main board. The shielding member is used to shield electronic devices that generate radiation signals. In some embodiments, there may be two shielding members, respectively disposed on opposite surfaces of the main board. In some embodiments, the shielding member is provided with an opening to expose electronic devices that do not generate radiation signals, and the part of the electronic devices can be directly blown and cooled by cold air.

[0047] In some embodiments, a CPU is provided on the surface of the main board facing the middle frame. Since the CPU generates more heat during the operation of the electronic device, a heat-conducting material can be provided at the position of the shielding member corresponding to the CPU to accelerate the cooling of the CPU. The heat-conducting material includes TIM, such as gel or silica gel.

[0048] In a possible implementation, a heat-generating device is provided on the main board, and the shielding member is provided with an opening to expose the heat-generating device. The heat-generating device can be disposed on any surface of the main board, such that the heat-generating device is directly blown and cooled by the cold air in the first air duct or the second air duct. In some embodiments, a heat-conducting material is provided on the surface of the heat-generating device away from the main board to conduct the heat of the heat-generating device and accelerate the cooling efficiency. Description of the Drawings

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0050] Figure 1 is a three-dimensional exploded view of an electronic device provided by an embodiment of the present application;

[0051] Figure 2 is a structural diagram of an electronic device provided by an embodiment of the present application;

[0052] Figure 3 is a structural diagram of a structural member part of an electronic device provided by an embodiment of the present application;

[0053] Figure 4 is a structural diagram of a middle frame part of an electronic device provided by an embodiment of the present application;

[0054] Figure 5a is a structural diagram of the middle frame, main board and structural member part of an electronic device as viewed from the side of the structural member according to an embodiment of the present application;

[0055] Figure 5b is the present application Figure 5a in the E-E cross-sectional view;

[0056] Figure 5c is a structural diagram of the middle frame, main board and structural member part of an electronic device as viewed from the side of the structural member according to an embodiment of the present application;

[0057] Figure 5d is the present application Figure 5c in the F-F cross-sectional view;

[0058] Figure 5e is a structural diagram of the middle frame, main board and structural member part of an electronic device provided by an embodiment of the present application;

[0059] Figure 5f is a structural diagram of the first air duct and the rear cover part of an electronic device as viewed from the side of the rear cover according to an embodiment of the present application;

[0060] Figure 5g is a structural diagram of the first air duct and the rear cover part of an electronic device as viewed from the side of the rear cover according to an embodiment of the present application;

[0061] Figure 5h is a structural diagram of the middle frame, main board and structural member part of an electronic device as viewed from the side of the structural member according to an embodiment of the present application;

[0062] Figure 5i is the present application Figure 5h in the G-G cross-sectional view;

[0063] Figure 5jIt is a schematic structural diagram of the middle frame, main board and structural member part of an electronic device provided by an embodiment of the present application, viewed from the side of the structural member;

[0064] Figure 5k is the present application Figure 5j in the H-H cross-sectional view;

[0065] Figure 5l It is a schematic structural diagram of the middle frame, main board and structural member part of an electronic device provided by an embodiment of the present application, viewed from the side of the structural member;

[0066] Figure 5m is the present application Figure 5l in the I-I cross-sectional view;

[0067] Figure 5n It is a schematic structural diagram of the middle frame, main board and structural member part of an electronic device provided by an embodiment of the present application, viewed from the side of the structural member;

[0068] Figure 5o is the present application Figure 5n in the J-J cross-sectional view;

[0069] Figure 5p is the present application Figure 5n in the K-K cross-sectional view;

[0070] Figure 6 It is a schematic structural diagram of three main boards provided by an embodiment of the present application;

[0071] Figure 7 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0072] Figure 8 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0073] Figure 9 It is a schematic structural diagram of an electronic device during operation provided by an embodiment of the present application;

[0074] Figure 10 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0075] Figure 11a It is a schematic structural diagram of an electronic device during operation provided by an embodiment of the present application;

[0076] Figure 11b It is a schematic structural diagram of the support member part of an electronic device provided by an embodiment of the present application;

[0077] Figure 12It is a schematic structural diagram of a middle frame, a third guiding part and a main board part of an electronic device provided by an embodiment of the present application;

[0078] Figure 13 It is a schematic structural diagram of a middle frame, a fourth guiding part and a main board part of an electronic device provided by an embodiment of the present application;

[0079] Figure 14 It is a schematic structural diagram of an electronic device during operation provided by an embodiment of the present application;

[0080] Figure 15 It is a schematic structural diagram of a middle frame, a first battery and a second battery part of an electronic device provided by an embodiment of the present application;

[0081] Figure 16 is the present application Figure 15 The L-L sectional view;

[0082] Figure 17 It is a schematic structural diagram of a main board of an electronic device provided by an embodiment of the present application;

[0083] Figure 18 It is a schematic structural diagram of a main board of an electronic device provided by an embodiment of the present application;

[0084] Figure 19 It is a schematic structural diagram of a main board of an electronic device provided by an embodiment of the present application;

[0085] Figure 20 It is a schematic structural diagram of an electronic device provided by a comparative embodiment of the present application;

[0086] Figure 21 It is a simulation schematic diagram of an electronic device provided by an embodiment of the present application;

[0087] Figure 22 It is a simulation schematic diagram of the main board part in an electronic device provided by an embodiment of the present application. Specific embodiments

[0088] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0089] For ease of understanding, the following first explains and describes the English abbreviations and related technical terms involved in the embodiments of the present application.

[0090] CPU: central processing unit, central processing unit.

[0091] WIFI: mobile hotspot.

[0092] TIM: Thermal Interface Material, a thermal conductive interface material.

[0093] CFM: cubic feet per minute, a unit of gas flow rate, cubic feet per minute.

[0094] This application provides an electronic device, including an air flow driving member, a middle frame, a main board, and a structural member that are sequentially stacked along a first direction. A first guiding portion and a second guiding portion are provided between the structural member and the main board, and together with the two, they enclose a first air duct. A third guiding portion and a fourth guiding portion are provided between the middle frame and the main board, and together with the two, they enclose a second air duct; the air flow driving member is located on the air ducts of the first air duct and the second air duct or on the path where the first air duct and the second air duct communicate with the outside of the electronic device. The air flow driving member is used to drive air to blow from the air inlets of the first air duct and the second air duct to the air outlets of the first air duct and the second air duct respectively. By providing a first air duct and a second air duct on the two surfaces of the main board respectively to dissipate heat from the two surfaces of the main board, the heat dissipation efficiency can be improved. Moreover, the first guiding portion and the second guiding portion, as well as the third guiding portion and the fourth guiding portion, can guide the cold air to flow in the first air duct and the second air duct, reduce the air resistance of the cold air in the electronic device, and accelerate the cold air flow rate, thereby improving the heat dissipation efficiency.

[0095] Please refer to Figure 1 and Figure 2, an embodiment of the present application provides an electronic device 10, which can be an electronic device such as a mobile phone, a tablet computer, a notebook, a wearable product, or a smart home terminal. In this embodiment, taking the electronic device 10 as a mobile phone as an example, the electronic device 10 includes an air flow driving member 400 and a middle frame 100, a main board 200, and a structural member 300 that are sequentially stacked along a first direction A. Among them, the middle frame 100 is the main load-bearing member in the electronic device 10. The middle frame 100 can be a carrier for carrying the internal components of the electronic device 10. One side of the middle frame 100 is used to install the display screen 20, and the other side is used to install components such as a battery and the main board 200. The main board 200, also known as the mainboard, systemboard, or motherboard, is a component that integrates the circuits of the electronic device 10. For example, when the electronic device 10 is a mobile phone, the mobile phone main board 200 can be divided into three parts: 1. The baseband part, including a baseband chip and a power management chip, for encoding; 2. The radio frequency part, including a radio frequency processor and a radio frequency power amplifier module, for realizing signal transmission and reception functions; 3. Other parts, including a CPU, memory, various controllers (including touch screen, Bluetooth, WIFI, sensors, etc.), as well as interfaces for some microphones, receivers, speakers, cameras, and display screens. The above three parts of components are integrated on the mobile phone main board 200. There are general standards for the layout arrangement, size, shape, and power supply specifications used for the components on the main board 200. When the electronic device 10 is working, the components on the main board 200 will generate a lot of heat, which is the main heat source of the electronic device 10. If the temperature of the main board 200 rises too high, it will affect the performance of the components on the main board 200, and it is necessary to cool the main board 200 in time. Among them, the air flow driving member 400 is a fan, including a centrifugal fan or an axial flow fan, and the shape of the fan can be cylindrical, columnar, or other shapes.

[0096] The middle frame 100 and the structural member 300 are arranged on both sides of the main board 200 along the first direction A (as Figure 2 shown). In this embodiment, the first direction A is the thickness direction of the electronic device 10. Among them, the structural member 300 can be a rear cover 700 or a support member 800. The support member 800 is used to support the main board 200, and the main board 200 is fixed between the support member 800 and the middle frame 100. The support member 800 can also be used to support other electronic components in the electronic device 10.

[0097] A first guiding portion 510 and a second guiding portion 520 are arranged opposite to each other along a second direction B between the structural member 300 and the main board 200 (as Figure 2As shown in the figure, the first guiding part 510, the structural member 300, the second guiding part 520 and the main board 200 together enclose and form a first air duct 500. Among them, the second direction B intersects with the first direction A. In this embodiment, the second direction B is perpendicular to the first direction A. The second direction B is parallel to the plane where the display screen 20 or the rear cover 700 of the electronic device 10 is located. The second direction B can be the width direction or the length direction of the electronic device 10. In this embodiment, the second direction B is the width direction of the electronic device 10. Among them, when the structural member 300 is the rear cover 700, a part of the rear cover 700 can participate in forming the first air duct 500. When the structural member 300 is the support member 800, the entire support member 800 or a part of the support member 800 can participate in forming the first air duct 500.

[0098] The first guiding part 510 and the second guiding part 520 can be continuous blocks or blocks with pores. In this embodiment, the first guiding part 510 and the second guiding part 520 are continuous blocks. When the cold air outside the electronic device 10 enters the first air duct 500, the cold air will not leak to the area outside the first air duct 500, but only dissipate heat from the surface of the main board 200 in the first air duct 500, improving the heat dissipation efficiency of the main board 200.

[0099] In some embodiments, the first guiding part 510 and the second guiding part 520 are discontinuous blocks. Please refer to Figure 3 , Figure 3FIG. 0 is a schematic structural view of the structural member 300 as viewed from the side of the display screen 20. The first guiding portion 510 has a plurality of first guiding sub-portions 511, and the second guiding portion 520 has a plurality of second guiding sub-portions 521. There is a first gap 512 between two adjacent first guiding sub-portions 511, and there is a second gap 522 between two adjacent second guiding sub-portions 521. Among them, the lengths of the plurality of first guiding sub-portions 511 may be the same or different, and the widths of the first gaps 512 between two adjacent first guiding sub-portions 511 may be the same or different. The lengths of the plurality of second guiding sub-portions 521 may be the same or different, and the widths of the second gaps 522 between two adjacent second guiding sub-portions 521 may be the same or different. In the present embodiment, the first guiding portion 510 and the second guiding portion 520 can also guide most of the cold air to flow through the first air duct 500, so as to improve the heat dissipation efficiency of the surface of the main board 200 located in the first air duct 500. In the present embodiment, the first guiding portion 510 and the second guiding portion 520 are discontinuous blocks, which is beneficial to electrically connecting the main board 200 and other electronic components in the electronic device 10 through connecting wires. For example, one end of the connecting wire passes through the first gap 512 or the second gap 522 and is electrically connected to the surface of the main board 200 facing the structural member 300, and the other end of the connecting wire is connected to an electronic component other than the main board 200. The setting of the first gap 512 or the second gap 522 is beneficial to electrically connecting the surface of the main board 200 facing the structural member 300 and the surrounding electronic components.

[0100] Please refer to again Figure 2 , a third guiding portion 610 and a fourth guiding portion 620 are provided between the middle frame 100 and the main board 200 and are oppositely arranged along the third direction C. The third guiding portion 610, the middle frame 100, the fourth guiding portion 620 and the main board 200 together enclose and form a second air duct 600. The first direction A intersects with the second direction B and the third direction C respectively. In the present embodiment, the third direction C is perpendicular to the first direction A and is the same as the second direction B, and the first air duct 500 and the second air duct 600 are arranged in parallel. In some embodiments, the third direction C and the second direction B may be different and intersect with each other.

[0101] Among them, the third guiding portion 610 and the fourth guiding portion 620 may be continuous blocks or blocks with pores. In the present embodiment, the third guiding portion 610 and the fourth guiding portion 620 are continuous blocks. When the cold air outside the electronic device 10 enters the second air duct 600, the cold air will not leak to the area outside the second air duct 600, but only dissipate heat from the surface of the main board 200 in the second air duct 600. The first air duct 500 and the second air duct 600 dissipate heat from two surfaces of the main board 200 respectively, thereby improving the heat dissipation efficiency of the main board 200.

[0102] In some embodiments, the third guiding portion 610 and the fourth guiding portion 620 are discontinuous blocks. Please refer to Figure 4 , Figure 4 FIG. Figure 4 is a schematic structural view of the middle frame 100 seen from the side of the rear cover 700. The third guiding portion 610 has a plurality of third guiding sub-portions 611, and the fourth guiding portion 620 has a plurality of fourth guiding sub-portions 621. There is a third gap 612 between two adjacent third guiding sub-portions 611, and there is a fourth gap 622 between two adjacent fourth guiding sub-portions 621. Among them, the lengths of the plurality of third guiding sub-portions 611 may be the same or different, and the widths of the third gaps 612 between two adjacent third guiding sub-portions 611 may be the same or different. The lengths of the plurality of fourth guiding sub-portions 621 may be the same or different, and the widths of the fourth gaps 622 between two adjacent fourth guiding sub-portions 621 may be the same or different. In this embodiment, the third guiding portion 610 and the fourth guiding portion 620 can also guide the cold air to flow through the second air duct 600 to improve the heat dissipation efficiency of the surface of the main board 200 located in the second air duct 600. In this embodiment, the third guiding portion 610 and the fourth guiding portion 620 are discontinuous blocks, which is beneficial to the electrical connection of the main board 200 and other electronic components in the electronic device 10 through connection lines. For example, one end of the connection line passes through the third gap 612 or the fourth gap 622 and is electrically connected to the surface of the main board 200 facing the middle frame 100, and the other end of the connection line is connected to an electronic component other than the main board 200. The setting of the third gap 612 or the fourth gap 622 is beneficial to the electrical connection between the surface of the main board 200 facing the middle frame 100 and the surrounding electronic components.

[0103] The air flow driving member 400 is located on the first air duct 500 and the second air duct 600 or on the path where the first air duct 500 and the second air duct 600 communicate with the outside of the electronic device 10. Both the first air duct 500 and the second air duct 600 have air inlets and air outlets that are oppositely arranged and communicate with the outside of the electronic device 10. The air flow driving member 400 is used to drive the air to blow from the air inlets of the first air duct 500 and the second air duct 600 to the air outlets of the first air duct 500 and the second air duct 600 respectively.

[0104] Among them, the first air duct 500 and the second air duct 600 include the inside of the first air duct 500 and the second air duct 600 and the air outlets or air inlets of the first air duct 500 and the second air duct 600, that is, the air flow driving member 400 can be located inside the first air duct 500 and the second air duct 600 (as shown in Figure 5d and Figure 5e ), or at the air outlets of the first air duct 500 and the second air duct 600 (as shown in Figure 5a and Figure 5b ), or at the air inlets (as shown in Figure 5h and Figure 5ias shown). In this application, the air inlet refers to the position where air enters the component, and the air outlet refers to the position where air leaves the component. For example, please refer to Figure 5a and Figure 5b , Figure 5a FIG. Figure 5a is a schematic view of a part of the middle frame 100, the main board 200, and the structural member 300 as viewed from the side of the structural member 300. Figure 5b is Figure 5a the cross-sectional view taken along line E-E in Figure 5a . The air inlet and air outlet of the air flow driving member 400 are denoted as the first air inlet R1 and the first air outlet C1. When the air flow driving member 400 is working, it drives air to enter from the first air inlet R1 and leave from the first air outlet C1, where the first air inlet R1 and the first air outlet C1 are located on opposite sides of the air flow driving member 400. For another example, the air inlet and air outlet of the first air duct 500 are denoted as the second air inlet R2 and the second air outlet C2, and the second air inlet R2 and the second air outlet C2 are respectively located at both ends of the first air duct 500. When the air flow driving member 400 is working, it drives air to enter from the second air inlet R2 of the first air duct 500, and then after passing through the inside of the first air duct 500, it leaves from the second air outlet C2. For another example, the air inlet and air outlet of the second air duct 600 are denoted as the third air inlet R3 and the third air outlet C3, and the third air inlet R3 and the third air outlet C3 are respectively located at both ends of the second air duct 600. When the air flow driving member 400 is working, it drives air to enter from the third air inlet R3 of the second air duct 600, and then after passing through the inside of the second air duct 600, it leaves from the third air outlet C3.

[0105] The number of the air flow driving members 400 can be set to 1, 2, 3, or more than 3 according to actual needs. Please refer to Figure 5c and Figure 5d , where Figure 5c FIG. Figure 5c is a schematic view of a part of the middle frame 100, the main board 200, and the structural member 300 as viewed from the side of the structural member 300. Figure 5d is Figure 5cIn the F-F sectional view, in some embodiments, there are two air flow driving members 400. The two air flow driving members 400 are respectively located inside the first air duct 500 and the second air duct 600. For the air flow driving member 400 located in the first air duct 500, the first air inlet R1 of the air flow driving member 400 and the second air inlet R2 of the first air duct 500 are on the same side, and the first air outlet C1 of the air flow driving member 400 and the second air outlet C2 of the first air duct 500 are on the same side. When the air flow driving member 400 works, the air flow F1 enters the second air inlet R2 of the first air duct 500, then enters the first air inlet R1 of the air flow driving member 400, and then leaves the air flow driving member 400 from the first air outlet C1 of the air flow driving member 400, and then leaves the first air duct 500 through the second air outlet C2. For the air flow driving member 400 located in the second air duct 500, the first air inlet R1 of the air flow driving member 400 and the third air inlet R3 of the second air duct 600 are on the same side, and the first air outlet C1 of the air flow driving member 400 and the third air outlet C3 of the second air duct 600 are on the same side. When the air flow driving member 400 works, the air flow F2 enters the third air inlet R3 of the second air duct 600, then enters the first air inlet R1 of the air flow driving member 400, and then leaves the air flow driving member 400 from the first air outlet C1 of the air flow driving member 400, and then leaves the second air duct 600 through the third air outlet C3. In this embodiment, the second air inlet R2 and the third air inlet R3 are arranged on the same side, and the second air outlet C2 and the third air outlet C3 are arranged on the same side. Please refer to Figure 5e , in some embodiments, the second air inlet R2 and the third air outlet C3 are arranged on the same side, and the second air outlet C2 and the third air inlet R3 are arranged on the same side. That is to say, the blowing directions of the air flow driving members 400 in the first air duct 500 and the second air duct 600 are opposite, and the flowing directions of the air flow in the first air duct 500 and the second air duct 600 are opposite. In some embodiments, 2 or more air flow driving members 400 can be respectively arranged in the first air duct 500 and the second air duct 600 to increase the air volume or accelerate the flow rate, thereby improving the cooling efficiency.

[0106] Among them, the air flow driving member 400 is located on the path where the first air duct 500 and the second air duct 600 communicate with the outside of the electronic device 10, including that the air flow driving member 400 is located on the path where the air inlets of the first air duct 500 and the second air duct 600 communicate with the outside of the electronic device 10, or the air flow driving member 400 is located on the path where the air outlets of the first air duct 500 and the second air duct 600 communicate with the outside of the electronic device 10. Please refer to Figure 5f , Figure 5fFIG. 0 is a schematic view of a part of the first air duct 500 and the rear cover 700 of the electronic device 10 as viewed from the side of the rear cover 700. In one embodiment, the air flow driving member 400 is located on the path where the second air inlet R2 of the first air duct 500 communicates with the outside of the electronic device 10. For example, when the electronic device 10 includes a rear cover 700, the air inlet R4 of the electronic device 10 is provided on one side wall of the rear cover 700. In this embodiment, an air inlet hole can be formed in the second guiding portion 520 to enable the second air inlet R2 of the first air duct 500 to communicate with the outside. The air flow driving member 400 is located between the second air inlet R2 of the first air duct 500 and the air inlet R4 of the rear cover 700. When the air flow driving member 400 operates, it drives the air to enter the electronic device 10 from the air inlet R4 of the rear cover 700, and then the air enters the second air inlet R2 of the first air duct 500. Please refer to Figure 5g , Figure 5g FIG. 1 is a schematic view of a part of the first air duct 500 and the rear cover 700 of the electronic device 10 as viewed from the side of the rear cover 700. In one embodiment, the air flow driving member 400 is located on the path where the second air outlet C2 of the first air duct 500 communicates with the outside of the electronic device 10. For example, the air outlet C4 of the electronic device 10 is provided on another side wall of the rear cover 700. In this embodiment, an air outlet hole can be formed in the first guiding portion 510 to enable the second air outlet C2 of the first air duct 500 to communicate with the outside. The air flow driving member 400 is located between the second air outlet C2 of the first air duct 500 and the air outlet C4 of the rear cover 700. When the air flow driving member 400 operates, it will create a negative pressure in the internal space of the electronic device 10, and then it can drive the air flowing into the first air duct 500 to flow through the first air duct 500 and then leave from the second air outlet C2, and enter the first air inlet R1 of the air flow driving member 400, and then leave from the first air outlet C1 of the air flow driving member 400, and then leave the electronic device 10 from the air outlet C4 of the rear cover 700. The specific implementation manners in which the air flow driving member 400 is located on the path where the air inlet or air outlet of the second air duct 600 communicates with the outside of the electronic device 10 are similar to the above, and will not be described in detail here. Similarly, in the above embodiment, two or more air flow driving members 400 can be provided to increase the air volume or the flow rate, and thus improve the cooling efficiency. It should be noted that Figure 5f and Figure 5g are only used to illustrate that the air flow driving member 400 can be arranged on the path where the air inlet or air outlet of the first air duct 500 communicates with the outside of the electronic device 10, and the structure in the actual product is not limited to this.

[0107] In the present application, a first air duct 500 and a second air duct 600 are respectively provided on two surfaces of the main board 200 to dissipate heat from the two surfaces of the main board 200, which can improve the heat dissipation efficiency. Moreover, a first guiding portion 510 and a second guiding portion 520 are provided on two sides of the first air duct 500, and a third guiding portion 610 and a fourth guiding portion 620 are provided on two sides of the second air duct 600. On the one hand, it can prevent cold air from flowing into other spaces outside the first air duct 500 and the second air duct 600, resulting in a reduction in the air volume in the first air duct 500 and the second air duct 500 and a decrease in the heat dissipation efficiency. On the other hand, it can also reduce the air resistance of the cold air in the electronic device 10. The first guiding portion 510 and the second guiding portion 520 guide a part of the cold air so that this part of the cold air flows in the first air duct 500, and the third guiding portion 610 and the fourth guiding portion 620 guide another part of the cold air so that this part of the cold air flows in the second air duct 600. With the same air volume entering the electronic device 10, it can prevent a part of the cold air from flowing in other spaces outside the first air duct 500 and the second air duct 600, so as to reduce the air resistance of the overall air volume entering the electronic device 10, accelerate the flow rate of the cold air in the electronic device 10, and further improve the heat dissipation efficiency of the heat-generating components on the main board 200.

[0108] In a possible implementation manner, the air outlets of the first air duct 500 and the second air duct 600 are arranged on the same side and communicate with each other. The air flow driving member 400 is located on one side of the air outlets of the first air duct 500 and the second air duct 600, and the air inlet of the air flow driving member 400 communicates with the air outlets of the first air duct 500 and the second air duct 600, and the air outlet of the air flow driving member 400 communicates with the outside of the electronic device 10. Please refer to again Figure 5a and Figure 5b , in this embodiment, the second air inlet R2 of the first air duct 500 and the third air inlet R3 of the second air duct 600 are arranged on the same side, the second air outlet C2 of the first air duct 500 and the third air outlet C3 of the second air duct 600 are arranged on the same side, the first air inlet R1 of the air flow driving member 400 is the opening of the air flow driving member 400 facing the second air duct 600, and the first air outlet C1 of the air flow driving member 400 is the opening of the air flow driving member 400 facing the structural member 300, such as Figure 5bAs shown, the first air inlet R1 of the air flow driving member 400 is at the bottom, and the first air outlet C1 is at the top. When the air flow driving member 400 works, a negative pressure is formed at the first air inlet R1 of the air flow driving member 400, causing the air in the first air duct 500 and the second air duct 600 to flow towards the air flow driving member 400, resulting in a negative pressure in the first air duct 500 and the second air duct 600. Furthermore, it drives the external cold air F of the electronic device 10 communicated with the first air duct 500 and the second air duct 600 to enter the first air duct 500 and the second air duct 600, thereby dissipating heat from both surfaces of the main board 200. The heated air is sucked into the air flow driving member 400 and leaves the electronic device 10 from the first air outlet C1 of the air flow driving member 400.

[0109] Please refer to Figure 5h and Figure 5i where Figure 5h is a schematic view of part of the middle frame 100, the main board 200, and the structural member 300 as seen from the side of the structural member 300. Figure 5i is Figure 5h the G-G cross-sectional view in

[0110] In some embodiments, the electronic device 10 includes two air flow driving members 400. Please refer to Figure 5j and Figure 5k where Figure 5j is a schematic view of part of the middle frame 100, the main board 200, and the structural member 300 as seen from the side of the structural member 300. Figure 5k is Figure 5jThe H-H cross-sectional view in this embodiment includes an air flow driving member 400a and an air flow driving member 400b. Among them, the air flow driving member 400a is located on one side of the air outlets of the first air duct 500 and the second air duct 600, and the air inlet of the air flow driving member 400a is communicated with the air outlets of the first air duct 500 and the second air duct 600, and the air outlet of the air flow driving member 400a is communicated with the outside of the electronic device 10; the air flow driving member 400b is located on one side of the air inlets of the first air duct 500 and the second air duct 600, and the air inlet of the air flow driving member 400b is communicated with the outside of the electronic device 10, and the air outlet of the air flow driving member 400b is communicated with the air inlets of the first air duct 500 and the second air duct 500. The two air flow driving members 400 are respectively arranged at the air inlets and air outlets of the first air duct 500 and the second air duct 600 to accelerate the air flow speed, improve the heat exchange rate between the main board 200 and the cold air, and thus enhance the heat dissipation efficiency of the main board 200.

[0111] In a possible implementation manner, the orthographic projections of the first air duct 500 and the second air duct 600 on the main board 200 at least partially overlap. In some embodiments, the orthographic projections of the first air duct 500 and the second air duct 600 on the main board 200 completely overlap, so that the cold air F in the first air duct 500 and the second air duct 600 dissipates heat from the main board 200 with the highest efficiency. In some embodiments, the orthographic projections of the first air duct 500 and the second air duct 600 on the main board 200 may intersect.

[0112] Please refer to Figure 5l and Figure 5m where Figure 5l is a schematic view of a part of the middle frame 100, the main board 200, and the structural member 300 as viewed from the side of the structural member 300. Figure 5m is Figure 5l the I-I cross-sectional view in this embodiment. In a possible implementation manner, the lengths of the first guiding portion 510 and the second guiding portion 520 along the fourth direction D are the same as the length of the main board 200, and the lengths of the third guiding portion 610 and the fourth guiding portion 620 along the fourth direction D are the same as the length of the main board 200. So that the lengths of the first air duct 500 and the second air duct 600 along the fourth direction D are the same as the length of the main board 200 along the fourth direction D, and thus the main board 200 can be cooled with the highest efficiency. Among them, the fourth direction D is perpendicular to the first direction A, and is coplanar and perpendicular to the second direction B. In this embodiment, the fourth direction D is the length direction of the electronic device 10, the first direction A is the thickness direction of the electronic device 10, and the second direction B is the width direction of the electronic device 10.

[0113] In some embodiments, the lengths of the first guiding portion 510, the second guiding portion 520, the third guiding portion 610, and the fourth guiding portion 620 along the fourth direction D can be set according to the positions of the main heat generating components 230 on the main board 200. For example, please refer toFigure 5n , Figure 5o and Figure 5p , where Figure 5n is a schematic view of the middle frame 100, the main board 200, and a part of the structural member 300 as viewed from the side of the structural member 300, Figure 5o is Figure 5n the sectional view taken along line J-J in Figure 5p is Figure 5n the sectional view taken along line K-K in. When the position of the main heat-generating device 230 on the main board 200 is located in a part of the main board 200 close to the air flow driving member 400, the lengths of the first guiding portion 510, the second guiding portion 520, the third guiding portion 610, and the fourth guiding portion 620 along the fourth direction D can be set shorter than that of the main board 200, so that the first air duct 500 and the second air duct 600 only dissipate heat from the part with the heat-generating device 230. By setting the air ducts in this targeted manner, the main board 200 can be cooled, and the space occupied by the air ducts can be saved.

[0114] Please refer to again Figure 1 and Figure 5b . In a possible implementation, the structural member 300 is provided with a first air inlet hole 310 and a first air outlet hole 320 that penetrate through the opposite two surfaces of the structural member 300 in the area of the first air duct 500. The first air inlet hole 310 and the first air outlet hole 320 are respectively located at opposite ends of the first air duct 500. The first air inlet hole 310 and the first air outlet hole 320 are respectively communicated with the outside of the electronic device 10. The first air outlet hole 320 is communicated with the air outlet (the first air outlet C1) of the air flow driving member 400; so that the air F enters from the first air inlet hole 310, flows through the first air duct 500 and the air flow driving member 400, and flows out from the first air outlet hole 320. Specifically, after the cold air F enters from the first air inlet hole 310, a part of the cold air F1 becomes hot air after being heated when flowing through the first air duct 500. The hot air enters the air inlet of the air flow driving member 400 from the air outlet of the first air duct 500 and leaves the electronic device 10 from the air outlet of the air flow driving member 400. The shapes of the first air inlet hole 310 and the first air outlet hole 320 can be any one of a circular shape, a square shape, an oval shape, or an irregular shape.

[0115] In a possible implementation, the main board 200 is provided with second air inlet holes 210 penetrating through opposite two surfaces of the main board 200. The second air inlet holes 210 are communicated with the first air inlet holes 310, so that air enters the second air inlet holes 210 from the first air inlet holes 310, flows through the second air duct 600 and the air flow driving member 400 and flows out from the first air outlet holes 320. Specifically, after the cold air F enters from the first air inlet holes 310, another part of the cold air F2 enters the second air duct 600 from the second air inlet holes 210, and becomes hot air after being heated when flowing through the second air duct 600. The hot air enters the air inlet of the air flow driving member 400 from the air outlet of the second air duct 600 and leaves the electronic device 10 from the air outlet of the air flow driving member 400. In this embodiment, the cold air F outside the electronic device 10 is shunted after entering from the first air inlet holes 310. One part of the cold air F1 enters the first air duct 500, and another part of the cold air F2 enters the second air duct 600 through the second air inlet 210, so that the cold air F is cooled by the two air ducts on the upper and lower surfaces of the main board 200. In this embodiment, the air inlet side of the cold air F can be arranged on the side of the structural member 300 away from the main board 200. For example, when the structural member 300 is the rear cover 700, the first air inlet holes 310 of the structural member 300 communicate the inside and the outside of the electronic device 10, and the cold air F enters the electronic device 10 from the first air inlet holes 310.

[0116] In some embodiments, the cold air F can first enter the second air duct 600 and then enter the first air duct 500 from the air inlet holes on the main board 200. That is to say, in this embodiment, the air inlet side of the cold air F can be arranged on the side of the display screen 20 or on the frame of the middle frame 100, or arranged on the rear cover 700 and enter the second air duct 600 through other air ducts in the rear cover 700.

[0117] In a possible implementation, the air flow driving member 400 is located on the side of the main board 200 away from the second air inlet hole 210. That is, the air flow driving member 400 and the main board 200 are not stacked in the thickness direction, but are arranged parallel in the width or length direction, which can reduce the stacked thickness of the electronic device 10. In some embodiments, the thickness of the air flow driving member 400 in the first direction A is the same as the thickness of the main board 200 in the first direction A. The surfaces of the air flow driving member 400 along both sides in the first direction A are respectively parallel and aligned with the surfaces of the main board 200 along both sides in the first direction A, so that the thickness of the two components, namely the air flow driving member 400 and the main board 200, in the first direction A is only the thickness of one main board 200 or one air flow driving member 400, so as to reduce the stacked thickness of the electronic device 10. In addition, in this embodiment, the air flow driving member 400 is located on the side of the main board 200 away from the second air inlet hole 210, so that the cold air entering the first air inlet hole 310 can blow and cool the main board 200 between the first air inlet hole 310 and the air flow driving member 400. When the lengths of the first air duct 500 and the second air duct 600 in the fourth direction D are the same as that of the main board 200, the cold air can blow and cool the entire main board 200, improving the cooling and heat dissipation efficiency.

[0118] In a possible implementation, the orthographic projection of the second air inlet hole 210 on the main board 200 at least partially overlaps with the orthographic projection of the first air inlet hole 310, so as to connect the first air inlet hole 310 and the second air inlet hole 210. In this embodiment, the orthographic projection of the second air inlet hole 210 on the main board 200 completely overlaps with the orthographic projection of the first air inlet hole 310, increasing the air volume of the cold air F entering the second air duct 600 and reducing the wind resistance. In an embodiment, please refer to Figure 5i , when the air flow driving member 400 is located on one side of the inlets of the first air duct 500 and the second air duct 600, a second air outlet hole 240 penetrating the main board 200 is further provided at one end of the main board 200 away from the second air inlet hole 210. The orthographic projection of the first air outlet hole 320 on the main board 200 at least partially overlaps with the orthographic projection of the second air outlet hole 240, so as to connect the first air outlet hole 320 and the second air outlet hole 240, increasing the speed of the air leaving the electronic device 10.

[0119] In the embodiments of the present application, the shapes of the first air duct 500 and the second air duct 600 are not limited and can be set according to the shape of the main board 200. Among them, as Figure 6 shown, the main board 200 can be square, T-shaped or L-shaped, etc., and the shapes of the first air duct 500 and the second air duct 600 can also be square, T-shaped or L-shaped.

[0120] Please refer to again Figure 1 、 Figure 5a and Figure 5bIn a possible implementation, the first air outlet 320 and the orthographic projection of the airflow driving member 400 on the structural member 300 at least partially overlap. In this embodiment, the first air outlet 320 and the orthographic projection of the airflow driving member 400 on the structural member 300 overlap, and the length of the airflow driving member 400 in the second direction B is the same as the length of the main board 200 in the second direction B. In this embodiment, the first guide portion 510 and the second guide portion 520 are disposed between the airflow driving member 400 and the structural member 300 (e.g., Figure 5m shown).

[0121] In a possible implementation, a fifth gap 220 is provided between the airflow driving member 400 and the main board 200, and the first air duct 500 is connected to the air inlet of the airflow driving member 400 through the fifth gap 220 (eg, Figure 1 and Figure 5b As shown). When the airflow driving member 400 is working, the cold air F1 of the first air duct 500 will be sucked into the airflow driving member 400 through the fifth gap 220. Since the air inlet (first air inlet R1) of the airflow driving member 400 is connected to the first air duct 500, when the airflow driving member 400 is working, part of the cold air F1 flows through the first air duct 500 and enters the airflow driving member 400 from the fifth gap 220, and another part of the cold air F2 flows through the second air duct 600 and enters the airflow driving member 400 from the air outlet (third air outlet C3) of the second air duct 600. The length of the fifth gap 220 along the fourth direction D can be set according to the actual product situation, for example, set to 5mm or 8mm.

[0122] See also Figure 7 In a possible implementation, the structural member 300 is a back cover 700, and the first guide portion 510 and the second guide portion 520 are connected to the back cover 700. The first guide portion 510 and the second guide portion 520 are arranged between the back cover 700 and the main board 200. In this embodiment, when the structural member 300 is a back cover 700, the first air duct 500 is formed by a part of the back cover 700, that is, the first guide portion 510 and the second guide portion 520 are connected and fixed to the middle part of the back cover 700 (such as Figure 7 As shown in FIG. 1 , the first guide portion 510 and the second guide portion 520 may be connected between the back cover 700 and the main board 200 by means of adhesive, screws, buckles, etc. In some embodiments, the first guide portion 510 and the second guide portion 520 may be formed by bosses protruding from the back cover 700 toward the main board 200, that is, the first guide portion 510 and the second guide portion 520 are integrally formed with the back cover 700. In some embodiments, see Figure 8 Alternatively, the rear cover 700 itself may be grooved to form the first air duct 500, wherein the groove walls on both sides are the first guide portion 510 and the second guide portion 520 respectively.

[0123] Please refer to Figure 9 , Figure 9 , which is a schematic structural diagram of one of the electronic devices 10. In this embodiment, the first air inlet hole 310 and the first air outlet hole 320 are provided on the rear cover 700. The side of the rear cover 700 away from the main board 200 is the external environment of the electronic device 10. The cold air F in the external environment enters the electronic device 10 from the first air inlet hole 310. Part of the cold air F1 flows through the first air duct 500 and enters the air flow driving member 400 from the fifth gap 220. Another part of the cold air F2 enters the second air duct 600 from the second air inlet hole 210, flows through the second air duct 600 and then enters the air flow driving member 400, and then leaves the electronic device 10 from the first air outlet hole 320. In order to reduce the water in the external environment from entering the electronic device 10 from the first air inlet hole 310 and the first air outlet hole 320, a water-repellent and breathable film layer can be provided in the first air inlet hole 310 and the first air outlet hole 320 to block water vapor. In some embodiments, the first air inlet hole 310 and the first air outlet hole 320 can be provided on the side wall of the rear cover 700 protruding towards the display screen 20, so as to prevent the user's hand from blocking the first air inlet hole 310 and the first air outlet hole 320 when holding the rear cover 700.

[0124] Please refer to Figure 10 , in a possible implementation manner, the structural member 300 is a support member 800. The first guiding portion 510 and the second guiding portion 520 are oppositely arranged at the edge of the support member 800 and are connected to the support member 800. The support member 800 can be used to support the main board 200 or other electronic components in the electronic device 10. Among them, the shapes of the support member 800 and the main board 200 can be the same or different. When the shapes of the support member 800 and the main board 200 are the same, the first guiding portion 510 and the second guiding portion 520 are oppositely arranged at the edge of the main board 200 and are connected to the main board 200. At this time, the entire support member 800, the main board 200, the first guiding portion 510 and the second guiding portion 520 together enclose and form the first air duct 500. In some embodiments, the first guiding portion 510 and the second guiding portion 520 can be formed by bosses protruding from the support member 800 towards the main board 200, that is, the first guiding portion 510 and the second guiding portion 520 are integrally formed with the support member 800. In some embodiments, it can also be that the support member 800 itself is grooved to form the first air duct 500, and the two side groove walls are respectively the first guiding portion 510 and the second guiding portion 520.

[0125] Please refer to Figure 11a and Figure 11b , where Figure 11a is a schematic structural diagram of one of the electronic devices 10, Figure 11bSchematic structural diagram of the support member 800. In a possible implementation, the support member 800 is provided with a first side wall 810 and a second side wall 820 at both ends along the fourth direction D. The first side wall 810 is connected to one end of the first guiding portion 510 and the second guiding portion 520, and the second side wall 820 is connected to the other end of the first guiding portion 510 and the second guiding portion 520. The first side wall 810 is disposed adjacent to the air inlet of the first air duct 500, and the second side wall 820 is disposed adjacent to the air outlet of the first air duct 500. Among them, the fourth direction D is perpendicular to the first direction A, and is coplanar and perpendicular to the second direction B. In this embodiment, the fourth direction D is the length direction of the electronic device 10, the first direction A is the thickness direction of the electronic device 10, and the second direction B is the width direction of the electronic device 10. The first side wall 810, the first guiding portion 510, the second side wall 820, and the second guiding portion 520 are connected end to end in sequence, and enclose the first air duct 500 together with the support member 800 and the main board 200 on both sides along the first direction A. Among them, the first side wall 810 and the second side wall 820 may be formed by bosses protruding from the support member 800 to the main board 200, that is, the first side wall 810 and the second side wall 820 are integrally formed with the support member 800, or may be separate components connected between the main board 200 and the support member 800 through connection methods such as adhesives, screws, and buckles.

[0126] In this embodiment, the electronic device 10 further includes a rear cover 700 (such as Figure 11aAs shown, the rear cover 700 is located on the side of the support member 800 away from the main board 200. The rear cover 700 is provided with a third air inlet hole 710 and a third air outlet hole 720 that penetrate through the opposite two surfaces of the rear cover 700. The third air inlet hole 710 communicates with the outside of the electronic device 10 and is respectively connected to the first air duct 500 and the second air duct 600. The third air outlet hole 720 communicates with the outside of the electronic device 10 and is respectively connected to the first air duct 500 and the second air duct 600. Specifically, the third air inlet hole 710 is respectively connected to the first air duct 500 and the second air duct 600 by connecting the first air inlet hole 310 and the second air inlet hole 210. The third air outlet hole 720 is respectively connected to the first air duct 500 and the second air duct 600 by connecting the first air outlet hole 320 and the air outlet of the air flow driving member 400. In this embodiment, the third air inlet hole 710 and the third air outlet hole 720 that communicate with the external environment are provided on the rear cover 700, that is, the side of the rear cover 700 away from the support member 800 is the external environment of the electronic device 10. The cold air F from the external environment enters the first air inlet hole 310 from the third air inlet hole 710. Part of the cold air F1 flows through the first air duct 500 and enters the air flow driving member 400 from the fifth gap 220. Another part of the cold air F2 enters the second air duct 600 from the second air inlet hole 210, flows through the second air duct 600 and then enters the air flow driving member 400, and then leaves the electronic device 10 through the first air outlet hole 320 and the third air outlet hole 720 in sequence. In order to reduce the water in the external environment from entering the electronic device 10 through the third air inlet hole 710 and the third air outlet hole 720, a water-proof and breathable membrane layer can be provided in the third air inlet hole 710 and the third air outlet hole 720 to block water vapor.

[0127] In a possible implementation manner, the orthographic projections of the first air inlet hole 310, the second air inlet hole 210, and the third air inlet hole 710 on the rear cover 700 at least partially overlap. So that the cold air outside the electronic device 10 can enter the first air duct 500 and the second air duct 600 with higher efficiency. The orthographic projections of the first air outlet hole 320, the third air outlet hole 720, and the air outlet of the air flow driving member 400 on the rear cover 700 at least partially overlap. So that the hot air that has cooled the heat-generating device 230 on the main board 200 can be smoothly discharged from the electronic device 10. This setting can reduce wind resistance and accelerate the cooling efficiency of the heat-generating device 230 on the main board 200. Among them, the sizes of the first air inlet hole 310, the second air inlet hole 210, and the third air inlet hole 710 can be set according to the actual product situation.

[0128] Please refer to again Figure 2 , in a possible implementation manner, the third guiding portion 610 and the fourth guiding portion 620 are connected to the middle frame 100. In this embodiment, the second air duct 600 is formed by part of the rear middle frame 100 participating, that is, the third guiding portion 610 and the fourth guiding portion 620 are fixedly connected to the middle part of the middle frame 100 (such as Figure 2As shown in the figure, the third guiding part 610 and the fourth guiding part 620 can be connected between the middle frame 100 and the main board 200 by connection means such as adhesives, screws, and buckles. Among them, the third guiding part 610 and the fourth guiding part 620 can be adapted to the shape of the main board 200, and the third guiding part 610 and the fourth guiding part 620 are connected to the edge of the main board 200. In some embodiments, the third guiding part 610 and the fourth guiding part 620 can be composed of bosses protruding from the middle frame 100 to the main board 200, that is, the third guiding part 610 and the fourth guiding part 620 are integrally formed with the middle frame 100. In some embodiments, the second air duct 600 can also be formed by grooving the middle frame 100 itself.

[0129] In some embodiments, please refer to Figure 12 and Figure 13 , Figure 12 is a schematic structural diagram of a part of the middle frame 100, the third guiding part 610 and the main board 200 in the electronic device 10, Figure 13 is a schematic structural diagram of a part of the middle frame 100, the fourth guiding part 620 and the main board 200 in the electronic device 10, where the third guiding part 610 and the fourth guiding part 620 can be respectively separate first bosses 613 and second bosses 614, and the first boss 613 and the second boss 614 can be connected between the main board 200 and the middle frame 100 by connection means such as adhesives, screws, and buckles to form the third guiding part 610 and the fourth guiding part 620 of the second air duct 600.

[0130] Please refer to Figure 14 , Figure 14 is a schematic structural diagram of the electronic device 10. In a possible implementation manner, the air inlet of the air flow driving member 400 is arranged adjacent to the main board 200 and intersects with the main board 200. So that the air inlet of the air flow driving member 400 turns to the air outlet of the first air duct 500, increasing the air intake area of the hot air in the first air duct 500 entering the air flow driving member 400 and improving the air intake volume. In some embodiments, there is a preset angle α between the surface of the air flow driving member 400 having the air inlet and the main board 200. In a specific embodiment, the preset angle α is 45°.

[0131] In a possible implementation manner, the air flow driving member 400 is electrically connected to the main board 200. The main board 200 provides electrical energy for the air flow driving member 400 to make the air flow driving member 400 work. In some embodiments, the air flow driving member 400 is electrically connected to the driving circuit on the main board 200 through an electrical connection line.

[0132] Please refer to Figure 15 and Figure 16 , Figure 15 is a schematic structural diagram of a part of the middle frame 100, the first battery 900 and the second battery 1000 of the electronic device 10,Figure 16 Yes Figure 15 is the L-L sectional view in it. In a possible implementation, the electronic device 10 further includes a first battery 900 and a second battery 1000. The first battery 900 and the second battery 1000 are spaced along the second direction B on one side of the middle frame 100 facing the main board 200. The first battery 900 is located on the side of the third guiding portion 610 away from the second air duct 600, and the second battery 1000 is located on the side of the fourth guiding portion 620 away from the second air duct 600. The height of the first battery 900 and the second battery 1000 along the first direction A is greater than the height of the third guiding portion 610 and the fourth guiding portion 620 (as Figure 16 shown), and the main board 200 is arranged between the first battery 900 and the second battery 1000 along the second direction B. In this embodiment, the main board 200 is in a T shape. The middle frame 100 is provided with a first receiving position 110 for receiving the first battery 900 and the second battery 1000, and a second receiving position 120 for receiving the air flow driving member 400. Among them, the first receiving position 110 is located on both sides of the main board 200, and the second receiving position 120 is located at one end of the main board 200 adjacent to the first air outlet 320. Among them, the third guiding portion 610 and the fourth guiding portion 620 are parts of the T-shaped main board 200 with a bent section along the second direction B, specifically as Figure 15 the thickened black part in it.

[0133] In some embodiments, the shapes of the third guiding portion 610 and the fourth guiding portion 620 can be set according to the shape of the main board 200, and are not limited to long strips, arcs, bent line segments, etc. In this embodiment, on the one hand, the third guiding portion 610 and the fourth guiding portion 620 are used to form a receiving position for receiving the first battery 900 and the second battery 1000, and on the other hand, they are used to form a wind direction guiding portion of the second air duct 600, that is, the components in the electronic device 10 that originally receive the batteries are used as the guiding portion, saving space and making the structural arrangement in the electronic device 10 more concise.

[0134] Among them, the first battery 900 and the second battery 1000 can be connected in series or in parallel according to product requirements, or operate independently. In this embodiment, the setting of the two batteries can sandwich the main board 200 between them. On the one hand, it can fix the main board 200 and improve the structural strength. On the other hand, it is beneficial to form the second air duct 600 and avoid the air flowing through various areas of the electronic device 20 and increasing the air resistance.

[0135] In some embodiments, third guiding portions 610 and fourth guiding portions 620 are provided with a third sidewall 630 and a fourth sidewall 640 at two ends along a fourth direction D. The third sidewall 630, the third guiding portions 610, the fourth sidewall 640, and the fourth guiding portions 620 are connected end to end in sequence and enclose a second air duct 600 together with the main board 200 and a part of the middle frame 100. The third sidewall 630, the third guiding portions 610, the fourth sidewall 640, and the fourth guiding portions 620 seal the periphery of the second air duct 600, enabling air to flow only in the second air duct 600, preventing air from leaking from the periphery of the second air duct 600, increasing the air volume in the second air duct 600, and improving the cooling efficiency. The third sidewall 630 and the fourth sidewall 640 may be formed by bosses protruding from the middle frame 100 towards the main board 200, that is, the third sidewall 630 and the fourth sidewall 640 are integrally formed with the middle frame 100, or they may be separate components connected between the main board 200 and the middle frame 100 by connection means such as adhesives, screws, and snaps.

[0136] In some embodiments, the lengths of the third sidewall 630 and the fourth sidewall 640 along the fourth direction D are set to be relatively larger. The fourth direction D is the length direction of the electronic device 10. After placing the main board 200 on the surfaces of the third sidewall 630, the fourth sidewall 640, the third guiding portions 610, and the fourth guiding portions 620 away from the middle frame 100, the main board 200 is fixedly connected to the third sidewall 630 and the fourth sidewall 640 by screws, and no other components are used to fix between the main board 200 and the third guiding portions 610 and the fourth guiding portions 620. Such a setting can save the design space of the electronic device 10 in the second direction B (width direction).

[0137] Please refer to again Figure 1 , in a possible implementation manner, the electronic device 10 further includes a shielding member 1100, and the shielding member 1100 is disposed on the surface of the main board 200. The shielding member 1100 is used to shield electronic devices that generate radiation signals. In some embodiments, there may be two shielding members 1100, which are respectively disposed on two opposite surfaces of the main board 200. In some embodiments, please refer to Figure 17 , Figure 17 is a schematic structural diagram of a part of the main board 200 in the electronic device 10. The shielding member 1100 is provided with an opening 1110 to expose electronic devices 1120 that do not generate radiation signals, and the part of the electronic devices 1120 can be directly blown and cooled by cold air.

[0138] Please refer to Figure 18 , Figure 18FIG. 0 is a schematic structural diagram of a part of the main board 200 in the electronic device 10. In some embodiments, a CPU 1130 is provided on the surface of the main board 200 facing the middle frame 100. Since the CPU 1130 generates a relatively large amount of heat during the operation of the electronic device 10, a heat-conducting material 1140 can be provided at the position of the shielding member 1100 corresponding to the CPU 1130 to accelerate the cooling of the CPU 1130. The heat-conducting material 1140 includes TIM, such as gel or silica gel.

[0139] Please refer to Figure 19 , Figure 19 FIG. 7 is a schematic structural diagram of a part of the main board 200 in the electronic device 10. In a possible implementation manner, a heat-generating device 230 is provided on the main board 200, and the shielding member 1100 is provided with an opening 1110 to expose the heat-generating device 230. The heat-generating device 230 can be disposed on any surface of the main board 200, so that the heat-generating device 230 is directly blown and cooled by the cold air in the first air duct 500 or the second air duct 600. In some embodiments, a heat-conducting material 1140 is provided on the surface of the heat-generating device 230 away from the main board 200, and the heat of the heat-generating device 230 is conducted through the heat-conducting material 1140 to improve the cooling efficiency.

[0140] To illustrate the beneficial effects of the electronic device 10 in the present application, the following specific implementation manners, comparative implementation manners, and test effects are also described in the present application.

[0141] Embodiment 1

[0142] Please refer to Figures 1 to 5b , in this embodiment, the electronic device 10 is a mobile phone, including an air flow driving member 400 and a display screen 20, a middle frame 100, a main board 200, a structural member 300, and a rear cover 700 stacked in sequence along the first direction A. Among them, a first battery 900 and a second battery 1000 (as Figure 15 shown) are installed on one side of the middle frame 10 facing the main board 200, and heat-generating devices 230 are provided on both surfaces of the main board 200. The heat-generating devices 230 include a CPU 1130 (as Figure 2 shown). In this embodiment, the first direction A is the thickness direction of the electronic device 10, and the structural member 300 is a support member 800.

[0143] A first guiding portion 510 and a second guiding portion 520 (as Figure 2 shown) are disposed opposite to each other along the second direction B between the support member 800 and the main board 200, and a first side wall 810 and a second side wall 820 (as Figure 11bAs shown in the figure, the first guiding part 510, the second guiding part 520, the first side wall 810, the second side wall 820, the support member 800 and the main board 200 together enclose to form the first air duct 500. The fourth direction D, the second direction B and the first direction A are perpendicular to each other pairwise. In this embodiment, the second direction B is the width direction of the electronic device 10, and the fourth direction D is the length direction of the electronic device 10.

[0144] Between the middle frame 100 and the main board 200, there are a third guiding part 610 and a fourth guiding part 620 arranged oppositely along the third direction C, and a third side wall 630 and a fourth side wall 640 arranged oppositely along the fourth direction D with respect to the device. The third side wall 630, the third guiding part 610, the fourth side wall 640 and the fourth guiding part 620 are connected end to end in sequence, and enclose with the main board 200 and a part of the middle frame 100 to form the second air duct 600 (as Figure 15 shown in the figure). The orthographic projection of the first air duct 500 on the main board 200 overlaps. The third direction C is the same as the second direction B.

[0145] In the area where the support member 800 is located in the first air duct 500, there are a first air inlet hole 310 and a first air outlet hole 320 penetrating through the opposite two surfaces of the structural member 300 (as Figure 11a shown in the figure). The first air inlet hole 310 and the first air outlet hole 320 are respectively located at the opposite two ends of the first air duct 500. The first air outlet hole 320 is communicated with the air inlet of the air flow driving member 400. On the main board 200, there is a second air inlet hole 210 penetrating through the opposite two surfaces of the main board 200. The air flow driving member 400 is located on the side of the main board 200 away from the second air inlet hole 210, and the second air inlet hole 210 is communicated with the first air inlet hole 310.

[0146] The rear cover 700 is located on the side of the support member 800 away from the main board 200. The rear cover 700 is provided with a third air inlet hole 710 and a third air outlet hole 720 penetrating through the opposite two surfaces of the rear cover 700. The third air inlet hole 710 is communicated with the outside of the electronic device 10 and is respectively communicated with the first air inlet hole 310 and the second air inlet hole 210. The third air outlet hole 720 is communicated with the outside of the electronic device 10 and is respectively communicated with the first air outlet hole 320 and the air outlet of the air flow driving member 400. The orthographic projections of the first air inlet hole 310, the second air inlet hole 210 and the third air inlet hole 710 on the rear cover 700 partially overlap. Among them, the lengths of the first air inlet hole 310, the second air inlet hole 210 and the third air inlet hole 710 along the fourth direction D are 18 mm, and the lengths along the second direction B are 5 mm. The lengths of the first air outlet hole 320 and the third air outlet hole 720 along the fourth direction D are 18 mm, and the lengths along the second direction B are 18 mm. Among them, the air flow driving member 400 is a fan, and the lengths of the fan along the fourth direction D and along the second direction B are both 18 mm, and the length along the first direction A is 5 mm.

[0147] The air flow driving member 400 is located on one side of the air outlets of the first air duct 500 and the second air duct 600. There is a fifth gap 220 between the air flow driving member 400 and the main board 200. The first air duct 500 communicates with the air inlet of the air flow driving member 400 through the fifth gap 220, and the air outlet of the second air duct 600 is connected to the air inlet of the air flow driving member 400.

[0148] The cold air F from the external environment enters the first air inlet hole 310 from the third air inlet hole 710, and then enters the electronic device 10 from the first air inlet hole 310. A part of the cold air F1 flows through the first air duct 500 and enters the air flow driving member 400 from the fifth gap 220. Another part of the cold air F2 enters the second air duct 600 from the second air inlet hole 210, enters the air flow driving member 400 after flowing through the second air duct 600, and then leaves the electronic device 10 through the first air outlet hole 320 and the third air outlet hole 720 in sequence.

[0149] In this embodiment, the main board 200 is arranged in a T shape, and the first air duct 500 and the second air duct 600 have the same shape as the main board 200. The first battery 900 and the second battery 1000 are arranged at intervals along the second direction B on the side of the middle frame 100 facing the main board 200. The first battery 900 is located on the side of the third guiding portion 610 away from the second air duct 600, and the second battery 1000 is located on the side of the fourth guiding portion 620 away from the second air duct 600.

[0150] Comparative embodiment

[0151] Please refer to Figure 20, in a comparative embodiment, an electronic device 10a is provided, including a display screen 20, a middle frame 100, a main board 200, a heat dissipation device 1200, an air flow driving member 400, and a rear cover 700. Among them, the display screen 20 and the main board 200 are arranged on both sides of the middle frame 100, the heat dissipation device 1200 is arranged on the side of the main board 200 away from the middle frame 100, and the rear cover 700 is arranged on the side of the heat dissipation device 1200 away from the main board 200. The heat dissipation device 1200 is a hollow cavity structure, the air flow driving member 400 is arranged inside the cavity of the heat dissipation device 1200, the heat dissipation device 1200 includes a first surface 1230 adjacent to the rear cover 700, and a fourth air inlet hole 1210 and a fourth air outlet hole 1220 penetrating the first surface 1230 are provided on the first surface 1230. The fourth air inlet hole 1210 and the fourth air outlet hole 1220 are arranged at opposite ends of the heat dissipation device 1200, and a third air inlet hole 710 and a third air outlet hole 720 penetrating opposite two surfaces are provided on the rear cover 700. The orthographic projection of the fourth air inlet hole 1210 and the third air inlet hole 710 on the rear cover 700 overlaps, and the orthographic projection of the fourth air outlet hole 1220 and the third air outlet hole 720 on the rear cover 700 overlaps. Cold air enters from the third air inlet hole 710, passes through the fourth air inlet hole 1210 and enters the heat dissipation device 1200, and then is discharged from the electronic device 10a through the fourth air outlet hole 1220 and the third air outlet hole 720 in sequence under the drive of the air flow driving member 400. Among them, the air flow driving member 400 is a fan, and the length and width of the fan are 18 mm, and the height is 5 mm. In this comparative embodiment, only the surface of the main board 200 facing the heat dissipation device 1200 can be cooled, and the cold air F cannot directly blow on the surface of the main board 200. Instead, the cold air F must first cool the surface of the heat dissipation device 1200 adjacent to the main board 200, and then cool the main board 200 through the cooled surface, resulting in poor cooling efficiency. Through testing, the overall heat dissipation capacity of the electronic device 10a provided in this comparative embodiment is 50 mA / °C - 65 mA / °C; and the heat dissipation device 1200 is an independent air duct structure, and stacking in the whole machine will increase the thickness, which is not conducive to meeting the current development direction of thin, light and high-performance products.

[0152] This application conducts an effect test on the above-mentioned Embodiment 1, where the simulation schematic diagram in Embodiment 1 is as Figure 21 and Figure 22 shown, where Figure 21 is the simulation schematic diagram of Embodiment 1, Figure 22 is the schematic diagram of the air flowing through the first air duct 500 and the second air duct 600 on the upper and lower surfaces of the main board 200 in Embodiment 1. From Figure 21 and Figure 22It can be seen that when the electronic device 10 provided in Embodiment 1 operates, the cold air F enters the first air duct 500 and the second air duct 600 on both sides of the main board 200, and then cools the upper and lower surfaces of the main board 200. The electronic device 10 provided in Embodiment 1 was tested with air volumes of 0.2 CFM and 0.5 CFM. The test data is shown in Table 1. Among them, the heat dissipation capacity of the first air duct 500 reaches 95 mA / °C and 160 mA / °C at air volumes of 0.2 CFM and 0.5 CFM respectively, and the heat dissipation capacity of the second air duct 600 reaches 81.7 mA / °C and 120 mA / °C at air volumes of 0.2 CFM and 0.5 CFM respectively. The heat dissipation efficiency is significantly higher than that of the electronic device 10a provided in the comparative embodiment. Moreover, the internal air resistance of the electronic device 10 in Embodiment 1 of the present application is only 25 Pa and 85 Pa at air volumes of 0.2 CFM and 0.5 CFM respectively, indicating that it has a small air resistance, which is more conducive to the flow of cold air and speeds up the cooling rate.

[0153] Table 1

[0154]

[0155] The electronic device provided in the embodiments of the present application has been introduced in detail above. Specific examples are used in this article to elaborate on the principle and embodiments of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those of ordinary skill in the art, according to the idea of the present application, there will be changes in the specific embodiments and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. An electronic device, characterized in that, the electronic device includes an air flow driving member, and a middle frame, a main board, and a structural member that are sequentially stacked along a first direction. A first guiding portion and a second guiding portion are oppositely arranged along a second direction between the structural member and the main board. The first guiding portion, the structural member, the second guiding portion, and the main board jointly enclose a first air duct. A third guiding portion and a fourth guiding portion are oppositely arranged along a third direction between the middle frame and the main board. The third guiding portion, the middle frame, the fourth guiding portion, and the main board jointly enclose a second air duct. The first direction intersects with the second direction and the third direction respectively. The first guiding portion, the second guiding portion, the third guiding portion, and the fourth guiding portion are used to guide cold air to flow in the first air duct and the second air duct; the air flow driving member is located on the first air duct and the second air duct or on the path where the first air duct and the second air duct communicate with the outside of the electronic device. Both the first air duct and the second air duct have an air inlet and an air outlet that are oppositely arranged and communicate with the outside of the electronic device. The air flow driving member is used to drive air to blow from the air inlets of the first air duct and the second air duct to the air outlets of the first air duct and the second air duct respectively.

2. The electronic device according to claim 1, characterized in that, the air outlets of the first air duct and the second air duct are arranged on the same side and communicate with each other. The air flow driving member is located on one side of the air outlets of the first air duct and the second air duct, and the air inlet of the air flow driving member communicates with the air outlets of the first air duct and the second air duct, and the air outlet of the air flow driving member communicates with the outside of the electronic device.

3. The electronic device according to claim 2, characterized in that, the structural member is provided with a first air inlet hole and a first air outlet hole that penetrate through opposite two surfaces of the structural member in the area of the first air duct. The first air inlet hole and the first air outlet hole are respectively located at opposite ends of the first air duct. The first air inlet hole and the first air outlet hole respectively communicate with the outside of the electronic device. The first air outlet hole communicates with the air outlet of the air flow driving member, so that air enters from the first air inlet hole, flows through the first air duct and the air flow driving member, and flows out from the first air outlet hole.

4. The electronic device according to claim 3, characterized in that, the orthographic projection of the first air outlet hole and the air outlet of the air flow driving member on the structural member at least partially overlaps.

5. The electronic device according to claim 3 or 4, characterized in that, the main board is provided with a second air inlet hole that penetrates through opposite two surfaces of the main board. The second air inlet hole communicates with the first air inlet hole, so that air enters the second air inlet hole from the first air inlet hole, flows through the second air duct and the air flow driving member, and flows out from the first air outlet hole.

6. The electronic device according to claim 5, characterized in that, the orthographic projection of the second air inlet hole and the first air inlet hole on the main board at least partially overlaps.

7. The electronic device according to claim 5, It is characterized in that the air flow driving member is located on the side of the main board away from the second air inlet hole.

8. The electronic device according to claim 7, It is characterized in that there is a fifth gap between the air flow driving member and the main board, and the first air duct is communicated with the air inlet of the air flow driving member through the fifth gap.

9. The electronic device according to claim 1, It is characterized in that the air inlets of the first air duct and the second air duct are arranged on the same side and communicated with each other. The air flow driving member is located on one side of the air inlets of the first air duct and the second air duct, and the air inlet of the air flow driving member is communicated with the outside of the electronic device, and the air outlet of the air flow driving member is communicated with the air inlets of the first air duct and the second air duct.

10. The electronic device according to claim 1, It is characterized in that the structural member is a rear cover, and the first guiding portion and the second guiding portion are connected to the rear cover.

11. The electronic device according to claim 1, It is characterized in that the structural member is a support member, and the first guiding portion and the second guiding portion are oppositely arranged along the second direction at the edge of the support member and connected to the support member.

12. The electronic device according to claim 11, It is characterized in that first side walls and second side walls are provided at both ends of the support member along the fourth direction. The first side wall is connected to one ends of the first guiding portion and the second guiding portion, and the second side wall is connected to the other ends of the first guiding portion and the second guiding portion. The first side wall is arranged adjacent to the air inlet of the first air duct, and the second side wall is arranged adjacent to the air outlet of the first air duct; the fourth direction intersects with the first direction and the second direction respectively.

13. The electronic device according to claim 11 or 12, It is characterized in that the electronic device further includes a rear cover, the rear cover is located on the side of the support member away from the main board, and the rear cover is provided with a third air inlet hole and a third air outlet hole penetrating through opposite two surfaces of the rear cover. The third air inlet hole is communicated with the outside of the electronic device and is respectively communicated with the first air duct and the second air duct, and the third air outlet hole is communicated with the outside of the electronic device and is respectively communicated with the first air duct and the second air duct.

14. The electronic device according to claim 1, It is characterized in that the orthographic projections of the first air duct and the second air duct on the main board at least partially overlap.

15. The electronic device according to claim 1, It is characterized in that the third guiding portion and the fourth guiding portion are connected to the middle frame.

16. The electronic device according to claim 1, It is characterized in that The electronic device further includes a first battery and a second battery. The first battery and the second battery are disposed at intervals along the third direction on a side of the middle frame facing the main board. The first battery is located on a side of the third guiding portion away from the second air duct, and the second battery is located on a side of the fourth guiding portion away from the second air duct. The height of the first battery and the second battery along the first direction is greater than the height of the third guiding portion and the fourth guiding portion. The main board is disposed between the first battery and the second battery along the second direction.

17. The electronic device according to claim 1, wherein, the electronic device further includes a shielding member, and the shielding member is disposed on the surface of the main board.

18. The electronic device according to claim 17, wherein, a heating device is provided on the main board, and the shielding member is provided with an opening to expose the heating device.

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