Radiation detector and method for manufacturing radiation detector

Abstract

The radiation detector of the present invention is a radiation detector comprising: a sensor panel, a scintillator panel, and a resin frame arranged throughout the sensor panel and the scintillator panel, the sensor panel having a mounting surface on which the scintillator panel is mounted, the scintillator panel comprising: a support body having: a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface to each other; and a scintillator layer formed on the first surface and comprising a plurality of columnar crystals, and mounted on the mounting surface in a manner such that the scintillator layer and the first surface are opposite to the mounting surface, the scintillator layer having: a second side surface extending so as to be located on the same plane as the first side surface.

Description

Technical Field

[0001] The present disclosure relates to a radiation detector and a method for manufacturing the radiation detector. Background Art

[0002] Patent Document 1 describes a radiation detector comprising: a support; a scintillator layer laminated inwardly of the outer edge of the support; a light detecting substrate attached to the scintillator layer to form a gap between the scintillator layer and the support; and a sealing film filling the gap, with a film thickness at the center portion being thinner than at the end portions.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2012-118058 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] In the above-described radiation detector, the scintillator layer is protected from moisture by the sealing film interposed between the support and the light detection substrate. In particular, in the above-described radiation detector, the sealing film is relatively thin in the central portion, allowing the sealing film to more easily elastically deform in response to warping of the support and the light detection substrate. Furthermore, the sealing film is relatively thick at the end portions, ensuring close contact between the sealing film and the support and the light detection substrate, thereby maintaining moisture resistance.

[0008] Specifically, in the aforementioned radiation detector, the scintillator layer must be formed smaller than the support body to protect it from moisture, and the gap between the support body, the scintillator layer, and the light detection substrate must be filled with a sealing film having the aforementioned characteristics. Consequently, the effective area where the scintillator layer is formed is smaller than the size of the support body.

[0009] An object of the present disclosure is to provide a radiation detector capable of increasing the effective area while ensuring reliability, and a method for manufacturing the radiation detector.

[0010] Technical means for solving technical problems

[0011] The radiation detector disclosed in the present invention is a radiation detector comprising: a sensor panel, a scintillator panel, and a resin frame arranged throughout the sensor panel and the scintillator panel, the sensor panel having a mounting surface on which the scintillator panel is mounted, the scintillator panel comprising: a support body having: a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface to each other; and a scintillator layer formed on the first surface, comprising a plurality of columnar crystals, and mounted on the mounting surface in a manner such that the scintillator layer and the first surface are opposite to the mounting surface, the scintillator layer having: a second side surface extending so as to be located on the same plane as the first side surface, the resin frame being observed from a first direction intersecting the first side surface and the second side surface, at least by extending from the mounting surface to the first side surface, thereby sealing the scintillator layer.

[0012] In this radiation detector, the scintillator panel is mounted on the sensor panel in such a manner that its scintillator layer faces the mounting surface of the sensor panel. In particular, in the scintillator panel, the first side surface, which is the side surface of the support body, and the second side surface, which is the side surface of the scintillator layer, are located on the same plane. That is, when viewed from a direction intersecting the first and second surfaces of the support body, the scintillator layer is provided on the entire surface of the support body, thereby increasing the effective area. In such a structure, the boundary between the support body and the scintillator layer, or the boundary between the scintillator layer and the sensor panel, is susceptible to damage from the side. In contrast, in this radiation detector, the resin frame extends from at least the mounting surface of the sensor panel to the first side surface of the support body, thereby sealing the scintillator layer. Therefore, damage to the boundary and the second side surface, which is the side surface of the scintillator layer, is avoided. In addition, at the same time, the moisture resistance of the scintillator layer is improved, and peeling due to thermal expansion difference / warping is suppressed. That is, according to this radiation detector, as described above, the effective area is increased while ensuring reliability.

[0013] In the radiation detector disclosed herein, the support body may include: a first flexible support body having a first surface and a third surface on the opposite side of the first surface; a second flexible support body having a second surface and a fourth surface on the opposite side of the second surface; and an inorganic layer disposed between the third surface and the fourth surface, wherein the resin frame extends at least from the mounting surface to the fourth surface when viewed from the first direction, thereby sealing the inorganic layer. In this case, the inorganic layer suppresses moisture intrusion from the second surface side through the first flexible support body into the scintillator layer. In particular, the resin frame extends across the inorganic layer (to reach the fourth surface), thereby reliably improving moisture resistance. In addition, the second flexible support body protects the inorganic layer from contact, thereby suppressing degradation of the inorganic layer. Therefore, reliability is reliably ensured.

[0014] In the radiation detector of the present disclosure, the resin frame may extend from the mounting surface to the peripheral edge of the second surface. In this case, moisture resistance is further improved, peeling is reliably suppressed, and reliability is more reliably ensured.

[0015] In the radiation detector of the present disclosure, the resin frame may include an inner edge located on the second surface and an outer edge located outside the second surface when viewed from a second direction intersecting the second surface.

[0016] The distance from the inner edge of the resin frame to the peripheral edge of the second surface is less than or equal to twice the distance from the peripheral edge of the second surface to the outer edge. In this case, the reliability can be ensured while suppressing the reduction of the effective area.

[0017] In the radiation detector of the present disclosure, the resin frame may include at least one overlapping portion composed of a plurality of parts arranged along the first side surface and the second side surface, wherein one part overlaps with another part.

[0018] In the radiation detector of the present disclosure, the ratio of the width of the resin frame from the first side surface may be 0.1 to 12.5, assuming the height of the resin frame from the mounting surface is 1. In this case, reliability can be ensured while avoiding an increase in size.

[0019] The radiation detector of the present disclosure may include an adhesive layer interposed between the mounting surface and the scintillator panel to bond the sensor panel and the scintillator panel to each other. In this case, the scintillator panel and the sensor panel are bonded with high precision.

[0020] In the radiation detector of the present disclosure, the resin frame may include a filler material made of an inorganic material. In this case, the moisture resistance is further improved.

[0021] In the radiation detector of the present disclosure, the resin frame may contain a pigment having reflectivity or absorptivity with respect to at least scintillation light generated in the scintillator layer. In this case, optical characteristics are improved.

[0022] In the radiation detector of the present disclosure, a protective layer may be formed on the mounting surface. In this case, the reliability of the sensor panel is improved.

[0023] In the radiation detector of the present disclosure, the scintillator panel may include a protective layer formed on the first side surface and the second side surface. In this case, damage and moisture intrusion from the side can be more reliably suppressed.

[0024] The method for manufacturing a radiation detector disclosed herein comprises: a first step of preparing a scintillator panel having a support body and a scintillator layer formed on the support body; a second step of preparing a sensor panel including a photoelectric conversion element; a third step of mounting the scintillator panel on the sensor panel such that the scintillator layer faces the sensor panel; and a fourth step of providing a resin frame extending over the sensor panel and the scintillator panel after the third step, wherein the support body comprises a first surface on which the scintillator layer is formed, a second surface opposite to the first surface, and a first side surface connecting the first and second surfaces; the scintillator layer comprises a second side surface extending so as to be coplanar with the first side surface; and the sensor panel comprises a mounting surface on which the scintillator panel is mounted. In the fourth step, a resin is applied and cured on at least the mounting surface, the first side surface, and the second side surface, thereby forming the resin frame so as to extend from at least the mounting surface to the first side surface when viewed from a first direction intersecting the first and second side surfaces, thereby sealing the scintillator layer.

[0025] In this manufacturing method, the scintillator panel is mounted on the sensor panel in such a manner that its scintillator layer faces the mounting surface of the sensor panel. In particular, in the scintillator panel, the first side surface, which is the side surface of the support body, and the second side surface, which is the side surface of the scintillator layer, are located on the same plane. That is, when viewed from a direction intersecting the first and second surfaces of the support body, the scintillator layer is provided on the entire surface of the support body, thereby increasing the effective area. In such a structure, the boundary between the support body and the scintillator layer, or the boundary between the scintillator layer and the sensor panel, is susceptible to damage from the side. In contrast, in this manufacturing method, a resin frame is formed in a manner that extends from at least the mounting surface of the sensor panel to the first side surface of the support body to seal the scintillator layer. Therefore, damage to the boundary and the second side surface, which is the side surface of the scintillator layer, is avoided. In addition, at the same time, the moisture resistance of the scintillator layer is improved, and peeling due to thermal expansion difference / warping is suppressed. That is, through this manufacturing method, a radiation detector can be manufactured that increases the effective area as described above while ensuring reliability.

[0026] In the method for manufacturing a radiation detector disclosed herein, the resin frame may be formed by applying and curing the resin multiple times in the fourth step. In this case, overlapping portions of the multiple parts constituting the resin frame can be formed by applying and curing the resin once and then applying and curing the resin again.

[0027] In the method for manufacturing a radiation detector disclosed herein, in the fourth step, resin may be applied and cured using a mold frame disposed on the mounting surface so as to surround the scintillator panel while being separated from the scintillator panel when viewed from a second direction intersecting the second surface, thereby forming the resin frame. In this case, the formation of resin dripping can be suppressed.

[0028] In the method for manufacturing a radiation detector of the present disclosure, in the third step, the scintillator panel may be mounted on the sensor panel via an adhesive layer.

[0029] Effects of the Invention

[0030] According to the present disclosure, it is possible to provide a radiation detector capable of increasing the effective area while ensuring reliability, and a method for manufacturing the radiation detector. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic cross-sectional view showing the radiation detector according to this embodiment.

[0032] Figure 2 yes Figure 1 Magnified view of area AR.

[0033] Figure 3 yes Figure 1 A schematic top view of the radiation detector shown.

[0034] Figure 4 Yes Figures 1 to 3 Schematic cross-sectional view of one step of a method for manufacturing a radiation detector shown.

[0035] Figure 5 Yes Figures 1 to 3 Schematic cross-sectional view of one step of a method for manufacturing a radiation detector shown.

[0036] Figure 6 Yes Figures 1 to 3 Schematic cross-sectional view of one step of a method for manufacturing a radiation detector shown. DETAILED DESCRIPTION

[0037] Hereinafter, one embodiment will be described in detail with reference to the accompanying drawings. In the description of each figure, the same or corresponding elements are denoted by the same reference numerals, and overlapping descriptions may be omitted.

[0038] The radiation detector (radiation imager) of this embodiment converts radiation such as X-rays into scintillation light such as visible light for detection (imaging). Furthermore, the radiation detector of this embodiment can be used in medical X-ray diagnostic imaging devices such as mammography equipment, breast examination equipment, CT equipment, dental intraoral imaging equipment, and radiographic cameras, as well as non-destructive inspection equipment.

[0039] Figure 1 : is a schematic cross-sectional view showing a radiation detector according to this embodiment. Figure 1 As shown, the radiation detector 1 includes a scintillator panel 10 , a sensor panel 20 , and a resin frame 30 . The scintillator panel 10 includes a support 11 , a scintillator layer 12 , a protective layer 18 , and a protective layer 19 .

[0040] The support 11 is formed in a flat plate shape and has a first surface 11a, a second surface 11b opposite to the first surface 11a, and a first side surface 11s connecting the first and second surfaces 11a and 11b. The first and second surfaces 11a and 11b are parallel to each other.

[0041] The scintillator layer 12 is formed on the first surface 11a. The scintillator layer 12 generates scintillation light in response to incident radiation from the second surface 11b. The scintillator layer 12 includes a plurality of columnar crystals. As an example, the scintillator layer 12 is composed of a plurality of columnar crystals. The scintillator layer 12 is suitable for high-resolution imaging because each columnar crystal has a light-guiding effect.

[0042] Examples of materials for the scintillator layer 12 include materials primarily composed of CsI (cesium iodide), such as CsI:Tl or CsI:Na; materials primarily composed of NaI (sodium iodide), such as NaI:Tl; SrI3 (strontium iodide); LuI3 (lutetium iodide); BaF2 (barium fluoride); and GOS. The scintillator layer 12 is primarily composed of CsI. Such a scintillator layer 12 can be formed, for example, by vapor deposition. The thickness of the scintillator layer 12 is, for example, not less than 10 μm and not more than 3000 μm, and specifically, 600 μm.

[0043] The scintillator layer 12 has a second side surface 12s. The second side surface 12s connects one side of the scintillator layer 12 that is in contact with the support body 11 and the other side on the opposite side of the side. The second side surface 12s is located on the same plane as the first side surface 11s of the support body 11. In other words, the first side surface 11s and the second side surface 12s are formed in substantially the same plane. As an example, when the first side surface 11s and the second side surface 12s are formed as cut surfaces when the support body 11 and the scintillator layer 12 are cut together by a knife blade or laser irradiation, they are substantially in the same plane. Therefore, when the first side surface 11s and the second side surface 12s are microscopically viewed, there is a possibility that there are fine concave and convex structures such as rough surfaces or burrs. When it is stipulated as "the same plane", such concave and convex structures can be ignored. As an example, the first side surface 11s and the second side surface 12s extend perpendicularly to the first surface 11a and the second surface 11b of the support body 11.

[0044] Here, the support body 11 includes a first flexible support body 13, a second flexible support body 14, an inorganic layer 15, and adhesive layers 16 and 17. The first flexible support body 13 includes a first surface 11a of the support body 11. Furthermore, the first flexible support body 13 includes a third surface 13b opposite the first surface 11a. The second flexible support body 14 includes a second surface 11b of the support body 11. Furthermore, the second flexible support body 14 includes a fourth surface 14a opposite the second surface 11b. That is, in the support body 11, the first surface 11a, the third surface 13b, the fourth surface 14a, and the second surface 11b are arranged in order from the scintillator layer 12 side.

[0045] The first flexible support body 13 and the second flexible support body 14 are flexible. In addition, being flexible means being able to be elastically deformed. Therefore, the support body 11 is flexible as a whole. The materials of the first flexible support body 13 and the second flexible support body 14 include, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polypropylene (PP), polyethylene (PE), or acrylic (PMMA). As an example, the material of the first flexible support body 13 and the second flexible support body 14 is PET, PEN, PI, PP, PE, or PMMA. Here, the material of the first flexible support body 13 and the second flexible support body 14 is PET. In addition, the material of the first flexible support body 13 and the material of the second flexible support body 14 are, for example, the same. To improve adhesion to the scintillator layer 12, the first flexible support 13 may also include an anchor coat layer made of a thermoplastic resin (e.g., acrylic) on the surface formed on the scintillator layer 12. In particular, when the scintillator layer 12 is composed of a plurality of columnar crystals, the anchor coat layer improves the crystallinity of the base of the columnar crystals.

[0046] The inorganic layer 15 is provided between the third surface 13b and the fourth surface 14a. The inorganic layer 15 is provided on the second flexible support 14. The second flexible support 14 provided with the inorganic layer 15 is bonded to the third surface 13b of the first flexible support 13 via the adhesive layer 17. In other words, the adhesive layer 17 bonds the third surface 13b and the organic layer 15 to each other.

[0047] An adhesive layer 16 is interposed between the inorganic layer 15 and the second flexible support 14, and the inorganic layer 15 is bonded to the second flexible support 14 via the adhesive layer 16. Specifically, the adhesive layer 16 bonds the inorganic layer 15 and the second flexible support 14 to each other. In this manner, the scintillator layer 12, the first flexible support 13, the inorganic layer 15, and the second flexible support 14 are sequentially stacked to form a stacked body 40, which is integrated by the adhesive layers 16 and 17.

[0048] The inorganic layer 15 is made of an inorganic material. For example, the material of the inorganic layer 15 is a metal. More specifically, the material of the inorganic layer 15 includes, for example, aluminum (Al), copper (Cu), titanium (Ti), iron (Fe), or SUS. For example, the material of the inorganic layer 15 is Al.

[0049] The thickness of the first flexible support 13 in the second direction intersecting the first surface 11a (and the second surface 11b) is, for example, greater than 50 μm and less than 250 μm. Similarly, the thickness of the second flexible support 14 in the second direction is, for example, greater than 50 μm and less than 250 μm. The difference between the thickness of the first flexible support 13 and the thickness of the second flexible support 14 is, for example, greater than 0 and less than 90 μm. As an example, the thickness of the first flexible support 13 is the same as the thickness of the second flexible support 14 (the difference in thickness is 0). The thickness of the inorganic layer 15 in the second direction is, for example, greater than 10 μm and less than 100 μm, which is thinner than the thickness of the first flexible support 13 and the thickness of the second flexible support 14. The thickness of the inorganic layer 15 is, for example, 30 μm.

[0050] The protective layer 18 is provided on the surface of the scintillator layer 12 opposite to the support 11. The protective layer 19 is provided so as to cover the laminate 40 (i.e., the support 11 and the scintillator layer 12) and the protective layer 18. Thus, a plurality of layers (here, two layers) of protective layers 18 and 19 are arranged on the surface of the scintillator layer 12 opposite to the support 11. Furthermore, the protective layer 19 is formed on the first side surface 11s of the support 11 and the second side surface 12s of the scintillator layer 12. The material of the protective layers 18 and 19 is an organic material such as a resin, and one example is parylene (polyparaxylene).

[0051] The sensor panel 20 includes a photoelectric conversion element. It detects the scintillation light generated by the scintillator panel 10 and outputs a signal corresponding to the scintillation light. The sensor panel 20 has a mounting surface 21. A protective layer 22 is formed on the mounting surface 21. The protective layer 22 can be made of, for example, an oxide film, a nitride film, a fluorine-based resin, or an aromatic resin. However, the protective layer 22 may not be formed.

[0052] The scintillator panel 10 is mounted on the mounting surface 21 via a protective layer 22. More specifically, the scintillator panel 10 is mounted on the mounting surface 21 such that the first surface 11a of the support 11 and the scintillator layer 12 face the mounting surface 21. An adhesive layer 23 is interposed between the scintillator panel 10 and the mounting surface 21 (protective layer 22), and the scintillator panel 10 and the sensor panel 20 are bonded to each other via this adhesive layer 23. The adhesive layers 16, 17, and 23 can be made of any material having adhesive / sticky properties, such as a tape-like adhesive material (double-sided tape).

[0053] The resin frame 30 is provided across the sensor panel 20 and the scintillator panel 10. Next, the resin frame 30 will be described in detail. Figure 2 yes Figure 1 A magnified view of the area AR, Figure 3 yes Figure 1 Schematic top view of the radiation detector shown in FIG. Figure 3 In the embodiment, the protective layers 18 and 19 are omitted. Figures 1 to 3 As shown, the resin frame 30 seals the scintillator layer 12 by extending from the mounting surface 21 over the first side surface 11 s when viewed from a first direction intersecting the first side surface 11 s of the support body 11 and the second side surface 12 s of the scintillator layer 12 .

[0054] The resin frame 30 is in close contact with the first side surface 11s, the second side surface 12s, and the mounting surface 21 over most of the first side surface 11s, the second side surface 12s, and the mounting surface 21 (i.e., it may be partially separated). Thus, the resin frame 30 helps secure the scintillator panel 10 to the sensor panel 20. Here, the resin frame 30 extends from the mounting surface 21 to the fourth surface 14a of the second flexible support body 14 when viewed from the first direction, thereby also sealing the inorganic layer 15.

[0055] Here, the resin frame 30 extends from the mounting surface 21 across the fourth surface 14a to the periphery of the second surface 11b. Specifically, the resin frame 30 includes a main body 31 extending along the first side surface 11s and the second side surface 12s, and an extended portion 32 extending from the main body 31 onto the second surface 11b. Here, the main body 31 covers the entire first side surface 11s and the second side surface 12s.

[0056] The resin frame 30 is annular when viewed from a second direction intersecting the first surface 11a and the second surface 11b, and has an inner edge 33 located on the second surface 11b. In other words, the resin frame 30 does not cover most of the second surface 11b, and an opening 35 is formed on the second surface 11b. The inner edge 33 is the end of the extended portion 32 opposite the main body 31. The resin frame 30 also has an outer edge 34 located outside the second surface 11b when viewed from the second direction. The outer edge 34 is the end of the main body 31 opposite the extended portion 32.

[0057] The distance S33 from the inner edge 33 of the resin frame 30 to the periphery E of the second surface 11b (the first side surface 11s and the second side surface 12s) is less than or equal to twice the distance S34 from the periphery E of the second surface 11b to the outer edge 34. When the height H30 of the resin frame 30 from the mounting surface 21 is set to 1, the ratio of the width W30 of the resin frame 30 (main body 31) from the first side surface 11s and the second side surface 12s is greater than or equal to 0.1 and less than or equal to 12.5. The height H30 is, for example, greater than or equal to 200 μm and less than or equal to 2500 μm. The width W30 is, for example, greater than or equal to 300 μm and less than or equal to 2500 μm.

[0058] Here, the resin frame 30 may be composed of multiple parts. More specifically, Figure 2 As shown, the resin frame 30 is composed of multiple parts arranged along the first side 11s and the second side 12s. In this case, the resin frame 30 may include at least one overlapping portion 30d in which one portion 30a and another portion 30b overlap each other. In the overlapping portion 30d, the width W30 of the resin frame 30 may be expanded compared to other portions (that is, the overlapping portion 30d may be an expanded portion). In addition, the expanded portion 30c can also be formed at the interface between the resin frame 30 and the mounting surface 21. The expanded portion 30c can be formed even when the resin frame 30 is composed of a single part.

[0059] The resin frame 30 is made of, for example, epoxy, silicon, fluorine, urethane, or acrylic. The resin frame 30 may contain a filler material, such as an inorganic material such as epoxy resin or glass. The filler material may be made of a material with higher moisture resistance than the primary material of the resin frame 30, such as SiO2, Al2O3, or TiO2. Furthermore, the resin frame 30 may contain a pigment that is reflective or absorptive to at least the scintillation light generated by the scintillator layer 12.

[0060] Next, a method for manufacturing the above-described radiation detector will be described. Figure 4 、 Figure 5 ,and Figure 6 Yes Display Figures 1 to 3Schematic cross-sectional view of one step of the manufacturing method of the radiation detector shown in FIG. Figures 4-6 As shown, in the manufacturing method of the radiation detector 1 of this embodiment, the following steps are performed: a first step of preparing the scintillator panel 10; a second step of preparing the sensor panel 20; a third step of mounting the scintillator panel 10 on the sensor panel 20; and a fourth step of forming the resin frame 30 over the scintillator panel 10 and the sensor panel 20. The order of the first and second steps is arbitrary.

[0061] like Figure 4 As shown in (a), in the first step, the inorganic layer 15 is bonded to the fourth surface 14a of the second flexible support 14 by the adhesive layer 16, thereby forming the fifth step of forming the first structure P1. The surface 14b on the opposite side of the fourth surface 14a of the second flexible support 14 becomes the surface of the second surface 11b of the support 11. On the other hand, as Figure 4 As shown in (b), in the first step, a sixth step is performed to form the second structure P2 by forming the scintillator layer 12 on the surface 13a of the first flexible support 13 by, for example, vapor deposition. The surface 13a serves as the first surface 11a of the support 11. The order of the fifth and sixth steps is arbitrary.

[0062] Then, in the first step, Figure 4 As shown in (c), the seventh step is performed to form the laminate 40 by laminating the first structure P1 and the second structure P2. In the seventh step, the first structure P1 is bonded to the second structure P2 via the adhesive layer 17 so that the inorganic layer 15 is interposed between the third surface 13b of the first flexible support 13 and the fourth surface 14a of the second flexible support 14. Here, the inorganic layer 15 is bonded to the third surface 13b.

[0063] Then, in the first step, Figure 5 As shown in (a), the eighth step of providing the protective layers 18 and 19 on the laminate 40 is performed. In the eighth step, the protective layer 18 is first formed on the surface of the scintillator layer 12 opposite the support 11 (one surface of the laminate 40). In the eighth step, the protective layer 19 is then formed to cover the entire laminate 40 and the protective layer 18. Thus, the scintillator panel 10 is prepared.

[0064] On the other hand, in the second step, Figure 5 As shown in FIG. 2 ( b ), the sensor panel 20 is prepared. An adhesive layer 23 is provided on the mounting surface 21 of the sensor panel 20 via a protective layer 22 .

[0065] Then, if Figure 6As shown in (a), after the first and second steps, a third step of mounting the scintillator panel 10 on the sensor panel 20 is performed. In the third step, the scintillator panel 10 is mounted on the sensor panel 20 via the adhesive layer 23. More specifically, in the third step, the scintillator panel 10 is placed on the sensor panel 20 such that the first surface 11a faces the sensor panel 20 relative to the second surface 11b of the support 11. That is, with the scintillator layer 12 facing the mounting surface 21, the surface of the scintillator layer 12 opposite to the support 11 is bonded to the mounting surface 21 via the adhesive layer 23 (via the protective layers 18, 19, and 22).

[0066] Then, if Figure 6 As shown in (b), a fourth step is performed to provide a resin frame 30 over the scintillator panel 10 and the sensor panel 20. In the fourth step, a dispenser 50 is positioned around the scintillator panel 10, a resin 51 is applied around the scintillator panel 10, and the applied resin 51 is cured to form the resin frame 30. Here, by applying and curing the resin to the mounting surface 21, the first side surface 11s of the support body 11, and the second side surface 12s of the scintillator layer 12 (via the protective layer 19), the resin frame 30 is formed so as to extend from the mounting surface 21 over the first side surface 11s when viewed from a first direction intersecting the first side surface 11s and the second side surface 12s. Thus, the scintillator layer 12 is sealed by the resin frame 30, and the radiation detector 1 is manufactured.

[0067] In particular, in the fourth step, when viewed from the first direction, the resin frame 30 is formed by extending from the mounting surface 21 across the inorganic layer 15 to the fourth surface 14a of the second flexible support body 14, thereby further sealing the inorganic layer 15. In addition, in the fourth step, the resin frame 30 is formed by extending from the mounting surface 21 to the peripheral portion of the second surface 11b of the support body 11. This can be achieved by, for example, applying (and subsequently curing) the resin 51 while surrounding the dispenser 50 along the peripheral edge of the second surface 11b on the outside of the second surface 11b to form the main body 31 of the resin frame 30, and then applying (and subsequently curing) the resin 51 while surrounding the dispenser 50 along the peripheral edge of the second surface 11b on the inside of the second surface 11b to form the extended portion 32. Alternatively, the resin frame 30 can also be formed by using the dispenser 50 to apply the resin 51 on the outside of the second surface 11b along the periphery of the second surface 11b, thereby forming a part of the resin frame 30 corresponding to the main body 31, and utilizing the dripping of resin from this part to the inside of the second surface 11b to form a part corresponding to the extended portion 32, and then solidifying the whole to form it.

[0068] In the fourth step, the resin frame 30 is formed by applying and curing the resin 51 multiple times. In particular, the main body 31 is also formed by applying and curing the resin 51 multiple times. Thus, the resin frame 30 (main body 31) is formed by applying and curing the resin 51 once, and then applying and curing the resin 51 again, to form the overlapping portion 30d between the portion 30a and the portion 30b.

[0069] As described above, in the radiation detector 1 of this embodiment, the scintillator panel 10 is mounted on the sensor panel 20 such that its scintillator layer 12 faces the mounting surface 21 of the sensor panel 20. In particular, in the scintillator panel 10, the first side surface 11s, which is a side surface of the support body 11, and the second side surface 12s, which is a side surface of the scintillator layer 12, are located on the same plane. That is, when viewed from a direction intersecting the first surface 11a and the second surface 11b of the support body 11, the scintillator layer 12 is provided on the entire surface of the support body 11, thereby increasing the effective area.

[0070] On the other hand, in such a structure, the boundary between the support body 11 and the scintillator layer 12, or the boundary between the scintillator layer 12 and the sensor panel 20, is susceptible to damage from the side. In contrast, in the radiation detector 1, the resin frame 30 extends from at least the mounting surface 21 of the sensor panel 20 to the first side surface 11s of the support body 11, thereby sealing the scintillator layer 12. Therefore, damage to the boundary and the second side surface 12s, which is the side surface of the scintillator layer 12, is avoided. In addition, at the same time, the moisture resistance of the scintillator layer 12 is improved, and peeling due to thermal expansion difference / warping is suppressed. That is, according to the radiation detector 1, as described above, while increasing the effective area, reliability is ensured.

[0071] In the radiation detector 1, the support body 11 includes a first flexible support body 13 having a first surface 11a and a third surface 13b opposite the first surface 11a; a second flexible support body 14 having a second surface 11b and a fourth surface 14a opposite the second surface 11b; and an inorganic layer 15 disposed between the third surface 13b and the fourth surface 14a. The resin frame 30 further seals the inorganic layer 15 by extending from at least the mounting surface 21 to the fourth surface 14a when viewed from the first direction.

[0072] Therefore, the inorganic layer 15 suppresses moisture intrusion from the second surface 11b through the first flexible support 13 into the scintillator layer 12. In particular, the resin frame 30 extends beyond the inorganic layer 15 (reaching the fourth surface 14a), thereby reliably improving moisture resistance. Furthermore, the second flexible support 14 protects the inorganic layer 15 from contact, suppressing degradation of the inorganic layer 15. Consequently, reliability is reliably ensured.

[0073] Furthermore, in the radiation detector 1 , the resin frame 30 extends from the mounting surface 21 to the peripheral edge of the second surface 11 b , thereby further improving moisture resistance and reliably suppressing peeling, thereby more reliably ensuring reliability.

[0074] Furthermore, in the radiation detector 1, the resin frame 30 includes an inner edge 33 located on the second surface 11b when viewed from a second direction intersecting the second surface 11b, and an outer edge 34 located outside the second surface 11b. Furthermore, the distance S33 from the inner edge 33 to the peripheral edge E of the second surface 11b of the resin frame 30 is no greater than twice the distance S34 from the peripheral edge E of the second surface 11b to the outer edge 34. This ensures reliability while minimizing the reduction in effective area.

[0075] In the radiation detector 1 , the resin frame 30 is composed of a plurality of sections arranged along the first side surface 11 s and the second side surface 12 s , and includes at least one overlapping portion 30 d where one section 30 a overlaps another section 30 b . In this manner, the resin frame may be composed of a plurality of sections.

[0076] In the radiation detector 1 , when the height H30 of the mounting surface 21 from the resin frame 30 is set to 1, the ratio of the width W30 of the resin frame 30 from the first side surface 11 s is 0.1 to 12.5. Therefore, reliability can be ensured while avoiding an increase in size.

[0077] The radiation detector 1 also includes an adhesive layer 23 interposed between the mounting surface 21 and the scintillator panel 10 to bond the sensor panel 20 and the scintillator panel 10 together.

[0078] In the radiation detector 1 , the resin frame 30 may also contain a filler made of an inorganic material. In this case, moisture resistance is improved. Furthermore, the resin frame 30 may also contain a pigment that is reflective or absorptive to at least the scintillation light generated by the scintillator layer 12 . In this case, optical properties are improved.

[0079] Furthermore, in the radiation detector 1, a protective layer 22 is formed on the mounting surface 21. This improves the reliability of the sensor panel. Furthermore, in the radiation detector 1, the scintillator panel 10 includes a protective layer 19 formed on the first side surface 11s and the second side surface 12s. This more reliably prevents damage and moisture intrusion from the sides.

[0080] On the other hand, in the method for manufacturing the radiation detector 1 of this embodiment, the scintillator panel 10 is mounted on the sensor panel 20 such that its scintillator layer 12 faces the mounting surface 21 of the sensor panel 20. In particular, in the scintillator panel 10, the first side surface 11s, which is a side surface of the support body 11, and the second side surface 12s, which is a side surface of the scintillator layer 12, are located on the same plane. In other words, when viewed from the second direction, the scintillator layer 12 is provided on the entire surface of the support body 11, thereby increasing the effective area.

[0081] On the other hand, in such a structure, the boundary between the support body 11 and the scintillator layer 12, or the boundary between the scintillator layer 12 and the sensor panel 20, is susceptible to damage from the side. In contrast, in this manufacturing method, the resin frame 30 is formed in a manner that extends from at least the mounting surface 21 of the sensor panel 20 to the first side surface 11s of the support body 11, thereby sealing the scintillator layer 12. Therefore, damage to the boundary and the second side surface 12s, which is the side surface of the scintillator layer 12, is avoided. In addition, at the same time, the moisture resistance of the scintillator layer 12 is improved, and peeling due to thermal expansion difference / warping is suppressed. That is, through this manufacturing method, as described above, a radiation detector 1 can be manufactured that increases the effective area while ensuring reliability.

[0082] In the manufacturing method of this embodiment, in the fourth step, the resin frame 30 may be formed by applying and curing the resin 51 multiple times. In this case, the overlapping portion 30d of the multiple portions 30a and 30b constituting the resin frame 30 can be formed by applying and curing the resin 51 once and then applying and curing the resin 51 again.

[0083] The above embodiment is an explanation of one aspect of the present disclosure. Therefore, the present disclosure is not limited to the above embodiment, and various modifications are possible.

[0084] For example, in the method for manufacturing the radiation detector 1, in the fourth step, the resin frame 30 can be formed by applying and curing the resin 51 using a mold frame that is positioned on the mounting surface 21 so as to surround the scintillator panel 10 while being separated from the scintillator panel 10 as viewed from the second direction intersecting the second surface 11b of the support body 11. In this case, the formation of dripping portions of the resin 51 can be suppressed. Furthermore, in the fourth step, the resin frame 30 can be formed by applying and curing the resin 51 once, rather than being limited to multiple applications and curing steps.

[0085] In the radiation detector 1 , the structure of the support 11 is arbitrary and is not limited to the stacked structure of the first flexible support 13 , the inorganic layer 15 , and the second flexible support 14 .

[0086] Industrial applicability

[0087] According to the present disclosure, a radiation detector capable of increasing the effective area while ensuring reliability and a method of manufacturing the radiation detector are provided.

[0088] Explanation of symbols

[0089] 1...radiation detector; 10...scintillator panel; 11...support body; 11a...first surface; 11b...second surface; 11s...first side surface; 12...scintillator layer; 12s...second side surface; 13...first flexible support body; 13b...third surface; 14...second flexible support body; 14a...fourth surface; 15...inorganic layer; 16, 17, 23...adhesive layer; 18, 19, 22...protective layer; 20...sensor panel; 21...mounting surface; 30...resin frame; 33...inner edge; 34...outer edge.

Claims

1. A radiation detector, wherein: A radiation detector comprising: a sensor panel, a scintillator panel, and a resin frame provided over the sensor panel and the scintillator panel. The sensor panel has a mounting surface on which the scintillator panel is mounted. The scintillator panel comprises: A support having a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface; and a scintillator layer formed on the first surface, including a plurality of columnar crystals, and The scintillator panel is mounted on the mounting surface such that the scintillator layer and the first surface face the mounting surface. The scintillator layer has a second side surface extending so as to be located on the same plane as the first side surface. The resin frame seals the scintillator layer by extending at least from the mounting surface to the first side surface when viewed from a first direction intersecting the first side surface and the second side surface. The resin frame includes an inner edge located on the second surface and an outer edge located outside the second surface when viewed from a second direction intersecting the second surface, and contributes to fixing the scintillator panel and the sensor panel. A distance from the inner edge of the resin frame to the peripheral edge of the second surface is not more than twice a distance from the peripheral edge of the second surface to the outer edge.

2. The radiation detector according to claim 1, wherein The support body has: a first flexible support having the first surface and a third surface opposite to the first surface; a second flexible support having the second surface and a fourth surface opposite to the second surface; and an inorganic layer provided between the third surface and the fourth surface, The resin frame extends from at least the mounting surface to the fourth surface when viewed from the first direction, thereby sealing the inorganic layer.

3. The radiation detector according to claim 1 or 2, wherein: The resin frame extends from the mounting surface to a peripheral edge portion of the second surface.

4. The radiation detector according to any one of claims 1 to 3, wherein The resin frame includes at least one overlapping portion composed of a plurality of parts arranged along the first side surface and the second side surface, wherein one of the parts overlaps with the other parts.

5. The radiation detector according to any one of claims 1 to 3, wherein A ratio of the width of the resin frame from the first side surface, assuming that the height of the resin frame from the mounting surface is 1, is greater than or equal to 0.1 and less than or equal to 12.

5.

6. The radiation detector according to any one of claims 1 to 5, wherein An adhesive layer is provided, which is interposed between the mounting surface and the scintillator panel and bonds the sensor panel and the scintillator panel to each other.

7. The radiation detector according to any one of claims 1 to 6, wherein The resin frame includes a filler material made of an inorganic material.

8. The radiation detector according to any one of claims 1 to 7, wherein The resin frame includes a pigment having reflective or absorptive properties with respect to at least scintillation light generated in the scintillator layer.

9. The radiation detector according to any one of claims 1 to 8, wherein A protective layer is formed on the mounting surface.

10. The radiation detector according to any one of claims 1 to 9, wherein The scintillator panel includes a protective layer formed on the first side surface and the second side surface.

11. A method for manufacturing a radiation detector, wherein: have: A first step of preparing a scintillator panel having a support and a scintillator layer formed on the support; A second step of preparing a sensor panel including a photoelectric conversion element; a third step of mounting the scintillator panel on the sensor panel so that the scintillator layer faces the sensor panel; and After the third step, a fourth step is performed to provide a resin frame over the sensor panel and the scintillator panel. The support body has a first surface on which the scintillator layer is formed, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. The scintillator layer has a second side surface extending so as to be located on the same plane as the first side surface. The sensor panel has a mounting surface on which the scintillator panel is mounted. In the fourth step, the resin is applied and cured on at least the mounting surface, the first side surface, and the second side surface, so that the resin frame is formed in a manner that extends from at least the mounting surface to the first side surface when viewed from a first direction intersecting the first side surface and the second side surface, thereby sealing the scintillator layer. The resin frame includes an inner edge located on the second surface and an outer edge located outside the second surface when viewed from a second direction intersecting the second surface, and contributes to fixing the scintillator panel and the sensor panel. A distance from the inner edge of the resin frame to the peripheral edge of the second surface is not more than twice a distance from the peripheral edge of the second surface to the outer edge.

12. The method for manufacturing a radiation detector according to claim 11, wherein: In the fourth step, the resin frame is formed by applying and curing the resin a plurality of times.

13. The method for manufacturing a radiation detector according to claim 11 or 12, wherein: In the fourth step, the resin is applied and cured using a mold frame arranged on the mounting surface so as to surround the scintillator panel while being separated from the scintillator panel when viewed from a second direction intersecting the second surface, thereby forming the resin frame.

14. The method for manufacturing a radiation detector according to any one of claims 11 to 13, wherein: In the third step, the scintillator panel is mounted on the sensor panel via an adhesive layer.

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