Temperature regulation test device for memory module and memory module test device using the above test device

Abstract

The present invention relates to a temperature regulation test unit for a memory module and a memory module test device using the above test unit. The present invention includes: a test board part installed in a test space, divided into a plurality of memory module installation areas, and a plurality of memory modules can be installed in the plurality of memory module installation areas; a test box part formed to surround the memory module installation areas; a control box part disposed above the test box part and capable of moving up and down, for covering the memory module installation areas together with the test box part; a driving part; a rotating shaft part that rotates as the driving part rotates; a pinion gear part that rotates as the rotating shaft part rotates; a rack gear part installed in such a way that the control box part moves up and down by receiving the rotational force of the rotating shaft; and a temperature control part for detecting and setting the internal temperature of the control box part, including a Peltier element.

Description

Technical Field

[0001] The present invention relates to a memory module temperature adjustment test device and a memory module test device using the above test device. In particular, it relates to a memory module temperature adjustment test device capable of temperature control and a memory module test device using the above test device. Background Art

[0002] Generally, compared with general server computers, desktop computers, or laptop computers, etc., general server computers use relatively more memory, and mainly use memories such as registered dual in-line memory modules (R-DIMMs).

[0003] In particular, in the above server computer, a memory area including a plurality of memory slots for installing a plurality of memories is provided, and a memory module including a memory and a temperature detection element (e.g., a thermal diode <Thermal diode>) is installed in the above memory area.

[0004] The above memory module performs data processing operations such as reading, writing, or storing data by being controlled by a central processing unit (CPU) installed in the motherboard of the above server computer.

[0005] Moreover, it is well known that memory modules used in personal computers (PCs) or servers recently are used to process complex and important data, so high reliability is required. Therefore, in order to meet the above requirements, it is necessary to check for defects in all active and passive chips (chips) including the memory used in the memory module and various problems that may occur during module assembly by performing a burn-in (aging) test at a certain high temperature in advance.

[0006] A temperature control device for performing a memory test for a server computer is disclosed in Korean Registered Patent No. 10-1940223 (announced on April 11, 2019, hereinafter referred to as Patent Document 1).

[0007] However, when Patent Document 1 simultaneously tests a plurality of memories, even when the target control temperature value is reached, the temperatures at each position are inconsistent due to the different positions of the above plurality of memories, which further leads to a problem of a decrease in the reliability of the test results.

[0008] In addition, Patent Document 1 takes a considerably long time to change from a preset temperature to the initial temperature before the test. Therefore, it is difficult to quickly perform tests under other conditions, resulting in the problem that it is difficult to perform the test within a preset time.

[0009] Prior art document

[0010] Patent document

[0011] (Patent Document 0001) Korean Registered Patent No. 10-1940223 Summary of the invention

[0012] The present invention aims to solve the above-mentioned existing problems. The object of the present invention is to provide a temperature adjustment test device for a memory module that can more accurately control the temperature by dividing the position where the memory module is installed into multiple regions and using multiple lower side air supply fans, and a memory module test device using the above test device.

[0013] Another object of the present invention is to provide a temperature adjustment test device for a memory module that enables a user to quickly and real-time confirm the temperature corresponding to each memory region by using a temperature display part exposed to the outside without the need for a separate display component, thereby quickly controlling the temperature of each memory region, and a memory module test device using the above test device.

[0014] Yet another object of the present invention is to provide a temperature adjustment test device for a memory module that can quickly complete initialization, that is, quickly change its temperature after completing a certain test, and thereby shorten the time until the next test is performed, and a memory module test device using the above test device.

[0015] In order to achieve the object of the present invention as described above, a temperature regulation test device for a memory module according to an embodiment of the present invention includes: a test board unit installed in a test space and partitioned to form a plurality of memory module installation areas independently for installing memory modules; a test box unit disposed above the test board unit and forming a test space by selectively surrounding any one or more of the plurality of memory module installation areas; a storage unit for storing the process and results of testing the memory module in the test space by the test board unit and the test box unit; and a control unit for controlling the test board unit, the test box unit, and the storage unit; wherein the test box unit includes: a support board unit formed with through holes through which the plurality of memory modules installed in the test board unit can pass and disposed above the test board unit; a covering unit for covering the plurality of memory modules passing through the through holes of the support board unit together with the support board unit; and a Peltier unit including a thermoelectric element for performing heat exchange to regulate the temperature of the test space; wherein the control unit can control the temperatures of the plurality of memory module installation areas respectively according to the user's selection.

[0016] In the temperature regulation test device for a memory module according to an embodiment of the present invention, the covering unit may include: a control box unit disposed above the test box unit and movable up and down for covering the memory module installation area together with the test box unit; a driving unit for receiving external power supply and rotating; a rotating shaft unit rotating with the rotation of the driving unit by being installed in the driving unit; a pinion gear unit penetrated by the rotating shaft unit and rotating with the rotation of the rotating shaft unit; a rack and gear unit installed in such a way as to move the control box unit up and down by receiving the rotational force of the rotating shaft; and a temperature control unit for detecting and setting the internal temperature of the control box unit and including a Peltier element.

[0017] In the temperature regulation test device for a memory module according to an embodiment of the present invention, the test board unit may further include: a memory slot for installing the memory module; and a locking member for preventing the memory module installed in the memory slot from detaching.

[0018] In the temperature regulation test device for a memory module according to an embodiment of the present invention, the test box unit may further include: a radiator unit for absorbing or dissipating the heat inside the test space.

[0019] In the temperature regulation test device of a memory module to which one embodiment of the present invention is applied, the above-mentioned test chamber unit may further include: a blower fan unit that induces circulation of the air inside the test space and thereby induces temperature conversion inside the test space by forming a flow of air from the upper part to the lower part of the memory module installation area.

[0020] In the temperature regulation test device of a memory module to which one embodiment of the present invention is applied, the above-mentioned test chamber unit may further include: a cooling unit that is disposed above the Peltier unit and through which cooling water can move.

[0021] In the temperature regulation test device of a memory module to which one embodiment of the present invention is applied, the above-mentioned cooling unit may further include: a cooling water inlet through which cooling water can flow in from the outside; a cooling pipe having one end communicated with the cooling water inlet and formed by being bent multiple times in a U shape; and a cooling water outlet communicated with the other end of the cooling pipe for discharging the cooling water inside the cooling pipe.

[0022] In the temperature regulation test device of a memory module to which one embodiment of the present invention is applied, it may further include: a cooling water meter for measuring the flow of the cooling water supplied to the above-mentioned cooling unit; and a cooling water filter for filtering foreign matters contained in the cooling water supplied to the above-mentioned cooling unit.

[0023] In the temperature regulation test device of a memory module to which one embodiment of the present invention is applied, the above-mentioned control unit may select the test conditions that were executed last time from the above-mentioned storage unit and set the test conditions without the user changing the test conditions.

[0024] In the temperature regulation test device of a memory module to which one embodiment of the present invention is applied, the above-mentioned control unit may select the test conditions required by the user from a plurality of test conditions stored in the above-mentioned storage unit and set the test conditions.

[0025] In the temperature regulation test device of a memory module to which one embodiment of the present invention is applied, the above-mentioned test conditions required by the user may be test conditions that are preset according to the expected place or environment where the corresponding memory module model is actually installed.

[0026] In the temperature regulation test device of a memory module to which one embodiment of the present invention is applied, the above-mentioned storage unit may store the conditions that change during the execution of the test of the above-mentioned memory module.

[0027] In the temperature regulation test device of a memory module to which an embodiment of the present invention is applied, when an abnormality or error of the memory module occurs during the process of setting any test condition and testing the memory module, the control unit may abort the ongoing test and record the test condition or the change process of the test condition up to the occurrence of the abnormality or error in the storage unit, and then retest the memory module with the abnormality or error under the same test conditions.

[0028] In the temperature regulation test device of a memory module to which an embodiment of the present invention is applied, when an abnormality or error of the memory module occurs during the process of setting any test condition and testing the memory module, the control unit may abort the ongoing test and record the test condition or the change process of the test condition up to the occurrence of the abnormality or error in the storage unit, and then, in the case of testing the corresponding model of the memory module with the abnormality or error, the test may be performed after resetting the test condition or the change process of the test condition up to the occurrence of the abnormality or error.

[0029] In order to achieve the object of the present invention as described above, a memory module testing device of a temperature regulation testing device using a memory module according to an embodiment of the present invention may include: a housing unit having a testing space therein for testing a memory module; a temperature regulation testing device disposed inside the housing unit, including a test board unit disposed in the testing space, a test chamber unit disposed above the test board unit and formed to surround the memory module installation area, a storage unit for storing the process and results of testing the memory module in the testing space for the test board unit and the test chamber unit, and a control unit for controlling the test board unit, the test chamber unit, and the storage unit to test the memory module; a cooling water supply unit disposed on one side of the housing unit for reducing the rising temperature by supplying cooling water to the testing space or the temperature regulation testing device; an air supply unit disposed on one side of the housing unit for supplying air for raising and lowering the temperature of the testing space or the temperature regulation testing device; an alarm unit disposed on one side of the housing unit for notifying the outside of the testing status in the testing space by sound or visually; a universal serial bus (USB) port unit disposed on one side of the housing unit for making an electrical connection for data transfer with an external electronic device; a display unit disposed on one side of the housing unit for visually displaying the memory module testing status of the temperature regulation testing device or the internal status of the housing for easy identification by the user with the naked eye; and a keyboard video monitor mouse (KVM) switching unit disposed on one side of the housing unit for controlling the temperature regulation testing device.

[0030] In the memory module testing device of a temperature regulation testing device using a memory module according to an embodiment of the present invention, the cooling water supply unit may further include: a cooling water meter installed in the housing unit for measuring the flow of the supplied cooling water; and a cooling water filter installed in the housing unit for filtering foreign substances when supplying cooling water.

[0031] In the memory module testing device of a temperature regulation testing device using a memory module according to an embodiment of the present invention, the alarm unit may include: an emergency stop button composed of an emergency stop (EMO) switch that stops all functions when pressed by the user in a critical situation; an alarm setting button for the user to set an alarm; and an alarm reset button for resetting the alarm set by the user.

[0032] In the memory module test device of the temperature regulation test device using a memory module according to an embodiment of the present invention, the test space may further include: a shelf for supporting the temperature regulation test device on the lower side of the temperature regulation test device, and can be slid to the outside of the housing according to the user's selection.

[0033] The present invention divides the positions for installing memory modules into multiple regions and can separately adjust the temperature of each region, so that tests under multiple different conditions can be performed simultaneously.

[0034] The present invention uses Peltier elements in each memory module installation region, so that temperature control can be achieved more accurately.

[0035] After completing a certain test, the present invention quickly completes initialization, that is, quickly changes its temperature and thereby shortens the time until the next test is executed. Therefore, more test opportunities can be obtained within a preset period, and rapid testing can be achieved by increasing the test speed. Description of the Drawings

[0036] Figure 1 It is a schematic perspective view of a memory module test device of a temperature regulation test unit using a memory module according to an embodiment of the present invention.

[0037] Figure 2 It is Figure 1 front view.

[0038] Figure 3 It is a front view of a temperature regulation test unit of a memory module according to an embodiment of the present invention.

[0039] Figure 4 It is an internal perspective view of a temperature regulation test unit of a memory module according to an embodiment of the present invention.

[0040] Figure 5 It is a schematic diagram illustrating the sliding working state of a temperature regulation test unit of a memory module according to an embodiment of the present invention.

[0041] Figure 6 It is a schematic diagram illustrating the working state of a temperature regulation test unit of a memory module according to an embodiment of the present invention.

[0042] Figure 7 It is for Figure 6 illustrating the front state when the control box in slides up and down.

[0043] Figure 8 It is a schematic diagram illustrating the test board of a temperature regulation test unit of a memory module according to an embodiment of the present invention.

[0044] Figure 9 It is a schematic diagram showing the state of mounting test items on the upper part of the test board of the temperature regulation test unit of the memory module to which one embodiment of the present invention is applied.

[0045] Figure 10 It is a perspective view of the temperature regulation test unit of the memory module to which one embodiment of the present invention is applied.

[0046] Figure 11 It is a rear view of the covering part of the temperature regulation test unit of the memory module to which one embodiment of the present invention is applied.

[0047] Figure 12 It is a side view showing the interior of the temperature regulation test unit of the memory module to which one embodiment of the present invention is applied.

[0048] Figure 13 It is an inclined bottom view of the temperature regulation test unit of the memory module to which one embodiment of the present invention is applied.

[0049] Figure 14 It is a plan view showing the cooling part of the temperature regulation test unit of the memory module to which one embodiment of the present invention is applied.

[0050] Explanation of reference numerals

[0051] 100: Housing unit

[0052] 200: Temperature regulation test unit

[0053] 210: Test board part

[0054] 211: Memory module installation area

[0055] 212: First memory module installation area

[0056] 212a: Memory slot

[0057] 212b: Locking part

[0058] 213: Second memory module installation area

[0059] 213a: Memory slot

[0060] 213b: Locking part

[0061] 214: Third memory module installation area

[0062] 214a: Memory slot

[0063] 214b: Locking part

[0064] 220: Test box part

[0065] 221: Support plate part

[0066] 221a: Support rod

[0067] 221b: Through hole

[0068] 222: Radiator part

[0069] 223: Air supply fan part

[0070] 224: Cooling part

[0071] 224a: Cooling water inlet

[0072] 224b: Cooling pipe

[0073] 224c: Cooling water outlet

[0074] 224d: Cooling water meter

[0075] 224e: Cooling water filter

[0076] 225: Temperature display part

[0077] 225a: First memory temperature display part

[0078] 225b: Second memory temperature display part

[0079] 225c: Third memory temperature display part

[0080] 226: Lower air supply fan

[0081] 227: Peltier part

[0082] 230: Control box part

[0083] 240: Driving part

[0084] 250: Rotating shaft part

[0085] 260: Pinion part

[0086] 270: Rack and pinion part

[0087] 280: Temperature control part

[0088] 290: Shelf

[0089] 291: Handle

[0090] 300: Cooling water supply unit

[0091] 400: Gas supply unit

[0092] 500: Alarm unit

[0093] 510: Emergency Stop Button

[0094] 520: Alarm Setting Unit

[0095] 530: Alarm Reset Unit

[0096] 600: Universal Serial Bus (USB) Port Unit

[0097] 700: Display Unit

[0098] 800: Keyboard Video Mouse (KVM) Switching Unit Detailed Implementation Manner

[0099] Next, some embodiments to which the present invention is applicable will be described in detail with reference to the exemplary drawings. It should be noted that in the process of assigning reference signs to the components of each drawing, the same reference signs are assigned to the same components as much as possible even if they are shown in different drawings. In addition, in the process of describing the embodiments to which the present invention is applicable, when it is determined that a detailed description of a related well-known component or function may impede the understanding of the embodiments to which the present invention is applicable, the detailed description thereof will be omitted.

[0100] In addition, in the process of describing the components of the embodiments to which the present invention is applicable, terms such as first, second, A, B, (a), and (b) may be used. However, the above terms are only used to distinguish the above components from other components, and the nature, order, or sequence of the corresponding components is not limited by the above terms. When a component is described as "connected", "coupled", or "contacted" with another component, the above component may be directly connected or contacted with the above other component, but it should be understood that there may be other components "connected", "coupled", or "contacted" between the respective components.

[0101] Next, a temperature regulation test unit of a memory module according to an embodiment to which the present invention is applicable will be described with reference to the drawings.

[0102] In the process of describing an embodiment to which the present invention is applicable, the content related to the memory module test unit will be included in the description of the memory module test device.

[0103] Figure 1 is a schematic perspective view of a memory module test device using a temperature regulation test unit of a memory module according to an embodiment to which the present invention is applicable, Figure 2 is Figure 1 front view of Figure 3 is a front view of a temperature regulation test unit of a memory module according to an embodiment to which the present invention is applicable, Figure 4is an internal perspective view of a temperature regulation test unit of a memory module to which one embodiment of the present invention is applicable, Figure 5 is a schematic diagram illustrating a sliding operating state of a temperature regulation test unit of a memory module to which one embodiment of the present invention is applicable, Figure 6 is a schematic diagram illustrating an operating state of a temperature regulation test unit of a memory module to which one embodiment of the present invention is applicable, Figure 7 is for Figure 6 is a schematic diagram illustrating a front state when the control box in Figure 8 is a schematic diagram illustrating a test board of a temperature regulation test unit of a memory module to which one embodiment of the present invention is applicable, Figure 9 is a schematic diagram illustrating a state in which test items are installed on the upper part of a test board of a temperature regulation test unit of a memory module to which one embodiment of the present invention is applicable.

[0104] Refer to Figures 1 to 2 , a memory module test device using a temperature regulation test unit of a memory module to which one embodiment of the present invention is applicable may include a housing unit 100, a temperature regulation test unit 200, a cooling water supply unit 300, a gas supply unit 400, an alarm unit 500, a universal serial bus (USB) port unit 600, a display unit 700, and a keyboard-video-mouse (KVM) switch unit.

[0105] In one embodiment of the present invention, it is possible to perform a reliability test while controlling the temperature of a registered dual in-line memory module (R-DIMM) used in a server-class personal computer (PC) as an object.

[0106] The housing unit 100 has a hexahedral shape and may be equipped with a test space inside for testing a memory module.

[0107] Inside the above test space, a temperature regulation test unit 200 described later may be configured, and the temperature regulation test unit 200 may be exposed on the front.

[0108] In the drawings, a case where six of the above test spaces and temperature regulation test units 200 are respectively equipped is illustrated, but this is only one embodiment, and the number is not particularly limited and may be equipped in different numbers according to the intention of the manufacturer.

[0109] The temperature regulation test unit 200 may be configured inside the housing unit 100, that is, in the above test space.

[0110] Refer to Figures 3 to 4, the temperature adjustment test unit 200 may include a test board part 210, a test box part 220, a control box part 230, a driving part 240, a rotating shaft part 250, a pinion part 260, a rack and gear part 270, and a temperature control part 280.

[0111] The temperature adjustment test unit 200 may include a test board part 210, and may perform a reliability test by arranging a memory module on the upper part of the test board part 210. At this time, the test board part 210 is preferably an ethylene / vinyl acetate copolymer board (EvaBoard).

[0112] Refer to Figure 5 , at least three memory module installation areas 212, 213, 214 may be formed in the test board part 210. The memory module installation area 211 may be divided into the first to third memory module installation areas 212, 213, 214, and a plurality of memory slots 212a, 213a, 214a for installing memory modules may be respectively provided in the first to third memory module installation areas 212, 213, 214. As Figure 5 shown, three memory slots 212a, 214a may be provided in the first and third memory module installation areas 212, 214, and six memory slots 213a may be provided in the second memory module installation area 213a.

[0113] Refer to Figure 4 and Figure 6 , locking members 212b, 213b, 214b may be arranged in the respective memory module installation areas 212, 213, 214 of the test board part 210 to fix the memory modules. The locking members 212b, 213b, 214b may prevent the memory modules from detaching by being arranged at the ends in the length direction of the respective slots.

[0114] Refer back to Figure 4 , the lower side air supply fan 226 may be arranged between the first and second memory module installation areas 212, 213 and between the second and third memory module installation areas 213, 214. The lower side air supply fan 226 may inject the air flowing in from the air supply unit 400 described later.

[0115] Refer to Figure 6 , the test box part 220 may be arranged on the upper part of the test board part 210. The test box part 220 may be formed so as to respectively surround the memory module installation areas 212, 213, 214.

[0116] A temperature display part 225 may be arranged in a part of the test box part 220, that is, a part of the frame (without a reference symbol).

[0117] As the temperature display unit 225, the first to third temperature display units 225a, 225b, and 225c can be arranged corresponding to the positions of the first to third memory module installation areas 212, 213, and 214.

[0118] As Figure 3 shown, the temperature display unit 225 can be arranged on the upper side of the test board unit 210, but can also be installed at various different positions as an option for the manufacturer. However, considering the visibility for the user, it is advisable to install them respectively at positions corresponding to the first to third memory module installation areas 212, 213, and 214.

[0119] Refer back to Figure 3 and Figure 4 , the temperature adjustment test unit 200 can include a control box unit 230. The control box unit 230 can be arranged on the upper part of the test box unit 220.

[0120] The control box unit 230 can be provided in a manner corresponding to each of the memory module installation areas 212, 213, and 214. That is, when three memory module installation areas are provided in a certain test board unit 210, three control box units 230 can also be provided in a manner corresponding to the sizes of the memory module installation areas. Thus, when the number of memory modules to be tested is relatively small, if there are memory module installation areas where no memory modules are installed, memory modules can be installed only in a part of the memory module installation areas with the above areas left vacant and the test can be performed only using the corresponding control box units 230. In the drawings, the case where the control box unit 230 covers all three memory module installation areas 212, 213, and 214 is illustrated, but this is only one embodiment, and the present invention is not limited thereto, but should be understood as providing control box units 230 corresponding to each of the memory module installation areas 212, 213, and 214.

[0121] The control box unit 230 can move up and down by the interlocking of a driving unit 240, a rotating shaft unit 250, a pinion 260, and a rack and pinion unit 270 which will be described later. When the control box unit 230 rises, the memory module installation area 221 will be exposed to the outside and open at the top, and when the control box unit 230 descends, it can enclose or cover the memory module installation area 221 together with the test box unit 220.

[0122] In the process of describing an embodiment to which the present invention is applied, detailed information related to the test board unit 210 and the test box unit 220 of the temperature adjustment test unit 200 will be described in the subsequent content.

[0123] The driving unit 240 can receive power supply and perform a rotational motion.

[0124] One end of the rotating shaft portion 250 can receive the transmitted rotational motion of the driving portion 240 by being connected to the driving portion 240. That is, the rotating shaft portion 250 can rotate as the driving portion 240 rotates.

[0125] A pinion portion 260 can be installed in the rotating shaft portion 250. In other words, the rotating shaft portion 250 can pass through the pinion portion 260 and rotate as the rotating shaft portion 250 rotates.

[0126] The other end of the rotating shaft portion 250 can be connected to the control box portion 230. At this time, a rack and pinion portion 270 can be installed in the control box portion 230. The rack and pinion portion 270 can convert the rotational motion of the driving portion 240, the rotating shaft portion 250, and the pinion portion 260 into a linear motion in the up and down direction. That is, the length direction of the rack and pinion portion 270 is the same as the up and down direction of the control box portion 230, so that the control box portion 230 can move up and down by engaging with the pinion portion 260.

[0127] A temperature control portion 280 can be provided on one side of the control box portion 230. The temperature control portion 280 can check the internal temperature of the control box portion 230, that is, the internal temperature of the memory module installation area 211, and set the temperature according to the user's intention. The temperature control portion 280 can include a Peltier element. For reference, although not described in the above content, it should be understood that temperature sensors (not shown) for detecting the temperatures of the respective memory module installation areas 212, 213, 214 are arranged in any one or more of the test board portion 210, the test box portion 220, and the control box portion 230. In addition, the temperature control portion 280 can inject air using the lower side air blower 222 until the temperature of the memory module installation area 211 reaches the temperature set according to the user's intention.

[0128] At this time, the air injected by the lower side air blower 22 can be higher or lower than the normal temperature (25 °C). For example, when the user needs to lower the temperatures of the memory module installation areas 212, 213, 214, air lower than the above normal temperature or cooling water described later can be injected, and when the temperature of the memory module installation areas 212, 213, 214 needs to be increased, air higher than the above normal temperature can be injected.

[0129] For reference, the temperature control portion 280 can vary the temperatures of the memory module installation areas 212, 213, 214 within the range of 0 to 90 °C. In addition, in one embodiment to which the present invention is applied, it can be heated from the above normal temperature to 85 °C within 5 minutes by the method described above, or cooled from the above normal temperature to 5 °C within 10 minutes.

[0130] Furthermore, the temperature control unit 280 can also check the outflow of the supplied cooling water.

[0131] The temperature adjustment test unit 200 may further include a shelf 290.

[0132] As Figure 1 and Figure 2 shown, in one embodiment of the present invention, 6 such test spaces can be provided and 6 temperature adjustment test units 200 can be provided accordingly. Each temperature adjustment test unit 200 can be slid from the inside of the housing unit 100 to the outside by means of the shelf 290. The shelf can support the temperature adjustment test unit 200 on the lower side in the above-mentioned test space. At this time, a handle 291 can be provided on the shelf 290, and the user can pull out the temperature adjustment test unit 200 from the housing unit 100 by holding and pulling the handle 291.

[0133] Refer to Figure 7 and Figure 8 , after the user holds the handle 291 and pulls the shelf 290 out to the outside, the memory module can be installed in the memory slots 212a, 213a, 214a and fixed by using the locking member 224 to prevent it from detaching. In addition, after the user holds the handle 291 and pushes the shelf 290 into the inside of the housing unit 100, when the user presses the start button (not shown) to start the test, the control box unit 230 will descend and overlap with the test box unit 220, so as to form and cover a three-dimensional space in the memory module installation area 211. Next, the temperature control unit 280 can adjust the temperature of the memory module installation areas 212, 213, 214 and perform other tests.

[0134] A memory module test device using a temperature adjustment test unit for a memory module according to an embodiment of the present invention may include a cooling water supply unit 300.

[0135] The cooling water supply unit 300 can be provided on one side of the housing unit 100. The purpose of the cooling water supply (Power Supply Cooling Water, PCW) is to cool the heat generated during the process of the temperature adjustment test unit 200 performing the memory module test. That is, the rising temperature in the above-mentioned test space or the temperature adjustment test unit 200 can be reduced by supplying cooling water.

[0136] The air supply unit 400 can be provided on one side of the housing unit 100. The air supply unit 400 is used to raise or lower the temperature of the memory module installation area 211 by supplying air to the above-mentioned test space or test unit.

[0137] The alarm unit 500 can be equipped on one side of the housing unit 100. The temperature adjustment test unit 200 can notify the outside of the test condition of the memory module in the memory module installation area 211 by sound or visually.

[0138] The alarm unit 500 can include an emergency stop button, an alarm setting button 520, and an alarm reset button 530.

[0139] The emergency stop button 510 can stop all functions when pressed by the user in a critical situation that occurs during the memory module test. The emergency stop button 510 is preferably an emergency off (EMO) switch.

[0140] The alarm setting button 520 can select the condition that the user needs to confirm by pressing and set the corresponding alarm.

[0141] The alarm reset button 530 can reset the alarm preset by the user by pressing.

[0142] Although not shown, the alarm unit 500 can be equipped with a speaker (not shown) or an indicator light (not shown), etc., so that the sound related to the corresponding condition can be played through the above speaker or various lights can be emitted through the above indicator light. That is, the alarm unit 500 can enable the user to recognize the test condition of the memory module by auditory or visual means.

[0143] The universal serial bus (USB) port unit 600 is configured on one side of the housing unit 100 and can perform data transfer with an external electronic device (not shown) formed with a universal serial bus (USB) terminal that is electrically connected by inserting into the universal serial bus (USB) port.

[0144] The display unit 700 can be configured on one side of the housing unit 100. The display unit 700 can visually display for the convenience of the user to recognize the memory module test condition of the temperature adjustment test unit 200 or the internal condition of the housing unit 100 by the naked eye. In addition, the user can only confirm the test result of the memory module through the display unit 700 by the naked eye and display the statistical information in the form of a chart.

[0145] In addition, the display unit 700 can also be composed of a touch screen.

[0146] A Keyboard, Video, Mouse (KVM) switch unit 800 can be configured on one side of the housing unit 100. Keyboard, Video, Mouse (KVM) refers to a Keyboard, a Video Monitor, and a Mouse. The Keyboard, Video, Mouse (KVM) switch can transfer and receive data with an external electronic device through a Universal Serial Bus (USB) port unit 600.

[0147] Figure 10 is a perspective view of a temperature regulation test unit of a memory module according to an embodiment of the present invention. Figure 11 is a rear view of a cover part of a temperature regulation test unit of a memory module according to an embodiment of the present invention. Figure 12 is a side view illustrating the interior of a temperature regulation test unit of a memory module according to an embodiment of the present invention. Figure 13 is a bottom perspective view of a temperature regulation test unit of a memory module according to an embodiment of the present invention. Figure 14 is a plan view illustrating a cooling part of a temperature regulation test unit of a memory module according to an embodiment of the present invention.

[0148] Refer to Figures 10 to 14 , a temperature regulation test unit of a memory module according to an embodiment of the present invention may include a test board part 210, a test box part 220, a storage part (not shown), and a control part (not shown).

[0149] The test board part 210 can be installed in a test space. The test board part 210 can be divided into multiple memory module installation areas 212, 213, and 214. Multiple memory modules can be installed in the multiple memory module installation areas 212, 213, and 214.

[0150] At this time, memory slots 212a, 213a, and 214a and locking members 212b, 213b, and 214b can be configured in the multiple memory module installation areas 212, 213, and 214. Memory modules can be installed in the memory slots 212a, 213a, and 214a. The locking members 212b, 213b, and 214b can prevent the memory modules installed in the memory slots 212a, 213a, and 214a from detaching.

[0151] The test box part 220 can be configured above the test board part 210. The test box part 220 can form a test space by surrounding the multiple memory module installation areas 212, 213, and 214 respectively.

[0152] The test box part 220 may include a support board part 221, a cover part (without a reference symbol), and a Peltier part 227.

[0153] The support plate part 221 can be arranged on the upper part of the test plate part 210. In the support plate part 221, through holes 221b corresponding to the shapes and widths of the memory module installation areas 212, 213, 214 can be formed so that the test plate part 210, that is, the memory modules installed in the memory slots 212a, 213a, 214a and the locking parts 212b, 213b, 214b, can pass through. In addition, a support rod 221a is installed on the lower side of the support plate part 221, so that it is supported by the test plate part 210.

[0154] The above-mentioned covering part can cover the multiple memory modules passing through the support plate part 221 together with the support plate part 221.

[0155] The test box part 220 can also include a radiator part 222.

[0156] The radiator part 222 is arranged in a manner facing the memory modules installed in the memory module installation areas 212, 213, 214, and can absorb or dissipate the heat inside the above-mentioned test space.

[0157] The test box part 220 can also include a blower fan part 223. The blower fan part 223 is a different component from the lower blower fan 226 described above, and is installed on the lower side of the radiator part 222, and can blow air towards the memory modules installed in the memory module installation areas 212, 213, 214. At this time, the blown air will circulate between the support plate part 221 and the above-mentioned covering part, that is, inside the above-mentioned test space, so as to reduce the temperature of the above-mentioned memory modules. Next, the air with the rising temperature will rise along the wall surface of the above-mentioned covering part and be cooled by contacting the radiator part 222, and the radiator part 222 can receive the heat transferred from the above-mentioned air.

[0158] That is, the blower fan part 223 can form the flow of wind from the upper part to the lower part of the memory module installation areas 212, 213, 214 to circulate the air inside the above-mentioned test space and thereby induce the temperature conversion inside the above-mentioned test space.

[0159] The test box part 220 can also include a cooling part 224. The cooling part 224 can be located above the radiator part 222, especially above the Peltier part 227 to be described later. The cooling part 224 allows the cooling water supplied from the cooling water supply unit 300 to move, so as to cool the temperature inside the above-mentioned test space.

[0160] The cooling part 224 can include a cooling water inlet 224a, a cooling pipe 224b, and a cooling water outlet 224c.

[0161] Cooling water can flow in from the outside of the cooling water inlet 224a, i.e., from the cooling water supply unit 300.

[0162] One end of the cooling pipe 224b can communicate with the cooling water inlet 224a. In addition, the cooling pipe 224b can be formed by being bent multiple times in a U shape, whereby the cooling efficiency can be further improved by maximizing the contact area with the hot air in a minimum space.

[0163] The cooling water outlet 224c can communicate with the other end of the cooling pipe 224b to discharge the cooling water inside the cooling pipe 224b.

[0164] In addition, the cooling unit 224 can further include a cooling water gauge 224d and a cooling water filter 224e. Refer to Figure 1 , the cooling water gauge 224d and the cooling water filter 224e can be arranged inside the housing unit 100.

[0165] The cooling water gauge 224d can measure the flow of the cooling water supplied from the cooling water supply unit 300 to the cooling unit 224. For example, the cooling water gauge 224d can measure the flow rate per unit time.

[0166] The cooling water filter 224e can filter out foreign substances contained in the cooling water before the cooling water supplied to the cooling unit 224 reaches the cooling water inlet 224a.

[0167] The Peltier unit 227 can be arranged between the radiator unit 222 and the cooling unit 224. The Peltier unit 227 can adjust the temperature of the above-mentioned test space by using a thermoelectric element. In an embodiment of applying the present invention, the memory module installation area 211 of any one of the test board units 210 can be divided into 3 areas and thereby 3 test spaces are defined. Thereby, the memory modules arranged in each test space can be tested under mutually different conditions, and the temperatures of each memory module installation area 212, 213, 214 can be selectively controlled according to the user's selection.

[0168] An embodiment of applying the present invention can include a storage unit (not shown) and a control unit (not shown).

[0169] The above-mentioned storage unit can store the process and results of testing the memory module in the test space by the test board unit 210 and the test chamber unit 220 as data. That is, the above-mentioned storage unit can store all the processes and results of multiple executions of the test as data respectively. In addition, the above-mentioned storage unit can store the conditions that change during the execution of the test of the above-mentioned memory module.

[0170] The above control unit can control the test board unit 210, the test box unit 220, and the above storage unit. In addition, the above control unit can also control the control box unit 230, the drive unit 240, the rotating shaft unit 250, the pinion unit 260, the rack and pinion unit 270, and the temperature control unit 280 in the memory module test device of the temperature adjustment test unit using the memory module according to one embodiment of the present invention described above.

[0171] The temperature adjustment test unit of the memory module according to one embodiment of the present invention can set test conditions such as temperature, time, and pressure in advance before testing the memory module.

[0172] However, when the test is repeatedly executed because the test conditions are the same, or when the test conditions are changed because the user does not set separate test conditions, the above control unit can directly select the test conditions executed last time and set the test conditions to be executed.

[0173] In addition, the above control unit can select the test conditions required by the user from the multiple test conditions stored in the above storage unit and set the test conditions. That is, the above storage unit can store the data values of the test conditions in different situations in advance, and when the user selects the corresponding required test conditions, the above control unit can set the test conditions to be executed according to the selected test conditions. For example, for the memory module of model B delivered by Company A, the test conditions can be set and the memory module can be measured when the user selects test condition C. At this time, the test conditions required by the user, that is, the test conditions for testing the memory module of model B delivered by Company A, can be the test conditions set in advance according to the expected place or environment where the corresponding memory module is actually installed. That is, when the expected place or environment where the memory module of model B is installed is temperature D, the above test condition C can test the above memory module of model B on the premise of reacting to temperature D.

[0174] In addition, even if the test conditions stored in the above storage unit change during the test of the above memory module, the above control unit can adjust the test conditions. For example, when it is necessary to change the test conditions from temperature D to temperature E during the test, the above control unit can change the temperature during the execution of the test.

[0175] That is, the test conditions to be executed are stored in the above storage unit in the form of a script, and the above control unit can read the stored test conditions according to the user's selection and set them.

[0176] In addition, during the process of setting any one of the test conditions and testing the memory module, the control unit can abort the ongoing test when an abnormality or error occurs in the memory module.

[0177] In addition, the control unit can record the test conditions or the change process of the test conditions until the occurrence of the abnormality or error in the storage unit.

[0178] Next, the control unit can retest the memory module where the abnormality or error occurred under the same test conditions.

[0179] In addition, in the case of testing the corresponding model of the memory module where the abnormality or error occurred, the test can be performed after resetting the test conditions or the change process of the test conditions until the occurrence of the abnormality or error.

[0180] The content described above is only for implementing embodiments of the temperature adjustment test unit for the memory module to which the present invention is applicable and the memory module test device using the test unit. The present invention is not limited to the above-described embodiments, and the technical gist of the present invention should be understood to include various modified implementation schemes made by those with ordinary knowledge in the technical field to which the present invention belongs without departing from the gist of the present invention claimed in the appended claims.

Claims

1. A temperature regulation test device for a memory module, characterized in that Comprising: A test board part, installed in a test space, which is partitioned to form a plurality of independent memory module installation areas for installing memory modules; A test box part, disposed above the above-mentioned test board part, which forms a test space by selectively surrounding one or more of the above-mentioned plurality of memory module installation areas; A storage part, used for storing the process and results of testing the memory modules in the above-mentioned test space by the above-mentioned test board part and the above-mentioned test box part; And, A control part, used for controlling the above-mentioned test board part, the above-mentioned test box part and the above-mentioned storage part; Wherein, the above-mentioned test box part includes: A support board part, formed with through holes through which the above-mentioned plurality of memory modules installed in the above-mentioned test board part can pass through, and is disposed above the above-mentioned test board part; A covering part, used for covering the above-mentioned plurality of memory modules passing through the through holes of the support board part together with the above-mentioned support board part; and, A Peltier part, including a thermoelectric element for heat exchange to adjust the temperature of the above-mentioned test space; Wherein, the above-mentioned control part controls the temperatures of the above-mentioned plurality of memory module installation areas respectively according to the user's selection.

2. The temperature adjustment test device for a memory module according to claim 1, wherein: The above-mentioned covering part includes: A control box part, disposed above the above-mentioned test box part and capable of moving up and down, used for covering the above-mentioned memory module installation area together with the above-mentioned test box part; A driving part, used for receiving external power supply and rotating; A rotating shaft part, which rotates as the above-mentioned driving part rotates by being installed on the above-mentioned driving part; A pinion part, through which the above-mentioned rotating shaft part can pass through and rotates as the above-mentioned rotating shaft part rotates; A rack and gear part, installed in such a way that the above-mentioned control box part moves up and down by receiving the rotational force of the above-mentioned rotating shaft; and, A temperature control part, used for detecting and setting the internal temperature of the above-mentioned control box part, including a Peltier element.

3. The temperature adjustment test device for a memory module according to claim 1, wherein: The above-mentioned test board part further includes: A memory slot, used for installing the above-mentioned memory module; and, A locking part, used for preventing the memory module installed in the above-mentioned memory slot from detaching.

4. The temperature adjustment test device for a memory module according to claim 1, wherein: The above-mentioned test box part further includes: A radiator part, used for absorbing or dissipating the heat inside the above-mentioned test space.

5. The temperature adjustment test device for a memory module according to claim 1, wherein: The above-mentioned test box part further includes: An air supply fan part, which induces the air inside the above-mentioned test space to circulate by forming a flow of air from the upper part to the lower part of the above-mentioned memory module installation area and thereby induces the temperature conversion inside the above-mentioned test space.

6. The temperature adjustment test device for a memory module according to claim 1, wherein: The above-mentioned test box part further includes: A cooling part, disposed above the above-mentioned Peltier part and through which cooling water can move.

7. The temperature regulation test device for a memory module according to claim 6, wherein: The above cooling unit further includes: A cooling water inlet through which cooling water can flow in from the outside; A cooling pipe, one end of which is connected to the above cooling water inlet and is formed by being bent multiple times in a U shape; and A cooling water outlet, which is connected to the other end of the above cooling pipe and is used to discharge the cooling water inside the above cooling pipe.

8. The temperature regulation test device for a memory module according to claim 6, wherein It further includes: A cooling water meter for measuring the flow of the cooling water supplied to the above cooling unit; And A cooling water filter for filtering foreign substances contained in the cooling water supplied to the above cooling unit.

9. The temperature regulation test device for a memory module according to claim 1, wherein: The above control unit selects the test conditions that were executed last time from the above storage unit and sets the test conditions without the user changing the test conditions.

10. The temperature regulation test device for a memory module according to claim 1, wherein: The above control unit selects the test conditions required by the user from the multiple test conditions stored in the above storage unit and sets the test conditions.

11. The temperature regulation test device for a memory module according to claim 10, wherein: The above test conditions required by the user are the test conditions set in advance according to the expected place or environment where the corresponding memory module model is actually installed.

12. The temperature regulation test device for a memory module according to claim 1, wherein: The above storage unit stores the conditions that change during the execution of the test on the above memory module.

13. The temperature regulation test device for a memory module according to claim 1, wherein: When an abnormality or error of the above memory module occurs during the process of setting any test condition and testing the above memory module, the above control unit aborts the ongoing test and records the test conditions or the change process of the test conditions until the occurrence of the above abnormality or error in the above storage unit, and then tests the above memory module with the same abnormality or error again under the same test conditions.

14. The temperature regulation test device for a memory module according to claim 1, wherein: When an abnormality or error of the above memory module occurs during the process of setting any test condition and testing the above memory module, the above control unit aborts the ongoing test and records the test conditions or the change process of the test conditions until the occurrence of the above abnormality or error in the above storage unit, and then, when testing the corresponding model of the above memory module with the abnormality or error, after resetting the test conditions or the change process of the test conditions until the occurrence of the above abnormality or error, the test is carried out.

15. A memory module test device, including: A housing unit, which is internally equipped with a test space for testing a memory module; A temperature adjustment test device, configured inside the above-mentioned housing unit, includes a test board unit disposed in the above-mentioned test space, a test box unit disposed above the above-mentioned test board unit and formed to surround the memory module installation area, a storage unit for storing the process and results of testing the memory module in the test space for the above-mentioned test board unit and the above-mentioned test box unit, and a control unit for controlling the above-mentioned test board unit, the above-mentioned test box unit, and the above-mentioned storage unit, for testing the memory module; A cooling water supply unit, configured on one side of the above-mentioned housing unit, for reducing the rising temperature by supplying cooling water to the above-mentioned test space or the above-mentioned temperature adjustment test device; An air supply unit, configured on one side of the above-mentioned housing unit, for supplying air for the temperature rise and fall of the above-mentioned test space or the above-mentioned temperature adjustment test device; An alarm unit, configured on one side of the above-mentioned housing unit, for notifying the outside by sound or visual means of the test status being carried out in the above-mentioned test space; A universal serial bus (USB) port unit, configured on one side of the above-mentioned housing unit, for making an electrical connection for data transfer with an external electronic device; A display unit, configured on one side of the above-mentioned housing unit, for visually displaying for the convenience of the user to identify the memory module test status of the above-mentioned temperature adjustment test device or the internal status of the above-mentioned housing; and, A keyboard display mouse (KVM (Keyboard, Video Monitor, Mouse)) switching unit, configured on one side of the above-mentioned housing unit, for controlling the above-mentioned temperature adjustment test device.

16. The memory module test device according to claim 15, wherein: The above-mentioned cooling water supply unit further includes: A cooling water meter, installed in the above-mentioned housing unit, for measuring the flow of the supplied cooling water; and, A cooling water filter, installed in the above-mentioned housing unit, for filtering foreign matters when supplying cooling water.

17. The memory module test device according to claim 15, wherein: The above-mentioned alarm unit includes: An emergency stop button, composed of an emergency shutdown (EMO) switch that stops all functions when pressed by the user in a critical situation; An alarm setting button, for the user to set the alarm; and, An alarm reset button, for resetting the alarm set by the user.

18. The memory module test device according to claim 15, wherein: The above-mentioned test space further includes: a shelf, for supporting the above-mentioned temperature adjustment test device on the lower side of the above-mentioned temperature adjustment test device, and can slide to the outside of the above-mentioned housing according to the user's selection.

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