Air blowing type wafer transfer system and operation method

Abstract

The present invention discloses an air-blowing type wafer transfer system and operation method, including a support table, the bottom of the support table is fixedly connected to a base, the top of the support table is fixedly connected to a transfer box, the front side of the support table is fixedly connected to a first transfer plate and a second transfer plate, the interior of the first transfer plate is provided with an ejection mechanism, and the present invention relates to the field of wafer transfer technology. The air-blowing type wafer transfer system and operation method, by providing a steering transmission mechanism, utilizes a driving motor to drive the rotation of a driving shaft, and the driving shaft drives the connecting rod and the clamping column to move in the clamping groove of the cross wheel, thereby realizing the rotation of the rotating plate and the extraction box, and clamping the wafer by the extraction plate, thereby realizing the clamping of the wafer, thereby avoiding the problem of falling caused by adsorption, and realizing intermittent steering, achieving the purpose of precise positioning and transmission, thereby improving the efficiency of wafer transfer.

Description

Technical Field

[0001] The present invention relates to the field of wafer transmission technology, and in particular to an air blowing type wafer transmission system and an operation method. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. After high-purity polycrystalline silicon is dissolved, silicon crystal seeds are added, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8 inches and 12 inches, and the main processing methods of wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, and the processing and measurement equipment becomes more and more advanced, new data characteristics have emerged in wafer processing. At the same time, the reduction in feature size increases the impact of the number of particles in the air on the quality and reliability of the wafer after processing during wafer processing, and as the cleanliness improves, the number of particles also has new data characteristics.

[0003] The existing wafers still have the following problems during the transmission process:

[0004] 1. Manual transmission often results in the inability to accurately locate the data, which in turn causes the transmission process to be slow.

[0005] 2. The wafer may fall off due to insufficient adsorption force during adsorption by the suction cup;

[0006] 3. During the transmission process, the wafer is often not lifted up, which causes inconvenience in transmission.

[0007] To this end, the present invention provides an air blowing type wafer transfer system and an operation method. Summary of the invention

[0008] In view of the deficiencies in the prior art, the present invention provides an air blowing type wafer transfer system and an operating method, which solve the problems that accurate positioning is often not possible during the prior transfer process, the wafer may fall due to insufficient adsorption force during the adsorption process of the suction cup, and the wafer may be inconvenient to lift during the transfer because the wafer is not lifted up.

[0009] To achieve the above objectives, the present invention is implemented through the following technical solutions: a blowing type wafer transfer system, comprising a support table, the bottom of the support table is fixedly connected to a base, the top of the support table is fixedly connected to a transfer box, the front side of the support table is fixedly connected to a first transfer plate and a second transfer plate, the interior of the first transfer plate is provided with an ejection mechanism, the interior of the transfer box is provided with a steering transfer mechanism, the steering transfer mechanism includes a driving motor and a first cylinder, the bottom of the first cylinder is slidably connected to a first piston rod, one end of the first piston rod is fixedly connected to a rotating plate, one end of the rotating plate is provided with a wafer extraction mechanism, one end of the driving motor output shaft is fixedly connected to a driving shaft through a coupling, the surface of the driving shaft is provided with a wafer ejection mechanism, the bottom of the driving shaft is fixedly connected to a connecting rod, the surface of the connecting rod is fixedly connected to a clamping column, The conveying box is rotatably connected with a supporting shaft, and the surface of the supporting shaft is fixedly connected with a cross wheel, and the surface of the cross wheel is provided with a slot, and the clamping column is slidably connected with the surface of the slot, and the bottom end of the supporting shaft is fixedly connected with the top of the first cylinder, and the wafer extraction mechanism includes a rotating disk and an extraction box fixedly installed at the bottom of the rotating plate, a placement groove is provided inside the extraction box, and the inner surface of the placement groove is fixedly connected with a spring, one end of the spring is fixedly connected with a moving plate, and the moving plate is slidably connected with the inner surface of the placement groove, and the bottom of the moving plate is fixedly connected with an arc plate, and the bottom of the arc plate is fixedly connected with the extraction plate through a support rod, and the bottom of the extraction box is provided with a moving groove, and the arc plate moves inside the moving groove, and the bottom of the rotating disk is fixedly connected with a rotating rod, and the bottom of the rotating rod is fixedly connected with an elliptical plate, and the surface of the elliptical plate contacts the surface of the arc plate.

[0010] Preferably, the wafer ejection mechanism includes a transmission shaft driven by a transmission assembly, the top end of the transmission shaft is rotatably connected to the inner wall of the transfer box, and the bottom end of the transmission shaft is fixedly connected to a transmission gear.

[0011] Preferably, a transmission rack is slidably connected to the inner wall of the transmission box, the transmission gear is meshed with the surface of the transmission rack, and one end of the transmission rack is fixedly connected to a push-out rack.

[0012] Preferably, the transmission assembly includes a driving wheel and a transmission wheel, the driving wheel is fixedly mounted on the surface of the driving shaft, the transmission wheel is fixedly mounted on the surface of the transmission shaft, and the surfaces of the driving wheel and the transmission wheel are connected by a transmission belt.

[0013] Preferably, the ejection mechanism comprises a second cylinder and a fixed block, the bottom of the fixed block is fixedly connected to the inside of the first transmission plate, and one side of the second cylinder is slidably connected to a second piston rod.

[0014] Preferably, the ends of the second cylinder and the second piston rod that are away from each other are fixedly connected to a support rod, one end of the support rod is fixedly connected to a support block, and the surface of the support block is rotatably connected to the first rotating rod and the second rotating rod via a support rod.

[0015] Preferably, a lifting block is rotatably connected to the surface of the first rotating rod, and an arc plate is fixedly connected to the top of the lifting block.

[0016] Preferably, one end of the second rotating rod is rotatably connected to the surface of the fixed block, an extension groove is provided on the top of the first transmission plate, and the support block extends through and extends to the outside of the extension groove.

[0017] The present invention also discloses an operation method of an air blowing type wafer transfer system, which specifically comprises the following steps:

[0018] S1. Wafer extraction: First, the rotating plate is rotated to drive the rotating rod and the elliptical plate to rotate, thereby driving the arc plate and the moving plate to move, thereby driving the extension of the spring and causing the movement of the extraction plate. At this time, the first cylinder is started to drive the movement of the first piston rod, and the first piston rod drives the rotating plate and the extraction box to move downward, placing the wafer between the extraction plates, and the recovery force of the spring causes the extraction plate to clamp the wafer;

[0019] S2, the circular plate moves downward: at this time, the second cylinder is started, and the second piston rod is driven by the second cylinder to move, and the first rotating rod and the second rotating rod are driven to move through the support rod and the support block, so as to move the lifting block downward until the circular plate is flush with the extension groove;

[0020] S3, wafer transmission: start the driving motor, use the driving motor to drive the rotation of the driving shaft, the driving shaft drives the connecting rod and the clamping column to move in the clamping groove of the cross wheel, thereby driving the rotation of the supporting shaft, thereby realizing the rotation of the rotating plate and the extraction box.

[0021] Preferably, the driving motor in S3 synchronously drives the rotation of the transmission shaft through the driving wheel, the transmission wheel and the transmission belt, and drives the movement of the transmission rack through the transmission gear, so that the transmission rack drives the movement of the ejection rack to move the wafer.

[0022] Beneficial Effects

[0023] The present invention provides an air blowing type wafer transfer system and an operation method. Compared with the prior art, the system has the following beneficial effects:

[0024] (1) The air blowing type wafer transfer system and operation method are provided with a steering transmission mechanism, which utilizes a driving motor to drive the rotation of a driving shaft, and the driving shaft drives the connecting rod and the clamping column to move in the clamping groove of the cross wheel, thereby realizing the rotation of the rotating plate and the extraction box, and clamping the wafer by the extraction plate, thereby realizing the clamping of the wafer, thereby avoiding the problem of falling caused by adsorption, and realizing intermittent steering, achieving the purpose of precise positioning and transmission, thereby improving the efficiency of wafer transfer.

[0025] (2) The air-blowing type wafer transfer system and operation method are provided with a wafer ejection mechanism, which utilizes a driving wheel, a transmission wheel and a transmission belt to synchronously drive the rotation of the transmission shaft, and drives the movement of the transmission rack through the transmission gear, so that the transmission rack drives the movement of the ejection rack to move the wafer, thereby realizing the next wafer transfer during the synchronous turning process, reducing energy loss and improving the transmission efficiency.

[0026] (3) The air blowing type wafer transfer system and operation method are provided with an ejection mechanism, which utilizes the second cylinder to drive the movement of the second piston rod, and drives the movement of the first rotating rod and the second rotating rod through the support rod and the support block, thereby moving the ejection block downward until the arc plate is flush with the extension groove, thereby facilitating the telescopic operation of the wafer, thereby facilitating the subsequent wafer extraction operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is an external three-dimensional structural diagram of the present invention;

[0028] Figure 2 It is the internal three-dimensional structure diagram of the present invention;

[0029] Figure 3 For the present invention Figure 2 A magnified view of the local structure at center A;

[0030] Figure 4 It is a three-dimensional structural diagram of the wafer extraction mechanism of the present invention;

[0031] Figure 5 For the present invention Figure 4 A magnified view of the local structure at B in the middle;

[0032] Figure 6 A three-dimensional structural diagram of the wafer ejection mechanism of the present invention;

[0033] Figure 7 It is a three-dimensional structural diagram of the ejection mechanism of the present invention;

[0034] Figure 8 It is a three-dimensional structural exploded view of the ejection mechanism of the present invention;

[0035] Fig. 9For the present invention Figure 8 A magnified view of the local structure at C in the middle;

[0036] Fig.10 It is a process flow chart of the operating method of the present invention.

[0037] In the figure: 1-support table, 2-base, 3-transfer box, 4-first transfer plate, 5-second transfer plate, 6-ejection mechanism, 61-second cylinder, 62-fixed block, 63-second piston rod, 64-support rod, 65-support block, 66-first rotating rod, 67-second rotating rod, 68-lifting block, 69-arc plate, 610-extension groove, 7-steering transmission mechanism, 71-drive motor, 72-first cylinder, 73-first piston rod, 74-rotating plate, 75-wafer extraction mechanism, 75-1-rotating disk, 75-2-extraction box, 75-3-placing groove, 75-4-spring, 75-5-moving plate, 75-6-arc plate, 75-7-extraction plate, 75-8-moving groove, 75-9-rotating rod, 75-10-elliptical plate, 76-driving shaft, 77-wafer ejection mechanism, 77-1-transmission assembly, 77-11-driving wheel, 77-12-transmission wheel, 77-13-transmission belt, 77-2-transmission shaft, 77-3-transmission gear, 77-4-transmission rack, 77-5-ejection frame, 78-connecting rod, 79-card column, 710-supporting shaft, 711-cross wheel, 712-card slot. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] See also Figure 1-5The present invention provides a technical solution: a blowing type wafer transfer system, comprising a support table 1, a base 2 is fixedly connected to the bottom of the support table 1, a transfer box 3 is fixedly connected to the top of the support table 1, a first transfer plate 4 and a second transfer plate 5 are fixedly connected to the front side of the support table 1, the first transfer plate 4 and the second transfer plate 5 are convenient for placing the wafer, an ejection mechanism 6 is arranged inside the first transfer plate 4, a steering transfer mechanism 7 is arranged inside the transfer box 3, the steering transfer mechanism 7 comprises a driving motor 71 and a first cylinder 72, the driving motor 71 is a three-phase asynchronous motor, the driving motor 71 is electrically connected to an external power supply, the first cylinder 72 is electrically connected to the external power supply, the bottom of the first cylinder 72 is slidably connected to a first piston rod 73, the first piston rod 73 One end of the transmission box 3 is fixedly connected to a rotating plate 74, one end of the rotating plate 74 is provided with a wafer extraction mechanism 75, one end of the output shaft of the driving motor 71 is fixedly connected to a driving shaft 76 through a coupling, the surface of the driving shaft 76 is provided with a wafer pushing mechanism 77, the bottom of the driving shaft 76 is fixedly connected to a connecting rod 78, the surface of the connecting rod 78 is fixedly connected to a clamping column 79, the clamping column 79 and the clamping groove 712 move to drive the rotation of the cross wheel 711, the internal rotation of the transmission box 3 is connected to a supporting shaft 710, the surface of the supporting shaft 710 is fixedly connected to a cross wheel 711, the surface of the cross wheel 711 is provided with a clamping groove 712, the clamping column 79 is slidably connected to the surface of the clamping groove 712, the bottom end of the supporting shaft 710 is fixedly connected to the top of the first cylinder 72 Next, the wafer extraction mechanism 75 includes a rotating disk 75-1 and an extraction box 75-2 fixedly installed at the bottom of the rotating plate 74, a placement groove 75-3 is provided inside the extraction box 75-2, the inner surface of the placement groove 75-3 is fixedly connected with a spring 75-4, one end of the spring 75-4 is fixedly connected with a movable plate 75-5, and the movable plate 75-5 is slidably connected to the inner surface of the placement groove 75-3, the bottom of the movable plate 75-5 is fixedly connected with an arc plate 75-6, the bottom of the arc plate 75-6 is fixedly connected with an extraction plate 75-7 through a support rod, and a protective pad is provided on the surface of the extraction plate 75-7 to avoid damage to the wafer, and a movable groove 75-8 is provided at the bottom of the extraction box 75-2, and the arc plate 75-6 is fixedly connected to the inner surface of the movable groove 75-8 Internal movement, the bottom of the rotating disk 75-1 is fixedly connected to a rotating rod 75-9, and the bottom of the rotating rod 75-9 is fixedly connected to an elliptical plate 75-10. The surface of the elliptical plate 75-10 contacts the surface of the arc plate 75-6. By setting a steering transmission mechanism 7, the driving motor 71 is used to drive the rotation of the driving shaft 76. The driving shaft 76 drives the connecting rod 78 and the clamping column 79 to move in the clamping groove 712 of the cross wheel 711, thereby realizing the rotation of the rotating plate 74 and the extraction box 75-2, and clamping the wafer through the extraction plate 75-7, thereby realizing the clamping of the wafer, thereby avoiding the problem of falling caused by adsorption, and realizing intermittent steering, achieving the purpose of precise positioning and transmission, thereby improving the efficiency of wafer transmission.

[0040] See also Figure 6 The wafer ejection mechanism 77 includes a transmission shaft 77-2 driven by a transmission assembly 77-1. The top of the transmission shaft 77-2 is rotatably connected to the inner wall of the transmission box 3. The bottom of the transmission shaft 77-2 is fixedly connected to a transmission gear 77-3. The inner wall of the transmission box 3 is slidably connected to a transmission rack 77-4. The transmission gear 77-3 meshes with the surface of the transmission rack 77-4. One end of the transmission rack 77-4 is fixedly connected to an ejection frame 77-5. The transmission assembly 77-1 includes a driving wheel 77-11 and a driving wheel 77-12. The driving wheel 77-11 is fixedly mounted on the surface of the driving shaft 76. The driving wheel 77-12 It is fixedly mounted on the surface of the transmission shaft 77-2, and the surfaces of the driving wheel 77-11 and the transmission wheel 77-12 are connected through a transmission belt 77-13. By setting up a wafer ejection mechanism 77, the driving wheel 77-11, the transmission wheel 77-12 and the transmission belt 77-13 are used to synchronously drive the rotation of the transmission shaft 77-2, and the transmission rack 77-4 is driven to move through the transmission gear 77-3, so that the transmission rack 77-4 drives the movement of the ejection rack 77-5 to move the wafer, thereby realizing the next wafer transmission during the synchronous steering process, reducing energy loss while improving transmission efficiency.

[0041] See also Figure 7-9 The ejection mechanism 6 includes a second cylinder 61 and a fixed block 62. The second cylinder 61 is electrically connected to an external power supply. The bottom of the fixed block 62 is fixedly connected to the inside of the first transmission plate 4. A second piston rod 63 is slidably connected to one side of the second cylinder 61. The ends of the second cylinder 61 and the second piston rod 63 that are away from each other are fixedly connected to a support rod 64. One end of the support rod 64 is fixedly connected to a support block 65. The surface of the support block 65 is rotatably connected to a first rotating rod 66 and a second rotating rod 67 through a support rod. The surface of the first rotating rod 66 is rotatably connected to a lifting block 68. The top of the lifting block 68 is fixedly connected to An arc plate 69 is connected, one end of the second rotating rod 67 is rotatably connected to the surface of the fixed block 62, an extension groove 610 is opened on the top of the first transmission plate 4, and the support block 65 extends to the outside of the extension groove 610. By setting up an ejection mechanism 6, the second cylinder 81 is used to drive the movement of the second piston rod 83, and the support rod 84 and the support block 85 drive the movement of the first rotating rod 86 and the second rotating rod 87, so as to move the ejection block 88 downward until the arc plate 89 is flush with the extension groove 810, so as to facilitate the telescopic operation of the wafer, thereby facilitating the subsequent wafer extraction operation.

[0042] See also Fig.10 The present invention also discloses an operation method of an air blowing type wafer transfer system, which specifically comprises the following steps:

[0043] S1. Wafer extraction: First, the rotating disk 75-1 is rotated to drive the rotating rod 75-9 and the elliptical plate 75-10 to rotate, thereby driving the movement of the arc plate 75-6 and the movable plate 75-5, thereby driving the extension of the spring 75-4 and the movement of the extraction plate 75-7. At this time, the first cylinder 72 is started to drive the movement of the first piston rod 73, and the first piston rod 73 drives the rotating plate 74 and the extraction box 75-2 to move downward, placing the wafer between the extraction plates 75-7, and the recovery force of the spring 75-4 makes the extraction plate 75-7 clamp the wafer;

[0044] S2, the circular plate moves downward: at this time, the second cylinder 61 is started, and the second piston rod 63 is driven by the second cylinder 61 to move, and the first rotating rod 66 and the second rotating rod 67 are driven to move through the support rod 64 and the support block 65, so as to move the lifting block 68 downward until the arc plate 69 is flush with the extension groove 610;

[0045] S3, wafer transmission: start the driving motor 71, and use the driving motor 71 to drive the driving shaft 76 to rotate. The driving shaft 76 drives the connecting rod 78 and the clamping column 79 to move in the clamping groove 712 of the cross wheel 711, thereby driving the rotation of the supporting shaft 710, thereby realizing the rotation of the rotating plate 74 and the extraction box 75-2.

[0046] In the embodiment of the present invention, the driving motor 71 in S3 synchronously drives the rotation of the transmission shaft 77-2 through the driving wheel 77-11, the transmission wheel 77-12 and the transmission belt 77-13, and drives the movement of the transmission rack 77-4 through the transmission gear 77-3, so that the transmission rack 77-4 drives the movement of the ejection rack 77-5 to move the wafer.

[0047] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An air blowing type wafer transfer system, comprising a support platform (1), the bottom of the support platform (1) being fixedly connected to a base (2), and the top of the support platform (1) being fixedly connected to a transfer box (3), characterized in that: A first transmission plate (4) and a second transmission plate (5) are fixedly connected to the front side of the support platform (1); an ejection mechanism (6) is provided inside the first transmission plate (4); and a steering transmission mechanism (7) is provided inside the transmission box (3); The steering transmission mechanism (7) comprises a driving motor (71) and a first cylinder (72); a first piston rod (73) is slidably connected to the bottom of the first cylinder (72); one end of the first piston rod (73) is fixedly connected to a rotating plate (74); one end of the rotating plate (74) is provided with a wafer extraction mechanism (75); one end of the output shaft of the driving motor (71) is fixedly connected to a driving shaft (76) via a coupling; a surface of the driving shaft (76) is provided with a wafer ejection mechanism (77); The bottom of the rotating shaft (76) is fixedly connected to a connecting rod (78), the surface of the connecting rod (78) is fixedly connected to a clamping column (79), the interior of the transmission box (3) is rotatably connected to a supporting rotating shaft (710), the surface of the supporting rotating shaft (710) is fixedly connected to a cross wheel (711), the surface of the cross wheel (711) is provided with a clamping groove (712), the clamping column (79) is slidably connected to the surface of the clamping groove (712), and the bottom end of the supporting rotating shaft (710) is fixedly connected to the top of the first cylinder (72); The wafer extraction mechanism (75) comprises a rotating disk (75-1) and an extraction box (75-2) fixedly mounted on the bottom of a rotating plate (74); a placement groove (75-3) is provided inside the extraction box (75-2); a spring (75-4) is fixedly connected to the inner surface of the placement groove (75-3); one end of the spring (75-4) is fixedly connected to a moving plate (75-5); the moving plate (75-5) is slidably connected to the inner surface of the placement groove (75-3); and a circular spring (75-4) is fixedly connected to the bottom of the moving plate (75-5). An arc plate (75-6), the bottom of the arc plate (75-6) being fixedly connected to an extraction plate (75-7) via a support rod, a moving groove (75-8) being provided at the bottom of the extraction box (75-2), the arc plate (75-6) moving inside the moving groove (75-8), the bottom of the rotating disk (75-1) being fixedly connected to a rotating rod (75-9), the bottom of the rotating rod (75-9) being fixedly connected to an elliptical plate (75-10), the surface of the elliptical plate (75-10) being in contact with the surface of the arc plate (75-6); The wafer ejection mechanism (77) comprises a transmission shaft (77-2) driven by a transmission assembly (77-1), the top of the transmission shaft (77-2) being rotatably connected to the inner wall of the transmission box (3), the bottom of the transmission shaft (77-2) being fixedly connected to a transmission gear (77-3), the inner wall of the transmission box (3) being slidably connected to a transmission rack (77-4), the transmission gear (77-3) being meshed with the surface of the transmission rack (77-4), and the transmission rack (77-4) being rotatably connected to the inner wall of the transmission box (3). One end of the transmission assembly (77-4) is fixedly connected to a push-out frame (77-5), the transmission assembly (77-1) comprises a driving wheel (77-11) and a transmission wheel (77-12), the driving wheel (77-11) is fixedly mounted on the surface of the driving shaft (76), the transmission wheel (77-12) is fixedly mounted on the surface of the transmission shaft (77-2), and the surfaces of the driving wheel (77-11) and the transmission wheel (77-12) are connected in transmission via a transmission belt (77-13); The ejection mechanism (6) comprises a second cylinder (61) and a fixed block (62); the bottom of the fixed block (62) is fixedly connected to the inside of the first transmission plate (4); one side of the second cylinder (61) is slidably connected to a second piston rod (63); the ends of the second cylinder (61) and the second piston rod (63) that are away from each other are fixedly connected to a support rod (64); one end of the support rod (64) is fixedly connected to a support block (65); the surface of the support block (65) is rotatably connected to a first rotating rod (66) and a second rotating rod (67) via a support rod; the surface of the first rotating rod (66) is rotatably connected to a lift block (68); the top of the lift block (68) is fixedly connected to an arc plate (69).

2. The air blowing type wafer transfer system according to claim 1, characterized in that: One end of the second rotating rod (67) is rotatably connected to the surface of the fixed block (62); an extension groove (610) is provided on the top of the first transmission plate (4); and the support block (65) extends through the extension groove (610) to the outside.

3. An operating method of an air blowing type wafer transfer system, using an air blowing type wafer transfer system as claimed in any one of claims 1 to 2, characterized in that: The specific steps include: S1. Wafer extraction: first, the rotating disk (75-1) is rotated to drive the rotating rod (75-9) and the elliptical plate (75-10) to rotate, thereby driving the arc plate (75-6) and the movable plate (75-5) to move, thereby driving the extension of the spring (75-4) and causing the extraction plate (75-7) to move. At this time, the first cylinder (72) is started to drive the movement of the first piston rod (73), and the first piston rod (73) drives the rotating plate (74) and the extraction box (75-2) to move downward, so that the wafer is placed between the extraction plates (75-7), and the recovery force of the spring (75-4) causes the extraction plate (75-7) to clamp the wafer; S2, the circular plate moves downward: at this time, the second cylinder (61) is started, and the second piston rod (63) is driven by the second cylinder (61), and the first rotating rod (66) and the second rotating rod (67) are driven to move through the support rod (64) and the support block (65), so as to move the lifting block (68) downward until the arc plate (69) is flush with the extension groove (610); S3, wafer transmission: start the driving motor (71), and use the driving motor (71) to drive the driving shaft (76) to rotate. The driving shaft (76) drives the connecting rod (78) and the clamping column (79) to move in the clamping groove (712) of the cross wheel (711), thereby driving the rotation of the supporting shaft (710), thereby realizing the rotation of the rotating plate (74) and the extraction box (75-2).

4. The method for operating an air blowing type wafer transfer system according to claim 3, characterized in that: The driving motor (71) in S3 synchronously drives the driving shaft (77-2) to rotate via the driving wheel (77-11), the transmission wheel (77-12) and the transmission belt (77-13), and drives the transmission rack (77-4) to move via the transmission gear (77-3), so that the transmission rack (77-4) drives the ejection rack (77-5) to move, thereby moving the wafer.

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