Flexible display panel and method for preparing the same

Abstract

The embodiment of the present application provides a flexible display panel and a method for preparing the same, wherein the flexible display panel comprises: an array substrate, an organic light-emitting layer, the organic light-emitting layer being arranged on the array substrate; a retaining wall, the retaining wall being arranged on the array substrate and surrounding the organic light-emitting layer; an encapsulation layer, the encapsulation layer covering the organic light-emitting layer and the retaining wall, the encapsulation layer comprising ink; wherein the retaining wall comprises a top surface away from the array substrate, a first side surface close to the organic light-emitting layer, and a second side surface away from the organic light-emitting layer, the second side surface being provided with at least one of a groove, a stepped structure, or a pointed structure. The contact area between the retaining wall and the ink in the encapsulation layer can be increased by the groove, the stepped structure, or the pointed structure, thereby increasing the surface tension of the ink in the encapsulation layer to prevent the ink from overflowing from the retaining wall.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a flexible display panel and a method for preparing the same. Background Art

[0002] The organic layer and other devices in the OLED display device are easily corroded by oxygen and water, which reduces their lifespan. Therefore, the AMOLED display panel needs to be encapsulated. Among them, for flexible displays, thin film encapsulation (TFE) is one of the most commonly used encapsulation methods. In the existing TFE encapsulation technology, in order to avoid the uneven boundary of the thin film formed after the ink (Ink) is leveled on the substrate or exceeds the range of the substrate, a retaining wall (Dam) is usually set on the substrate at the position corresponding to the ink printing boundary.

[0003] However, in the related art, ink often overflows from the retaining wall, thus reducing the service life of the display panel. Summary of the invention

[0004] The embodiments of the present application provide a flexible display panel and a method for preparing the same, which can solve the problem of ink overflowing from a retaining wall in existing display panels.

[0005] An embodiment of the present application provides a flexible display panel, the flexible display panel comprising:

[0006] An array substrate;

[0007] An organic light-emitting layer, wherein the organic light-emitting layer is disposed on the array substrate;

[0008] A retaining wall, the retaining wall is arranged on the array substrate and surrounds the organic light-emitting layer;

[0009] an encapsulation layer, the encapsulation layer covering the organic light-emitting layer and the retaining wall, the encapsulation layer comprising ink;

[0010] The retaining wall includes a top surface away from the array substrate, a first side surface close to the organic light-emitting layer and a second side surface away from the organic light-emitting layer, and the second side surface is provided with at least one of a groove, a stepped structure or a pointed structure.

[0011] Optionally, at least one of the top surface and the first side surface is provided with a groove.

[0012] Optionally, the first side surface is provided with a stepped structure.

[0013] Optionally, a groove is provided on the stepped structure.

[0014] Optionally, when a pointed structure is provided on the second side surface, a density of the pointed structure provided on the second side surface is greater than a density of the stepped structure provided on the first side surface.

[0015] Optionally, a microcapsule self-repairing film layer is provided on the pointed structure.

[0016] Optionally, the display panel further includes:

[0017] A hydrophobic film layer covers at least one of the top surface of the retaining wall, the first side surface, and the second side surface.

[0018] Optionally, the cross-sectional shape of the groove is one of a rectangle, a trapezoid, a triangle, a V-shape, an arc or a semi-ellipse.

[0019] Optionally, the display panel includes a plurality of retaining walls, and a distance between two adjacent retaining walls is less than 500 micrometers.

[0020] Optionally, the top surface and the side surfaces of the retaining wall are rough surfaces.

[0021] The present application also provides a method for preparing a flexible display panel, the method comprising:

[0022] Providing an array substrate;

[0023] Disposing an organic light-emitting layer on the array substrate;

[0024] A retaining wall is arranged on the array substrate around the organic light-emitting layer, the retaining wall comprising a top surface and a side surface, wherein the top surface is arranged on a side away from the array substrate, the side surface comprises a first side surface close to the organic light-emitting layer and a second side surface away from the organic light-emitting layer; the second side surface is provided with at least one of a groove, a stepped structure or a sharp angle structure;

[0025] An encapsulation layer is disposed on the organic light-emitting layer to cover the organic light-emitting layer and the retaining wall, and the encapsulation layer includes ink.

[0026] Optionally, the barrier wall is arranged on the array substrate around the organic light-emitting layer, comprising:

[0027] coating a photoresist material layer on the array substrate;

[0028] Placing a photomask having a predetermined retaining wall pattern between the photoresist material layer and a light source of an exposure machine, and exposing the photoresist material layer so that the second side surface is provided with at least one of a groove, a stepped structure or a sharp angle structure;

[0029] The photoresist material layer at the non-blocking wall pattern portion is removed by developing method to form the blocking wall arranged on the array substrate.

[0030] Optionally, the photoresist material layer is exposed to high light intensity to form a hydrophobic film layer on at least one of the top surface, the first side surface and the second side surface of the retaining wall.

[0031] The beneficial effects of the present application are as follows: the flexible display panel provided in the embodiment of the present application includes an array substrate, an organic light-emitting layer, an encapsulation layer and a retaining wall, wherein the retaining wall is arranged on the array substrate, and the second side of the retaining wall is provided with at least one of a groove, a stepped structure or a sharp-angle structure. The contact area between the retaining wall and the ink in the encapsulation layer can be increased by the groove, the stepped structure or the sharp-angle structure, thereby increasing the surface tension of the ink in the encapsulation layer to prevent the ink from overflowing the retaining wall. In addition, when the flexible display panel is bent, the groove, the stepped structure or the sharp-angle structure provided on the retaining wall can avoid the situation where the flexible display panel is broken due to stress concentration, thereby increasing the service life of the flexible display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0033] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.

[0034] Figure 1 A schematic diagram of the structure of a flexible display panel provided in an embodiment of the present application.

[0035] Figure 2 for Figure 1 A schematic diagram of a first structure of the retaining wall in the flexible display panel.

[0036] Figure 3 for Figure 1 A schematic diagram of a second structure of the retaining wall in the flexible display panel.

[0037] Figure 4 for Figure 1 A third structural schematic diagram of the retaining wall in the flexible display panel.

[0038] Figure 5 for Figure 1 A fourth structural schematic diagram of the retaining wall in the flexible display panel.

[0039] Figure 6 for Figure 1 A fifth structural schematic diagram of the retaining wall in the flexible display panel.

[0040] Figure 7 for Figure 1 A sixth structural schematic diagram of the retaining wall in the flexible display panel.

[0041] Figure 8 for Figure 1 A seventh structural schematic diagram of the retaining wall in the flexible display panel.

[0042] Fig. 9 for Figure 1 An eighth structural schematic diagram of the retaining wall in the flexible display panel.

[0043] Fig.10 A first schematic diagram of a method for preparing a flexible display panel provided in an embodiment of the present application.

[0044] Fig.11 for Fig.10 A schematic diagram of the process for preparing a retaining wall in the preparation method.

[0045] Fig.12 A second schematic diagram of the process of preparing a flexible display panel provided in an embodiment of the present application.

[0046] Fig.13 A third flow chart of the method for preparing a flexible display panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0049] Organic Light Emitting Diode (OLED) has the characteristics of self-luminescence, wide viewing angle, fast response and can be made on flexible substrates, and is increasingly used in various display fields. Display panels usually use thin film packaging structures to achieve sealing of the display area. The thin film packaging structure has low cost and good sealing effect, and has been widely used in OLED display panels.

[0050] However, in the prior art, the retaining wall and the pixel definition layer (PDL) are usually formed through a single mask and exposure process. In actual production, the thickness of the edge of the organic film layer is much smaller than the thickness in the middle, resulting in the ink not being able to effectively cover the device, and the ink often overflows the retaining wall, reducing the service life of the OLED.

[0051] Therefore, in order to solve the above problems, the present application proposes a display panel and a method for manufacturing the display panel. The present application will be further described below in conjunction with the accompanying drawings and implementation examples.

[0052] See also Figures 1 to 4 , Figure 1 A schematic diagram of the structure of a flexible display panel provided in an embodiment of the present application, Figure 2 for Figure 1 A schematic diagram of a first structure of the retaining wall in the flexible display panel, Figure 3 for Figure 1 A schematic diagram of a second structure of the retaining wall in the flexible display panel, Figure 4 for Figure 1A third structural schematic diagram of the retaining wall in the flexible display panel. The embodiment of the present application provides a flexible display panel 100, the flexible display panel 100 includes a display area and a non-display area arranged around the display area, and the flexible display panel 100 includes an array substrate 10, an organic light-emitting layer 40, an encapsulation layer 20 and a retaining wall 30. The organic light-emitting layer 40 is arranged on the array substrate 10 located in the display area, the encapsulation layer 20 covers the organic light-emitting layer 40 and the retaining wall 30, and the encapsulation layer 20 includes ink. The retaining wall 30 is arranged on the array substrate 10, the retaining wall 30 is arranged around the organic light-emitting layer 40, the retaining wall 30 includes a top surface 310 and a side surface, the top surface 310 is arranged on a side away from the array substrate 10, and the side surface includes a first side surface 320 close to the organic light-emitting layer 40 and a second side surface 330 away from the organic light-emitting layer 40, wherein the second side surface 330 is provided with at least one of a groove 340, a stepped structure 350 or a sharp angle structure 360. The contact area between the retaining wall 30 and the ink in the encapsulation layer 20 can be increased by the groove 340, the stepped structure 350 or the sharp angle structure 360, thereby increasing the surface tension of the ink in the encapsulation layer 20 to prevent the ink from overflowing the retaining wall 30. In addition, the ink in the encapsulation layer 20 can also be received in the groove 340, further preventing the ink from overflowing the retaining wall 30. In addition, when the flexible display panel 100 is bent, the groove 340, the stepped structure 350 or the sharp angle structure 360 ​​provided on the retaining wall 30 can avoid the situation where the flexible display panel 100 is broken due to stress concentration, thereby increasing the service life of the flexible display panel 100.

[0053] Please continue reading Figure 2, a groove 340 is provided on the second side 330. By providing the groove 340 on the second side 330, the contact area between the ink in the encapsulation layer 20 and the retaining wall 30 can be increased, and the groove 340 can carry the ink, further preventing the ink from overflowing the retaining wall 30. In addition, when the flexible display panel 100 is bent, the groove 340 provided on the retaining wall 30 can avoid the situation where the flexible display panel 100 is broken due to stress concentration, thereby increasing the service life of the flexible display panel 100. In some embodiments, at least one of the top surface 310 and the first side 320 is provided with a groove 340. Exemplarily, in some embodiments, the top surface 310 and the first side 320 of the retaining wall 30 are both provided with a groove 340, and the second side 330 can be provided with a groove 340, a stepped structure 350 or a pointed structure 360. In some embodiments, the top surface 310 and the second side 330 of the retaining wall 30 are provided with a groove 340, and the first side 320 can be provided with a groove 340 or a stepped structure 350. In some embodiments, the first side surface 320 and the second side surface 330 of the retaining wall 30 are provided with a groove 340, and the top surface 310 may be provided with a groove 340 or may not be provided with a groove 340. In other embodiments, the top surface 310, the first side surface 320 and the second side surface 330 of the retaining wall 30 are all provided with a groove 340, such as Figure 3 It is understandable that the position of the groove 340 of the retaining wall 30 can be designed according to actual conditions, and no specific limitation is made here.

[0054] The cross-sectional shape of the groove 340 can be one of a rectangle, a trapezoid, a triangle, a V-shape, an arc or a semi-ellipse. It is understandable that the number, size and shape of the grooves 340 provided on the top surface 310 and the side surface can be the same or different. The specific situation of providing the grooves 340 is designed according to the actual situation and is not specifically limited here.

[0055] Please continue to refer to Figures 4 to Figure 6 , Figure 5 for Figure 1 A fourth structural schematic diagram of the retaining wall in the flexible display panel, Figure 6 for Figure 1 A fifth structural diagram of the retaining wall in the flexible display panel. At least one of the first side surface 320 and the second side surface 330 of the retaining wall 30 is configured as a stepped structure 350. For example, in some embodiments, the top surface 310 and the first side surface 320 of the retaining wall 30 are both provided with a groove 340, and the second side surface 330 is configured as a stepped structure 350. Figure 4 In some embodiments, the top surface 310 and the second side surface 330 of the retaining wall 30 are both provided with a groove 340, and the first side surface 320 is provided with a stepped structure 350, as shown in FIG. Figure 5It should be noted that the second side surface 330 may be a stepped structure 350, may be a groove 340, or may be a stepped structure 350 and provided with the groove 340. In some embodiments, the first side surface 320 and the second side surface 330 of the retaining wall 30 are provided with the groove 340, and the first side surface 320 and the second side surface 330 are stepped structures 350, that is, the stepped structure 350 is provided with the groove 340, as shown in FIG. Figure 6 As shown. It is understandable that the setting of the retaining wall 30 is not limited to the above examples, and other settings can be combined and set as needed, which will not be described here one by one. By setting the side to a stepped structure 350, the contact surface area between the ink and the retaining wall 30 can be effectively increased, the surface tension of the ink can be increased, and the ink can be effectively prevented from overflowing from the retaining wall 30.

[0056] Among them, the stepped structure 350 is an intersecting first plane 351 and a second plane 352, the first plane 351 is parallel to the array substrate 10, and the angle between the second plane 352 and the first plane 351 is greater than 0 degree and less than 180 degrees. Exemplarily, the angle between the second plane 352 and the first plane 351 can be 90 degrees, 120 degrees, 135 degrees or 165 degrees, etc.

[0057] Please continue reading Figure 7 , Figure 7 for Figure 1 A sixth structural schematic diagram of the retaining wall in the flexible display panel. In some embodiments, the second side 330 of the retaining wall 30 is provided with two or more sharp corner structures 360. Exemplarily, a groove 340 is provided in the top surface 310 and the first side 320 of the retaining wall 30, and the second side 330 is provided with two or more sharp corner structures 360. Or a groove 340 is provided in the top surface 310 and the first side 320 of the retaining wall 30, and the first side 320 is provided with a stepped structure 350, and the second side 330 is provided with two or more sharp corner structures 360. Or a groove 340 is provided in the top surface 310 and the second side 330 of the retaining wall 30, and the first side 320 is provided with a stepped structure 350, that is, a groove 340 is provided on the stepped structure 350 of the first side 320, and the second side 330 is provided with two or more sharp corner structures 360. The density of the sharp angle structures 360 on the second side 330 is greater than the density of the stepped structures 350 on the first side 320. It is understood that the configuration of the retaining wall 30 is not limited to the above examples, and other configurations can be combined and configured as needed, which will not be described in detail here.

[0058] It should be noted that the plurality of sharp angle structures 360 may be formed by the second side surface 330 being continuously connected by the plurality of sharp angle structures 360 in the direction from the array substrate 10 to the top surface 310. Alternatively, the second side surface 330 may be provided with a plurality of sharp angle structures 360 spaced apart from each other. The specific design may be designed according to the actual situation and is not specifically limited here.

[0059] The pointed structure 360 ​​is composed of a third plane 361 and a fourth plane 362 intersecting each other. In some embodiments, the third plane 361 is parallel to the array substrate 10, and the projection length of the fourth plane 362 perpendicular to the array substrate 10 is less than the projection length of the second plane 352 perpendicular to the array substrate 10. It can be seen that within the same length, the density of the pointed structure 360 ​​is greater than the density of the stepped structure 350. Therefore, the pointed structure 360 ​​with a higher density will break when bent, thereby releasing stress and avoiding stress concentration. In some other embodiments, the angle between the third plane 361 and the fourth plane 362 is an acute angle.

[0060] Because the sharp corner structure 360 ​​is made of a hard material, by providing the sharp corner structure 360 ​​on the second side surface 330 of the retaining wall 30 away from the light-emitting surface, the sharp corner structure 360 ​​can be broken when the display panel is bent, thereby releasing the tip stress and avoiding stress concentration. In addition, because the sharp corner structure 360 ​​is provided in the non-display area, the breaking of the sharp corner structure 360 ​​will not affect the display of the display panel.

[0061] In some embodiments, a microcapsule self-repairing material is disposed on the sharp corner structure 360. When the sharp corner structure 360 ​​is broken, the microcapsule self-repairing material 60 coated on the surface of the sharp corner structure 360 ​​can perform self-repairing, so that the sharp corner structure 360 ​​can be reused.

[0062] In some embodiments, the connection between the second side surface 330 and the top surface 310 of the retaining wall 30 described in any of the above items can be surrounded by two or more curved portions or tooth-shaped portions connected end to end. Through the design of the curved portion and the tooth-shaped portion, the contact area between the ink in the encapsulation layer 20 and the retaining wall 30 can be better increased, thereby better increasing the surface tension of the ink and reducing the amount of ink in the encapsulation layer 20 overflowing from the retaining wall 30.

[0063] Please continue reading Figure 8 and Fig. 9 , Figure 8 for Figure 1 A seventh structural schematic diagram of the retaining wall in the flexible display panel, Fig. 9 for Figure 1The eighth structural schematic diagram of the retaining wall in the flexible display panel, in some embodiments, at least one of the first side surface 320 and the second side surface 330 is a stepped structure 350. By setting at least one of the first side surface 320 and the second side surface 330 of the retaining wall 30 as the stepped structure 350, the contact area between the ink in the encapsulation layer 20 and the retaining wall 30 can be increased, thereby preventing the ink from overflowing the retaining wall 30.

[0064] Among them, at least one of the first side surface 320 and the second side surface 330 is a stepped structure 350, and the top surface 310 is not provided with a groove 340. The following situations can be mentioned. For example, in some embodiments, the first side surface 320 is provided with a groove 340 or a stepped structure 350, the second side surface 330 is provided with a stepped structure 350, and the top surface 310 is not provided with a groove 340. In some embodiments, the second side surface 330 is provided with a groove 340 or a stepped structure 350, the first side surface 320 is provided with a stepped structure 350, and the top surface 310 is not provided with a groove 340. In some embodiments, the first side surface 320 and the second side surface 330 of the retaining wall 30 are both stepped structures 350. By setting the first side surface 320 and the second side surface 330 to be stepped structures 350, the contact area between the ink in the encapsulation layer 20 and the retaining wall 30 can be increased to prevent the ink from overflowing. In some embodiments, the first side 320 of the retaining wall 30 is provided with a stepped structure 350, and the second side 330 is a plurality of continuous sharp angle structures 360. By providing the sharp angle structure 360, the contact area between the ink in the encapsulation layer 20 and the retaining wall 30 can be increased, and the stress can be released by breaking, so as to avoid the problem of stress concentration when the flexible display panel 100 is bent. In some embodiments, the first side 320 and the second side 330 of the retaining wall 30 are both stepped structures 350, and at least one of the first side 320 and the second side 330 is provided with a groove 340. By providing the groove 340 on the basis that the first side 320 and the second side 330 are both stepped structures 350, the contact area with the ink in the encapsulation layer 20 can be increased by the groove 340, and the groove 340 can be used to accommodate the ink, further alleviating the problem of ink overflow. In some other embodiments, the first side 320 of the retaining wall 30 is a stepped structure 350, the second side 330 is a plurality of continuous sharp angle structures 360, and at least one of the first side 320 and the second side 330 is provided with a groove 340. The step-shaped structure 350 and the groove 340 improve the ink overflow problem, and the self-fracture mode of the sharp angle structure 360 ​​is used to release the stress. It is understandable that the retaining wall 30 provided in the embodiment of the present application is not limited to the above-mentioned examples, but also includes a combination of other modes, which is not specifically limited here, and can be set according to actual conditions.

[0065] In some embodiments, a microcapsule self-repairing material 60 is disposed on the sharp corner structure 360. When the sharp corner structure 360 ​​is broken, the microcapsule self-repairing material 60 coated on the surface of the sharp corner structure 360 ​​can self-repair, so that the sharp corner structure 360 ​​can be reused.

[0066] In some embodiments, at least one of the top surface 310 or the side surface of any of the above-mentioned retaining walls 30 is covered with a hydrophobic film layer 50 , and after the ink in the encapsulation layer 20 contacts the hydrophobic film layer 50 , the ink overflow can be effectively prevented.

[0067] The flexible display panel 100 provided in the embodiment of the present application includes a plurality of retaining walls 30, and the distance between two adjacent retaining walls 30 is less than 500 micrometers. The shape and size of each retaining wall 30 can be set according to actual conditions and are not specifically limited here.

[0068] In some embodiments, the top surface 310 and the outer surface of the side surfaces of any of the above-mentioned retaining walls 30 are rough surfaces, and the rough surfaces can increase the adhesion of the liquid and thus reduce the overflow of the ink.

[0069] Please continue reading Fig.10 , Fig.10 The first process diagram of the method for preparing the flexible display panel 100 provided in the embodiment of the present application is shown in FIG. The embodiment of the present application also provides a method for preparing the flexible display panel 100, by which the flexible display panel 100 described above is prepared. The specific steps of the preparation method are as follows:

[0070] 101. Provide an array substrate.

[0071] Exemplarily, a substrate is provided, and the substrate may be a glass substrate or a flexible substrate, and a LS layer (Lighting Shield) is prepared on the substrate by wet etching.

[0072] A buffer layer is deposited on the LS using CVD.

[0073] IGZO is deposited on the buffer layer using the Inline sputter method.

[0074] The GI layer was deposited on IGZO using a CVD process.

[0075] The Gate layer is prepared on the GI using wet etching.

[0076] The ILD layer is prepared on the gate using CVD.

[0077] S / D was prepared on ILD using wet etching.

[0078] The PV layer was prepared by CVD on S / D.

[0079] A PLN layer was prepared above the PV layer.

[0080] 102. Dispose an organic light-emitting layer on the array substrate.

[0081] An organic light emitting layer 40 is disposed on one side of the array substrate 10 to form a display area and a non-display area.

[0082] 103. A retaining wall is arranged around the organic light-emitting layer on the array substrate, the retaining wall includes a top surface and a side surface, wherein the top surface is arranged on a side away from the array substrate, and the side surface includes a first side surface close to the organic light-emitting layer and a second side surface away from the organic light-emitting layer; the second side surface is provided with at least one of a groove, a stepped structure or a pointed structure.

[0083] A retaining wall 30 is disposed on the array substrate 10 around the organic light emitting layer 40. The retaining wall 30 may be made of, but not limited to, polyimide. The specific configuration of the retaining wall 30 may be found in Fig.11 , Fig.11 for Fig.10 A schematic diagram of the process of preparing the retaining wall 30 in the preparation method. The specific process steps are as follows:

[0084] 1031. Coat a photoresist material layer on the array substrate.

[0085] A photoresist material is coated on the array substrate 10 to form a photoresist material layer, wherein the photoresist material layer can form a material with hydrophobic properties after high exposure.

[0086] 1032. Place a photomask having a predetermined retaining wall pattern between a photoresist material layer and a light source of an exposure machine, and expose the photoresist material layer so that the second side surface is provided with at least one of a groove, a stepped structure, or a pointed structure.

[0087] By exposing the photoresist material layer, the pattern of any of the above-mentioned retaining walls 30 can be exposed. For example, the predetermined pattern of the retaining wall 30 can be such that at least two of the top surface 310, the first side surface 320, and the second side surface 330 of the retaining wall 30 are provided with grooves 340. The predetermined pattern of the retaining wall 30 can be set according to actual conditions and is not specifically limited here.

[0088] 1033. Remove the photoresist material layer at the non-blocking wall pattern portion by developing method to form a blocking wall disposed on the substrate.

[0089] The photoresist material layer of the portion other than the blocking wall 30 pattern is removed by developing, so as to form the blocking wall 30 disposed on the array substrate 10 .

[0090] The retaining wall 30 is obtained by coating, exposing and developing, so that at least two of the top surface 310, the first side surface 320 and the second side surface 330 of the retaining wall 30 are provided with grooves 340, and the contact area between the ink in the encapsulation layer 20 and the retaining wall 30 can be increased by the grooves 340, and the grooves 340 can carry the ink, further preventing the ink from overflowing the retaining wall 30. In addition, when the flexible display panel 100 is bent, the grooves 340 provided on the retaining wall 30 can avoid the situation where the flexible display panel 100 is broken due to stress concentration, thereby increasing the service life of the flexible display panel 100.

[0091] In some embodiments, the photoresist material layer is subjected to high exposure to form a hydrophobic film layer 50 on at least one of the top surface 310 , the first side surface 320 , and the second side surface 330 of the retaining wall 30 . The hydrophobic film layer 50 can effectively prevent the ink in the encapsulation layer 20 from overflowing.

[0092] 104. A packaging layer is provided on the organic light-emitting layer to cover the organic light-emitting layer and the retaining wall, wherein the packaging layer includes ink.

[0093] The encapsulation layer 20 is disposed on the organic layer, and the organic light emitting layer 40 and the barrier ribs 30 are encapsulated by the encapsulation layer 20 to prevent impurities such as moisture from entering the interior of the flexible display panel 100 .

[0094] Please continue reading Fig.12 , Fig.12 The second process diagram of the method for preparing the flexible display panel 100 provided in the embodiment of the present application is shown in FIG. The embodiment of the present application also provides a method for preparing the flexible display panel 100, and the flexible display panel 100 described above is prepared by the preparation method. The specific steps of the preparation method are as follows:

[0095] 201. Provide an array substrate.

[0096] Please refer to the above step 101 for details, which will not be repeated here.

[0097] 202. Dispose an organic light-emitting layer on the array substrate.

[0098] Please refer to the above step 102 for details, which will not be described again here.

[0099] 203. Dispose a retaining wall around the organic light-emitting layer on the array substrate, wherein the retaining wall includes a first side surface close to the organic light-emitting layer and a second side surface away from the organic light-emitting layer; at least one of the first side surface and the second side surface is a stepped structure.

[0100] The retaining wall 30 is obtained on the array substrate 10 by coating, exposing and developing, wherein at least one of the first side surface 320 and the second side surface 330 of the retaining wall 30 is a stepped structure 350 .

[0101] 204. Dispose a packaging layer on the organic light-emitting layer to cover the organic light-emitting layer and the retaining wall, wherein the packaging layer includes ink.

[0102] Please refer to the above step 104 for details, which will not be described again here.

[0103] In the embodiment of the present application, a retaining wall 30 is disposed on the array substrate 10. By configuring at least one of the first side surface 320 and the second side surface 330 of the retaining wall 30 as a stepped structure 350, the contact area between the ink in the encapsulation layer 20 and the retaining wall 30 can be increased, thereby increasing the surface tension of the ink and improving the overflow of the ink in the encapsulation layer 20.

[0104] Please continue reading Fig.13 , Fig.13 The third process diagram of the method for preparing the flexible display panel 100 provided in the embodiment of the present application is shown in FIG. The embodiment of the present application also provides a method for preparing the flexible display panel 100, by which the flexible display panel 100 described above is prepared. The specific steps of the preparation method are as follows:

[0105] 301. Provide an array substrate.

[0106] Please refer to the above step 101 for details, which will not be repeated here.

[0107] 302. Dispose an organic light-emitting layer on the array substrate.

[0108] Please refer to the above step 102 for details, which will not be described again here.

[0109] 303. Arrange a retaining wall around the organic light-emitting layer on the array substrate, wherein the retaining wall comprises a first side surface close to the organic light-emitting layer and a second side surface away from the organic light-emitting layer, and a groove is arranged on the second side surface.

[0110] The retaining wall 30 is obtained on the array substrate 10 by coating, exposing and developing, wherein a groove 340 is provided on the second side surface 330 of the retaining wall 30 .

[0111] 304. Dispose a packaging layer on the organic light-emitting layer to cover the organic light-emitting layer and the retaining wall, wherein the packaging layer includes ink.

[0112] Please refer to the above step 104 for details, which will not be described again here.

[0113] In the embodiment of the present application, a retaining wall 30 is arranged on the array substrate 10. By setting a groove 340 on the second side surface 330 of the retaining wall 30, the contact area between the ink in the encapsulation layer 20 and the retaining wall 30 can be increased, thereby increasing the surface tension of the ink and improving the overflow of the ink in the encapsulation layer 20.

[0114] The flexible display panel and the preparation method thereof provided by the embodiment of the present application are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. A flexible display panel, characterized in that: The flexible display panel comprises: An array substrate; An organic light-emitting layer, wherein the organic light-emitting layer is disposed on the array substrate; A retaining wall, the retaining wall is arranged on the array substrate and surrounds the organic light-emitting layer; an encapsulation layer, the encapsulation layer covers the organic light-emitting layer and the retaining wall, and the encapsulation layer comprises ink; Wherein, the retaining wall includes a top surface away from the array substrate, a first side surface close to the organic light-emitting layer, and a second side surface away from the organic light-emitting layer, the first side surface is provided with a stepped structure, the second side surface is provided with a pointed structure, and the density of the pointed structure arranged on the second side surface is greater than the density of the stepped structure arranged on the first side surface.

2. The flexible display panel according to claim 1, characterized in that: At least one of the top surface and the first side surface is provided with a groove.

3. The flexible display panel according to claim 1, characterized in that: The stepped structure is provided with a groove.

4. The flexible display panel according to claim 1, characterized in that: A microcapsule self-repairing film layer is arranged on the pointed structure.

5. The flexible display panel according to claim 1, characterized in that: The flexible display panel further includes: A hydrophobic film layer covers at least one of the top surface of the retaining wall, the first side surface, and the second side surface.

6. The flexible display panel according to claim 2 or 3, characterized in that: The cross-sectional shape of the groove is one of a rectangle, a trapezoid, a triangle, a V-shape, an arc or a semi-ellipse.

7. The flexible display panel according to claim 1, characterized in that: The display panel includes a plurality of retaining walls, and a distance between two adjacent retaining walls is less than 500 micrometers.

8. The flexible display panel according to claim 1, characterized in that: The top surface and the side surface of the retaining wall are rough surfaces.

9. A method for preparing a flexible display panel, characterized in that: The preparation method comprises: Providing an array substrate; Disposing an organic light-emitting layer on the array substrate; A retaining wall is arranged on the array substrate around the organic light-emitting layer, the retaining wall comprising a top surface and a side surface, wherein the top surface is arranged on a side away from the array substrate, and the side surface comprises a first side surface close to the organic light-emitting layer and a second side surface away from the organic light-emitting layer; the first side surface is provided with a stepped structure, the second side surface is provided with a pointed structure, and the density of the pointed structure arranged on the second side surface is greater than the density of the stepped structure arranged on the first side surface; An encapsulation layer is disposed on the organic light-emitting layer to cover the organic light-emitting layer and the retaining wall, and the encapsulation layer includes ink.

10. The preparation method according to claim 9, characterized in that: The blocking wall is arranged on the array substrate around the organic light-emitting layer, comprising: coating a photoresist material layer on the array substrate; Placing a photomask having a predetermined retaining wall pattern between the photoresist material layer and a light source of an exposure machine, and exposing the photoresist material layer so that the second side surface is provided with the sharp corner structure; The photoresist material layer at the non-blocking wall pattern portion is removed by developing method to form the blocking wall disposed on the array substrate.

11. The preparation method according to claim 10, characterized in that: The photoresist material layer is exposed to high light to form a hydrophobic film layer on at least one of the top surface, the first side surface and the second side surface of the retaining wall.

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