An electronic device

Abstract

An embodiment of the present application provides an electronic device, including an antenna structure, which can achieve the purpose of changing the antenna radiation characteristics and improving the antenna radiation efficiency by performing a secondary injection molding process through an NMT process to change the dielectric parameters of the dielectric layer corresponding to the radiator at different positions. The electronic device may include: a frame and a dielectric layer; the frame has a first position and a second position, wherein the frame between the first position and the second position serves as the antenna radiator; at least part of the inner surface of the frame is provided with a first medium except for the frame between the first position and the second position; at least part of the surface of the antenna radiator is provided with a second medium; the first medium and the second medium are different.

Description

Technical Field

[0001] The present application relates to the field of wireless communications, and in particular to an electronic device. Background Art

[0002] At present, electronic devices generally use metal structural parts based on nano molding technology (NMT) as appearance parts. NMT is a process that combines metal and plastic with nano technology. NMT is to first nano-process the metal surface, and then directly inject plastic onto the metal surface to form the metal and plastic into one piece. Through the establishment of this technology, the metal appearance texture is taken into account, and the product can also be made thinner and lighter.

[0003] Through NMT injection molding, the metal appearance parts can be divided into multiple parts, wherein the electronic device can use some of the metal appearance parts as the radiator of the antenna, and more antenna units can be arranged for the electronic device. Summary of the invention

[0004] An embodiment of the present application provides an electronic device, including an antenna structure, which uses a secondary injection molding process through an NMT process to change the dielectric parameters of the dielectric layer corresponding to the radiator at different positions, thereby achieving the purpose of changing the antenna radiation characteristics and improving the antenna radiation efficiency.

[0005] In a first aspect, an electronic device is provided, comprising: a frame and a dielectric layer; the frame has a first position and a second position, wherein the frame between the first position and the second position serves as an antenna radiator; at least a portion of the inner surface of the frame except the frame between the first position and the second position is provided with a first dielectric; at least a portion of the surface of the antenna radiator is provided with a second dielectric; the first dielectric and the second dielectric are different.

[0006] According to the technical solution of the embodiment of the present application, the difference in dielectric constant or dielectric loss factor between the first medium and the second medium can be considered as a difference in one of the dielectric parameters, or, it can also be that both dielectric parameters are different, which can be selected according to actual production or design, and the present application does not limit this. For example, a medium with a high DK value can be filled in the gap formed between the excitation unit and the parasitic unit of the antenna radiator to improve the coupling between the resonance generated by the excitation unit and the resonance generated by the parasitic unit to improve the antenna radiation efficiency, or, it can also be set to set the medium with a high dielectric constant on the side of the antenna radiator away from the feeding point, so that the excitation of the floor becomes relatively more sufficient to improve the antenna radiation efficiency, or, a medium with a low DF value can be used in the dielectric layer area corresponding to the antenna radiator to reduce the loss of plastic particles of the dielectric to improve the antenna radiation efficiency.

[0007] In combination with the first aspect, in certain implementations of the first aspect, the dielectric constant of the second medium is greater than the dielectric constant of the first medium; wherein a first gap is opened at a first position of the frame, and the first gap is filled with the second medium, so that the frame still serves as a complete structural member after the first gap is opened, and the dielectric constant of the second medium in the first gap is greater than that of the first medium, and therefore can be equivalent to a distributed capacitor connected in parallel with the antenna radiator, and the capacitance value of the distributed capacitor is related to the dielectric constant of the second medium.

[0008] According to the technical solution of the embodiment of the present application, a second dielectric with a high dielectric constant is used to fill the gap formed between the first radiator and the frame, and the second dielectric filled in the gap can be equivalent to a distributed capacitor. As the dielectric constant is higher, the capacitance of the distributed capacitor formed will be larger when the frequency remains unchanged. The improvement in the corresponding radiation efficiency of the antenna structure after filling the medium with a high dielectric constant can be understood as the excitation of the floor inside the electronic device becoming relatively more sufficient, resulting in an improvement in the radiation efficiency of the antenna structure. At the same time, since the capacitance of the equivalent distributed capacitor also depends on the width of the gap and the overlapping area of ​​the metal on both sides of the gap, etc., the dielectric constant of the dielectric in different antenna structures may vary greatly, and can be adjusted according to actual production or design, and the present application does not limit this.

[0009] In combination with the first aspect, in some implementations of the first aspect, a second gap is opened at a second position of the frame, the second gap is filled with the first medium, and the first medium in the second gap is used to make the frame after the second gap is opened a complete structural member.

[0010] In combination with the first aspect, in some implementations of the first aspect, the dielectric constant of the second medium is smaller than the dielectric constant of the first medium, wherein a first gap is opened at a first position of the frame, and the first gap is filled with the second medium.

[0011] According to the technical solution of the embodiment of the present application, in some cases, a dielectric with a lower dielectric constant may be filled in the corresponding part of the antenna structure to achieve the same technical effect.

[0012] In combination with the first aspect, in some implementations of the first aspect, the electronic device also includes a feeding unit; a feeding point is provided on the antenna radiator, and the feeding unit feeds the antenna radiator at the feeding point; the distance between the feeding point and the first position of the frame is greater than the distance between the feeding point and the second position of the frame.

[0013] According to the technical solution of the embodiment of the present application, if the position of the second medium is moved toward the feeding point, the radiation efficiency of the antenna structure is still higher than that of other conventional particle-filled solutions. However, the radiation efficiency is relatively reduced relative to the traditional solution as the position of the second medium filler moves toward the head end (feeding point).

[0014] In combination with the first aspect, in certain implementations of the first aspect, the antenna structure includes a first radiator and a second radiator; the first radiator and the second radiator are arranged opposite to each other and form a third gap; the third gap is filled with the second medium, so that the frame still serves as a complete structural member after the third gap is opened, and the second medium in the third gap is equivalent to a distributed capacitor between the first radiator and the second radiator, and the capacitance value of the distributed capacitor is related to the dielectric constant of the second medium; the dielectric constant of the second medium is greater than the dielectric constant of the first medium.

[0015] According to the technical solution of the embodiment of the present application, the first radiator serves as an excitation unit, and the second radiator serves as a parasitic unit. A second medium different from the first medium is injected into the gap formed between the first radiator and the second radiator through a second injection molding to introduce a change, resulting in a significant change in the antenna efficiency of the same antenna design.

[0016] In combination with the first aspect, in some implementations of the first aspect, the dielectric layer is used to fix the antenna radiator in the electronic device.

[0017] In combination with the first aspect, in some implementations of the first aspect, the dielectric loss factor values ​​of the first medium and the second medium are the same.

[0018] In combination with the first aspect, in some implementations of the first aspect, a dielectric loss factor of the second medium is smaller than a dielectric loss factor of the first medium.

[0019] According to the technical solution of the embodiment of the present application, the dielectric loss factor of the second medium can be adjusted according to actual production or design, and the present application does not limit this.

[0020] In combination with the first aspect, in certain implementations of the first aspect, the dielectric constants of the first medium and the second medium are the same, and the dielectric loss factor of the second medium is smaller than the dielectric loss factor of the first medium.

[0021] According to the technical solution of the embodiment of the present application, the antenna structure is changed by introducing a dielectric different from the first dielectric through the second injection molding, which can be considered to reduce the dielectric loss factor of the dielectric, thereby reducing the loss of plastic particles of the dielectric, so the efficiency will be relatively improved.

[0022] In combination with the first aspect, in certain implementations of the first aspect, at least the entire surface of the antenna radiator is filled with the second medium, wherein the first medium is a dielectric and the second medium is a magnetic medium; or, the first medium is a magnetic medium and the second medium is a dielectric.

[0023] According to the technical solution of the embodiment of the present application, the antenna structure is filled with high-loss magnetic materials, and under the same antenna environment, the radiation efficiency of the antenna is still high. For the dielectric layer of the radiator corresponding area of ​​the antenna structure, if a medium with a higher dielectric loss factor needs to be selected, the medium of the second injection molding process can be selected as a magnetic medium, which can obtain better radiation efficiency.

[0024] In combination with the first aspect, in some implementations of the first aspect, the second medium is provided on at least a portion of the inner surface of the antenna radiator.

[0025] According to the technical solution of the embodiment of the present application, at least part of the inner surface of the antenna radiator may include a surface of the antenna radiator close to the PCB or battery inside the electronic device, and an end surface at one end of the antenna radiator.

[0026] In combination with the first aspect, in some implementations of the first aspect, at least a portion of the outer surface of the antenna radiator is provided with the second medium; and the dielectric constant of the second medium is greater than the dielectric constant of the first medium.

[0027] According to the technical solution of the embodiment of the present application, the second medium can be used as an extension of the antenna radiator to improve the efficiency of the antenna structure.

[0028] In combination with the first aspect, in some implementations of the first aspect, one end of a first dielectric layer formed by the first dielectric is connected to one end of a second dielectric layer formed by the second dielectric.

[0029] According to the technical solution of the embodiment of the present application, the first dielectric layer and the second dielectric layer may be adjacent to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of an electronic device provided in an embodiment of the present application.

[0031] Figure 2 The schematic diagram of the structure of the NMT metal structure is shown as an example.

[0032] Figure 3 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0033] Figure 4 It is a schematic diagram of the secondary injection molding process provided in an embodiment of the present application.

[0034] Figure 5 It is a schematic diagram of a traditional antenna structure.

[0035] Figure 6 yes Figure 3 Schematic diagram of S11 parameter simulation results of the antenna structure shown.

[0036] Figure 7 yes Figure 3 Schematic diagram of simulation results of radiation efficiency and system efficiency of the antenna structure shown.

[0037] Figure 8 yes Figure 3 Schematic diagram of current distribution of the antenna structure shown.

[0038] Fig. 9 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0039] Fig.10 It is a schematic diagram of the S11 parameter simulation results provided in the embodiment of the present application.

[0040] Fig.11 It is a schematic diagram of simulation results of radiation efficiency and system efficiency provided in an embodiment of the present application.

[0041] Fig.12 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0042] Fig.13 yes Fig.12 Schematic diagram of the simulation results of the radiation efficiency of the antenna structure shown.

[0043] Fig.14 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0044] Fig.15 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0045] Fig.16 yes Fig.14 Schematic diagram of the simulation results of the radiation efficiency of the antenna structure shown.

[0046] Fig.17 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0047] Fig.18 yes Fig.17 Schematic diagram of S11 parameter simulation results of the antenna structure shown.

[0048] Fig.19 yes Fig.17 Schematic diagram of Smith simulation results for the antenna structure shown.

[0049] Fig. 20 yes Fig.17 Schematic diagram of simulation results of radiation efficiency and system efficiency of the antenna structure shown.

[0050] Fig.21 yes Fig.17 Schematic diagram of current distribution of the antenna structure shown.

[0051] Fig. 22 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0052] Fig.23 It is a schematic diagram of the simulation results of the radiation efficiency of dielectrics with different DF values.

[0053] Fig.24 It is a schematic diagram of the simulation results of the radiation efficiency of magnetic media with different loss factors. DETAILED DESCRIPTION

[0054] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0055] It should be understood that in this application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as a form of connection between different components in the circuit structure through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals. "Communication connection" can refer to electrical signal transmission, including wireless communication connection and wired communication connection. Wireless communication connection does not require a physical medium and does not belong to a connection relationship that limits the product structure. "Connection" and "connected" can both refer to a mechanical connection relationship or a physical connection relationship. For example, A is connected to B or A is connected to B, which can mean that there is a fastening component (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and A and B are difficult to separate.

[0056] The technical solution provided in this application is applicable to electronic devices that adopt one or more of the following communication technologies: Bluetooth (blue tooth, BT) communication technology, global positioning system (global positioning system, GPS) communication technology, wireless fidelity (wireless fidelity, WiFi) communication technology, global system for mobile communications (global system for mobile communications, GSM) communication technology, wideband code division multiple access (wideband code division multiple access, WCDMA) communication technology, long term evolution (long term evolution, LTE) communication technology, 5G communication technology and other future communication technologies, etc. The electronic device in the embodiment of this application can be a mobile phone, a tablet computer, a laptop computer, a smart bracelet, a smart watch, a smart helmet, smart glasses, etc. The electronic device may also be a cellular phone, a cordless phone, a session initiation protocol (SIP) phone, a wireless local loop (WLL) station, a personal digital assistant (PDA), a handheld device with wireless communication capabilities, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network, or an electronic device in a future evolved public land mobile network (PLMN), etc., and the embodiments of the present application are not limited to this.

[0057] Figure 1 The internal environment of the electronic device provided in the present application is exemplified, with the electronic device being a mobile phone for illustration.

[0058] like Figure 1 As shown, the electronic device 10 may include: a cover glass 13 , a display 15 , a printed circuit board (PCB) 17 , a housing 19 and a rear cover 21 .

[0059] The glass cover plate 13 may be disposed close to the display screen 15 , and may be mainly used to protect the display screen 15 from dust.

[0060] In one embodiment, the display screen 15 may be a liquid crystal display (LCD), a light emitting diode (LED) or an organic light-emitting diode (OLED), etc., and the present application does not impose any limitation on this.

[0061] Among them, the printed circuit board PCB17 can adopt a flame retardant material (FR-4) dielectric board, a Rogers dielectric board, a mixed dielectric board of Rogers and FR-4, and so on. Here, FR-4 is a code for a grade of flame retardant material, and Rogers dielectric board is a high-frequency board. A metal layer can be set on the side of the printed circuit board PCB17 close to the middle frame 19, and the metal layer can be formed by etching metal on the surface of PCB17. The metal layer can be used for grounding the electronic components carried on the printed circuit board PCB17 to prevent the user from electric shock or damage to the equipment. The metal layer can be called a PCB floor. In addition to the PCB floor, the electronic device 10 can also have other floors for grounding, such as a metal middle frame.

[0062] The electronic device 10 may further include a battery, which is not shown here. The battery may be disposed in the middle frame 19, and the battery may divide the PCB 17 into a main board and a sub-board, wherein the main board may be disposed between the middle frame 19 and the upper edge of the battery, and the sub-board may be disposed between the middle frame 19 and the lower edge of the battery.

[0063] Among them, the middle frame 19 mainly plays a supporting role for the whole machine. The middle frame 19 may include a frame 11, and the frame 11 may be formed of a conductive material such as metal. The frame 11 may extend around the periphery of the electronic device 10 and the display screen 15. The frame 11 may specifically surround the four sides of the display screen 15 to help fix the display screen 15. In one implementation, the frame 11 made of a metal material may be directly used as a metal frame of the electronic device 10, forming the appearance of a metal frame, which is suitable for a metal ID. In another implementation, the outer surface of the frame 11 may also be a non-metallic material, such as a plastic frame, to form the appearance of a non-metallic frame, which is suitable for a non-metallic ID.

[0064] The back cover 21 may be a back cover made of a metal material, or a back cover made of a non-conductive material, such as a glass back cover, a plastic back cover or other non-metal back cover.

[0065] Figure 1 Only some components of the electronic device 10 are schematically shown, and the actual shapes, sizes and structures of these components are not subject to the present invention. Figure 1 limited.

[0066] At present, electronic devices generally use NMT-based metal structural parts as appearance parts. NMT is a process that combines metal and plastic with nanotechnology. NMT is to first nano-process the metal surface, and then directly inject plastic onto the metal surface to form the metal and plastic into one piece. Through the establishment of this technology, the metal appearance texture is taken into account, and the product can also be made thinner and lighter.

[0067] NMT injection molded metal appearance parts of electronic devices, the antennas of electronic devices all use metal appearance parts as antenna radiators. For example, metal structural parts can be Figure 2 The back cover of the electronic device shown in the figure. The plastic particles filled in the linear gap formed by the NMT process can be used to separate the complete metal back cover into two parts. The antenna radiator part is located at the bottom of the plastic gap, such as the top or bottom of the electronic device.

[0068] It should be understood that for the antenna in the electronic device, the gap formed between it and the frame or the middle frame needs to be filled with plastic particles, so that the antenna radiator is fixed in the electronic device, so that it forms a complete structural part with the frame or the middle frame. Through the NMT process, plastic particles can usually be injected with disposable metal structural parts in a pre-designed area. The function of the dielectric layer formed by the NMT process is to fix the antenna radiator in the electronic device. For example, when a gap is opened in the metal frame to be reused as an antenna radiator, the dielectric layer can make the metal frame with the gap into a complete structural part. When the antenna radiator is set in the frame and a gap is formed between it and the middle frame, the dielectric layer can combine the antenna branch and the middle frame as a complete structural part. Because the antenna radiator is also part of the metal structure appearance, the properties of the nano-injection molded plastic particles need to meet the requirements of the nano-injection molding process at the same time, and at the same time, the electrical properties of the particles also need to meet the requirements related to the antenna design. Electronic devices need to support 2G / 3G / 4G / 5G communication specifications, and antenna design needs to meet the frequency band requirements of different communication system tests. Communications need to cover the frequency band of 700MHz-6000MHz. The dielectric constant (DK) and dielectric loss factor (DF) values ​​of plastic particles used in these frequency bands can reflect the dielectric parameters of the particles. Usually DK=3.5 and DF=0.015 are typical dielectric parameters of nano injection molding particles in RF bands. Generally speaking, as the DK and DF values ​​increase (ideal material DK=1, DF=0), the antenna radiation efficiency will decrease to varying degrees. Compared with DF, DK has a greater impact on the antenna radiation efficiency. As DK increases, the electrical size of the antenna will decrease accordingly. The bandwidth of the antenna will also become narrower accordingly.

[0069] An embodiment of the present application provides an antenna structure, which performs secondary injection molding through the NMT process to change the dielectric of the dielectric layer corresponding to the radiator at different positions, thereby achieving the purpose of changing the antenna radiation characteristics and improving the antenna radiation efficiency. For example, a dielectric with a high DK value can be filled in the gap formed between the excitation unit and the parasitic unit of the antenna radiator to improve the coupling between the resonance generated by the excitation unit and the resonance generated by the parasitic unit to improve the antenna radiation efficiency. Alternatively, the dielectric with a high DK value can be set on the side of the antenna radiator away from the feeding point to make the excitation of the floor relatively more sufficient to improve the antenna radiation efficiency. Alternatively, a dielectric with a low DF value and / or a low DK value can be used in the dielectric layer area corresponding to the antenna radiator to reduce the loss of plastic particles of the dielectric to improve the antenna radiation efficiency.

[0070] It should be understood that in the present application, the medium may be a solid medium, an electrical medium or a magnetic medium, and the present application does not impose any limitation on this, and the medium may be selected according to actual production or design.

[0071] Figure 3 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0072] It should be understood that in the embodiments of the present application, the antenna structure can be an inverted L-shaped antenna (inverted Lantenna, ILA), an inverted F-shaped antenna (inverted F antenna, IFA) or a planar inverted F-shaped antenna (planner Inverted F antenna, PIFA), or other forms of antenna structures, and the present application does not impose any restrictions on this.

[0073] like Figure 3 As shown in (a) of FIG. 1 , the electronic device 10 may include a frame 11 and a dielectric layer 120. The frame 11 may include a first position 1231 and a second position 1232, and the frame between the first position 1231 and the second position 1232 serves as the antenna radiator 110. In this embodiment, the frame between the first position 1231 and the second position 1232 is as follows: Figure 3 As shown in (a), the border between position 1231 and position 1232 on the left side of the border.

[0074] like Figure 3As shown in (b) of FIG. 1 , the dielectric layer 120 is disposed on the surface of the frame 11. The dielectric layer 120 may include a first dielectric layer 121 and a second dielectric layer 122 connected to each other, the first dielectric layer 121 includes a first dielectric, the second dielectric layer 122 includes a second dielectric, and the first dielectric and the second dielectric are different. In addition to the frame between the first position 1231 and the second position 1232, at least part of the inner surface of the frame 11 is provided with the first dielectric layer 121 including the first dielectric. In addition to the frame between the first position 1231 and the second position 1232, the first dielectric layer 121 including the first dielectric may be disposed on the inner surface of the frame 11. Figure 3 As shown in (a) of FIG. 1 , the frame is above position 1231 or below position 1232 on the left side of the frame, or the frame is on other sides. A second dielectric layer 122 including a second dielectric is disposed on at least a portion of the surface of the antenna radiator 110 .

[0075] The frame 11 between the first position 1231 and the second position 1232 can be considered as the frame corresponding to the path with the shortest distance along the frame between the first position 1231 and the second position 1232. In addition to the frame between the first position 1231 and the second position 1232, the frame can be considered as the frame corresponding to the path with the longest distance along the frame between the first position 1231 and the second position 1232.

[0076] It should be understood that the first dielectric layer 121 and the second dielectric layer 122 can be arranged in parallel, for example, the first dielectric layer 121 and the second dielectric layer 122 are both in contact with the frame 11, and one end of the first dielectric layer 121 is connected to one end of the second dielectric layer 122. At the same time, the inner surface of the frame 11 can be considered as the surface of the frame close to the PCB and the battery in the electronic device, or it can also be considered as the end surface of the frame 11 where the gap is formed.

[0077] In one embodiment, the dielectric layer 120 includes a first dielectric layer 121 and a second dielectric layer 122 between the first position 1231 and the second position 1232. For example, the first dielectric layer 121 and the second dielectric layer 122 are arranged in the dielectric layer corresponding to the antenna radiator 110. The first dielectric layer 121 and the second dielectric layer 122 can be arranged adjacent to each other.

[0078] It should be understood that the dielectric layer 120 may also cover all or part of the border 11 at other positions. For the sake of simplicity, in the following embodiments, only the dielectric layer in the area corresponding to the antenna radiator 110 is used as an example for description, such as the dielectric layer between the first position 1231 and the second position 1232. The dielectric layer outside this area may include the first dielectric layer 121 of the first medium, or other media. The present application does not impose any restrictions on this.

[0079] In one embodiment, the antenna radiator 110 is a section of the frame 11, and can form a housing of the electronic device 10 together with the frame 11 and the back cover of the electronic device 10. It should be understood that other antenna structures can also be provided on the frame 11 to meet the communication needs of users.

[0080] In one embodiment, the first medium and the second medium are different, which can be understood as the first medium and the second medium are both dielectrics, and the DK or DF of the first medium and the second medium are different. The difference in DK or DF of the first medium and the second medium can be considered as a difference in one of the medium parameters, or both medium parameters can be different, which can be selected according to actual production or design, and the present application does not limit this.

[0081] In one embodiment, the DK value of the second dielectric layer 122 may be greater than that of the first dielectric layer 121. In this case, the DF value of the second dielectric layer 122 may be the same as that of the first dielectric layer 121.

[0082] In one embodiment, the first dielectric layer 121 and the second dielectric layer 122 are different, which can be understood as one of the first dielectric layer 121 and the second dielectric layer 122 is a magnetic dielectric, and the other is an electrical dielectric.

[0083] In one embodiment, the electronic device 10 may further include a feeding unit 130. A feeding point 131 is provided on the first radiator 110, and the feeding unit 130 is electrically connected or coupled to the first radiator 110 at the feeding point 131 to provide an electrical signal to the antenna radiator 110. It should be understood that in the embodiment, the feeding point 131 is only for illustration and not for limitation, and may be adjusted according to actual production or design, and the present application does not limit this.

[0084] In one embodiment, the antenna structure formed by the antenna radiator 110 can work in a quarter-wavelength mode. The length L1 of the first radiator can be designed and adjusted according to the actual working frequency band.

[0085] In one embodiment, the second medium is arranged on a side of the medium layer away from the feeding point.

[0086] In one embodiment, as shown in the figure, the first radiator 110 is arranged opposite to one end of the adjacent frame 111 and forms a first gap 140. One end of the adjacent frame 11 can be the first position 1231 or the second position 1232 of the frame 11. The first gap 140 can be filled with a second medium to form at least a portion of the second medium layer 122.

[0087] It should be understood that the embodiment of the present application is described by taking the example of a gap 140 filled with a second medium at a first position 1231 of an adjacent frame 111. The gap 141 opened at a second position 1232 of an adjacent frame 112 can be filled with a first medium, and the first medium in the gap 141 is used to ensure that the frame 11 with the gap is still a complete structural member.

[0088] In one embodiment, the electronic device 10 may further include a PCB 17 and a battery 18. The dielectric layer 120 may be located between the first radiator 110 and the PCB 17 or the battery 18.

[0089] It should be understood that the technical solution provided in the embodiment of the present application can change the structure of the dielectric layer through a secondary injection molding process. The dielectric layer can be arranged between structural members (middle frame, battery or PCB) adjacent to or connected to the antenna radiator, so that the dielectric layer includes two different dielectric materials, and a dielectric layer with a higher DK value is filled in the corresponding part of the antenna radiator 110 to meet the needs of the antenna structure. Alternatively, in some cases, a dielectric with a lower DK value can also be filled in the corresponding part of the antenna radiator 110 to achieve the same technical effect.

[0090] Figure 4 It is a schematic diagram of the secondary injection molding process provided in an embodiment of the present application.

[0091] like Figure 4 As shown, according to the process steps, the particles of the first medium and the particles of the second medium can be sequentially injected into the corresponding positions of the dielectric layer through different master molds to achieve the purpose of changing the dielectric parameters of the dielectric layer corresponding to the radiator at different positions, so as to achieve the purpose of changing the radiation characteristics of the antenna and improving the radiation efficiency of the antenna. For example, the secondary injection molding can be achieved through the following steps: one mold closing, one injection, mold opening, secondary mold closing, secondary injection, and ejection. The secondary injection molding can also be achieved through other steps, and this application is only used as an example.

[0092] It should be understood that the embodiment of the present application only provides a solution for realizing the antenna structure by a secondary injection molding process, and the same antenna structure can also be realized by other technologies, and the present application does not impose any limitation on this.

[0093] Figure 5 It is a schematic diagram of an antenna structure for comparison with the embodiment of the present application.

[0094] like Figure 5 In the antenna structure shown in (a), the gap opened on the frame, such as the gap formed between the radiator and the adjacent frame, is filled with the first dielectric, and the dielectric layer also only includes the first dielectric layer, for example, the antenna structure is an ILA in the original state.

[0095] like Figure 5In the antenna structure shown in (b), the gap formed on the frame, such as the gap formed between the radiator and the adjacent frame, is connected by a metal member, such as connecting the radiator to the adjacent frame by a metal member, and the dielectric layer also only includes the first dielectric layer. It should be understood that when the radiator is connected to the adjacent frame by a metal member, the antenna structure is a composite right and left hand (CRLH) antenna.

[0096] Figure 6 and Figure 7 The embodiment of this application provides Figure 3 and Figure 5 The schematic diagram of the simulation comparison results of the antenna structure formed by the antenna radiator shown. Figure 6 It is a schematic diagram of the S11 parameter simulation results provided in the embodiment of the present application. Figure 7 is a schematic diagram of the simulation results of the radiation efficiency and system efficiency (total efficiency) provided in the embodiment of the present application. It should be understood that Figure 3 Figure 5 In the antenna structure shown, the antenna types are different, so different matching is done for each different antenna type. Figure 6 and Figure 7 The results shown are the simulation results after adding matching.

[0097] In an embodiment, the antenna structure can operate at a low frequency. In this case, the length L1 of the corresponding first radiator can be 38 mm. At the same time, the DK value of the first medium can be 3.5, and the DK value of the second medium can be 100. The DF values ​​of the first medium and the second medium can be the same, both of which are 0.015. It should be understood that the above medium parameters are only used for example, and the embodiments of the present application are not limited to this, and can be adjusted according to actual production or design.

[0098] like Figure 6 As shown, Figure 3 and Figure 5 The antenna structures shown can all excite resonance near 800 MHz when fed by the feeding unit, and their resonance points are all at 800 MHz, which can meet the communication requirements.

[0099] like Figure 7 As shown, the antenna structure provided by the embodiment of the present application has a radiation efficiency and a system efficiency compared with Figure 5 The antenna structure shown has an improvement of more than 4dB, and the efficiency improvement is very obvious.

[0100] Figure 8 The embodiment of this application provides Figure 3 and Figure 5Schematic diagram of current distribution of the antenna structure shown.

[0101] like Figure 8 As shown in (a) of Figure 5 (a) is a schematic diagram of the current distribution corresponding to the original state of ILA. Figure 8 As shown in (b) of Figure 5 (b) is a schematic diagram of the current distribution corresponding to the CRLH antenna where the radiator is connected to the adjacent frame through a metal piece. Figure 8 (c) is a schematic diagram of current distribution of the antenna structure provided in an embodiment of the present application.

[0102] like Figure 8 As shown, it can be concluded that when the antenna structure provided in the embodiment of the present application is working, a larger current on the floor is excited compared to the traditional antenna structure. It can also be explained that under a given antenna space, the antenna structure provided in the embodiment of the present application can obtain better antenna efficiency.

[0103] It should be understood that in the antenna structure provided in the embodiment of the present application, the second dielectric is used to fill the gap on the frame, so that the frame can still be a complete structural member after the first gap is opened; the second dielectric with a high DK value is used to fill the gap opened on the frame, and the second dielectric filled in the gap can be equivalent to a distributed capacitor. The calculation formula of the capacitance value is as follows:

[0104]

[0105] Among them, ε is the dielectric constant, which is the DK value in the embodiment of the present application; δ is the absolute dielectric constant in a vacuum; k is the electrostatic force constant; S is the facing area of ​​the two electrodes, which is the relative area of ​​the borders on both sides of the gap in the embodiment of the present application (for example, the antenna radiator and the adjacent borders); d is the vertical distance between the two electrodes, which is the width of the gap in the embodiment of the present application.

[0106] As shown in the above formula, as the DK value increases, the capacitance of the distributed capacitor formed will also increase when the frequency remains unchanged. The improvement in the corresponding radiation efficiency of the antenna structure filled with a high-DK dielectric can be understood as the excitation of the floor inside the electronic device becoming relatively more sufficient, resulting in an improvement in the radiation efficiency of the antenna structure. At the same time, since the capacitance of the equivalent distributed capacitor also depends on the width of the gap and the overlapping area of ​​the metal on both sides of the gap, the DK value of the dielectric in different antenna structures may vary greatly and can be adjusted according to actual production or design, and this application does not limit this.

[0107] In one embodiment, the floor in the above embodiment may be a PCB, a middle frame or other metal layer of an electronic device, and the present application does not impose any limitation on this.

[0108] It should be understood that in this embodiment, if one of the medium parameters DK and / or DF of the second medium in the dielectric layer or both medium parameters are reduced relative to the DK and / or DF corresponding to the first medium, in extreme cases the DK and / or DF of the second medium will approach 1 (limit value). In this case, the radiation efficiency of the antenna structure will also be improved.

[0109] At the same time, in order to facilitate comparison with the traditional antenna structure, the embodiment of the present application adopts the same DF value and different DK value of the first medium and the second medium. In actual production or design, the DF value or DK value of the first medium and the second medium can be adjusted at the same time, and the present application does not limit this.

[0110] Fig. 9 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0111] like Fig. 9 As shown, the antenna radiator 110 may also be disposed at the bottom of the electronic device.

[0112] In one embodiment, the working frequency band of the antenna structure formed by the antenna radiator 110 may cover the global positioning system (GPS) frequency band of 1500 MHz to 1600 MHz.

[0113] Fig.10 and Fig.11 The embodiment of this application provides Fig. 9 Schematic diagram of the simulation results of the antenna structure shown. Fig.10 It is a schematic diagram of the S11 parameter simulation results provided in the embodiment of the present application. Fig.11 It is a schematic diagram of simulation results of radiation efficiency and system efficiency provided in an embodiment of the present application.

[0114] and Figure 3 Compared with the antenna structure shown in FIG. 1 , in this embodiment, the antenna structure can also work at a high frequency. In this case, the length L1 of the corresponding first radiator can be 23 mm. At the same time, the DK value of the first medium can be 3.5, and the DK value of the second medium can be 30. The DF value of the first medium and the second medium can be the same, both of which are 0.015. It should be understood that the above medium parameters are only used for example, and the embodiments of the present application are not limited to this, and can be adjusted according to actual production or design.

[0115] like Fig.10 As shown, Fig. 9 The antenna structure and Figure 5 When the feeding unit feeds power to the antenna structure shown, the working frequency band can cover the GPS frequency band and meet the communication requirements.

[0116] like Fig.11 As shown, the antenna structure provided by the embodiment of the present application has a radiation efficiency and a radiation efficiency compared with that of Figure 5 The antenna structure shown has an improvement of more than 1dB, and the efficiency improvement is very obvious.

[0117] It should be understood that in the antenna structure provided in the embodiment of the present application, a second medium with a high DK value is used to fill the gap formed between the first radiator and the adjacent frame, and the second medium filled in the gap can be equivalent to a distributed capacitor connected in parallel with the antenna radiator. The improvement in the corresponding radiation efficiency of the antenna structure filled with a high DK medium can be understood as the excitation of the floor inside the electronic device becoming relatively more sufficient, resulting in an improvement in the radiation efficiency of the antenna structure.

[0118] At the same time, in order to facilitate comparison with the traditional antenna structure, the embodiment of the present application adopts the same DF value and different DK value of the first medium and the second medium. In actual production or design, the DF value or DK value of the first medium and the second medium can be adjusted at the same time, and the present application does not limit this.

[0119] Fig.12 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0120] like Fig.12 In the antenna structure provided by the embodiment of the present application shown in (a), the gap formed between the antenna radiator and the adjacent frame is filled with a second medium, the DK value of the second medium can be greater than the first medium, and the DF value of the second medium can be the same as the first medium. Alternatively, the DF value of the second medium can be different from that of the first medium, for example, the DF value of the second medium can be less than that of the first medium, and can be adjusted according to actual production or design, and the present application does not limit this.

[0121] like Fig.12 In the comparative antenna structure shown in (b), the gap formed between the radiator and the adjacent frame is filled with the first dielectric, and the dielectric layer also only includes the first dielectric layer, for example, the antenna structure is an ILA in the original state.

[0122] like Fig.12 The comparative antenna structure shown in (c) in Fig.12 Based on the antenna structure shown in (b), a second medium is covered on part of the outer surface of the radiator.

[0123] like Fig.12 The comparative antenna structure shown in (d) in Fig.12 Based on the antenna structure shown in (b), the entire outer surface of the radiator is covered with a second medium.

[0124] Fig.13 yes Fig.12 Schematic diagram of the simulation results of the radiation efficiency of the antenna structure shown.

[0125] In this embodiment, the antenna structure can also operate at a low frequency, the DK value of the first medium can be 3.5, and the DK value of the second medium can be 100. The DF values ​​of the first medium and the second medium can be the same, both of which are 0.015. It should be understood that the above medium parameters are only used for example, and the embodiments of the present application are not limited to this, and can be adjusted according to actual production or design.

[0126] The method provided in this application of changing the material of the dielectric layer corresponding to the antenna radiator by secondary injection molding through the NMT process is closely related to the position of the second medium of the secondary injection molding. By optimizing the design and selecting the filling position, the antenna efficiency can be significantly improved in the low frequency band (700MHz-1000MHz).

[0127] like Fig.13 As shown, compared to Fig.12 The antenna structures shown in (b) to (d) in the embodiment of the present application have a radiation efficiency that is improved by about 4-10 dB in the low frequency band after secondary injection molding.

[0128] It should be understood that in the antenna structure provided in the embodiment of the present application, a second medium with a high DK value is used to fill the gap formed between the radiator and the adjacent frame, and the second medium filled in the gap can be equivalent to a distributed capacitor. The improvement in the corresponding radiation efficiency of the antenna structure filled with a high DK medium can be understood as the excitation of the floor inside the electronic device becoming relatively more sufficient, resulting in an improvement in the radiation efficiency of the antenna structure.

[0129] At the same time, in order to facilitate comparison with the traditional antenna structure, the embodiment of the present application adopts the same DF value and different DK value of the first medium and the second medium. In actual production or design, the DF value or DK value of the first medium and the second medium can be adjusted at the same time, and the present application does not limit this.

[0130] In one embodiment, Fig.12 In the antenna structure shown in (a), the second dielectric is filled at the end of the radiator (the end where the feeding point is located can be considered as the head end), for example, away from the feeding point. If the second dielectric is moved toward the feeding point, the radiation efficiency of the antenna structure is still higher than that of other conventional particle filling solutions, but the radiation efficiency is relatively Fig.12 The position shown in (a) in FIG. 1 is relatively reduced as the position of the second dielectric filling moves toward the head end (feeding point).

[0131] Fig.14It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0132] It should be understood that the antenna structure in the above embodiments adopts ILA, and the solution provided in the embodiments of the present application can also be applied to other antenna forms, for example, it can be a closed slot antenna, such as Fig.14 shown.

[0133] like Fig.14 In the antenna structure provided by the embodiment of the present application shown in (a), the dielectric layer between the first position and the second position of the frame may only include a second medium with a low DF value, the DF value of the second medium may be smaller than that of the first medium, and the DK value of the second medium may be the same as that of the first medium.

[0134] It should be understood that the method provided in the embodiment of the present application for changing the material of the dielectric layer corresponding to the antenna radiator through secondary injection molding by NMT process to improve the radiation efficiency of the antenna structure can also use a second medium with a low DF value to fill the dielectric layer.

[0135] like Fig.15 As shown, a dielectric layer can be provided on the inner side of the frame 11 (close to the PCB 17 or the battery 18), the dielectric layer between the first position and the second position of the frame adopts the second dielectric layer 220, and the remaining dielectric layers adopt the first dielectric layer 210. Therefore, for the entire dielectric layer, the second dielectric 220 changes the material of the dielectric layer corresponding to the radiator of the antenna structure through secondary injection molding to improve the radiation efficiency of the antenna structure.

[0136] At the same time, in actual production or design, the area filled by the second medium 220 can be adjusted according to actual conditions so that the area filled by the second medium 220 is larger or smaller than the area of ​​the medium layer between the first position and the second position of the frame, and the present application does not impose any restrictions on this.

[0137] like Fig.14 In the antenna structure shown in (b), the dielectric layer corresponding to the radiator is the first dielectric layer, for example, the antenna structure is a closed slot antenna in the original state.

[0138] like Fig.14 In the antenna structure shown in (c), the dielectric layer corresponding to the radiator is the third dielectric layer, the DK value of the third dielectric included in the third dielectric layer can be greater than the first dielectric, and the DF value of the third dielectric can be the same as the first dielectric.

[0139] like Fig.14 The antenna structure shown in (d) in Fig.14Based on the antenna structure shown in (b), a third dielectric layer is covered on the entire outer surface of the radiator, and the DK value of the third medium included in the third dielectric layer can be greater than the first medium, and the DF value of the third medium can be the same as the first medium.

[0140] Fig.16 yes Fig.14 Schematic diagram of the simulation results of the radiation efficiency of the antenna structure shown.

[0141] In this embodiment, the antenna structure can also work at a low frequency, and the length of the corresponding radiator can be 41 mm. The DK value of the first medium can be 3.5, the DF value can be 0.015, the DK value of the second medium can be 3.5, the DF value can be 0.001, and the DK value of the third medium can be 100, and the DF value can be 0.015. It should be understood that the above medium parameters are only used for example, and the embodiments of the present application are not limited to this, and can be adjusted according to actual production or design.

[0142] The antenna structure is changed by the second injection molding of a dielectric different from the first dielectric, resulting in a significant change in the antenna efficiency of the same antenna design. Fig.16 As shown, the efficiency comparison between the antenna structure provided in the present application and the conventional design is shown. It can be clearly seen from the results that the antenna structure provided in the present application can effectively improve the radiation efficiency; it can be considered that the DF of the dielectric is reduced, thereby reducing the loss of plastic particles in the dielectric, so the efficiency will be relatively improved.

[0143] at the same time, Fig.14 The antenna structure shown in (d) can also improve the radiation efficiency of the antenna. This efficiency improvement can be considered as the high DK dielectric acting as an extension of the outer conductor of the closed slot antenna, and the more the outer conductor extends outward, the more the radiation efficiency of the antenna is improved.

[0144] Fig.17 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0145] like Fig.17 As shown in (a) and (b) of FIG. 8 , the antenna radiator may include a first radiator 310 , a second radiator 320 , a dielectric layer 330 and a feeding unit 350 .

[0146] The first radiator 310 and the second radiator 320 may be arranged between the first position 3231 and the second position 3232 of the frame 11, and a gap 360 is formed between the first radiator 310 and the second radiator 320. The gap 360 may be filled with the second dielectric 332, and the other part of the dielectric layer between the first position 3231 and the second position 3232 of the frame 11 may be filled with the first dielectric 331, and the DK value of the second dielectric 332 is greater than that of the first dielectric 331. A feeding point may be arranged on the first radiator 310, and the feeding unit 350 may be electrically connected to the first radiator 310 at the feeding point to feed the antenna structure.

[0147] In one embodiment, a grounding point may be provided on the second radiator 320, and the second radiator 320 may be grounded at the grounding point.

[0148] It should be understood that in the antenna structure provided in the embodiment of the present application, the first radiator 310 serves as an excitation unit, and the second radiator 320 serves as a parasitic unit. A change is introduced by injecting a second medium different from the first medium into the gap 360 formed between the first radiator 310 and the second radiator 320 through a second injection molding, resulting in a significant change in the antenna efficiency of the same antenna design.

[0149] Figures 18 to 20 yes Fig.17 The simulation results of the antenna structure shown in Figure 1 are schematic diagrams. Fig.18 yes Fig.17 Schematic diagram of S11 parameter simulation results of the antenna structure shown. Fig.19 yes Fig.17 Schematic diagram of Smith simulation results for the antenna structure shown. Fig. 20 yes Fig.17 Schematic diagram of simulation results of radiation efficiency and system efficiency of the antenna structure shown.

[0150] It should be understood that in the embodiments of the present application, the antenna structure (original state) used for comparison is different from the antenna structure (original state) used in the present application. Fig.17 The antenna structure of the embodiment shown is similar, the difference being that the gap 360 formed between the first radiator and the second radiator is still filled with the first medium.

[0151] In this embodiment, the DK value of the first medium may be 3.5, and the DK value of the second medium may be 15. The DF values ​​of the first medium and the second medium may be the same, both of which are 0.015. It should be understood that the above medium parameters are only used for example, and the embodiments of the present application are not limited thereto, and can be adjusted according to actual production or design.

[0152] like Fig.18As shown, when the antenna structure is fed by the feeding unit, the excitation unit and the parasitic unit can respectively excite resonances near 800MHz and 1100MHz, both of which can meet the communication requirements. It should be understood that the dielectric parameters of the dielectric layer or the length of the radiator can be adjusted according to different design or production needs to change the resonant frequency generated by the antenna unit, and this application does not limit this.

[0153] like Fig.19 and 20 As shown, the present application provides a method of performing secondary injection molding through the NMT process to change the material of the dielectric layer that fills the gap between the first radiator and the second radiator of the antenna structure, for example, changing the dielectric layer structure between the first position and the second position, specifically changing the dielectric parameters of the dielectric in the dielectric layer, and filling the gap between the excitation unit and the parasitic unit with a high DK value dielectric, thereby effectively improving the coupling between the resonance generated by the excitation unit and the resonance generated by the parasitic unit, and the antenna efficiency can be improved by about 3dB in the low frequency band (700MHz-1000MHz).

[0154] Fig.21 yes Fig.17 Schematic diagram of current distribution of the antenna structure shown.

[0155] like Fig.21 As shown, it is a current distribution diagram of the antenna structure provided by the embodiment of the present application and the comparative antenna structure when the antenna structure is at 800 MHz.

[0156] When the feeding unit is fed, a larger current is coupled from the excitation unit to the parasitic unit, resulting in a more sufficient current excitation of the floor of the electronic equipment, such as Fig.21 As shown in (b) in the figure, the radiation efficiency and system efficiency of the antenna structure are improved accordingly.

[0157] At the same time, in order to facilitate comparison with the traditional antenna structure, the embodiment of the present application adopts the same DF value and different DK value of the first medium and the second medium. In actual production or design, the DF value or DK value of the first medium and the second medium can be adjusted at the same time, and the present application does not limit this.

[0158] Fig. 22 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0159] In one embodiment, the dielectric layer 420 between the first location 4231 and the second location 4232 may be filled with a magnetic medium.

[0160] It should be understood that the parameters of the RF properties of magnetic and dielectric materials are relative permeability (μ) and loss factor (μF). In the same antenna structure, using different dielectric materials as the dielectric layer will have a very large difference in antenna efficiency.

[0161] Fig.23 and Fig.24 yes Fig. 22 The schematic diagram of the simulation results of the radiation efficiency of the dielectric layer of the antenna structure shown is a dielectric or magnetic medium. Fig.23 It is a schematic diagram of the simulation results of the radiation efficiency of dielectrics with different DF values. Fig.24 It is a schematic diagram of the simulation results of the radiation efficiency of magnetic media with different μF.

[0162] like Fig.23 As shown in the figure, when the DK value of the dielectric layer corresponding to the antenna radiator is fixed at 3.5, as the DF value increases from small to large, the radiation efficiency of the antenna structure deteriorates more and more obviously. This is because DF is the loss value of the dielectric material. The larger the DF value, the more obvious the loss.

[0163] like Fig.24 As shown in the figure, for the μ and μF of the magnetic dielectric material, when the μ value of the dielectric layer corresponding to the antenna radiator is fixed at 3.5, the change of μF of the magnetic dielectric does not significantly deteriorate the radiation efficiency of the antenna structure. Therefore, for the dielectric layer in the area corresponding to the antenna radiator, if a medium with a higher DF value is required, the medium of the second injection molding process can be selected as a magnetic medium, which can obtain better radiation efficiency.

[0164] When the antenna structure is filled with high-loss magnetic material particles, the radiation efficiency of the antenna is still high under the same antenna environment. It can be considered that the antenna structure provided in the embodiment of the present application is ILA. ILA mainly couples energy to the floor of the electronic device through a relatively concentrated electric field. When the electric field passes through the magnetic medium, it is not affected, but when the electric field passes through the dielectric, the DK and DF of the dielectric material will weaken the energy of the electric field coupled to the floor of the electronic device. Therefore, from Fig.23 When the dielectric DF of ILA increases, the radiation efficiency of the antenna structure decreases very quickly. Fig.24 Looking at the ILA solution, when μF increases, the radiation efficiency of the antenna structure is relatively little affected.

[0165] It should be understood that in the antenna structure provided in the embodiment of the present application, other mediums can be injected into the area of ​​the dielectric layer corresponding to the radiator through a secondary injection molding process to change the parameters of the dielectric layer corresponding to the radiator at different positions, thereby achieving the purpose of changing the antenna radiation characteristics and improving the antenna radiation efficiency.

[0166] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0167] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: A frame and a dielectric layer, wherein the dielectric layer is arranged on the surface of the frame and comprises a first dielectric layer and a second dielectric layer, wherein the first dielectric layer comprises a first dielectric, and the second dielectric layer comprises a second dielectric; The frame has a first position and a second position, wherein the frame between the first position and the second position serves as an antenna radiator; Wherein, except for the frame between the first position and the second position, at least a portion of the inner surface of the frame is provided with the first medium; A first gap is provided at a first position of the frame, and the first gap is filled with the second medium, and / or the radiator has a third gap, and the third gap is filled with the second medium; The first medium and the second medium have different dielectric constants or dielectric loss factors, or the first medium is a dielectric and the second medium is a magnetic medium.

2. The electronic device according to claim 1, characterized in that: The dielectric constant of the second medium is greater than the dielectric constant of the first medium.

3. The electronic device according to claim 2, characterized in that: A second gap is formed at a second position of the frame, and the second gap is filled with the first medium. The first medium in the second gap is used to make the frame a complete structural component after the second gap is formed.

4. The electronic device according to claim 1, characterized in that: The dielectric constant of the second medium is smaller than the dielectric constant of the first medium.

5. The electronic device according to claim 1, characterized in that: The electronic device further includes a feeding unit; A feeding point is provided on the antenna radiator, and the feeding unit feeds the antenna radiator at the feeding point; The distance between the feeding point and the first position of the frame is greater than the distance between the feeding point and the second position of the frame.

6. The electronic device according to claim 1, characterized in that: The antenna radiator includes a first radiator and a second radiator; The first radiator and the second radiator are arranged opposite to each other and form the third gap; The dielectric constant of the second medium is greater than the dielectric constant of the first medium.

7. The electronic device according to claim 6, characterized in that: The second medium in the first gap is equivalent to a distributed capacitor connected in parallel with the antenna radiator, and the capacitance value of the parallel distributed capacitor is related to the dielectric constant of the second medium; and / or The second medium in the third gap is equivalent to a distributed capacitor connected in series between the first radiator and the second radiator, and the capacitance value of the distributed capacitor connected in series is related to the dielectric constant of the second medium.

8. The electronic device according to claim 1, characterized in that: The electronic device also includes a printed circuit board PCB and a battery; The dielectric layer is located between the antenna radiator and the PCB, or the dielectric layer is located between the antenna radiator and the battery.

9. The electronic device according to claim 1, characterized in that: The dielectric constants of the first medium and the second medium are different, and the dielectric loss factors of the first medium and the second medium are the same.

10. The electronic device according to claim 1, characterized in that: The dielectric loss factor of the second medium is smaller than the dielectric loss factor of the first medium.

11. The electronic device according to claim 1, characterized in that: The dielectric constants of the first medium and the second medium are the same, and the dielectric loss factor of the second medium is smaller than the dielectric loss factor of the first medium.

12. The electronic device according to claim 1, characterized in that: At least part of the surface of the antenna radiator is filled with the second medium, wherein: The first medium is an electrical medium, and the second medium is a magnetic medium; Alternatively, the first medium and the second medium are both dielectrics, and the dielectric constant of the second medium is greater than the dielectric constant of the first medium.

13. The electronic device according to claim 1, characterized in that: The second medium is disposed on at least a portion of the inner surface of the antenna radiator.

14. The electronic device according to claim 1, characterized in that: The second medium is disposed on at least part of the outer surface of the antenna radiator; The dielectric constant of the second medium is greater than the dielectric constant of the first medium.

15. The electronic device according to claim 1, characterized in that: The first dielectric layer is disposed adjacent to the second dielectric layer.

16. The electronic device according to claim 1, characterized in that: One end of the first dielectric layer is connected to one end of the second dielectric layer.

17. An electronic device, characterized in that: include: A frame and a dielectric layer, wherein the dielectric layer is arranged on the surface of the frame and comprises a first dielectric layer and a second dielectric layer, wherein the first dielectric layer comprises a first dielectric, and the second dielectric layer comprises a second dielectric; The frame has a first position and a second position, wherein the frame between the first position and the second position serves as an antenna radiator; Wherein, except for the frame between the first position and the second position, at least a portion of the inner surface of the frame is provided with the first medium; At least a portion of the inner surface of the antenna radiator is provided with the second medium, and / or at least a portion of the outer surface of the antenna radiator is provided with the second medium; The first medium and the second medium have different dielectric constants or dielectric loss factors, or the first medium is a dielectric and the second medium is a magnetic medium.

18. The electronic device according to claim 17, characterized in that: The dielectric constant of the second medium is greater than the dielectric constant of the first medium.

19. The electronic device according to claim 17, characterized in that: The dielectric constant of the second medium is smaller than the dielectric constant of the first medium.

20. The electronic device according to any one of claims 17 to 19, characterized in that: The first dielectric layer is disposed adjacent to the second dielectric layer.

21. The electronic device according to any one of claims 17 to 19, characterized in that: One end of the first dielectric layer is connected to one end of the second dielectric layer.

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