Backplane and electronics

Abstract

The present invention discloses a backplane and an electronic device. The backplane is used to support a circuit board. A middle recessed portion with a bottom is formed on the top surface of the backplane facing the circuit board. A raised main support column is formed on the bottom surface of the middle recessed portion of the backplane for supporting the circuit board. In the present invention, the main support column formed on the backplane can increase the contact deformation amount of the central area of ​​the socket connector installed on the circuit board and improve the force uniformity of the socket connector, thereby improving the stability and reliability of the electrical contact between the central area of ​​the socket connector and the electronic chip.

Description

Technical Field

[0001] The invention relates to a back plate and an electronic device comprising the back plate. Background Art

[0002] In the prior art, a central processing unit (usually referred to as a CPU) is usually mounted on a socket connector of a circuit board in a pressurized manner. In order to ensure reliable electrical contact between the pins on the central processing unit and the socket connector, sufficient contact pressure needs to be applied to the central processing unit (usually referred to as a CPU).

[0003] In the prior art, the circuit board is usually supported on a backplane, and a pressure component is provided on the central processing unit. The pressure component is connected to the backplane and is used to apply a pressing force to the central processing unit to ensure reliable electrical contact between the central processing unit and the socket connector.

[0004] In the prior art, a portion of the backplane corresponding to the central area of ​​the socket connector is hollowed out, resulting in the central area of ​​the socket connector not being supported by any support. This will cause a reduction in the contact deformation of the central area of ​​the socket connector and uneven force on the socket connector, thereby reducing the stability and reliability of the electrical contact between the central area of ​​the socket connector and the central processing unit. Summary of the invention

[0005] The purpose of the present invention is to solve at least one aspect of the above-mentioned problems and defects in the prior art.

[0006] According to one aspect of the present invention, a back plate is provided, the back plate being used to support a circuit board. A middle recessed portion with a bottom is formed on the top surface of the back plate facing the circuit board. A raised main support column is formed on the bottom surface of the middle recessed portion of the back plate for supporting the circuit board.

[0007] According to an exemplary embodiment of the present invention, the middle recessed portion corresponds to a central area of ​​a socket connector mounted on the top surface of the circuit board; the main support column increases the contact deformation of the central area of ​​the socket connector by supporting the circuit board.

[0008] According to another exemplary embodiment of the present invention, the main support column is located at the center of the bottom surface of the middle recessed portion.

[0009] According to another exemplary embodiment of the present invention, a plurality of raised additional support columns are formed on the bottom surface of the middle recessed portion of the back plate, and the plurality of additional support columns are distributed around the main support column for supporting the circuit board together with the main support column.

[0010] According to another exemplary embodiment of the present invention, the top surface of the main support column is flush with the top surface of the additional support column, and the top surfaces of the main support column and the additional support column are flush with the top surface of the back plate.

[0011] According to another exemplary embodiment of the present invention, the number of the additional support columns is no less than three.

[0012] According to another exemplary embodiment of the present invention, the number of the additional support columns is three, four, five or six.

[0013] According to another exemplary embodiment of the present invention, the cross-section of the main support column and / or the additional support column is circular or regular polygonal.

[0014] According to another exemplary embodiment of the present invention, a cross-sectional area of ​​the main support column is greater than a cross-sectional area of ​​the additional support column.

[0015] According to another exemplary embodiment of the present invention, a plurality of strip-shaped recessed portions with bottoms are further formed on the top surface of the back plate, and the plurality of strip-shaped recessed portions are symmetrically distributed around the middle recessed portion and spaced apart from the middle recessed portion.

[0016] According to another exemplary embodiment of the present invention, the back plate is a single integral back plate having a predetermined thickness.

[0017] According to another exemplary embodiment of the present invention, the backplane is a combined backplane, the backplane includes a substrate and a top plate stacked on the substrate, and the thickness of the top plate is smaller than the thickness of the substrate.

[0018] According to another exemplary embodiment of the present invention, the base plate is a solid plate, a middle window is hollowed out on the top plate, the middle window constitutes the middle recessed portion, and the main support column is formed on the top surface of the base plate.

[0019] According to another exemplary embodiment of the present invention, a backplane insulating film is attached to the top surface of the backplane to electrically isolate the backplane from the circuit board.

[0020] According to another exemplary embodiment of the present invention, at least one threaded connector is provided at each corner of the backplane, and the threaded connector is used to connect a pressurizing component to the backplane; the pressurizing component is used to press an electronic chip onto the socket connector and to fix the electronic chip, the socket connector and the circuit board to the backplane.

[0021] According to another aspect of the present invention, there is provided an electronic device, comprising: the aforementioned backplane; a circuit board supported on the top surface of the backplane; a socket connector mounted on the circuit board; an electronic chip suitable for being electrically connected to the circuit board via the socket connector; and a pressure-applying component connected to the backplane and pressing the electronic chip onto the socket connector.

[0022] According to an exemplary embodiment of the present invention, the electronic chip is a central processing unit, and the central processing unit is in reliable electrical contact with the socket connector on the circuit board under the action of the pressing force applied by the pressing component.

[0023] According to another exemplary embodiment of the present invention, the electronic device further comprises a heat sink fixed to the top of the pressurizing member, and a bottom protrusion of the heat sink is received in a central opening on the pressurizing member and in thermal contact with the electronic chip.

[0024] According to another exemplary embodiment of the present invention, the pressurizing component includes a pressurizing bottom plate and a pressurizing top plate fixed on the pressurizing bottom plate, and the pressurizing top plate has an elastic pressing portion suitable for pressing on the electronic chip.

[0025] According to another exemplary embodiment of the present invention, a connecting nut suitable for connecting with a threaded connector on the back plate is provided at each corner of the pressurizing bottom plate to connect and fix the pressurizing component to the back plate.

[0026] According to another exemplary embodiment of the present invention, a cylindrical threaded sleeve suitable for threaded connection with a screw on the radiator is provided at each corner of the pressurized bottom plate to connect and fix the radiator to the pressurized component.

[0027] According to another exemplary embodiment of the present invention, a fixing screw is disposed on the pressurized top plate, and a fixing nut suitable for being threadedly connected with the fixing screw is disposed on the pressurized bottom plate to fix the pressurized top plate to the pressurized bottom plate.

[0028] According to another exemplary embodiment of the present invention, one side of the pressurizing top plate is rotatably connected to the pressurizing bottom plate, so that the pressurizing top plate can be rotatably opened relative to the pressurizing bottom plate after the fixing screw is removed.

[0029] According to another exemplary embodiment of the present invention, the pressurizing top plate is rotatably connected to the pressurizing bottom plate via a hinge structure.

[0030] According to another exemplary embodiment of the present invention, a layer of insulating film is attached to the bottom surface of the pressurizing component to electrically isolate the pressurizing component from the circuit board.

[0031] In the aforementioned various exemplary embodiments according to the present invention, the main support column formed on the back plate can increase the contact deformation of the central area of ​​the socket connector installed on the circuit board and improve the force uniformity of the socket connector, thereby improving the stability and reliability of the electrical contact between the central area of ​​the socket connector and the electronic chip.

[0032] Other objects and advantages of the present invention will become apparent from the following description of the present invention with reference to the accompanying drawings, which will help to provide a comprehensive understanding of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram showing an assembly of an electronic device according to an exemplary embodiment of the present invention;

[0034] Figure 2 An exploded schematic diagram showing an electronic device according to an exemplary embodiment of the present invention;

[0035] Figure 3 A partial cross-sectional view showing an electronic device according to an exemplary embodiment of the present invention;

[0036] Figure 4 A three-dimensional schematic diagram showing a back plate according to an exemplary embodiment of the present invention;

[0037] Figure 5 A three-dimensional schematic diagram showing a back plate according to another exemplary embodiment of the present invention;

[0038] Figure 6 show Figure 2 A three-dimensional schematic diagram of a pressurizing component of an electronic device is shown. DETAILED DESCRIPTION

[0039] The technical solution of the present invention is further specifically described below by examples and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention and should not be construed as a limitation of the present invention.

[0040] In addition, in the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the disclosed embodiments. However, it is apparent that one or more embodiments may be implemented without these specific details. In other cases, known structures and devices are embodied in a schematic manner to simplify the accompanying drawings.

[0041] According to an overall technical concept of the present invention, a back plate is provided, the back plate being used to support a circuit board. A middle recessed portion with a bottom is formed on the top surface of the back plate facing the circuit board. A raised main support column is formed on the bottom surface of the middle recessed portion of the back plate for supporting the circuit board.

[0042] Figure 1 A schematic diagram showing an assembly of an electronic device according to an exemplary embodiment of the present invention; Figure 2 An exploded schematic diagram showing an electronic device according to an exemplary embodiment of the present invention; Figure 3 A partial cross-sectional view of an electronic device according to an exemplary embodiment of the present invention is shown.

[0043] like Figures 1 to 3 As shown, in the illustrated embodiment, the electronic device mainly includes: a backplane 100, a circuit board 200, a socket connector 300, an electronic chip 400 and a pressurizing component 500. The circuit board 200 is supported on the top surface of the backplane 100. The socket connector 300 is mounted on the top surface of the circuit board 200 ( Figure 2 Only the housing portion of the socket connector 300 is shown in the figure). The electronic chip 400 is adapted to be electrically connected to the circuit board 200 via the socket connector 300. The pressing member 500 is connected to the backplane 100 and presses the electronic chip 400 onto the socket connector 300, so that the electronic chip 400 is in reliable electrical contact with the socket connector 300 on the circuit board 200.

[0044] like Figures 1 to 3 As shown, in an exemplary embodiment of the present invention, the aforementioned electronic chip 400 may be a central processing unit, which is in reliable electrical contact with the socket connector 300 on the circuit board 200 under the pressure applied by the pressing component 500. However, the present invention is not limited thereto, and the aforementioned electronic chip 400 may also be other chips.

[0045] Figure 4 A schematic three-dimensional diagram of a back plate 100 according to an exemplary embodiment of the present invention is shown.

[0046] like Figure 3 and Figure 4 As shown, in the illustrated embodiment, the backplane 100 is used to support the circuit board 200. A middle recessed portion 101 with a bottom is formed on the top surface of the backplane 100 facing the bottom surface of the circuit board 200. That is, the depth of the middle recessed portion 101 is less than the thickness of the backplane 100, so the middle recessed portion 101 has a bottom surface and does not penetrate the backplane 100. The middle recessed portion 101 corresponds to the central area of ​​the socket connector 300 mounted on the top surface of the circuit board 200.

[0047] like Figure 3 and Figure 4 As shown, in the illustrated embodiment, a protruding main support column 102 is formed at the center of the bottom surface of the middle recessed portion 101 of the back plate 100, and the main support column 102 is used to support the circuit board 200 to increase the contact deformation amount of the central area of ​​the socket connector 300 and improve the force uniformity of the socket connector 300. In this way, the stability and reliability of the electrical contact between the central area of ​​the socket connector 300 and the electronic chip 400 can be improved.

[0048] Although not shown in the figure, in another exemplary embodiment of the present invention, the main support column 102 may not be located at the center of the bottom surface of the middle recessed portion 101. For example, the main support column 102 may also be located at a position offset by a predetermined distance from the center of the bottom surface of the middle recessed portion 101.

[0049] However, the structure of the back plate 100 of the present invention is not limited to Figure 3 and Figure 4 The embodiments shown, for example, Figure 5 A schematic three-dimensional diagram of a back plate 100 according to another exemplary embodiment of the present invention is shown.

[0050] like Figure 5 As shown, in the illustrated embodiment, a plurality of protruding additional support columns 102' are formed on the bottom surface of the middle recessed portion 101 of the back plate 100, and the plurality of additional support columns 102' are distributed around the main support column 102, and are used to support the circuit board 200 together with the main support column 102, so as to increase the contact deformation of the central area of ​​the socket connector 300 and improve the force uniformity of the socket connector 300.

[0051] like Figure 5 As shown, in the illustrated embodiment, a plurality of additional support columns 102' are symmetrically distributed around the main support column 102, which can further improve the force uniformity of the socket connector 300. However, the present invention is not limited thereto, and a plurality of additional support columns 102' can also be distributed around the main support column 102 in an asymmetrical manner.

[0052] like Figure 5 As shown, in the illustrated embodiment, the top surface of the main support column 102 is flush with the top surface of the additional support column 102 ′, and the top surfaces of the main support column 102 and the additional support column 102 ′ are flush with the top surface of the back plate 100 .

[0053] like Figure 5 As shown, in the illustrated embodiment, the number of the additional support columns 102' is not less than three. For example, the number of the additional support columns 102' may be three, four, five, six or more.

[0054] like Figure 5As shown, in the illustrated embodiment, the cross-section of the main support column 102 and / or the additional support column 102' is circular, regular polygonal or other suitable shapes. The cross-sectional area of ​​the main support column 102 is larger than the cross-sectional area of ​​the additional support column 102'. In this way, the force uniformity of the socket connector 300 can be further improved.

[0055] like Figure 4 and Figure 5 As shown, in the illustrated embodiment, a plurality of strip-shaped recessed portions 103 with bottoms are further formed on the top surface of the back plate 100, and the plurality of strip-shaped recessed portions 103 are symmetrically distributed around the middle recessed portion 101 and are spaced apart from the middle recessed portion 101. In this way, the force uniformity of the socket connector 300 can be further improved.

[0056] like Figure 4 and Figure 5 As shown, in the illustrated embodiment, the backplane 100 is a combined backplane, and the backplane 100 includes a substrate 120 and a top plate 110 stacked on the substrate 120. However, the present invention is not limited to the illustrated embodiment, and the backplane 100 may also be a single integral backplane with a predetermined thickness.

[0057] like Figure 4 and Figure 5 As shown, in the illustrated embodiment, the thickness of the top plate 110 is less than the thickness of the base plate 120. The base plate 120 is a solid plate, and the top plate 110 is a hollow plate. A middle window and a strip-shaped opening are hollowed out on the top plate 110. The middle window constitutes a middle recessed portion 101, and the strip-shaped opening constitutes a strip-shaped recessed portion 103. The main support column 102 is formed on the top surface of the base plate 120.

[0058] like Figure 4 and Figure 5 As shown, in the illustrated embodiment, at least one threaded connector 130 is provided at each corner of the back plate 100, and the threaded connector 130 is used to connect the press component 500 to the back plate 100. The press component 500 is used to press the electronic chip 400 onto the socket connector 300 and to fix the electronic chip 400, the socket connector 300 and the circuit board 200 to the back plate 100.

[0059] like Figure 4 and Figure 5 As shown, in the illustrated embodiment, a backplane insulating film 100 a is attached to the top surface of the backplane 100 to electrically isolate the backplane 100 from the circuit board 200 .

[0060] Figure 6 show Figure 2 FIG. 5 is a perspective schematic diagram of a pressurizing component 500 of an electronic device.

[0061] See also Figure 1-3 and Figure 6 In the illustrated embodiment, the electronic device further comprises a heat sink (not shown). The heat sink is fixed to the top of the press member 500, and the bottom protrusion of the heat sink is received in the central opening 501 on the press member 500 so as to be in thermal contact with the electronic chip 400.

[0062] See also Figure 1-3 and Figure 6 In the illustrated embodiment, the pressurizing component 500 includes a pressurizing bottom plate 510 and a pressurizing top plate 520 fixed on the pressurizing bottom plate 510 , and the pressurizing top plate 520 has an elastic pressing portion 520 a suitable for pressing on the electronic chip 400 .

[0063] See also Figure 1-3 and Figure 6 In the illustrated embodiment, a connecting nut 530 suitable for connecting with the threaded connector 130 on the back plate 100 is provided at each corner of the pressurizing base plate 510 to connect and fix the pressurizing component 500 to the back plate 100 .

[0064] See also Figure 1-3 and Figure 6 In the illustrated embodiment, a cylindrical threaded sleeve 512 suitable for threaded connection with a screw on the radiator is also provided at each corner of the pressurized base plate 510 to connect and fix the radiator to the pressurized component 500.

[0065] See also Figure 1-3 and Figure 6 In the illustrated embodiment, a fixing screw 521 is provided on the pressurized top plate 520 , and a fixing nut 511 suitable for threaded connection with the fixing screw 521 is provided on the pressurized bottom plate 510 to fix the pressurized top plate 520 to the pressurized bottom plate 510 .

[0066] See also Figure 1-3 and Figure 6 In the illustrated embodiment, one side of the pressurizing top plate 520 is rotatably connected to the pressurizing bottom plate 510 , so that the pressurizing top plate 520 can be rotatably opened relative to the pressurizing bottom plate 510 after the fixing screws 521 are removed.

[0067] See also Figure 1-3 and Figure 6 In the illustrated embodiment, the pressurized top plate 520 is rotatably connected to the pressurized bottom plate 510 via the hinge structure 502. However, the present invention is not limited thereto, and the pressurized top plate 520 may also be rotatably connected to the pressurized bottom plate 510 in other ways, such as by a pin-hole fit.

[0068] See also Figure 1-3 and Figure 6In the illustrated embodiment, a layer of insulating film 500 a is attached to the bottom surface of the press component 500 to electrically isolate the press component 500 from the circuit board 200 .

[0069] Those skilled in the art can understand that the embodiments described above are exemplary and can be improved by those skilled in the art. The structures described in various embodiments can be freely combined without causing conflicts in structure or principle.

[0070] Although the present invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the accompanying drawings are intended to exemplify the preferred implementations of the present invention and should not be construed as limiting the present invention.

[0071] Although some embodiments of the present general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the present general inventive concept, the scope of which is defined in the claims and their equivalents.

[0072] It should be noted that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. In addition, any element reference signs in the claims shall not be construed as limiting the scope of the present invention.

Claims

1. A backplane for supporting a circuit board (200), wherein: A middle recessed portion (101) with a bottom is formed on the top surface of the back plate (100) facing the circuit board (200). Features: The middle recessed portion (101) is recessed inwardly relative to the top surface of the back plate (100). A protruding main support column (102) is formed on the bottom surface of the middle recessed portion (101) of the back plate (100) and is used to support the circuit board (200).

2. The back plate according to claim 1, characterized in that: The middle recessed portion (101) corresponds to a central area of ​​a socket connector (300) mounted on the top surface of the circuit board (200); The main support column (102) supports the circuit board (200) to increase the contact deformation amount of the central area of ​​the socket connector (300).

3. The back plate according to claim 1, characterized in that: The main support column (102) is located at the center of the bottom surface of the middle recessed portion (101).

4. The back plate according to claim 1, characterized in that: A plurality of protruding additional support columns (102') are also formed on the bottom surface of the middle recessed portion (101) of the back plate (100); the plurality of additional support columns (102') are distributed around the main support column (102) and are used to support the circuit board (200) together with the main support column (102).

5. The back plate according to claim 4, characterized in that: The top surface of the main support column (102) is flush with the top surface of the additional support column (102'), and the top surfaces of the main support column (102) and the additional support column (102') are flush with the top surface of the back plate (100).

6. The back plate according to claim 4, characterized in that: The number of the additional support columns (102') is no less than three.

7. The back plate according to claim 4, characterized in that: The number of the additional support columns (102') is three, four, five or six.

8. The back plate according to claim 4, characterized in that: The cross-section of the main support column (102) and / or the additional support column (102') is circular or regular polygonal.

9. The back plate according to claim 4, characterized in that: The cross-sectional area of ​​the main support column (102) is greater than the cross-sectional area of ​​the additional support column (102').

10. The back plate according to claim 1, characterized in that: A plurality of strip-shaped recessed portions (103) with bottoms are also formed on the top surface of the back plate (100); the plurality of strip-shaped recessed portions (103) are symmetrically distributed around the middle recessed portion (101) and are spaced apart from the middle recessed portion (101).

11. The back plate according to claim 1, characterized in that: The back plate (100) is a single integral back plate with a predetermined thickness.

12. The back plate according to claim 1, characterized in that: The backplane (100) is a combined backplane, comprising a base plate (120) and a top plate (110) stacked on the base plate (120), and the thickness of the top plate (110) is smaller than the thickness of the base plate (120).

13. The back plate according to claim 12, characterized in that: The base plate (120) is a solid plate, a middle window is hollowed out on the top plate (110), the middle window constitutes the middle recessed portion (101), and the main support column (102) is formed on the top surface of the base plate (120).

14. The back plate according to claim 1, characterized in that: A layer of backplane insulating film (100a) is attached to the top surface of the backplane (100) so as to electrically isolate the backplane (100) from the circuit board (200).

15. The back plate according to claim 2, characterized in that: At least one threaded connection piece (130) is provided at each corner of the back plate (100), and the threaded connection piece (130) is used to connect a pressurizing component (500) to the back plate (100); The pressurizing component (500) is used to press an electronic chip (400) onto the socket connector (300) and to fix the electronic chip (400), the socket connector (300) and the circuit board (200) onto the backplane (100).

16. An electronic device, characterized in that: include: The back panel (100) according to any one of claims 1 to 15; A circuit board (200) supported on the top surface of the back plate (100); A socket connector (300) mounted on the circuit board (200); An electronic chip (400) adapted to be electrically connected to the circuit board (200) via the socket connector (300); and A pressurizing component (500) is connected to the back plate (100) and presses the electronic chip (400) onto the socket connector (300).

17. The electronic device according to claim 16, characterized in that: The electronic chip (400) is a central processing unit, and the central processing unit is in reliable electrical contact with the socket connector (300) on the circuit board (200) under the action of the pressing force applied by the pressurizing component (500).

18. The electronic device according to claim 16, characterized in that: The electronic device further comprises a heat sink, which is fixed to the top of the pressurizing component (500), and a bottom protrusion of the heat sink is received in a central opening (501) on the pressurizing component (500) and is in thermal contact with the electronic chip (400).

19. The electronic device according to claim 18, characterized in that: The pressurizing component (500) comprises a pressurizing bottom plate (510) and a pressurizing top plate (520) fixed on the pressurizing bottom plate (510), wherein the pressurizing top plate (520) has an elastic pressing portion (520a) suitable for pressing on the electronic chip (400).

20. The electronic device according to claim 19, characterized in that: A connecting nut (530) suitable for connecting to a threaded connector (130) on the back plate (100) is provided at each corner of the pressurizing bottom plate (510) to connect and fix the pressurizing component (500) to the back plate (100).

21. The electronic device according to claim 19, characterized in that: A cylindrical threaded sleeve (512) suitable for being threadedly connected to a screw on the radiator is provided at each corner of the pressurizing bottom plate (510) so as to connect and fix the radiator to the pressurizing component (500).

22. The electronic device according to claim 19, wherein: A fixing screw (521) is provided on the pressurizing top plate (520), and a fixing nut (511) suitable for being threadedly connected to the fixing screw (521) is provided on the pressurizing bottom plate (510), so as to fix the pressurizing top plate (520) to the pressurizing bottom plate (510).

23. The electronic device according to claim 22, characterized in that: One side of the pressurizing top plate (520) is rotatably connected to the pressurizing bottom plate (510), so that after the fixing screw (521) is removed, the pressurizing top plate (520) can be rotatably opened relative to the pressurizing bottom plate (510).

24. The electronic device according to claim 23, characterized in that: The pressurized top plate (520) is rotatably connected to the pressurized bottom plate (510) via a hinge structure (502).

25. The electronic device according to claim 16, characterized in that: A layer of insulating film (500a) is attached to the bottom surface of the pressurizing component (500) so as to electrically isolate the pressurizing component (500) from the circuit board (200).

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