Motor frame and manufacturing method thereof, and high-integration camera module

Abstract

The present application provides a motor frame and a manufacturing method thereof, and a high-integration camera module. The motor frame is used in a high-integration camera module, and the motor frame includes a motor frame body, a coil, and an embedded circuit, wherein the coil is arranged on the side wall of the motor frame body; the embedded circuit is arranged on the side wall of the motor frame to form an integrated structure with the motor frame, and the embedded circuit is connected to an external circuit board to supply power to the coil.

Description

Technical Field

[0001] The present application relates to the technical field of camera modules, and in particular to a motor frame and a manufacturing method thereof, and a high-integration camera module. Background Art

[0002] Vision is one of the main ways for humans to perceive the outside world. It is used as a major reference factor in all walks of life. For example, the clothing industry attracts people's attention through highlights in appearance design; for example, display-related industries attract people's or consumers' attention through the perfection or beauty of the displayed image information. There are many such examples in life. These examples mainly attract people's attention through the image information they present when they are acquired by people. There is a type of product that acquires external image information and then presents it to people (or consumers). This type of product can be called a camera device, which is also an important component of a smartphone.

[0003] Smartphones have become one of the essential accessories in people's modern life. They are designed in every aspect of life, whether it is payment in life, taking pictures of the scenery and food along the way, or video communication with relatives and friends, all require the use of the camera module in the mobile phone. The development trend of mobile phones is highly integrated, that is, the number of integrated functions in mobile phones will increase, which is one of the development trends of the mobile phone industry. How to reasonably allocate space for its internal components and ensure their reliability is one of the key issues that the mobile phone industry has focused on in recent years.

[0004] In mobile phones, there are often multiple camera modules, and the space they occupy in the phone has become one of the directions that can be optimized. As a product with a precise structure, the camera module has a complex internal structure and numerous small parts. Its production and assembly processes are relatively complex. In addition, when multiple parts are assembled and matched, the more bonding and matching there are between the parts, the larger its volume will be, and its reliability will be relatively lower.

[0005] The motor frame of the camera module is as follows Figure 1As shown, the motor frame has four side walls, and the side walls have a large surface area. The coils and FPCs in the camera module can be attached to the side walls. The application range of FPC inside the mobile phone covers components such as batteries, screens, cameras, side buttons, antennas, fingerprint modules, speakers, etc. Generally, the AF coil and OIS coil in the module can be set on the inner surface of the side wall, and the coil and FPC are attached parallel to the side wall, that is, the coil and FPC are attached to the side wall by bonding methods such as gluing or welding. Then the traditional attachment of coils and FPCs will cause such a problem. The thickness of the coils, FPCs, and side walls will produce a stack. At the same time, the coils, FPCs, and side wall parts will also have a thick adhesive layer, which further increases the thickness of the side walls, coils, and FPCs after combination, that is, it further squeezes the space of the camera module.

[0006] In order to solve this problem, some inventions arrange the coil by providing a groove or a through hole on the side wall, partially accommodating the coil in the groove or the through hole, and then fixing the coil and the FPC by bonding or welding. Although such a setting reduces the space occupied by the coil body and bonding to a certain extent, its bonding strength and bonding difficulty become more difficult. Summary of the invention

[0007] An embodiment of the present application provides a motor frame for a high-integration camera module, wherein the motor frame includes a motor frame body, a coil and an embedded circuit, wherein the coil is arranged on the side wall of the motor frame body; the embedded circuit is arranged on the side wall of the motor frame to form an integrated structure with the motor frame, and the embedded circuit is connected to an external circuit board to power the coil.

[0008] According to some embodiments, the embedded circuit and the motor frame body are formed into an integral structure through a process including at least one of injection molding, molding or powder forming.

[0009] According to some embodiments, the coil includes an AF coil and an OIS coil, and the OIS coil includes coils in horizontal, vertical and tilted directions.

[0010] According to some embodiments, the motor frame body is connected to the AF coil and the OIS coil respectively, and the connection pathways do not interfere with each other.

[0011] An embodiment of the present application also provides a highly integrated camera module, comprising the motor frame as described above.

[0012] According to some embodiments, the high-integration camera module also includes a magnet, a lens, a lens holder, a color filter element and a circuit board, the magnet moves in the magnetic field generated after the coil is energized, causing the lens to move; the lens is connected to the magnet and moves driven by the magnet; the lens includes an upper spring leaf and a lower spring leaf, the upper spring leaf is fixedly connected to the upper side of the motor frame; the lower spring leaf is fixedly connected to the upper side of the motor frame; the lens holder is arranged under the motor frame to support the motor frame; the color filter element is arranged on the lens holder to filter the light unnecessary for the camera module; the circuit board is arranged under the lens holder, connected to the embedded circuit, and powers the coil.

[0013] An embodiment of the present application also provides a method for manufacturing a motor frame as described above, comprising: fixing the embedded circuit and the side wall of the motor frame body into an integrated structure; placing the integrated structure into a molding mold for process molding; welding, gluing or embedding molding the coil on the side wall of the motor frame body; connecting the embedded circuit and the coil.

[0014] According to some embodiments, fixing the embedded circuit and a side wall of the motor frame into an integrated structure includes: setting a groove or a through hole on the side wall of the motor frame body; placing the embedded circuit in the groove or the through hole and fixing it into an integrated structure with the side wall of the motor frame body.

[0015] According to some embodiments, fixing the embedded circuit and a side wall of the motor frame into an integrated structure includes: integrally forming a plurality of side walls of independent motor frame bodies; and configuring the embedded circuit to the corresponding side wall.

[0016] According to some embodiments, the manufacturing method further includes: fixing the plurality of side walls to form the motor frame body.

[0017] According to some embodiments, fixing the embedded circuit and a side wall of the motor frame body into an integrated structure includes: etching or electro-coating the embedded circuit on a side wall of the motor frame body.

[0018] According to some embodiments, the process includes at least one of injection molding, molding or powder forming.

[0019] According to some embodiments, when the embedded circuit and a side wall of the motor frame body are fixed into an integrated structure, the motor frame body corresponding to the embedded circuit is made thin or provided with a groove for heat dissipation.

[0020] The technical solution provided in the embodiment of the present application eliminates the original independent FPC that attaches the camera module to the motor frame, and adopts an embedded circuit with an integrated structure with the motor frame to replace the function of the FPC, which can reduce the volume of the motor frame, simplify the process, and improve the strength, further achieve the reduction of the overall volume of the camera module and the simplification of the assembly process, and improve the reliability of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a structural schematic diagram of a camera module provided by the prior art.

[0023] Figure 2 It is a structural schematic diagram of a motor frame provided in an embodiment of the present application.

[0024] Figure 3 It is a structural schematic diagram of a motor frame body provided in an embodiment of the present application.

[0025] Figure 4 It is a structural schematic diagram of a camera module provided in an embodiment of the present application.

[0026] Figure 5 It is a structural schematic diagram of another camera module provided in an embodiment of the present application.

[0027] Figure 6 It is a schematic flow chart of a method for manufacturing a motor frame provided in an embodiment of the present application.

[0028] Figure 7 It is a schematic diagram of an integrated motor frame body and an embedded circuit provided in an embodiment of the present application.

[0029] Figure 8 It is a schematic flow chart of a method for manufacturing a motor frame provided in an embodiment of the present application.

[0030] Fig. 9 It is a schematic flow chart of another method for manufacturing a motor frame provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0032] It should be understood that the terms "first", "second", etc. in the claims, specification and drawings of the present application are used to distinguish different objects rather than to describe a specific order. The terms "include" and "comprise" used in the specification and claims of the present application indicate the presence of the described features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their collections.

[0033] Figure 2 It is a structural schematic diagram of a motor frame provided in an embodiment of the present application.

[0034] like Figure 2 As shown, the motor frame includes a motor frame body 1, a coil 4 and an embedded circuit 3. The coil 4 is arranged on the side wall of the motor frame body 1. The embedded circuit 3 is arranged on the side wall of the motor frame body 1, forming an integrated structure with the motor frame body 1, and the embedded circuit 3 is connected to the external circuit board 9 to supply power to the coil 4.

[0035] The motor frame body 1 is as follows Figure 3 As shown, the side wall 11 of the motor frame body. The motor frame body 1 is a rectangular frame with four frames but no upper and lower surfaces. The motor frame body 1 is equivalent to the base, which plays a bearing and holding role. Other components of the drive structure rely on the motor frame body 1 to maintain their state and dynamic characteristics. The motor frame body 1 has four walls and a base, and the base is connected to a mirror seat or the like below.

[0036] The embedded circuit 3 replaces the FPC used to conduct the coil circuit in the prior art. The coil 4 includes an AF coil and an OIS coil, and the OIS coil includes coils in the horizontal direction, the vertical direction, and the tilted direction. The embedded circuit 3 is connected to the AF coil and the OIS coil respectively, and the connection paths do not interfere with each other.

[0037] The embedded circuit 3 and the motor frame body 1 are formed into an integral structure through a process including at least one of injection molding, molding or powder forming.

[0038] The technical solution provided in this embodiment eliminates the original independent FPC that attaches the camera module to the motor frame, and adopts an embedded circuit with an integrated structure with the motor frame to replace the function of the FPC, which can reduce the volume of the motor frame, simplify the process and improve the strength.

[0039] Figure 4 It is a structural schematic diagram of a camera module provided in an embodiment of the present application.

[0040] like Figure 4 As shown, the camera module includes a motor frame 100, a magnet 5, a lens 6, a lens holder 7, a color filter element 8 and a circuit board 9.

[0041] The motor frame includes a motor frame body 1, a coil 4 and an embedded circuit 3. The coil 4 is arranged on the side wall of the motor frame body 1. The embedded circuit 3 is arranged on the side wall of the motor frame body 1, and forms an integrated structure with the motor frame body 1. The embedded circuit 3 is connected to the external circuit board 9 to supply power to the coil 4. The magnet 5 moves in the magnetic field generated after the coil is energized, and causes the lens 6 to move. The lens 6 is connected to the magnet 5 and moves driven by the magnet 5. The magnet 5 can be directly fixed on the lens 6, or it can be fixed on a carrier, and then the carrier is fixed on the lens 6. The number and position of the coils 4 and magnets 5 depend on the situation.

[0042] The lens 6 includes an upper spring 61 and a lower spring 62. The upper spring 61 is fixedly connected to the upper side of the motor frame 100, and the lower spring 62 is fixedly connected to the lower side of the motor frame 100, so that the lens 6 becomes a suspended structure in the motor frame body 1, and can reciprocate within a certain range under the upper and lower springs. At the same time, under the condition of not continuing to drive, the lens combined with the upper and lower springs can return to the initial position. Driven by the coil 4 and the magnet 5, the lens 6 can move in space. The lens seat 7 is arranged under the motor frame 100 to support the motor frame 100. The circuit board 9 is arranged under the lens seat, connected to the embedded circuit, and supplies power to the coil. The circuit board 9 includes an electronic component 91 and a photosensitive element 92. The center of the lens seat 7 has a window corresponding to the photosensitive element 92, and the window has a stepped sinking structure for installing a color filter element. The color filter element 8 can be fixedly arranged on the window step-down structure of the lens seat 7 by gluing or other methods to filter the light not needed by the camera module.

[0043] When the prior art uses FPC, it is important to know that the forces are mutual during operation. The force that drives the lens 6 to move will also be fed back to the coil 4 and the FPC, affecting the coil and the FPC. Long-term operation may not cause reliability issues such as the coil or FPC shifting or falling off (the magnetic structure generally has a raised support structure as an installation position, and the reliability is relatively high).

[0044] In the embodiment of the present application, an embedded circuit 3 is used instead of the FPC to form an integrated structure with the motor frame body, and the three components of the coil 4, the embedded circuit 3 replacing the FPC, and the motor frame body 1 are simplified into two components, thereby improving the reliability, volume and assembly accuracy of the camera module.

[0045] The embedded circuit 3 is connected downward to the circuit board 9 of the camera module, and the coil 4 is powered by the circuit board 9. The embedded circuit can be an engraved circuit, a circuit layer, a metal wire circuit, etc., but is not limited thereto.

[0046] According to some embodiments, a mirror base 7 with an embedded circuit 3 and a motor frame with an embedded circuit 3 may also be used, and the motor frame is directly connected to the circuit board 9 through the electrical structure of the embedded circuit in the mirror base 7, without the need for further wiring to be connected to the circuit board 9, such as Figure 5 shown.

[0047] The technical solution provided in this embodiment eliminates the original independent FPC that attaches the camera module to the motor frame, and adopts an embedded circuit with an integrated structure with the motor frame to replace the function of the FPC, which can reduce the volume of the motor frame, simplify the process, and improve the strength, further achieve the reduction of the overall volume of the camera module and the simplification of the assembly process, and improve the reliability of the camera module.

[0048] Figure 6 It is a schematic flow chart of a method for manufacturing a motor frame provided in an embodiment of the present application, which includes the following processes.

[0049] In S110 , the embedded circuit 3 and the side wall of the motor frame body 1 are fixed into an integral structure.

[0050] Specifically, the circuit and the preset skeleton can be first combined into an embedded circuit 3, a groove or a through hole is set on one side wall of the motor frame body 1, and the embedded circuit 3 is placed in the groove or the through hole, and fixed to form an integrated structure with the side wall of the motor frame body 1. The overlapping utilization of space is realized, and the space utilization rate is improved. At the same time, the groove or through hole structure can match the embedded circuit 3 structure, making the layout of the embedded circuit 3 structure and the motor frame body 1 simpler.

[0051] The embedded circuit 3 has welding points reserved at corresponding positions of the frame for electrical connection with the coil 4 and other circuits, such as the circuit board of the camera module, for electrical connection with other components at a later stage.

[0052] According to some embodiments, the side walls of multiple independent motor frame bodies can be integrally formed, and the side walls of the motor frame body 1 have an embedded circuit 3 inside, and the embedded circuit 3 corresponds to the coil 4. All the coils 4 are fixed to a single independent side wall, and then the four are fixed to form a motor frame body 1, which is convenient for welding and installation of the coil 4, that is, the embedded circuit 3 (the original FPC function), to achieve modularization of the embedded circuit 3 and the side walls.

[0053] In S120, the integrated structure is placed in a molding die for process molding.

[0054] The process includes at least one of injection molding, molding or powder forming, but is not limited thereto.

[0055] The embedded circuit 3 is connected and fixed to the side wall of the motor frame body 1, and the solder joint end face 31 on the other side of the embedded circuit 3 faces the inside of the motor frame body 1, and the multiple solder joint end faces 31 are parallel to each other. After the embedded circuit 3 and the motor frame body 1 are fixed, the integrated structure of the embedded circuit 3 and the motor frame body 1 is placed in a molding mold.

[0056] The mold includes an upper mold and a lower mold, and the upper mold and the lower mold form a cavity for accommodating the integrated structure of the embedded circuit 3 and the motor frame body 1. It should be noted that a vertical side of the cavity is in contact with the outer side of the motor frame body 1, and the other side of the cavity is in contact with the solder joint end face 31 of the embedded circuit 3, that is, the integrated structure of the embedded circuit 3 and the motor frame body 1 is clamped by two side faces. When the molding material 10 is injected, the molding material 10 cannot cover the outer side of the motor frame body 1 and the solder joint end face 31, so that a fixed motor frame can be formed without hindering the subsequent electrical connection between the solder joint and the external coil or other components.

[0057] It should be noted that the shape of the mold is not a limitation. The key point is that the two sides clamp the embedded circuit 3 and the motor frame body 1 to form an integrated structure so that the solder joint structure on the embedded circuit 3 is not covered by the molding material 10.

[0058] The molding material 10 includes but is not limited to molding materials, injection molding materials, resins, adhesives and powder molding materials. The molding material covers the structure of all embedded circuits 3 except the end faces of the solder joints, and fixes the embedded circuit 3 on the inner side of the motor frame body 1, so that the motor frame body 1 and the embedded circuit 3 form a complete whole. Compared with such a structure on the motor frame attached with a traditional FPC, the volume of the membrane is reduced to a certain extent, and at the same time, the bonding strength and reliability between the motor frame and the circuit are greatly improved, and there is no need to worry about the circuit falling off or gradually deviating from the original position during use. In the present application, the embedded circuit 3 and the motor frame body 1 are formed into an integrated structure, which replaces the original structure of the FPC attached to the motor frame, thereby improving the utilization rate of the internal space of the module and enhancing the strength and reliability of the internal module.

[0059] The multiple welding points reserved for the embedded circuit 3 are closely attached to the edge of the molding mold, so that during the molding process, the molding material 10 will not cover the welding points. After molding and demoulding, the welding points are directly exposed, and the surface of the welding points is coplanar with the molding surface, forming a complete molding surface together. Figure 7 shown.

[0060] In S130 , the coil is welded, bonded, or insert-molded to the side wall of the motor frame body.

[0061] The coil 4 includes an AF coil and an OIS coil. The AF coil needs to reserve 4 welding points, and the OIS coil needs to reserve 12 welding points. The reserved welding points can be parallel to the side wall of the motor frame body 1, or at a certain angle to the side wall of the motor frame body 1. According to some embodiments, the position of the welding point is perpendicular to the side of the motor frame body 1, and can also be set in the concave part of the motor side wall body 1, such as Figure 8 shown.

[0062] According to some embodiments, the coil can also be embedded into the side wall of the motor frame body 1 by insert molding, and the AF coil and the OIS coil can be respectively embedded into the side wall of the motor frame body 1 by plastic material, wherein the OIS coil includes coils in horizontal, vertical and inclined directions.

[0063] In the process of integrally molding the embedded circuit 3 and the molding material, the mold has a corresponding protrusion, so that there is no molding material above the welding point, and a groove that penetrates upward is retained. When the welding point is connected to 4, the welding material can be directly filled into the groove, which is convenient for welding, and the welding surface is wide, and the reliability is greatly improved. At the same time, such a groove structure can also play a certain role in heat dissipation.

[0064] In S140 , the embedded circuit and the coil are connected.

[0065] During the process of integrated molding of the embedded circuit 3 and the molding material 10, the mold has corresponding protrusions, so that there is no molding material above the welding point of the embedded circuit 3, and a groove that runs through upward is retained. When the welding point of the embedded circuit 3 is connected to the coil, the welding material can be directly filled into the groove, which is convenient for welding, and the welding surface is wide, and the reliability is greatly improved. At the same time, such a groove structure can also play a certain role in heat dissipation. Among them, the connection method is not limited to welding, and can also be conductive glue, ultrasonic welding, hot pressing welding, reflow soldering and other methods.

[0066] According to some embodiments, the coil 4 can also be formed in the following manner. A layer of conductive layers with coil structures, generally copper layers, are stacked without mutual conduction (a hole is reserved for conduction, and the holes are also stacked to form a columnar hole) to reach the required height, and then a conductive material is filled in the columnar hole to make the entire coil conductive and realize the coil function. In this way, it can be considered that the coil 4 is directly grown on the motor frame body 1 (such a structure is relatively more suitable for modular production with a single side wall).

[0067] In the present application, the general FPC in the camera module is eliminated, that is, the original independent FPC that needs to be attached to the side wall of the camera module motor frame is set to an embedded circuit 3 embedded in the side wall of the motor frame body 1 to realize the original FPC function. That is, the embedded circuit 3 with FPC function does not require an attachment process, but becomes an integrated structure with the motor frame body 1, thereby reducing the overall volume of the module. At the same time, the original FPC needs to be fixed to the motor frame through a bonding process, etc., and is affected by the bonding strength. On the one hand, it may fall off or deviate from the original predetermined position during use due to external factors. On the other hand, because it is fixed by attachment, its precision control is more difficult. These factors affect the volume and reliability of the module.

[0068] The technical solution provided in this embodiment eliminates the original independent FPC that the camera module is attached to the motor frame, and adopts an embedded circuit with an integrated structure with the motor frame to replace the function of the FPC, which can reduce the volume of the motor frame, simplify the process, and improve the strength. The motor frame is designed with structures such as grooves or through holes to accommodate the embedded circuit, realize overlapping utilization of space, and improve space utilization. At the same time, the groove or through hole structure can match the embedded circuit, making the integrated layout of the embedded circuit and the motor frame body more reliable.

[0069] Fig. 9 It is a schematic flow chart of another method for manufacturing a motor frame provided in an embodiment of the present application, which includes the following process.

[0070] In S210 , the embedded circuit 3 is etched or electro-coated on the side wall of the motor frame body 1 .

[0071] Specifically, a metal circuit is preset on the side wall of the motor frame body 1 to form an embedded circuit 3. The motor frame body 1 is fixed with some relatively high-strength skeleton structures to form a relatively stable whole. The overlapping utilization of space is realized, the space utilization rate is improved, and the layout of the embedded circuit 3 structure and the motor frame body 1 is simpler.

[0072] The embedded circuit 3 has welding points at corresponding positions on the frame for electrical connection with the coil 4 and other circuits, such as the circuit board of the camera module, which are used for electrical connection with other components at a later stage.

[0073] In another embodiment of the present invention, a mirror base structure with an embedded circuit and a motor frame with an embedded structure may also be used. The motor frame is directly connected to the circuit board through the electrical structure in the mirror base without the need for wiring to connect to the circuit board.

[0074] According to some embodiments, the side walls of multiple independent motor frame bodies can be integrally formed, and the side walls of the motor frame body 1 have an embedded circuit 3 inside, and the embedded circuit 3 corresponds to the coil 4. All the coils 4 are fixed to a single independent side wall, and then the four are fixed to form a motor frame body 1, which is convenient for welding and installation of the coil 4, that is, the embedded circuit 3 (the original FPC function), to achieve modularization of the embedded circuit 3 and the side walls.

[0075] In S220, the integrated structure is placed in a molding die for process molding.

[0076] The process includes at least one of injection molding, molding or powder forming, but is not limited thereto.

[0077] The embedded circuit 3 is connected and fixed to the side wall of the motor frame body 1, and the solder joint end face 31 on the other side of the embedded circuit 3 faces the inside of the motor frame body 1, and the multiple solder joint end faces 31 are parallel to each other. After the embedded circuit 3 and the motor frame body 1 are fixed, the integrated structure of the embedded circuit 3 and the motor frame body 1 is placed in a molding mold.

[0078] The mold includes an upper mold and a lower mold, and the upper mold and the lower mold form a cavity for accommodating the integrated structure of the embedded circuit 3 and the motor frame body 1. It should be noted that a vertical side of the cavity is in contact with the outer side of the motor frame body 1, and the other side of the cavity is in contact with the solder joint end face 31 of the embedded circuit 3, that is, the integrated structure of the embedded circuit 3 and the motor frame body 1 is clamped by two side faces. When the molding material 10 is injected, the molding material 10 cannot cover the outer side of the motor frame body 1 and the solder joint end face 31, so that a fixed motor frame can be formed without hindering the subsequent electrical connection between the solder joint and the external coil or other components.

[0079] It should be noted that the shape of the mold is not a limitation. The key point is that the two sides clamp the embedded circuit 3 and the motor frame body 1 to form an integrated structure so that the solder joint structure on the embedded circuit 3 is not covered by the molding material 10.

[0080] The molding material 10 includes but is not limited to molding materials, injection molding materials, resins, adhesives and powder molding materials. The molding material covers the structure of all embedded circuits 3 except the end faces of the solder joints, and fixes the embedded circuit 3 on the inner side of the motor frame body 1, so that the motor frame body 1 and the embedded circuit 3 form a complete whole. Compared with such a structure on the motor frame attached with a traditional FPC, the volume of the membrane is reduced to a certain extent, and at the same time, the bonding strength and reliability between the motor frame and the circuit are greatly improved, and there is no need to worry about the circuit falling off or gradually deviating from the original position during use. In the present application, the embedded circuit 3 and the motor frame body 1 are formed into an integrated structure, which replaces the original structure of the FPC attached to the motor frame, thereby improving the utilization rate of the internal space of the module and enhancing the strength and reliability of the internal module.

[0081] The multiple welding points reserved for the embedded circuit 3 are closely attached to the edge of the molding mold, so that during the molding process, the molding material 10 will not cover the welding points. After molding and demoulding, the welding points are directly exposed, and the surface of the welding points is coplanar with the molding surface, forming a complete molding surface together. Figure 7 shown.

[0082] In S230 , the coil is welded, bonded, or insert-molded to the side wall of the motor frame body.

[0083] The coil 4 includes an AF coil and an OIS coil. The AF coil needs to reserve 4 welding points, and the OIS coil needs to reserve 12 welding points. The reserved welding points can be parallel to the side wall of the motor frame body 1, or at a certain angle to the side wall of the motor frame body 1. According to some embodiments, the position of the welding point is perpendicular to the side of the motor frame body 1, and can also be set in the concave part of the motor side wall body 1, such as Figure 8 shown.

[0084] According to some embodiments, the coil can also be embedded into the side wall of the motor frame body 1 by insert molding, and the AF coil and the OIS coil can be respectively embedded into the side wall of the motor frame body 1 by plastic material, wherein the OIS coil includes coils in horizontal, vertical and inclined directions.

[0085] In the process of integrally molding the embedded circuit 3 and the molding material, the mold has a corresponding protrusion, so that there is no molding material above the welding point, and a groove that penetrates upward is retained. When the welding point is connected to 4, the welding material can be directly filled into the groove, which is convenient for welding, and the welding surface is wide, and the reliability is greatly improved. At the same time, such a groove structure can also play a certain role in heat dissipation.

[0086] In S240 , the embedded circuit and the coil are connected.

[0087] During the process of integrated molding of the embedded circuit 3 and the molding material 10, the mold has corresponding protrusions, so that there is no molding material above the welding point of the embedded circuit 3, and a groove that penetrates upward is retained. When the welding point of the embedded circuit 3 is connected to the coil, the welding material can be directly filled into the groove, which is convenient for welding, and the welding surface is wide, and the reliability is greatly improved. Among them, the connection method is not limited to welding, and can also be conductive glue, ultrasonic welding, hot pressing welding, reflow welding and other methods.

[0088] According to some embodiments, the coil 4 can also be formed in the following manner. A layer of conductive layers with coil structures, generally copper layers, are stacked without mutual conduction (a hole is reserved for conduction, and the holes are also stacked to form a columnar hole) to reach the required height, and then a conductive material is filled in the columnar hole to make the entire coil conductive and realize the coil function. In this way, it can be considered that the coil 4 is directly grown on the motor frame body 1 (such a structure is relatively more suitable for modular production with a single side wall).

[0089] In the present application, the general FPC in the camera module is eliminated, that is, the original independent FPC that needs to be attached to the side wall of the camera module motor frame is set to an embedded circuit 3 embedded in the side wall of the motor frame body 1 to realize the original FPC function. That is, the embedded circuit 3 with FPC function does not require an attachment process, but becomes an integrated structure with the motor frame body 1, thereby reducing the overall volume of the module. At the same time, the original FPC needs to be fixed to the motor frame through a bonding process, etc., and is affected by the bonding strength. On the one hand, it may fall off or deviate from the original predetermined position during use due to external factors. On the other hand, because it is fixed by attachment, its precision control is more difficult. These factors affect the volume and reliability of the module.

[0090] The technical solution provided in this embodiment eliminates the original independent FPC that the camera module is attached to the motor frame, and adopts an embedded circuit with an integrated structure with the motor frame to replace the function of the FPC, which can reduce the volume of the motor frame, simplify the process, and improve the strength. Etching or electro-coating the embedded circuit on a side wall of the motor frame body can greatly improve the space utilization rate and make the integrated layout of the embedded circuit and the motor frame body more stable and reliable.

[0091] The embodiments of the present application are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and its core idea of ​​the present application. At the same time, changes or deformations made by those skilled in the art based on the ideas of the present application, the specific implementation methods and the scope of application of the present application, all belong to the scope of protection of the present application. In summary, the content of this specification should not be construed as a limitation on the present application.

Claims

1. A motor frame for a high-integration camera module, the motor frame comprising: Motor frame body; A coil is arranged on a side wall of the motor frame body; An embedded circuit is arranged on a side wall of the motor frame to form an integrated structure with the motor frame, and the embedded circuit is connected to an external circuit board to supply power to the coil; Among them, a plurality of independent side walls of the motor frame body are integrally formed, the side wall of the motor frame body has the embedded circuit inside, the embedded circuit corresponds to the coil, the coil is fixed to a single independent side wall, and four independent side walls are fixed to form the motor frame body; During the process of integrated molding of the embedded circuit and the molding material, the mold has corresponding protrusions so that there is no molding material above the welding point of the embedded circuit, and a groove running upward is retained. When the welding point of the embedded circuit is connected to the coil, the welding material is filled into the groove.

2. The motor frame according to claim 1, wherein: The coil includes an AF coil and an OIS coil, and the OIS coil includes coils in horizontal, vertical and tilted directions.

3. The motor frame according to claim 2, wherein: The motor frame body is connected to the AF coil and the OIS coil respectively, and the connection paths do not interfere with each other.

4. A highly integrated camera module, comprising: A motor frame as claimed in any one of claims 1 to 3.

5. The highly integrated camera module according to claim 4, further comprising: The magnet moves in the magnetic field generated when the coil is energized, driving the lens to move; A lens is connected to the magnet and moves under the drive of the magnet; the lens comprises: An upper spring sheet fixedly connected to the upper side of the motor frame; A lower spring sheet fixedly connected to the lower side of the motor frame; A mirror seat, arranged under the motor frame, supporting the motor frame; A color filter element, disposed on the lens holder, for filtering light that is not needed by the camera module; The circuit board is arranged under the mirror base, connected to the embedded circuit, and supplies power to the coil.

6. A method for manufacturing a motor frame according to any one of claims 1 to 3, comprising: Fixing the embedded circuit and the side wall of the motor frame body into an integrated structure; Putting the integrated structure into a molding die for process molding; Welding, bonding or insert molding the coil to the side wall of the motor frame body; connecting the embedded circuit and the coil; Fixing a plurality of the side walls to form the motor frame body; Wherein, fixing the embedded circuit and a side wall of the motor frame into an integrated structure comprises: Integrally forming the side walls of multiple independent motor frame bodies; The embedded circuit is configured to the corresponding side wall.

7. The manufacturing method according to claim 6, wherein: The method of fixing the embedded circuit and a side wall of the motor frame into an integrated structure comprises: A groove or a through hole is provided on the side wall of the motor frame body; The embedded circuit is placed in the groove or through hole and fixed to the side wall of the motor frame body to form an integrated structure.

8. The manufacturing method according to claim 6, wherein: The method of fixing the embedded circuit and a side wall of the motor frame body into an integrated structure includes: The embedded circuit is etched or electro-coated on a side wall of the motor frame body.

9. The manufacturing method according to claim 6, wherein: The process includes at least one of injection molding, molding or powder forming.

Images