MEMS device having electrodes and a dielectric

Abstract

The present disclosure relates to a MEMS device having an electrode and a dielectric. A first electrode of the MEMS device may be longitudinally oriented along an axis and parallel to the axis, and may have a first end and a second end. A second electrode may be longitudinally oriented along an axis and parallel to the axis, and may have a first end and a second end. A third electrode may be longitudinally oriented along an axis and parallel to the axis, and may have a first end and a second end. The first electrode, the second electrode, and the third electrode may each be at least partially located in one of a plurality of holes in a solid dielectric that may surround the second end of the second electrode and the first end of the third electrode. The first end of the second electrode and the second end of the third electrode may be located outside the solid dielectric.

Description

Technical Field

[0001] The present disclosure relates to a microelectromechanical system (MEMS) device having electrodes and a dielectric. Background Art

[0002] Currently, consumer electronic devices such as mobile phones, personal computers, smart speakers, hearing aids, and true wireless stereo (TWS) headphones, as well as other host devices, typically contain one or more small microphones, sensors, and / or actuators. Advances in micro-nano manufacturing technology have led to the development of MEMS devices (such as microphones, sensors, and actuators) with increasingly smaller sizes and different form factors. Increasing the bias voltage of capacitive microphones, sensors, actuators, and other capacitive elements in MEMS devices can result in higher output and other operations, but it can also increase the tendency to collapse and increase the mechanical stiffness of the system. Summary of the invention

[0003] One aspect of the present invention relates to a micro-electromechanical system (MEMS) device, the MEMS device comprising: a first electrode, the first electrode being longitudinally oriented along an axis and parallel to the axis, the first electrode having a first end and a second end; a second electrode, the second electrode being longitudinally oriented along the axis and parallel to the axis, the second electrode having a first end and a second end; a third electrode, the third electrode being longitudinally oriented along the axis and parallel to the axis, the third electrode having a first end and a second end; and a solid dielectric, the solid dielectric comprising a plurality of holes, wherein the first electrode, the second electrode and the third electrode are each at least partially located within one of the plurality of holes, wherein the solid dielectric surrounds the second end of the second electrode and the first end of the third electrode, and wherein the first end of the second electrode and the second end of the third electrode are located outside the solid dielectric.

[0004] Another aspect of the present invention relates to a micro-electromechanical system (MEMS) device, the MEMS device comprising: a solid dielectric having a first outer surface and a second outer surface opposite the first outer surface, the solid dielectric having a plurality of vias, each of the plurality of vias having an opening located on the first outer surface and an opening located on the second outer surface; and an electrode set, the electrode set comprising: a first electrode, the first electrode being partially disposed in a first via of the plurality of vias, such that a first end of the first electrode extends beyond the first outer surface and a second end of the first electrode extends beyond the second outer surface; a second electrode, the second electrode being partially disposed in a second via of the plurality of vias, such that a first end of the second electrode extends beyond the first outer surface and a second end of the second electrode is within the second via; and a third electrode, the third electrode being partially disposed in a third via of the plurality of vias, such that a first end of the third electrode is within the third via and a second end of the third electrode extends beyond the second outer surface, wherein the first electrode, the second electrode and the third electrode are fixed relative to each other, and wherein the solid dielectric and the electrode set are movable relative to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] In order to describe the manner in which the advantages and features of the present disclosure can be obtained, a description of the present disclosure is presented by reference to the specific embodiments of the present disclosure illustrated in the accompanying drawings. These drawings depict only example embodiments of the present disclosure and are therefore not to be considered as limiting the scope of the present disclosure. For the sake of clarity, the drawings may have been simplified and are not necessarily drawn to scale.

[0006] Figure 1 is an example cross-sectional view of a MEMS device according to a possible implementation;

[0007] Figure 2 is an example isometric diagram of a MEMS device according to a possible implementation;

[0008] Figure 3 is an example cross-sectional view of a MEMS device according to a possible implementation;

[0009] Figures 4 to 7 is an example isometric diagram of a MEMS device according to a possible implementation;

[0010] Figures 8 to 11 is an example cross-sectional view of a MEMS device according to a possible implementation;

[0011] Fig.12 is an example cross-sectional view of a sensor package according to a possible implementation; and

[0012] Fig.13is an example illustration of an application of a MEMS device according to a possible implementation. DETAILED DESCRIPTION

[0013] Embodiments may provide a MEMS device having an electrode and a dielectric. According to a possible embodiment, the MEMS device may include a first electrode oriented longitudinally along an axis and parallel to the axis. The first electrode may have a first end and a second end. The MEMS device may include a second electrode oriented longitudinally along an axis and parallel to the axis. The second electrode may have a first end and a second end. The MEMS device may include a third electrode oriented longitudinally along an axis and parallel to the axis. The third electrode may have a first end and a second end. The MEMS device may include a solid dielectric having a plurality of holes. The first electrode, the second electrode, and the third electrode may each be at least partially located within one of the plurality of holes. The dielectric may surround the second end of the second electrode and the first end of the third electrode. The first end of the second electrode and the second end of the third electrode may be located outside the solid dielectric.

[0014] At least some embodiments may be based on dielectric actuators, where a dielectric is placed between electrodes at different potentials. The electrostatic force generated is used to pull the dielectric and electrodes so that the dielectric covers as much of the electrodes as possible, thereby maximizing the capacitance between them. The force is proportional to the change in capacitance with displacement and the square of the voltage.

[0015] In detail, when a voltage is applied between adjacent electrodes, an electrostatic force is generated, which pulls the dielectric and the electrode in a way that more fully engages the dielectric and the electrode. The energy in the capacitor is E = 1 / 2CV 2 Moving the dielectric into the gap between the electrodes increases the capacitance. Electrostatic force F = δE / δz = 1 / 2δC / δzV 2 , where z is the junction direction of the dielectric and the electrode. As long as the ends of the dielectric are not too close to the ends of the conductive electrodes and as long as the electrodes are ideally shaped, the capacitance between the electrodes varies linearly as a function of the displacement of the dielectric. Therefore, the electrostatic force generated is constant regardless of the position of the dielectric between the electrodes.

[0016] In a conventional parallel plate sensor, the electrostatic force varies inversely with the square of the gap between the plates. In a MEMS device (such as a microphone), the electrostatic force causes the diaphragm to deflect as a function of displacement and thus stiffen. When a dielectric motor is used as a sensor in a MEMS device (such as a microphone), the electrostatic force generated by the motor causes the diaphragm to bend and thus increase the stiffness of the diaphragm. This additional stiffness is proportional to the square of the applied voltage. The sensitivity of the sensor is also proportional to the applied voltage, so there is a conflict between increasing the applied voltage to increase the sensitivity and reducing the mechanical compliance of the diaphragm (i.e., increasing the stiffness). At least some embodiments may provide a dual dielectric motor that can make the overall compliance independent of the voltage applied to at least the first order.

[0017] One problem with conventional parallel plate MEMS microphones is that the diaphragm tends to collapse onto the backplate under high impact or acoustic loads. A dual diaphragm single backplate microphone can become very unstable as the gap between the diaphragm and the backplate becomes unequal. Using dual dielectric motors for sensing can avoid electrostatic collapse and electrostatic stiffening of the diaphragm. Some embodiments can use two opposing dielectric motors to balance the electrostatic forces between them. In some embodiments, this can allow large bias voltages where there is little or no net electrostatic force or electrostatic force gradient and the position is applied between the electrode and the dielectric of the MEMS device.

[0018] Figure 1 is an example cross-sectional view of a MEMS device 100 according to a possible implementation. Figure 2 is an example isometric diagram of a MEMS device 200 according to a possible implementation. Figure 3 is an example cross-sectional view of a MEMS device 300 according to a possible implementation. Figures 4 to 7 are example isometric views of MEMS devices 400 , 500 , 600 , and 700 , according to possible implementations. Figures 8 to 11 are example cross-sectional views of MEMS devices 800 , 900 , 1000 , and 1100 , according to possible implementations. Fig.12 is an example cross-sectional view of a sensor package 1200 according to a possible implementation. Fig.13 is an example illustration 1300 of an application of the MEMS device 400 or any other disclosed MEMS device according to a possible implementation.

[0019] Usually, reference Figures 1 to 3, the MEMS device may include a first electrode 110 oriented longitudinally along an axis 160 and parallel to the axis. The first electrode 110 may have a first end 111 and a second end 112. The MEMS device may include a second electrode 120 oriented longitudinally along an axis 160 and parallel to the axis. The second electrode 120 may have a first end 121 and a second end 122. The MEMS device may include a third electrode 130 oriented longitudinally along an axis 160 and parallel to the axis. The third electrode 130 may have a first end 131 and a second end 132. The electrodes 110, 120 and 130 may be electrodes of a cylindrical, plate, rectangular parallelepiped, prism, polyhedron or other shape. The length of the first electrode 110 may be longer than the length of the second electrode 120 and longer than the length of the third electrode 130. The MEMS device includes a dielectric 150 dispersed between the electrodes. The dielectric 150 has a plurality of holes 156 ( Figure 1 150). The first electrode, the second electrode, and the third electrode can each be at least partially located in one of the plurality of holes 156. Being at least partially located in a hole can imply that a portion of the electrode is located in the hole and / or that the electrode is located in a portion of the hole. According to possible embodiments, at least the second electrode and the third electrode can be only partially located in the hole 156, and the ends will be located outside the solid dielectric 150. The electrodes can be substantially fixed relative to each other. For example, the electrodes can be substantially fixed while allowing some relative movement due to bending and other forces. The dielectric 150 and the electrodes are free to move relative to each other.

[0020] From the first voltage source V l A voltage of is applied between the first electrode 110 and the second electrode 120, thereby generating a relatively constant force F l . A voltage from a second voltage source V2 is applied between the first electrode 110 and the third electrode 130 to generate a relatively constant force F2. The forces F1 and F2 are opposite. If the structure is relatively symmetrical and the magnitudes of the voltage sources V1 and V2 are equal, the forces F1 and F2 are equal, so a net zero force is applied between the dielectric and the electrodes. The magnitudes of the voltages from the voltage sources V1 and V2 may be unequal to compensate for the asymmetry of the structure or to intentionally generate a non-zero net force between the dielectric and the electrodes.

[0021] The MEMS device may be a MEMS transducer. For example, the MEMS device may be a sensor or an actuator. The MEMS device may be mechanically driven, such as used as a differential sensor, microphone, vibration sensor, or other sensor. The MEMS device may also be electrically driven, such as used as an actuator or speaker to produce mechanical motion.

[0022] The MEMS device includes at least one dielectric 150. Figure 2According to possible embodiments, the dielectric 150 may be a solid dielectric that may include a plurality of holes 156. For convenience, the holes 156 are illustrated as cylindrical, but may take any useful shape. The dielectric 150 may surround the second end 122 of the second electrode 120 and the first end 131 of the third electrode 130. The first end 121 of the second electrode 120 and the second end 132 of the third electrode 130 may be located outside the solid dielectric 150. According to possible embodiments, the dielectric 150 may fill at least 50% of the distance between the first electrode 120 and the second electrode 120. The distance may be perpendicular to the first length of the first electrode 110. For example, the dielectric 150 may fill at least 75% of the distance, at least 80% of the distance, at least 80% of the distance, at least 80% to 90% of the distance. However, the dielectric 150 may fill any amount from 1% to 99% of the distance. The more the dielectric fills the gap between the electrodes, the greater the capacitance change per unit displacement, and therefore the greater the force generated for a given bias between the electrodes. Some minimum gap should be maintained between the dielectric and the electrode, which is subject to manufacturing constraints so that the dielectric and the electrode remain movable relative to each other. Although some embodiments show a solid dielectric 150 with holes 156 (such as channels or passages), the solid dielectric 150 can also take other forms, such as one or more segments or members, as shown in other embodiments.

[0023] The dielectric 150 can move relative to the first electrode, the second electrode, and the third electrode. For example, the dielectric 150 can move substantially and intentionally more than slightly due to accidental flexing, bending, bumping, and other slight movements of the dielectric 150. In addition, when the dielectric 150 can move relative to the first electrode, the second electrode, and the third electrode parallel to the axis 160, the first electrode, the second electrode, and the third electrode can also move relative to the dielectric 150. Therefore, by enabling the electrodes and the dielectric 150 to move relative to each other, the electrodes and / or the dielectric 150 may or may not be fixed or movable relative to other elements of the MEMS device, relative to the earth, and / or relative to any other reference point.

[0024] There is a first capacitance between the first electrode 110 and the second electrode 120. There is a second capacitance between the first electrode 110 and the third electrode 130. The capacitance between the electrodes can be a function of the dielectric 150. For example, when the dielectric 150 moves relative to the electrodes in a direction parallel to the axis 160, the values ​​of the first capacitance and the second capacitance can change in opposite directions. For example, when the dielectric 150 moves and causes the first capacitance to increase, the second capacitance can decrease. The electrostatic force on the dielectric 150 relative to the electrodes 110, 120 and 130 can be substantially unchanged relative to the displacement.

[0025] The first electrode 110 may be at least partially disposed within a first hole of the plurality of holes 156. The second end 122 of the second electrode 120 may be disposed within a second hole of the plurality of holes 156. The first end 131 of the third electrode 130 may be disposed within a third hole of the plurality of holes 156. The first hole, the second hole, and the third hole may be different holes.

[0026] The dielectric 150 may include a first surface 151 and a second surface 152. The first surface 151 and the second surface 152 may be parallel to a plane perpendicular to the axis 160. The first end 111 and the second end 112 of the first electrode 110 may be located outside the dielectric 150. The second end 112 of the first electrode 110 and the second end 132 of the third electrode 130 may extend beyond the second surface 152 of the dielectric 150. The first end 121 of the second electrode 120 may extend beyond the first surface 151 of the dielectric 150. The first end 111 of the first electrode 110 may also extend beyond the first surface 151 of the dielectric 150.

[0027] In an embodiment, the first electrode 110 may be one of a plurality of first conductive pins electrically connected to each other. The second electrode 120 may be one of a plurality of second conductive pins electrically connected to each other. The third electrode 130 may be one of a plurality of third conductive pins electrically connected to each other.

[0028] refer to Figure 3 According to a possible embodiment, the first electrode may be a plurality of first electrodes 110-x, the second electrode may be a plurality of second electrodes 120-x, and the third electrode may be a plurality of third electrodes 130-x. The plurality of second electrodes 120-x and the plurality of third electrodes 130-x may be staggered on either side of the plurality of first electrodes 110-x. This may allow for more capacitance and an increase in capacitance variation with displacement. Other configurations of conductive and dielectric elements, such as strips or rings, may also be used. The plurality of first electrodes 110-x may be collectively referred to as a first plurality of electrodes. Similarly, the plurality of second electrodes 120-x may be collectively referred to as a second plurality of electrodes, and the plurality of third electrodes 130-x may be collectively referred to as a third plurality of electrodes.

[0029] Reference to a plurality of conductive pins connected to each other Figures 4 to 7 , the first hole 156, the second hole 156 and the third hole 156 can be a first plurality of holes 156, a second plurality of holes 156 and a third plurality of holes 156, respectively. The first plurality of conductive pins can be arranged in a two-dimensional array in a plane perpendicular to the axis 160. The second plurality of conductive pins and the third plurality of conductive pins can be arranged in a corresponding two-dimensional array in a plane perpendicular to the axis 160 and interspersed in the first plurality of conductive pins. According to possible embodiments, depending on the implementation, the dielectric 150 can be considered as a non-conductive electric field modulation member.

[0030] refer to Figure 4 , the MEMS device may include a diaphragm 170 coupled to at least the first electrode 110-x. The diaphragm 170 may have a substantially flat surface 172 perpendicular to the axis 160. The surface 172 may be substantially flat, as there may be defects on the surface 172, or the surface 172 may be slightly curved or uneven while still allowing the surface 172 to operate in a manner useful to the diaphragm. The diaphragm 170 may also have an interlayer.

[0031] According to a possible embodiment, the diaphragm 170 may be a first diaphragm coupled to the first electrode 110-x and the third electrode 130-x. The MEMS device may include a second diaphragm 174 coupled to the first electrode 110-x and the second electrode 120-x. The second diaphragm 174 may be located on the side of the dielectric 150 opposite to the first diaphragm 170. The second diaphragm 174 may have a substantially flat surface 176 perpendicular to the axis 160. The first diaphragm 170 and the second diaphragm 174 are spaced apart from the dielectric 150 to allow relative movement between the electrodes connected to the first diaphragm and the second diaphragm and the dielectric 150. A low pressure area may be established and sealed between the diaphragms 170 and 174 to reduce structural noise and damping. The first electrode 110-x is connected to the first diaphragm 170 and the second diaphragm 174 and prevents the diaphragm from collapsing onto the dielectric 150. The low pressure area may be substantially a vacuum such as a pressure less than 1 Torr, less than 300 mTorr, or less than 100 mTorr.

[0032] Diaphragms 170 and 174 may be made of a dielectric material such as silicon nitride. Dielectric 150 may be silicon nitride. Electrodes 110-x, 120-x, and 130-x may be polysilicon. However, other materials may be used. For example, one or more of diaphragm 170, diaphragm 174, and dielectric 150 may be polyimide. As another example, the conductor for the electrodes may be a plated metal.

[0033] refer to Figure 4 , dielectric 150 is fixed in place, with its periphery attached to substrate 180 by means of spacer layers 182, 184, and 186. The periphery of the diaphragm is also attached to substrate 180 by means of spacer layers 182, 184, and 186. Dielectric 150 is relatively thick and stiff compared to diaphragms 172 and 174, and remains relatively stationary when diaphragms 172 and 174 are deflected. Deflection of diaphragms 172 and 174 causes electrodes 110-x, 120-x, and 130-x to move relative to dielectric 150.

[0034] Figure 5 Shows Figure 41 is a perspective view of a MEMS device that is partially constructed, showing only the second diaphragm 174, the first electrode 110-x, and the second electrode 120-x. The example interconnect 114 is shown as electrically connected to the electrode 110-x (e.g., a pin of the first electrode), and the example interconnect 124 is shown as electrically connected to the electrode 120-x (e.g., a pin of the second electrode).

[0035] Figure 6 continue Figure 4 A MEMS device is constructed in which a dielectric 150 including a hole 156 is added, wherein a first electrode and a second electrode are disposed within the hole 156.

[0036] Figure 7 continue Figure 4 The structure of the MEMS device is shown in FIG. 1 , wherein a third electrode 130-x and an example interconnect 134 electrically connected to the third electrode 130-x (e.g., a pin of the third electrode 130-x) are provided. The structure continues with the addition of the first diaphragm 170 and the removal of the central area of ​​the spacer layers 182, 184, and 186 by sacrificial etching to form Figure 4 MEMS devices.

[0037] refer to Figure 8 and Fig. 9 , the MEMS device may include a fourth electrode 140. The fourth electrode 140 may have a first end 141 and a second end 142. The dielectric 150 may surround the first end 111 of the first electrode 110 and the second end 142 of the fourth electrode 140. The second end 112 of the first electrode 110 and the first end 141 of the fourth electrode may be located outside the dielectric 150. The fourth electrode 140 may or may not be electrically coupled to the first electrode 110. Fig. 9 , the fourth electrode 140 can be coaxial with the first electrode 110, such as by being located in the same hole.

[0038] refer to Figure 4 , the second electrode 120-x may be coaxial with the corresponding third electrode 130-x. Figures 9 to 11 , the second electrode 120-x can be coaxial with the corresponding third electrode 130-x. For example, the second electrode and the third electrode can be located in the same hole. Fig.10 and Fig.11 , an optional dielectric support layer D may be present between the second electrode 120 and the third electrode 130. The dielectric support layer D may or may not have the same cross-sectional area as the second electrode 120 and the third electrode 130. The dielectric support layer D may be used for structural purposes while taking into account any additional parasitic capacitance. For example, if the chamber between the diaphragms is under vacuum, the dielectric support layer D may be used to prevent collapse or contact between the second electrode 120 and the third electrode 130.

[0039] refer to Fig.10 , a MEMS device as a sensor such as used in a microphone may include a first charge amplifier 194 coupled to the second electrode 120. The first charge amplifier 194 may bias the second electrode 120 to a first potential relative to the first electrode 110. The MEMS device may include a second charge amplifier 196 coupled to the third electrode 130. The second charge amplifier 196 may bias the third electrode 130 to a second potential relative to the first electrode 110. The first potential may be substantially equal to the second potential. The first potential may also be different from the second potential. When the dielectric 150 moves relative to the electrodes, the first charge amplifier 194 and the second charge amplifier 196 may produce complementary outputs. For example, Q=C*V, when a charge amplifier is used, V remains constant. When C rises, Q may rise, and vice versa. This results in complementary outputs.

[0040] For example, according to possible implementations, one electrode, such as electrode 110, may be full length, while the other electrode may be segmented, such as into electrodes 120 and 130. First electrode 110 may be biased. Using charge amplifiers 194 and 196, drive electrodes 120 and 130 may be biased to a fixed potential, i.e., ground, through a very high resistance value across a feedback capacitor. Charge amplifiers 194 and 196 may produce complementary outputs when dielectric 150 moves along an axis substantially parallel to the lengths of the first, second, and third electrodes.

[0041] refer to Fig.11 , a MEMS device as a sensor such as used in a microphone may include a high input impedance voltage amplifier 1000, which includes a first input terminal 1010 and a second input terminal 1020. The first input terminal 1010 can be coupled to the second electrode 120, and the second input terminal 1020 can be coupled to the third electrode 130. The input terminals 1010 and 1020 are biased to a fixed potential, i.e., ground, through a very high resistance value. As described above, Q=C*V. When a high impedance amplifier is used, Q can remain constant because there is no current. When C rises, V falls, and vice versa. This results in complementary outputs.

[0042] refer to Fig.12, the MEMS device 100 or any other disclosed MEMS device can be part of a sensor package 1200. The sensor package 1200 can include a housing 1111, which can include a base 1110 and a cover 1105 (such as a can or any other cover) coupled to the base 1110. The first electrode 110-x, the second electrode 120-x, and the third electrode 130-x and the solid dielectric 150 can be located within the housing 1111. For example, the housing 1111 can surround the MEMS device between the cover 1105 and the base 1110. The sensor package 1100 may include an external device interface 1520 disposed on the base 1110. The external device interface 1520 can be implemented as a surface mount interface or can include leads configured for mounting on a host device through a hole.

[0043] The sensor package 1200 may include an integrated circuit 1530, such as an application specific integrated circuit (ASIC) electrically coupled to the first electrode 110, the second electrode 120, and the third electrode 130. The integrated circuit 1530 may also be coupled to contacts of the external device interface 1520, such as via electrical leads 1534 and / or leads extending through the base 1110. The integrated circuit 1530 may receive electrical signals from the MEMS device 100 (such as via electrical leads 1532), and may communicate with a host device using contacts of the external device interface 1520, such as via electrical leads 1534 and / or leads in the base 1110. According to possible implementations, the integrated circuit 1530 may be covered with a protective coating 1526.

[0044] According to possible embodiments, the base 1110 may include an acoustic port 1150. The MEMS device 100 may be acoustically coupled to the acoustic port 1150. For example, the acoustic port 1150 may be a hole in the base 1110 that allows sound to pass through the base to the MEMS device 100. The illustrated embodiment may be considered a bottom port embodiment, but the acoustic port 1150 may be located at other locations on the transducer assembly. For example, the acoustic port 1150 may also be located on a cover 1105 for a top port transducer assembly. The acoustic port 1150 may also be located on one side of the sensor package 1100, the acoustic port 1150 may be located anywhere else on the sensor package 1100, or there may be no acoustic port 1150, such as for a MEMS die vibration sensor or other sensor. According to possible embodiments, when the MEMS device 100 includes at least one diaphragm 170 and / or 174, the diaphragm 170 and / or 174 may be acoustically coupled to the acoustic port 1150. According to other embodiments, MEMS device 100 may not be in a sensor package, such as when MEMS device 100 is an actuator, as described above.

[0045] refer to Fig.13, a MEMS device (such as MEMS device 400 or any other disclosed MEMS device) as an actuator such as used in a speaker is connected to an amplifier 1310. The output of the amplifier 1310 is connected to a first electrode 110-x of the MEMS device. The second electrode 120-x and the third electrode 130-x are connected to power rails V1 and V2, respectively. The output of the amplifier 1310 varies between the power rail values ​​of V1 and V2 in response to the input signal. When the amplifier output is the mid-rail (V1+V2) / 2, the electrostatic forces applied to the electrodes and therefore to the diaphragms 170 and 172 are balanced. When the amplifier output approaches one of the power rails, the electrostatic forces applied to the electrodes and therefore to the diaphragms reach a maximum in one direction. When the amplifier output approaches the opposite power rail, the electrostatic forces applied to the electrodes and therefore to the diaphragms reach a maximum in the other direction. Since the electrostatic force is proportional to the square of the voltage, this embodiment produces nonlinear movement.

[0046] The amplifier 1310 can be a pulse width modulation (PWM) or pulse density modulation (PDM) amplifier, in which its output is digital and swings between two power rails. The average value of the PWM amplifier output and the average value of the PDM amplifier output are functions of their inputs. The output of the digital amplifier is applied to the first electrode 110-x. The electrostatic force applied to the electrode and therefore to the diaphragm is proportional to the square of the average value. A square root function can be included in the digital amplifier so that the movement of the diaphragm can be linearly related to the input. The diaphragms can couple their movement directly to the air to produce sound, or they can couple their movement through an auxiliary diaphragm to move the air and thus produce sound.

[0047] According to a possible embodiment, the MEMS device may include a solid dielectric, which may have a first outer surface and a second outer surface opposite to the first outer surface. The dielectric may have a plurality of passages (such as holes), each of which may have an opening located on the first outer surface and an opening located on the second outer surface. The MEMS device may be a MEMS transducer. The MEMS device may include an electrode set. The dielectric and the electrode set may move relative to each other.

[0048] The electrode set may include a first electrode partially disposed within a first via of the plurality of vias such that a first end of the first electrode extends beyond the first outer surface and a second end of the first electrode extends beyond the second outer surface. The first electrode may be one electrode of a plurality of first electrodes electrically connected to each other.

[0049] The electrode set may include a second electrode partially disposed within a second via of the plurality of vias such that a first end of the second electrode extends beyond the first outer surface and a second end of the second electrode is within the second via. The second electrode may be one electrode of a plurality of second electrodes electrically connected to each other.

[0050] The electrode set may include a third electrode partially disposed within a third passage of the plurality of passages such that a first end of the third electrode is within the third passage and a second end of the third electrode extends beyond the second outer surface. The third electrode may be one electrode of a plurality of third electrodes electrically connected to each other. The first electrode, the second electrode, and the third electrode may be fixed relative to each other.

[0051] According to another possible embodiment, the device may include an electrode set and a dielectric member. The electrode set may include at least a first electrode, a second electrode and a third electrode. The electrodes in the electrode set may each have a separate height, wherein the ends of each height have an upper surface and a lower surface. There is a capacitance between at least the first electrode and the second electrode and the first electrode and the third electrode of the electrode set.

[0052] The dielectric member may have a height with an upper surface and a lower surface at the ends of the height. The dielectric member may have a hole through the member so that the dielectric member surrounds the electrode set and is spaced apart from each electrode in the electrode set. The dielectric member may not be in mechanical contact with any electrode in the electrode set.

[0053] The upper surface of the first electrode in the electrode concentration may be above the upper surface of the dielectric member, and the lower surface of the first electrode in the electrode concentration may be below the lower surface of the dielectric member. The upper surface of the second electrode in the electrode concentration may be above the upper surface of the dielectric member, and the lower surface of the second electrode may be between the upper and lower surfaces of the dielectric member. The upper surface of the third electrode in the electrode concentration may be between the upper and lower surfaces of the dielectric member, and the lower surface of the third electrode in the electrode concentration may be below the lower surface of the dielectric member.

[0054] The physical position of the electrodes in the electrode set may be substantially fixed relative to each other.The physical position of the electrode set relative to the position of the dielectric member may be allowed to move.

[0055] The relative position of each electrode to the other electrodes can be substantially fixed. Some electrodes can be fixed while other electrodes are allowed to move. For example, the first electrode and the dielectric member can be fixed together, and the second electrode and the third electrode can be allowed to move relative to the dielectric member. Other configurations are also possible.

[0056] The first electrode in the electrode collection may be divided into two electrically independent members. The first member may have an upper surface and a second lower surface. The second member may have a second upper surface and a lower surface. The upper surface of the first member of the first electrode may be above the upper surface of the dielectric member. The second lower surface of the first member of the first electrode may be between the upper surface and the lower surface of the dielectric member. The second upper surface of the second member of the first electrode may be between the upper surface and the lower surface of the dielectric member, and the lower surface of the second member of the first electrode may be below the lower surface of the dielectric member.

[0057] According to a possible embodiment, the MEMS device may include a solid dielectric having a plurality of holes. The MEMS device may include a first plurality of electrodes, the first plurality of electrodes extending completely through a first subset of the plurality of holes. The MEMS device may include a second plurality of electrodes, the second plurality of electrodes extending partially into a second subset of the plurality of holes. The second subset may be different from the first subset. The MEMS device may include a third plurality of electrodes, the third plurality of electrodes extending partially into a third subset of the plurality of holes. The third subset may be different from the first subset.

[0058] According to a possible implementation of the above embodiment, the solid dielectric may include a first side and a second side opposite to the first side. A plurality of holes may extend from the first side to the second side. A second plurality of electrodes may partially extend from the first side to the second subset. A third plurality of electrodes may partially extend from the second side to the third subset. The second subset may be the same as or different from the third subset.

[0059] Although the present disclosure has been described using specific embodiments of the present disclosure, it is apparent that many alternatives, modifications, and variations will be apparent to those skilled in the art. For example, various components of the embodiments may be interchanged, added, or replaced in other embodiments. In addition, all elements in the various figures are not necessary for the operation of the disclosed embodiments. For example, by simply adopting the elements of the independent claims, a person of ordinary skill in the field of the disclosed embodiments will be able to make and use the teachings of the present disclosure. Therefore, the embodiments of the present disclosure set forth herein are intended to be illustrative rather than restrictive. Various changes may be made without departing from the spirit and scope of the present disclosure.

[0060] In this document, related terms such as "first", "second" and the like can be used alone to distinguish one entity or action from another entity or action, without requiring or implying any actual such relationship or order between such entities or actions. The phrase "at least one", "at least one selected from a group" or "at least one selected from" followed by a list is defined to mean one, some or all, but not necessarily all, of the elements in the list. The terms "comprises", "comprising", "including" or any other variation thereof are intended to cover non-exclusive inclusions, so that the process, method, article or equipment including the list of elements not only includes those elements, but may also include other elements that are not explicitly listed or inherent to such process, method, article or equipment. Elements starting with "one", "one" and the like do not exclude the presence of additional identical elements in the process, method, article or equipment including the element without more constraints. In addition, the term "another" is defined as at least the second or more. As used herein, the terms "include", "have" and the like are defined as "include". In addition, the background section is not admitted to be prior art, which is written as the inventor's own understanding of the context of some embodiments when filing the application, and includes the inventor's recognition of any problems with the prior art and / or problems encountered in the inventor's own work.

Claims

1. A micro-electromechanical system (MEMS) device, comprising: a first electrode, the first electrode being longitudinally oriented along and parallel to an axial reference, the first electrode having a first end and a second end; a second electrode, the second electrode being longitudinally oriented along and parallel to the axial reference, the second electrode having a first end and a second end; a third electrode, the third electrode longitudinally oriented along and parallel to the axial reference, the third electrode having a first end and a second end, wherein the first electrode, the second electrode, and the third electrode are fixed relative to each other; A solid dielectric, the solid dielectric comprising a plurality of through holes, wherein the plurality of through holes in the solid dielectric are parallel to the axial reference, and a first surface and a second surface of the solid dielectric are parallel to a plane perpendicular to the axial reference, wherein the first electrode, the second electrode and the third electrode are each at least partially located in a different through hole among the plurality of through holes, wherein the second end of the second electrode and the first end of the third electrode are located in the through hole, and The first end of the second electrode and the second end of the third electrode are located outside the solid dielectric, and the first end of the first electrode and the second end of the first electrode extend through different surfaces of the solid dielectric and are located outside the solid dielectric.

2. The MEMS device according to claim 1, in, The first electrode is at least partially disposed in a first through hole among the plurality of through holes, The second end of the second electrode is disposed in a second through hole among the plurality of through holes. The first end of the third electrode is disposed in a third through hole among the plurality of through holes, and The first through hole, the second through hole and the third through hole are different through holes.

3. The MEMS device according to claim 1, in, There is a first capacitance between the first electrode and the second electrode, and Wherein, a second capacitor exists between the first electrode and the third electrode.

4. The MEMS device according to claim 1, further comprising a fourth electrode having a first end and a second end, in, The solid dielectric surrounds the first end of the first electrode and the second end of the fourth electrode, and The second end of the first electrode and the first end of the fourth electrode are located outside the solid dielectric.

5. The MEMS device according to claim 1, in, The solid dielectric comprises a first surface and a second surface, wherein the second end of the first electrode and the second end of the third electrode extend beyond the second surface, and Wherein, the first end of the second electrode extends beyond the first surface.

6. The MEMS device according to claim 1, wherein: The solid dielectric and the first, second, and third electrodes are movable relative to each other.

7. The MEMS device according to claim 1, in, The first electrode includes a first plurality of conductive pins electrically connected to each other, wherein the second electrode comprises a second plurality of conductive pins electrically connected to each other, and Wherein, the third electrode includes a third plurality of conductive pins electrically connected to each other.

8. The MEMS device according to claim 7, in, The first plurality of conductive pins are arranged in a two-dimensional array in a plane perpendicular to the axial reference, and The second plurality of conductive pins and the third plurality of conductive pins are arranged in corresponding two-dimensional arrays in a plane perpendicular to the axial reference and are interspersed in the first plurality of conductive pins.

9. The MEMS device according to claim 1, wherein: The second electrode is coaxial with a third electrode, the third electrode including a first end portion positioned in the through hole of the solid dielectric.

10. The MEMS device according to claim 1, wherein: The MEMS device includes a MEMS transducer.

11. The MEMS device according to claim 1 , further comprising: A housing, the housing comprising: a base; and a cover coupled to the base, The first electrode, the second electrode, the third electrode and the solid dielectric are located in the shell.

12. The MEMS device according to claim 1, further comprising a diaphragm, wherein the diaphragm is coupled to at least the first electrode, wherein: The diaphragm has a flat surface perpendicular to the axial reference.

13. The MEMS device according to claim 12, in, The diaphragm includes a first diaphragm coupled to the first electrode and the third electrode, wherein the first diaphragm has a flat surface perpendicular to the axial reference, and The MEMS device further comprises a second diaphragm coupled to the first electrode and the second electrode, wherein the second diaphragm is located on a side of the solid dielectric opposite to the first diaphragm, and wherein the second diaphragm has a flat surface perpendicular to the axial reference.

14. The MEMS device according to claim 1, wherein: The first electrode is longer than the second electrode, and the first electrode is longer than the third electrode.

15. The MEMS device according to claim 1, wherein: The solid dielectric fills at least 50% of a distance between the first electrode and the second electrode, the distance being measured perpendicular to a length of the first electrode.

16. The MEMS device according to claim 1, further comprising a voltage source, the voltage source applying a voltage between the first electrode and the second electrode, wherein: The voltage generates a force that acts in a direction to increase the capacitance between the first electrode and the second electrode.

17. The MEMS device according to claim 1, further comprising: a first charge amplifier coupled to the second electrode, the first charge amplifier biasing the second electrode to a first potential relative to the first electrode; as well as A second charge amplifier is coupled to the third electrode, the second charge amplifier biasing the third electrode to a second potential relative to the first electrode.

18. The MEMS device of claim 1, further comprising a high input impedance voltage amplifier, the high input impedance voltage amplifier comprising a first input terminal and a second input terminal, wherein: The first input terminal is coupled to the second electrode, and the second input terminal is coupled to the third electrode.

19. The MEMS device of claim 1, further comprising an amplifier, the amplifier comprising: an output terminal connected to the first electrode; a first power rail coupled to the second electrode; as well as A second power rail is coupled to the third electrode.

20. A micro-electromechanical system (MEMS) device, comprising: a solid dielectric having a first outer surface and a second outer surface opposite the first outer surface, the solid dielectric having a plurality of passages, each of the plurality of passages having an opening on the first outer surface and an opening on the second outer surface; as well as An electrode set, the electrode set comprising: a first electrode disposed partially within a first via of the plurality of vias such that a first end of the first electrode extends beyond the first outer surface and a second end of the first electrode extends beyond the second outer surface; a second electrode partially disposed within a second via of the plurality of vias such that a first end of the second electrode extends beyond the first outer surface and a second end of the second electrode is within the second via; and a third electrode partially disposed within a third via of the plurality of vias such that a first end of the third electrode is within the third via and a second end of the third electrode extends beyond the second outer surface, wherein the first electrode, the second electrode and the third electrode are fixed relative to each other, and Wherein, the solid dielectric and the electrode set are movable relative to each other.

21. The MEMS device of claim 20, wherein: The MEMS device includes a MEMS transducer.

22. The MEMS device according to claim 20, in, The first electrode includes a plurality of first electrodes electrically connected to each other, wherein the second electrode comprises a plurality of second electrodes electrically connected to each other, and The third electrode includes a plurality of third electrodes electrically connected to each other.

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