Detection device and semiconductor packaging detection equipment

Abstract

The present invention proposes a detection device, including a detection component for detecting the flatness of a workpiece surface and a workpiece conveying component for cooperating with the detection operation. The detection component includes a photoelectric sensor, a rotating arm, a baffle, and a connecting piece. The photoelectric sensor includes a transmitter for emitting a light beam and a receiver for receiving the light beam. The rotating arm is rotatably arranged in a plane intersecting with the light beam. The baffle is close to the workpiece surface and is connected to the rotating arm through a connecting piece. The detection device detects the flatness of the workpiece surface through the baffle. Workpieces that do not meet the requirements will touch the baffle, causing the rotating arm to deflect, thereby triggering the photoelectric sensor to alarm. The present invention also proposes a semiconductor packaging detection device for detecting defective semiconductors with residual resin on the pin bracket. During detection, the workpiece is dragged by a hook on a floating plate equipped with the detection component. The vibration caused by this transmission method is very small, ensuring monitoring accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a detection device and semiconductor packaging detection equipment. Background Art

[0002] The packaging process is a crucial step in semiconductor production. Semi-finished molded parts require a debonding process to remove any residual resin. However, in some cases, this residual resin cannot be completely removed, resulting in the workpiece being passed to the next process with resin residue on the lead bracket. In the subsequent rib cutting process, the rib cutting tool can break directly when punching due to the residual resin. This process requires extremely high tool precision, typically reaching the micron level, and each tool can cost hundreds or even thousands of yuan. Therefore, to reduce the scrapping of rib cutting tools, products destined for the rib cutting process must be pre-inspected to screen out any workpieces with residual resin. Summary of the Invention

[0003] In view of the above, the present invention proposes a detection device for detecting the surface flatness of a workpiece; based on the detection device, the present invention also proposes a semiconductor packaging detection equipment for detecting defective products with residual resin on the pin bracket before the rib cutting process.

[0004] The present invention provides a detection device, comprising a detection component for detecting the flatness of a workpiece surface and a workpiece conveying component for cooperating with the detection operation, wherein the detection component comprises a photoelectric sensor, a rotating arm, a baffle and a connecting piece;

[0005] The photoelectric sensor includes a transmitter that emits a light beam and a receiver that receives the light beam;

[0006] The rotating arm is arranged to rotate in a plane intersecting the light beam;

[0007] The baffle is close to the surface of the workpiece and is connected to the rotating arm through a connecting piece.

[0008] Preferably, the detection assembly further comprises a limiting mechanism, and the limiting mechanism is located on one side of the rotation direction of the rotating arm;

[0009] When the rotating arm contacts the limiting mechanism, the rotating arm blocks the light beam, so that the receiver cannot receive the light beam.

[0010] Preferably, the detection assembly further includes a reset mechanism;

[0011] The reset mechanism is elastically connected to the rotating arm;

[0012] The reset mechanism and the limiting mechanism are located on the same side of the rotating direction of the rotating arm.

[0013] Preferably, the model of the photoelectric sensor is Omron EE-SX670.

[0014] Preferably, the rotating arm, the baffle and the connecting piece are integrally connected.

[0015] The present invention also provides a semiconductor packaging detection device, which includes the detection device described in any of the above technical solutions.

[0016] Preferably, the conveying assembly includes a first floating plate with a first sliding groove, a second floating plate with a second sliding groove, and a hook for dragging the semiconductor workpiece;

[0017] The first floating plate and the second floating plate are arranged at intervals, and the first slide groove and the second slide groove are arranged opposite to each other and extend in parallel. During detection, the semiconductor workpiece is located between the first floating plate and the second floating plate, and the lead frame on one side of the semiconductor workpiece slides in the first slide groove, and the lead frame on the other side slides in the second slide groove.

[0018] Preferably, the detection assembly is mounted on the first floating plate or the second floating plate.

[0019] Preferably, the baffle is close to the surface of the lead frame.

[0020] Preferably, the detection assembly further comprises a bracket mounted on the first floating plate or the second floating plate;

[0021] A photoelectric sensor is installed on one side of the bracket, and a rotating shaft is installed on the opposite other side. The rotating arm is connected to the rotating shaft through a bearing.

[0022] The present invention provides the following advantages: The present invention uses a baffle to detect the surface flatness of the workpiece. Workpieces that do not meet the requirements will contact the baffle, causing the rotating arm to deflect, thereby triggering a photoelectric sensor alarm. The detection device has a simple structure, stable and reliable operation, and is inexpensive. Furthermore, the workpiece is dragged on the floating plate by a hook, which causes very little vibration, ensuring monitoring accuracy. The detection assembly is mounted on the floating plate, so even if the floating plate is subject to up and down vibrations, monitoring accuracy is not affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention is described in detail below with reference to the embodiments and accompanying drawings, in which:

[0024] Figure 1 It is a three-dimensional diagram of the detection device of the present invention.

[0025] Figure 2 It is a structural diagram of the detection component.

[0026] Figure 3 It is a three-dimensional diagram of the semiconductor packaging detection equipment of the present invention.

[0027] Figure 4It is a cross-sectional view of the semiconductor packaging detection equipment of the present invention from the bottom side perspective.

[0028] Reference numerals:

[0029] 100-detection component, 200-transmission component, 300-semiconductor workpiece, 310-peripheral frame, 320-molded body, 1-photoelectric sensor, 11-transmitter, 12-receiver, 2-rotating arm, 21-bearing, 3-baffle, 4-connector, 5-limiting mechanism, 6-reset mechanism, 61-reset spring, 62-fixing bolt, 7-first floating plate, 71-first slide groove, 8-second floating plate, 81-second slide groove, 9-bracket. DETAILED DESCRIPTION

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0031] Thus, a feature indicated in this specification is intended to illustrate one of the features of one embodiment of the present invention, rather than to imply that every embodiment of the present invention must have the described feature. In addition, it should be noted that this specification describes many features. Although certain features can be combined together to illustrate possible system designs, these features can also be used in other, not explicitly described, combinations. Thus, unless otherwise noted, the described combinations are not intended to be limiting.

[0032] The principle of the present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0033] The present invention provides a detection device, including a detection component 100 for detecting the flatness of a workpiece surface and a workpiece conveying component 200 for cooperating with the detection operation. The detection component 100 includes a photoelectric sensor 1, a rotating arm 2, a baffle 3 and a connecting member 4;

[0034] The photoelectric sensor 1 comprises a transmitter 11 for emitting a light beam and a receiver 12 for receiving the light beam;

[0035] The rotating arm 2 is rotatably arranged in a plane intersecting the light beam;

[0036] The baffle 3 is close to the surface of the workpiece and is connected to the rotating arm 2 through a connecting piece 4.

[0037] The side of baffle 3 closest to the workpiece is flat and parallel to the workpiece surface. If the workpiece surface is warped or contains foreign matter, it will contact baffle 3, causing the pivoting arm 2 connected to baffle 3 to deflect. In its initial position, the pivoting arm 2 blocks the light beam. This deflection moves the beam out of the way, allowing receiver 12 to receive the beam signal. The photoelectric sensor 1 then sends a signal to the controller, informing the operator or robot to remove the defective workpiece.

[0038] This embodiment detects flatness through physical contact, and the detection device has a simple structure and works stably and reliably. Compared with other methods such as image comparison or manual detection, this embodiment consumes much less labor, cost, and energy.

[0039] In this embodiment, the detection assembly 100 further includes a limiting mechanism 5, which is located on one side of the rotation direction of the rotating arm 2;

[0040] The limiting mechanism 5 is used to locate the initial position of the rotating arm 2 , that is, when the rotating arm 2 contacts the limiting mechanism 5 , the rotating arm 2 just blocks the light beam, so that the receiver 12 cannot receive the light beam.

[0041] In this embodiment, the detection component 100 further includes a reset mechanism 6 .

[0042] The reset mechanism 6 is elastically connected to the rotating arm 2 and is located on the same side of the rotating direction of the rotating arm 2 as the limiting mechanism 5 .

[0043] When a defective workpiece is detected, the rotating arm 2 is deflected. After the defective workpiece is removed, the rotating arm 2 returns to its initial position under the action of the reset mechanism 6.

[0044] In this embodiment, the model of the photoelectric sensor 1 is Omron EE-SX670.

[0045] The OMRON EE-SX670 is a sensor that integrates a transmitter 11 and a receiver 12. Compared to a proximity switch, the OMRON EE-SX670 has a longer detection range and is contactless, so it does not damage or affect the workpiece being tested. Furthermore, the OMRON EE-SX670 offers a fast response time, generating a switch signal based on the amount of reflected light.

[0046] In this embodiment, the rotating arm 2, baffle 3, and connector 4 are integrally connected. The front of the baffle 3 is in close contact with the workpiece surface, while its back is connected to the connector 4. The rotating arm 2, baffle 3, and connector 4 are formed in a single process, which reduces production costs and improves strength and durability.

[0047] The present invention also provides a semiconductor packaging detection device, comprising the detection device described in any one of the above embodiments.

[0048] In this embodiment, the conveying assembly 200 includes a first floating plate 7 having a first slide groove 71, a second floating plate 8 having a second slide groove 81, and a hook (not shown in the figure) for dragging the semiconductor workpiece 300; the first floating plate 7 and the second floating plate 8 are arranged at intervals, and the first slide groove 71 and the second slide groove 81 are arranged opposite to each other and extend in parallel.

[0049] Before the rib cutting process, the leads on both sides of the packaged semiconductor workpiece 300 are still unbent, and the peripheral frame 310 to be removed still remains. During inspection, the semiconductor workpiece 300 is positioned between the first floating plate 7 and the second floating plate 8. The lead frame on one side of the semiconductor workpiece 300 slides within the first slide groove 71 under the action of the retractor, while the lead frame on the other side slides within the second slide groove 81.

[0050] The inspection assembly 100 is mounted on the first floating plate 7 or the second floating plate 8, with the baffle 3 positioned close to the surface of the lead frame. As the semiconductor workpiece 300 rapidly passes the baffle 3, the inspection assembly 100 rapidly inspects the lead frame of each semiconductor workpiece 300 for any residual resin that has not been cleaned.

[0051] The semiconductor packaging inspection equipment may also be configured with multiple inspection components 100 for inspecting different positions of the semiconductor workpiece 300 .

[0052] In addition, the shape of the side of the baffle 3 close to the semiconductor workpiece 300 can also be designed according to the surface shape of the workpiece, such as being designed into a "J" shape, which can cross the mold package 320 and simultaneously detect the lead frames on both sides of the semiconductor workpiece 300.

[0053] The photoelectric sensor 1 , the rotating arm 2 , the limiting mechanism 5 and the resetting mechanism 6 may be directly mounted on the first floating plate 7 or the second floating plate 8 , or may be assembled and mounted on the first floating plate 7 or the second floating plate 8 .

[0054] In this embodiment, the detection assembly 100 further includes a bracket 9 mounted on the first floating plate 7 or the second floating plate 8;

[0055] A photoelectric sensor 1 is mounted on one side of the bracket 9 , and a rotating shaft is mounted on the opposite side. The rotating arm 2 is connected to the rotating shaft via a bearing 21 .

[0056] In this embodiment, the limiting mechanism 5 is a limiting bolt installed on the bracket 9.

[0057] In this embodiment, the reset mechanism 6 includes a reset spring 61 and a fixing bolt 62. The fixing bolt 62 and the limit bolt are located on the same side of the rotation direction of the rotating arm 2. The rotating arm 2 has a mounting hole for the reset spring 61. One end of the reset spring 61 is connected to the rotating arm 2 through the mounting hole, and the other end is mounted on the fixing bolt 62.

[0058] Under the tension of the return spring 61, the rotating arm 2 rests against the stop bolt. At this point, the rotating arm 2 is in its initial position, shielding the light beam from the receiver 12. When the baffle encounters residual resin, the collision causes it to displace around the bearing 21, disrupting the equilibrium state and causing the return spring 61 to stretch. After removing the defective semiconductor workpiece 300 with residual resin, the return spring 61 contracts, returning the rotating arm 2 to its equilibrium position.

[0059] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A detection device comprising a detection component for detecting the surface flatness of a semiconductor workpiece and a workpiece conveying component for cooperating with the detection operation, characterized in that: The detection assembly includes a bracket fixed to the workpiece conveying assembly, a photoelectric sensor installed on one side of the bracket, a rotating shaft installed on the other side opposite to the bracket, a rotating arm connected to the rotating shaft through a bearing, a baffle and a connecting piece, a limiting mechanism, and a reset mechanism; The photoelectric sensor includes a transmitter for emitting a light beam and a receiver for receiving the light beam; The rotating arm is rotatably arranged in a plane intersecting with the light beam; The baffle is close to the surface of the semiconductor workpiece, and its contact surface with the workpiece is a plane parallel to the surface of the workpiece, and is integrally connected to the rotating arm through the connecting member; The limiting mechanism is located on one side of the rotation direction of the rotating arm, and when the rotating arm contacts the limiting mechanism, the rotating arm blocks the light beam; The reset mechanism includes a reset spring and a fixing bolt, one end of the reset spring is connected to the rotating arm, and the other end is fixed to the fixing bolt, and the reset mechanism and the limiting mechanism are located on the same side of the rotation direction of the rotating arm, so that the rotating arm always presses against the limiting mechanism under the tension of the reset spring to maintain the initial position.

2. The detection device according to claim 1, wherein The model of the photoelectric sensor is Omron EE-SX670.

3. A semiconductor packaging testing device, characterized in that: Comprising the detection device according to claim 1 or 2.

4. The semiconductor packaging testing equipment according to claim 3, wherein: The conveying assembly includes a first floating plate with a first sliding groove, a second floating plate with a second sliding groove, and a hook for dragging the semiconductor workpiece; The first floating plate and the second floating plate are spaced apart from each other, and the first slide groove and the second slide groove are oppositely arranged and extend in parallel. During detection, the semiconductor workpiece is located between the first floating plate and the second floating plate, and the lead frame on one side of the semiconductor workpiece slides in the first slide groove, and the lead frame on the other side slides in the second slide groove.

5. The semiconductor packaging testing equipment according to claim 4, wherein: The detection assembly is mounted on the first floating plate or the second floating plate.

6. The semiconductor packaging testing equipment according to claim 4, wherein: The baffle is close to the surface of the lead frame.

7. The semiconductor packaging testing equipment according to claim 4, wherein: The detection assembly further includes a bracket mounted on the first floating plate or the second floating plate.

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