Semiconductor processing apparatus and cassette loading and unloading device therefor

Abstract

This application provides a semiconductor process equipment and its wafer cassette loading and unloading device. The wafer cassette loading and unloading device includes: a main chassis, an unlocking mechanism, and a sealing telescopic assembly; the main chassis has a sealed loading space, and at least one side panel of the main chassis has a transfer port; the unlocking mechanism includes a door frame structure and an unlocking panel, the door frame structure is disposed within the loading space, the unlocking panel is disposed within the door frame structure, and can telescopically move relative to the door frame structure to pass through the transfer port, for adsorbing the door panel and opening the wafer cassette; the door frame structure is used to drive the unlocking panel and the door panel to move, so that the loading space and the temporary storage space within the wafer cassette are connected; the sealing telescopic assembly is disposed between the door frame structure and the unlocking panel, and can telescopically move with the unlocking panel, so that the installation space is completely sealed and isolated from the loading space and the temporary storage space. This application embodiment can prevent wafers within the wafer cassette from being contaminated by particles and oxygen, thereby significantly improving product quality.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and more specifically, to a semiconductor process equipment and a wafer cassette unloading device thereof. Background Technology

[0002] Currently, front-opening interface mechanical standard (FIMS) is an important component of the transfer system in semiconductor process equipment and vertical thermal processing equipment. In the semiconductor industry, front-opening wafer cassettes are often used as containers for wafer transfer and temporary storage. During the process of placing and removing wafers, FIMS is used to fix, purge, open, and close the wafer cassette to ensure that the cassette is sealed to the outside world before and after the door is opened, so that the wafer can be transferred cleanly between the process chamber and the wafer cassette.

[0003] In existing FIMS (Film Suspension Module) technology, the film cassette needs to be opened and closed during operation. The internal space of the FIMS houses moving parts such as cylinders required for the movement of the FIMS unlocking panel. Particles generated by the relative movement of these parts during normal operation gradually accumulate in the internal space of the FIMS. When opening the cassette, the unlocking panel uses suction cups to adhere to the cassette door panel and moves the panel to open it. During this opening process, particles generated inside the FIMS diffuse into the cassette due to movement and pressure changes, causing particle contamination and leading to product quality issues. Summary of the Invention

[0004] This application addresses the shortcomings of existing methods by proposing a semiconductor process equipment and its wafer cassette loading and unloading device to solve the technical problem of particle contamination of wafers during the wafer cassette opening process in the prior art.

[0005] In a first aspect, embodiments of this application provide a wafer cassette loading and unloading device for semiconductor process equipment, used for transferring wafers between a wafer cassette and a process chamber, comprising: a main chassis, an unlocking mechanism, and a sealing telescopic assembly; the main chassis has a sealed loading space, and at least one side panel of the main chassis has a transfer port communicating with the loading space, the outer periphery of the transfer port being used to seal against the opening of the wafer cassette; the unlocking mechanism includes a door frame structure and an unlocking panel, the door frame structure being disposed within the loading space, and the door frame structure being movable relative to the side panel for selectively sealing the transfer port to seal the wafer cassette. The loading space; the unlocking panel is disposed within the door frame structure and can extend and retract through the transmission port to attract and move the door panel of the tray to open the tray; the door frame structure is also used to move the unlocking panel and the door panel to connect the loading space with the temporary storage space in the tray; the sealing telescopic assembly is disposed between the door frame structure and the unlocking panel to cooperate with the unlocking panel to form a sealed installation space within the door frame structure, and can extend and retract with the unlocking panel to completely seal and isolate the installation space from the loading space and the temporary storage space.

[0006] In one embodiment of this application, the sealing telescopic assembly includes a flexible sealing ring, the outer periphery of which is sealed to the door frame structure, and the inner periphery of which is sealed to the periphery of the unlocking panel.

[0007] In one embodiment of this application, an integrally formed connecting ring is provided on both the outer and inner periphery of the sealing ring. The connecting ring is fitted onto the periphery of the door frame structure and the unlocking panel, and the hardness of the connecting ring is greater than that of the sealing ring.

[0008] In one embodiment of this application, the sealing telescopic assembly further includes a clamping member and a fastener. The clamping member is stacked on the connecting ring, and the fastener passes through the clamping member and the connecting ring in sequence and is connected to the door frame structure or the unlocking panel.

[0009] In one embodiment of this application, a receiving groove is provided on the periphery of the surface of the door frame structure opposite to the side plate, and a receiving groove is provided on the periphery of the surface of the unlocking panel away from the loading space. The receiving groove is used to accommodate the connecting ring and the clamping member.

[0010] In one embodiment of this application, the sealing ring is in a stacked state when the unlocking panel is retracted, and the sealing ring can form a folded space. The opening of the folded space is located between the door frame structure and the unlocking panel, and the opening of the folded space faces the transmission port.

[0011] In one embodiment of this application, the extension length of the sealing ring can cover the telescopic movement stroke of the unlocking panel; the sealing ring includes an integrally formed outer sealing section, a flexible section and an inner sealing section sequentially from its outer periphery to its inner periphery, and the flexible section has crease lines between itself and the outer sealing section and the inner sealing section, and the hardness of the flexible section is less than that of the outer sealing section and the inner sealing section.

[0012] In one embodiment of this application, both the sealing ring and the connecting ring are made of flexible silicone rubber, and the surfaces of the sealing ring and the connecting ring are coated with a wear-resistant coating, which is made of polytetrafluoroethylene.

[0013] In one embodiment of this application, the unlocking panel is provided with a plurality of suction cups for selectively adhering to or separating from the door panel to adsorb or release the door panel.

[0014] In one embodiment of this application, the unlocking mechanism further includes a telescopic structure and a driving structure. The telescopic structure is disposed within the installation space and is used to drive the unlocking panel to telescopically move relative to the door frame structure. The driving structure is disposed between the door frame structure and the side plate and is used to drive the door frame structure to move relative to the side plate.

[0015] Secondly, embodiments of this application provide a semiconductor process apparatus, including a process chamber and a wafer cassette loading and unloading device as provided in the first aspect, the wafer cassette loading and unloading device being used to transfer wafers between the process chamber and the wafer cassette.

[0016] The beneficial technical effects of the technical solutions provided in this application are:

[0017] This embodiment of the application incorporates a sealing telescopic component between the door frame structure and the unlocking panel, creating a sealed installation space within both spaces. Because this installation space is completely isolated from the loading and temporary storage spaces, particles generated during the extension and retraction of the unlocking panel cannot enter these spaces, significantly improving the airtightness of the installation space within the unlocking mechanism. Furthermore, since the unlocking mechanism is entirely sealed, opening the wafer cassette door prevents particles from entering the temporary storage space, greatly improving the cleanliness of the wafer cassette during opening and closing. It also enhances the cleanliness of the loading space within the main unit chassis and prevents oxygen from entering the wafer cassette, thus avoiding particle and oxygen contamination of the wafers during transport and significantly improving product quality.

[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0019] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0020] Figure 1 This is a three-dimensional structural diagram of a tablet cassette loading and unloading device provided in an embodiment of this application;

[0021] Figure 2A A cross-sectional view of a cassette loading and unloading device in an extended state, as provided in an embodiment of this application;

[0022] Figure 2B A cross-sectional view of a cassette loading and unloading device in a retracted state, as provided in an embodiment of this application;

[0023] Figure 3A This is a front view schematic diagram of a sealing telescopic assembly provided in an embodiment of this application;

[0024] Figure 3B This is a cross-sectional view of a sealing telescopic assembly provided in an embodiment of this application;

[0025] Figure 4 A cross-sectional view of the cooperation between an unlocking mechanism and a sealing telescopic component is provided in an embodiment of this application;

[0026] Figure 5A A partial cross-sectional view of a cassette loading and unloading device in an extended state, as provided in an embodiment of this application;

[0027] Figure 5B A partial cross-sectional view of a cassette loading and unloading device in a transitional state, provided in an embodiment of this application;

[0028] Figure 5C This is a partial cross-sectional view of a tablet cassette loading and unloading device in a retracted state, provided as an embodiment of this application.

[0029] Figure 6A A top view schematic diagram of an unlocking mechanism that cooperates with a chip box and is in an extended state, provided in an embodiment of this application;

[0030] Figure 6B A top view of an unlocking mechanism that is engaged with a chip box and in a transitional state, as provided in an embodiment of this application;

[0031] Figure 6C This is a partial top view of an unlocking mechanism that is engaged with a disc holder and is in a retracted state, as provided in an embodiment of this application. Detailed Implementation

[0032] This application is described in detail below. Examples of embodiments of this application are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Furthermore, detailed descriptions of known technologies that are unnecessary for the features of this application are omitted. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0033] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0034] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments.

[0035] This application provides a wafer cassette loading and unloading device for semiconductor process equipment, used for transferring wafers between a wafer cassette and a process chamber. A schematic diagram of the wafer cassette loading and unloading device is shown below. Figures 1 to 2B As shown, it includes: a main unit housing 1, an unlocking mechanism 2, and a sealing telescopic assembly 3; the main unit housing 1 has a sealed loading space 11, and at least one side panel 10 of the main unit housing 1 has a transmission port 12 communicating with the loading space 11, the outer periphery of the transmission port 12 being used to seal against the opening of the disc cassette 200; the unlocking mechanism 2 includes a door frame structure 21 and an unlocking panel 22, the door frame structure 21 being disposed within the loading space 11, and the door frame structure 21 being movable relative to the side panel 10, for selectively sealing the transmission port 12 to seal the loading space 11; the unlocking panel 22 being disposed within the door frame structure 21, and being able to... The door panel 201 of the disc box 200 is moved by the telescopic movement through the transmission port 12 to attract and drive the door panel 201 of the disc box 200 to open the disc box 200; the door frame structure 21 is also used to drive the unlocking panel 22 and the door panel 201 to move so that the loading space 11 is connected to the temporary storage space 202 in the disc box 200; the sealing telescopic component 3 is disposed between the door frame structure 21 and the unlocking panel 22 to cooperate with the unlocking panel 22 to form a sealed installation space 23 in the door frame structure 21, and can telescopically move with the unlocking panel 22 so that the installation space 23 is completely sealed and isolated from the loading space 11 and the temporary storage space 202.

[0036] like Figures 1 to 2BAs shown, the main unit chassis 1 adopts a box-type structure, and the main unit chassis 1 has a loading space 11. The loading space 11 can be equipped with a robot arm for transferring wafers between the wafer cassette 200 and the process chamber. Two transfer ports 12 communicating with the loading space 11 can be opened on the front panel 10 of the main unit chassis 1. The opening of the wafer cassette 200 covers the outer periphery of the transfer port 12 and can fit and seal against the outer periphery of the transfer port 12. The projected area of ​​the transfer port 12 is larger than the projected area of ​​the door panel 201 of the wafer cassette 200 so that the door panel 201 can pass through the transfer port 12. Two unlocking mechanisms 2 are respectively set on two transmission ports 12, and the door frame structure 21 can adopt a shell structure. The door frame structure 21 can be set in the loading space 11 and slidably set on the side plate 10. When the door frame structure 21 moves to the transmission port 12, the opening of the door frame structure 21 is aligned with the transmission port 12 and can seal the transmission port 12 so that the loading space 11 is completely sealed. The unlocking panel 22 can be installed inside the door frame structure 21 and can extend and retract relative to the door frame structure 21 to pass through the transfer port 12 for adsorption and to move the door panel 201 to open the wafer cassette 200. Then the unlocking panel 22 can move the door panel 201 into the door frame structure 21. At this time, the door frame structure 21 can move the unlocking panel 22 and the door panel 201, thereby connecting the loading space 11 with the temporary storage space 202 in the wafer cassette 200, so that the robot in the loading space 11 can transfer wafers between the wafer cassette 200 and the process chamber. For example, the rear panel of the main unit chassis 1 can be connected to the process chamber. The sealing telescopic component 3 is specifically a sleeve structure and is disposed between the door frame structure 21 and the unlocking panel 22. It is used to cooperate with the unlocking panel 22 to form a sealed installation space 23 inside the door frame structure 21. During the telescopic movement of the unlocking panel 22, the sealing telescopic component 3 can telescopically move with the unlocking panel 22, so that the installation space 23 is completely sealed and isolated from the loading space 11 and the temporary storage space 202, thereby preventing particles generated by the unlocking mechanism 2 during the movement from entering the loading space 11 and the temporary storage space 202, and avoiding particle contamination of the wafer.

[0037] This embodiment of the application incorporates a sealing telescopic component between the door frame structure and the unlocking panel, creating a sealed installation space within both spaces. Because this installation space is completely isolated from the loading and temporary storage spaces, particles generated during the extension and retraction of the unlocking panel cannot enter these spaces, significantly improving the airtightness of the installation space within the unlocking mechanism. Furthermore, since the unlocking mechanism is entirely sealed, opening the wafer cassette door prevents particles from entering the temporary storage space, greatly improving the cleanliness of the wafer cassette during opening and closing. It also enhances the cleanliness of the loading space within the main unit chassis and prevents oxygen from entering the wafer cassette, thus avoiding particle and oxygen contamination of the wafers during transport and significantly improving product quality.

[0038] In one embodiment of this application, as Figures 1 to 2B As shown, the sealing telescopic assembly 3 includes a flexible sealing ring 31. The outer periphery of the sealing ring 31 is sealed to the door frame structure 21, and the inner periphery of the sealing ring 31 is sealed to the periphery of the unlocking panel 22. Specifically, the sealing ring 31 may be a ring-shaped structure made of silicone rubber, but this embodiment does not limit the specific material of the sealing ring 31, as long as it is made of a flexible material. The outer periphery of the sealing ring 31 is sealed to the inner periphery of the door frame structure 21, and the inner periphery of the sealing ring 31 is sealed to the periphery of the unlocking panel 22, so that the sealing ring 31 can seal the gap between the door frame structure 21 and the unlocking panel 22. When the unlocking panel 22 telescopically moves relative to the door frame structure 21, the sealing ring 31 can telescopically move with the unlocking panel 22, thereby forming a sealed installation space 23 between the unlocking panel 22 and the door frame structure 21, preventing the telescopic structure set in the installation space 23 from generating particles, thereby preventing particle contamination of the wafer. The above design simplifies the structure of the embodiments of this application, thereby significantly reducing application and maintenance costs.

[0039] It should be noted that the embodiments of this application do not limit the specific implementation of the sealing and telescopic component 3. For example, the sealing and telescopic component 3 can be made of a telescopic bellows structure. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0040] In one embodiment of this application, as Figures 1 to 4 As shown, the outer and inner peripheries of the sealing ring 31 are provided with integrally formed connecting rings 32. The connecting rings 32 are fitted to the periphery of the door frame structure 21 and the unlocking panel 22, and the hardness of the connecting rings 32 is greater than that of the sealing ring 31.

[0041] like Figures 1 to 4As shown, the sealing ring 31 can be configured as a rounded rectangular structure to match the shape of the door frame structure 21 and the unlocking panel 22. However, this embodiment is not limited to this; for example, the sealing ring 31 can be configured as a rectangular structure. A connecting ring 32 can be integrally formed on the outer periphery of the sealing ring 31, and a connecting ring 32 can also be integrally formed on the inner periphery of the sealing ring 31. Specifically, the connecting ring 32 is a rounded rectangular structure with a certain width to fit and seal against the periphery of the door frame structure 21 and the unlocking panel 22. Furthermore, the hardness of the connecting ring 32 can be greater than that of the sealing ring 31, thereby improving the sealing effect between the connecting ring 32 and the door frame structure 21 and the unlocking panel 22. In practical applications, the sealing ring 31 is located between the inner periphery of the door frame structure 21 and the periphery of the unlocking panel 22. The connecting ring 32 located on the outer periphery of the sealing ring 31 is attached to the surface of the door frame structure 21, for example, it is located on the inner periphery of the surface of the door frame structure 21 facing the side panel 10, but this embodiment is not limited thereto. The connecting ring 32 located on the inner periphery of the sealing ring 31 is attached to the periphery of the unlocking panel 22, for example, it is located on the periphery of the surface of the unlocking panel 22 facing the transmission port 12, but this embodiment is not limited thereto. This design not only simplifies the structure of this embodiment but also significantly improves the sealing effect of the sealing ring 31, preventing particle leakage and wafer contamination, thereby further improving product quality.

[0042] In one embodiment of this application, as Figures 3A to 4 As shown, the sealing telescopic assembly 3 also includes a clamping member 33 and a fastener 34. The clamping member 33 is stacked on the connecting ring 32, and the fastener 34 passes through the clamping member 33 and the connecting ring 32 in sequence and is connected to the door frame structure 21 or the unlocking panel 22.

[0043] like Figures 3A to 4 As shown, the clamping members 33 can be rod-shaped structures made of metal. Four clamping members 33 are fitted against the four straight edges of the connecting ring 32 to press the connecting ring 32 onto the door frame structure 21 and the unlocking panel 22. Multiple fasteners 34 pass through the clamping members 33 and are evenly distributed and spaced apart along the extension direction of the clamping members 33. After passing through the clamping members 33 and the connecting ring 32, the fasteners 34 are connected to the door frame structure 21 or the unlocking panel 22. Specifically, the fasteners 34 can be, for example, bolts. Threaded holes can be provided on the door frame structure 21 and the unlocking panel 22 to cooperate with the fasteners 34, thereby achieving the pressing of the connecting ring 32 onto the door frame structure 21 and the unlocking panel 22 by the clamping members 33. However, this application is not limited to this. By adopting the above design, since the clamping element 33 is stacked on the connecting ring 32, the sealing between the connecting ring 32 and the door frame structure 21 and the unlocking panel 22 can be further improved, thereby further improving the cleanliness of the embodiment of this application and further improving the product quality.

[0044] It should be noted that the embodiments of this application do not necessarily include the clamping member 33 and the fastener 34. For example, the connecting ring 32 can be sealed to the door frame structure 21 and the unlocking panel 22 by adhesive bonding. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0045] In one embodiment of this application, as Figures 1 to 4 As shown, a receiving groove 24 is provided on the periphery of the surface of the door frame structure 21 opposite to the side plate 10, and a receiving groove 24 is provided on the periphery of the surface of the unlocking panel 22 away from the loading space 11. The receiving groove 24 is used to receive the connecting ring 32 and the clamping member 33.

[0046] like Figures 1 to 4 As shown, an open receiving groove 24 is provided on the inner periphery of the surface of the door frame structure 21 facing the side plate 10. Specifically, there is an open receiving groove 24 between the surface of the door frame structure 21 and the inner wall. The cross-sectional shape of the receiving groove 24 can be a rectangular structure to accommodate the connecting ring 32, the clamping member 33 and the fastener 34, so that the fastener 34 is flush with or lower than the surface of the door frame structure 21, so as to prevent interference between the door frame structure 21 and the side plate 10 of the main unit box 1. Since the door frame structure 21 and the side plate 10 need to be sealed to achieve the sealing of the transmission port 12, the above design can also facilitate the setting of a sealing structure between the door frame structure 21 and the side plate 10, thereby making the structure of this embodiment simple and improving the sealing effect between the two, thereby further improving the sealing effect of the loading space 11 in the main unit box 1. The unlocking panel 22 has a receiving groove 24 at the periphery of the surface facing the transmission port 12. Specifically, there is an open receiving groove 24 between the surface of the unlocking panel 22 and the outer peripheral wall. The cross-sectional shape of the receiving groove 24 can be a rectangular structure to accommodate the connecting ring 32, the clamping member 33 and the fastener 34, so that the fastener 34 can be flush with the surface of the unlocking panel 22 or lower than the surface of the unlocking panel 22. When the unlocking panel 22 is engaged with the door panel 201 of the card box 200, mechanical interference between the fastener 34 and the door panel 201 is avoided. This not only makes the design of the embodiment of this application reasonable, but also reduces the failure rate and extends the service life.

[0047] In one embodiment of this application, as Figures 1 to 4 As shown, the sealing ring 31 is in a stacked state when the unlocking panel 22 is retracted, and the sealing ring 31 can form a folded space 35. The opening of the folded space 35 is located between the door frame structure 21 and the unlocking panel 22, and the opening of the folded space 35 faces the transmission port 12.

[0048] like Figures 1 to 4As shown, the length of the sealing ring 31 is much greater than the width between the door frame structure 21 and the unlocking panel 22. When the unlocking panel 22 retracts into the door frame structure 21, the sealing ring 31 can be stacked between the door frame structure 21 and the panel, ensuring that the sealing ring 31 always seals the door frame structure 21 and the unlocking panel 22 during its extension and retraction. Specifically, the sealing ring 31 has two layers in the stacked state, forming a folded space 35. The opening of this folded space 35 can be located between the door frame structure 21 and the unlocking panel 22, and this opening faces the direction of the transmission port 12, i.e., the sealing ring 31 extends into the installation space 23 after folding. This design not only significantly saves space occupied by the sealing ring 31 but also makes the travel of the unlocking panel 22 smoother, thereby greatly improving the service life and reducing the failure rate of the embodiments of this application. However, the embodiments of this application are not limited to this; for example, the sealing ring 31 can directly extend and retract with the unlocking panel 22, achieving the same function. Therefore, the embodiments in this application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0049] In one embodiment of this application, as Figures 1 to 4 As shown, the extension length of the sealing ring 31 can cover the telescopic movement stroke of the unlocking panel 22; the outer periphery to the inner periphery of the sealing ring 31 includes an integrally formed outer sealing section 311, a flexible section 312 and an inner sealing section 313 in sequence, and the flexible section 312 has crease lines between the outer sealing section 311 and the inner sealing section 313, and the hardness of the flexible section 312 is less than the hardness of the outer sealing section 311 and the inner sealing section 313.

[0050] like Figures 1 to 4As shown, since the sealing ring 31 is stacked in the retracted state of the unlocking panel 22, the extension length of the sealing ring 31 needs to be greater than or equal to the extension and retraction stroke of the unlocking panel 22 so that the unlocking panel 22 will not be resisted by the sealing ring 31 during the extension and retraction process, thereby making the unlocking panel 22 run more smoothly, thus improving the service life of the embodiment of this application and reducing the failure rate. Furthermore, the sealing ring 31 includes an integrally formed outer sealing section 311, a flexible section 312, and an inner sealing section 313 sequentially from its outer periphery to its inner periphery. The outer sealing section 311 is integrally formed with the connecting ring 32 and is connected to the door frame structure 21 through the connecting ring 32. The inner sealing section 313 is integrally formed with the connecting ring 32 and is connected to the unlocking panel 22 through the connecting ring 32. The flexible section 312 is located between the outer sealing section 311 and the inner sealing section 313, and a crease line is provided between them to distinguish the sections and make the sealing ring 31 easy to fold. This not only reduces the space occupied by the sealing ring 31, but also further reduces the resistance of the sealing ring 31 to the movement of the unlocking panel 22. As a result, the structure of this embodiment is not only simple, but also the service life and failure rate are further improved. Furthermore, the hardness of the flexible section 312 is less than that of the outer sealing section 311 and the inner sealing section 313. That is, the hardness of the outer sealing section 311 and the inner sealing section 313 is greater than that of the flexible section 312. This ensures that the outer sealing section 311 adheres to the inner wall of the door frame structure 21 after the door is opened, thus providing motion constraint for the sealing ring 31. For details, please refer to... Figure 5C As shown. The flexible section 312 provides a flexible seal during the opening and closing process, and the inner sealing section 313, during the closing process, closely adheres to the unlocking panel 22 to provide motion constraint for the sealing ring 31, as detailed in the figure below. Figures 5A to 5C As shown. Optionally, the width of the outer sealing section 311 is the same as the thickness of the inner wall of the door frame structure 21, and the width of the inner sealing section 313 is the same as the thickness of the unlocking panel 22, and the width of the flexible section 312 can cover the travel of the unlocking panel 22. With the above design, the sealing ring 31 is orderly folded in the opening or closing door panel 201 of the plate box 200, thereby ensuring the reliability of the movement of the unlocking panel 22, and also providing up to two layers of seal between the unlocking panel 22 and the door frame structure 21, thereby further improving the sealing effect; and also avoiding friction caused by multi-layer stacking during the movement of the unlocking panel 22, thereby further improving the service life of the sealing ring 31.

[0051] In one embodiment of this application, as Figures 3A to 4As shown, both the sealing ring 31 and the connecting ring 32 are made of flexible silicone rubber. The surfaces of the sealing ring 31 and the connecting ring 32 are also coated with a wear-resistant coating made of polytetrafluoroethylene (PTFE). Specifically, the use of flexible silicone rubber for both the sealing ring 31 and the connecting ring 32 not only improves the sealing effect and extends their service life, but also reduces the application and maintenance costs of this embodiment. Furthermore, the surfaces of the sealing ring 31 and the connecting ring 32 can also be coated with a wear-resistant coating, which can specifically be made of PTFE. This not only improves the wear resistance of the sealing ring 31 and the connecting ring 32, thereby further extending their service life, but also improves their high-temperature resistance. However, this embodiment does not limit the specific materials of the sealing ring 31 and the wear-resistant coating, as long as they meet the requirements of flexibility, wear resistance, and high-temperature resistance. Therefore, this embodiment is not limited thereto, and those skilled in the art can adjust the settings according to actual conditions.

[0052] In one embodiment of this application, as Figures 1 to 2B As shown, the unlocking panel 22 is provided with multiple suction cups 25 for selectively adhering to or separating from the door panel 201, thereby adsorbing or releasing the door panel 201. Specifically, the unlocking panel 22 may be provided with two suction cups 25, which may be arranged side by side on the surface of the unlocking panel 22 facing the transmission port 12 for adsorbing the door panel 201 of the sheet box 200. The suction cups 25 may be flexible suction cups or vacuum suction cups to improve the adsorption performance of the door panel 201, thereby improving the stability of adsorbing the door panel 201. However, the embodiments of this application do not limit the specific type and number of suction cups 25. For example, two or more suction cups 25 may be used, evenly distributed on the unlocking panel 22. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the settings according to the actual situation.

[0053] In one embodiment of this application, as Figures 1 to 2BAs shown, the unlocking mechanism 2 also includes a telescopic structure and a driving structure (neither shown in the figure). The telescopic structure is disposed within the installation space 23 and is used to drive the unlocking panel 22 to telescopically move relative to the door frame structure 21. The driving structure is disposed between the door frame structure 21 and the side plate 10 and is used to drive the door frame structure 21 to move relative to the side plate 10. Specifically, the telescopic structure can be a telescopic cylinder or a hydraulic cylinder and is specifically disposed within the installation space 23. For example, the telescopic structure is fixedly connected to the door frame structure 21 and connected to the unlocking panel 22, and is used to drive the unlocking panel 22 to telescopically move relative to the door frame structure 21. Using the above design, the embodiment of this application has a simple structure and is easy to use, and can also reduce application and maintenance costs. The drive structure, for example, employs a lead screw structure. This drive structure is located within the loading space 11, between the door frame structure 21 and the side plate 10. It is used to move the door frame structure 21 relative to the side plate 10, for example, moving it to the transmission port 12 to seal it, and moving it away from the transmission port 12 so that the transmission port 12 can connect the loading space 11 with the temporary storage space 202 within the disc cassette 200. This design makes the embodiments of this application simple and easy to use, and also reduces application and maintenance costs. However, the embodiments of this application do not limit the specific implementation of the telescopic structure and drive structure, as long as the above functions are achieved. Therefore, the embodiments of this application are not limited thereto, and those skilled in the art can adjust the settings according to actual conditions.

[0054] To further illustrate the working principle and beneficial effects of the embodiments of this application, the following is in conjunction with the appendix. Figures 1 to 4 The specific implementation of this application is described below. When wafer transfer is required, the opening of the wafer cassette 200 is aligned with the transfer port 12 on the side plate 10. The unlocking panel 22 is telescopically moved relative to the door frame structure 21 to move towards the position of the wafer cassette 200, and contacts the door panel 201 of the wafer cassette 200 via the suction cup 25 to adsorb the door panel 201. At this time, the outer sealing section 311 is disengaged from the door frame structure 21, and the inner sealing section 313 is tightly attached to the periphery of the unlocking panel 22. See below for details. Figure 5A As shown. During the opening of the door panel 201, the outer sealing section 311 gradually presses against the door frame structure 21 as the unlocking panel 22 moves, while the inner sealing section 313 remains pressed against the periphery of the unlocking panel 22. At this time, the movement of the sealing ring 31 is absorbed by the flexible section 312, as shown in the figure. Figure 5B As shown. When the door is fully opened, the outer sealing section 311 is tightly fitted against the door frame structure 21, while the inner sealing section 313 remains tightly fitted against the periphery of the unlocking panel 22, as specifically... Figure 5C As shown. Because the sealing ring 31 has reasonable motion constraints, it ensures that the normal movement of the unlocking panel 22 is not interfered with during the opening and closing of the door panel 201. (Refer to the reference...) Figures 6A to 6BAs shown, since the sealing ring 31 always moves with the unlocking panel 22, the particles in the mounting space 23 are always constrained within the mounting space 23, thereby preventing the particles from contaminating the wafers in the wafer cassette 200 and further improving the wafer process yield.

[0055] Based on the same inventive concept, this application provides a semiconductor process apparatus, including a process chamber and a wafer cassette loading and unloading device as provided in the above embodiments, the wafer cassette loading and unloading device being used to transfer wafers between the process chamber and the wafer cassette.

[0056] By applying the embodiments of this application, at least the following beneficial effects can be achieved:

[0057] This embodiment of the application incorporates a sealing telescopic component between the door frame structure and the unlocking panel, creating a sealed installation space within both spaces. Because this installation space is completely isolated from the loading and temporary storage spaces, particles generated during the extension and retraction of the unlocking panel cannot enter these spaces, significantly improving the airtightness of the installation space within the unlocking mechanism. Furthermore, since the unlocking mechanism is entirely sealed, opening the wafer cassette door prevents particles from entering the temporary storage space, greatly improving the cleanliness of the wafer cassette during opening and closing. It also enhances the cleanliness of the loading space within the main unit chassis and prevents oxygen from entering the wafer cassette, thus avoiding particle and oxygen contamination of the wafers during transport and significantly improving product quality.

[0058] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

[0059] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0060] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0061] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0062] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0063] The above description is only a partial embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A wafer cassette loading and unloading device for semiconductor process equipment, used for transferring wafers between a wafer cassette and a process chamber, characterized in that, include: Main unit chassis, unlocking mechanism, and sealing telescopic assembly; The main unit has a sealed loading space inside, and at least one side panel of the main unit has a transmission port communicating with the loading space. The outer periphery of the transmission port is used to seal and fit with the opening of the disc cartridge. The unlocking mechanism includes a door frame structure and an unlocking panel. The door frame structure is disposed within the loading space and is movable relative to the side panel to selectively seal the transmission port, thereby sealing the loading space. The unlocking panel is disposed within the door frame structure and can extend and retract through the transmission port to attract and move the door panel of the disc box, thereby opening the disc box. The door frame structure is also used to move the unlocking panel and the door panel to connect the loading space with the temporary storage space within the disc box. The sealing telescopic component is disposed between the door frame structure and the unlocking panel, and is used to cooperate with the unlocking panel to form a sealed installation space within the door frame structure. It can also move telescopically with the unlocking panel so that the installation space is always completely sealed and isolated from the loading space and the temporary storage space during the movement of the unlocking panel. The sealing telescopic assembly includes a flexible sealing ring, the outer periphery of which is sealed to the door frame structure, and the inner periphery of which is sealed to the periphery of the unlocking panel. The sealing ring is stacked in the retracted state of the unlocking panel, and the sealing ring can form a folding space. The opening of the folding space is located between the door frame structure and the unlocking panel, and the opening of the folding space faces the transmission port. The extension length of the sealing ring can cover the telescopic movement stroke of the unlocking panel; the outer periphery to the inner periphery of the sealing ring includes an integrally formed outer sealing section, a flexible section and an inner sealing section in sequence, and the flexible section has crease lines between itself and the outer sealing section and the inner sealing section, and the hardness of the flexible section is less than that of the outer sealing section and the inner sealing section.

2. The unloading device for tablet cassettes as described in claim 1, characterized in that, Both the outer and inner peripheries of the sealing ring are provided with integrally formed connecting rings. The connecting rings are fitted onto the periphery of the door frame structure and the unlocking panel, and the hardness of the connecting rings is greater than that of the sealing ring.

3. The unloading device for tablet cassettes as described in claim 2, characterized in that, The sealing telescopic assembly also includes a clamping element and a fastener. The clamping element is stacked on the connecting ring, and the fastener passes through the clamping element and the connecting ring in sequence and is connected to the door frame structure or the unlocking panel.

4. The unloading device for tablet / carton packaging as described in claim 3, characterized in that, A receiving groove is provided on the periphery of the surface of the door frame structure opposite to the side plate, and a receiving groove is provided on the periphery of the surface of the unlocking panel away from the loading space. The receiving groove is used to accommodate the connecting ring and the clamping member.

5. The unloading device for tablets / cartons as described in claim 2, characterized in that, Both the sealing ring and the connecting ring are made of flexible silicone rubber. The surfaces of the sealing ring and the connecting ring are also coated with a wear-resistant coating made of polytetrafluoroethylene.

6. The tablet / carton unloading device as described in any one of claims 1 to 5, characterized in that, The unlocking panel is equipped with multiple suction cups for selectively adhering to or separating from the door panel, in order to adsorb or release the door panel.

7. The tablet / carton unloading device as described in any one of claims 1 to 5, characterized in that, The unlocking mechanism further includes a telescopic structure and a driving structure. The telescopic structure is disposed within the installation space and is used to drive the unlocking panel to telescopically move relative to the door frame structure. The driving structure is disposed between the door frame structure and the side plate and is used to drive the door frame structure to move relative to the side plate.

8. A semiconductor process apparatus, characterized in that, It includes a process chamber and a wafer cassette unloading device as described in any one of claims 1 to 7, the wafer cassette unloading device being used to transfer wafers between the process chamber and the wafer cassette.

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