A cleaning apparatus

Abstract

The application provides a cleaning device, which comprises a support structure and a cleaning cavity arranged on the support structure and used for containing a cleaning agent. The bottom of the cleaning cavity is provided with a support table, and the support table is provided with a first limiting structure used for limiting a wafer cassette of a first size and a second limiting structure used for limiting a wafer cassette of a second size. The first size is larger than the second size, and the first limiting structure surrounds the second limiting structure. By arranging two limiting structures on the support table and arranging the first limiting structure to surround the second limiting structure, the cleaning cavity with one work station can place the wafer cassette of the first size and the wafer cassette of the second size, so that the cleaning device can be compatible with wafer cassettes of different sizes, the wafer in the wafer cassette of different sizes can be cleaned, the compatibility of the cleaning device for cleaning the wafer cassette of different sizes is improved, and two sets of cleaning devices for the wafer cassette of different sizes are not needed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a cleaning device. BACKGROUND

[0002] In the process of manufacturing semiconductors and LEDs (Light Emitting Diode), one cleaning process is to clean wafers by using various liquids such as chemical liquid and cleaning water. The device used is a cleaning device. In the process of manufacturing semiconductors, 6-inch wafers or 8-inch wafers are sometimes used to manufacture chips. In the process of manufacturing LEDs, 6-inch wafers are also used. In the process of small-scale production manufacturing, the current cleaning device can only clean 6-inch wafers and cannot clean 8-inch wafers. Or the cleaning device can only clean 8-inch wafers and cannot clean 6-inch wafers. This makes the compatibility of the cleaning device poor. SUMMARY

[0003] The present application provides a semiconductor cleaning device, which can clean wafers of different sizes.

[0004] In a first aspect, the present application provides a cleaning device, which comprises a support structure and a cleaning cavity arranged on the support structure and used for containing a cleaning agent. A support table is arranged at the bottom of the cleaning cavity, wherein the support table has a first limiting structure used for limiting a first-size wafer cassette and a second limiting structure used for limiting a second-size wafer cassette; the first size is larger than the second size, and the first limiting structure surrounds the second limiting structure.

[0005] In the above scheme, by arranging two limiting structures on the support table and surrounding the second limiting structure with the first limiting structure, the cleaning cavity with one work station can place both the first-size wafer cassette and the second-size wafer cassette, so that the cleaning device can be compatible with wafer cassettes of different sizes to clean wafers in wafer cassettes of different sizes, thereby improving the compatibility of the cleaning device for cleaning wafer cassettes of different sizes, and thus there is no need to arrange two sets of cleaning devices for wafer cassettes of different sizes.

[0006] In one embodiment, the first limiting structure includes four first L-shaped protrusions disposed on the support table, the four first protrusions are spaced apart and oppositely opened to clamp the end portions of the two support bars of the bottom of the first size wafer cassette. The second limiting structure includes four second L-shaped protrusions disposed on the support table, the four second protrusions are spaced apart and oppositely opened to clamp the end portions of the two support bars of the bottom of the second size wafer cassette. The four first protrusions are surrounded by the four second protrusions. In this way, two sets of non-interfering positioning structures are provided in the cleaning chamber with one station, so that the cleaning chamber can clean wafers in wafer cassettes of two different sizes.

[0007] In one embodiment, the cleaning apparatus further includes a transfer table located at one side of the cleaning chamber and shared by loading and unloading, the transfer table includes a loading table disposed on the support structure and having a plurality of support units, wherein each support unit is used to support a first size wafer cassette or a second size wafer cassette. By using a transfer table shared by loading and unloading, the utilization efficiency of the station is improved, and the space occupied by the cleaning apparatus is saved.

[0008] In one embodiment, the loading table includes two support plates disposed on the support structure and spaced apart, and the distance between the two support plates is less than the distance between the two support bars of the bottom of the second size wafer cassette. Each support unit includes four first L-shaped protrusions disposed on the two support plates and four second L-shaped protrusions disposed on the two support plates. The four first protrusions are spaced apart and oppositely opened to clamp the end portions of the two support bars of the bottom of the first size wafer cassette. The four second protrusions are spaced apart and oppositely opened to clamp the end portions of the two support bars of the bottom of the second size wafer cassette. The four first protrusions are surrounded by the four second protrusions. In this way, each support unit can be used for supporting and transferring wafer cassettes of different sizes.

[0009] In one embodiment, the cleaning apparatus further includes a first transfer unit disposed between the two support plates and used to transfer the wafer cassette from one support unit to another support unit, so as to transfer the wafer cassette between different support units.

[0010] In one specific embodiment, the first transfer unit comprises a supporting plate for supporting the bottom of the first size wafer cassette or the bottom of the second size wafer cassette, and a push rod fixedly connected with the lower surface of the supporting plate and arranged on the supporting structure. The supporting plate is located at the gap between the two supporting plates. The push rod can drive the supporting plate to slide up and down in the vertical direction, and can also drive the supporting plate to move from one supporting unit to another supporting unit in the horizontal direction. In this way, the structure of the first transfer unit is simplified, and the first transfer unit can transfer both the first size wafer cassette and the second size wafer cassette without using two sets of transfer devices.

[0011] In one specific embodiment, the cleaning device further comprises a second transfer unit arranged on the supporting structure and used for moving the wafer cassette between the transfer table and the cleaning cavity, and the second transfer unit can transfer both the first size wafer cassette and the second size wafer cassette. In this way, the second transfer unit is used for transferring wafer cassettes of different sizes, so that two sets of transfer devices are not needed.

[0012] In one specific embodiment, the second transfer unit comprises a plurality of L-shaped pull rods and two supporting arms arranged at intervals. The horizontal part of the L-shaped pull rod is used for hooking at the lower surface of the upper edge of the wafer cassette, and the end of the vertical part of the L-shaped pull rod is connected with one of the two supporting arms, and each supporting arm is connected with at least two L-shaped pull rods. The second transfer unit further comprises a driving mechanism connected with the two supporting arms, which drives the two supporting arms to expand or contract in distance to clamp the first size wafer cassette or the second size wafer cassette. By arranging two supporting arms with expandable or retractable distance and at least two L-shaped pull rods on each supporting arm, wafer cassettes of different sizes can be clamped and transferred.

[0013] In one specific embodiment, the driving mechanism comprises a guide rail and a driving cylinder. The extension direction of the guide rail is perpendicular to the extension direction of the two supporting arms, and the two supporting arms are slidingly assembled on the guide rail. The driving cylinder is used for driving the two supporting arms to slide on the guide rail in the direction of approaching each other or separating from each other. By driving the two supporting arms to approach each other to reduce the distance or separate from each other to expand the distance through the driving cylinder, wafer cassettes of different sizes can be clamped.

[0014] In one specific embodiment, the horizontal part of the L-shaped pull rod connected with the same support arm is connected with a hook plate for being hooked at the lower surface of the upper edge of the wafer cassette, and a plurality of clamping units are arranged on the two hook plates, each clamping unit is used for clamping a wafer cassette of a first size or a wafer cassette of a second size. Wherein, each clamping unit comprises a limiting block arranged on the two hook plates to limit the wafer cassette of the first size or the wafer cassette of the second size. By arranging the hook plate and arranging a plurality of clamping units on the hook plate, a plurality of wafer cassettes of the same size can be clamped at one time. By arranging the limiting block on the hook plate, the wafer cassette is prevented from sliding on the hook plate. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A side view of a cleaning equipment according to an embodiment of the present application is shown in FIG. 1.

[0016] Figure 2 A top view of a cleaning equipment according to an embodiment of the present application is shown in FIG. 2.

[0017] Figure 3 A structure diagram of a wafer cassette in the prior art is shown in FIG. 3.

[0018] Figure 4 A top view of a transfer table according to an embodiment of the present application is shown in FIG. 4.

[0019] Figure 5 A top view of a support unit and a first transfer unit according to an embodiment of the present application is shown in FIG. 5.

[0020] Figure 6 A side view of a support unit and a first transfer unit according to an embodiment of the present application is shown in FIG. 6.

[0021] Figure 7 A side view of a second transfer unit according to an embodiment of the present application is shown in FIG. 7.

[0022] Figure 8 A top view of a second transfer unit according to an embodiment of the present application is shown in FIG. 8.

[0023] REFERENCE NUMERALS:

[0024] 10 - cleaning cavity 11 - support table 21 - first protrusion 22 - second protrusion

[0025] 30 - transfer table 31 - support unit 32 - support plate 41 - supporting plate

[0026] 42 - push rod 51 - L-shaped pull rod 52 - support arm 53 - driving mechanism

[0027] 54 - guide rail 55 - hook plate 56 - limiting block 60 - wafer cassette

[0028] 601-Frame body; 602-Supporting strip; 603-Top edge; 604-Bottom wall

[0029] 61 - First-size wafer cassette 62 - Second-size wafer cassette 70 - Wafer Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] To facilitate understanding of the cleaning equipment provided in the embodiments of the present invention, the application scenario of the cleaning equipment provided in the embodiments of the present invention will be described first. This cleaning equipment is used in the process of cleaning wafers. The cleaning equipment will now be described in detail with reference to the accompanying drawings.

[0032] refer to Figure 1 and Figure 2 The cleaning equipment provided in this embodiment of the invention includes a support structure (not shown in the figure) and a cleaning chamber 10 disposed on the support structure for holding cleaning agent. The support structure can be a frame or platform with a supporting function. The cleaning chamber 10 can use a hollow shell as its wall or a box as its wall. The cleaning chamber 10 is used to hold cleaning agents such as chemical solutions or cleaning water. During cleaning, the wafer cassette containing wafers 70 is immersed entirely in the cleaning agent in the cleaning chamber 10 to clean the wafers 70 in the cassette.

[0033] like Figure 1 and Figure 2 As shown, a support platform 11 is provided at the bottom of the cleaning chamber 10, which is used to support the wafer cassette placed in the cleaning chamber 10. When setting the support platform 11, a base plate can be provided at the bottom of the cleaning chamber 10 as the support platform 11. When the wafer cassette is placed on the support platform 11, two spaced support bars 602 at the bottom of the wafer cassette press against the support platform 11.

[0034] It should be explained that this wafer cassette is a conventional wafer cassette used in the prior art for holding wafers 70, such as... Figure 3The wafer cassette 60 shown typically includes a frame 601 for receiving a wafer 70. A wafer 70 inlet is located at the top of the frame 601 for placing the wafer 70 inside. Multiple opposing grooves are located on opposite sidewalls of the frame 601 for securing the wafer 70 within them. An opening is located at the bottom of the frame 601 for ejecting the wafer 70 from below. Two spaced-apart support bars 602 are located on either side of the bottom of the frame 601, serving as a support structure for the entire frame 601. When the wafer cassette 60 is placed on a support platform 11, the two support bars 602 at the bottom of the wafer cassette 60 press against the support platform 11. At the upper edges of the two side walls of the frame 601, each side wall has an outwardly flared edge, which is used to hook the wafer cassette 60 onto the lower surface of the upper edge 603 of the wafer cassette 60 by means of grippers, hook plates 55, etc., to facilitate the transfer of the wafer cassette 60. At the bottom of the frame 601, there are two bottom walls 604 connecting the two support bars 602. The two bottom walls 604 of the wafer cassette 60 can be supported by structures such as trays 41 to lift or transfer the wafer cassette 60 as a whole.

[0035] Continue to refer to Figure 1 and Figure 2 The support platform 11 has a first limiting structure for limiting a wafer cassette 61 of a first size and a second limiting structure for limiting a wafer cassette 62 of a second size; the first size is larger than the second size, and the first limiting structure surrounds the second limiting structure. By providing two limiting structures on the support platform 11, with the first limiting structure surrounding the second limiting structure, the cleaning chamber 10 with one station can accommodate both the first-size wafer cassette 61 and the second-size wafer cassette 62. This allows the cleaning equipment to be compatible with wafer cassettes of different sizes, enabling the cleaning of wafers 70 in wafer cassettes of different sizes. This improves the compatibility of the cleaning equipment with wafer cassettes of different sizes, eliminating the need for two separate cleaning systems for wafer cassettes of different sizes.

[0036] When setting two limit structures, refer to Figure 1 and Figure 2The first limiting structure may include four first protrusions 21 disposed on the support platform 11. The four first protrusions 21 are spaced apart and have openings facing each other to lock the ends of the two support bars 602 at the bottom of the first-size wafer cassette 61. When the first-size wafer cassette 61 is placed on the support platform 11 in the cleaning chamber 10, the ends of the two support bars 602 at the bottom of the first-size wafer cassette 61 respectively abut against the L-shaped openings of the four first protrusions 21 to lock the first-size wafer cassette 61 within them. The second limiting structure includes four L-shaped second protrusions 22 disposed on the support platform 11. The four second protrusions 22 are spaced apart and have openings facing each other to lock the ends of the two support bars 602 at the bottom of the second-size wafer cassette 62. When the second-sized wafer cassette 62 is placed on the support platform 11 inside the cleaning chamber 10, the ends of the two support bars 602 at the bottom of the second-sized wafer cassette 62 respectively abut against the L-shaped openings of the four second protrusions 22 to lock the second-sized wafer cassette 62 inside.

[0037] refer to Figure 2 Four first protrusions 21 surround four second protrusions 22, meaning the four first protrusions 21 are positioned around the four second protrusions 22. Since the wafer cassette has two support bars 602 at its bottom, when a first-sized wafer cassette 61 is placed on the support platform 11 within the cleaning chamber 10, there are gaps between the four second protrusions 22 and the bottom of the wafer cassette and the wafers 70 inside, ensuring that the four second protrusions 22 do not interfere with the placement of the first-sized wafer cassette 61 at the same workstation. When a second-sized wafer cassette 62 is placed on the support platform 11 within the cleaning chamber 10, the four first protrusions 21 are located around the four second protrusions 22, so the four first protrusions 21 do not affect the placement of the second-sized wafer cassette 62. This arrangement allows for two sets of non-interfering positioning structures within a single cleaning chamber 10, enabling the cleaning chamber 10 to clean wafers 70 from wafer cassettes of two different sizes. Therefore, it is unnecessary to set up two workstations in the cleaning chamber 10 to place different wafer cassettes.

[0038] refer to Figure 4 , Figure 5 and Figure 6Furthermore, a transfer platform 30 for both loading and unloading can be provided on the support structure. This transfer platform 30 is located on one side of the cleaning chamber 10, meaning it is used not only for loading but also for unloading. Loading here refers to the process of replacing the wafer 70 from a standard wafer cassette to a dedicated wafer cassette before cleaning; unloading here refers to the process of replacing the wafer 70 from the dedicated wafer cassette back to a standard wafer cassette after cleaning. It should be explained that during the chemical cleaning process, high-concentration, high-temperature chemicals are required to chemically clean the wafer 70 in the wafer cassette. Since the material of a standard wafer cassette is not suitable for immersion in high-concentration, high-temperature chemicals, the wafer 70 needs to be removed from the standard wafer cassette and placed into a dedicated wafer cassette before this step. After this step, the wafer 70 needs to be replaced from the dedicated wafer cassette back to a standard wafer cassette. Therefore, a loading and unloading section needs to be provided on one side of the cleaning chamber 10. In the prior art, the loading and unloading sections are separately located, occupying a large area. This application sets up a transfer platform 30 for both loading and unloading, so that one workstation can serve multiple purposes, thereby improving the utilization efficiency of the workstation and saving the space occupied by the cleaning equipment.

[0039] refer to Figure 4 The transfer stage 30 includes a platform mounted on a support structure and having multiple support units 31, wherein each support unit 31 is used to support a wafer cassette 61 of a first size or a wafer cassette 62 of a second size. By enabling each support unit 31 on the platform to support both the first-size wafer cassette 61 and the second-size wafer cassette 62, each support unit 31 can be used for wafer cassettes of different sizes, improving the compatibility of the support unit 31. There is no need to set up two separate sets of different support units 31.

[0040] When setting up the platform, refer to Figure 4 , Figure 5 and Figure 6 The stage may include two support plates 32 disposed on the support structure and spaced apart, with the distance between the two support plates 32 being smaller than the distance between the two support bars 602 at the bottom of the second-sized wafer cassette 62, to prevent the second-sized wafer cassette 62 from leaking out of the gap between the two support bars 602 when placed on the support plates 32. The two support plates 32 have multiple support positions, each support position serving as a support unit 31 for placing one wafer cassette.

[0041] Continue to refer to Figure 4 , Figure 5 and Figure 6Each support unit 31 may include four L-shaped first protrusions 21 disposed on two support plates 32, and four L-shaped second protrusions 22 disposed on the two support plates 32. The four first protrusions 21 are spaced apart and have openings facing each other to lock the ends of the two support bars 602 at the bottom of the first-sized wafer cassette 61. That is, when the first-sized wafer cassette 61 is placed on one of the support units 31, the ends of the two support bars 602 at the bottom of the first-sized wafer cassette 61 respectively abut against the L-shaped openings of the four first protrusions 21 to lock the first-sized wafer cassette 61 in place and prevent the first-sized wafer cassette 61 from sliding. The four second protrusions 22 are spaced apart and have openings facing each other to lock the ends of the two support bars 602 at the bottom of the second-sized wafer cassette 62. When the second-sized wafer cassette 62 is placed on the support plate 32 inside the cleaning chamber 10, the ends of the two support bars 602 at the bottom of the second-sized wafer cassette 62 respectively abut against the L-shaped openings of the four second protrusions 22 to lock the second-sized wafer cassette 62 inside and prevent the second-sized wafer cassette 62 from sliding.

[0042] like Figure 4 and Figure 5 As shown, four first protrusions 21 surround four second protrusions 22. That is, the four first protrusions 21 are positioned around the four second protrusions 22. Because the wafer cassette has two support bars 602 at its bottom, when a first-sized wafer cassette 61 is placed on the two support plates 32 of the transfer table 30, there are gaps between the four second protrusions 22 and the bottom of the wafer cassette and the wafers 70 inside the wafer cassette, ensuring that the four second protrusions 22 do not interfere with the placement of the first-sized wafer cassette 61 at the same workstation. When a second-sized wafer cassette 62 is placed on the two support plates 32 of the transfer table 30, the four first protrusions 21 are located around the four second protrusions 22, so the four first protrusions 21 do not affect the placement of the second-sized wafer cassette 62. This configuration allows for two independent positioning structures within a single support unit 31, enabling the support unit 31 to support wafers 70 in two different sized wafer cassettes. This ensures that each support unit 31 can be used for both supporting and transporting wafer cassettes of different sizes. Consequently, it eliminates the need to separately configure support units 31 on the transfer stage 30, each designed for only one type of wafer cassette.

[0043] refer to Figure 4 , Figure 5 and Figure 6 A first transfer unit can also be provided between the two support plates 32 for transferring the wafer cassette from one support unit 31 to another, so as to facilitate the transfer of the wafer cassette between different support units 31. When specifically configuring the first transfer unit, refer to... Figure 6The first transfer unit may include a support plate 41 for supporting the bottom of a first-size wafer cassette 61 or a second-size wafer cassette 62, and a push rod 42 fixedly connected to the lower surface of the support plate 41 and mounted on a support structure. The support plate 41 is located in the gap between two support plates 32. The push rod 42 can slide the support plate 41 vertically up and down, and can also move the support plate 41 horizontally from one support unit 31 to another. This simplifies the structure of the first transfer unit, enabling it to transfer both the first-size wafer cassette 61 and the second-size wafer cassette 62 without requiring two separate transfer devices. The support plate 41 can press against the two bottom walls 604 of the first-size wafer cassette 61 or the second-size wafer cassette 62. (Reference) Figure 5 and Figure 6 The length of the tray 41 can be greater than the width of the bottom of the first-sized wafer cassette 61, so that the tray 41 can be used to lift both the first-sized wafer cassette 61 and the second-sized wafer cassette 62. In implementing the vertical and horizontal movement of the push rod 42, a three-dimensional motion platform capable of both vertical and horizontal movement can be provided on the support structure, and the push rod 42 can be fixed to this three-dimensional motion platform.

[0044] refer to Figure 4 Two sets of spaced-apart support plates 32 and two sets of first transfer units can be installed on the transfer table 30. The two sets of spaced-apart support plates 32 can be arranged side by side, so that adjacent support plates 32 in the two sets of support plates 32 share a single support plate 32. A rectangular groove can be provided on the shared support plate 32 of the two sets of support plates 32 to avoid the movement of the push rod 42, so that the first transfer unit can transfer the wafer cassette from one set of support plates 32 to the other set of support plates 32.

[0045] refer to Figure 7 and Figure 8 A second transfer unit can also be provided on the support structure for moving the wafer cassette between the transfer stage 30 and the cleaning chamber 10, so as to transfer the wafer cassette from the transfer stage 30 to the cleaning chamber 10, or from the cleaning chamber 10 to the transfer stage 30. When providing the second transfer unit, it can be configured to transfer both first-size wafer cassettes 61 and second-size wafer cassettes 62. This allows the second transfer unit to be used for transferring wafer cassettes of different sizes, thus eliminating the need for two sets of transfer devices.

[0046] When specifically setting up the second transfer unit, refer to... Figure 7 and Figure 8The second transfer unit may include multiple L-shaped pull rods 51 and two spaced-apart support arms 52. The horizontal portion of the L-shaped pull rod 51 is used to hook onto the lower surface of the upper edge 603 of the wafer cassette. The end of the vertical portion of the L-shaped pull rod 51 is connected to one of the two support arms 52, and each support arm 52 is connected to at least two L-shaped pull rods 51, so that the lower surfaces of the two opposite upper edges 603 of the wafer cassette are hooked by L-shaped pull rods 51, allowing the wafer cassette to be pulled upwards when the two support arms 52 are lifted. (Reference) Figure 7 and Figure 8 A drive mechanism 53 connected to the two support arms 52 can also be provided. This drive mechanism 53 can drive the distance between the two support arms 52 to expand or shrink, so as to clamp a first-size wafer cassette 61 or a second-size wafer cassette 62. When it is necessary to clamp the larger first-size wafer cassette 61, the drive mechanism 53 drives the two support arms 52 to separate, thereby expanding the distance between the two support arms 52 and the distance between the L-shaped pull rods 51 connected to the two support arms 52, so that the L-shaped pull rods 51 can hook onto the lower surface of the upper edge 603 of the first-size wafer cassette 61. When it is necessary to clamp the smaller second-size wafer cassette 62, the drive mechanism 53 drives the two support arms 52 to move closer together, thereby reducing the distance between the two support arms 52 and the distance between the L-shaped pull rods 51 connected to the two support arms 52, so that the L-shaped pull rods 51 can hook onto the lower surface of the upper edge 603 of the second-size wafer cassette 62. By setting two support arms 52 with an expandable or retractable spacing, and setting at least two L-shaped pull rods on each support arm 52, it is possible to clamp wafer cassettes of different sizes and transfer wafer cassettes of different sizes.

[0047] When specifically configuring the drive mechanism 53, refer to... Figure 7 and Figure 8 The drive mechanism 53 may include a guide rail 54 and a drive cylinder. The extension direction of the guide rail 54 is perpendicular to the extension direction of the two support arms 52. Both support arms 52 are slidably mounted on the guide rail 54, allowing them to slide in a direction perpendicular to their extension direction to adjust the distance between them. The drive cylinder drives the two support arms 52 to slide on the guide rail 54 in a direction that moves them closer together or further apart. By driving the two support arms 52 to move closer together to reduce the distance or to separate them to increase the distance, the clamping of wafer cassettes of different sizes can be achieved.

[0048] like Figure 8As shown, hook plates 55 for hooking onto the lower surface of the upper edge 603 of a wafer cassette can be connected to the horizontal portion of an L-shaped pull rod 51 connected to the same support arm 52. Multiple clamping units can be provided on the two hook plates 55, each clamping unit for clamping a wafer cassette 61 of a first size or a wafer cassette 62 of a second size. By providing two hook plates 55 connected to the L-shaped pull rod 51, the contact area between the hook plates 55 and the lower surface of the upper edge 603 of the wafer cassette is increased, preventing the upper edge 603 of the wafer cassette from being pulled and broken. The length of the hook plates 55 can also be extended to allow simultaneous clamping of multiple wafer cassettes of the same size. (Reference) Figure 8 Multiple limiting blocks 56 can be set on the two hook plates 55. Each clamping unit includes eight limiting blocks 56, of which four limiting blocks 56 are used to limit the wafer cassette 61 of the first size, and the other four limiting blocks 56 are used to limit the wafer cassette 62 of the second size, preventing the wafer cassette clamped on the hook plate 55 from sliding. By setting two sets of limiting blocks 56, each clamping unit can limit either the wafer cassette 61 of the first size or the wafer cassette 62 of the second size.

[0049] The second transfer unit may also include a robotic arm connected to both support arms 52, which is capable of moving the held wafer cassette from the transfer stage 30 to the cleaning chamber 10, or from the cleaning chamber 10 to the transfer stage 30. It should be understood that the mechanism for moving the held wafer 70 is not limited to a robotic arm, but may also employ a motion platform capable of multi-dimensional operation, consisting of slide rails, linear motors, etc.

[0050] By setting two limiting structures on the support platform 11, with the first limiting structure surrounding the second limiting structure, the cleaning chamber 10 with one station can accommodate both a first-size wafer cassette 61 and a second-size wafer cassette 62. This allows the cleaning equipment to be compatible with wafer cassettes of different sizes, enabling the cleaning of wafers 70 in wafer cassettes of different sizes. This improves the compatibility of the cleaning equipment with wafer cassettes of different sizes, eliminating the need for two separate cleaning systems for wafer cassettes of different sizes.

[0051] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A cleaning device, characterized in that, include: Support structure; A cleaning chamber disposed on the support structure and used to hold the cleaning agent; A support platform is installed at the bottom of the cleaning chamber; The support platform has a first limiting structure for limiting a wafer cassette of a first size and a second limiting structure for limiting a wafer cassette of a second size; the first size is larger than the second size, and the first limiting structure surrounds the second limiting structure. The cleaning equipment also includes a transfer platform located on one side of the cleaning chamber and shared for loading and unloading; the transfer platform includes a platform disposed on the support structure and having multiple support units, wherein each support unit is used to support a wafer cassette of the first size or a wafer cassette of the second size. The stage includes two support plates disposed on the support structure and spaced apart; and the distance between the two support plates is less than the distance between the two support strips at the bottom of the wafer cassette of the second size; Each support unit includes: four L-shaped first protrusions disposed on the two support plates, the four first protrusions being spaced apart and having openings facing each other to secure the ends of the two support bars at the bottom of the first-sized wafer cassette; four L-shaped second protrusions disposed on the two support plates, the four second protrusions being spaced apart and having openings facing each other to secure the ends of the two support bars at the bottom of the second-sized wafer cassette; and the four first protrusions surrounding the four second protrusions. The cleaning equipment further includes a first transfer unit disposed between the two support plates and used to transfer the wafer cassette from one support unit to another support unit; the first transfer unit includes: A support plate for holding the bottom of the first-sized wafer cassette or the second-sized wafer cassette, wherein the support plate is located in the gap between the two support plates; A push rod is provided on the support structure and fixedly connected to the lower surface of the tray. The push rod can drive the tray to slide up and down in the vertical direction and can also drive the tray to move from one support unit to another in the horizontal direction.

2. The cleaning equipment as described in claim 1, characterized in that, The first limiting structure includes four L-shaped first protrusions disposed on the support platform. The four first protrusions are spaced apart and have openings facing each other to lock the ends of the two support bars at the bottom of the wafer cassette of the first size. The second limiting structure includes four L-shaped second protrusions disposed on the support platform. The four second protrusions are spaced apart and have openings facing each other to lock the ends of the two support bars at the bottom of the wafer cassette of the second size; and the four first protrusions surround the four second protrusions.

3. The cleaning equipment as described in claim 1, characterized in that, It also includes a second transfer unit disposed on the support structure and used to move the wafer cassette between the transfer stage and the cleaning chamber, and the second transfer unit is capable of transferring both the first-size wafer cassette and the second-size wafer cassette.

4. The cleaning equipment as described in claim 3, characterized in that, The second transfer unit includes: Multiple L-shaped pull rods, the horizontal portion of which is used to hook onto the lower surface of the upper edge of the wafer cassette; Two support arms are spaced apart, and the end of the vertical portion of the L-shaped tie rod is connected to one of the two support arms, and at least two of the L-shaped tie rods are connected to each support arm; A drive mechanism connected to the two support arms, the drive mechanism drives the distance between the two support arms to expand or shrink, so as to clamp the wafer cassette of the first size or the wafer cassette of the second size.

5. The cleaning equipment as described in claim 4, characterized in that, The drive mechanism includes: A guide rail extending in a direction perpendicular to the extension direction of the two support arms, wherein the two support arms are slidably mounted on the guide rail; A drive cylinder that drives the two support arms to slide on the guide rail in a direction of mutual approach or separation.

6. The cleaning equipment as described in claim 4, characterized in that, The horizontal portion of the L-shaped pull rod connected to the same support arm is connected to a hook plate for hooking onto the lower surface of the upper edge of the wafer cassette; The two hook plates are provided with a plurality of clamping units, each clamping unit being used to clamp a wafer cassette of the first size or a wafer cassette of the second size; wherein, each clamping unit includes a limiting block disposed on the two hook plates to limit the wafer cassette of the first size or the wafer cassette of the second size.

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