Camera module and preparation method thereof

Abstract

The present application provides a camera module and a preparation method thereof, wherein the camera module includes a photosensitive component, a lens component and a focusing lens. The lens component is arranged on the photosensitive path of the photosensitive component and includes a first lens and a second lens arranged at an interval. The focusing lens is arranged between the first lens and the second lens and includes at least one deformable film layer. By arranging a deformable focusing lens between the lenses of the camera module, the focusing function of the camera module is realized and the ultra-thinness of the camera module is realized.

Description

Technical Field

[0001] The present application relates to the field of optical imaging technology, and more specifically, to an ultra-thin anti-shake camera module and a preparation method thereof. Background Art

[0002] With the popularization and development of mobile terminals with camera functions, the requirements for camera modules used in mobile terminals are becoming higher and higher.

[0003] Taking mobile phones as an example, the thickness of thin and light mobile phones can basically be achieved within 9mm, or even within 8mm. Therefore, the camera modules used on them are required to have ultra-wide characteristics. At the same time, manufacturers and users also hope that the camera module's performance such as pixels, telephoto shooting, large aperture, and anti-shake can reach a higher level. However, the improvement of the functions of the above-mentioned camera modules will lead to the increase of the size of the camera modules, especially the increase of the height of the camera modules.

[0004] The camera modules used in existing mobile terminals generally protrude from the outer cover of the mobile terminal (the camera module is arranged inside the mobile terminal corresponding to the outer cover and exposed from the outer cover), thus forming a boss on the outer cover, making the outer cover not flat. This affects both the appearance of the mobile terminal and the user's operation. For example, when the user places a mobile terminal such as a mobile phone flat on a desktop, the posture of the mobile terminal is tilted and unstable. More importantly, the camera module protrudes from the outer cover of the mobile terminal, which makes the camera module or the protective cover on the outside of the camera module have a great risk of scratches. Bumps or falls can easily cause scratches or cracks on the camera module, thereby affecting the imaging effect of the camera module.

[0005] In summary, there is an urgent need for a camera module and a preparation method that can solve the above problems, so as to optimize the performance of the camera module in terms of ultra-thinness, image quality and anti-shake. Summary of the invention

[0006] The present application provides a camera module and a method for preparing the same that can at least solve or partially solve at least one of the above-mentioned shortcomings in the prior art.

[0007] On the one hand, the present application provides a camera module, including: a photosensitive component; a lens component, arranged on the photosensitive path of the photosensitive component, the lens component including a first lens and a second lens arranged at an interval; and a focusing lens, arranged between the first lens and the second lens, the focusing lens including at least one deformable film layer.

[0008] According to an embodiment of the present application, the focusing lens includes a substrate, a polymer layer, and a deformable film layer which are arranged in sequence.

[0009] According to an embodiment of the present application, the focusing lens includes a first deformable film layer, a polymer layer and a second deformable film layer which are arranged in sequence.

[0010] According to an embodiment of the present application, the camera module is applied to a mobile terminal, an outer cover of the mobile terminal is provided with an opening, and the camera module is arranged in the opening of the outer cover, wherein the first lens includes a first lens arranged at the light incident end of the camera module, the first lens includes a relative light incident surface and a light exiting surface; wherein the light incident surface is a plane and flush with the outer cover; and the light exiting surface is a concave surface or a convex surface.

[0011] According to an embodiment of the present application, the lens assembly also includes a first lens barrel opposite to the first lens, wherein a supporting platform is provided on the inner surface of the first lens barrel to place the first lens; and the light emitting surface of the first lens is in contact with the supporting platform.

[0012] According to an embodiment of the present application, the camera module further includes an anti-shake component, and the anti-shake component includes an active part connected to the photosensitive component to drive the photosensitive component to perform compensating movement.

[0013] According to an embodiment of the present application, the focusing lens further includes: a driving mechanism, the driving mechanism includes a piezoelectric film, and the piezoelectric film is arranged on the outer edge of the deformable film layer.

[0014] According to an embodiment of the present application, the focusing lens includes: a driving mechanism, the driving mechanism includes a pressure ring, the pressure ring is arranged on the outer edge of the deformable lens surface, and is driven by at least one of VCM drive, MEMS drive and SMA drive.

[0015] According to an embodiment of the present application, the photosensitive component also includes a circuit board, and the lens assembly also includes a second lens barrel opposite to the second lens, and a connecting circuit is arranged on the surface of the second lens barrel, one end of the connecting circuit is electrically connected to the focusing lens, and the other end of the connecting circuit is electrically connected to the circuit board.

[0016] According to an embodiment of the present application, the first lens is far away from the photosensitive component, the second lens is close to the photosensitive component, and a connecting circuit is provided on the outer surface or inside of the second lens barrel.

[0017] According to an embodiment of the present application, a connecting circuit formed by an integral molding process is disposed inside the second lens barrel.

[0018] According to an embodiment of the present application, a connecting circuit formed by an etching process is provided on the outer surface of the second lens barrel.

[0019] According to an embodiment of the present application, the focusing lens is electrically connected to the connecting circuit through a wire bonding process.

[0020] According to an embodiment of the present application, the focusing lens includes a first surface and a second surface opposite to each other, and a side surface connecting the first surface and the second surface, and a pad is provided on the side surface to connect the connecting circuit through a wire bonding process.

[0021] According to an embodiment of the present application, the focusing lens includes a first surface and a second surface relative to each other, the second surface faces the second lens, and a first solder pad and a second solder pad are respectively arranged on the second surface and the surface of the second lens opposite to the second surface, and the first solder pad and the second solder pad are directly connected through a chip-scale packaging process CSP.

[0022] According to an embodiment of the present application, the other end of the connecting circuit is electrically connected to the circuit board by at least one of laser welding and connector snap-fitting.

[0023] According to an embodiment of the present application, the photosensitive component includes a circuit board and a photosensitive chip, the circuit board is provided with a groove to accommodate the photosensitive chip; and the lens assembly also includes a color filter element and a lens holder, wherein the lens holder is arranged on the circuit board, and the color filter element is arranged on the surface of the lens holder away from the circuit board.

[0024] According to an embodiment of the present application, the circuit board is provided with a through hole to accommodate the photosensitive chip.

[0025] According to an embodiment of the present application, the photosensitive component includes a circuit board, and the movable part is arranged on the circuit board.

[0026] According to an embodiment of the present application, the movable portion is disposed on a side of the mirror holder close to an outer edge of the circuit board.

[0027] According to an embodiment of the present application, the mirror seat is arranged on the outer edge of the circuit board, and the movable portion is arranged on the surface of the mirror seat away from the circuit board.

[0028] According to an embodiment of the present application, the photosensitive component includes a circuit board and a reinforcing plate, the reinforcing plate is arranged on a surface of the circuit board away from the photosensitive chip, the photosensitive chip is arranged in the groove on the circuit board and attached to the reinforcing plate.

[0029] On the other hand, the present application also provides a method for preparing a camera module, including: arranging a first lens and a second lens at intervals to form a lens assembly; arranging the lens assembly on a photosensitive path of a photosensitive assembly; and arranging a focusing lens including at least one deformable film layer between the first lens and the second lens.

[0030] According to an embodiment of the present application, the method further includes: connecting the movable part to the photosensitive component.

[0031] According to an embodiment of the present application, setting a focusing lens including at least one deformable film layer between a first lens and a second lens includes: setting the first lens away from the photosensitive component and setting the second lens close to the photosensitive component; fixing the focusing lens on a side of the second lens close to the first lens; actively calibrating and adjusting the positional relationship between the first lens and the second lens to adjust the optical axes of the first lens and the second lens to be consistent; and placing adhesive in the gap formed by the first lens and the focusing lens to fix the first lens and the second lens.

[0032] According to an embodiment of the present application, the lens assembly also includes a first lens barrel and a second lens barrel respectively opposite to the first lens and the second lens, wherein fixing the focusing lens to a side of the second lens close to the first lens includes: providing a connecting circuit on the outer surface or inside of the second lens barrel; and electrically connecting one end of the connecting circuit to the focusing lens, and electrically connecting the other end of the connecting circuit to the circuit board.

[0033] According to an embodiment of the present application, providing a connecting circuit inside the second lens barrel includes: forming the connecting circuit inside the second lens barrel by an integrated molding process.

[0034] According to an embodiment of the present application, providing a communication circuit on the outer surface of the second lens barrel includes: forming the communication circuit on the outer surface of the second lens barrel by an etching process.

[0035] According to an embodiment of the present application, electrically connecting one end of the communication circuit to the focusing lens includes: electrically connecting the focusing lens to the communication circuit by a wire bonding process.

[0036] According to an embodiment of the present application, the focusing lens includes a first surface and a second surface relative to each other, and a side surface connecting the first surface and the second surface, wherein electrically connecting the focusing lens and the connecting circuit through a wire bonding process includes: setting a solder pad on the side surface; and connecting the solder pad to a metal wire to realize the wire bonding process to electrically connect the focusing lens and the connecting circuit.

[0037] According to an embodiment of the present application, the focusing lens includes a first surface and a second surface relative to each other, the second surface faces the second lens, wherein electrically connecting one end of the connecting circuit to the focusing lens includes: respectively setting a first solder pad and a second solder pad on the second surface and the surface of the second lens opposite to the second surface; and directly connecting the first solder pad and the second solder pad through a chip-scale packaging process CSP so that one end of the connecting circuit is electrically connected to the focusing lens.

[0038] According to an embodiment of the present application, electrically connecting the other end of the connecting circuit with the circuit board includes: providing a bent soft board on the circuit board, and electrically connecting the other end of the connecting circuit with the soft board of the circuit board by at least one of laser welding or connector snapping.

[0039] According to an embodiment of the present application, the camera module is applied to a mobile terminal, an opening is set in the outer cover of the mobile terminal, and the camera module is set in the opening of the outer cover, the first lens includes a first lens set at the light incident end of the camera module, the first lens includes a relative light incident surface and a light exit surface, and it is characterized in that the method also includes: setting the light incident surface of the first lens to be a plane and flush with the outer cover; and setting the light exit surface of the first lens to be a concave surface or a convex surface.

[0040] According to an embodiment of the present application, disposing a focusing lens including at least one deformable film layer between a first lens and a second lens includes: disposing a piezoelectric film at an outer edge of the deformable film layer; and disposing the focusing lens between the first lens and the second lens.

[0041] According to an embodiment of the present application, setting a focusing lens including at least one deformable film layer between a first lens and a second lens includes: setting a pressure ring on the outer edge of the deformable film layer, wherein the pressure ring is driven by at least one of VCM drive, MEMS drive and SMA drive; and setting the focusing lens between the first lens and the second lens.

[0042] According to at least one solution of the camera module provided above in the present application, at least one of the following beneficial effects can be achieved:

[0043] The camera module provided by the present application keeps the position of the lens relatively unchanged during the focusing process, and the focusing component is a focusing lens arranged on the optical axis of the lens. The focusing function of the camera module can be achieved by controlling the change of the surface shape of the focusing lens. Compared with the prior art, the moving stroke of the lens in the direction of its optical axis and the nonlinear segment stroke of the driving mechanism are omitted, thereby reducing the total height of the camera module. This is conducive to realizing the thinness of the mobile terminal and improving the hand-held experience of the mobile terminal.

[0044] The ultra-thin anti-shake camera module and its preparation method provided by the present application can correct the displacement caused by the shaking of the camera module and reduce the height of the camera module by installing the active part of the anti-shake component in the photosensitive component and setting the photosensitive chip in the groove of the circuit board. At the same time, the focusing function of the camera module is realized by setting a deformable focusing lens between the two lenses of the camera module closest to the incident end of the light (the side of the lens assembly of the camera module away from the photosensitive component). Therefore, the imaging quality of the camera module can be effectively improved by using the preparation method of the camera module provided by the present application, and the prepared camera module has the characteristics of ultra-thinness and anti-shake.

[0045] In addition, the camera module and its preparation method provided by the present application can also be configured to have the surface (first surface) of the outermost lens disposed at the light incident end of the camera module (the side of the lens assembly of the camera module away from the photosensitive assembly) exposed to the external space as a plane, so that the surface of the light incident end of the camera module is a plane, and installing it in a mobile terminal can eliminate the protective glass used to protect the camera module in the mobile terminal. The above-mentioned plane is not easy to accumulate dust during the use of the mobile terminal, and the appearance is more beautiful. In addition, the gap between the protective glass and the light incident end of the camera module is eliminated, which can further shorten the spatial height of the camera module in the mobile terminal. The camera module obtained by the preparation method helps to improve the hand-held experience of the mobile terminal and realize the thinness of the mobile terminal.

[0046] In addition, in the camera module and the preparation method thereof provided in the present application, the focusing lens may have more than one deformable film, so that both light-receiving surfaces of the focusing lens can be deformed, thereby increasing the focusing ability of the focusing lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0048] Figure 1 is a structural schematic diagram of a camera module according to an embodiment of the present application;

[0049] Figure 2is a structural schematic diagram of a camera module according to another embodiment of the present application;

[0050] Figure 3A is a partial structural schematic diagram of a lens assembly according to another embodiment of the present application;

[0051] Figure 3B is a partial structural schematic diagram of a lens assembly according to another embodiment of the present application;

[0052] Figure 3C is a partial structural schematic diagram of a lens assembly according to another embodiment of the present application;

[0053] Figure 4 is a schematic structural diagram of a focusing lens including a piezoelectric film according to an embodiment of the present application;

[0054] Figure 5 is a schematic structural diagram of a focusing lens including a pressure ring according to another embodiment of the present application;

[0055] Figure 6 is a schematic structural diagram of a focusing lens according to another embodiment of the present application; and

[0056] Figure 7 This is a flow chart of preparing a camera module according to one embodiment of the present application. DETAILED DESCRIPTION

[0057] In order to better understand the present application, a more detailed description will be made of various aspects of the present application with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application, and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0058] It should be noted that in this specification, the expressions first, second, third, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Therefore, without departing from the teaching of the present application, the first surface discussed below may also be referred to as the second surface. And vice versa.

[0059] In the drawings, the thickness, size and shape of the components have been slightly adjusted for ease of illustration. The drawings are for illustration only and are not drawn strictly to scale. As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not as terms of degree, and are intended to account for the inherent deviations in measurements or calculations that would be recognized by one of ordinary skill in the art.

[0060] It should also be understood that expressions such as "include", "including", "have", "contain" and / or "comprising" are open rather than closed expressions in this specification, which indicate the presence of the stated features, elements and / or components, but do not exclude the presence of one or more other features, elements, components and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire list of features rather than just the individual elements in the list. In addition, when describing embodiments of the present application, "may" is used to mean "one or more embodiments of the present application". And, the term "exemplary" is intended to refer to an example or illustration.

[0061] Unless otherwise specified, all words (including engineering terms and scientific and technological terms) used in this article have the same meaning as those commonly understood by ordinary technicians in the field to which this application belongs. It should also be understood that, unless clearly stated in this application, words defined in common dictionaries should be interpreted as having the same meaning as their meaning in the context of the relevant technology, and should not be interpreted in an idealized or overly formal sense.

[0062] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. In addition, unless explicitly limited or contradictory to the context, the specific steps included in the camera module recorded in the present application are not necessarily limited to the recorded order, but can be performed in any order or in parallel. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0063] Figure 1 It is a structural schematic diagram of a camera module 1000 according to an embodiment of the present application.

[0064] like Figure 1 As shown, the camera module 1000 may include a lens assembly 1100 , a photosensitive assembly 1200 and a focusing lens 1500 .

[0065] The lens assembly 1100 may be arranged on the light sensing path of the photosensitive assembly 1200, and include at least two lenses. The at least two lenses may include: a first lens 1120 and a second lens 1130 arranged at intervals. The first lens 1120 and the second lens 1130 may be respectively arranged in a first lens barrel 1110A and a second lens barrel 1110B corresponding thereto. The focusing lens 1500 may be arranged between the first lens 1120 and the second lens 1130, and include at least one deformable film layer 13 to realize the focusing function of the camera module 1000.

[0066] Figure 2 It is a structural schematic diagram of a camera module 1000 according to another embodiment of the present application. Figure 3AIt is a schematic diagram of the partial structure of a lens assembly 1100 according to another embodiment of the present application. Figure 3B It is a schematic diagram of the partial structure of a lens assembly 1100 according to another embodiment of the present application. Figure 3C It is a schematic diagram of the partial structure of a lens assembly 1100 according to another embodiment of the present application.

[0067] like Figure 2 As shown, the camera module 1000 applied to the mobile terminal 2000 is directly exposed to the external space after the protective glass is removed, and the outer cover 2100 of the mobile terminal 2000 (the camera module 1000 is installed inside the mobile terminal 2000 corresponding to the outer cover 2100 and exposed on the outer cover 2100) is flush with the light incident surface of the camera module 1000 exposed to the external space. For example, when the camera module 1000 is a rear camera module of the mobile terminal 2000, the outer cover 2100 can be the back cover of the mobile terminal 2000. In order to reduce the space in which the camera module 1000 is accommodated in the mobile terminal 2000, the protective glass of the mobile terminal 2000 can be removed, and the flat light incident surface of the camera module 1000 exposed to the external space is set to be flush with the back cover.

[0068] Specifically, the first lens 1120 is farthest from the photosensitive component 1200 and is located at the light incident end of the camera module 1000. The first lens 1120 may include a plurality of lenses. The plurality of lenses include a first lens 1121 located at the outermost side of the light incident end (farthest from the photosensitive component 1200) of the camera module 1000. The first lens 1121 includes a relative light incident surface 21 and a light exit surface 22. The light incident surface 21 of the first lens 1121 exposed to the external space can be set as a flat surface and made flush with the outer cover 2100 of the mobile terminal 2000. Furthermore, in order to ensure the imaging effect of the camera module 1000, the light exit surface 22 of the first lens 1121 can be set as a concave surface or a convex surface according to a specific optical design scheme.

[0069] In addition, during the assembly process of the camera module 1000, the first lens 1121 needs to be assembled in the first lens barrel 1110A along the light incident direction of the camera module 1000 (from the end away from the photosensitive component 1200 to the end close to the photosensitive component 1200). In other words, the opening size of the end surface 1111 of the first lens barrel 1110A close to the light incident end is larger than the opening size of the other opposite end. Further, the first lens 1120 can also be fixed to the outer cover 2100 of the mobile terminal 2000 by glue 16.

[0070] like Figure 3AAs shown, a support platform 23 can be provided on the inner surface of the first lens barrel 1110A to place the first lens 1121, so that the light exiting surface 22 of the first lens 1121 contacts the support platform 23, and the first lens 1121 is fixed by glue. Further, as an option, in some embodiments of the present application, multiple support platforms can also be provided in the first lens barrel 1110A to place other lenses in the first lens 1120.

[0071] Since the opening size of the side of the supporting table 23 close to the light incident end (away from the photosensitive component 1200) is larger than the opening size of the other opposite side, the planar light incident surface 21 of the first lens 1121 can be stably and firmly installed in the first lens barrel 1110A.

[0072] like Figure 3B As shown, in one embodiment of the present application, a bearing platform 23 can be set on the inner surface of the first lens barrel 1110A, and the end surface 1111 of the first lens barrel 1110A is lower than the light incident surface 21 of the first lens 1121. The outer cover 2100 of the mobile terminal 2000 can be set on the end surface 1111 and flush with the light incident surface 21, and glue can be applied where the outer cover 2100 contacts the first lens barrel 1110A. The above structure can prevent the glue between the first lens 1121 and the first lens barrel 1110A from being exposed to the outside, affecting the beauty of the camera module. Further, as a choice, in some embodiments of the present application, multiple bearing platforms can also be set in the first lens barrel 1110A to place other lenses in the first lens 1120.

[0073] like Figure 3C As shown, in one embodiment of the present application, the first lens barrel 1110A is only a support platform 23, one side of the support platform 23 can be fixed with the first lens 1121 by glue, and the other side of the support platform 23 can be fixed with the focus lens 1500 by glue 16. The above structure can prevent the glue between the first lens 1121 and the first lens barrel 1110A (support platform 23) from being exposed to the outside, affecting the appearance of the camera module.

[0074] Figure 4 is a schematic structural diagram of a focusing lens 1500 including a piezoelectric film 14 according to an embodiment of the present application. Figure 5 It is a schematic structural diagram of a focusing lens 1500 including a pressure ring 15 according to another embodiment of the present application. Figure 6 It is a schematic structural diagram of a focusing lens 1500 according to another embodiment of the present application.

[0075] like Figure 4 and 5As shown, in one embodiment of the present application, the focusing lens 1500 may include a substrate 11, a polymer layer 12 and a deformable film layer 13 arranged in sequence. The substrate 11 and the deformable film layer 13 are arranged opposite to each other, and the polymer layer 12 is arranged between the substrate 11 and the deformable film layer 13.

[0076] like Figure 6 As shown, in another embodiment of the present application, the focusing lens 1500 may include a first deformable film layer 18, a polymer layer 12, and a second deformable film layer 19 which are sequentially arranged. The first deformable film layer 18 and the second deformable film layer 19 are arranged opposite to each other, and the polymer layer 12 is arranged between the first deformable film layer 18 and the second deformable film layer 19. The focusing lens of the above structure has more than one deformable film layer, so that both light-receiving surfaces of the focusing lens can be deformed, thereby increasing the focusing ability of the focusing lens.

[0077] Furthermore, in one embodiment of the present application, the focusing lens 1500 may further include a driving mechanism (not shown), and the driving mechanism may include a piezoelectric film 14. The piezoelectric film 14 may be disposed on the deformable film layer 13 (eg, Figure 4 Through the deformation of the piezoelectric film 14, the optical axis direction of the lens 1120 (as shown) can be Figure 4 The dotted line shown in the figure squeezes the deformable film layer 13, thereby changing the shape of the deformable lens surface to achieve the focusing function of the camera module 1000.

[0078] As an option, in another embodiment of the present application, the driving mechanism of the focus lens 1500 may further include a pressure ring 15. The pressure ring 15 may be disposed on the deformable film layer 13 (eg, Figure 5 Through at least one of VCM drive, MEMS drive and SMA drive, pressure is applied to the pressure ring 15 along the optical axis direction of the lens 1120, thereby changing the shape of the deformable lens surface to achieve the focusing function of the camera module 1000.

[0079] The above only takes the focusing lens 1500 having a deformable film layer as an example to explain the driving mechanism of the deformable film layer. Those skilled in the art should understand that the setting of the driving mechanism of the focusing lens 1500 having the first deformable film layer 18 and the second deformable film layer 19 is the same as described above and will not be repeated.

[0080] Since the above-mentioned driving mechanism can provide a greater driving force, the shape of the deformable lens surface can be changed to a greater extent by at least one driving pressure ring among VCM driving, MEMS driving and SMA driving, and the camera module using the focusing lens of this structure can achieve a stronger focusing capability.

[0081] In one embodiment of the present application, the polymer layer 12 may be a high polymer layer with relatively low fluidity to ensure that the gravity of the polymer layer 12 itself is insufficient to cause the deformable film layer 13 to deform.

[0082] In one embodiment of the present application, the substrate 11 may be prepared by selecting a suitable material based on the optical performance of the camera module 1000 with reference to optical parameters such as transmittance and Abbe number.

[0083] In the prior art, the camera module usually needs to move the lens in the direction of the optical axis to focus in order to achieve the function of shooting from far to near, so that a clear imaging effect can always be obtained on the photosensitive chip. However, the distance that the lens moves in the direction of its optical axis needs to reach several hundred microns (effective focus stroke), and because the driving component that drives the lens to move requires a larger non-completely linear stroke, the actual movable stroke of the lens in the driving component is much larger than the effective focus stroke, which results in the camera module protruding from the outer cover of the mobile terminal after being installed in the mobile terminal, which is not in line with the trend of thinner and lighter mobile terminals and reduces the hand-held experience of the mobile terminal.

[0084] Compared with the above-mentioned traditional focusing method, the camera module provided by the present application keeps the position of the lens relatively unchanged during the focusing process, and the focusing component is a focusing lens arranged on the optical axis of the lens. The focusing function of the camera module can be achieved by controlling the change of the surface shape of the focusing lens. Compared with the prior art, the moving stroke of the lens in the direction of its optical axis and the nonlinear segment stroke of the driving mechanism are omitted, thereby reducing the total height of the camera module. This is conducive to realizing the thinness of the mobile terminal and improving the hand-held experience of the mobile terminal.

[0085] In addition, in the camera module and its preparation method provided in the present application, the focusing lens may have more than one deformable film layer, so that both light-receiving surfaces of the focusing lens can be deformed, thereby increasing the focusing ability of the focusing lens and enabling the camera module to have excellent zoom capability.

[0086] In addition, the camera module and its preparation method provided by the present application can also be configured to have a surface (light incident surface 21 of the first lens 1121) of the outermost lens disposed at the light incident end of the camera module (the side of the lens assembly of the camera module away from the photosensitive assembly) exposed to the external space as a plane, so that the surface of the light incident end of the camera module is a plane, and installing it in a mobile terminal can eliminate the protective glass used to protect the camera module in the mobile terminal. The above-mentioned plane is not easy to accumulate dust during the use of the mobile terminal, and the appearance is more beautiful. In addition, the gap between the protective glass and the light incident end of the camera module is eliminated, which can further shorten the spatial height of the camera module in the mobile terminal. The camera module obtained by the preparation method helps to improve the hand-held experience of the mobile terminal and realize the thinness of the mobile terminal.

[0087] Reference again Figure 1 and Figure 2 The first lens 1120 is away from the photosensitive component 1200 and is located at the light incident end of the camera module 1000, and the second lens 1130 is close to the photosensitive component 1200. The photosensitive component 1200 may include a photosensitive chip 1210 and a circuit board 1220.

[0088] A connection circuit 17 may be provided on the surface of the second lens barrel 1110B of the lens assembly 1100. One end of the connection circuit 17 may be electrically connected to the focus lens 1500, and the other end of the connection circuit 17 may be electrically connected to the circuit board 1220 to achieve electrical conduction between the focus lens 1500 and the circuit board 1220.

[0089] Specifically, a communication circuit 17 may be provided on the outer surface or inside of the second lens barrel 1110B.

[0090] In one embodiment of the present application, the connecting circuit 17 may be formed inside the second lens barrel 1110B by an integrated molding process.

[0091] As an option, in another embodiment of the present application, the connecting circuit 17 may be formed on the outer surface of the second lens barrel 1110B by an etching process.

[0092] In addition, in one embodiment of the present application, the focusing lens 1500 can be electrically connected to the connecting circuit 17 through a wire bonding process. Furthermore, while the glue 16 fixes the first lens 1120 to the outer cover 2100 of the mobile terminal 2000, the metal wire used in the wire bonding process can be encapsulated by the glue 16 to prevent the metal wire from being damaged.

[0093] In one embodiment of the present application, the focusing lens 1500 may include a first surface 1520 and a second surface 1530 that are opposite to each other, and a side surface 1540 connecting the first surface 1520 and the second surface 1530. Further, a pad may be provided on the side surface 1540 of the focusing lens 1500, and the focusing lens 1500 may be electrically connected to the communication circuit 17 by a wire bonding process.

[0094] As an option, in another embodiment of the present application, the focus lens 1500 may include a first surface 1520 and a second surface 1530 opposite to each other, and the second surface 1530 may face the second lens 1130. A first pad and a second pad may be provided at the outer edge of the second surface 1530 of the focus lens 1500 and the outer edge of the surface of the second lens 1130 facing the second surface 1530, respectively. The first pad and the second pad are directly connected through a chip-scale packaging process CSP. Specifically, solder paste may be provided between the first pad and the second pad, so as to weld the adjustable lens 1500 and the second lens 1130.

[0095] The CSP process can directly connect the focus lens 1500 and the connection circuit 17 through the pad, avoiding the need to reserve a space for setting the pad in the second lens barrel 1110B, so the size of the focus lens 1500 can be designed to be larger. Therefore, the above electrical connection is achieved during the process of packaging the focus lens 1500 through the CSP process, which is conducive to setting the light aperture of the focus lens 1500 larger.

[0096] Specifically, in another embodiment of the present application, the other end of the communication circuit 17 can be electrically connected to the circuit board 1220 by at least one of laser welding or connector snap-fitting. Further, an FPC (flexible circuit board) can be led out at the edge of the circuit board 1220 and bent upward to connect to the communication circuit 17 on the surface of the second lens barrel 1110B.

[0097] The photosensitive component 1200 mainly converts the optical signal transmitted by the lens 1120 into an electrical signal to form a photograph of the target object. In one embodiment of the present application, a groove may be provided on the circuit board 1220 to accommodate the photosensitive chip 1210. The photosensitive chip 1210 may be electrically connected to the circuit board 1220 by, for example, a wire bonding process to achieve electrical connection between the two.

[0098] As an option, in one embodiment of the present application, the groove on the circuit board 1220 for accommodating the photosensitive chip 1210 can also be set as a through hole to further reduce the height of the camera module 1000.

[0099] In one embodiment of the present application, the camera module 1000 further includes an anti-shake component 1300. The anti-shake component 1300 is an important component of the anti-shake structure of the camera module 1000, and may include a movable part 1310 and a fixed part 1320 connected to the photosensitive component 1200 to drive the photosensitive component 1200 to perform compensatory motion.

[0100] In one embodiment of the present application, the active part 1310 of the anti-shake assembly 1300 may be made of SMA (Shape Memory Alloy) metal or other materials. The present application does not limit this, and those skilled in the art should understand that the material and processing method of the active part may be changed to obtain the various results and advantages described in this specification without departing from the technical solution claimed in the present application.

[0101] In one embodiment of the present application, the anti-shake assembly 1300 may include a kinetic energy supply unit, which may provide a power source such as electromagnetic force to provide power to move the movable portion 1310 relative to the fixed portion 1320. Based on the connection between the movable portion 1310 and the photosensitive component 1200 in the camera module 1000 provided in the present application, the above power may drive the photosensitive chip 1210 to perform compensatory movement, thereby realizing the focusing function of the camera module 1000.

[0102] As an option, in another embodiment of the present application, the movable portion 1310 and the fixed portion 1320 may be connected via an SMA member (not shown). However, those skilled in the art should understand that the present application does not limit the connection method between the movable portion and the fixed portion, and the connection method between the two or the material of the connection member may be changed without departing from the technical solution claimed in the present application to obtain the various results and advantages described in this specification.

[0103] The SMA (Shape Memory Alloy) component can be made of SMA metal, such as titanium nickel alloy (TiNi), titanium palladium alloy (TiPd), titanium nickel copper alloy (TiNiCu), titanium nickel palladium alloy (TiNiPd) or a combination thereof. The SMA component can have different shapes such as linear and strip shapes. The SMA component has a shape memory function, that is, after being heated after plastic deformation, it can be restored to its shape before deformation when the temperature reaches a critical value. When the SMA component is energized, the temperature of the SMA component itself rises, and when the temperature reaches a critical value, the length of the SMA component will change, thereby generating a certain driving force, which will drive the movable part 1310 to move relative to the fixed part 1320. Based on the connection between the movable part 1310 and the photosensitive component 1200 in the camera module 1000 provided in the present application, the above-mentioned drive can drive the photosensitive chip 1210 to perform compensatory movement to realize the focusing function of the camera module 1000.

[0104] Specifically, the lens assembly 1100 further includes a color filter element 1150 and a lens holder 1140. The color filter element 1150 is mainly used to filter stray light. The lens holder 1140 can provide support for the lens assembly 1100 and can also be used to encapsulate the electronic components of the photosensitive assembly 1200. Furthermore, the lens holder 1140 can also be a packaging part.

[0105] In one embodiment of the present application, the lens holder 1140 may be disposed on the circuit board 1220 , and the color filter element 1150 may be disposed on a surface 1141 of the lens holder 1140 away from the circuit board 1220 .

[0106] Furthermore, a slot may be provided on the surface 1141 to accommodate the color filter element 1150. The color filter element 1150 is directly provided on the lens holder 1140, which is conducive to reducing the distance between the color filter element 1150 and the photosensitive chip 1210, thereby further reducing the overall height of the camera module 1000 and achieving ultra-thinness of the camera module 1000.

[0107] In one embodiment of the present application, the lens holder 1140 may be disposed around the circuit board 1220, and the lens holder 1140, the circuit board 1220 and the color filter element 1150 form a closed space. The formation of the closed space can prevent dust or debris from entering the surface of the photosensitive chip 1210 and affecting its imaging effect.

[0108] In one embodiment of the present application, the mirror base 1140 may be disposed on the outer edge of the circuit board 1220 , and the movable portion 1310 may be attached to a surface 1141 (the upper surface of the mirror base 1140 ) of the mirror base 1140 away from the circuit board 1220 .

[0109] As an option, in another embodiment of the present application, the movable portion 1310 may be disposed on the circuit board 1220 .

[0110] Furthermore, the movable portion 1310 can be bonded to one side (outer side) of the lens holder 1140 near the outer edge of the circuit board 1220. This can prevent the unevenness of the upper surface 1141 of the lens holder 1140 or the relatively inclined setting of the movable portion 1310 from affecting the consistency of the optical axis of the lens 1120 and the optical axis of the photosensitive chip 1210. In addition, since the movable portion 1310 is located on the outer side of the lens holder 1140, the distance from the photosensitive chip 1210 to the lens 1120 can be reduced to a certain extent, thereby further reducing the overall height of the camera module 1000.

[0111] Further, in one embodiment of the present application, the camera module 1000 further includes a housing 1400, which can be disposed below the photosensitive component 1200 and surround the photosensitive component 1200 and the anti-shake component 1300. There is a gap between the housing 1400 and the circuit board 1220, so that the photosensitive component 1200 can move in a direction perpendicular to the optical axis of the lens 1120, thereby realizing the anti-shake function of the camera module 1000.

[0112] Further, in one embodiment of the present application, the photosensitive component 1200 also includes a reinforcing plate, which can be made of, for example, a steel sheet. The reinforcing plate can be arranged on a surface of the circuit board 1220 away from the photosensitive chip 1210. The photosensitive chip 1210 can be arranged in a groove on the circuit board 1220 and attached to the surface of the reinforcing plate. However, those skilled in the art should understand that the setting position of the photosensitive chip and the configuration of the reinforcing plate do not constitute limitations of the present application. Without departing from the technical solution claimed for protection in the present application, the setting position of the photosensitive chip and the configuration of the reinforcing plate can be changed to obtain the various results and advantages described in this specification.

[0113] In one embodiment of the present application, the specific location of the photosensitive chip and the thickness and material of the reinforcing plate can be freely selected according to the thickness of the mobile terminal to which the camera module is finally applied. For example, in a thicker mobile terminal, the thickness of the reinforcing plate can be increased to increase the strength of the camera module. On the contrary, in a thinner mobile terminal, the thickness of the reinforcing plate can be reduced and the photosensitive chip can be set in the through hole of the circuit board to further reduce the thickness of the camera module.

[0114] The movable part 1310 of the camera module 1000 provided in the present application is connected to the photosensitive component 1200, and the driving force that drives the movable part 1310 to move relative to the fixed part 1320 will drive the photosensitive component 1200 to move relative to the fixed part 1320. When the camera module 1000 shakes during shooting, the anti-shake component 1300 can drive the photosensitive chip 1210 to adjust the corresponding position through the movable part 1310 according to the received instructions to correct the displacement caused by the shaking of the camera module 1000. After the shaking correction action of the anti-shake component 1300 is completed, the focusing function of the camera module 1000 can be realized through the deformation of the above-mentioned focusing lens 1500, and then the camera module 1000 completes shooting. Therefore, shooting with the camera module including the anti-shake component and the focusing lens provided in the present application can effectively improve the image quality.

[0115] The camera module provided by the present application can correct the displacement caused by the shaking of the camera module and reduce the height of the camera module by installing the movable part of the anti-shake component in the photosensitive component and setting the photosensitive chip in the groove of the circuit board. At the same time, the focusing function of the camera module is realized by setting a deformable focusing lens between the two lenses of the camera module closest to the incident end of the light (the side of the lens assembly of the camera module away from the photosensitive component). Therefore, the camera module provided by the present application has high imaging quality and is ultra-thin and anti-shake.

[0116] Figure 7 FIG. 1 is a flow chart of the preparation of a camera module according to an embodiment of the present application. Figure 7As shown, in one embodiment of the present application, a method 3000 for preparing a camera module is also provided. The preparation method 3000 mainly includes:

[0117] S1, disposing a first lens and a second lens at an interval to form a lens assembly.

[0118] S2, setting the lens assembly on the light-sensing path of the light-sensing assembly.

[0119] S3, disposing a focusing lens including at least one deformable film layer between the first lens and the second lens.

[0120] In addition, the preparation method 3000 further includes: connecting the movable part to the photosensitive component. The movable part is an important component of the anti-shake component. The anti-shake component may include a movable part and a fixed part.

[0121] Specifically, in one embodiment of the present application, in step S3, setting a focusing lens including at least one deformable film layer between the first lens and the second lens includes: setting the first lens away from the photosensitive component, and setting the second lens close to the photosensitive component; fixing the focusing lens on a side of the second lens close to the first lens; actively calibrating and adjusting the positional relationship between the first lens and the second lens to align the optical axes of the first lens and the second lens; and placing adhesive in the gap formed by the first lens and the focusing lens to fix the first lens and the second lens.

[0122] The active calibration process can calculate and adjust the relative positions of the lenses through the imaging quality of the optical system composed of the lenses in the lens assembly. The above calibration process is repeated until the imaging quality of the optical system reaches the optimal level or meets the requirements. The relative positions of the lenses can then be fixed by adhesive.

[0123] The lens assembly also includes a first lens barrel and a second lens barrel corresponding to the first lens and the second lens. After the focusing lens is fixed to the side of the second lens close to the first lens, the steps of setting a connecting circuit on the outer surface or inside of the second lens barrel, electrically connecting one end of the connecting circuit to the focusing lens, and electrically connecting the other end of the connecting circuit to the circuit board can be directly performed. In this way, it is not necessary to weld the circuit of the adjustable lens after the lens assembly and the adjustable lens are assembled.

[0124] As an option, in one embodiment of the present application, a connecting circuit can be formed inside the second lens barrel through an integrated molding process.

[0125] As an option, in another embodiment of the present application, a connecting circuit can be formed on the outer surface of the second lens barrel by an etching process.

[0126] In another embodiment of the present application, the focusing lens and the connecting circuit may be electrically connected by a wire bonding process.

[0127] Further, in one embodiment of the present application, the focusing lens includes a first surface and a second surface opposite to each other, and a side surface connecting the first surface and the second surface. A pad can be provided on the side surface of the focusing lens, and the pad can be connected to a metal wire to realize a wire bonding process to electrically connect the focusing lens to the connection circuit.

[0128] As an option, in another embodiment of the present application, the focus lens includes a first surface and a second surface opposite to each other, the deformable lens surface is any one of the first surface and the second surface, and the second surface faces the second lens. A first pad and a second pad may be respectively provided on the outer edge of the second surface of the focus lens and the outer edge of the surface of the second lens facing the second surface, and the first pad and the second pad may be directly connected through a chip-scale packaging process CSP, so that one end of the communication circuit is electrically connected to the focus lens.

[0129] As an option, in one embodiment of the present application, a bent soft board can be provided on the circuit board, and the other end of the connecting circuit can be electrically connected to the soft board of the circuit board by at least one of laser welding or connector snap-on methods.

[0130] In one embodiment of the present application, the camera module is applied to a mobile terminal, and an opening can be set in the outer cover of the mobile terminal, and the camera module is set in the opening of the outer cover. The first lens of the camera module includes a first lens set at the light incident end of the camera module, and the first lens includes a relative light incident surface and a light exit surface. The first lens includes at least one lens, and the light incident surface of the first lens can be set to a plane so that it is exposed to the external space, and the light incident surface of the first lens can be set to be flush with the outer cover of the mobile terminal. At the same time, according to the specific requirements of the camera module imaging, the light exit surface of the first lens can be set to a concave surface or a convex surface.

[0131] In one embodiment of the present application, a piezoelectric film may be provided at the outer edge of the deformable film layer, and the deformable film layer may be squeezed along the optical axis direction of the lens, thereby changing the shape of the deformable lens surface to achieve the focusing function of the camera module.

[0132] As an option, in another embodiment of the present application, the driving mechanism of the focus lens may further include a pressure ring. The pressure ring may be arranged at the outer edge of the deformable film. Through at least one of VCM drive, MEMS drive and SMA drive, pressure is applied to the pressure ring along the optical axis direction of the lens, thereby changing the shape of the deformable lens surface to achieve the focusing function of the camera module.

[0133] The above description is only an implementation method of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of protection involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the technical concept. For example, the above features are replaced with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A camera module, characterized in that: include: A photosensitive component, wherein the photosensitive component includes a circuit board; A lens assembly is arranged on the light sensing path of the photosensitive assembly, the lens assembly comprises a first lens and a second lens arranged at intervals; the first lens comprises an outermost first lens, a light incident surface of the first lens is exposed to the external space, and the light incident surface is a flat surface; the lens assembly also comprises a first lens barrel opposite to the first lens, wherein a supporting platform is arranged on the inner surface of the first lens barrel to place the first lens, so that the end surface of the first lens barrel is lower than the light incident surface of the first lens; the lens assembly also comprises a lens seat; A focusing lens is disposed between the first lens and the second lens, wherein the focusing lens comprises at least one deformable film layer; and An anti-shake component, the anti-shake component comprising a movable part and a fixed part connected to the photosensitive component to drive the photosensitive component to perform compensatory movement; Wherein, the movable part is connected to the fixed part through a shape memory alloy component; the movable part is bonded to a side of the mirror holder close to the outer edge of the circuit board; and Wherein, the focusing lens comprises a first surface and a second surface opposite to each other, and the second surface faces the second lens; A first solder pad and a second solder pad are respectively disposed on the second surface and a surface of the second lens facing the second surface, and the first solder pad and the second solder pad are directly connected.

2. The camera module according to claim 1, characterized in that: The focusing lens comprises a substrate, a polymer layer and a deformable film layer which are arranged in sequence.

3. The camera module according to claim 1, characterized in that: The focusing lens comprises a first deformable film layer, a polymer layer and a second deformable film layer which are arranged in sequence.

4. The camera module according to claim 1, wherein the camera module is applied to a mobile terminal, an outer cover of the mobile terminal is provided with an opening, and the camera module is provided in the opening of the outer cover, wherein: The first lens comprises a first lens arranged at the light incident end of the camera module, the first lens comprises a light incident surface and a light exiting surface opposite to each other; wherein the light incident surface is a plane and is flush with the outer cover; and The light exiting surface is a concave surface or a convex surface.

5. The camera module according to claim 4, characterized in that: The light exiting surface of the first lens is in contact with the supporting platform.

6. The camera module according to any one of claims 1 to 4, characterized in that: The focusing lens also includes: The driving mechanism includes a piezoelectric film, and the piezoelectric film is arranged on the outer edge of the deformable film layer.

7. The camera module according to any one of claims 1 to 4, characterized in that: The focusing lens comprises: The driving mechanism comprises a pressure ring, which is arranged at the outer edge of the deformable film layer and is driven by at least one of VCM driving, MEMS driving and SMA driving.

8. The camera module according to any one of claims 1 to 4, characterized in that: The lens assembly also includes a second lens barrel opposite to the second lens, and a connecting circuit is arranged on the surface of the second lens barrel, one end of the connecting circuit is electrically connected to the focusing lens, and the other end of the connecting circuit is electrically connected to the circuit board.

9. The camera module according to claim 5, characterized in that: The lens assembly also includes a second lens barrel opposite to the second lens, the first lens is far away from the photosensitive component, the second lens is close to the photosensitive component, and a connecting circuit is arranged on the outer surface or inside of the second lens barrel.

10. The camera module according to claim 9, characterized in that: A connecting circuit formed by an integral molding process is disposed inside the second lens barrel.

11. The camera module according to claim 9, characterized in that: A connecting circuit formed by an etching process is provided on the outer surface of the second lens barrel.

12. The camera module according to claim 8, characterized in that: The focusing lens is electrically connected to the communication circuit through a wire bonding process.

13. The camera module according to claim 8, characterized in that: The first pad and the second pad are directly connected to each other through a chip scale packaging process CSP.

14. The camera module according to claim 8, characterized in that: The other end of the connecting circuit is electrically connected to the circuit board by at least one of laser welding and connector snap-fitting.

15. The camera module according to any one of claims 1 to 4, characterized in that: The photosensitive component includes a photosensitive chip, and the circuit board is provided with a groove to accommodate the photosensitive chip; and The lens assembly also includes a color filter element, Wherein, the lens holder is arranged on the circuit board, and the color filter element is arranged on a surface of the lens holder away from the circuit board.

16. The camera module according to claim 15, characterized in that: The circuit board is provided with a through hole to accommodate the photosensitive chip.

17. The camera module according to any one of claims 1 to 4, characterized in that: The movable part is arranged on the circuit board.

18. The camera module according to claim 15, characterized in that: The mirror seat is arranged on the outer edge of the circuit board, and the movable part is arranged on the surface of the mirror seat away from the circuit board.

19. The camera module according to claim 15, characterized in that: The photosensitive component includes a reinforcing plate, which is arranged on a surface of the circuit board away from the photosensitive chip. The photosensitive chip is arranged in the groove on the circuit board and attached to the reinforcing plate.

20. A method for preparing a camera module, characterized in that: The method comprises: The first lens and the second lens are spaced apart to form a lens assembly; the first lens includes an outermost first lens, a light incident surface of the first lens is exposed to the external space, and the light incident surface is a flat surface; the lens assembly also includes a first lens barrel opposite to the first lens, wherein a supporting platform is provided on the inner surface of the first lens barrel to place the first lens, so that the end surface of the first lens barrel is lower than the light incident surface of the first lens; the lens assembly also includes a lens seat; The lens assembly is arranged on the light sensing path of the light sensing assembly, wherein the light sensing assembly includes a circuit board; Disposing a focusing lens including at least one deformable film layer between the first lens and the second lens; and Connecting the movable part to the photosensitive component, wherein the movable part is a component of the anti-shake component, and the movable part drives the photosensitive component to perform compensatory movement, and the anti-shake component also includes a fixed part, and the movable part and the fixed part are connected through a shape memory alloy component; the movable part is bonded to a side of the lens holder close to the outer edge of the circuit board; and Wherein, the focusing lens comprises a first surface and a second surface opposite to each other, and the second surface faces the second lens; A first solder pad and a second solder pad are respectively disposed on the second surface and a surface of the second lens facing the second surface, and the first solder pad and the second solder pad are directly connected.

21. The method according to claim 20, characterized in that Disposing a focusing lens including at least one deformable film layer between a first lens and a second lens comprises: The first lens is arranged away from the photosensitive component, and the second lens is arranged close to the photosensitive component; Fixing the focusing lens to a side of the second lens close to the first lens; Actively calibrating and adjusting the positional relationship between the first lens and the second lens to make the optical axes of the first lens and the second lens consistent; and The adhesive material is arranged in the gap formed by the first lens and the focusing lens to fix the first lens and the second lens.

22. The method according to claim 21, wherein the lens assembly further comprises a first lens barrel and a second lens barrel respectively opposite to the first lens barrel and the second lens barrel, wherein: Fixing the focusing lens to a side of the second lens close to the first lens comprises: Disposing a communication circuit on the outer surface or inside of the second lens barrel; and One end of the communication circuit is electrically connected to the focusing lens, and the other end of the communication circuit is electrically connected to a circuit board.

23. The method according to claim 22, characterized in that Providing a connecting circuit inside the second lens barrel includes: The connecting circuit is formed inside the second lens barrel through an integrated molding process.

24. The method according to claim 22, characterized in that Providing a connecting circuit on the outer surface of the second lens barrel comprises: The connecting circuit is formed on the outer surface of the second lens barrel by an etching process.

25. The method according to claim 22, characterized in that Electrically connecting one end of the communication circuit to the focusing lens comprises: The focusing lens is electrically connected to the communication circuit through a wire bonding process.

26. The method according to claim 22, characterized in that Electrically connecting one end of the communication circuit to the focusing lens comprises: The first pad and the second pad are directly connected to each other through a chip-scale packaging process CSP, so that one end of the connection circuit is electrically connected to the focus lens.

27. The method according to claim 22, characterized in that Electrically connecting the other end of the connection circuit to the circuit board comprises: A bent soft board is arranged on the circuit board, and The other end of the connecting circuit is electrically connected to the flexible board of the circuit board by at least one of laser welding and connector snap-fitting.

28. The method according to claim 20, wherein the camera module is applied to a mobile terminal, an opening is provided in an outer cover of the mobile terminal, and the camera module is provided in the opening of the outer cover, the first lens comprises a first lens provided at a light incident end of the camera module, the first lens comprises a light incident surface and a light emitting surface opposite to each other, characterized in that: The method further comprises: Arrange the light incident surface of the first lens to be flat and flush with the outer cover; and The light exiting surface of the first lens is configured to be a concave surface or a convex surface.

29. The method according to claim 20, characterized in that Disposing a focusing lens including at least one deformable film layer between a first lens and a second lens comprises: Disposing a piezoelectric film at the outer edge of the deformable film layer; and The focusing lens is disposed between the first lens and the second lens.

30. The method according to claim 20, characterized in that Disposing a focusing lens including at least one deformable film layer between a first lens and a second lens comprises: A pressure ring is arranged at the outer edge of the deformable film layer, wherein the pressure ring is driven by at least one of VCM drive, MEMS drive and SMA drive; and The focusing lens is disposed between the first lens and the second lens.

Images