A vehicle-mounted semiconductor air conditioning system

Abstract

The present invention relates to a vehicle-mounted semiconductor air-conditioning system, and to the technical field of semiconductor air-conditioning. In the present invention, the air-conditioning-refrigerator integrated device includes an air-conditioning area and a refrigerator area; the refrigerator area includes a first semiconductor heat exchange module and a metal plate, the air-conditioning area includes an air inlet channel and an air outlet channel, the air inlet channel and the air outlet channel are separated by the refrigerator area, and the air inlet channel and the air outlet channel are connected by an air channel with heat dissipation fins, and the air-conditioning-refrigerator integrated device realizes the coordination and independence of the air-conditioning area and the refrigerator area by opening and closing the louver insulation board. The present invention also includes a vehicle-mounted semiconductor air-conditioning system of the above-mentioned air-conditioning-refrigerator integrated device. The air-conditioning-refrigerator integrated device of the present invention saves space and the number of components, and can work in coordination in different usage scenarios, and can also work independently, shortening the refrigerator refrigeration time, and it can be connected in parallel with the automobile cooling system.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor air conditioners, and more specifically, to a vehicle-mounted semiconductor air conditioning system. Background Art

[0002] In recent years, the air conditioners commonly installed in new energy vehicles use compression refrigeration and PTC heating to regulate the temperature inside the car. At the same time, more users choose to install car refrigerators in the car to improve comfort and daily riding convenience.

[0003] However, the existing automotive air conditioning compressor and PTC require complex and numerous parts, high cost, and loud noise and strong vibration during operation. The refrigerant in refrigeration is a fluorine-containing material. The existing car refrigerator uses compressors and refrigerants for refrigeration, which also has the problems of vibration, noise, and environmental pollution.

[0004] In order to solve the above problems, the prior art provides a design idea of ​​applying thermoelectric refrigeration semiconductor materials to automobile cooling and heating systems. CN109532401A discloses an in-car air cooling and heating system, in which semiconductor chips are used to replace the traditional compressed steam air conditioning and refrigeration system. It not only needs to be matched with phase change materials, but also cannot use the existing cooling system of the car, resulting in excessively high modification costs. CN107020920A discloses a vehicle-mounted air conditioning and heating device, in which the hot ends of multiple semiconductor refrigeration plates are respectively arranged under multiple seats, which not only occupies a large space, but also greatly changes the existing car layout, and it is difficult to use the original circulation cooling system. In addition, in the existing vehicle-mounted semiconductor air conditioning system, the air conditioner and the refrigerator are arranged separately, which not only occupies a large space, but also the cooling time of the semiconductor refrigerator is long, and the disadvantages are obvious. Summary of the invention

[0005] In order to solve the above-mentioned technical problems existing in the prior art, an object of the present invention is to provide a vehicle-mounted semiconductor air-conditioning system.

[0006] The first aspect of the present invention also relates to an air conditioner-refrigerator integrated device, comprising an air conditioning zone and a refrigerator zone; the refrigerator zone comprises a first semiconductor heat exchange module located at the bottom, and a metal plate located at the upper part of the first semiconductor heat exchange module, the first semiconductor heat exchange module and the metal plate enclose a storage space of the refrigerator, and a metal heat exchange module is arranged on the lower surface of the first semiconductor heat exchange module; a louvered heat insulation board is arranged on the inner surface of the metal plate on the front and rear sides of the first semiconductor heat exchange module; the air conditioning zone comprises an air inlet channel and an air outlet channel, the air inlet channel and the air outlet channel are separated by the refrigerator zone, and the air inlet channel and the air outlet channel are connected by an air channel with heat dissipation fins, the heat dissipation fins are arranged on the outer surface of the metal plate on the front and rear sides of the first semiconductor heat exchange module, a second semiconductor heat exchange module is arranged on the outer surface of the heat dissipation fin, and a metal heat exchange module is arranged on the outer surface of the second semiconductor heat exchange module; the air conditioner-refrigerator integrated device realizes the coordination and independence of the air conditioning zone and the refrigerator zone by opening and closing the louvered heat insulation board.

[0007] Wherein, the outer surfaces of the metal plates on the left and right sides of the first semiconductor heat exchange module are provided with heat insulation plates. The heat insulation plate on the outer surface of the metal plate on the left side of the first semiconductor heat exchange module is located in the air inlet channel, and the heat insulation plate on the outer surface of the metal plate on the right side of the first semiconductor heat exchange module is located in the air outlet channel.

[0008] The shutter heat insulation board is composed of stacked heat insulation sheets, and the opening and closing of the heat insulation sheets are controlled by a micro motor.

[0009] Wherein, a fan is arranged in the air inlet duct.

[0010] Wherein, the heat dissipation fins are composed of cross-vertical metal sheet structures.

[0011] Wherein, a coolant pipeline is arranged in the metal heat exchange module, and the coolant pipeline is arranged in a winding manner in the metal heat exchange module.

[0012] The air conditioner-refrigerator integrated device further includes a power supply for supplying power to the first semiconductor heat exchange module, the second semiconductor heat exchange module, the fan and the micro motor of the louvered heat insulation board, and a power supply controller for controlling the power supply.

[0013] Wherein, the first semiconductor heat exchange module and the second semiconductor heat exchange module each include two insulating heat-conducting panels, and a plurality of thermocouple pairs formed by connecting P-type semiconductor elements and N-type semiconductor elements are arranged between the two insulating heat-conducting panels; and the insulating heat-conducting panels are preferably heat-conducting ceramic panels.

[0014] The present invention also includes an on-vehicle semiconductor air conditioning system of the above-mentioned air conditioner-refrigerator integrated device, wherein: the coolant pipeline in the metal heat exchange module in the air conditioner-refrigerator integrated device is connected in parallel with the automobile cooling system circulation loop.

[0015] Among them, the automobile cooling system circulation loop includes a condenser and an automobile cooling loop connected to the condenser, and an expansion water tank is arranged between the condenser and the automobile cooling loop; the coolant pipeline outlet in the metal heat exchange module in the air-conditioner-refrigerator integrated device is connected to the liquid inlet of the expansion water tank, and the liquid outlets of the expansion water tank and the condenser are connected to the coolant pipeline inlet in the metal heat exchange module in the air-conditioner-refrigerator integrated device.

[0016] Compared with the prior art, the vehicle-mounted semiconductor air conditioning system of the present invention has the following beneficial effects:

[0017] In the vehicle-mounted semiconductor air-conditioning system of the present invention, a refrigerator area is integrated into the semiconductor air-conditioning, saving space and the number of parts; the semiconductor air-conditioning area and the refrigerator area can work together or independently in different usage scenarios, shortening the refrigerator refrigeration time and improving work efficiency; the cooling system of the semiconductor heat exchange module and the automobile cooling system are connected in parallel, making extensive use of the existing heat dissipation system of the vehicle body, reducing the number of parts and saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of the air conditioner-refrigerator integrated device of Example 1.

[0019] Figure 2 This is a top view of the air conditioner-refrigerator integrated device of Example 1.

[0020] Figure 3 Schematic diagram of the opening (a) and closing (b) of the louvered insulation board in the air conditioner-refrigerator integrated device of Example 1.

[0021] Figure 4 This is a schematic diagram of the structure of the semiconductor heat exchange module in the air conditioner-refrigerator integrated device of Example 1.

[0022] Figure 5 This is a diagram of the internal structure of the metal heat exchange module in the air conditioner-refrigerator integrated device of Example 1.

[0023] Figure 6 This is a structural block diagram of the semiconductor air conditioning system of Example 1.

[0024] Figure 7 Schematic diagram of the cooling cycle loop 1 of the semiconductor air conditioning system of Example 1.

[0025] Figure 8Schematic diagram of the cooling circulation loop 2 of the semiconductor air conditioning system of Example 1.

[0026] Fig. 9 Schematic diagram of the cooling circulation loop 3 of the semiconductor air conditioning system of Example 1.

[0027] Fig.10 This is a schematic diagram of the working process of the semiconductor air conditioning system in Example 1.

[0028] In the figure: 100 air conditioner-refrigerator integrated device; 11 fan, 12 air inlet duct, 13 air outlet duct; 21 heat insulation board, 22 louver heat insulation board; 31 metal plate, 32 heat dissipation fins; 41 first semiconductor heat exchange module, 42 second semiconductor heat exchange module; 51 metal heat exchange module, 52 water pipe, 53 two-position three-way reversing valve, 54 water pump, 55 two-position two-way reversing valve A, 56 two-position two-way reversing valve B; 61 expansion water tank, 62 condenser. DETAILED DESCRIPTION

[0029] The vehicle-mounted semiconductor air-conditioning system of the present invention will be further described below in conjunction with specific embodiments to help technicians in this field have a more complete, accurate and in-depth understanding of the technical solution of the present invention.

[0030] Example 1

[0031] like Figure 1-5 As shown, this embodiment relates to an air conditioner-refrigerator integrated device 100 including an air conditioner area and a refrigerator area; the refrigerator area includes a first semiconductor heat exchange module 41 located at the bottom, and a metal plate 31 located at the upper part of the first semiconductor heat exchange module 41, the first semiconductor heat exchange module 41 and the metal plate 31 enclose a storage space for the refrigerator, and a metal heat exchange module is arranged on the lower surface of the first semiconductor heat exchange module 41; the inner surface of the metal plate 31 on the front and rear sides of the first semiconductor heat exchange module 41 is provided with a louvered heat insulation board 22, and the outer surface of the metal plate 31 on the left and right sides of the first semiconductor heat exchange module 41 is provided with a heat insulation board 21. For the louvered heat insulation board 22, as shown in FIG. Figure 3 As shown, the shutter insulation board 22 is composed of stacked insulation sheets, and the insulation sheets are opened and closed by a micro motor. Figure 3(a) shows the open state, and (b) shows the closed state. The air-conditioning area includes an air inlet duct 12 and an air outlet duct 13, and a fan 11 is arranged in the air inlet duct 12. The refrigerator area is separated by the air inlet duct 12 and the air outlet duct 13, and the air inlet duct 12 and the air outlet duct 13 are connected by an air channel with heat dissipation fins 32. The heat dissipation fins 32 are arranged on the outer surface of the metal plate 31 on the front and rear sides of the first semiconductor heat exchange module 41, and the second semiconductor heat exchange module 42 is arranged on the outer surface of the heat dissipation fins 32, and the metal heat exchange module 51 is arranged on the outer surface of the second semiconductor heat exchange module 42. Figure 5 As shown, the metal heat exchange module 51 is provided with a coolant pipeline, and the coolant pipeline is arranged in a winding manner in the metal heat exchange module 51. In this embodiment, the air conditioner-refrigerator integrated device 100 also includes a power supply and a power controller for supplying power to the micro motor of the first semiconductor heat exchange module 41, the second semiconductor heat exchange module 42, the fan 11 and the louver insulation board 22, and a temperature sensor is also provided. Figure 4 As shown, in this embodiment, the first semiconductor heat exchange module 41 and the second semiconductor heat exchange module 42 are devices based on the principle of "thermoelectric refrigeration". The basic element of the semiconductor heat exchange module is a thermocouple pair, that is, a thermocouple formed by connecting a P-type semiconductor element and an N-type semiconductor element. When the DC power supply is turned on, the current direction of the upper joint is NP, the temperature decreases, and heat is absorbed to form a cold end; the current direction of the lower joint is pn, the temperature rises, and heat is released to form a hot end. Connecting several pairs of thermocouples together constitutes a commonly used thermopile. With the help of various heat transfer devices, the hot end of the thermopile continuously dissipates heat and maintains a certain temperature. The cold end of the thermopile is placed in the working environment to absorb heat and generate low temperature. This is the working principle of semiconductor refrigeration. By changing the direction of the semiconductor current, the switching of the cooling surface and the heating surface can be achieved. The semiconductor heat exchange module includes two insulating heat-conducting panels, and a plurality of thermocouple pairs formed by connecting P-type semiconductor elements and N-type semiconductor elements are arranged between the two insulating heat-conducting panels. The insulating heat-conducting panels are heat-conducting ceramic panels.

[0032] In the air conditioner-refrigerator integrated device 100 of the present embodiment, the coordination and independence of the working areas of the air conditioner zone and the refrigerator zone are achieved by opening and closing the louvered heat insulation board 22 .

[0033] Specifically, if Figure 2As shown, an air duct is formed by the metal plate 31 and the heat sink fins 32 in the middle of the second semiconductor heat exchange module 42. Air enters from the fan 11 of the air inlet 12, exchanges heat through the heat sink fins 32 at the cold end of the second semiconductor heat exchange module 42, and is then discharged through the air outlet 13. The heat at the hot end of the second semiconductor heat exchange module 42 is transferred to the coolant in the water pipe through the metal heat exchange module 51. When the refrigerator area is working, the first semiconductor heat exchange module 41 at the bottom starts working, the cold end reduces the temperature in the cavity of the refrigerator area, and the heat at the hot end is taken away by the coolant in the metal heat exchange module 51. At the same time, the heat insulation louvers 22 on both sides are opened under the drive of the micromotor, and the second semiconductor heat exchange modules 42 on both sides start working. The cooling capacity is transferred from the heat dissipation fins 32 to the metal plate 31, and then transferred from the metal plate 31 to the refrigerator cavity, so as to realize the coordinated work of the air conditioning area with the refrigerator area, and provide a strong cooling effect for the refrigerator area. When the refrigerator area reaches the target temperature, the louver insulation board 22 is closed under the drive of the micromotor, so that the air conditioning area and the refrigerator area are divided into two independent areas by the insulation material. Since the cold end and the hot end of the semiconductor heat exchange module can be adjusted by changing the direction of the current, when the cooling end is switched to the heating end, the working principle is the same as that of the cooling.

[0034] like Figure 6 As shown, this embodiment also provides a vehicle-mounted semiconductor air conditioning system including the above-mentioned air conditioner-refrigerator integrated device 100, and the coolant pipeline in the metal heat exchange module 51 in the air conditioner-refrigerator integrated device 100 is connected in parallel with the automobile cooling system circulation loop, so as to improve the heat dissipation efficiency of the heat dissipation end of the semiconductor element, thereby improving the working efficiency of the entire air conditioning system. Specifically, the automobile cooling system circulation loop includes a condenser 62 and an automobile cooling loop connected to the condenser 62, and an expansion water tank 61 is provided between the condenser 62 and the automobile cooling loop. The outlet of the coolant pipeline in the metal heat exchange module 51 in the air conditioner-refrigerator integrated device 100 is connected to the liquid inlet of the expansion water tank 61, and the liquid outlets of the expansion water tank 61 and the condenser 62 are connected to the coolant pipeline inlet in the metal heat exchange module 51 in the air conditioner-refrigerator integrated device 100. Specifically, the liquid outlets of the expansion water tank 61 and the condenser 62 are connected to the inlet of the two-position three-way reversing valve 53 through pipelines, and the outlet of the two-position three-way reversing valve 53 is connected to the two-position two-way reversing valve A 55 and the two-position two-way reversing valve B 56, and the outlet of the two-position two-way reversing valve A 55 is connected to the coolant pipeline inlet in the metal heat exchange module 51 arranged on the outer surface of the second semiconductor heat exchange module 42, and the outlet of the two-position two-way reversing valve B 56 is connected to the coolant pipeline inlet in the metal heat exchange module arranged on the lower surface of the first semiconductor heat exchange module 41; and a water pump 54 is arranged between the two-position three-way reversing valve 53 and the two-position two-way reversing valve A 55 and the two-position two-way reversing valve B 56.

[0035] Fig.10 The schematic diagram of the working process of the semiconductor air conditioning system of this embodiment is shown in FIG. The normal temperature threshold H1 of the coolant temperature in the expansion tank 61 and the high temperature threshold H2 of the water outlet temperature of the condenser 62 are set. The cooling system circulation loop of the automobile can be regarded as Fig. 9 The cooling cycle loop 3 is shown as: expansion water tank 61 → condenser 62 → vehicle cooling circuit → expansion water tank 61. When the cooling signal is received, if the coolant temperature in the expansion water tank 61 is lower than the normal temperature threshold H1, the coolant temperature in the expansion water tank 61 can absorb the heat dissipation of the semiconductor air conditioning system within the normal temperature threshold H1. Fig. 9 Cooling circuit 3 is not working. Figure 7 Cooling cycle 1 works: expansion water tank 61 → 2-position 3-way reversing valve water pump 53 → water pump 54 → 2-position 2-way reversing valve A&B → metal heat exchange module 51 → expansion water tank 61. When the coolant temperature in the expansion water tank 61 is greater than the normal temperature threshold H1, and the outlet temperature of the condenser 62 is less than the high temperature threshold H2, the heat dissipation of the coolant in the expansion water tank 61 reaches saturation, but the heat dissipation of the condenser 62 still has surplus, and the heat dissipation of the car is greater than the heat generation of the car. Fig. 9 Cooling circuit 3 and Figure 8 The cooling loop 2 works in parallel. The cooling loop of the semiconductor air conditioning system is Figure 8 Cooling cycle 2 is shown as: expansion water tank 61 → condenser 62 → two-position three-way reversing valve water pump 53 → water pump 54 → two-position two-way reversing valve A&B → metal heat exchange module 51 → expansion water tank 61. When the condenser outlet temperature is higher than the high temperature threshold value H2, the heat dissipation of the car is less than the heat generation. After the coolant passes through the condenser 62, the temperature cannot be reduced below the high temperature threshold value H2. In order to give priority to the heat dissipation of the car power system, only Fig. 9 Cooling circulation loop 3 is working, cooling circulation loop 2 and cooling circulation loop 3 of the semiconductor air-conditioning system are not working, the refrigeration signal of the semiconductor air-conditioning system is cancelled, and the semiconductor air-conditioning system issues a warning of excessive water temperature.

[0036] For ordinary technicians in this field, the specific embodiments are only illustrative descriptions of the present invention. It is obvious that the specific implementation of the present invention is not limited to the above-mentioned methods. As long as various non-substantial improvements are made using the method concept and technical solution of the present invention, they are all within the protection scope of the present invention.

Claims

1. An air conditioner-refrigerator integrated device, characterized in that: It includes an air-conditioning area and a refrigerator area; the refrigerator area includes a first semiconductor heat exchange module located at the bottom, and a metal plate located on the upper part of the first semiconductor heat exchange module, the first semiconductor heat exchange module and the metal plate enclose a storage space for the refrigerator, and a metal heat exchange module is arranged on the lower surface of the first semiconductor heat exchange module; the inner surfaces of the metal plates on the front and rear sides of the first semiconductor heat exchange module are provided with louvered insulation boards; the air-conditioning area includes an air inlet channel and an air outlet channel, the air inlet channel and the air outlet channel are separated by the refrigerator area, and the air inlet channel and the air outlet channel are connected through an air channel with heat dissipation fins, the heat dissipation fins are arranged on the outer surfaces of the metal plates on the front and rear sides of the first semiconductor heat exchange module, a second semiconductor heat exchange module is arranged on the outer surface of the heat dissipation fins, and a metal heat exchange module is arranged on the outer surface of the second semiconductor heat exchange module; the air-conditioning-refrigerator integrated device realizes the coordination and independence of the air-conditioning area and the refrigerator area through the opening and closing of the louvered insulation boards.

2. The air conditioner-refrigerator integrated device according to claim 1, characterized in that: Heat insulation plates are provided on the outer surfaces of the metal plates on the left and right sides of the first semiconductor heat exchange module.

3. The air conditioner-refrigerator integrated device according to claim 2, characterized in that: The heat insulation plate on the outer surface of the metal plate on the left side of the first semiconductor heat exchange module is located in the air inlet channel, and the heat insulation plate on the outer surface of the metal plate on the right side of the first semiconductor heat exchange module is located in the air outlet channel.

4. The air conditioner-refrigerator integrated device according to claim 1, characterized in that: The shutter heat insulation board is composed of stacked heat insulation sheets, and the opening and closing of the heat insulation sheets are controlled by a micro motor.

5. The air conditioner-refrigerator integrated device according to claim 1, characterized in that: The heat dissipation fins are composed of cross-vertical metal sheet structures.

6. The air conditioner-refrigerator integrated device according to claim 1, characterized in that: A coolant pipeline is arranged in the metal heat exchange module, and the coolant pipeline is arranged in a winding manner in the metal heat exchange module.

7. The air conditioner-refrigerator integrated device according to claim 1, characterized in that: The air conditioner-refrigerator integrated device also includes a power supply for supplying power to the first semiconductor heat exchange module, the second semiconductor heat exchange module, the fan and the micro motor of the louvered heat insulation board, and a power supply controller for controlling the power supply.

8. The air conditioner-refrigerator integrated device according to claim 1, characterized in that: The first semiconductor heat exchange module and the second semiconductor heat exchange module each include two insulating heat-conducting panels, and a plurality of thermocouple pairs formed by connecting P-type semiconductor elements and N-type semiconductor elements are arranged between the two insulating heat-conducting panels.

9. A vehicle-mounted semiconductor air conditioning system, characterized in that: The invention comprises the air conditioner-refrigerator integrated device as claimed in any one of claims 1 to 8, wherein the coolant pipeline in the metal heat exchange module of the air conditioner-refrigerator integrated device is connected in parallel with the circulation loop of the automobile cooling system.

10. The vehicle-mounted semiconductor air conditioning system according to claim 9, characterized in that: The automobile cooling system circulation loop includes a condenser and an automobile cooling loop connected to the condenser, and an expansion water tank is arranged between the condenser and the automobile cooling loop; the coolant pipeline outlet in the metal heat exchange module in the air-conditioner-refrigerator integrated device is connected to the liquid inlet of the expansion water tank, and the liquid outlets of the expansion water tank and the condenser are connected to the coolant pipeline inlet in the metal heat exchange module in the air-conditioner-refrigerator integrated device.

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