Manufacturing method of flexible electronic packaging device

Abstract

This invention discloses a method for manufacturing a flexible electronic packaging device, comprising the following steps: determining the allowable bending radius of the flexible electronic packaging device; determining the minimum surface curvature radius of a selected portion of an application carrier; determining that the allowable bending radius is less than the minimum surface curvature radius; and disposing the flexible electronic packaging device on the selected portion.

Description

Technical Field

[0001] This invention relates to a method for manufacturing an electronic device, and more particularly to a method for manufacturing a flexible electronic packaging device. Background Technology

[0002] With the continuous evolution of electronic technology, electronic devices are being used more and more widely in daily life. Flexible packaging technology is receiving increasing attention. However, the use of flexible packaging technology must address the problem that electronic components are easily damaged or detached, leading to poor yield and short lifespan. Summary of the Invention

[0003] This invention provides a method for manufacturing a flexible electronic packaging device, which helps to ensure the normal operation of the flexible electronic packaging device and extend its service life.

[0004] The method for manufacturing the flexible electronic packaging device of the present invention includes the following steps, but is not limited thereto: Determining the allowable bending radius of the flexible electronic packaging device; Determining the minimum surface curvature radius of a selected portion of the application carrier; Determining that the allowable bending radius is less than or equal to the minimum surface curvature radius; and Disposing the flexible electronic packaging device on the selected portion.

[0005] Another method for manufacturing a flexible electronic packaging device according to the present invention includes the following steps, but is not limited thereto: Determining the minimum surface radius of curvature of a selected portion of an application carrier. Determining a flexible electronic packaging device disposed on the selected portion based on the minimum surface radius of curvature, wherein the flexible electronic packaging device comprises a plurality of components. The method for determining the flexible electronic packaging device includes: setting an initial bending radius and calculating the bending stress value of each of the components in the flexible electronic packaging device at the bending radius, wherein the bending radius is less than the minimum surface radius of curvature; determining the maximum allowable stress value of each of the components; and determining the flexible electronic packaging device when the bending stress value of each of the components is less than the maximum allowable stress value. Then, disposing the flexible electronic packaging device on the selected portion.

[0006] Based on the above, the method of this embodiment of the invention considers the radius of curvature of a selected portion of the application carrier and the allowable bending radius of the flexible electronic packaging device to determine whether the flexible electronic packaging device can be disposed on the application carrier, thereby ensuring the service life of the flexible electronic packaging device on the application carrier. Attached Figure Description

[0007] The accompanying drawings are included to further illustrate the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0008] Figure 1 This is a schematic diagram of a method for manufacturing a flexible electronic packaging device according to an embodiment of the present invention;

[0009] Figure 2 A method for determining the minimum permissible bending radius of a flexible electronic package device according to some embodiments is schematically illustrated.

[0010] Figure 3 A diagram illustrating the method for determining the bending stress values ​​of each component;

[0011] Figure 4 and Figure 5 This is a schematic diagram of a flexible electronic packaging device according to some embodiments of the present invention;

[0012] Figure 6 This is a schematic diagram of a flexible electronic packaging device according to some embodiments of the present invention;

[0013] Figure 7 This is a schematic diagram of a flexible electronic packaging device disposed on an application carrier according to an embodiment of the present invention;

[0014] Figures 8 to 11 This diagram schematically illustrates an implementation of a flexible electronic packaging device disposed on an application carrier.

[0015] Explanation of icon numbers

[0016] 200, 300, 400, 500, 600, 810, 910, 1010, 1110, 1120: Flexible electronic packaging devices;

[0017] 202: Neutral aspect;

[0018] 210, 310~390, 312, 342, 352: Components;

[0019] 610: Part One;

[0020] 620: Part Two;

[0021] 700, 820, 920, 1020, 1130: Application carriers;

[0022] 710, 720: Selected portion;

[0023] 830, 930, 1030: Molds;

[0024] d: distance;

[0025] O: Center of curvature;

[0026] S110~S150, S112~S118: Steps;

[0027] X, Y: Direction;

[0028] ρ: Radius of curvature. Detailed Implementation

[0029] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0030] Figure 1 This is a method for manufacturing a flexible electronic packaging device according to an embodiment of the present invention. For example... Figure 1 As shown, in step S110, the allowable bending radius (R) of the flexible electronic packaging device is determined. tol _ Sip Flexible electronic packaging devices are flexible, but they can still be damaged if the stress caused by bending is too great. Therefore, the bending tolerance of flexible electronic packaging devices is a necessary consideration.

[0031] In this embodiment, the flexible electronic packaging device is intended to be disposed on an application carrier for use. In other words, the application carrier referred to herein is the object on which the flexible electronic packaging device is intended to be disposed. For example, the application carrier may be a wearable item or other three-dimensional object. In order to determine the proper operation of the flexible electronic packaging device after it is disposed on the application carrier, the characteristics of the application carrier can be used as parameters to be considered when manufacturing the flexible electronic packaging device. Therefore, in step S120, the minimum surface radius of curvature (R) of a selected portion of the application carrier is determined. min _ C In some embodiments, when the application carrier itself is a three-dimensional object, step 120 may include scanning a selected portion of the application carrier where a flexible electronic packaging device is to be disposed, to obtain the surface radii of curvature of individual surfaces in the selected portion, and selecting the smallest of these surface radii of curvature as the minimum surface radius of curvature (R) of the selected portion. min _ C In other embodiments, when the application carrier itself is fabric or a wearable item, the application carrier can be first positioned in a worn state, and then individual surfaces of a selected portion of the application carrier in the worn state can be scanned. The smallest surface radius of curvature (R) among the scanned individual surfaces is selected as the minimum surface radius of curvature (R) of the selected portion. min _ C For example, when the application carrier is clothing covering the human torso, such as a T-shirt, shirt, or athletic leggings, the application carrier can first be worn on a mannequin, and then a selected portion of the application carrier can be scanned to obtain the minimum surface radius of curvature (R) of the selected portion. min _ C ).

[0032] Next, step S130 can be performed to determine the permissible bending radius (R) of the flexible electronic packaging device. tol _ Sip Is it less than or equal to the minimum surface radius of curvature (R) of the selected portion of the application carrier? min _ C The relationship between the allowable bending radius (R) of flexible electronic packaging devices. tol _ Sip The radius of curvature of the selected portion of the application carrier is less than the minimum surface radius of curvature (R). min _ C This indicates that the flexural stress experienced by the flexible electronic package when it is mounted on the surface of the selected portion is less than the tolerance of the flexible electronic package itself. In other words, the flexible electronic package is less likely to be damaged due to unevenness of the surface of the selected portion when mounted on the selected portion of the application carrier. Therefore, step S130 determines the allowable bending radius (R) of the flexible electronic package. tol _ Sip The radius of curvature of the selected portion of the application carrier is less than the minimum surface radius of curvature (R). min _ C After that, step S140 can be performed to place the flexible electronic packaging device on the selected portion. In this way, even if the application carrier with the flexible electronic packaging device is bent during use or the application carrier itself has a curved surface, the flexible electronic packaging device is not easily damaged, thereby achieving a higher manufacturing yield and a better service life.

[0033] Additionally, step S130 determines no, that is, the allowable bending radius (R) of the flexible electronic packaging device. tol _ Sip The radius of curvature of the selected portion of the application carrier is greater than the minimum surface radius of curvature (R). min _ C This indicates that the surface curvature of a selected portion of the application carrier may be equal to or greater than the tolerance of the flexible electronic packaging device. In this case, step S150 can be performed to redesign the flexible electronic packaging device. In some embodiments, the method for redesigning the flexible electronic packaging device includes... Figure 2 The method shown enables the redesigned flexible electronic package to meet the allowable bending radius (R). tol _ Sip The minimum surface radius of curvature (R) of the selected portion is less than or equal to that of the selected portion. min _ C The redesigned flexible electronic package device can be accessed via… Figure 1The process continues through steps S110 to S130 until step S140 is reached to place the flexible electronic packaging device in the selected portion. In this way, even if the application carrier with the flexible electronic packaging device is bent during use or has a curved surface, the flexible electronic packaging device is less likely to be damaged, thus achieving higher manufacturing yield and better service life.

[0034] Figure 2 The illustration schematically depicts a method for determining the minimum permissible bending radius of a flexible electronic package according to some embodiments. Generally, a flexible electronic package may include multiple components, and the material properties of each component, its placement, and the stacking relationship between the components all affect the flexibility of the package's tolerance to flexural stress. Therefore, a method may be employed... Figure 2 The method for determining the minimum allowable bending radius (R) of a flexible electronic package device tol _ Sip Specifically, in step S112, an initial bending radius (R) is set. i ), and calculate the bending stress (S) of each component in the flexible electronic packaging device. max Furthermore, in step S114, failure criteria for each component are established to determine the maximum allowable stress value (S) for each component. limit +FS). Here, S limit For example, the yield strength or ultimate strength of an individual component, while FS is, for example, the factor of safety. In some embodiments, the factor of safety can be defined as S. limit × Safety percentage, where the safety percentage can be set to greater than 0% and up to a maximum of 100%. Taking a safety percentage of 100% as an example, the maximum allowable stress value for each component can be approximately S. limit +S limit ×100%, which is twice the yield strength of an individual component. Taking a safety percentage of 50% as an example, the maximum allowable stress value of each component can be approximately S. limit +S limit ×50%, which is 1.5 times the yield strength of an individual component.

[0035] In step S116, the bending stress value (S) of each component can be determined. max Are all values ​​less than or equal to the maximum allowable stress value? For each component at its initial bending radius (R)... i Bending stress value (S) under ) max If the stress value is less than the maximum allowable stress value, it means that the component is at the initial bending radius (R). iThe stress experienced by all components under the initial bending radius (R) has not yet reached its tolerable level. At this point, the component is not easily damaged by bending. Therefore, all components of the flexible electronic packaging device are within the initial bending radius (R). i All of them conform to the bending stress value (S) max When the initial bending radius (R) is less than or equal to the maximum allowable stress value, i.e., when step S116 determines it to be true, step S118 can be performed to determine the initial bending radius (R). i The allowable bending radius (R) of the flexible electronic packaging device is... tol _ SiP The permissible bending radius (R) is determined by this. tol _ SiP ) can be applied to Figure 1 In step S110. Figure 1 In step S130, if the minimum allowable bending radius (R) of the determined flexible electronic package device is... tol _ SiP ) less than or equal to the minimum surface radius of curvature (R) min _ C This allows the flexible electronic packaging device to be placed in a selected portion of the application carrier. Figure 1 In step S130, if the determined minimum allowable bending radius (R) tol _ SiP ) greater than the minimum surface radius of curvature (R) min _ C This requires changing the design of the flexible electronic packaging device and redesigning it according to... Figure 2 The method for obtaining the minimum surface curvature radius (R) after the updated design min _ C ), then proceed Figure 1 The judgment process.

[0036] Additionally, if a component has an initial bending radius (R) i The bending stress value S under ) max If the initial bending radius (R) is greater than the maximum allowable stress value, which means step S116 is incorrect, it indicates that the initial bending radius (R) is greater than the maximum allowable stress value. i The state of [something] may cause certain components to experience stresses exceeding their permissible limits, making them prone to damage due to bending. Therefore, it was determined that some components [have] initial bending radius (R [radius]). i Bending stress value (S) under ) max If the stress value is greater than the maximum allowable stress value, proceed to step S112 and reset another bending radius (R). i The new bending radius can be different from the previously set initial bending radius (R). i Larger values ​​are needed to find the bending stress value (S). maxThe condition is that the stress is less than the maximum allowable stress value.

[0037] In some embodiments, the initial bending radius (Ri) in step S112 can be based on Figure 1 The minimum surface radius of curvature (R) of the selected part of the application carrier obtained in step S120 min _ C This can be configured using [a specific method]. For example, the location where the flexible electronic packaged device is intended to be placed on the application carrier is predetermined. In this case, [a specific method] can be used. Figure 1 Step S120 involves scanning a selected portion of the application carrier to obtain the minimum surface curvature radius (R) of that selected portion. min _ C Then, based on the minimum surface radius of curvature (R) of the selected portion of the application carrier... min _ C The method for determining the electronic packaging device suitable for flexible mounting on a selected portion of the carrier includes: setting an initial bending radius (Ri) according to step S112, such that the set initial bending radius (Ri) is smaller than the minimum surface curvature radius (R) of the selected portion of the carrier surface. min _ C The bending stress value of each component in the flexible electronic packaging device is calculated at the initial bending radius (Ri). Next, as described in step S114, the maximum allowable stress value of each component is determined, and a judgment is made according to the steps in step S116. Figure 2 Step S116 determines the individual bending stress values ​​(S) of all components. max If all values ​​are less than or equal to the individual maximum allowable stress values, then the electronic package is deemed suitable for mounting on a selected portion of the carrier. Since the initial bending radius (Ri) is set to be less than the minimum surface curvature radius (R0),... min _ C After step S116 is passed, the process proceeds to step S140. Therefore, this flexible electronic packaging device can be placed on a selected portion of the application carrier.

[0038] Figure 3 This illustration demonstrates how to determine the bending stress values ​​of each component. In other words, Figure 3 The specific manner in which step S112 is described is used, but it is not limited to this. Figure 3In this embodiment, the flexible electronic packaging device 200 is, for example, in a bent state and has a neutral surface 202, where the neutral surface 202 is the surface formed by the points where the bending stress experienced in the bent state is zero. Furthermore, in this embodiment, the radius of curvature ρ is defined as the distance from the center of curvature O to the neutral surface 202. The component 210 in the flexible electronic packaging device 200 is separated from the neutral surface 202 by a distance d in the Y direction, and the neutral surface 202 is located between the center of curvature O and the component 210. Therefore, the bending stress value σ experienced by the component 210 in the X direction is... x It can be derived from the formula: σ x = -E×d / ρ, where E is the Young's coefficient of component 210. It can be seen that the bending stress on component 210 is directly proportional to the distance d from the neutral surface 202 and the Young's coefficient E, and inversely proportional to the radius of curvature ρ.

[0039] Figure 4 and Figure 5 This is a schematic diagram of a flexible electronic packaging device according to some embodiments of the present invention. Figure 4 In this flexible electronic packaging device 300, multiple components 310 to 380 may be included. Specifically, component 310 is, for example, an electronic component, including, for example, an integrated circuit chip, a passive component, a sensing component, etc. Component 320 is, for example, a first flexible substrate, which is, for example, a substrate with flexible properties and sufficient support to stably support the electronic component 310. Component 330 is, for example, a second flexible substrate, used to support the first flexible substrate, and the size of the second flexible substrate may be larger than that of the first flexible substrate. Component 310 may be joined to component 320, and component 320 may be joined to component 330 to form a stack structure in which the first flexible substrate is located between the second flexible substrate and the electronic component. Furthermore, component 310 may be electrically connected to component 320, and component 320 may be electrically connected to component 330. That is, the electronic component, the first flexible substrate, and the second flexible substrate may be electrically connected to each other.

[0040] Additionally, component 340 may be a conductive bonding member for bonding component 310 to component 320. In some embodiments, component 340 may be a conductive bump, solder, conductive ball, or the like. Component 350 may be disposed between component 310 and component 320 and for filling the gap between components 340. In some embodiments, component 350 may be a filler, such as epoxy resin, polyimide, or similar materials. Component 340 may electrically connect component 310 to component 320. In some embodiments, component 320 may have conductive vias, and component 360 may be a conductive pad disposed on the surface of component 320. Component 340 may be electrically connected to component 360 on the opposite side via the conductive vias in component 320. Component 370 may be a conductive pad disposed on component 330, and component 370 and component 360 face each other. Component 380 may be a conductive particle bonding member, disposed between component 360 and component 370, to electrically connect the structure of component 360 to component 370. Thus, component 310 can be electrically connected to the conductive lines in component 330 through the conductive through-holes of components 340 and 320, as well as components 360, 380, and 370. Component 380 can be anisotropic conductive adhesive, but is not limited thereto.

[0041] exist Figure 5 In the middle, the flexible electronic packaging device 400 includes Figure 4 The flexible electronic packaging device 400 includes all components 310-380, and also includes component 390. Component 390 is, for example, a sensing electrode. Component 390 (sensing electrode) is disposed on component 330 (second flexible carrier) and located on the side of component 330 (second flexible carrier) away from component 320 (first flexible carrier). The material of the sensing electrode includes biocompatible materials. When the flexible electronic packaging device 400 is disposed on the surface of an application carrier, component 390 can face the user and is positioned to contact the user. For example, when the application carrier is a wearable item, the flexible electronic packaging device 400 is positioned on the wearable item with component 390 located closer to the wearer.

[0042] Figure 4 The flexible electronic packaging device 300 can be adopted Figure 1 and Figure 2 The method is used for design. Figure 4 For the flexible electronic packaging device 300, it can be based on Figure 2 In step S112, the bending stress value (S) at the set initial bending radius (Ri) is calculated for components 310 to 380 respectively. max And as described in steps S116 and S118, the permissible bending radius (R) of the flexible electronic packaging device is determined. tol _ Sip After that, it can be relied upon. Figure 1The method determines whether the flexible electronic packaging device 300 is suitable for mounting on a selected portion of the application carrier. Of course, Figure 5 The flexible electronic packaging device 400 can also be designed using the above method.

[0043] Figure 6 This is a schematic diagram of a flexible electronic packaging device according to some embodiments of the present invention. Figure 6 In this flexible electronic packaging device 500, in addition to all components 310-390 of the aforementioned flexible electronic packaging device 400, it also includes components 312, 342, and 352. Component 312 is, for example, an electronic assembly, including an integrated circuit, a passive component, a sensing component, etc. Component 342 can be a conductive connector used to bond component 312 to component 320 and electrically connect component 342 to component 320. Component 352 can be disposed between component 312 and component 320 and used to fill the gap between components 342. In some embodiments, components 310 and 312 are also electronic assemblies, but can be used for different functional operations. Component 342 and 340 are also conductive connectors and may have the same or different structures and / or materials. Component 352 and 350 are both fillers, but may have the same or different materials. Figure 6 The flexible electronic packaging device 500 can be adopted Figure 1 and Figure 2 The design and manufacturing methods enable the flexible electronic packaging device 500 to have an ideal service life after being placed on the application carrier.

[0044] Figure 7 This is a schematic diagram illustrating a flexible electronic packaging device disposed on an application carrier according to an embodiment of the present invention. Figure 7 In this context, the flexible electronic packaging device 600 is, for example, disposed on the application carrier 700. Specifically, the application carrier 700, in its actual use state, has selected portions 710 and 720 with different surface curvatures, wherein... Figure 7 The illustration is illustrative, with the minimum surface curvature of selected portion 710 being greater than that of selected portion 720, and the flexible electronic package 600 is intended to be disposed on the application carrier 700 in a manner that spans across selected portion 710 and selected portion 720. In other words, the first portion 610 of the flexible electronic package 600 is, for example, disposed on selected portion 710, and the second portion 620 of the flexible electronic package 600 is, for example, disposed on selected portion 720.

[0045] When manufacturing the flexible electronic packaging device 600, it is possible to first refer to... Figure 1 The method determines whether the first portion 610 of the flexible electronic packaging device 600 is appropriately configured in the selected portion 710, and then, based on... Figure 1The method determines whether the second portion 620 of the flexible electronic package device 600 is appropriately configured in the selected portion 720. Both the first portion 610 and the second portion 620 are... Figure 1 After step S130 determines that the condition is met, the flexible electronic packaging device 600 can be disposed on the application carrier 700. That is to say, different parts of the flexible electronic packaging device 600 can be designed according to the surface shape of the selected parts that are predetermined to be disposed.

[0046] For example, it can be based on Figure 1 Step S110 and Figure 2 The method for determining the permissible bending radius (R) of the first part 610 of the flexible electronic packaging device 600 is as follows. tol _ Sip ). And, according to Figure 1 Step S120: Calculate the minimum surface radius of curvature (R) of the selected portion 710. min _ C Next, with Figure 1 Step S130 determines the permissible bending radius (R) of the first part 610. tol _ Sip The minimum surface radius of curvature (R) of the selected portion 710 min _ C The judgment is made based on the allowable bending radius (R). tol _ Sip ) greater than the minimum surface radius of curvature (R) min _ C If the design of the first part 610 of the electronic packaging device 600 is not correct, then the design needs to be changed. For example, the structure, material, or both of the first part 610 need to be changed, and the above steps need to be repeated after the change until the determination result of step S130 is yes.

[0047] Furthermore, the second part 620 and selected part 720 of the flexible electronic packaging device 600 are also analyzed, judged, and even redesigned according to the above steps until the allowable bending radius (R) of the second part 620 is determined. tol _ Sip The minimum surface radius of curvature (R) of the selected portion is less than or equal to 720. min _ C Until (after the judgment in step S130, it is possible to proceed to step S140). Both the first part 610 and the second part 620 are... Figure 1After step 130 is determined to be "yes", the flexible electronic packaging device 600 can be placed on the application carrier 700, with the first part 610 correspondingly placed on the selected part 710 and the second part 620 correspondingly placed on the selected part 720. Thus, although the selected parts 710 and 720 of the application carrier 700 are non-planar in use and / or wear conditions, the flexible electronic packaging device 600 is not easily damaged by bending stress. Therefore, the flexible electronic packaging device 600 can have an ideal service life.

[0048] Figures 8 to 11 This illustration demonstrates an implementation method where a flexible electronic packaging device is disposed on an application carrier. Figure 8 In this embodiment, a flexible electronic packaging device 810 is disposed, for example, on an application carrier 820, wherein the application carrier 820 is, for example, a headband. When the application carrier 820 is worn, it conforms to the curve of the wearer's head. Therefore, the minimum surface radius of curvature of the portion on which the flexible electronic packaging device 810 is disposed approximately corresponds to the curve of the user's head. The flexible electronic packaging device 810 can be based on... Figure 1 and Figure 2 The method of manufacturing, in which, during the process Figure 1 In step S120, the application carrier 820 can be first placed on the head-shaped mold 830, and then the surface curvature radius of the selected part can be scanned to obtain the minimum surface curvature radius (R). min _ C ).

[0049] exist Figure 9 In this embodiment, a flexible electronic encapsulation device 910 is disposed, for example, on an application carrier 920, which is, for example, upper torso clothing, and the flexible electronic encapsulation device 910 is to be disposed, for example, on the chest portion (selected portion) of the clothing. When the application carrier 920 is worn, the application carrier 920 will, for example, conform to the curve of the wearer's upper torso. Therefore, the minimum surface radius of curvature of the selected portion on which the flexible electronic encapsulation device 910 is to be disposed corresponds, for example, approximately to the curve of the user's chest portion. In some embodiments, the flexible electronic encapsulation device 910 may be based on... Figure 1 and Figure 2 The method involves using a human-shaped mold 930 to expand the application carrier 920 into a wearable state, and then scanning the surface of the selected portion (chest portion) of the flexible electronic packaging device 910 to be installed. Figure 1 Step S120 obtains the minimum surface curvature radius (R) min _ C ).

[0050] exist Figure 10In this embodiment, a flexible electronic encapsulation device 1010 is disposed, for example, on an application carrier 1020, wherein the application carrier 1020 is, for example, a pair of athletic pants, and the flexible electronic encapsulation device 1010 is to be disposed, for example, on the hip portion of the athletic pants. When the application carrier 1020 is worn, the application carrier 1020 will, for example, conform to the curves of the wearer's hips and legs. Therefore, the minimum surface radius of curvature of the selected portion on which the flexible electronic encapsulation device 1010 is to be disposed corresponds, for example, approximately to the curve of the user's hip portion. In some embodiments, the flexible electronic encapsulation device 1010 may be based on Figure 1 and Figure 2 The method involves using a human-shaped mold 1030 to expand the application carrier 1020 into a wearable state, and then scanning the surface of the selected portion of the flexible electronic packaging device 1010 to be installed. Figure 1 Step S120 obtains the minimum surface curvature radius (R) min _ C ).

[0051] exist Figure 11 In this design, flexible electronic packaging devices 1110 and 1120 are disposed, for example, on an application carrier 1130, which is, for example, a shoe. Flexible electronic packaging device 1110 is to be disposed, for example, on the heel portion of the shoe, and flexible electronic packaging device 1120 is to be disposed, for example, on the arch portion of the shoe. The application carrier 1130 itself is a three-dimensional object, having curved surfaces in both the heel and arch portions. Therefore, flexible electronic packaging device 1110 can correspond to the curved surface design of the heel portion, and flexible electronic packaging device 1120 can correspond to the curved surface design of the arch portion. In other words, [the process involves...]. Figure 1 When using this method, the heel and arch portions of the shoe can be scanned to obtain the corresponding minimum surface curvature radius (R). min _ C ).

[0052] In summary, the manufacturing method of the flexible electronic packaging device in this embodiment of the invention determines whether the flexible electronic packaging device is suitable for placement on a selected part of the application carrier based on the characteristics of the flexible electronic packaging device and the surface condition of the application carrier, so that the flexible electronic packaging device is not easily damaged by the bending state of the application carrier during use, thereby having an ideal service life.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method of manufacturing a flexible electronic package device, characterized by, The method for obtaining the minimum surface radius of curvature of the selected portion of the application carrier includes scanning the selected portion of the application carrier in a worn state to obtain the surface radius of curvature of individual surfaces in the selected portion, and selecting the minimum one from the surface radius of curvature as the minimum surface radius of curvature. The method for determining the soft electronic packaging device disposed on the selected portion includes: setting an initial bending radius, and calculating the bending stress value of each component in the soft electronic packaging device under the initial bending radius, wherein the initial bending radius is smaller than the minimum surface radius of curvature; determining the maximum allowable stress value of each component; the bending stress value of each component is determined to be less than or equal to the maximum allowable stress value, and the soft electronic packaging device disposed on the selected portion is determined; and the soft electronic packaging device is disposed on the selected portion, The method for obtaining the minimum surface radius of curvature of the selected portion of the application carrier includes scanning the selected portion of the application carrier in a worn state to obtain the surface radius of curvature of individual surfaces in the selected portion, and selecting the minimum one from the surface radius of curvature as the minimum surface radius of curvature, The soft electronic packaging device includes a plurality of components, the plurality of components including a first soft carrier plate and an electronic component bonded to the first soft carrier plate, the plurality of components further including a second soft carrier plate, the first soft carrier plate being bonded to the second soft carrier plate, and the electronic component being electrically connected to the first soft carrier plate and the second soft carrier plate. The application carrier is a three-dimensional object.

2. The method of manufacturing a flexible electronic package device according to claim 1, wherein The component includes a first soft carrier plate and an electronic component bonded to the first soft carrier plate.

3. The method of manufacturing a flexible electronic package device according to claim 1, wherein The component further includes a second soft carrier plate, the first soft carrier plate being bonded to the second soft carrier plate, and the second soft carrier plate being larger in size than the first soft carrier plate.

4. The method of manufacturing a flexible electronic package device according to claim 3, wherein The component further includes a sensing electrode, the sensing electrode being disposed on the second soft carrier plate, and the material of the sensing electrode including a biocompatible material.

5. The method of manufacturing a flexible electronic package device according to claim 4, wherein The sensing electrode is located on the outer side of the second soft carrier plate away from the first soft carrier plate.

6. The method of manufacturing a flexible electronic package device according to claim 5, wherein The application carrier includes a wearable article.

7. The method of manufacturing a flexible electronic package device according to claim 1, wherein The wearable article includes a headband, a shirt, pants, or shoes.

8. The method of manufacturing a flexible electronic package device according to claim 7, wherein ​

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