A processing technology of SiP module structure and SiP module structure

Abstract

The embodiments of the present invention disclose a processing technology for a SiP module structure and a SiP module structure, wherein the SiP module structure includes components, a packaging substrate, and a metal tube shell, and the processing technology includes: preparing the metal tube shell, module assembly, and potting; obtaining an assembly module by assembling the substrate and components, and placing the assembly module in the metal tube shell, with a cavity between the assembly module and the inner wall of the metal tube shell; injecting glue into the cavity so that the glue covers all cavities inside the SiP module structure; and performing exhaust treatment and curing treatment on the metal tube shell after glue injection to obtain the SiP module structure of the specific structure. The present invention proposes a lightweight metal tube shell potting SiP module structure and processing technology based on potting process technology, which has the characteristics of simple assembly process, low equipment dependence, strong overshoot resistance, strong environmental adaptability, and low cost.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic module design and packaging, and particularly relates to a processing technology of a SiP module structure and a SiP module structure. Background Art

[0002] A digital signal processing (DSP) chip is a system integration module that integrates multiple chips that form a complete functional system into a single package. The biggest difference between different SiP types is the packaging format, with the most common packaging types being metal, ceramic, and plastic.

[0003] Metal and ceramic packages are generally fully sealed cavity structures, meaning the outer shell is made of metal or ceramic material, and the interior of the shell is a cavity structure. The carrier of the internal chip is called the substrate, which is generally made of thin film, thick film, and ceramic substrates. Sometimes the wiring function of the substrate is implemented on the ceramic shell, which is called an integrated ceramic shell and tube. The metal and ceramic package SiP module structure uses bonding (wire bonding) and flip chip (flip chip) processes on the substrate to assemble the chip to the substrate. Finally, a packaging process such as parallel sealing or laser sealing is used to seal the entire cavity. In terms of external lead-out form, metal package SiP is generally plug-in, while ceramic package SiP has a variety of forms, including plug-in, CBGA, CCGA, etc.

[0004] Plastic-encapsulated SiP (or "plastic-encapsulated SiP") modules are solid, non-encapsulated structures without a shell. Chips are assembled on an IC carrier board through bonding and flip-chip processes. The bare chips are then encapsulated with plastic compound through high-pressure injection molding to solidify the chips and bonding wires. Finally, the modules are cut to form independent plastic-encapsulated SiP modules. Plastic-encapsulated SiP modules typically use BGA connectors for external terminals.

[0005] Defects of the existing technology:

[0006] The metal package and ceramic package SiP module structures have the following structural problems:

[0007] Due to the presence of metal tube shells (usually made of steel) and ceramic tube shells, the package size and weight are large, and the device installation requirements are high;

[0008] The internal cavity structure results in poor overshoot resistance, and failures such as bonding wire adhesion and disconnection may occur in high overload applications;

[0009] The tube shell manufacturing process is complicated and has a great impact on the cost;

[0010] Internal flip-chip soldering and bonding processes are both bare chip assembly processes, which have high requirements on the equipment and environment of the assembly process line, resulting in higher production costs. Summary of the Invention

[0011] The present invention provides a processing technology of a SiP module structure and a SiP module structure, so as to solve the above technical problems.

[0012] In a first aspect, an embodiment of the present invention discloses a processing technology for a SiP module structure, wherein the SiP module structure includes components, a packaging substrate, and a metal tube shell, and the processing technology includes:

[0013] preparing a metal tube shell;

[0014] An assembly module is manufactured by assembling a packaging substrate and components, and the assembly module is placed in a metal tube shell, with a cavity being formed between the assembly module and the inner wall of the metal tube shell;

[0015] Injecting glue into the cavity so that the glue fills all the cavities inside the SiP module structure;

[0016] The metal tube shell after the glue injection is subjected to exhaust treatment and curing treatment to obtain the SiP module structure.

[0017] Optionally, the steps of preparing the metal tube shell include:

[0018] Obtain a metal sheet; form an open cavity structure through die stamping; and perform electroplating or anodizing surface treatment on the open cavity structure to obtain the metal tube shell.

[0019] Optionally, the step of assembling the packaging substrate and components to obtain an assembly module includes:

[0020] Select a multi-layer PCB board as the packaging substrate;

[0021] Obtain a double-sided PCB board as a transfer substrate; the transfer substrate is connected to the packaging substrate;

[0022] Using the package substrate as a carrier, mounting circuits and / or passive components on both sides of the package substrate;

[0023] The transfer substrate is fixedly connected to the mounted packaging substrate to obtain the SiP module structure.

[0024] Optionally, glue is injected into the cavity so that the glue fills all the cavities inside the SiP module structure;

[0025] The glue completely covers the packaging substrate, the mounting circuit and / or the passive components, and also covers a portion of the transfer substrate.

[0026] Optionally, the step of mounting circuits and / or passive components on both sides of the package substrate may employ a standard reflow soldering process.

[0027] Optionally, the transfer substrate is fixedly connected to the mounted package substrate by:

[0028] Solder paste is applied on the packaging substrate and the transfer substrate to perform reflow soldering, so that the transfer substrate is fixed on the packaging substrate by welding.

[0029] Optionally, the structure of the packaging substrate is a rounded rectangular structure.

[0030] In a second aspect, the present application provides a SiP module structure, which is manufactured by the above-mentioned SiP module structure processing technology, including:

[0031] Metal tube shell;

[0032] An assembly module is placed in the metal tube shell, and a cavity exists between the assembly module and the side wall of the metal tube shell;

[0033] The potting compound is filled in the cavity and is used to fix the assembly module in the metal tube shell.

[0034] Optionally, the assembly module includes:

[0035] Package substrate;

[0036] The transfer substrate is fixed on the packaging substrate and connected to the packaging substrate for leading out signals from the packaging substrate.

[0037] Optionally, also include:

[0038] The integrated chip is welded on the packaging substrate.

[0039] The embodiment of the present invention discloses a processing technology for a SiP module structure, wherein the SiP module structure includes a SiP module structure and a metal tube shell, and the processing technology includes: preparing a metal tube shell; obtaining a SiP module structure, and placing the SiP module structure in the metal tube shell so that there is a cavity between the SiP module structure and the inner wall of the metal tube shell; injecting glue into the cavity so that the glue covers the SiP module structure; and performing exhaust treatment and curing treatment on the metal tube shell after the glue injection to obtain the SiP module structure. The present invention combines the advantages and disadvantages of existing SiP packaging technology and proposes a lightweight metal tube shell encapsulation SiP design structure and manufacturing method based on encapsulation process technology, which has the characteristics of simple assembly process, low equipment dependence, strong overshoot resistance, strong environmental adaptability, and low cost. Compared with ceramic-sealed and metal-sealed SiP module structures, its packaging shell is lightweight and low-cost, its packaging process has low requirements for equipment and production lines, the packaging process is simple, and the packaging materials are low-cost; compared with the plastic-sealed SiP module structure, it mainly improves the moisture absorption problem of the plastic packaging material, which can greatly enhance its environmental adaptability, has low investment and cost in small-batch development, and has obvious economic advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a processing flow chart of a SiP module structure provided in this embodiment.

[0041] Figure 2 This is a cross-sectional view of a SiP module structure provided in this embodiment.

[0042] Figure 3 This is a bottom view of a SiP module structure provided in this embodiment. DETAILED DESCRIPTION

[0043] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0044] Reference Figure 1 , showing the embodiment provided Figure 1 This is a process flow chart of a SiP module structure provided by this embodiment. Figure 2 , shows a cross-sectional view of a SiP module structure provided by this embodiment; refer to Figure 3 , showing a bottom view of a SiP module structure provided by this embodiment.

[0045] It should be noted that the plastic-encapsulated SiP module structure is manufactured using existing semiconductor plastic encapsulation process lines and uses high-pressure injection molding to solidify the package body, but the design incorporates multiple bare chips. Because this structure lacks a tube shell, its advantages over metal and ceramic packaging include high integration density, light weight, strong overload resistance, and low mass production costs. However, its shortcomings compared to ceramic and metal packaging are mainly as follows: First, the non-sealed plastic encapsulation structure means that the plastic encapsulation material will slowly absorb moisture when exposed to the environment over a large area, resulting in delamination and even a popcorn effect in later use, which directly limits its service life and application reliability. Second, the product structure is limited and the form is single. Due to material stress, bubbles, delamination, and punching failure are very likely to occur when the number of stacked layers in a three-dimensional assembly is large. When the module size is large, substrate cracking or solder joint cracking may occur under thermal mismatch stress, which directly affects the product yield and application reliability.

[0046] In this exemplary embodiment, a processing technology and SiP module structure of a SiP module structure disclosed in an embodiment of the present invention, wherein the SiP module structure includes components, a packaging substrate, and a metal tube shell, and the processing technology includes: preparing the metal tube shell, module assembly, and potting; obtaining an assembly module by assembling the substrate and components, and placing the assembly module in the metal tube shell, with a cavity between the assembly module and the inner wall of the metal tube shell; injecting glue into the cavity so that the glue covers all the cavities inside the SiP module structure; and performing exhaust treatment and curing treatment on the metal tube shell after glue injection to obtain the SiP module structure of the specific structure. The present invention proposes a lightweight metal tube shell potting SiP module structure and processing technology based on potting process technology, which has the characteristics of simple assembly process, low equipment dependence, strong overshoot resistance, strong environmental adaptability, and low cost.

[0047] like Figure 1 As shown, in a first aspect, an embodiment of the present invention discloses a processing technology for a SiP module structure, wherein the SiP module structure includes components, a packaging substrate, and a metal tube shell, and the processing technology includes: steps S101 to S104.

[0048] Step S101: Prepare a metal tube shell.

[0049] In this exemplary embodiment, the tube shell manufacturing process is as follows: the tube shell of the SiP module structure shown in the present invention is made of metal material, is formed into an open cavity structure after die stamping, and is then formed after electroplating or anodizing surface treatment process.

[0050] Step S102: Assembling the packaging substrate and components to obtain an assembly module, and placing the assembly module in a metal tube shell, with a cavity between the assembly module and the inner wall of the metal tube shell.

[0051] In this exemplary embodiment, the packaging substrate of the SiP module structure shown in the present invention typically utilizes a multi-layer PCB, with circuits mounted on one or both sides, and electrical connections between the circuits are achieved through internal multi-layer wiring. The adapter substrate typically utilizes a double-sided PCB, with signal connections on both sides achieved through PCB holes. The packaging substrate and adapter substrate are connected using a BGA format. The substrate has a rounded rectangular structure, and the substrate size is slightly smaller than the internal dimensions of the tube shell. After drying, the packaging substrate is used as a carrier, and the circuits and passive components are mounted on both sides using a standard reflow soldering process. Solder paste is then applied to the packaging substrate and adapter substrate and reflow soldered to achieve the connection between the two substrates.

[0052] Step S103: injecting glue into the cavity so that the glue fills all the cavities inside the SiP module structure.

[0053] In this example implementation, after the module is welded, the module is placed in a metal shell. After limiting and leveling, one of the four corners is selected as the glue injection port, and the other three openings are used as air outlets. The glue is slowly injected until it is completely leveled, and then the center area is filled with glue so that the liquid level completely covers the device and does not exceed the adapter substrate.

[0054] Step S104: performing exhaust treatment and curing treatment on the metal tube shell after glue injection to obtain the SiP module structure.

[0055] In this exemplary embodiment, after the glue injection process is completed, the material is placed in a vacuum drying oven for exhaust and curing.

[0056] This invention combines the advantages and disadvantages of existing SiP packaging technologies to propose a lightweight metal tube-encapsulated SiP design structure and manufacturing method based on potting technology. This design features a simple assembly process, low equipment dependence, strong overshoot resistance, strong environmental adaptability, and low cost. Compared to ceramic-encapsulated and metal-encapsulated SiP module structures, the encapsulated shell is lightweight and low-cost, the encapsulation process has low requirements for equipment and production lines, the encapsulation process is simple, and the encapsulation materials are low-cost. Compared to plastic-encapsulated SiP module structures, the design primarily improves the moisture absorption problem of the plastic encapsulation material, significantly enhancing its environmental adaptability. Low investment and low cost are required for small-batch production, offering significant economic advantages.

[0057] In one embodiment, the steps of preparing the metal shell include:

[0058] Obtain a metal sheet; form an open cavity structure through die stamping; and then obtain the metal shell through electroplating or anodizing surface treatment.

[0059] In a specific embodiment, the steps of assembling the packaging substrate and components to prepare the assembly module include:

[0060] A multi-layer PCB board is selected as the packaging substrate, and circuits are mounted on one or both sides of the PCB board; the PCB boards on each layer are connected by circuits.

[0061] A double-sided PCB board is obtained as a transfer substrate; the transfer substrate is connected to the packaging substrate.

[0062] The packaging substrate is used as a carrier, and circuits and / or passive components are mounted on both sides of the packaging substrate.

[0063] The transfer substrate is fixedly connected to the mounted packaging substrate to obtain the assembly module.

[0064] In a specific embodiment, the step is to inject glue into the cavity so that the glue fills all the cavities inside the SiP module structure, and the glue completely covers the packaging substrate, the mounting circuit and / or the passive components, and covers part of the transfer substrate.

[0065] In a specific embodiment, the step of mounting circuits and / or passive components on both sides of the package substrate uses a standard reflow soldering process to mount circuits and / or passive components on both sides.

[0066] In a specific embodiment, the transfer substrate is fixedly connected to the mounted package substrate in the following manner:

[0067] Solder paste is applied on the packaging substrate and the transfer substrate to perform reflow soldering, so that the transfer substrate is fixed on the packaging substrate by welding.

[0068] In a specific embodiment, the package substrate has a rounded rectangular structure.

[0069] In the second aspect, the present application provides a SiP module structure, which is manufactured by the above-mentioned SiP module structure processing technology, including: a metal tube shell; an assembly module, which is placed in the metal tube shell and has a cavity between it and the side wall of the metal tube shell; and a potting compound, which is filled in the cavity and is used to fix the assembly module in the metal tube shell.

[0070] In this example implementation, see Figure 2 、 Figure 3 ; Figure 2 Among them, 1. It is a metal tube shell, usually made of metal material, with a rectangular cavity structure; 2. It is a SiP module structure, usually a plastic-sealed circuit, with no limit on the welding form; 3. It is a potting compound, and the internal cavity part is completely filled with potting compound.

[0071] In a specific embodiment, the assembly module includes: a packaging substrate; and a transfer substrate fixed to the packaging substrate and connected to the packaging substrate for leading out signals from the packaging substrate.

[0072] In this example implementation, see Figure 2 , Figure 3 In the figure, the four corners shown in 3 are the injection ports and air outlets for potting; 4 is the packaging substrate, which is usually a PCB board, but can also be an IC carrier board or other substrate, with a rounded rectangular structure; 5 is the adapter substrate, which is used to lead out the signal from the packaging substrate, usually a PCB board, with a ring structure.

[0073] In one embodiment, the device further includes an integrated chip integrated on the package substrate. Users can select the integrated chip based on actual usage requirements. Users can select the model of the integrated chip based on the desired function and the chip performance required to achieve the function. This application does not limit the type of the integrated chip.

[0074] The encapsulated SiP module structure implemented by the present invention has the following advantages:

[0075] 1. Introducing a lightweight metal package shell into the module structure to cover the top and sides of the module, combined with the bottom filling process in the module solder plate application, can avoid the moisture absorption problem caused by the large area of ​​plastic packaging material exposed in the traditional plastic package SiP module structure, making it more reliable and longer service life.

[0076] 2. The module assembly adopts the most commonly used reflow soldering process for PCB soldering. Compared with the traditional metal packaging, ceramic packaging and plastic package SiP packaging production lines, the process is simple and efficient, with low requirements for equipment and production space, and low investment in packaging lines.

[0077] 3. Low packaging cost, mainly manifested in:

[0078] Using PCB as the packaging substrate has no mold opening fee, lower engineering costs and shorter processing cycle compared to ceramic substrates and IC carrier boards.

[0079] Using a stamped metal tube shell as the packaging shell has a simpler process and lower cost than ceramic packaging shells and traditional metal packaging shells.

[0080] The module assembly adopts the reflow process, which is simpler and lower in cost than the bonding and FC processes.

[0081] Compared with high-pressure injection molding, potting has lower requirements for site and equipment, and the cost of small-batch development is lower.

[0082] In summary, the SiP module structure of the encapsulation process realized by the present invention has the overshoot resistance of traditional plastic-encapsulated circuits and the long-term reliability of ceramic and metal-encapsulated circuits through optimization of the packaging structure, packaging substrate, process flow, etc., while having the advantages of small batch and low cost, which can further reduce the application cost and application field of SiP.

[0083] It should be noted that the embodiments described above are only some of the embodiments of the application, not all of the embodiments. Based on the embodiments in the application, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the application. Each embodiment in this specification focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced.

Claims

1. A processing technology for a SiP module structure, the SiP module structure comprising: Components, packaging substrates, and metal tube shells, characterized in that the processing technology includes: Prepare a metal tube shell; the steps of preparing the metal tube shell include: obtaining a metal sheet, and punching the metal sheet through a mold to form an open cavity structure to obtain the metal tube shell; An assembly module is obtained by assembling a packaging substrate and components. The steps of assembling the packaging substrate and components to obtain the assembly module include: selecting a multi-layer PCB board as a packaging substrate, wherein the packaging substrate has a rounded rectangular structure; obtaining a double-sided PCB board as a transfer substrate; connecting the packaging substrate and the transfer substrate in a BGA format; using the packaging substrate as a carrier, mounting circuits and / or passive components on both sides of the packaging substrate, and using a standard reflow soldering process to mount the circuits and / or passive components on both sides; the transfer substrate has a ring structure, and the transfer substrate is fixedly connected to the mounted packaging substrate to obtain the assembly module. Placing the assembly module in a metal tube shell, with a cavity between the assembly module and the inner wall of the metal tube shell; Injecting glue into the cavity so that the glue fills all the cavities inside the SiP module structure. The step of injecting glue into the cavity so that the glue fills all the cavities inside the SiP module structure includes: after limiting and leveling, selecting one of the four corners as a glue injection port and the other three openings as air outlets, slowly injecting glue until it is completely leveled, and then filling the center area with glue so that the liquid level completely covers the device and does not exceed the transfer substrate; The metal tube shell after the glue injection is subjected to exhaust treatment and curing treatment to obtain the SiP module structure.

2. The processing technology of the SiP module structure according to claim 1, characterized in that: In the step of injecting glue into the cavity to fill all the cavities inside the SiP module structure, the glue completely covers the packaging substrate, the mounting circuit and / or the passive components, and partially covers the transfer substrate.

3. The processing technology of the SiP module structure according to claim 1, characterized in that: In the step of fixing the transfer substrate to the mounted package substrate, the fixing method used is: Solder paste is applied on the packaging substrate and the transfer substrate for reflow soldering, so that the transfer substrate is fixed on the packaging substrate by soldering.

4. A SiP module structure, manufactured by the processing technology of the SiP module structure according to any one of claims 1 to 3, characterized in that: include: Metal tube shell; An assembly module is placed in the metal tube shell, and a cavity exists between the assembly module and the side wall of the metal tube shell; The potting compound is filled in the cavity and is used to fix the assembly module in the metal tube shell.

5. The SiP module structure according to claim 4, characterized in that: The assembly module includes: Package substrate; The transfer substrate is fixed on the packaging substrate and connected to the packaging substrate for leading out signals from the packaging substrate.

6. The SiP module structure according to claim 5, characterized in that: Also includes: The integrated chip is welded on the packaging substrate.

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