Touch panel and touch display device

Abstract

Embodiments of the present invention disclose a touch panel and touch display device. In one specific embodiment, the touch panel includes a touch integrated circuit, a touch area, a routing area, and a bonding area formed on a substrate. The bonding area includes a shielding trace and a shielding pad electrically connected to a shielding signal pin of the touch integrated circuit. The shielding trace is electrically connected to the shielding pad. The shielding pad is formed from a first transparent conductive layer that extends to the routing area. The projection of the first transparent conductive layer extending to the routing area on the substrate covers the projection of at least some of the routing traces in the routing area on the substrate. This embodiment can reduce noise interference.

Description

Technical Field

[0001] The present invention relates to the field of touch technology, and more particularly, to a touch panel and a touch display device. Background Art

[0002] In recent years, with the growing demand for human-computer interaction, the market demand for touch-enabled display devices has also grown. Generally speaking, to achieve touch functionality, a display device usually needs to consist of the following components: a touch sensor, a touch flexible circuit board, and a touch integrated circuit. The touch sensor has a bonding area for bonding to the touch flexible circuit board, which is used to connect the touch sensor and the touch integrated circuit to achieve touch driving and detection.

[0003] However, current touch display devices use capacitive touch screens, which often fail ESD tests during device verification. Alternatively, during device debugging, the complexity of the experimental environment and the high ambient noise can lead to unstable touch performance during debugging. Summary of the Invention

[0004] An object of the present invention is to provide a touch panel and a touch display device to solve at least one of the problems existing in the prior art.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A first aspect of the present invention provides a touch panel, comprising a touch integrated circuit, and further comprising a touch area, a routing area, and a bonding area formed on a substrate, wherein the bonding area comprises a shielding routing wire and a shielding pad electrically connected to a shielding signal pin of the touch integrated circuit, the shielding routing wire being electrically connected to the shielding pad;

[0007] The shielding pad is formed by a first transparent conductive layer, and the first transparent conductive layer extends to the routing area. The projection of the first transparent conductive layer extending to the routing area on the substrate covers the projection of at least part of the routing in the routing area on the substrate.

[0008] The touch panel provided in the first aspect of the present invention increases the anti-static performance of the touch panel and reduces noise interference without increasing costs, thereby improving the signal-to-noise ratio of the touch panel by providing shielding traces and shielding pads electrically connected to the shielding signal pins of the touch integrated circuit in the bonding area.

[0009] Optionally, the shielding trace extends to the trace area.

[0010] This optional method can enhance the side protection of the touch panel.

[0011] Optionally, a projection of the first transparent conductive layer extending to the routing area on the substrate covers a projection of the shielding routing extending to the routing area on the substrate.

[0012] This optional method can reduce noise interference on both sides of the module, while increasing the ESD release path and strengthening the side protection of the touch panel.

[0013] Optionally, the projection of the first transparent conductive layer extending to the wiring area on the substrate covers the projection of all wirings extending to the wiring area on the substrate.

[0014] This optional approach can enhance ESD resistance and signal shielding capability by providing a first transparent conductive layer to cover all traces in the trace area.

[0015] Optionally, the shielding traces of the bonding area are located at both side edges of the bonding area, and the shielding traces extending to the routing area are located at the edge of the routing area.

[0016] Optionally, a projection of the shielding pad on the substrate covers a projection of the shielding trace of the bonding area on the substrate.

[0017] Optionally, the bonding area further includes a ground trace and a ground pad connected to a ground signal pin of the touch integrated circuit, the ground trace is electrically connected to the ground pad, and the ground trace extends to the trace area.

[0018] Optionally, a projection of the ground pad on the substrate covers a projection of the ground trace on the substrate.

[0019] Optionally, the ground pad is formed by a second transparent conductive layer, and the second transparent conductive layer is provided in the same layer as the first transparent conductive layer.

[0020] Optionally, the touch integrated circuit is configured to electrically connect the shielding signal pin to the ground signal pin in response to a switching instruction.

[0021] This optional method can optimize the anti-noise capability or anti-static capability through the switching instructions of the touch integrated circuit, further increase the touch panel's anti-ESD capability, further reduce noise interference, and improve the signal-to-noise ratio.

[0022] Optionally, the touch area includes a touch sensor, the routing area includes a signal lead connected to the touch sensor, the signal lead extends to the bonding area, the bonding area also includes a sensing pad electrically connected to the sensing signal pin of the touch integrated circuit, and the sensing pad is electrically connected to the signal lead extending to the bonding area.

[0023] Optionally, the touch panel is a capacitive touch panel.

[0024] A second aspect of the present invention provides a touch display device, comprising the touch module according to the first aspect of the present invention.

[0025] The beneficial effects of the present invention are as follows:

[0026] The technical solution of the present invention reduces noise interference and improves the signal-to-noise ratio of the touch panel without increasing costs by providing shielding traces and shielding pads electrically connected to the shielding signal pins of the touch integrated circuit in the bonding area. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0028] Figure 1 A schematic diagram showing the structure of a touch panel in the prior art

[0029] Figure 2 Show Figure 1 Schematic diagram of a cross-section of a touch panel along the horizontal cross-section of the routing area.

[0030] Figure 3 A schematic structural diagram of a touch panel provided by an embodiment of the present invention is shown.

[0031] Figure 4 Show Figure 3 Schematic diagram of a cross-section of a touch panel along the horizontal cross-section of the routing area.

[0032] Figure 5 A schematic structural diagram of a touch panel provided by yet another embodiment of the present invention is shown.

[0033] Figure 6 Show Figure 5 Schematic diagram of a cross-section of a touch panel along the horizontal cross-section of the routing area.

[0034] Figure 7 A schematic structural diagram of a touch panel provided by yet another embodiment of the present invention is shown.

[0035] Figure 8 A schematic structural diagram of a touch panel provided by yet another embodiment of the present invention is shown.

[0036] Figure 9 Show Figure 8 Schematic diagram of the specific structure of the touch panel. DETAILED DESCRIPTION

[0037] In order to more clearly illustrate the present invention, the present invention will be further described below in conjunction with the embodiments and drawings. Similar components in the drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the following specific description is illustrative rather than restrictive and should not be used to limit the scope of protection of the present invention.

[0038] In recent years, with the growing demand for human-computer interaction, the market demand for touch-enabled display devices has also grown. Generally speaking, to achieve touch functionality, a display device usually needs to consist of the following components: a touch sensor, a touch flexible circuit board, and a touch integrated circuit. The touch sensor has a bonding area for bonding to the touch flexible circuit board, which is used to connect the touch sensor and the touch integrated circuit to achieve touch driving and detection.

[0039] Currently, common touch display devices on the market include smart watches, smart bracelets, smart glasses, smart jewelry, heart rate / blood pressure monitors, and sports cameras. As these products are updated and replaced, customers have higher requirements for touch display devices in terms of display effect, display area, module size, and touch performance.

[0040] However, current touch display devices use capacitive touch screens. Figure 1 FIG. 1 shows a schematic structural diagram of a touch panel in the prior art. Figure 2 Show Figure 1 A schematic cross-sectional view of the touch panel along the transverse cross-section of the wiring area, as shown in FIG. Figure 1 and Figure 2 As shown, the touch panel includes a touch area, a wiring area 20' and a bonding area 30'. Figure 1 Ground pads 2 are located at the edges of the bonding area on both sides. Ground pad A in the bonding area is connected to ground trace 1 in the bonding area. Ground trace 1 extends to trace area 20'. Between the ground pads 2 at the edges of the bonding area on both sides are: bonding pads corresponding to several Rx traces, bonding pads corresponding to the ground traces, bonding pads corresponding to several Tx traces, bonding pads corresponding to the ground traces, and bonding pads corresponding to several Rx traces. Among them, the bonding pads corresponding to the several Rx traces are connected to the several Rx traces through punching in the bonding area; the Rx traces are used to output touch sensor signals to the touch integrated circuit; the bonding pads corresponding to the ground traces are connected to the bonding area through punching; the bonding pads corresponding to the several Tx traces are connected to the several Tx traces through punching in the bonding area; the Tx traces are used to receive signals sent by the touch integrated circuit to the touch sensor. Figure 1In the figure, the Rx trace, GND trace, and Tx trace all extend to the trace area 20'; in the bonding area 30', the bonding pad corresponding to the Rx trace is connected to the Rx trace; the bonding pad corresponding to the ground trace is connected to the ground trace; the bonding pad corresponding to the Tx trace is connected to the Tx trace; in the trace area 20', the ground trace extending to the trace area 20' has an insulating layer between it and the trace area 20'; the Rx trace extending to the trace area 20' has an insulating layer between it and the trace area 20'; the Tx trace extending to the trace area 20' has an insulating layer between it and the trace area 20'. Figure 2 As shown, the substrate is 101, 104 is the signal routing in the routing area, including ground routing, Tx routing and Rx routing, and 102 and 103 are both insulating layers.

[0041] The touch panel often fails the ESD test during the whole machine verification; or during the whole machine debugging process, due to the complexity of the experimental environment and the high environmental noise, the touch performance during debugging is unstable.

[0042] Existing technologies address module ESD test failures and poor signal-to-noise ratios. Adding conductive fabric to the module or providing grounding area between the module and the entire device can improve electrostatic performance to a certain extent, but the increased film material increases bill of materials (BOM) costs. Debugging the entire device requires time and resources, extensive experimental verification, and low efficiency. The solution to improve the signal-to-noise ratio involves temporarily optimizing the firmware and raising the touch threshold to address customer debugging issues. This may increase customer verification time for touch performance and is inefficient.

[0043] In view of this, an embodiment of the present invention provides a touch panel, comprising a touch integrated circuit, and further comprising a touch area, a routing area, and a bonding area formed on a substrate, wherein the bonding area comprises a shielding routing line and a shielding pad electrically connected to a shielding signal pin of the touch integrated circuit, wherein the shielding routing line is electrically connected to the shielding pad;

[0044] The shielding pad is formed by a first transparent conductive layer, and the first transparent conductive layer extends to the routing area. The projection of the first transparent conductive layer extending to the routing area on the substrate covers the projection of at least part of the routing in the routing area on the substrate.

[0045] In a specific example, the touch panel provided by the embodiment of the present invention is a capacitive touch panel. Figure 3As shown, the touch panel includes a touch area, a wiring area 20 and a bonding area 30 formed on a substrate, wherein the touch area includes a touch sensor, which is a capacitive sensor, and the wiring area 20 includes a signal lead connected to the touch sensor, and the signal lead extends to the bonding area 30. The touch panel also includes a touch integrated circuit ( Figure 3 Not shown) and touch flexible circuit board ( Figure 3 The touch flexible circuit board is used to connect the touch sensor and the touch integrated circuit located in the touch area, thereby ensuring the touch performance of the touch panel.

[0046] In a specific example, Figure 3 In the bonding area 30, the shielding trace 31 is located at the edge positions on both sides of the bonding area and the shielding pad 32 is electrically connected to the shielding signal pin of the touch integrated circuit. The shielding trace 31 is electrically connected to the shielding pad 32; specifically, the shielding trace 31 and the shielding pad 32 of the bonding area 30 are electrically connected by punching.

[0047] The shielding pad 32 is formed by a first transparent conductive layer, and the first transparent conductive layer extends to the routing area 20. The projection of the first transparent conductive layer extending to the routing area 20 on the substrate covers the projection of at least part of the routing in the routing area 20 on the substrate.

[0048] In a specific example, the length and width of the shielding pad 32 are 0.47*0.14 mm, wherein the line width of the shielding trace 31 is 0.02 mm, and the first transparent conductive layer covers the shielding trace 31, and the line width is 0.024 mm.

[0049] Figure 3 In the figure, the shielding pad 32 is connected to the shielding trace 31 by punching, and the shielding pad 32 extends to the trace area 20, but the shielding trace 31 does not extend to the trace area 20. Therefore, the shielding trace 31 is connected to the shielding pad 32, and the shielding pad 32 is connected to the trace area 20, thereby realizing the connection between the shielding trace 31 and the trace area 20. Figure 2 The projection of the first transparent conductive layer extending to the routing area 20 on the substrate covers the projection of the routing corresponding to the shielding pad 32 in the routing area 20 on the substrate. Since the shielding routing does not cover the projection of all routings in the routing area 20 on the substrate, the shielding capability is relatively weak.

[0050] In one possible implementation, the bonding area 30 also includes a ground trace 33 and a ground pad 34 connected to the ground signal pin of the touch integrated circuit. The ground trace 33 is electrically connected to the ground pad 34. Specifically, the ground trace 33 of the bonding area 30 is electrically connected to the ground pad 34 by punching; the ground trace 33 extends to the routing area 20.

[0051] In a possible implementation, the ground pad 34 is formed by a second transparent conductive layer, and the second transparent conductive layer is provided in the same layer as the first transparent conductive layer.

[0052] In a specific example, Figure 3 In the figure, since the first transparent conductive layer extends to the routing area 20 and the second transparent conductive layer is arranged on the same layer as the first transparent conductive layer, the ground pad 34 also extends to the routing area 20, and the ground pad 34 is connected to the ground trace 33 by punching. The ground trace 33 also extends to the routing area 20, but there is an insulating layer between the ground trace extending to the routing area and the routing area. Therefore, the ground trace 33 is connected to the ground pad 34, and the ground pad 34 is connected to the routing area 20, thereby realizing the connection between the ground trace 33 and the routing area 20.

[0053] In a possible implementation, a projection of the ground pad 34 on the substrate covers a projection of the ground trace 33 on the substrate.

[0054] In a specific example, Figure 3 As shown, the line width of the second transparent conductive layer of the ground pad 34 is 0.024 mm, and the line width of the ground trace is 0.02 mm. Therefore, the projection area of ​​the ground pad 34 on the substrate is larger than the projection area of ​​the ground trace 33 on the substrate, that is, the projection of the ground pad 34 on the substrate covers the projection of the ground trace 33 on the substrate.

[0055] In a possible implementation, the shielding traces 31 of the bonding area 30 are located at both side edges of the bonding area.

[0056] In a specific example, the shielding pads 32 of the bonding area 30 are located at both side edges of the bonding area 30 , and the shielding traces 31 corresponding to the shielding pads 32 are also located at both side edges of the bonding area 30 .

[0057] In a possible implementation, the bonding area 30 further includes a sensing pad electrically connected to a sensing signal pin of the touch integrated circuit, and the sensing pad is electrically connected to a signal lead extending to the bonding area. Figure 3There is also a sensing pad corresponding to the Rx line for outputting the touch sensor signal to the touch integrated circuit between the shielding pad 32 and the grounding pad 34; there is also a sensing pad corresponding to the Tx line for receiving the signal sent by the touch integrated circuit to the touch sensor between the two grounding pads 34, wherein the sensing pad corresponding to the Rx line has several Rx lines extending to the line area 20, and the sensing pad corresponding to the Tx line has several Tx lines extending to the line area 20 ( Figure 3 (The sensing pads corresponding to the Rx traces, several Rx traces, sensing pads corresponding to the Tx traces, and several Tx traces are not shown.) The circuit connections corresponding to the sensing pads are specifically as follows: the receiving pin of the touch integrated circuit is connected to the sensing pad corresponding to the Rx trace in bonding area 30. The Rx trace sensing signal is connected to the sensing pad and then, through the traces, to the touch flexible circuit board. The signal output by the capacitive touch sensor is sent from the trace area 20 to the sensing pad corresponding to the Tx trace in bonding area 30. The sensing pad corresponding to the Tx trace is connected to the touch integrated circuit through the touch flexible circuit board.

[0058] In a specific example, three sensing signals Rx are grouped together and located in sensing pads corresponding to Rx traces; three sensing signals Tx are grouped together and located in sensing pads corresponding to Tx traces; and a ground trace is between the three sensing signals Rx and the three sensing signals Tx.

[0059] In a possible implementation manner, a projection of the first transparent conductive layer extending to the wiring area on the substrate covers a projection of at least part of the wiring in the wiring area on the substrate.

[0060] In a specific example, Figure 4 As shown, 104 above the substrate 101 is part of the routing area, including shielding routing, grounding routing, Rx routing and Tx routing, 102 and 103 are insulating layers, and 105 is a first transparent conductive layer extending to the routing area.

[0061] In a possible implementation, a projection of the first transparent conductive layer extending to the wiring area on the substrate covers projections of all wiring extending to the wiring area on the substrate.

[0062] In a specific example, Figure 5 As shown, the projection of the first transparent conductive layer extending to the wiring area on the substrate covers the projection of all wiring extending to the wiring area on the substrate, that is, the wiring area is entirely formed by the first transparent conductive layer, and the second transparent conductive layer and the first transparent conductive layer are arranged on the same layer. In other words, the wiring area is entirely formed by the second transparent conductive layer. At this time, the width of the first transparent conductive layer and the second transparent conductive layer is 0.5 mm.

[0063] Figure 6 Show Figure 5 The first conductive layer 105 covers the projections of all the traces in the trace area on the substrate, so the first conductive layer 105 is between the insulating layer 102 and the insulating layer 103.

[0064] In a possible implementation, the shielding trace 31 extends to the trace area 20 .

[0065] In a specific example, Figure 7 As shown, the shielding trace 31 extends to the routing area 20. There is an insulating layer between the shielding trace 31 extending to the routing area 20 and the routing area. The shielding trace 31 extends to the routing area 20, and a shielding protection can be formed on the side of the routing area 20. The shielding capability of the touch panel designed in this way is enhanced compared to the touch panel designed in which the shielding trace is not extended to the routing area.

[0066] In a possible implementation, a projection of the first transparent conductive layer extending to the wiring area on the substrate covers projections of all wiring extending to the wiring area on the substrate.

[0067] In a specific example, Figure 8 As shown, the projection of the first transparent conductive layer extending to the wiring area on the substrate covers the projection of all wirings extending to the wiring area on the substrate. Figure 9 Show Figure 8 The specific structural diagram of the touch panel is as follows, the touch panel includes: a touch area 10, a routing area 20 and a bonding area 30, the bonding area 30 includes a shielding pad 32 corresponding to the shielding signal, a sensing pad 35 corresponding to the Rx routing, a grounding pad 34 corresponding to the ground routing and a sensing pad 36 corresponding to the Tx routing. In the bonding area 30, the shielding signal and the shielding pad are connected by punching, the ground signal and the ground pad are connected by punching, the Rx trace and the sensing pad 35 are connected by punching, and the Tx trace and the sensing pad 36 are connected by punching. In the routing area 20, although the Rx trace, Tx trace, shielding trace and ground trace all extend to the routing area, the Rx trace, Tx trace, shielding trace, ground trace and the routing area 20 are separated by an insulating layer. When it is necessary to connect the routing area with the Rx trace, Tx trace, shielding trace and ground trace, the sensing pads 35, sensing pads 36, shielding pads 32 and ground pads 34 corresponding to the Rx trace, Tx trace, shielding trace and ground trace are connected.

[0068] In a possible implementation, the touch control integrated circuit is configured to electrically connect the shielding signal pin to the ground signal pin in response to a switching instruction.

[0069] In a specific example, an embodiment of the present invention Figure 3 、 Figure 5 、 Figure 7 and Figure 8 The touch panels provided in the specification have two working modes. The first working mode is that the shielding pad is connected to the shielding signal pin of the touch integrated circuit, for example, through a flexible circuit board FPC; the second working mode is that while the shielding pad is connected to the shielding signal pin of the touch integrated circuit, the shielding signal pin inside the touch integrated circuit is grounded, for example, through a switch in the internal circuit of the touch integrated circuit. When the switch is disconnected, the shielding signal pin inside the touch integrated circuit is not grounded; when the switch is closed, the shielding signal pin inside the touch integrated circuit is grounded.

[0070] For example, use Figure 3 The designed touch panel bonds the touch flexible circuit board to the shielding pad 32, so that the shielding pad 32 is connected to the shielding signal line of the touch integrated circuit. Similarly, the grounding pad 34 is connected to the grounding signal line of the touch integrated circuit, and the grounding signal line of the touch integrated circuit is connected to the ground copper wire of the touch flexible circuit board. According to environmental conditions, when the touch integrated circuit is in anti-noise mode, a shielding signal is output. The touch panel provided by this embodiment can block noise interference from the signal line; when the touch integrated circuit is in anti-static mode, the first transparent conductive layer is grounded, which effectively reduces the impedance to the ground. ESD can be released in the film layer without entering the interior of the channel film layer to cause bridge point damage or pad explosion, and ultimately cause functional failure.

[0071] Another embodiment of the present invention provides a touch display device, including the above-mentioned touch panel and a display panel, wherein the touch sensor of the touch panel, such as a capacitive sensor, and corresponding wiring are integrated into a functional film layer of the display panel.

[0072] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0073] It should also be noted that, in the description of the present invention, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0074] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in this field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A touch panel, characterized in that: A touch integrated circuit further comprising a touch area, a routing area, and a bonding area formed on a substrate, wherein the bonding area comprises a shielding routing line and a shielding pad electrically connected to a shielding signal pin of the touch integrated circuit, and the shielding routing line is electrically connected to the shielding pad; The shielding pad is formed by a first transparent conductive layer, and the first transparent conductive layer extends to the routing area, and the projection of the first transparent conductive layer extending to the routing area on the substrate covers the projection of at least part of the routing in the routing area on the substrate; The shielding wiring extends to the wiring area; an insulating layer is provided between the shielding wiring extending to the wiring area and the wiring area.

2. The touch panel according to claim 1, wherein: The projection of the first transparent conductive layer extending to the wiring area on the substrate covers the projection of the shielding wiring extending to the wiring area on the substrate.

3. The touch panel according to claim 1, wherein: The projection of the first transparent conductive layer extending to the wiring area on the substrate covers the projection of all wirings extending to the wiring area on the substrate.

4. The touch panel according to claim 1, wherein: The shielding traces of the bonding area are located at both side edges of the bonding area, and the shielding traces extending to the trace area are located at the edge of the trace area.

5. The touch panel according to claim 4, wherein: The projection of the shielding pad on the substrate covers the projection of the shielding trace of the bonding area on the substrate.

6. The touch panel according to claim 1, wherein: The bonding area further includes a ground trace and a ground pad connected to a ground signal pin of the touch integrated circuit. The ground trace is electrically connected to the ground pad and extends to the trace area.

7. The touch panel according to claim 6, wherein: The projection of the ground pad on the substrate covers the projection of the ground trace on the substrate.

8. The touch panel according to claim 6, wherein: The ground pad is formed by a second transparent conductive layer, and the second transparent conductive layer is provided in the same layer as the first transparent conductive layer.

9. The touch panel according to claim 1, wherein: The touch control integrated circuit is used to electrically connect the shielding signal pin with the ground signal pin in response to a switching instruction.

10. The touch panel according to claim 1, wherein: The touch area includes a touch sensor, the routing area includes a signal lead connected to the touch sensor, the signal lead extends to the bonding area, the bonding area also includes a sensing pad electrically connected to the sensing signal pin of the touch integrated circuit, and the sensing pad is electrically connected to the signal lead extending to the bonding area.

11. The touch panel according to claim 1, wherein: The touch panel is a capacitive touch panel.

12. A touch display device, characterized in that: The invention comprises a touch panel as claimed in any one of claims 1 to 11.

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