ITO patterning method, display panel manufacturing method, and display panel

Abstract

This application relates to an ITO patterning method, a display panel fabrication method, and a display panel. The method includes: providing an organic adhesive layer; patterning the organic adhesive layer by forming a plurality of spaced-apart recesses in the upper surface layer of the organic adhesive layer; depositing an ITO material on the organic adhesive layer, wherein the thickness of the deposited ITO material is less than the depth of the recesses; the ITO material deposited on the upper surface layer forms a first ITO film, and the ITO material deposited in the recesses forms a second ITO film, wherein the first ITO film and the second ITO film are isolated from each other. This method can improve production capacity and reduce costs.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to an ITO patterning method, a method for fabricating a display panel, and a display panel. Background Technology

[0002] Under-display cameras are becoming a trend, and with the development of display technology, under-display camera technology has emerged. An under-display camera completely integrates the front-facing camera under the screen, achieving a true full-screen display. However, placing the front-facing camera within the screen layer is not difficult; the challenge lies in solving the light transmission problem.

[0003] In traditional technology, transparent leads, such as a thin ITO film layer, are used to electrically connect the light-emitting units located in the under-display camera area to the pixel circuits located outside the under-display camera area in order to increase the transmittance of the under-display camera area.

[0004] However, the number of ITO film layers is generally more than two, and the patterning of ITO film layers will limit the overall production capacity and increase costs. Summary of the Invention

[0005] Therefore, it is necessary to provide an ITO patterning method, a display panel fabrication method, and a display panel that can improve production capacity and reduce costs, in response to the above-mentioned technical problems.

[0006] Firstly, this application provides an ITO graphical method. The method includes:

[0007] Provide an organic adhesive layer;

[0008] The organic adhesive layer is patterned, and multiple recesses spaced apart from each other are formed in the upper surface layer of the organic adhesive layer;

[0009] ITO material is deposited on the organic adhesive layer, the thickness of the deposited ITO material is less than the depth of the recess, the ITO material deposited on the upper surface layer forms a first ITO film, the ITO material deposited in the recess forms a second ITO film, and the first ITO film and the second ITO film are isolated from each other.

[0010] In the above-mentioned ITO patterning method, an organic adhesive layer is first provided and patterned. Multiple spaced-apart recesses are formed in the upper surface of the organic adhesive layer. Then, ITO material is deposited on the organic adhesive layer. The ITO material deposited on the upper surface forms a first ITO film, and the ITO material deposited in the recesses forms a second ITO film. The first ITO film and the second ITO film are isolated. By utilizing the special structure inside the organic adhesive layer, the thinner ITO material can be automatically separated into the first ITO film and the second ITO film at the corner of the thicker recess. Furthermore, the distribution area of ​​the recesses can be consistent with the distribution area of ​​the transition lines, thereby reducing the number of ITO film patterning steps, increasing overall production capacity, and reducing implementation costs.

[0011] In one embodiment, the cross-sectional area of ​​the recess perpendicular to the opening direction gradually increases along the opening direction;

[0012] Preferably, the recess is trapezoidal.

[0013] The cross-sectional area of ​​the recessed part perpendicular to the opening direction gradually increases along the opening direction. The overall size is smaller at the top and larger at the bottom. The angle between the sidewall and the bottom surface is an acute angle, so the ITO material cannot adhere to the sidewall. The ITO material deposited inside and outside the recessed part automatically breaks off.

[0014] In one embodiment, at least two of the recesses have different depths;

[0015] Preferably, the recess includes at least a first recess and a second recess, wherein the depth of the second recess is greater than the depth of the first recess.

[0016] The different depths of the recesses allow the deposited ITO material to be located on different planes, which is beneficial for forming different traces and can separate adjacent traces, reducing the spacing between adjacent traces on the plane and facilitating trace design.

[0017] In one embodiment, the patterning of the organic adhesive layer includes creating a plurality of spaced-apart recesses in the upper surface layer of the organic adhesive layer, comprising:

[0018] The organic adhesive layer is exposed through a photomask, which includes a fully transparent area, a semi-transparent area, and a non-transparent area. The organic adhesive layer includes a negative photoresist.

[0019] The organic adhesive layer is developed, and the area of ​​the organic adhesive layer opposite to the semi-transparent area forms the first recess, and the area of ​​the organic adhesive layer opposite to the non-transparent area forms the second recess.

[0020] Before exposure to light, negative photoresist is soluble; after exposure, it becomes insoluble. The area of ​​the organic photoresist layer opposite the opaque area remains soluble and will dissolve after development. The area of ​​the organic photoresist layer opposite the fully transparent area receives sufficient light and becomes completely insoluble, remaining entirely after development. The area of ​​the organic photoresist layer opposite the semi-transparent area receives insufficient light and still contains some soluble material, some of which will dissolve after development. Therefore, the area of ​​the organic photoresist layer opposite the semi-transparent area forms a shallow first recess, while the area of ​​the organic photoresist layer opposite the opaque area forms a deeper second recess.

[0021] In one embodiment, the patterning of the organic adhesive layer includes creating a plurality of spaced-apart recesses in the upper surface layer of the organic adhesive layer, comprising:

[0022] The organic adhesive layer is patterned, and a plurality of first recesses spaced apart from each other are formed in the organic adhesive layer;

[0023] The second recess is formed by etching a portion of the first recess.

[0024] First, the organic adhesive layer is patterned, and a first recess with a shallow depth is formed within the organic adhesive layer. Then, a portion of the first recess is further etched to transform it into a second recess with a greater depth, thereby achieving the formation of a first recess and a second recess with different depths within the organic adhesive layer.

[0025] In one embodiment, the deposition thickness of the ITO material is 200 angstroms to 1000 angstroms.

[0026] The deposition thickness of ITO material ranges from 200 angstroms to 1000 angstroms. A thinner thickness allows the ITO material deposited inside and outside the depression to automatically separate at the corners of the thicker depression. Furthermore, the greater the deposition thickness of ITO material, the better its conductivity; the smaller the deposition thickness of ITO material, the better its light transmittance. A deposition thickness of 200 angstroms to 1000 angstroms can effectively balance conductivity and light transmittance.

[0027] In one embodiment, the method further includes:

[0028] A portion of the first ITO thin film is etched to expose the upper surface layer.

[0029] A portion of the first ITO thin film is etched to expose the upper surface layer, so that the distribution area of ​​the first ITO thin film is consistent with the distribution area of ​​the adapter line, thereby using the first ITO thin film to realize the electrical connection between the light-emitting unit and the pixel circuit, which facilitates the wiring design.

[0030] In one embodiment, the method further includes:

[0031] The organic adhesive layer is patterned, and through-holes are formed within the organic adhesive layer.

[0032] Vias are formed within the organic adhesive layer to allow the ITO material deposited on the organic adhesive layer to be electrically connected to the pixel circuitry beneath the organic adhesive layer via the vias. Specifically, vias penetrating the organic adhesive layer enable the electrical connection between the first ITO film and the pixel circuitry, while vias communicating with the recessed portion enable the electrical connection between the second ITO film and the pixel circuitry.

[0033] Secondly, this application also provides a method for manufacturing a display panel. The method includes:

[0034] A substrate with a pixel driving circuit is provided. The substrate includes a main screen area, a sub-screen area, and a transition area located between the main screen area and the sub-screen area. The pixel driving circuit includes a plurality of pixel circuits disposed in the main screen area and the transition area.

[0035] An adhesive layer is deposited on the side of the substrate where the pixel driving circuit is located;

[0036] The organic adhesive layer is patterned, and vias corresponding to and communicating with the pixel circuits are opened in the organic adhesive layer. A recessed portion communicating with the corresponding via is opened in the upper surface layer of the organic adhesive layer located in the sub-screen area and the transition area.

[0037] ITO material is deposited on the side of the organic adhesive layer away from the pixel driving circuit. The deposition thickness of the ITO material is less than the depth of the recess. The ITO material deposited on the upper surface layer forms a first ITO film, and the ITO material deposited in the recess forms a second ITO film. The first ITO film and the second ITO film are isolated from each other. The light-emitting unit located in the main screen area is electrically connected to the pixel circuit located in the main screen area through the first ITO film. The light-emitting units located in the sub-screen area and the transition area are electrically connected to the pixel circuit located in the transition area through one of the first ITO film and the second ITO film, respectively.

[0038] Preferably, the cross-sectional area of ​​the through hole communicating with the recessed portion, perpendicular to the opening direction, gradually decreases along the opening direction;

[0039] Preferably, the through hole communicating with the recess is in the shape of an inverted trapezoid.

[0040] Thirdly, this application also provides a display panel.

[0041] The display panel includes:

[0042] The substrate includes a main screen area, a sub-screen area, and a transition area located between the main screen area and the sub-screen area;

[0043] A pixel driving circuit includes multiple pixel circuits disposed in the main screen area and the transition area;

[0044] An organic adhesive layer is located on the side of the substrate where the pixel driving circuit is located. The organic adhesive layer has vias that are connected to the pixel circuits one by one. The upper surface of the organic adhesive layer located in the sub-screen area and the transition area has a recess that is connected to the corresponding via.

[0045] A first ITO film is located on the upper surface layer;

[0046] A second ITO film is located within the recessed portion, and the first ITO film and the second ITO film are isolated from each other.

[0047] The light-emitting layer group is located on the side of the organic adhesive layer where the first ITO film is disposed. The light-emitting layer group includes a plurality of light-emitting units located in the main screen area, the sub-screen area, and the transition area. The light-emitting units located in the main screen area are electrically connected to the pixel circuit located in the main screen area through the first ITO film. The light-emitting units located in the sub-screen area and the transition area are electrically connected to the pixel circuit located in the transition area through one of the first ITO film and the second ITO film, respectively. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is an application environment diagram of the ITO graphical method in one embodiment;

[0050] Figure 2 This is a partial structural diagram of the display panel in one embodiment;

[0051] Figure 3 This is a flowchart illustrating the ITO graphical method in one embodiment;

[0052] Figure 4 This is a schematic diagram of the structure of the organic adhesive layer formed after step S302 is performed in one embodiment;

[0053] Figure 5 This is a schematic diagram of the structure of the recess formed after step S304 is performed in one embodiment;

[0054] Figure 6This is a schematic diagram of the structure of the ITO thin film formed after step S306 is performed in one embodiment;

[0055] Figure 7 This is a flowchart illustrating step S304 in one embodiment;

[0056] Figure 8 This is a schematic diagram of the structure of the recess formed after step S304 is performed in another embodiment;

[0057] Figure 9 This is a flowchart illustrating step S304 in another embodiment;

[0058] Figure 10 This is a flowchart illustrating step S304 in yet another embodiment;

[0059] Figure 11 This is a schematic diagram of the via structure formed in one embodiment;

[0060] Figure 12 This is a flowchart illustrating the ITO graphical method in another embodiment;

[0061] Figure 13 This is a flowchart illustrating a method for manufacturing a display panel in one embodiment;

[0062] Figure 14 This is a flowchart illustrating step S1306 in one embodiment;

[0063] Figure 15 This is a schematic diagram of the structure of the recess formed after step S1404 is performed in one embodiment;

[0064] Figure 16 In one embodiment Figure 15 Cross-sectional view along the AA direction;

[0065] Figure 17 In one embodiment Figure 15 Cross-sectional view along the BB direction;

[0066] Figure 18 This is a schematic diagram of the structure of the recess formed after step S1406 is performed in one embodiment;

[0067] Figure 19 In one embodiment Figure 18 Cross-sectional view along the AA direction;

[0068] Figure 20 In one embodiment Figure 18 Cross-sectional view along the CC direction;

[0069] Figure 21 This is a schematic diagram showing the connection between the pixel circuit and the light-emitting unit in one embodiment.

[0070] Explanation of reference numerals in the attached figures:

[0071] 10-Display panel, 11-Substrate, 12-Pixel circuit, 13-Light-emitting unit, 14-Via, 15-Adapter cable;

[0072] A - Main screen area, B - Secondary screen area, C - Transition area;

[0073] 21-Organic adhesive layer, 22-Recessed portion, 23-Through hole;

[0074] 31 - First ITO film layer, 32 - Second ITO film layer. Detailed Implementation

[0075] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0076] The ITO graphical method provided in this application embodiment can be applied to, for example... Figure 1 In the application environment shown, the display panel 10 has a main screen area A, a secondary screen area B, and a transition area C. The main screen area A at least partially surrounds the secondary screen area B, and the transition area C is located between the main screen area A and the secondary screen area B. Figure 2 As shown, the display panel 10 includes a substrate 11 and pixel circuits 12 and light-emitting units 13 that are electrically connected to each other. The pixel circuits 12 are distributed in the main screen area A and the transition area C, and the light-emitting units 13 are distributed in the main screen area A, the sub-screen area B, and the transition area C. The light-emitting units 13 located in the main screen area A are opposite to the pixel circuits 12 located in the main screen area A, and the two can be directly connected through vias 14. The light-emitting units 13 located in the sub-screen area B and the transition area C are offset from the pixel circuits 12 located in the transition area C, and the two need to be connected through adapter cables 15. This leaves space between the light-emitting units 13 located in the sub-screen area B and the substrate 11, avoiding the pixel circuits 12 in the sub-screen area B from affecting the AUG light incidence, which is beneficial for the photosensitive device located in the sub-screen area B to receive optical signals, thereby realizing under-display imaging.

[0077] like Figure 2 As shown, for ease of wiring design, the adapter cable 15 is distributed across at least two layers. To increase the transmittance of the sub-screen area 12, the adapter cable 15 is implemented using a transparent ITO film layer. Since the patterning process of the ITO film layer is complex and time-consuming, performing the ITO film layer patterning at least twice would limit overall production capacity and increase implementation costs.

[0078] To address the aforementioned issues, this application provides an ITO patterning method, a display panel fabrication method, and a display panel. First, an organic adhesive layer is provided and patterned. Multiple spaced-apart recesses are formed in the upper surface of the organic adhesive layer. Then, ITO material is deposited on the organic adhesive layer, with the deposition thickness of the ITO material being less than the depth of the recesses. The ITO material deposited on the upper surface forms a first ITO film, and the ITO material deposited in the recesses forms a second ITO film. The first and second ITO films are isolated. Utilizing the special internal structure of the organic adhesive layer, the thinner ITO material is automatically separated into isolated first and second ITO films at the corners of the thicker recesses. Furthermore, the distribution area of ​​the recesses can coincide with the distribution area of ​​the transition lines, thereby reducing the number of ITO film patterning operations, increasing overall production capacity, and reducing implementation costs.

[0079] The ITO patterning method disclosed in this application can be applied to the fabrication of display panels, which can be used in various display devices, such as mobile terminals, wearable devices, automotive devices, tablet computers, laptop computers, computer monitors, etc.

[0080] To facilitate better understanding, before going into detail, let's clarify a few points:

[0081] Indium tin oxide (ITO) is a mixture, appearing as a transparent brown film or yellowish-gray lumps, composed of 90% In₂O₃ and 10% SnO₂. It is primarily used in the fabrication of liquid crystal displays, flat panel displays, plasma displays, touchscreens, electronic paper, organic light-emitting diodes (OLEDs), solar cells, antistatic coatings, transparent conductive coatings for EMI (Electromagnetic Interference) shielding, and various optical coatings. The main characteristic of ITO is its combination of electrical conductivity and optical transparency. Thin film deposition requires balancing conductivity and transparency, as a high concentration of charge carriers increases the material's conductivity but reduces its transparency. Indium tin oxide films are typically deposited onto surfaces using physical vapor deposition (PVD) or sputtering deposition techniques.

[0082] Patterning: A series of processes that create patterns within a structure or on a surface layer, the size and location of which are determined according to the requirements of the physical “components” in the integrated circuit.

[0083] In one embodiment, such as Figure 3 As shown, an ITO graphical method is provided, including the following steps:

[0084] Step S302, provide an organic adhesive layer.

[0085] The organic adhesive layer is a layered structure formed by organic cementing materials. Organic cementing materials refer to a class of cementing materials whose basic composition is natural or artificially synthesized polymer compounds. Cementing materials are materials that can bind other materials into a whole and have a certain strength.

[0086] For example, the organic adhesive layer is a photoresist layer, which can be directly patterned, simplifying the process and reducing implementation costs.

[0087] like Figure 4 As shown, after performing step S302, an organic adhesive layer 21 is formed. In practical applications, the organic adhesive layer 21 can be disposed on a surface that provides support, such as the surface of a substrate. Specifically, step S302 includes: using a spin coater to evenly spread the organic adhesive, causing it to spread evenly on the surface to form an organic adhesive layer.

[0088] Step S304: Pattern the organic adhesive layer by creating multiple recesses spaced apart within the upper surface of the organic adhesive layer.

[0089] The organic adhesive layer has an upper surface and a lower surface positioned opposite each other, with the upper surface above the lower surface. The upper surface layer is the portion of the organic adhesive layer closest to the upper surface, and the distance from each point within the upper surface layer to the upper surface is less than or equal to a predetermined threshold. For example, the organic adhesive layer may consist of an upper surface layer and other layers located below it. For instance, if the thickness of the organic adhesive layer is 'a' and the thickness of the upper surface layer is 'b', then the distance from each point within the upper surface layer to the upper surface is less than or equal to 'b', and 'b' < 'a'.

[0090] like Figure 5 As shown, after step S304, a plurality of spaced-apart recesses 22 are formed in the upper surface layer of the organic adhesive layer 21. In practical applications, the distribution area of ​​the recesses 22 can be the same as the distribution area of ​​the adapter lines that electrically connect the light-emitting unit and the pixel circuit, so that the ITO material deposited in the recesses 22 can directly form the adapter lines, thereby eliminating the need for ITO patterning.

[0091] Specifically, when the organic adhesive layer is a photoresist layer, the organic adhesive layer is first exposed through a photomask and then developed to achieve patterning of the organic adhesive layer, thereby creating multiple spaced recesses in the upper surface of the organic adhesive layer.

[0092] When the organic adhesive layer is not a photoresist layer, the photoresist layer is first laid on the organic adhesive layer, then the photoresist layer is exposed through a mask and developed to achieve the patterning of the photoresist layer. Then the pattern of the photoresist layer is transferred to the organic adhesive layer, and finally the photoresist layer is removed.

[0093] It should be noted that although both patterning of organic adhesive layers and patterning of ITO involve patterning, the specific process flows differ due to the different material properties. The patterning process for ITO is more complex, time-consuming, and has a greater impact on production capacity. Therefore, switching from patterning ITO to patterning of organic adhesive layers can reduce production time and increase production capacity.

[0094] Step S306: Deposit ITO material on the organic adhesive layer. The deposition thickness of the ITO material is less than the depth of the recess. The ITO material deposited on the upper surface layer forms a first ITO film, and the ITO material deposited in the recess forms a second ITO film. The first ITO film and the second ITO film are isolated from each other.

[0095] The recessed portion is located on different planes, and the ITO material deposited on the recessed portion is also located on different planes. The corner of the recessed portion cuts off the ITO material inside and outside the recessed portion, so that ITO films are automatically formed inside and outside the recessed portion that are separated from each other. That is, the ITO material deposited on the upper surface layer forms the first ITO film, and the ITO material deposited in the recessed portion forms the second ITO film. The first ITO film and the second ITO film are isolated.

[0096] like Figure 6 As shown, after step S306 is performed, a first ITO film 31 is formed on the upper surface layer, and a second ITO film 32 is formed in the recess. The first ITO film 31 and the second ITO film 32 are disconnected.

[0097] Specifically, ITO material is deposited on an organic adhesive layer using physical vapor deposition or magnetron sputtering deposition techniques.

[0098] In the above-mentioned ITO patterning method, an organic adhesive layer is first provided and patterned. Multiple spaced-apart recesses are formed in the upper surface of the organic adhesive layer. Then, ITO material is deposited on the organic adhesive layer. The ITO material deposited on the upper surface forms a first ITO film, and the ITO material deposited in the recesses forms a second ITO film. The first ITO film and the second ITO film are isolated. By utilizing the special structure inside the organic adhesive layer, the thinner ITO material can be automatically separated into the first ITO film and the second ITO film at the corner of the thicker recess. Furthermore, the distribution area of ​​the recesses can be consistent with the distribution area of ​​the transition lines, thereby reducing the number of ITO film patterning steps, increasing overall production capacity, and reducing implementation costs.

[0099] In one embodiment, such as Figure 6 As shown, the deposition thickness d of the ITO material is 200 angstroms to 1000 angstroms.

[0100] The deposition thickness of ITO material ranges from 200 angstroms to 1000 angstroms. A thinner thickness allows the ITO material deposited inside and outside the depression to automatically separate at the corners of the thicker depression. Furthermore, the greater the deposition thickness of ITO material, the better its conductivity; the smaller the deposition thickness of ITO material, the better its light transmittance. A deposition thickness of 200 angstroms to 1000 angstroms can effectively balance conductivity and light transmittance.

[0101] In one embodiment, such as Figure 5 As shown, the recessed portion 22 is perpendicular to the opening direction ( Figure 5 The cross-sectional area (indicated by arrows) gradually increases along the opening direction.

[0102] The cross-sectional area of ​​the recessed part perpendicular to the opening direction gradually increases along the opening direction. The overall size is smaller at the top and larger at the bottom. The angle between the sidewall and the bottom surface is an acute angle, so the ITO material cannot adhere to the sidewall. The ITO material deposited inside and outside the recessed part automatically breaks off.

[0103] For example, such as Figure 5 As shown, the recessed portion 22 is trapezoidal.

[0104] The recess is trapezoidal, which facilitates the automatic separation of ITO material deposited inside and outside the recess, and is easy to achieve in terms of process.

[0105] In one implementation of this embodiment, the organic adhesive includes a negative photoresist.

[0106] like Figure 7 As shown, step S304 includes:

[0107] Step S702: Expose the organic adhesive layer through a photomask. The photomask includes multiple non-transparent areas spaced apart from each other, and transparent areas located between the non-transparent areas.

[0108] Step S704: The organic adhesive layer is developed, and a trapezoidal depression is formed in the area opposite the non-transparent area of ​​the organic adhesive layer.

[0109] Before exposure to light, negative photoresist is soluble; after exposure, it becomes insoluble. The area of ​​the organic photoresist layer opposite the opaque area remains soluble and will dissolve after development; the area opposite the transparent area is exposed to light and becomes insoluble, but will remain after development. In the area where the organic photoresist layer meets the opaque and transparent areas, the upper half is exposed to light and becomes insoluble, but will remain after development; the lower half is not exposed to light and remains soluble, but will dissolve after development. Therefore, a trapezoidal depression is ultimately formed in the area where the organic photoresist layer meets the opaque area.

[0110] In one embodiment, such as Figure 8As shown, at least two recesses 22 have different depths.

[0111] The different depths of the recesses allow the deposited ITO material to be located on different planes, which is beneficial for forming different traces and can separate adjacent traces, reducing the spacing between adjacent traces on the plane and facilitating trace design.

[0112] For example, such as Figure 8 As shown, the recess includes at least a first recess and a second recess, and the depth of the second recess is greater than the depth of the first recess.

[0113] In one implementation of this embodiment, such as Figure 9 As shown, step S304 includes:

[0114] Step S902: Expose the organic resist layer through a photomask. The photomask includes a fully transparent area, a semi-transparent area, and a non-transparent area. The organic resist layer includes negative photoresist.

[0115] Step S904: The organic adhesive layer is developed, and a first recess is formed in the area of ​​the organic adhesive layer opposite to the semi-transparent area, and a second recess is formed in the area of ​​the organic adhesive layer opposite to the non-transparent area.

[0116] Before exposure to light, negative photoresist is soluble; after exposure, it becomes insoluble. The area of ​​the organic photoresist layer opposite the opaque area remains soluble and will dissolve after development. The area of ​​the organic photoresist layer opposite the fully transparent area receives sufficient light and becomes completely insoluble, remaining entirely after development. The area of ​​the organic photoresist layer opposite the semi-transparent area receives insufficient light and still contains some soluble material, some of which will dissolve after development. Therefore, the area of ​​the organic photoresist layer opposite the semi-transparent area forms a shallow first recess, while the area of ​​the organic photoresist layer opposite the opaque area forms a deeper second recess.

[0117] In another implementation of this embodiment, such as Figure 10 As shown, step S304 includes:

[0118] Step S1002: Pattern the organic adhesive layer and form a plurality of spaced-apart first recesses within the organic adhesive layer.

[0119] Specifically, when the organic adhesive layer is a photoresist layer, the organic adhesive layer is first exposed through a photomask and then developed to achieve patterning of the organic adhesive layer, thereby creating multiple spaced-apart first recesses in the upper surface of the organic adhesive layer.

[0120] When the organic adhesive layer is not a photoresist layer, the photoresist layer is first laid on the organic adhesive layer, then the photoresist layer is exposed through a mask and developed to achieve the patterning of the photoresist layer. Then the pattern of the photoresist layer is transferred to the organic adhesive layer, and finally the photoresist layer is removed.

[0121] Step S1004: Etch a portion of the first recess to form a second recess.

[0122] Specifically, step S1004 can be similar to step S1002, the main difference being the selection of a different mask, specifically the different distribution positions of the light-transmitting and non-light-transmitting areas in the mask.

[0123] In this embodiment, the organic adhesive layer is first patterned to form a first recess with a shallow depth within the organic adhesive layer. Then, a portion of the first recess is further etched to transform it into a second recess with a greater depth, thereby achieving the formation of a first recess and a second recess with different depths within the organic adhesive layer.

[0124] In one embodiment, the method further includes etching a portion of the first ITO film to expose the upper surface layer.

[0125] Specifically, a photoresist layer is first laid on the ITO material, then the photoresist layer is exposed through a photomask and developed to achieve patterning of the photoresist layer. Then the pattern of the photoresist layer is transferred to the first ITO thin film, and finally the photoresist layer is removed.

[0126] In this embodiment, a portion of the first ITO film is etched to expose the upper surface layer, so that the distribution area of ​​the first ITO film is consistent with the distribution area of ​​the adapter line, thereby using the first ITO film to realize the electrical connection between the light-emitting unit and the pixel circuit, which facilitates the wiring design.

[0127] It should be noted that although there is ITO graphical representation here, the entire process only involves this one ITO graphical representation. Reducing the number of ITO graphical representations can improve overall productivity and lower implementation costs.

[0128] In one embodiment, the method further includes: patterning the organic adhesive layer to form vias within the organic adhesive layer. This step is performed after step S304 and before step S306.

[0129] like Figure 11 As shown, after performing the above steps, a via 23 is formed in the organic adhesive layer 21. A portion of the via 23 directly penetrates the organic adhesive layer 21, while the other portion of the via 23 communicates with the recessed portion 22.

[0130] Specifically, when the organic adhesive layer is a photoresist layer, the organic adhesive layer is first exposed through a photomask, and then developed to achieve patterning of the organic adhesive layer, thereby forming vias within the organic adhesive layer.

[0131] When the organic adhesive layer is not a photoresist layer, the photoresist layer is first laid on the organic adhesive layer, then the photoresist layer is exposed through a mask and developed to achieve the patterning of the photoresist layer. Then the pattern of the photoresist layer is transferred to the organic adhesive layer, and finally the photoresist layer is removed.

[0132] In this embodiment, vias are formed within the organic adhesive layer to allow the ITO material deposited on the organic adhesive layer to be electrically connected to the pixel circuit beneath the organic adhesive layer through the vias. Specifically, vias penetrating the organic adhesive layer enable the electrical connection between the first ITO film and the pixel circuit, while vias communicating with the recessed portion enable the electrical connection between the second ITO film and the pixel circuit.

[0133] For example, such as Figure 11 As shown, via 23 is perpendicular to the opening direction ( Figure 11 The cross-sectional area (indicated by arrows) gradually decreases along the opening direction.

[0134] The cross-sectional area of ​​the via perpendicular to the opening direction gradually decreases along the opening direction, with the top being smaller and the bottom being larger. The angle between the sidewall and the bottom surface is an obtuse angle, which is conducive to the adhesion of ITO material to the sidewall to achieve electrical connection.

[0135] like Figure 12 As shown, a graphical method for ITO is provided. Figure 3 A specific implementation of the ITO graphical method shown includes the following steps:

[0136] Step S1202: Provide an organic adhesive layer.

[0137] Step S1204: Pattern the organic adhesive layer by creating multiple recesses spaced apart within the upper surface of the organic adhesive layer.

[0138] Step S1206: Pattern the organic adhesive layer and form vias within the organic adhesive layer.

[0139] Step S1208: Deposit ITO material on the organic adhesive layer. The deposition thickness of the ITO material is less than the depth of the recess. The ITO material deposited on the upper surface layer forms a first ITO film, and the ITO material deposited in the recess forms a second ITO film. The first ITO film and the second ITO film are isolated from each other.

[0140] Step S1210: Part of the first ITO thin film is etched to expose the upper surface layer.

[0141] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0142] Based on the same inventive concept, embodiments of this application also provide a method for manufacturing a display panel, such as... Figure 13 As shown, it includes the following steps:

[0143] Step S1302: A substrate with a pixel driving circuit is provided. The substrate includes a main screen area, a sub-screen area, and a transition area between the main screen area and the sub-screen area. The pixel driving circuit includes multiple pixel circuits disposed in the main screen area and the transition area.

[0144] Step S1304: An adhesive layer is laid on the side of the substrate where the pixel driving circuit is located.

[0145] Step S1306: Pattern the organic adhesive layer, open vias in the organic adhesive layer that correspond one-to-one with the pixel circuits, and open recesses in the upper surface layer of the organic adhesive layer located in the sub-screen area and transition area that correspond to the vias.

[0146] In step S1308, ITO material is deposited on the side of the organic adhesive layer away from the pixel driving circuit. The deposition thickness of the ITO material is less than the depth of the recess. The ITO material deposited on the upper surface layer forms a first ITO film, and the ITO material deposited in the recess forms a second ITO film. The first ITO film and the second ITO film are isolated from each other.

[0147] The light-emitting unit located in the main screen area is electrically connected to the pixel circuit located in the main screen area through the first ITO film, and the light-emitting units located in the sub-screen area and the transition area are electrically connected to the pixel circuit located in the transition area through one of the first ITO film and the second ITO film, respectively.

[0148] In one embodiment, the cross-sectional area of ​​the through hole communicating with the recess, perpendicular to the opening direction, gradually decreases along the opening direction.

[0149] For example, the via communicating with the recess is in the shape of an inverted trapezoid.

[0150] In one implementation of this embodiment, the organic adhesive layer includes positive photoresist and negative photoresist stacked sequentially.

[0151] like Figure 14 As shown, step S1306 includes:

[0152] Step S1402: Expose the organic adhesive layer through a first mask. The first mask includes multiple opaque areas spaced apart from each other and transparent areas located between the opaque areas.

[0153] Step S1404: The organic adhesive layer is developed, and the area opposite the opaque area of ​​the organic adhesive layer forms a trapezoidal depression.

[0154] Figure 15 This is a schematic diagram of the structure of the recess formed after step S1404 is performed in one embodiment. Figure 16 In one embodiment Figure 15 Cross-sectional view along the AA direction. Figure 17 In one embodiment Figure 15 A cross-sectional view along the BB direction. (See attached image.) Figures 15-17 As shown, after step S1404 is performed, a trapezoidal recess 22 is formed in the organic adhesive layer 21.

[0155] Step S1406: Expose the organic adhesive layer through a second mask. The second mask includes multiple light-transmitting areas spaced apart from each other and opaque areas located between the light-transmitting areas.

[0156] Step S1408: The organic adhesive layer is developed, and an inverted trapezoidal via is formed in the area of ​​the organic adhesive layer opposite to the light-transmitting area.

[0157] Figure 18 This is a schematic diagram of the structure of the recess formed after step S1406 is performed in one embodiment. Figure 19 In one embodiment Figure 18 Cross-sectional view along the AA direction. Figure 20 In one embodiment Figure 18 A cross-sectional view along the CC direction. (See attached image.) Figures 18-20 As shown, after step S1408 is executed, an inverted trapezoidal via 23 is formed within the organic adhesive layer 21. The inverted trapezoidal via 23 can penetrate the organic adhesive layer 21 independently, allowing the pixel circuit and the light-emitting unit to be connected via ITO, as shown below. Figure 20 As shown. The inverted trapezoidal via 23 can also penetrate the organic adhesive layer 21 together with the regular trapezoidal recess 22, allowing the pixel circuit and the light-emitting unit to be connected via ITO, as shown. Figure 19 As shown.

[0158] In practical applications, after depositing ITO material on the side of the organic adhesive layer away from the pixel driving circuit, the ITO material automatically separates into a first ITO film deposited on the upper surface and a second ITO film deposited in the recess. The automatically separated first and second ITO films can be used to form different transition lines, and an insulating medium with vias can be deposited on the ITO material to achieve connections between different pixel circuits and light-emitting units, such as... Figure 21 As shown. Multilayer transition lines can also be formed using a second ITO film formed multiple times.

[0159] Based on the same inventive concept, this application also provides a display panel (not shown) prepared by the above-described method for manufacturing a display panel. The display panel includes a substrate, a pixel driving circuit, an organic adhesive layer, a first ITO film, a second ITO film, and a light-emitting layer group. The substrate includes a main screen area, a sub-screen area, and a transition area between the main screen area and the sub-screen area. The pixel driving circuit includes multiple pixel circuits disposed in the main screen area and the transition area. The organic adhesive layer is located on the side of the substrate where the pixel driving circuit is disposed, and has vias that communicate with each pixel circuit. The upper surface layer of the organic adhesive layer in the sub-screen area and the transition area has recesses communicating with the corresponding vias. The first ITO film is located on the upper surface layer. The second ITO film is located within the recesses, and the first ITO film and the second ITO film are isolated from each other. The light-emitting layer group is located on the side of the organic adhesive layer where the first ITO film is provided. The light-emitting layer group includes multiple light-emitting units located in the main screen area, the sub-screen area and the transition area. The light-emitting units located in the main screen area are electrically connected to the pixel circuit located in the main screen area through the first ITO film. The light-emitting units located in the sub-screen area and the transition area are electrically connected to the pixel circuit located in the transition area through one of the first ITO film and the second ITO film, respectively.

[0160] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0161] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, The method includes: A substrate with a pixel driving circuit is provided. The substrate includes a main screen area, a sub-screen area, and a transition area located between the main screen area and the sub-screen area. The pixel driving circuit includes a plurality of pixel circuits disposed in the main screen area and the transition area. An adhesive layer is deposited on the side of the substrate where the pixel driving circuit is located; The organic adhesive layer is patterned, and vias corresponding to and communicating with the pixel circuits are opened in the organic adhesive layer. A recessed portion communicating with the corresponding via is opened in the upper surface layer of the organic adhesive layer located in the sub-screen area and the transition area. ITO material is deposited on the side of the organic adhesive layer away from the pixel driving circuit. The deposition thickness of the ITO material is less than the depth of the recess. The ITO material deposited on the upper surface layer forms a first ITO film, and the ITO material deposited in the recess forms a second ITO film. The first ITO film and the second ITO film are isolated from each other. The light-emitting unit located in the main screen area is electrically connected to the pixel circuit located in the main screen area through the first ITO film. The light-emitting units located in the sub-screen area and the transition area are electrically connected to the pixel circuit located in the transition area through one of the first ITO film and the second ITO film, respectively.

2. The method according to claim 1, characterized in that, The cross-sectional area of ​​the through hole communicating with the recessed portion, perpendicular to the opening direction, gradually decreases along the opening direction.

3. The method according to claim 2, characterized in that, The through hole communicating with the recessed portion is inverted trapezoidal in shape.

4. The method according to claim 1, characterized in that, The process of patterning the organic adhesive layer, creating vias that correspond one-to-one with the pixel circuits within the organic adhesive layer, and creating recesses in the upper surface of the organic adhesive layer located in the sub-screen area and the transition area that communicate with the corresponding vias includes: The organic adhesive layer is exposed through a first mask, which includes multiple opaque areas spaced apart from each other and transparent areas located between the opaque areas. The organic adhesive layer is developed, and the area opposite the opaque area of ​​the organic adhesive layer forms a trapezoidal recess. The organic adhesive layer is exposed through a second mask, which includes a plurality of light-transmitting areas spaced apart from each other and opaque areas located between the light-transmitting areas. The organic adhesive layer is developed, and an inverted trapezoidal via is formed in the area of ​​the organic adhesive layer opposite to the light-transmitting area.

5. The method according to claim 1, characterized in that, At least two of the recesses have different depths.

6. The method according to claim 5, characterized in that, The recessed portion includes at least a first recessed portion and a second recessed portion, wherein the depth of the second recessed portion is greater than the depth of the first recessed portion.

7. The method according to claim 6, characterized in that, The first recess and the second recess are formed in the following manner: The organic adhesive layer is exposed through a photomask, which includes a fully transparent area, a semi-transparent area, and a non-transparent area. The organic adhesive layer includes a negative photoresist. The organic adhesive layer is developed, and the area of ​​the organic adhesive layer opposite to the semi-transparent area forms the first recess, and the area of ​​the organic adhesive layer opposite to the non-transparent area forms the second recess.

8. The method according to claim 6, characterized in that, The first recess and the second recess are formed in the following manner: The organic adhesive layer is patterned, and a plurality of first recesses spaced apart from each other are formed in the organic adhesive layer; The second recess is formed by etching a portion of the first recess.

9. The method according to claim 1, characterized in that, The deposition thickness of the ITO material is 200 angstroms to 1000 angstroms.

10. A display panel, characterized in that, The display panel includes: The substrate includes a main screen area, a sub-screen area, and a transition area located between the main screen area and the sub-screen area; A pixel driving circuit includes multiple pixel circuits disposed in the main screen area and the transition area; An organic adhesive layer is located on the side of the substrate where the pixel driving circuit is located. The organic adhesive layer has vias that are connected to the pixel circuits one by one. The upper surface of the organic adhesive layer located in the sub-screen area and the transition area has a recess that is connected to the corresponding via. A first ITO film is located on the upper surface layer; A second ITO film is located within the recessed portion, and the first ITO film and the second ITO film are isolated from each other. The light-emitting layer group is located on the side of the organic adhesive layer where the first ITO film is disposed. The light-emitting layer group includes a plurality of light-emitting units located in the main screen area, the sub-screen area, and the transition area. The light-emitting units located in the main screen area are electrically connected to the pixel circuit located in the main screen area through the first ITO film. The light-emitting units located in the sub-screen area and the transition area are electrically connected to the pixel circuit located in the transition area through one of the first ITO film and the second ITO film, respectively.

Images