Horizontal Refrigeration Cabinet

Abstract

The present invention provides a horizontal refrigeration cabinet, comprising a cabinet body enclosing a storage room and a heat-insulating door body arranged above the cabinet body to open and close the upper opening of the storage room, and also comprising a semiconductor refrigeration system, the semiconductor refrigeration system being arranged in the heat-insulating door body, the cooling mechanism of the semiconductor refrigeration system being heat-insulated and isolated from the external environment of the horizontal refrigeration cabinet through the heat-insulating layer of the heat-insulating door body and supplying cold to the storage room, and the heating mechanism of the semiconductor refrigeration system being heat-insulated and isolated from the storage room through the heat-insulating layer of the heat-insulating door body and radiating heat to the external environment of the horizontal refrigeration cabinet. On the one hand, the refrigeration system being arranged in the cabinet body can be prevented from affecting the volume ratio of the storage room, and on the other hand, the heat-insulating layer of the heat-insulating door body can not only isolate the cold generated by the cooling mechanism from being radiated to the external environment of the horizontal refrigeration cabinet, but also prevent the heating mechanism from radiating heat to the storage room, thereby improving the refrigeration efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of refrigeration equipment, and in particular to a horizontal refrigeration cabinet. Background Art

[0002] At present, the commonly used horizontal refrigerators on the market usually adopt a vapor compression refrigeration cycle. The refrigeration system is composed of a compressor, a condenser, a throttling device and an evaporator. Due to the large size of the compressor, a compressor compartment is generally set at the lower right corner of the cabinet of the horizontal refrigerator to place the compressor, which greatly occupies the storage space of the cabinet and seriously reduces the volume ratio of the horizontal refrigerator. In addition, the compressor compartment will protrude into the storage space, affecting the internal aesthetics of the horizontal refrigerator. Summary of the invention

[0003] In order to solve the above technical problems, an object of the present invention is to provide a horizontal refrigeration cabinet to solve the problems of low volume ratio and unsightly interior of the existing horizontal refrigeration cabinet.

[0004] To achieve one of the above-mentioned purposes of the invention, one embodiment of the present invention provides a horizontal refrigeration cabinet, comprising a cabinet body enclosing a storage compartment and a thermal insulation door body arranged above the cabinet body to open and close the upper opening of the storage compartment, the horizontal refrigeration cabinet also comprising a semiconductor refrigeration system, the semiconductor refrigeration system being arranged in the thermal insulation door body, the cooling mechanism of the semiconductor refrigeration system being thermally insulated from the external environment of the horizontal refrigeration cabinet through the thermal insulation layer of the thermal insulation door body and supplying cold to the storage compartment, the heating mechanism of the semiconductor refrigeration system being thermally insulated from the storage compartment through the thermal insulation layer of the thermal insulation door body and dissipating heat to the external environment of the horizontal refrigeration cabinet.

[0005] As a further improvement of one embodiment of the present invention, an air duct system is provided in the heat-insulating door body, and the air duct system includes a hot air duct, an installation cavity and a cold air duct arranged in sequence from top to bottom, and the extension directions of the hot air duct and the cold air duct intersect each other but are not parallel to each other, and the installation cavity is provided at the intersection of the hot air duct and the cold air duct, and the installation cavity is connected to the hot air duct and the cold air duct respectively;

[0006] The cooling mechanism includes a cold end of a semiconductor refrigeration plate and a cooling component, and the heating mechanism includes a hot end of a semiconductor refrigeration plate and a heat dissipation component. The semiconductor refrigeration plate is accommodated in the installation cavity and isolates the hot air duct and the cold air duct in the installation cavity. The cooling component is thermally connected to the cold end and extends from the cold end to the cold air duct, and the heat dissipation component is thermally connected to the hot end and extends from the hot end to the hot air duct.

[0007] As a further improvement of an embodiment of the present invention, the extension directions of the hot air duct and the cold air duct are perpendicular to each other.

[0008] As a further improvement of one embodiment of the present invention, the insulation layer includes a heat insulation sheet formed at the intersection of the hot air duct and the cold air duct, the installation cavity is configured as a channel that passes through the heat insulation sheet from top to bottom, and the semiconductor refrigeration sheet is placed horizontally in the channel with its periphery in contact with the inner wall of the installation cavity.

[0009] As a further improvement of one embodiment of the present invention, a first groove is provided on the upper surface of the insulation layer, and the groove wall of the first groove and the upper cover plate of the insulation door body enclose the hot air duct; a second groove is provided on the lower surface of the insulation layer, and the groove wall of the second groove and the lower cover plate of the insulation door body enclose the cold air duct.

[0010] As a further improvement of one embodiment of the present invention, the side of the thermal insulation door body is provided with a first air outlet and a second air outlet, and the hot air duct includes a first air duct connecting the installation cavity and the first air outlet, and a second air duct connecting the installation cavity and the second air outlet; the lower cover plate of the thermal insulation door body is provided with a first air supply port and a second air supply port, and the cold air duct includes a third air duct connecting the installation cavity and the first air supply port, and a fourth air duct connecting the installation cavity and the second air supply port.

[0011] As a further improvement of one embodiment of the present invention, the first air outlet and the second air outlet are relatively arranged at the front side and the rear side of the thermal insulation door body, the first air supply outlet and the second air supply outlet are respectively arranged at the left end and the right end of the thermal insulation door body, and the length of the thermal insulation door body along the left-right direction is greater than its length along the front-back direction.

[0012] As a further improvement of one embodiment of the present invention, the cabinet body is provided with two air supply ducts, and the two air supply ducts are respectively extended up and down and arranged in the opposite side walls of the cabinet body, the upper end of one of the two air supply ducts is connected to the first air supply port, and the upper end of the other of the two air supply ducts is connected to the second air supply port, and the inner wall surfaces of the opposite side walls of the cabinet body are respectively provided with third air supply ports, and the third air supply ports are connected to the storage compartment and the air supply ducts.

[0013] As a further improvement of an embodiment of the present invention, a plurality of the third air supply outlets are arranged side by side at intervals up and down on each of the side walls, and the areas of the plurality of the third air supply outlets gradually increase from top to bottom.

[0014] As a further improvement of one embodiment of the present invention, the heat dissipation component includes a heat dissipation fan, the upper cover plate is provided with an air inlet, and the air inlet is connected to the air intake port of the heat dissipation fan and the external environment of the horizontal refrigeration cabinet; the cooling component includes a cooling fan, the lower cover plate is provided with a return air port, and the return air port is connected to the storage room and the air intake port of the cooling fan.

[0015] As a further improvement of an embodiment of the present invention, the heat dissipation assembly includes a heat dissipation fin group, a heat dissipation centrifugal fan, and a heat conduction base that thermally connects the heat dissipation fin group and the hot end, the heat dissipation fin group is annular and its inner annular surface surrounds a heat dissipation cavity, the heat dissipation centrifugal fan is arranged in the heat dissipation cavity, the heat dissipation fin group includes a plurality of heat dissipation fins, and the air blown out by the heat dissipation centrifugal fan is sent to the hot air duct through the gaps between adjacent heat dissipation fins;

[0016] The cooling assembly includes a cooling fin group, a cooling centrifugal fan, and a cooling base that thermally connects the cooling fin group and the cold end. The cooling fin group is annular and its inner annular surface encloses a cooling cavity. The cooling centrifugal fan is arranged in the cooling cavity. The cooling fin group includes a plurality of cooling fins. The air blown out by the cooling centrifugal fan is delivered to the cold air duct through the gaps between adjacent cooling fins.

[0017] As a further improvement of one embodiment of the present invention, the horizontal refrigeration cabinet includes two of the semiconductor refrigeration systems and two of the air duct systems respectively coordinated with the two semiconductor refrigeration systems, the two hot air ducts in the two air duct systems are arranged at intervals left and right, and the two cold air ducts in the two air duct systems are arranged at intervals front and back.

[0018] As a further improvement of an embodiment of the present invention, both of the two hot air ducts extend front and back, and both of the two cold air ducts extend left and right; in the two semiconductor refrigeration systems, the distance between the heat dissipation component of one and the front side of the thermal insulation door body is smaller than the distance between it and the rear side of the thermal insulation door body, and the distance between the cooling component of the one and the left side of the thermal insulation door body is larger than the distance between it and the right side of the thermal insulation door body; in the two semiconductor refrigeration systems, the distance between the heat dissipation component of the other and the front side of the thermal insulation door body is larger than the distance between it and the rear side of the thermal insulation door body, and the distance between the cooling component of the one and the left side plate of the thermal insulation door body is smaller than the distance between it and the right side of the thermal insulation door body;

[0019] Alternatively, among the two semiconductor refrigeration systems, the distance between the heat dissipation component of one and the front side edge of the thermal insulation door body is greater than the distance between it and the rear side edge of the thermal insulation door body, and the distance between the cooling component of that one and the left side edge of the thermal insulation door body is greater than the distance between it and the right side edge of the thermal insulation door body; among the two semiconductor refrigeration systems, the distance between the heat dissipation component of the other one and the front side edge of the thermal insulation door body is less than the distance between it and the rear side edge of the thermal insulation door body, and the distance between the cooling component of that one and the left side plate of the thermal insulation door body is less than the distance between it and the right side edge of the thermal insulation door body.

[0020] As a further improvement of one embodiment of the present invention, the horizontal refrigeration cabinet also includes a controller and a sensor, the sensor is arranged on at least one of the thermal insulation door body and the cabinet body, the sensor detects position information of the thermal insulation door body and the cabinet body, the controller is connected to the sensor and is used to control the semiconductor refrigeration system to be powered on according to the position information, so that the semiconductor refrigeration system provides cooling to the storage room.

[0021] Compared with the prior art, the present invention has the following beneficial effects: the horizontal refrigerator of the present invention has the beneficial effect that, by arranging the semiconductor refrigeration system in the heat-insulating door body, on the one hand, the refrigeration system being arranged in the cabinet body and affecting the volume ratio of the storage room can be avoided, and the space occupied by the semiconductor refrigeration system is relatively small, which reduces the volume and occupied space of the horizontal refrigerator as a whole, and facilitates storage and transportation; on the other hand, the heat-insulating layer of the heat-insulating door body can not only isolate the cold energy generated by the cooling mechanism from being dissipated to the external environment of the horizontal refrigerator through the heat-insulating door body, but also can avoid the heat supply mechanism from dissipating heat into the storage room, thereby greatly improving the refrigeration efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a front view of a horizontal refrigeration cabinet according to an embodiment of the present invention;

[0023] Figure 2 for Figure 1 Sectional view along line AA;

[0024] Figure 3 for Figure 1 Sectional view along line BB;

[0025] Figure 4 for Figure 1 Sectional view along line CC;

[0026] Figure 5 A longitudinal sectional view of a horizontal refrigerating cabinet according to an embodiment of the present invention from another angle;

[0027] Figure 6The figure is a schematic diagram of the three-dimensional structure of a heat dissipation assembly according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] The present invention will be described in detail below with reference to the specific embodiments shown in the accompanying drawings.

[0029] In various drawings of the present invention, for the sake of convenience of illustration, some sizes of structures or parts are exaggerated relative to other structures or parts, and thus, only the basic structure of the subject matter of the present invention is illustrated.

[0030] It should be understood that although the terms first, second, third, fourth, etc. may be used in this article to describe various elements or structures, these described objects should not be limited by these terms. These terms are only used to distinguish these described objects from each other.

[0031] A refrigeration device provided in an embodiment of the present invention comprises a semiconductor refrigeration system, a cabinet 1 enclosing a storage compartment 2, and a door for opening and closing the storage compartment 2. The refrigeration device can be specifically configured as a horizontal refrigeration cabinet 100, a wine cabinet, and the like.

[0032] See also Figures 1 to 5 An embodiment of the present invention provides a horizontal refrigeration cabinet 100, comprising the semiconductor refrigeration system as described above, a cabinet body 1 enclosing a storage room 2, and a thermal insulation door body 3 for opening and closing the storage room 2, the thermal insulation door body 3 is arranged above the cabinet body 1 and is used to open and close the upper opening of the storage room 2, and the semiconductor refrigeration system is arranged in the thermal insulation door body 3.

[0033] Specifically, in this embodiment, the semiconductor refrigeration system includes a cooling mechanism and a heating mechanism. The cooling mechanism is insulated from the external environment of the horizontal refrigerator 100 through the insulation layer 31 of the insulation door 3 and supplies cold energy to the storage room 2. The heating mechanism is insulated from the storage room 2 through the insulation layer 31 of the insulation door 3 and radiates heat to the external environment of the horizontal refrigerator 100. By arranging the semiconductor refrigeration system in the insulation door 3, on the one hand, it can be avoided that the refrigeration system is arranged in the cabinet 1 and the volume ratio of the storage room 2 is affected, and the semiconductor refrigeration system occupies a small space, which reduces the volume and occupied space of the horizontal refrigerator 100 as a whole, and is convenient for storage and transportation; on the other hand, the insulation layer 31 of the insulation door 3 can not only isolate the cold energy generated by the cooling mechanism from being radiated to the external environment of the horizontal refrigerator 100 through the insulation door 3, but also can avoid the heating mechanism from radiating heat to the storage room 2, which greatly improves the refrigeration efficiency.

[0034] Combination Figures 1 to 5Furthermore, an air duct system is provided in the heat preservation door body 3, and the air duct system includes a hot air duct 32, an installation cavity 33 and a cold air duct 34 arranged in sequence from top to bottom. The hot air duct 32 is arranged at the top, which can increase the distance between it and the storage room 2 on the one hand, prevent heat from being dissipated into the storage room 2, which is not conducive to refrigeration, and on the other hand, reduce the distance between the hot air duct 32 and the external environment, which is conducive to heat dissipation as soon as possible and improve the heat dissipation efficiency; the cold air duct 34 is arranged at the bottom, which can increase the distance between it and the external environment on the one hand, prevent cold from being lost to the external environment, and on the other hand, reduce the distance between it and the storage room 2, which is conducive to the cold in the cold air duct 34 being dissipated into the storage room 2, and improve the refrigeration efficiency; the installation cavity 33 is placed between the hot air duct 32 and the cold air duct 34 based on the Peltier effect of the semiconductor refrigeration system, so that the cold generated by the semiconductor refrigeration system can be conducted to the storage room 2, and the heat generated by it can be dissipated to the external environment.

[0035] See also Figures 2 to 5 The extension directions of the hot air duct 32 and the cold air duct 34 intersect each other but are not parallel to each other, thereby reducing the heat exchange between the hot air duct 32 and the cold air duct 34. The installation cavity 33 is arranged at the intersection of the hot air duct 32 and the cold air duct 34, and the installation cavity 33 is connected to the hot air duct 32 and the cold air duct 34 respectively, so that the cold capacity and heat transfer path of the semiconductor refrigeration system can be shortened, thereby improving the refrigeration efficiency and heat dissipation efficiency.

[0036] In this embodiment, the cooling mechanism includes the cold end of the semiconductor refrigeration plate 4 and the cooling component 6, which conducts the cold energy generated by the cold end of the semiconductor refrigeration plate 4 and supplies the cold energy to the storage room 2; the heating mechanism includes the hot end of the semiconductor refrigeration plate 4 and the heat dissipation component 5, which conducts the heat generated by the hot end of the semiconductor refrigeration plate 4 and dissipates it to the external environment of the horizontal refrigeration cabinet 100, thereby preventing the heat from affecting the cooling efficiency of the storage room 2.

[0037] See also Figures 4 to 5 , wherein the semiconductor cooling chip 4 is accommodated in the installation cavity 33 and the hot air duct 32 and the cold air duct 34 are isolated at the installation cavity 33, the cooling component 6 is thermally connected to the cold end and extends from the cold end to the cold air duct 34, and the heat dissipation component 5 is thermally connected to the hot end and extends from the hot end to the hot air duct 32. In this way, the cold energy generated by the cold end of the semiconductor cooling chip 4 can be conducted to the cold air duct 34 through the cooling component 6, and then supplied to the storage room 2 and cool the storage room 2, while the heat generated by the hot end of the semiconductor cooling chip 4 can be conducted to the hot air duct 32 through the heat conduction component, and then dissipated to the external environment of the horizontal refrigeration cabinet 100; the semiconductor cooling chip 4 can also further prevent the cold and heat exchange at the installation cavity 33, avoid the loss of cold energy and the dissipation of heat to the storage room 2, improve the refrigeration efficiency, and reduce energy consumption.

[0038] Combination Figures 2 to 3 Preferably, the extension directions of the hot air duct 32 and the cold air duct 34 are perpendicular to each other, so as to minimize the overlapping area of ​​the hot air duct 32 and the cold air duct 34 and the heat exchange.

[0039] Combination Figure 2 as well as Figures 4 to 6 The heat dissipation component 5 includes a heat dissipation fin group 51, a heat dissipation centrifugal fan 52, and a heat-conducting base 53. The heat-conducting base 53 thermally connects the heat dissipation fin group 51 and the hot end of the semiconductor refrigeration plate 4. The heat dissipation fin group 51 is annular and its inner annular surface surrounds a heat dissipation cavity. The heat dissipation centrifugal fan 52 is arranged in the heat dissipation cavity. The heat dissipation fin group 51 includes a plurality of heat dissipation fins. The wind blown out by the heat dissipation centrifugal fan 52 is sent to the hot air duct 32 through the gap between adjacent heat dissipation fins.

[0040] Combination Figures 3 to 5 The cooling assembly 6 includes a cooling fin group 61, a cooling centrifugal fan 62, and a cooling base 63. Since the structure of the cooling assembly 6 is the same as that of the heat dissipation assembly 5, its specific structure can be referred to in Figure 6 The cooling base 63 is heat-conductingly connected to the cooling fin group 61 and the cold end of the semiconductor refrigeration plate 4. The cooling fin group 61 is annular and its inner annular surface encloses a cooling cavity. The cooling centrifugal fan 62 is arranged in the cooling cavity. The cooling fin group 61 includes a plurality of cooling fins. The air blown by the cooling centrifugal fan 62 is sent to the cold air duct 34 through the gaps between adjacent cooling fins.

[0041] For the convenience of description, when the insulation door body 3 opens the upper opening of the storage compartment 2, the user faces the insulation door body 3 as a reference, and the side where the insulation door body 3 is connected to the cabinet body 1 is defined as the rear, and the side of the cabinet body 1 close to the user is defined as the front, and the left and right directions of the user are defined as the left and right directions in this embodiment.

[0042] Specifically, in the present embodiment, the length of the heat-insulating door body 3 in the left-right direction is greater than its length in the front-to-back direction, and the hot air duct 32 extends in the front-to-back direction, and the cold air duct 34 extends in the left-right direction and crosses the hot air duct 32 perpendicularly. In this way, the length of the hot air duct 32 is minimized, and the hot air duct 32 can dissipate heat to the external environment as quickly as possible, while the cold air duct 34 can deliver cold air through the storage compartment 2 in the left-right direction, so as to make the cold air in the storage compartment 2 uniform and improve the cooling efficiency.

[0043] See also Figures 4 to 5Further, the thermal insulation layer 31 includes a heat insulating sheet 311 formed at the intersection of the hot air duct 32 and the cold air duct 34, and the installation cavity 33 is set as a channel that passes through the heat insulating sheet 311 from top to bottom. The semiconductor cooling sheet 4 is horizontally placed in the channel and its periphery is in contact with the inner wall of the installation cavity 33. In other words, the heat insulating sheet 311 is provided with a installation cavity 33 surrounding the semiconductor cooling sheet 4, and the heat insulating sheet 311 extends outward from the periphery of the semiconductor cooling sheet 4 to the outer annular surface protruding from the fin group. Specifically, in this embodiment, the heat insulating sheet 311 extends from the periphery of the semiconductor cooling sheet 4 to the outer side away from the semiconductor cooling sheet 4 to the outer annular surface protruding from the cooling fin group 61, and protrudes from the outer annular surface of the heat dissipation fin group 51. In this way, the hot air duct 32 and the cold air duct 34 are isolated by the semiconductor refrigeration sheet 4, thereby avoiding the exchange of cold and heat from the installation cavity 33, and the hot air duct 32 and the cold air duct 34 are isolated by the thermal insulation sheet 311, further avoiding the exchange of heat and cold between the hot air duct 32 and the cold air duct 34.

[0044] See also Figures 4 to 5 Furthermore, a first groove 312 is provided on the upper surface of the heat preservation layer 31, and the groove wall of the first groove 312 and the upper cover plate 35 of the heat preservation door body 3 enclose a hot air duct 32; a second groove 313 is provided on the lower surface of the heat preservation layer 31, and the groove wall of the second groove 313 and the lower cover plate 36 of the heat preservation door body 3 enclose a cold air duct 34. In this way, there is only the upper cover plate 35 between the hot air duct 32 and the external environment, which is conducive to the heat in the hot air duct 32 being dissipated to the external environment through the upper cover plate 35, which can further improve the heat dissipation efficiency, and there is only the lower cover plate 36 between the cold air duct 34 and the storage compartment 2, which is conducive to the coldness in the cold air duct 34 being supplied to the storage compartment 2 through the lower cover plate 36, which can further improve the refrigeration efficiency.

[0045] Combination Figures 2 to 5 Specifically, in the present embodiment, the first groove 312 extends forward and backward, the second groove 313 extends left and right, and the first groove 312 is located above the second groove 313, the installation cavity 33 is arranged at the intersection of the first groove 312 and the second groove 313, and the installation cavity 33 is respectively connected with the first groove 312 and the second groove 313, so that the heat exchange from the hot air duct 32 to the storage compartment 2 and the cold exchange between the cold air duct 34 and the external environment are isolated by the thermal insulation layer 31 and the semiconductor refrigeration sheet 4, thereby avoiding the loss of cold and the increase of energy consumption caused by the heat in the hot air duct 32 being transferred to the storage compartment 2.

[0046] See also Figure 2Furthermore, the side of the heat-insulating door body 3 is provided with a first air outlet and a second air outlet, and the hot air duct 32 includes a first air duct 321 connecting the installation cavity 33 and the first air outlet, and a second air duct 322 connecting the installation cavity 33 and the second air outlet. In other words, the installation cavity 33 is located in the middle of the hot air duct 32, so that the heat generated by the heating mechanism can flow from the first air duct 321 and the second air duct 322 to the external environment in two directions, thereby improving the heat dissipation efficiency.

[0047] Specifically, in this embodiment, the first air outlet and the second air outlet are relatively arranged on the front side plate 37 and the rear side plate 38 of the thermal insulation door body 3, that is, the front and rear ends of the hot air duct 32 respectively extend to the front side plate 37 and the rear side plate 38 of the thermal insulation door body 3, and the intersection of the first air duct 321 and the front side plate 37 forms the first air outlet, and the intersection of the second air duct 322 and the rear side plate 38 forms the second air outlet.

[0048] See also Figure 5 Further, the lower cover plate 36 of the heat preservation door body 3 is provided with a first air supply port 341 and a second air supply port 342, and the first air supply port 341 and the second air supply port 342 are respectively provided at the left end and the right end of the heat preservation door body 3, and the cold air duct 34 includes a third air duct 343 connecting the installation cavity 33 and the first air supply port 341, and a fourth air duct 344 connecting the installation cavity 33 and the second air supply port 342. In other words, the installation cavity 33 is located in the middle of the cold air duct 34, so that the cold energy generated by the cooling mechanism can flow from the third air duct 343 and the fourth air duct 344 to the storage compartment 2 in two directions, thereby improving the cooling efficiency.

[0049] See also Figure 4 and Figure 5 , the arrow direction shown in the figure is the circulation path of the cooling capacity. Further, the cabinet 1 is provided with two air supply ducts 11, which are respectively extended up and down and arranged in the opposite side walls of the cabinet 1, the upper end of one of the two air supply ducts 11 is connected to the first air supply port 341, and the upper end of the other of the two air supply ducts 11 is connected to the second air supply port 342, and the inner wall surfaces of the opposite side walls of the cabinet 1 are respectively provided with third air supply ports 111, which connect the storage compartment 2 and the air supply duct 11.

[0050] Specifically, in this embodiment, the first air supply port 341 is arranged at the left end of the lower cover plate 36, the second air supply port 342 is arranged at the right end of the lower cover plate 36, and the two air supply ducts 11 are respectively arranged in the left side wall 12 and the right side wall 13 of the cabinet body 1. The upper end of the air supply duct 11 in the left side wall 12 is connected to the first air supply port 341, and the upper end of the air supply duct 11 in the right side wall 13 is connected to the second air supply port 342. The inner wall surfaces of the left side wall 12 and the right side wall 13 of the cabinet body 1 are respectively provided with the third air supply port 111. In this way, part of the cold energy generated by the cold end of the semiconductor refrigeration plate 4 is transported to the storage room 2 via the third air duct 343, the first air supply port 341, the air supply port 11 in the left side wall 12, and the third air supply port 111 of the left side wall 12 in sequence, and the remaining part of the cold energy generated by the hot end of the semiconductor refrigeration plate 4 is transported to the storage room 2 via the fourth air duct 344, the second air supply port 342, the air supply port 11 in the right side wall 13, and the third air supply port 111 of the right side wall 13 in sequence, and the cold energy is transported to the storage room 2 through the third air supply ports 111 of the left side wall 12 and the right side wall 13 respectively and flows in the storage room 2, and the length of the cabinet 1 along the left-right direction is greater than its length along the front-back direction, so that the cold energy can be evenly distributed in the storage room 2, avoiding insufficient cold energy on the left and right sides of the storage room 2, thereby improving the temperature uniformity in the storage room 2.

[0051] Combination Figures 4 to 5 Furthermore, a plurality of third air supply outlets 111 are arranged side by side at intervals up and down on each of the side walls, and the areas of the plurality of third air supply outlets 111 gradually increase from top to bottom, which can further improve the temperature uniformity in the storage compartment 2 in the up and down directions.

[0052] Specifically, in the present embodiment, the inner side surfaces of the left side wall 12 and the right side wall 13 are respectively provided with a plurality of third air supply openings 111 spaced apart from each other in parallel from top to bottom, and the areas of the plurality of third air supply openings 111 on the left side wall 12 gradually increase from top to bottom, and the areas of the plurality of third air supply openings 111 on the right side wall 13 also gradually increase from top to bottom, that is, the plurality of third air supply openings 111 are spaced apart from each other in the extending direction of the air supply duct 11, so that the storage room 2 is supplied with cold energy at all locations in the up-down direction, thereby improving the temperature uniformity in the up-down direction of the storage room 2; as the air supply duct 11 extends from top to bottom, the cold energy in the air supply duct 11 continuously decreases from the upper end to the lower end, and the area of ​​the plurality of third air supply openings 111 gradually increases from top to bottom, thereby further reducing the up-down temperature difference in the storage room 2, thereby improving the temperature uniformity in the up-down direction of the storage room 2.

[0053] See also Figures 4 to 5Further, the upper cover plate 35 of the heat-insulating door body 3 is provided with an air inlet 351, and the air inlet 351 is connected to the external environment and the air inlet of the heat-dissipating fan in the heat-dissipating assembly 5, so that the heat-dissipating fan can draw air from the external environment, thereby forming an air circulation between the hot air duct 32 and the external environment. The lower cover plate 36 of the heat-insulating door body 3 is provided with a return air port 361, and the return air port 361 is connected to the storage room 2 and the air inlet of the cold-conducting fan in the cold-conducting assembly 6, so that the cold-conducting fan can draw air from the storage room 2, thereby forming an air circulation between the cold air duct 34, the air supply duct 11 and the storage room 2. In this embodiment, the heat-dissipating fan is a heat-dissipating centrifugal fan 52, and the cold-conducting fan is a cold-conducting centrifugal fan 62; in other embodiments, the heat-dissipating fan and the cold-conducting fan can also be axial flow fans or other fans.

[0054] See also Figures 4 to 6 Furthermore, in the heat dissipation assembly 5, a heat conductive base 53 is arranged at one axial end of the heat dissipation fin group 51, and a surface of the heat conductive base 53 on one side facing away from the heat dissipation fin group 51 is in contact with the hot end of the semiconductor cooling plate 4, so that the heat conductive base 53 can conduct the heat generated by the hot end of the semiconductor cooling plate 4 to the heat dissipation fin group 51.

[0055] Similarly, in the cooling assembly 6, the cooling base 63 is arranged at one axial end of the cooling fin group 61, and the side surface of the cooling base 63 facing away from the cooling fin group 61 is in contact with the cold end of the semiconductor cooling plate 4, so that the cooling base 63 can conduct the cold generated by the cold end of the semiconductor cooling plate 4 to the cooling fin group 61.

[0056] Specifically, in this embodiment, the heat-conducting base 53 and the cooling base 63 are both truncated cone-shaped. The heat-dissipating fin group 51 and the semiconductor cooling sheet 4 are respectively located on both sides of the axial direction of the heat-conducting base 53. On a plane perpendicular to the axial direction of the heat-conducting base 53, the projection of the heat-conducting base 53 completely blocks the projection of the semiconductor cooling sheet 4. The cooling fin group 61 and the semiconductor cooling sheet 4 are respectively located on both sides of the axial direction of the cooling base 63. On a plane perpendicular to the axial direction of the cooling base 63, the projection of the cooling base 63 completely blocks the projection of the semiconductor cooling sheet 4. In this way, the heat and cold generated by the semiconductor cooling sheet 4 can be conducted and utilized to the maximum extent.

[0057] Furthermore, each of the fins extends straight from the inner end to the outer end, thereby shortening the flow path of heat or cold between adjacent fins and improving heat exchange efficiency.

[0058] Furthermore, each of the fins of the heat dissipation fin group 51 extends straight along the axial direction of the heat dissipation fin group 51, thereby facilitating the heat dissipation centrifugal fan 52 to blow the heat on the fins into the hot air duct 32, thereby improving the heat dissipation efficiency; each of the fins of the cooling fin group 61 extends straight along the axial direction of the cooling fin group 61, thereby facilitating the cooling centrifugal fan 62 to blow the cold on the fins into the cold air duct 34, thereby improving the cooling efficiency.

[0059] Furthermore, the heat dissipation fin group 51 and the thermal conductive base 53 are integrally arranged, and the cooling fin group 61 and the cooling base 63 are also integrally arranged, thereby reducing the assembly process and improving the connection strength between the heat dissipation fin group 51 and the thermal conductive base 53 and between the cooling fin group 61 and the cooling base 63.

[0060] Preferably, the heat-conducting base 53 and the cold-conducting base 63 are made of metal plates or alloy plates with good thermal conductivity, which can improve the conductivity and heat exchange efficiency of the heat and cold generated by the semiconductor cooling plate 4. In this embodiment, the heat-conducting base 53 and the cold-conducting base 63 are both made of aluminum plates.

[0061] Furthermore, in this example, the heat dissipation fin group 51 and the cooling fin group 61 are both in a circular shape. On the one hand, the number of air outlet channels is increased, 360° air outlet can be achieved, and the heat exchange efficiency is improved. On the other hand, they can adapt to the hot air duct 32 and the cold air duct 34 in the thermal insulation door body 3, while ensuring the air outlet efficiency, reducing the space occupied by the hot air duct 32 and the cold air duct 34.

[0062] See also Figures 2 to 5 Furthermore, the horizontal refrigeration cabinet 100 includes two of the semiconductor refrigeration systems and two of the air duct systems respectively cooperating with the two semiconductor refrigeration systems. The two hot air ducts 32 in the two air duct systems are arranged at intervals left and right, and the two cold air ducts 34 in the two air duct systems are arranged at intervals front and back, thereby increasing the refrigeration efficiency of the horizontal refrigeration cabinet 100 and improving the uniformity of cold distribution in the storage compartment 2.

[0063] Specifically, in this embodiment, the two hot air ducts 32 are arranged in parallel, and the two cold air ducts 34 are also arranged in parallel, and the two hot air ducts 32 are extended forward and backward to shorten the length of the hot air ducts 32 and accelerate heat dissipation. The two cold air ducts 34 are extended left and right to increase the flow path of the cold air in the storage compartment 2, so that the cold air in the storage compartment 2 is evenly distributed.

[0064] In this embodiment, the two semiconductor refrigeration systems are configured as follows: the distance between the heat dissipation component 5 of one of them and the front side 37 of the insulation door body 3 is smaller than the distance between it and the rear side 38 of the insulation door body 3, and the distance between the cooling component 6 of the one of them and the left side 39 of the insulation door body 3 is larger than the distance between it and the right side 30 of the insulation door body 3; among the two semiconductor refrigeration systems, the distance between the heat dissipation component 5 of the other one and the front side 37 of the insulation door body 3 is larger than the distance between it and the rear side 38 of the insulation door body 3, and the distance between the cooling component 6 of the one of them and the left side plate of the insulation door body 3 is smaller than the distance between it and the right side 30 of the insulation door body 3.

[0065] In other embodiments, it can also be set as follows: in the two semiconductor refrigeration systems, the distance between the heat dissipation component 5 of one and the front side 37 of the insulation door body 3 is greater than the distance between it and the rear side 38 of the insulation door body 3, and the distance between the cooling component 6 of the one and the left side 39 of the insulation door body 3 is greater than the distance between it and the right side 30 of the insulation door body 3; in the two semiconductor refrigeration systems, the distance between the heat dissipation component 5 of the other and the front side 37 of the insulation door body 3 is less than the distance between it and the rear side 38 of the insulation door body 3, and the distance between the cooling component 6 of the one and the left side plate of the insulation door body 3 is less than the distance between it and the right side 30 of the insulation door body 3.

[0066] In this way, the two semiconductor refrigeration systems are staggered in the front-to-back direction and the left-to-right direction, which not only reasonably utilizes the space inside the thermal insulation door body 3, avoids the increase in thickness of the thermal insulation door body 3, local thinning of the thermal insulation layer 31, and poor thermal insulation performance caused by the stacking of the two semiconductor refrigeration systems, but also reduces the heat exchange between the two hot air ducts 32 and the two cold air ducts 34, and also improves the cold supply, cooling efficiency and temperature uniformity in the storage room 2.

[0067] Furthermore, the horizontal refrigeration cabinet 100 further includes a controller and a sensor, wherein the sensor is disposed on at least one of the heat preservation door body 3 and the cabinet body 1, and the sensor detects the position information of the heat preservation door body 3 and the cabinet body 1, and the controller is connected to the sensor and is used to control the semiconductor refrigeration system to be powered on and turned on according to the position information, so that the semiconductor refrigeration system provides coldness to the storage room 2. In this way, it is possible to judge whether the heat preservation door body 3 is in an open or closed state according to the position information of the heat preservation door body 3 and the cabinet body 1, and when the sensor detects that the heat preservation door body 3 is in a closed state, the controller controls the semiconductor refrigeration system to be powered on and turned on to provide refrigeration to the storage room 2; when the sensor detects that the heat preservation door body 3 is in an open state, the controller controls the semiconductor refrigeration system to be powered on and stopped refrigeration, thereby improving the intelligence level of the horizontal refrigeration cabinet 100.

[0068] Compared with the prior art, the horizontal refrigerator 100 provided by the present invention has the beneficial effect that, by arranging the semiconductor refrigeration system in the thermal insulation door body 3, on the one hand, it can avoid that the refrigeration system is arranged in the cabinet body 1 and affects the volume ratio of the storage room 2, and the semiconductor refrigeration system occupies a smaller space, which reduces the volume and occupied space of the horizontal refrigerator 100 as a whole, and facilitates storage and transportation; on the other hand, the thermal insulation layer 31 of the thermal insulation door body 3 can not only isolate the cold energy generated by the cooling mechanism from being dissipated to the external environment of the horizontal refrigerator 100 through the thermal insulation door body 3, but also can avoid the heat supply mechanism from dissipating heat into the storage room 2, thereby greatly improving the cooling efficiency.

[0069] In the description of the present invention, it should be understood that the words "up", "down", "inside", "outside", "left", "right", "front", "back", etc. indicating directions or positional relationships in the present invention are all with reference to the directions defined in the text, and these words indicating directions or positional relationships are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0070] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0071] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A horizontal refrigeration cabinet, comprising a cabinet body enclosing a storage compartment and a heat-insulating door body disposed above the cabinet body to open and close an upper opening of the storage compartment, characterized in that: The horizontal refrigerator also includes a semiconductor refrigeration system, which is arranged in the thermal insulation door body. The cooling mechanism of the semiconductor refrigeration system is insulated and isolated from the external environment of the horizontal refrigerator through the thermal insulation layer of the thermal insulation door body and supplies cold air to the storage room. The heating mechanism of the semiconductor refrigeration system is insulated and isolated from the storage room through the thermal insulation layer of the thermal insulation door body and radiates heat to the external environment of the horizontal refrigerator. An air duct system is arranged in the thermal insulation door body, and the air duct system includes a hot air duct, an installation cavity and a cold air duct arranged in sequence from top to bottom. The extension directions of the hot air duct and the cold air duct intersect with each other. The mounting cavity is respectively connected with the hot air duct and the cold air duct, and the insulation layer includes an insulation sheet formed at the intersection of the hot air duct and the cold air duct; the lower cover plate of the insulation door body is provided with a first air supply port and a second air supply port, and the cold air duct includes a third air duct connecting the mounting cavity and the first air supply port, and a fourth air duct connecting the mounting cavity and the second air supply port, and the cabinet body is provided with two air supply ports, and the two air supply ports are respectively extended up and down in the opposite side walls of the cabinet body, one of the two air supply ports is connected with the first air supply port and the storage compartment, and the other is connected with the second air supply port and the storage compartment.

2. The horizontal refrigerating cabinet according to claim 1, characterized in that: The extension directions of the hot air duct and the cold air duct are not parallel to each other, and the installation cavity is arranged at the intersection of the hot air duct and the cold air duct; The cooling mechanism includes a cold end of a semiconductor refrigeration plate and a cooling component, and the heating mechanism includes a hot end of a semiconductor refrigeration plate and a heat dissipation component. The semiconductor refrigeration plate is accommodated in the installation cavity and isolates the hot air duct and the cold air duct in the installation cavity. The cooling component is thermally connected to the cold end and extends from the cold end to the cold air duct, and the heat dissipation component is thermally connected to the hot end and extends from the hot end to the hot air duct.

3. The horizontal refrigerating cabinet according to claim 2, characterized in that: The extension directions of the hot air duct and the cold air duct are perpendicular to each other.

4. The horizontal refrigerating cabinet according to claim 2, characterized in that: The installation cavity is configured as a channel that passes through the heat insulation sheet from top to bottom, and the semiconductor cooling sheet is placed horizontally in the channel with its periphery in contact with the inner wall of the installation cavity.

5. The horizontal refrigerating cabinet according to claim 2, characterized in that: A first groove is provided on the upper surface of the insulation layer, and the groove wall of the first groove and the upper cover plate of the insulation door body enclose the hot air duct; a second groove is provided on the lower surface of the insulation layer, and the groove wall of the second groove and the lower cover plate of the insulation door body enclose the cold air duct.

6. The horizontal refrigerating cabinet according to claim 5, characterized in that: The side of the heat-insulating door body is provided with a first air outlet and a second air outlet, and the hot air duct includes a first air duct connecting the installation cavity and the first air outlet, and a second air duct connecting the installation cavity and the second air outlet.

7. The horizontal refrigerating cabinet according to claim 6, characterized in that: The first air outlet and the second air outlet are relatively arranged at the front side and the rear side of the thermal insulation door body, the first air supply outlet and the second air supply outlet are respectively arranged at the left end and the right end of the thermal insulation door body, and the length of the thermal insulation door body along the left-right direction is greater than its length along the front-back direction.

8. The horizontal refrigerating cabinet according to claim 7, characterized in that: The inner wall surfaces of the two opposite side walls of the cabinet are respectively provided with third air supply ports, and the third air supply ports are connected with the storage compartment and the air supply duct.

9. The horizontal refrigerating cabinet according to claim 8, characterized in that: A plurality of the third air supply openings are arranged side by side at intervals in the upper and lower directions on each of the side walls, and the areas of the plurality of the third air supply openings gradually increase from top to bottom.

10. The horizontal refrigerating cabinet according to claim 5, characterized in that: The heat dissipation component includes a heat dissipation fan, the upper cover plate is provided with an air inlet, and the air inlet is connected to the air intake port of the heat dissipation fan and the external environment of the horizontal refrigeration cabinet; the cooling component includes a cooling fan, the lower cover plate is provided with a return air port, and the return air port is connected to the storage compartment and the air intake port of the cooling fan.

11. The horizontal refrigerating cabinet according to claim 2, characterized in that: The heat dissipation assembly includes a heat dissipation fin group, a heat dissipation centrifugal fan, and a heat conduction base that heat-conductingly connects the heat dissipation fin group and the hot end, the heat dissipation fin group is annular and its inner annular surface surrounds a heat dissipation cavity, the heat dissipation centrifugal fan is arranged in the heat dissipation cavity, the heat dissipation fin group includes a plurality of heat dissipation fins, and the air blown by the heat dissipation centrifugal fan is sent to the hot air duct through the gaps between adjacent heat dissipation fins; The cooling assembly includes a cooling fin group, a cooling centrifugal fan, and a cooling base that thermally connects the cooling fin group and the cold end. The cooling fin group is annular and its inner annular surface encloses a cooling cavity. The cooling centrifugal fan is arranged in the cooling cavity. The cooling fin group includes a plurality of cooling fins. The air blown out by the cooling centrifugal fan is delivered to the cold air duct through the gaps between adjacent cooling fins.

12. The horizontal refrigerating cabinet according to claim 2, characterized in that: It comprises two semiconductor refrigeration systems and two air duct systems respectively cooperating with the two semiconductor refrigeration systems. The two hot air ducts in the two air duct systems are arranged at intervals left and right, and the two cold air ducts in the two air duct systems are arranged at intervals front and back.

13. The horizontal refrigerating cabinet according to claim 12, characterized in that: The two hot air ducts both extend front to back, and the two cold air ducts both extend left to right; in the two semiconductor refrigeration systems, the distance between the heat dissipation component of one and the front side of the thermal insulation door body is smaller than the distance between it and the rear side of the thermal insulation door body, and the distance between the cooling component of the one and the left side of the thermal insulation door body is larger than the distance between it and the right side of the thermal insulation door body; in the two semiconductor refrigeration systems, the distance between the heat dissipation component of the other and the front side of the thermal insulation door body is larger than the distance between it and the rear side of the thermal insulation door body, and the distance between the cooling component of the one and the left side plate of the thermal insulation door body is smaller than the distance between it and the right side of the thermal insulation door body; Alternatively, among the two semiconductor refrigeration systems, the distance between the heat dissipation component of one and the front side edge of the thermal insulation door body is greater than the distance between it and the rear side edge of the thermal insulation door body, and the distance between the cooling component of that one and the left side edge of the thermal insulation door body is greater than the distance between it and the right side edge of the thermal insulation door body; among the two semiconductor refrigeration systems, the distance between the heat dissipation component of the other one and the front side edge of the thermal insulation door body is less than the distance between it and the rear side edge of the thermal insulation door body, and the distance between the cooling component of that one and the left side plate of the thermal insulation door body is less than the distance between it and the right side edge of the thermal insulation door body.

14. The horizontal refrigerating cabinet according to claim 2, characterized in that: It also includes a controller and a sensor, wherein the sensor is arranged on at least one of the thermal insulation door body and the cabinet body, and the sensor detects position information of the thermal insulation door body and the cabinet body. The controller is connected to the sensor and is used to control the semiconductor refrigeration system to be powered on according to the position information, so that the semiconductor refrigeration system provides cooling to the storage room.

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