Heater array and substrate processing apparatus comprising a heater array

Abstract

The present application provides a heater array and a substrate processing apparatus including the same. The substrate processing apparatus can include a process chamber capable of performing a desired process, a support unit disposed in the process chamber, and a heater array disposed in the support unit. The heater array can include a plurality of heaters providing a plurality of heating zones, a plurality of diodes electrically connected to the plurality of heaters, respectively, and a controller operating the plurality of heaters. In the plurality of heating zones, adjacent diodes can be arranged in opposite directions. The present application can reduce the number of control lines for the heater array, and in the case where the heater array includes a large number of heaters in order to provide a large number of heating zones, the substrate processing apparatus including the heater array can also have a simplified structure.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2020-0187300, filed with the Korean Intellectual Property Office on December 30, 2020. Technical Field

[0002] The exemplary embodiments of the present invention relate to heater arrays and substrate processing apparatus including heater arrays. More specifically, the exemplary embodiments of the present invention relate to heater arrays having a simple matrix structure and substrate processing apparatus including such heater arrays. Background Technology

[0003] A substrate processing apparatus for manufacturing integrated circuit devices including semiconductor devices or display devices including flat panel display devices can generally include various engineering chambers such as deposition chambers, sputtering chambers, etching chambers, cleaning chambers, and drying chambers. Such engineering chambers may include a support unit on top for placing the substrate and a matrix-structured heater array capable of heating the substrate.

[0004] Existing matrix-structured heater arrays have a configuration where all diodes electrically connected to multiple heaters are arranged in one direction. To operate the multiple heaters individually, control circuitry is required to sum the number of columns and rows in the matrix structure. However, when the number of heaters in the heater array is increased to provide a larger heating area, the wiring for electrically connecting the components of the substrate processing apparatus including the heater array can become complex, potentially increasing the structural complexity of the substrate processing apparatus. Summary of the Invention

[0005] Technical issues

[0006] One aspect of the present invention provides a heater array that can have a simplified matrix structure by reducing the number of control lines.

[0007] Another aspect of the present invention provides a substrate processing apparatus including a heater array that can have a simplified matrix structure by reducing the number of control lines.

[0008] Technical solution

[0009] One aspect of the invention provides a heater array comprising: a plurality of heaters providing a plurality of heating regions, a plurality of diodes electrically connected to the plurality of heaters respectively, and a controller for operating the plurality of heaters. In this case, adjacent diodes within the plurality of heating regions may be arranged in substantially opposite directions.

[0010] In an exemplary embodiment, the heater array may have a 2x2 matrix structure, and the directions of the diodes electrically connected to the heaters arranged in the first column of the matrix structure and the directions of the diodes electrically connected to the heaters arranged in the second column of the matrix structure may be substantially opposite.

[0011] In some exemplary embodiments, the heater array may have an N x N (where N is a positive integer) matrix structure, and the directions of the diodes electrically connected to the heaters arranged in the odd-numbered columns of the matrix structure and the directions of the diodes electrically connected to the heaters arranged in the even-numbered columns of the matrix structure may be substantially opposite.

[0012] In an exemplary embodiment, the controller may include multiple control lines for operating the plurality of heaters.

[0013] In an exemplary embodiment, the heater array may have a 2x2 matrix structure, and the number of control lines for operating the 2x2 heaters of the matrix structure may be three.

[0014] In some exemplary embodiments, the heater array may have an N x N matrix structure, and the number of control lines for operating the N x N heaters of the matrix structure may be (N+N) / 2.

[0015] In an exemplary embodiment, the controller may include a plurality of switches for operating the plurality of heaters.

[0016] In an exemplary embodiment, the heater array may have a matrix structure, and the controller may include a first switch electrically connected to heaters configured in columns of the matrix structure and a second switch electrically connected to heaters configured in rows of the matrix structure.

[0017] In an exemplary embodiment, the heater array may have a 2x2 matrix structure, and the controller may include two first switches and four second switches.

[0018] In some exemplary embodiments, the heater array may have an N x N matrix structure, and the controller may include N first switches and 2N second switches.

[0019] In another aspect of the invention, a substrate processing apparatus is provided, comprising an engineering chamber capable of performing desired processes, a support unit disposed within the engineering chamber, and a heater array disposed within the support unit. In this case, the heater array may include a plurality of heaters providing a plurality of heating regions, a plurality of diodes electrically connected to the plurality of heaters respectively, and a controller for operating the plurality of heaters, wherein adjacent diodes in the plurality of heating regions may be arranged in substantially opposite directions.

[0020] In an exemplary embodiment, the engineering chamber may include an etching chamber, a deposition chamber, a sputtering chamber, a coating chamber, an exposure chamber, a developing chamber, a cleaning chamber, or a drying chamber.

[0021] In an exemplary embodiment, the support unit may be substantially plate-shaped, and the heater array may have a matrix structure.

[0022] In an exemplary embodiment, the heater array may have a 2x2 matrix structure, and the directions of the diodes electrically connected to the heaters arranged in the first column of the matrix structure and the directions of the diodes electrically connected to the heaters arranged in the second column of the matrix structure may be substantially opposite.

[0023] In some exemplary embodiments, the heater array may have an N x N matrix structure, and the directions of the diodes electrically connected to the heaters arranged in the odd-numbered columns of the matrix structure and the directions of the diodes electrically connected to the heaters arranged in the even-numbered columns of the matrix structure may be substantially opposite.

[0024] In an exemplary embodiment, the controller may include multiple control lines and multiple switches for operating the plurality of heaters.

[0025] In an exemplary embodiment, the heater array may have a 2x2 matrix structure, and the number of control lines for operating the 2x2 heaters of the matrix structure may be three.

[0026] In some exemplary embodiments, the heater array has an N x N matrix structure, and the number of control lines for operating the N x N heaters of the matrix structure can be N+N / 2.

[0027] In an exemplary embodiment, the heater array may have a 2x2 matrix structure, and the controller may include two first switches electrically connected to heaters arranged in columns of the matrix structure and four second switches electrically connected to heaters arranged in rows of the matrix structure.

[0028] In some exemplary embodiments, the heater array may have an N x N matrix structure, and the controller may include N first switches electrically connected to heaters arranged in columns of the matrix structure and 2N second switches electrically connected to heaters arranged in rows of the matrix structure.

[0029] Technical effect

[0030] According to an exemplary embodiment of the present invention, since adjacent diodes in a heater array with a matrix structure can be arranged in opposite directions, the direction of current flowing in the heater can be controlled by additional switches and diodes, thus reducing the number of control lines for the heater array. Therefore, even when the heater array includes a large number of heaters to provide more heating areas, the substrate processing apparatus including the heater array can also have a simplified structure.

[0031] However, the technical effects of the present invention are not limited to the above-mentioned technical effects, and various expansions can be made without exceeding the scope of the ideas and fields of the present invention. Attached Figure Description

[0032] Figure 1 This is a circuit diagram used to illustrate an existing heater array;

[0033] Figure 2 This is a circuit diagram illustrating a heater array according to an exemplary embodiment of the present invention;

[0034] Figure 3 and Figure 4 This is a circuit diagram illustrating a control method for a heater array according to an exemplary embodiment of the present invention;

[0035] Figure 5 This is a plan view illustrating a substrate processing apparatus for an exemplary embodiment of a heater array according to the present invention. Detailed Implementation

[0036] The following describes exemplary embodiments of the present invention. The present invention can be modified in various ways and can be implemented in many different manners; the embodiments provide a detailed description of the invention. However, this is not intended to limit the invention to a specific mode of disclosure, and should be understood to include all modifications, equivalents, and substitutions within the scope of the invention's concept and technology. Similar reference numerals are used for similar constituent elements in the description of the drawings. Terms such as "first," "second," etc., can be used to describe multiple constituent elements, but the constituent elements are not limited by the terms. The terms are merely used to distinguish one constituent element from other constituent elements. The terminology used in this application is only for describing specific embodiments and is not intended to limit the invention. The singular form also includes the plural form unless otherwise explicitly stated herein. Terms such as "comprising," "having," or "possessing" as used in this application should be understood as the presence of the features, numbers, steps, operations, constituent elements, components, or combinations thereof described in the specification, and should not be construed as pre-excluding the existence or additional possibilities of one or more other features, numbers, steps, operations, constituent elements, components, or combinations thereof.

[0037] Unless otherwise defined, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in commonly used dictionaries shall be interpreted in a meaning consistent with the context of the relevant art and shall not be construed as ideal or overly formal unless expressly defined in this application.

[0038] The exemplary embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. The same reference numerals are used for the same constituent elements in the drawings, and repeated descriptions of the same constituent elements are omitted.

[0039] To manufacture integrated circuit devices including semiconductor devices or display devices including flat panel display devices, the substrate processing apparatus may have various engineering chambers, but is not limited to, including deposition chambers, etching chambers, sputtering chambers, coating chambers, exposure chambers, developing chambers, cleaning chambers, and drying chambers. Within these various engineering chambers, multiple processes, including deposition, etching, sputtering, coating, exposure, developing, cleaning, or drying processes, can be performed on the substrate, but is not limited to these.

[0040] Typically, a support unit for supporting a substrate positioned on top can be provided within the engineering chamber. The support unit may include a support plate capable of supporting the substrate and a heater array capable of heating the substrate during the required processes performed on the substrate within the engineering chamber. Optionally, the heater array may also be disposed within the support plate. The heater array may have a matrix structure comprising multiple heaters that heat the substrate to a predetermined temperature. For example, the heater array may include multiple heaters arranged in a matrix structure to provide multiple heating zones, multiple diodes electrically connected to the multiple heaters, a controller for controlling the multiple heaters, and a harness for electrically connecting the multiple heaters and the multiple diodes to the controller.

[0041] Figure 1 This is a circuit diagram used to illustrate an existing heater array. Figure 1 In the diagram, the portion indicated by a single-dot dashed line represents multiple heaters and multiple diodes, the portion indicated by a dashed line represents a wiring harness, and the portion indicated by a two-dot dashed line represents a controller.

[0042] like Figure 1As shown, a conventional heater array has a matrix structure in which the plurality of diodes electrically connected to the plurality of heaters are arranged in one direction. In a conventional heater array having switches Sa, Sb, S1 and S2, in order to operate the heaters located in the first row and first column (i.e., [1, 1]) of the matrix structure, switches Sa and S1 are turned on.

[0043] Having such Figure 1 The existing heater array with a 2x2 matrix structure shown requires 4 control lines to operate 4 heaters. Therefore, when the existing heater array has an N x N matrix structure (where N is a positive integer), 2N control lines are needed to operate N x N heaters. As the number of heaters in the heater array increases, the wiring structure for electrical connection components within the existing substrate processing device including the heater array may become more complex, and the space for the heater array may increase, thus complicating the overall structure of the substrate processing device.

[0044] To address the aforementioned problems, the heater array according to the exemplary embodiment may have a structure in which adjacent diodes in multiple heating regions can be arranged in opposite directions.

[0045] Figure 2 This is a circuit diagram illustrating a heater array according to an exemplary embodiment of the present invention. Figure 2 In the diagram, the portion indicated by a single-dot dashed line represents multiple heaters and multiple diodes, the portion indicated by a dashed line represents a wiring harness, and the portion indicated by a two-dot dashed line represents a controller.

[0046] See Figure 2 According to an exemplary embodiment, the heater array may have a 2x2 matrix structure. In this case, the heater array may include a plurality of heaters, a plurality of diodes electrically connected to the plurality of heaters, a controller for operating the plurality of heaters, and a wiring harness electrically connecting the plurality of heaters and the plurality of diodes to the controller. In this case, the controller may include a power supply and a plurality of control lines for controlling the plurality of heaters respectively. Furthermore, the controller may include a plurality of switches capable of adjusting the flow of current through the plurality of control lines.

[0047] In an exemplary embodiment, the heater array may have a matrix structure, wherein the controller may include a plurality of first switches Sa, Sb electrically connected to heaters arranged in columns of the matrix structure and a plurality of second switches S1a, S1b, S2a, S2b electrically connected to heaters arranged in rows of the matrix structure.

[0048] In the heater array having the above configuration, the plurality of heaters and the plurality of diodes can provide a plurality of heating regions, in which adjacent diodes can be arranged in substantially opposite directions.

[0049] like Figure 2 As illustrated, when the heater array has a 2x2 matrix structure, the diodes electrically connected to the heaters arranged in the first column of the matrix structure can be arranged in the opposite direction to the arrangement direction of the diodes electrically connected to the heaters arranged in the second column of the matrix structure. In other words, when the heater array has an NxN matrix structure (where N is a positive integer), the directions of the diodes electrically connected to the heaters arranged in the odd-numbered columns of the matrix structure and the directions of the diodes electrically connected to the heaters arranged in the even-numbered columns of the matrix structure can be substantially opposite.

[0050] The controller for the heater array may include multiple switches for operating the plurality of heaters and the plurality of diodes arranged in opposite directions. For example, if the heater array has a 2x2 matrix structure, the controller may include two first switches Sa and Sb and four second switches S1a, S1b, S2a, and S2b for operating the plurality of heaters and the plurality of diodes. Similarly, if the heater array has an NxN matrix structure, the controller may include N first switches and 2N second switches. In this case, the structure of the wiring harness of the heater array can be unchanged. That is, the wiring harness can be substantially the same as that of an existing heater array. In other words, the heater array can selectively operate one or more desired heaters among the plurality of heaters by controlling additional switches and diodes arranged in opposite directions without substantially changing the wiring harness of the existing heater array. Therefore, the number of wirings for electrical connections in the substrate processing apparatus including the heater array can be reduced, and the substrate processing apparatus can also have a further simplified structure.

[0051] like Figure 2As illustrated, a heater array having the 2x2 matrix structure can generally include three control lines for operating 2x2 heaters. Similarly, when the heater array has the NxN matrix structure, it can include only (N+N) / 2 control lines to operate NxN heaters. In other words, according to the exemplary embodiment, the number of control lines in the heater array can be reduced by more than 25% compared to the number of control lines in conventional heater arrays. Thus, a heater array with a structure that reduces the number of control lines has the advantage of significantly reducing the complexity of the substrate processing apparatus having the heater array, even when the heater array includes more heaters and diodes to provide more heating areas.

[0052] Figure 3 and Figure 4 This is a circuit diagram illustrating a control method for a heater array according to an exemplary embodiment of the present invention.

[0053] Figure 3 The diagram illustrates the configuration of switches for operating heaters arranged in the first row and first column (i.e., [1, 1]) of a heater array with a 2x2 matrix structure. Figure 3 As illustrated, when the controller activates both switches Sb and S1a, current can flow to the heaters located in the first row and first column ([1, 1]), as indicated by arrow I. In this case, within the heater array, the current can flow from the power source along a path including switch S1a, the heaters located in the first row and first column, and switch Sb.

[0054] Figure 4 The configuration of the switches for operating the heaters in the first row and second column (i.e., [1, 2]) is shown. See also Figure 4 When the controller turns on switches Sa and S1b, current can flow to the heaters in the first row and second column ([1, 2]), as shown by arrow II. Within the heater array, the current can flow from the power source along a path including switch S1b, the heaters located in the first row and second column, and switch Sa.

[0055] exist Figure 3 and Figure 4In the illustrated heater array, the wiring harnesses used to direct current to the heaters located in the first row and first column, and the heaters located in the first row and second column, can be substantially the same as those in existing heater arrays. However, by adjusting the orientation of adjacent diodes so that they flow in the opposite direction to the current flowing through the wiring harness, the current can only flow in one or more of the desired heaters. That is, the heating areas within the heater array can be selectively controlled.

[0056] According to an exemplary embodiment, in the heater array with a matrix structure, the plurality of adjacent diodes can be arranged in opposite directions, and the current can flow to the plurality of heaters in both the forward and reverse directions through additional switches and the diodes. This reduces the number of control lines required for the heaters. Consequently, even when the heater array includes a large number of heaters and diodes to provide a larger heating area within the heater array, the substrate processing apparatus including the heater array can also have a simplified structure.

[0057] Figure 5 This is a plan view illustrating a substrate processing apparatus for an exemplary embodiment of a heater array according to the present invention.

[0058] See Figure 5 The substrate processing apparatus may include a transposition module 20 and a processing module 55. The transposition module 20 is capable of transferring a substrate from the outside into the processing module 55, and the processing module 55 is capable of performing predetermined processes on the substrate. In this case, the substrate can be used to manufacture integrated circuit devices or display devices. For example, the substrate may include silicon wafers, glass substrates, organic substrates, etc.

[0059] The transposition module 20 may include a loading cavity 10 and a transfer frame 15. The loading cavity 10 may hold a carrier 25 capable of accommodating the substrate. The transfer frame 15 may transfer the substrate between the carrier 25 loaded in the loading cavity 10 and the processing module 55. The transfer frame 15 may include a transposition robot 30 and a transposition track 35.

[0060] The transposition robot 30 can move along the transposition track 35 and can transfer the substrate between the transposition module 20 and the processing module 55. For example, the transposition robot 30 can transfer the substrate between the carrier 25 and the buffer groove 60 while moving on the transposition track 35.

[0061] The processing module 55 is capable of performing predetermined processes on the substrate, including deposition, etching, sputtering, coating, developing, cleaning, and drying processes, but is not limited thereto. The processing module 55 may include a buffer chamber 40, a transfer chamber 45, an engineering chamber 50, a control unit (not shown), etc.

[0062] For the aforementioned processing step, the substrate transferred between the transposition module 20 and the processing module 55 can be temporarily housed within the buffer cavity 40. The buffer cavity 40 may include a buffer groove 60 at the top for placing the substrate. For example, the buffer cavity 40 may include multiple buffer grooves 60, thus multiple substrates can be housed within the buffer cavity 40.

[0063] The transfer chamber 45 is capable of transferring the substrate between the buffer chamber 40 and the engineering chamber 50. The transfer chamber 45 may include a transfer robot 65 and a transfer track 70. The transfer robot 65 is capable of moving along the transfer track 70 and transferring the substrate between the buffer chamber 40 and the engineering chamber 50. For example, as the transfer robot 65 moves along the transfer track 70, it can transfer the substrate located on the buffer groove 60 into the engineering chamber 50.

[0064] In an exemplary embodiment, for manufacturing an integrated circuit device including a semiconductor device or a display device including a flat panel display device, the substrate processing apparatus may include a plurality of engineering chambers 50 capable of performing various processes. For example, the plurality of engineering chambers 50 may include, but are not limited to, etching chambers, deposition chambers, sputtering chambers, coating chambers, exposure chambers, developing chambers, cleaning chambers, drying chambers, etc. The required processes, including deposition, sputtering, etching, coating, exposure, developing, cleaning, and / or drying processes, can be performed within the engineering chambers 50.

[0065] The engineering chamber 50 may include a support unit on which the substrate to be processed is placed. The support unit may include a support plate supporting the substrate and a heater array for heating the substrate during the required processes. The heater array may have [see reference 1] Figure 2The described heater array has a substantially identical structure. In other words, the heater array may include multiple heaters providing multiple heating zones for heating the substrate, multiple diodes electrically connected to the multiple heaters, a controller including multiple switches for controlling the multiple heaters, and a wiring harness electrically connecting the multiple heaters and the multiple diodes to the controller. The heater array can have a structure in which multiple adjacent diodes are arranged in opposite directions, and current flows to the multiple heaters in both forward and reverse directions through the multiple switches, thereby reducing the number of control lines for the heater array. Therefore, the substrate processing apparatus including the heater array can have a more simplified structure.

[0066] According to an exemplary embodiment of the present invention, in a heater array with a matrix structure, adjacent diodes can be arranged in opposite directions, and the direction of current flowing to the heaters can be controlled by additional switches and diodes, thus reducing the number of control lines used for the heater array. Therefore, even when the heater array includes a large number of heaters to provide more heating areas, the substrate processing apparatus including the heater array can also have a simplified structure.

[0067] The above describes exemplary embodiments of the present invention, but those skilled in the art should understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the present invention as described in the technical solutions.

Claims

1. A heater array, characterized in that, include: Multiple heaters are provided for multiple heating zones; Multiple diodes are electrically connected to the plurality of heaters respectively; as well as The controller that operates the plurality of heaters, The heater has an N x N matrix structure, where N is a positive integer; in each column of the heater matrix structure, the diodes electrically connected to the heaters in the odd-numbered positions of the matrix structure are in the opposite direction to the diodes electrically connected to the heaters in the even-numbered positions of the matrix structure; in each row of the heater matrix structure, the diodes electrically connected to each heater in each row are in the same direction. The controller includes N first switches electrically connected to heaters configured in columns of the matrix structure and 2N second switches electrically connected to heaters configured in rows of the matrix structure. In each column of the heater matrix structure, the diodes electrically connected to each heater in each column are connected to two second switches arranged in parallel. The two second switches are respectively connected to the positive and negative terminals of the power supply. The N first switches are connected to the positive or negative terminal of the power supply according to the orientation of the plurality of diodes.

2. The heater array according to claim 1, characterized in that: The heater array has a 2 x 2 matrix structure, with the diodes electrically connected to the heaters in the first column of the matrix structure having opposite directions to those electrically connected to the heaters in the second column of the matrix structure.

3. The heater array according to claim 1, characterized in that: The controller includes multiple control lines for operating the plurality of heaters.

4. The heater array according to claim 3, characterized in that: The heater array has a 2 x 2 matrix structure, and the number of control lines for operating the 2 x 2 heaters of the matrix structure is 3.

5. The heater array according to claim 3, characterized in that: The heater array has an N x N matrix structure, and the number of control lines for operating the N x N heaters in the matrix structure is (N+N) / 2.

6. The heater array according to claim 1, characterized in that: The heater array has a 2 x 2 matrix structure, and the controller includes two first switches and four second switches.

7. A substrate processing apparatus, characterized in that, include: An engineering chamber capable of performing the required procedures; A support unit configured within the engineering chamber; as well as The heater array configured in the support unit The heater array includes multiple heaters providing multiple heating zones, multiple diodes electrically connected to the multiple heaters, and a controller for operating the multiple heaters. The heater has an N x N matrix structure, where N is a positive integer; in each column of the heater matrix structure, the diodes electrically connected to the heaters in the odd-numbered positions of the matrix structure are in the opposite direction to the diodes electrically connected to the heaters in the even-numbered positions of the matrix structure; in each row of the heater matrix structure, the diodes electrically connected to each heater in each row are in the same direction. The controller includes N first switches electrically connected to heaters configured in columns of the matrix structure and 2N second switches electrically connected to heaters configured in rows of the matrix structure. In each column of the heater matrix structure, the diodes electrically connected to each heater in each column are connected to two second switches arranged in parallel. The two second switches are respectively connected to the positive and negative terminals of the power supply. The N first switches are connected to the positive or negative terminal of the power supply according to the orientation of the plurality of diodes.

8. The substrate processing apparatus according to claim 7, characterized in that: The engineering chambers include etching chambers, deposition chambers, sputtering chambers, coating chambers, exposure chambers, developing chambers, cleaning chambers, or drying chambers.

9. The substrate processing apparatus according to claim 7, characterized in that: The support unit is plate-shaped, and the heater array has a matrix structure.

10. The substrate processing apparatus according to claim 9, characterized in that: The heater array has a 2 x 2 matrix structure, with the diodes electrically connected to the heaters in the first column of the matrix structure having opposite directions to those electrically connected to the heaters in the second column of the matrix structure.

11. The substrate processing apparatus according to claim 9, characterized in that: The controller includes multiple control lines for operating the plurality of heaters.

12. The substrate processing apparatus according to claim 11, characterized in that: The heater array has a 2 x 2 matrix structure, and the number of control lines for operating the 2 x 2 heaters of the matrix structure is 3.

13. The substrate processing apparatus according to claim 11, characterized in that: The heater array has an N x N matrix structure, and the number of control lines for operating the N x N heaters in the matrix structure is (N+N) / 2.

14. The substrate processing apparatus according to claim 11, characterized in that: The heater array has a 2 x 2 matrix structure, and the controller includes two first switches electrically connected to heaters arranged in columns of the matrix structure and four second switches electrically connected to heaters arranged in rows of the matrix structure.

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