Apparatus for processing a substrate and method for processing a substrate

Abstract

This invention provides a substrate processing apparatus. According to this invention, the substrate processing apparatus processes the substrate by supplying a processing liquid onto a rotating substrate. An exhaust unit for discharging atmosphere from an internal space includes: a first exhaust port for introducing atmosphere into the internal space; a first exhaust line configured to discharge the atmosphere introduced through the first exhaust port in a first direction; and a second exhaust port for introducing atmosphere into the internal space; and a second exhaust line configured to discharge the atmosphere introduced through the second exhaust port in a second direction. A controller controls a support unit such that the exhaust direction inside the first exhaust line and the second exhaust line is positive relative to the rotation direction of the substrate.

Description

Technical Field

[0001] Embodiments of the inventive concept described herein relate to apparatus and methods for processing substrates, and more specifically, to apparatus and methods for processing substrates by supplying liquid onto a rotating substrate. Background Technology

[0002] Various processes, such as photolithography, etching, ashing, thin film deposition, and cleaning, are performed to manufacture semiconductor devices or flat panel display panels. In these processes, photolithography includes supplying photoresist to a semiconductor substrate to form a photoresist film on the substrate's surface, exposing the photoresist film using a photomask, and then supplying a developer to selectively remove portions of the photoresist film.

[0003] Figure 1 This is a schematic cross-sectional view of a substrate processing apparatus for applying photoresist to a substrate, and Figure 2 It is shown schematically in Figure 1 A plan view showing the arrangement of the exhaust unit connected to the processing container in the substrate processing apparatus. (Reference) Figure 1 and Figure 2 The substrate processing apparatus 900 includes a processing container 920 having an internal space 901, a support unit 940 supporting a substrate W in the internal space 901, and a nozzle 980 supplying photoresist to the substrate W placed on the support unit 940.

[0004] An exhaust unit 960 is connected to the bottom wall of the processing container 920 and exhausts the atmosphere from the interior space 901 of the processing container 920. The exhaust unit 960 has a first exhaust line 962, a second exhaust line 964, and a common conduit 966. The first exhaust line 962 exhausts the atmosphere from the interior space 901 of the processing container 920 through a first exhaust port 961, and the second exhaust line 964 exhausts the atmosphere from the interior space 901 of the processing container 901 through a second exhaust port 963. The first exhaust line 962 and the second exhaust line 964 are connected to the common conduit 966, and the airflow exhausted from the interior space 901 through the first exhaust port 961 and the second exhaust port 963 flows into the common conduit 966.

[0005] Figure 3 It shows when using Figure 1 The exhaust state of the atmosphere in the internal space 901 of the processing container 920 when the substrate processing apparatus 900 processes a substrate. (Reference) Figure 3When the substrate (or support unit) rotates clockwise while supplying photoresist to process the substrate, the first exhaust line 962 is configured to exhaust in the direction positive relative to the rotation direction of the substrate, but the second exhaust line 964 is configured to exhaust in the opposite direction relative to the rotation direction of the substrate. Therefore, the atmosphere is smoothly discharged through the first exhaust port 961, but the atmosphere through the second exhaust port 963 cannot be smoothly discharged due to eddies generated near the second exhaust port 962. Therefore, the amount of exhaust discharged through the second exhaust port 963 is less than the amount of exhaust discharged through the first exhaust port 961.

[0006] In this case, the exhaust volume deviates between the area in the internal space 901 where the first exhaust port 961 is located and the area where the second exhaust port 963 is located, which affects the uniformity of the photoresist coating thickness between the areas of the substrate.

[0007] Furthermore, as the exhaust gas flowing through the first exhaust line 962 and the exhaust gas flowing through the second exhaust line 964 collide with each other at the point where the first exhaust line 962 and the second exhaust line 964 connect to the common pipe 966, the flow resistance increases, and the atmosphere does not exit from the internal space 901 of the processing container 920 in a predetermined volume, thus causing a process error. Summary of the Invention

[0008] The present invention provides a substrate processing apparatus for improving the efficiency of processing substrates.

[0009] The present invention provides a substrate processing apparatus for smoothly discharging airflow in an internal space by supplying processing liquid to a rotating substrate in the internal space during substrate processing.

[0010] Embodiments of the present invention provide a substrate processing apparatus for forming a liquid film of uniform thickness over the entire area of ​​a substrate by supplying a processing liquid to a rotating substrate.

[0011] The technical problems to be solved by the inventive concept are not limited to those mentioned above, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the inventive concept pertains based on the following description.

[0012] An embodiment of the present invention provides a substrate processing apparatus. The apparatus includes: a processing container having an internal space; a support unit that supports and rotates the substrate within the internal space; and an exhaust unit connected to the processing container and exhausting atmosphere from the internal space. The exhaust unit includes: a first exhaust line having a first exhaust port for introducing atmosphere into the internal space, the first exhaust line being configured to exhaust the atmosphere introduced through the first exhaust port; and a second exhaust line having a second exhaust port for introducing atmosphere into the internal space, the second exhaust line being configured to exhaust the atmosphere introduced through the second exhaust port. When viewed from above, based on a virtual straight line passing through the first exhaust port and the second exhaust port, the first exhaust line exhausts atmosphere in a direction toward one side of the straight line, and the second exhaust line exhausts atmosphere in a direction toward the other side of the straight line.

[0013] In one embodiment, the device further includes a controller for controlling the support unit such that the exhaust direction inside the first exhaust line and the second exhaust line is positive relative to the rotation direction of the substrate.

[0014] In one embodiment, the first exhaust pipe and the second exhaust pipe are respectively arranged in an arc shape.

[0015] In one embodiment, the support unit includes: a support plate that supports the substrate; a drive shaft connected to the support plate; and a driver that rotates the drive shaft, wherein, when viewed from above, the first exhaust line and the second exhaust line have points symmetrical about rotation relative to the center of rotation of the support plate.

[0016] In one embodiment, the first exhaust line and the second exhaust line are connected to the bottom wall of the processing container.

[0017] In one embodiment, the apparatus further includes a liquid supply unit that supplies processing liquid to the substrate supported by the support unit.

[0018] An embodiment of the present invention provides a substrate processing apparatus. The apparatus includes: a first processing unit for processing the substrate, comprising a first processing container having a first internal space and a first support unit supporting and rotating the substrate within the first internal space; a second processing unit for processing the substrate, comprising a second processing container having a second internal space and a second support unit supporting and rotating the substrate within the second internal space; and an exhaust unit for venting air from the first internal space and the second internal space, wherein the first processing unit and the second processing unit are arranged in a row, and the exhaust unit includes: a first common conduit located on a side of the unit arrangement direction based on the unit arrangement direction of the first processing unit and the second processing unit; a second... A common conduit located on the opposite side of the unit arrangement direction; a first exhaust conduit having a first exhaust port for introducing atmosphere into the first interior space and discharging the atmosphere introduced into the first exhaust port through the first common conduit; a second exhaust conduit having a second exhaust port for introducing atmosphere into the first interior space and discharging the atmosphere introduced into the second exhaust port through the second common conduit; a third exhaust conduit having a third exhaust port for introducing atmosphere into the second interior space and discharging the atmosphere introduced into the third exhaust port through the first common conduit; and a fourth exhaust conduit having a fourth exhaust port for introducing atmosphere into the second interior space and discharging the atmosphere entering the fourth exhaust port through the second common conduit.

[0019] In one embodiment, the device further includes a controller for controlling the first support unit and the second support unit, the controller controlling the first support unit and the second support unit such that the exhaust direction inside the first exhaust line, the second exhaust line, the third exhaust line and the fourth exhaust line is a positive direction relative to the rotation direction of the substrate.

[0020] In one embodiment, the first exhaust pipe, the second exhaust pipe, the third exhaust pipe, and the fourth exhaust pipe are each arranged in an arc shape.

[0021] In one embodiment, the first support unit includes: a first support plate supporting the substrate; a first drive shaft connected to the first support plate; and a first driver rotating the first drive shaft, wherein, when viewed from above, the first exhaust line and the second exhaust line have points symmetrical about the rotation center of the first support plate, and the second support unit includes: a second support plate supporting the substrate; a second drive shaft connected to the second support plate; and a second driver rotating the second drive shaft, wherein, when viewed from above, the third exhaust line and the fourth exhaust line have points symmetrical about the rotation center of the second support plate.

[0022] In one embodiment, the first exhaust port, the second exhaust port, the third exhaust port, and the fourth exhaust port are aligned sequentially in the unit arrangement direction.

[0023] In one embodiment, the controller controls the first support unit and the second support unit such that the substrate supported by the first support unit and the substrate supported by the second support unit have the same rotation direction.

[0024] In one embodiment, the apparatus further includes a liquid supply unit for discharging liquid onto the substrate, wherein the liquid supply unit includes: a nozzle; and a nozzle driver that moves the nozzle to a first processing position toward the first supply unit or a second processing position toward the second support unit, such that the nozzle discharges the liquid onto a selected substrate of the substrate supported by the first support unit or the substrate supported by the second support unit.

[0025] An embodiment of the present invention provides a substrate processing apparatus. The apparatus includes: a processing container having an internal space; a support unit that supports and rotates the substrate within the internal space; an exhaust unit connected to the processing container and exhausting atmosphere from the internal space; and a controller that controls the support unit. The exhaust unit includes: a first exhaust line having a first exhaust port for introducing atmosphere into the internal space, the first exhaust line being configured to exhaust the atmosphere introduced through the first exhaust port in a first direction; a second exhaust line having a second exhaust port for introducing atmosphere into the internal space, the second exhaust line being configured to exhaust the atmosphere introduced through the second exhaust port in a second direction; and the controller that controls the support unit such that the exhaust directions within the first exhaust line and the second exhaust line are positive relative to the rotation direction of the substrate.

[0026] In one embodiment, when viewed from above, the first exhaust port and the second exhaust port each have an arc shape.

[0027] In one embodiment, the support unit includes: a support plate that supports the substrate; a drive shaft coupled to the support plate; and a driver that rotates the drive shaft, wherein, when viewed from above, the first exhaust line and the second exhaust line have points symmetrical about rotation relative to the center of rotation of the support plate.

[0028] An embodiment of the present invention provides a substrate processing apparatus. The method includes: processing a substrate using the substrate processing apparatus, the substrate processing apparatus including a processing container having an internal space, a supply unit supporting and rotating the substrate within the internal space, an exhaust unit connected to the processing container and discharging atmosphere from the internal space, and a liquid supply unit supplying processing liquid to the substrate supported by the support unit; while processing the substrate by supplying processing liquid onto the substrate, discharging atmosphere from the internal space through each exhaust port of a plurality of exhaust lines; and rotating the substrate such that the exhaust direction within each exhaust line is positive relative to the rotation direction of the substrate.

[0029] In one embodiment, each exhaust line is arranged in an arc shape.

[0030] In one embodiment, the substrate rotates at a speed of 2000 rpm or higher.

[0031] In one embodiment, the processing liquid is photoresist.

[0032] According to the present invention, a processing liquid is supplied to a substrate rotating within the internal space of a processing container to facilitate the discharge of airflow from the internal space during substrate processing.

[0033] According to some embodiments of the present invention, when a processing liquid is supplied to a rotating substrate to form a liquid film on the substrate, the thickness of the liquid film can be uniformly formed over the entire area of ​​the substrate.

[0034] The effects of this invention are not limited to those described above, and those skilled in the art will clearly understand any effects not mentioned based on this specification and the accompanying drawings. Attached Figure Description

[0035] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals in the various drawings refer to the same parts, and wherein:

[0036] Figure 1 This is a cross-sectional view showing a substrate processing apparatus having a general structure for liquid processing of a substrate while rotating the substrate.

[0037] Figure 2 It is shown Figure 1 A plan view of the exhaust unit of the substrate processing apparatus;

[0038] Figure 3 This shows the use of Figure 1 A view of the airflow during substrate processing by the substrate processing apparatus;

[0039] Figure 4 This is a schematic perspective view illustrating a substrate processing apparatus according to an embodiment of the concept of the present invention;

[0040] Figure 5 It is shown Figure 4 A cross-sectional view of the substrate processing apparatus for the coating block and the developing block;

[0041] Figure 6 yes Figure 4 A plan view of the substrate processing apparatus;

[0042] Figure 7 It is shown Figure 6 A schematic plan view of the conveying robot arm;

[0043] Figure 8 It is shown Figure 6 A schematic floor plan of an example heat treatment chamber;

[0044] Figure 9 yes Figure 6 Front view of the heat treatment chamber;

[0045] Figure 10 It is shown Figure 4 A schematic diagram of an embodiment of the liquid processing chamber of a substrate processing apparatus;

[0046] Figure 11 yes Figure 10 Floor plan of the liquid handling room;

[0047] Figure 12 This is a schematic diagram showing the processing of a substrate in a liquid processing chamber;

[0048] Figure 13 It is shown in Figure 10 The airflow path when the liquid processing chamber processes the substrate;

[0049] Figures 14 to 17 They are shown separately. Figure 11 A view of a modified embodiment of the liquid handling chamber. Detailed Implementation

[0050] The inventive concept can be modified and taken in various forms, and specific embodiments of the inventive concept will be shown and described in detail in the accompanying drawings. However, the embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations and equivalent substitutions included within the spirit and scope of the inventive concept. In the description of the inventive concept, detailed descriptions of related known technologies may be exaggerated or omitted where this may obscure the essence of the inventive concept.

[0051] The apparatus of this embodiment can be used to perform a photolithography process on a circular substrate. Specifically, the apparatus of this embodiment can be connected to an exposure apparatus and can be used to perform a photoresist coating process on the substrate. However, the spirit and scope of the inventive concept are not limited thereto, and the apparatus can be used to perform various types of processes that supply processing liquids other than photoresist to the substrate while rotating it. For example, the processing liquid can be a developer, chemicals, rinsing solution, organic solvent, etc. Furthermore, the inventive concept can be applied to processes in which the space providing the substrate is emptied while rotating the substrate, without the need to supply processing liquids.

[0052] In the following text, reference will be made to Figures 4 to 17 The embodiments of the present invention are described.

[0053] Figure 4 A substrate processing apparatus according to an embodiment of the present invention is shown. Figure 5 Show Figure 4 The coating block or developing block, and Figure 6 Show Figure 4 Substrate processing apparatus.

[0054] refer to Figures 4 to 6 According to an embodiment of the present invention, a substrate processing apparatus 10 includes a transposition module 100, a processing module 300, and an interface module 500. According to the embodiment, the transposition module 100, the processing module 300, and the interface module 500 are arranged in a row in sequence. Hereinafter, the arrangement direction of the transposition module 100, the processing module 300, and the interface module 500 will be referred to as a first direction 12, the direction perpendicular to the first direction when viewed from above will be referred to as a second direction 14, and the direction perpendicular to both the first direction 12 and the second direction 14 will be referred to as a third direction 16.

[0055] The transposition module 100 transfers the substrate W from the container F containing the substrate W to the processing module 300, and retrieves the processed substrate W from the processing module 300 for storage in the container F. The transposition module 100 is configured to extend its length along a second direction 14. The transposition module 100 has a loading port 110 and a transposition frame 130. The transposition frame 130 is positioned between the loading port 110 and the processing module 300. The container F containing the substrate W is positioned at the loading port 110. Multiple loading ports 110 can be provided, and the multiple loading ports 110 can be positioned along the second direction 14.

[0056] For container F, a closed container F, such as a front-opening unified pod (FOUP), can be used. Container F can be placed on loading port 110 by a transfer component (not shown) (such as an overhead conveyor, overhead transporter, or automated guided vehicle), or container F can be placed on loading port 110 by an operator.

[0057] A sorting robot 132 is disposed inside a sorting frame 130. Within the sorting frame 130, a guide rail 136 is configured to extend its length along a second direction 14, and the sorting robot 132 is configured to move along the guide rail 136. The sorting robot 132 includes a hand on which a substrate W is placed, and the hand is configured to move back and forth, rotate about a third direction 16 as an axis, and move along the third direction 16.

[0058] The processing module 300 can perform a coating process and a developing process on the substrate W. The processing module 300 can receive the substrate W stored in the container F and perform substrate processing. The processing module 300 has a coating block 300a and a developing block 300b. The coating block 300a performs the coating process on the substrate W, and the developing block 300b performs the developing process on the substrate W. Multiple coating blocks 300a are provided and are stacked on top of each other. Multiple developing blocks 300b are provided and are stacked on top of each other. Figure 4 In one embodiment, two coating blocks 300a and two developing blocks 300b are provided. The coating blocks 300a may be positioned below the developing blocks 300b. In one embodiment, the two coating blocks 300a perform the same process and may be arranged in the same structure. Similarly, the two developing blocks 300b perform the same process and may be arranged in the same structure.

[0059] refer to Figure 6The coating block 300a includes a heat treatment chamber 320, a transfer chamber 350, a liquid treatment chamber 360, and buffer chambers 312 and 316. The heat treatment chamber 320 may be a chamber for performing heat treatment processes on a substrate W. The heat treatment process may include a cooling process and a heating process. The liquid treatment chamber 360 supplies liquid onto the substrate W to form a liquid layer. The liquid layer may be a photoresist film or an anti-reflective film. The transfer chamber 350 transfers the substrate W between the heat treatment chamber 320 and the liquid treatment chamber 360 of the coating block 300a.

[0060] The transfer chamber 350 is configured such that its length direction is parallel to the up / down direction. A transfer robot 352 is disposed in the transfer chamber 350. The transfer robot 352 transfers substrates between the heat treatment chamber 320, the liquid treatment chamber 360, and the buffer chambers 312 and 316. In one embodiment, the transfer robot 352 has a hand on which the substrate W is placed, and the hand may be configured to be movable back and forth, rotatable about a third direction 16 as an axis, and movable along the third direction 16. A guide rail 356 is configured in the transfer chamber 350 such that its length direction is parallel to a first direction, and the transfer robot 352 may be configured to move on the guide rail 356.

[0061] Figure 7 An example of the hand 354 of the transfer robot 352 is shown. (Reference) Figure 7 The hand 354 has a base 354a and a support protrusion 354b. The base 354a may have a partially circumferentially curved annular shape. The base 354a has an inner diameter larger than the diameter of the substrate W. The support protrusion 352b extends inward from the base 354a. A plurality of support protrusions 354b are provided and support the edge region of the substrate W. According to an embodiment, four support protrusions 354b may be provided at equal intervals.

[0062] Multiple heat treatment chambers 320 are provided. The heat treatment chambers 320 are arranged along a first direction 12. The heat treatment chambers 320 are placed on one side of the transfer chamber 350.

[0063] Figure 8 Show Figure 7 The heat treatment chamber, and Figure 9 The embodiments of the present invention are shown. Figure 8 The heat treatment chamber.

[0064] refer to Figure 8 and Figure 9 The heat treatment chamber 320 includes a shell 321, a cooling unit 322, a heating unit 323, and a conveyor plate 324.

[0065] The housing 321 is configured as a generally rectangular parallelepiped shape. An inlet portion (not shown) is provided on the side wall of the housing 321, through which the substrate W enters and exits. The inlet portion can remain open. Optionally, a door (not shown) can be provided to open and close the inlet portion. A cooling unit 322, a heating unit 323, and a conveyor plate 324 are disposed within the housing 321. The cooling unit 322 and the heating unit 323 are disposed along a second direction 14. In one embodiment, the cooling unit 320 may be placed closer to the conveyor chamber 350 than the heating unit 323.

[0066] The cooling unit 322 has a cooling plate 322a. When viewed from above, the cooling plate 322a may have a generally circular shape. The cooling plate 322a is provided with a cooling member 322b. In one embodiment, the cooling member 322b is formed inside the cooling plate 322a and may be configured as a channel for the flow of cooling fluid.

[0067] The heating unit 323 includes a heating plate 323a, a cover 323c, and a heater 323b. When viewed from above, the heating plate 323a has a generally circular shape. The heating plate 323a has a diameter larger than that of the substrate W. The heating plate 323a is equipped with the heater 323b. The heater 323b can be implemented using a resistance heating element to which an electric current is applied. The heating plate 323a is provided with lifting pins 323e, which can move vertically along a third direction 16. The lifting pins 323e receive the substrate W from a conveying device outside the heating unit 323 and place the substrate W downwards onto the heating plate 323a, or lift the substrate W away from the heating plate 323a and convey the substrate W to a conveying device outside the heating unit 323. In one embodiment, three lifting pins 323e may be provided. The cover 323c has a space therein, which opens at the bottom.

[0068] The cover 323c is positioned above the heating plate 323a and moves in the up / down direction via the driver 3236d. The space formed by the cover 323c and the heating plate 323a by moving the cover 323c is configured as a heating space for heating the substrate W.

[0069] The conveyor plate 324 has a generally circular shape and a diameter corresponding to that of the substrate W. Notches 324b are formed at the edge of the conveyor plate 324. The notches 324b may have a shape corresponding to the protrusions 3543 formed on the hand 354 of the conveying robot 352. Furthermore, as many notches 324b as protrusions 3543 are formed at positions corresponding to the protrusions 3543 on the hand 354. When the vertical alignment position of the hand 354 and the conveyor plate 324 changes in the setting direction, the substrate W is conveyed between the hand 354 and the conveyor plate 324. The conveyor plate 324 can be mounted on a guide rail 324d and can be moved along the guide rail 324d between a first region and a second region by a driver 324c. A plurality of slit-shaped guide grooves 324a are provided in the conveyor plate 324. The guide grooves 324a extend inwardly from the edge of the conveyor plate 324 to the interior of the conveyor plate 324. The guide groove 324a is configured to extend its length along the second direction 14, and the guide grooves 3242 are positioned spaced apart from each other along the second direction 14. When the substrate W is transferred between the transfer plate 324 and the heating unit 323, the guide groove 324a prevents the transfer plate 324 and the lifting pin 323e from interfering with each other.

[0070] The substrate W is cooled while the transfer plate 324, on which the substrate W is placed, is in contact with the cooling plate 322a. For efficient heat transfer between the cooling plate 322a and the substrate W, the transfer plate 324 is formed of a material with high thermal conductivity. In one embodiment, the transfer plate 324 may be formed of a metallic material.

[0071] Heating units 323 disposed in some of the heat treatment chambers 320 can supply gas while heating the substrate W to improve the adhesion of the photoresist to the substrate W. In one embodiment, the gas may be hexamethyldisilane (HMDS) gas.

[0072] Multiple liquid handling chambers 360 are provided. Some of the liquid handling chambers 360 can be stacked on top of each other. The liquid handling chambers 360 are located on one side of the transfer chamber 350. The liquid handling chambers 360 are arranged side by side along a first direction 12. Some of the liquid handling chambers 360 are positioned adjacent to the transposition module 100. Hereinafter, the liquid handling chamber 360 positioned adjacent to the transposition module 100 is referred to as the front liquid handling chamber 362. Some other liquid handling chambers 360 are positioned adjacent to the interface module 500. Hereinafter, the liquid handling chamber 360 positioned adjacent to the interface module 500 is referred to as the rear liquid handling chamber 364.

[0073] Each of the front liquid processing chambers 362 applies a first liquid to the substrate W, and each of the rear liquid processing chambers 364 applies a second liquid to the substrate W. The first liquid and the second liquid can be different types of liquids. In one embodiment, the first liquid can be a liquid for forming an antireflective layer, and the second liquid can be a liquid for forming a photoresist layer. The photoresist liquid can be applied to the substrate W coated with the antireflective film. Alternatively, the first liquid can be a photoresist liquid, and the second liquid can be a liquid for forming an antireflective layer. In this case, the liquid for forming the antireflective layer can be applied to the substrate W coated with the photoresist layer. Alternatively, the first liquid and the second liquid can be the same liquid, and both the first liquid and the second liquid can be liquids for forming a photoresist layer.

[0074] The developing block 300b has the same structure as the coating block 300a, and the liquid handling chamber of the developing block 300b supplies the developing solution to the substrate.

[0075] The interface module 500 connects the processing module 300 to the external exposure apparatus 700. The interface module 500 has an interface frame 510, an additional processing chamber 520, an interface buffer 530, and an interface robot 550.

[0076] A fan filter unit that forms a downward airflow can be disposed at the top of the interface frame 510. An additional processing chamber 520, an interface buffer 530, and an interface robot 550 are disposed within the interface frame 510. The additional processing chamber 520 can perform a predetermined additional process before the substrate W processed in the coating block 300a is transferred to the exposure apparatus 700. Alternatively, the additional processing chamber 520 can perform a predetermined additional process before the substrate W processed in the exposure apparatus 700 is transferred to the developing block 300b. In one embodiment, the additional process can be an edge exposure process that exposes the edge region of the substrate W, a top-side cleaning process that cleans the top side of the substrate W, or a back-side cleaning process that cleans the back side of the substrate W. Multiple additional processing chambers 520 can be provided, and the additional processing chambers 520 can be stacked on top of each other. All additional processing chambers 520 can be configured to perform the same process. Alternatively, some of the additional processing chambers 520 can be configured to perform different processes.

[0077] Interface buffer 530 provides space for the substrate W to temporarily stop during transport between coating block 300a, additional processing chamber 520, exposure apparatus 700 and developing block 300b. Multiple interface buffers 530 can be provided, and multiple interface buffers 530 can be stacked on top of each other.

[0078] In one embodiment, the additional processing chamber 520 may be located on one side of an extension line in the longitudinal direction toward the transfer chamber 350, and the interface buffer 530 may be located on the opposite side of the extension line.

[0079] An interface robot 550 transfers a substrate W between a coating block 300a, an additional processing chamber 520, an exposure apparatus 700, and a developing block 300b. The interface robot 550 may have a transfer hand for transferring the substrate W. One or more interface robots 550 may be provided. In one embodiment, the interface robot 550 has a first robot 552 and a second robot 554. The first robot 552 may be configured to transfer the substrate W between the coating block 300a, the additional processing chamber 520, and the interface buffer 530, and the second robot 554 may transfer the substrate W between the interface buffer 530 and the exposure apparatus 700, and may also transfer the substrate W between the interface buffer 530 and the developing block 300b.

[0080] Each of the first robotic arm 552 and the second robotic arm 554 includes a transfer hand on which a substrate W is placed, and the hand may be configured to be movable back and forth, rotatable relative to an axis parallel to a third direction 16, and movable along the third direction 16.

[0081] The structure of the liquid processing chamber will be described in detail below. An example of a liquid processing chamber disposed in a coating block will be used. The example will be that the liquid processing chamber is used to apply photoresist to a substrate W. However, the liquid processing chamber can also be a chamber for forming a protective layer or an anti-reflective layer on the substrate W. The liquid processing chamber can also be a chamber for developing the substrate W by supplying a developing solution to the substrate W.

[0082] Figure 10 This is a cross-sectional view showing an embodiment of a liquid processing chamber in which processing liquid is supplied to a rotating substrate W for liquid processing of the substrate W. Figure 11 yes Figure 10 Floor plan of the liquid handling room.

[0083] refer to Figure 10 and Figure 11 The liquid handling chamber 1000 includes a housing 1100, a first processing unit 1201a, a second processing unit 1201b, a liquid supply unit 1400, an exhaust unit 1600, and a controller 1800.

[0084] The housing 1100 is configured as a rectangular container with an internal space. Openings 1101a and 1101b are formed on one side of the housing 1100. Openings 1101a and 1101b serve as channels through which the substrate W is inserted and removed. Doors 1103a and 1103b are installed at openings 1101a and 1101b, and doors 1103a and 1103b open and close openings 1101a and 1101b.

[0085] A fan filter unit 1130 for supplying downward airflow to the interior space of the housing 1100 is disposed on the top wall of the housing 1100. The fan filter unit 1130 has a fan for introducing outside air into the interior space and a filter for filtering the outside air.

[0086] The first processing unit 1201a and the second processing unit 1201b are disposed within the internal space of the housing 1100. The first processing unit 1201a and the second processing unit 1201b are arranged in a specific direction. Hereinafter, the arrangement direction of the first processing unit 1201a and the second processing unit 1201b will be referred to as the unit arrangement direction, and... Figure 11 The direction is represented by the X-axis.

[0087] The first processing unit 1201a has a first processing container 1220a and a first support unit 1240a.

[0088] The first processing container 1220a has a first internal space 1222a. The first internal space 1222a is configured such that its top portion opens.

[0089] A first support unit 1240a supports a substrate W within a first internal space 1222a of a first processing container 1220a. The first support unit 1240a includes a first support plate 1242a, a first drive shaft 1244a, and a first actuator 1246a. The top surface of the first support plate 1242a is disk-shaped. The first support plate 1242a has a diameter smaller than that of the substrate W. The first support plate 1242a is configured to support the substrate W under vacuum pressure. Optionally, the first support plate 1242a may have a mechanical clamping structure for supporting the substrate W. The first drive shaft 1244a is coupled to the center of the bottom of the first support plate 1242a, and the first actuator 1246a is provided with the first drive shaft 1244a to provide rotational force to the first drive shaft 1244a. The first actuator 1246a may be a motor.

[0090] The second processing unit 1201b has a second processing container 1220b and a second support unit 1240b, and the second support unit 1240b has a second support plate 1242b, a second drive shaft 1244b and a second driver 1246b. The second processing container 1220b and the second support unit 1240b have substantially the same structure as the first processing container 1220a and the first support unit 1240a.

[0091] Liquid supply unit 1400 supplies liquid to substrate W. Liquid supply unit 1400 includes a first nozzle 1420a, a second nozzle 1420b, and a processing liquid nozzle 1440. The first nozzle 1420a supplies liquid to substrate W supported on a first support unit 1240a, and the second nozzle 1420b supplies liquid to substrate W supported on a second support unit 1240b. The first nozzle 1420a and the second nozzle 1420b may be configured to supply the same type of liquid. According to one embodiment, the first nozzle 1420a and the second nozzle 1420b may supply a rinsing solution for cleaning substrate W. For example, the rinsing solution may be water. According to another embodiment, the first nozzle 1420a and the second nozzle 1420b may supply a removal solution for removing photoresist from edge regions of substrate W. For example, the removal solution may be a diluent. Each of the first nozzle 1420a and the second nozzle 1420b may be rotatable about its axis between a processing position and a standby position. The processing position is the position where liquid is discharged from the substrate W, and the standby position is the position where the first nozzle 1420a and the second nozzle 1420b wait for the substrate W without discharging liquid.

[0092] Processing liquid nozzle 1440 supplies processing liquid to substrates W supported on first support unit 1240a and second support unit 1240b. The processing liquid may be photoresist. Nozzle driver 1448 drives processing liquid nozzle 1440 such that processing liquid nozzle 1440 moves along guide 1442 between a first processing position, a standby position, and a second processing position. The first processing position is for supplying processing liquid to substrate W supported on first support unit 1240a, and the second processing position is for supplying processing liquid to substrate W supported on second support unit 1240b. The standby position is a waiting position located at standby port 1444 between first processing unit 1201a and second processing unit 1201b when photoresist has not been discharged from processing liquid nozzle 1440.

[0093] The gas-liquid separation plate 1229a can be disposed within the internal space 1201a of the first processing container 1220a. The gas-liquid separation plate 1229a can be configured to extend upward from the bottom wall of the first processing container 1220a. The gas-liquid separation plate 1229a can be configured as annular.

[0094] According to an embodiment, the outer side of the gas-liquid separation plate 1229a can be configured as a discharge space for liquid discharge, and the inner side of the gas-liquid separation plate 1229a can be configured as an exhaust space for atmospheric discharge. A discharge pipe 1228a for discharging the treated liquid is connected to the bottom wall of the first processing container 1220a. The discharge pipe 1228a discharges the treated liquid introduced between the side wall of the first processing container 1220a and the gas-liquid separation plate 1229a to the outside of the first processing container 1220a. Airflow flowing into the space between the side wall of the first processing container 1220a and the gas-liquid separation plate 1229a flows into the gas-liquid separation plate 1229a. During this process, the treated liquid contained in the airflow is discharged from the discharge space to the outside of the first processing container 1220a through the discharge pipe 1228a, and the airflow is introduced into the exhaust space of the first processing container 1220a.

[0095] Although not shown, a lift / lower drive may be provided for adjusting the relative height between the first support plate 1242a and the first processing container 1220a.

[0096] Figure 12 This is an exemplary plan view schematically showing the exhaust unit 1600. (Reference) Figure 12 The exhaust unit 1600 has a first common conduit 1622, a second common conduit 1624, a first exhaust line 1642, a second exhaust line 1644, a third exhaust line 1646, and a fourth exhaust line 1648.

[0097] A first common conduit 1622 is disposed on a first side, and a second common conduit 1624 is disposed on the opposite second side. For example, the first common conduit 1622 and the second common conduit 1624 are spaced apart from each other, with the rotation centers of the first support plate and the second support plate disposed between them. Figure 12 In this configuration, when the element arrangement direction passing through the rotation centers R1 and R2 is the X-axis, the first common conduit 1622 is located above the X-axis, i.e., in the +Y-axis direction, and the second common conduit 1624 is located below the X-axis, i.e., in the -Y-axis direction. Each of the first common conduit 1622 and the second common conduit 1624 can be configured such that their length direction is substantially parallel to the element arrangement direction.

[0098] A first exhaust line 1642 and a second exhaust line 1644 are connected to a first processing container 1220a to discharge atmosphere from a first internal space 1222a of the first processing container 1220a. The first exhaust line 1642 has a first exhaust port 1642a for introducing atmosphere into the first internal space 1222a, and the second exhaust line 1644 has a second exhaust port 1644a for introducing atmosphere into the first internal space 1222a. According to an embodiment, the first exhaust line 1642 and the second exhaust line 1644 may be connected to the bottom wall of the first processing container 1220a.

[0099] According to an embodiment, when viewed from above, the first exhaust port 1642a and the second exhaust port 1644a can be positioned such that a virtual straight line 1641 connecting the first exhaust port 1642a and the second exhaust port 1644a passes through the rotation center R1 of the first support plate 1242a. The first exhaust line 1642 is located above the linear line 1641 on the +Y axis. According to an embodiment, the first exhaust line 1642 is arranged in an arc shape. The first exhaust line 1642 can be formed to have the same center as the rotation center R1 of the first support plate 1242a. For example, the first exhaust line 1642 can have a central angle of 90 degrees, and as... Figure 12 As shown, the first exhaust pipe 1642 can be located in the second quadrant of the rotation center R1 relative to the first support plate 1242a.

[0100] The second exhaust line 1644 is located below the linear line 1641 on the -Y axis. The second exhaust line 1644 connects to the second common duct 1624, and the atmosphere introduced into the first internal space 1222a through the second exhaust port 1644a is guided into the second common duct 1624. According to an example, the second exhaust line 1644 is arranged in an arc shape. The second exhaust line 1644 can be formed to have the same center as the rotation center R1 of the first support plate 1242a. For example, the second exhaust line 1644 can be provided with a central angle of 90 degrees, and as... Figure 12 As shown, it can be located in the fourth quadrant relative to the rotation center R1 of the first support plate 1242a.

[0101] According to the embodiment, when viewed from above, the first exhaust line 1642 and the second exhaust line 1644 can be arranged and formed to have points symmetrical with respect to the rotation center R1 of the first support plate 1242a.

[0102] The third exhaust line 1646 and the fourth exhaust line 1648 are connected to the second processing container 1220b to discharge atmosphere from the second internal space 1222b of the second processing container 1220b. The third exhaust line 1646 has a third exhaust port 1646a for introducing atmosphere into the second internal space 1222b, and the fourth exhaust line 1648 has a fourth exhaust port 1648a for introducing atmosphere into the second internal space 1222b. According to an embodiment, the third exhaust line 1646 and the fourth exhaust line 1648 may be connected to the bottom wall of the second processing container 1220b.

[0103] According to an embodiment, when viewed from above, the third exhaust port 1646a and the fourth exhaust port 1648a can be positioned such that the virtual straight line 1641 connecting the third exhaust port 1646a and the fourth exhaust port 1648a passes through the rotation center R2 of the second support plate 1242b. The third exhaust line 1646 is located above the linear line 1641 on the +Y axis. According to an embodiment, the third exhaust line 1646 is arranged in an arc shape. The third exhaust line 1646 can be formed to have the same center as the rotation center R2 of the second support plate 1242b. For example, the third exhaust line 1646 can be provided with a central angle of 90 degrees, and as... Figure 12 As shown, it can be located in the second quadrant of the rotation center R2 relative to the second support plate 1242b.

[0104] The fourth exhaust line 1648 is located below the linear line 1641 on the -Y axis. The fourth exhaust line 1648 connects to the second common duct 1624, and the atmosphere introduced into the second internal space 1222b through the fourth exhaust port 1648a is guided into the second common duct 1624. According to an embodiment, the fourth exhaust line 1648 is arranged in an arc shape. The fourth exhaust line 1648 can be formed to have the same center as the rotation center R2 of the second support plate 1242b. For example, the fourth exhaust line 1648 can have a central angle of 90 degrees and can be located in the fourth quadrant relative to the rotation center R2 of the second support plate 1242b, such as... Figure 12 As shown.

[0105] According to the embodiment, when viewed from above, the third exhaust line 1646 and the fourth exhaust line 1648 can be configured and shaped to have points symmetrical with respect to the rotation center R2 of the second support plate 1242b.

[0106] The first exhaust line 1642 may have a main line and an inlet portion. A first exhaust port 1642a may be located at one end of the inlet portion, and the main line may extend from the other end of the inlet portion. The inlet portion may be perpendicular to the bottom wall of the first processing container 1220a, and the main line may be substantially parallel to the bottom wall of the first processing container 1220a. The inlet portion may have a relatively short length compared to the main line. The first exhaust port 1642a may be located at a position spaced upwards from the bottom wall of the first processing container 1220a. Alternatively, the first exhaust port 1642a may be located at the same height as the bottom wall of the first processing container 1220a. Alternatively, the first exhaust port 1642a may be located at the same height as the bottom wall of the first processing container 1220a, and simultaneously, the first exhaust line 1642 may only have a main line without an inlet portion. In this configuration, the first exhaust line 1642 may contact the bottom wall of the first processing container 1220a, and the first exhaust port 1642a may be formed in the first exhaust line 1642. The second exhaust line 1644, the third exhaust line 1646, and the fourth exhaust line 1648 may have the same shape and structure as the first exhaust line 1642.

[0107] In the above example, the virtual straight line 1641 connecting the third exhaust port 1646a and the fourth exhaust port 1648a can be the same straight line 1641 connecting the first exhaust port 1642a and the second exhaust port 164a. For example, the first exhaust port 1642a, the second exhaust port 1644a, the third exhaust port 1646a, and the fourth exhaust port 1648a can be sequentially arranged on the virtual straight line 1641.

[0108] Although not shown, each of the first common conduit 1622 and the second common conduit 1624 can be provided with a pressure-reducing member to provide flow pressure for exhaust. For example, the pressure-reducing member can be a pump or a fan. The first common conduit 1622 is configured to exhaust from the first exhaust port 1642a in the rotational direction of the first support plate 1242a, and the second common conduit 1624 is configured to exhaust from the second exhaust port 1644a in the rotational direction of the first support plate 1242a. Furthermore, the first common conduit 1622 is configured to exhaust from the third exhaust port 1646a in the rotational direction of the second support plate 1242b, and the second common conduit 1624 is configured to exhaust from the fourth exhaust port 1648a in the rotational direction of the second support plate 1242b. Therefore, the direction of exhaust in the first common conduit 1622 and the direction of exhaust in the second common conduit 1624 can be configured to be opposite to each other. For example, in Figure 12In this arrangement, the exhaust direction in the first common duct 1622 is from left to right, while the exhaust direction in the second common duct 1624 is from right to left. Therefore, exhaust flow through the first exhaust line 1642 and the third exhaust line 1646 to the first common duct 1622 can be provided smoothly, and exhaust flow through the second exhaust line 1644 and the fourth exhaust line 1648 to the second common duct 1624 can be provided smoothly.

[0109] In the above example, the pressure-reducing component is disposed in each of the first common conduit 1622 and the second common conduit 1624, but the first common conduit 1622 and the second common conduit 1624 can be combined into a line and the pressure-reducing component can be disposed in the combined line.

[0110] The controller 1800 controls the first processing unit 1201a, the second processing unit 1201b, and the liquid supply unit 1400. When the first substrate W is placed on the first support unit 1240a, the processing liquid nozzle 1440 moves to the first processing position. The controller 1800 controls the first support unit 1240a to rotate the first substrate W and controls the liquid supply unit 1400 to discharge photoresist from the processing liquid nozzle 1440 onto the first substrate W placed on the first support unit 1240a. In this case, the controller 1800 controls the support unit 1240 such that the exhaust direction of the exhaust from the first internal space 1222a in the first exhaust line 1642 and the second exhaust line 1644 is the positive direction (flow direction) relative to the rotation direction of the first substrate W. Subsequently, when the second substrate W is placed on the second support unit 1240b, the processing liquid nozzle 1440 moves to the second processing position. The controller 1800 controls the second support unit 1240b to rotate the second substrate W, and controls the liquid supply unit 1400 to discharge photoresist from the processing liquid nozzle 1440 onto the second substrate W placed on the second support unit 1240b. In this case, the controller 1800 controls the support unit 1240 such that the exhaust flow of the atmosphere discharged from the second internal space 1222b in the third exhaust line 1646 and the fourth exhaust line 1648 is in the positive direction relative to the rotation direction of the second substrate W. When... Figure 12 When the exhaust unit 1600 is set as shown, the first substrate W and the second substrate W rotate clockwise respectively, as shown. Figure 13 As shown.

[0111] Although the processing liquid nozzle 1440 discharges photoresist from one of the first processing unit 1201a or the second processing unit 1201b, the rinsing liquid or removal liquid can be discharged from the first nozzle 1420a or the second nozzle 1420b of the other.

[0112] During processing at processing units 1201a and 1201b, rotating airflow is generated in the internal spaces 1222a and 1222b of processing units 1201a and 1201b by the rotation of substrate W and support plates 1242a and 1242b. When using a device with... Figure 2 When using the conventional exhaust unit 1600 shown, the exhaust flow to some exhaust lines is not smooth. However, when using the device with the exhaust unit 1600 as described in the embodiment of the present invention, all exhaust lines 1642, 1644, 1646 and 1648 have a smooth exhaust flow.

[0113] In the example above, the first to fourth exhaust pipes 1642, 1644, 1646, and 1648 are shown as having an arc shape. However, unlike this, as... Figure 14 As shown in the liquid handling chamber 2000, the first exhaust line to the fourth exhaust line 2642, 2644, 2646, and 2648 can be respectively arranged in a straight line. In this case, when viewed from above, the first exhaust line to the fourth exhaust line 2642, 2644, 2646, and 2648 can be arranged perpendicular to the virtual straight line 2641 that connects the first exhaust port to the fourth exhaust port 2642a, 2644a, 2646a, and 2648a respectively.

[0114] In the example above, two processing units 1201a and 1201b are disposed in the housing 1100 of the liquid processing chamber 1000 for liquid processing of the substrate W, and the processing liquid nozzle 1440 is shared in both processing units 1201a and 1201b. However, unlike this, as Figure 15 As shown, only one processing unit 3201 can be installed in the housing 3100 of the liquid processing chamber 3000. In this case, a first extension line 3643 extending from the first exhaust line 3642 and having a pressure-reducing member (not shown) can be provided instead of the first common pipe, and a second extension line 3645 extending from the second exhaust line 3644 and having a pressure-reducing member (not shown) can be provided instead of the second common pipe.

[0115] Selectively, such as Figure 16 As shown, three or more processing units 3201a, 3201b, 3201c can be disposed in the housing 4100 of the liquid processing chamber 4000.

[0116] Selectively, such as Figure 17As shown, the first processing unit 5201a and the second processing unit 5201b are disposed in the housing 5100 of the liquid processing chamber 5000, and the rotation directions of the substrate W can be opposite to each other during processing at the first processing unit 5201a and the second processing unit 5201b. In this case, the first exhaust line 5642 and the second exhaust line 5644 connected to the first processing unit 5201a, and the third exhaust line 5646 and the fourth exhaust line 5648 connected to the second processing unit 5201b are respectively positioned and formed such that the exhaust flow can appear in the positive direction relative to the rotation direction of the substrate W.

[0117] For example, in the first processing unit 5201a, the substrate W can rotate clockwise, and in the second processing unit 5201b, the substrate W can rotate counterclockwise, and the first exhaust port 5642a, the second exhaust port 5644a, the third exhaust port 5646a, and the fourth exhaust port 5648a can be arranged sequentially along the unit arrangement direction X. In this case, as... Figure 17 As shown, the first exhaust pipe 5642 and the fourth exhaust pipe 5648 can be located at +Y on one side relative to the unit arrangement direction X, and the second exhaust pipe 5644 and the third exhaust pipe 5646 can be located at -Y on the other side relative to the unit arrangement direction X.

[0118] The above description illustrates the inventive concept. Furthermore, while the foregoing descriptions illustrate embodiments of the inventive concept, it can be applied to various other combinations, modifications, and environments. That is, variations or modifications can be made to the inventive concept without departing from the scope of the inventive concept disclosed herein, the equivalent scope of the written disclosure, and / or the skill or knowledge of those skilled in the art. The written embodiments describe the optimal state for realizing the technical spirit of the inventive concept, and various changes can be made as needed for specific applications and purposes of the inventive concept. Therefore, the detailed description of the inventive concept is not intended to limit it to the disclosed embodiments. Additionally, it should be understood that the appended claims include other embodiments.

Claims

1. An apparatus for processing a substrate, comprising: A first processing unit for processing the substrate includes a first processing container having a first internal space and a first support unit supporting and rotating the substrate in the first internal space. The second processing unit for processing the substrate includes a second processing container having a second internal space and a second support unit that supports and rotates the substrate in the second internal space. as well as An exhaust unit that vents air from the first interior space and the second interior space; as well as A controller that controls the first support unit and the second support unit. The first processing unit and the second processing unit are arranged in a line, and The exhaust unit includes: The first common conduit is located on the first side of the unit arrangement direction defined by the arrangement of the first processing unit and the second processing unit; The second common conduit is located on the second side opposite to the first side in the unit arrangement direction; A first exhaust line having a first exhaust port for introducing atmosphere into the first interior space and for discharging the atmosphere introduced into the first exhaust port through the first common pipe; The second exhaust line has a second exhaust port that introduces the atmosphere into the first interior space and discharges the atmosphere introduced into the second exhaust port through the second common pipe. A third exhaust line having a third exhaust port for introducing atmosphere into the second interior space and for discharging the atmosphere introduced into the third exhaust port through the first common conduit; and A fourth exhaust line having a fourth exhaust port for introducing atmosphere into the second interior space and for discharging the atmosphere entering the fourth exhaust port through the second common conduit. The controller controls the first support unit and the second support unit such that the exhaust direction inside the first exhaust pipe, the second exhaust pipe, the third exhaust pipe, and the fourth exhaust pipe is in the positive direction relative to the rotation direction of the substrate. The first exhaust pipe, the second exhaust pipe, the third exhaust pipe, and the fourth exhaust pipe are each arranged in an arc shape.

2. The apparatus according to claim 1, wherein the first support unit comprises: A first support plate supports the substrate; A first drive shaft is connected to the first support plate; as well as A first driver that rotates the first drive shaft. When viewed from above, the first exhaust pipe and the second exhaust pipe have points symmetrical about the rotation center of the first support plate, and The second support unit includes: The second support plate supports the substrate; A second drive shaft, which is connected to the second support plate; and The second driver rotates the second drive shaft. When viewed from above, the third and fourth exhaust pipes have points symmetrical about the rotation center of the second support plate.

3. The apparatus according to claim 2, wherein the first exhaust port, the second exhaust port, the third exhaust port, and the fourth exhaust port are sequentially aligned along the unit arrangement direction.

4. The apparatus of claim 3, wherein the controller controls the first support unit and the second support unit such that the substrate supported by the first support unit and the substrate supported by the second support unit rotate in the same direction.

5. The apparatus of claim 2, further comprising a liquid supply unit for discharging liquid onto the substrate. The liquid supply unit includes: nozzle; as well as A nozzle driver moves the nozzle to a first processing position opposite to the first support unit or a second processing position opposite to the second support unit, such that the nozzle discharges the liquid onto a selected substrate between a substrate supported by the first support unit and a substrate supported by the second support unit.

6. A substrate processing method using the apparatus according to any one of claims 1 to 5, comprising: A substrate is processed using a substrate processing apparatus, the substrate processing apparatus including a processing container having an internal space, a supply unit supporting and rotating the substrate in the internal space, an exhaust unit connected to the processing container and discharging the atmosphere from the internal space, and a liquid supply unit supplying processing liquid to the substrate supported by the support unit. While the substrate is being processed by supplying a processing liquid onto it, the atmosphere of the internal space is being discharged through the exhaust ports of a plurality of exhaust lines. as well as The substrate is rotated such that the exhaust direction inside each exhaust pipe becomes the positive direction relative to the rotation direction of the substrate.

7. The substrate processing method according to claim 6, wherein the rotation speed of the substrate is 2000 rpm or higher.

8. The substrate processing method according to claim 6, wherein the processing liquid is photoresist.

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