Portable electronic device and customized image acquisition module thereof

Abstract

The present invention discloses a portable electronic device and a custom image capture module thereof. The custom image capture module includes a carrier substrate, an image capture chip and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads and a plurality of second conductive pads. The image capture chip is arranged in a recessed space of the carrier body, and the image capture chip includes a plurality of chip conductive pads. Thus, since the plurality of second conductive pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive pads can be respectively electrically connected to the plurality of second conductive pads through the plurality of first conductive pads, when the custom image capture module is partially arranged in the accommodating space of the circuit substrate, the plurality of second conductive pads of the carrier substrate can be respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate through the plurality of soldering objects.

Description

Technical Field

[0001] The invention relates to an electronic device and an image capturing module thereof, and in particular to a portable electronic device and a custom image capturing module thereof. Background Art

[0002] Portable electronic devices in the prior art are all equipped with an image capture module. However, the installation of the existing image capture module is limited by the configuration of the pads of the main circuit board, so there is still room for improvement. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a portable electronic device and a custom image capture module thereof in view of the deficiencies of the prior art.

[0004] In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a custom image capture module, which includes: a carrier substrate, an image capture chip and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads arranged on the carrier body, a plurality of second conductive pads arranged on the carrier body and a plurality of conductive circuits arranged inside the carrier body, and the carrier body has a through opening and a recessed space connected to the through opening. The image capture chip is arranged in the recessed space of the carrier body, and the image capture chip includes an image sensing area and a plurality of chip conductive pads respectively electrically connected to the plurality of first conductive pads. The lens assembly includes a lens bracket arranged on the carrier body and a lens structure carried by the lens bracket. Among them, the plurality of second conductive pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive pads of the image capture chip are respectively electrically connected to the plurality of second conductive pads through the plurality of first conductive pads. Among them, when the custom image capture module is partially arranged in a accommodating space of a circuit substrate and is located between two electronic components, the plurality of second conductive pads of the carrier substrate are respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate.

[0005] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a custom image capture module, which includes: a carrier substrate, an image capture chip and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads and a plurality of second conductive pads, and the carrier body has a recessed space. The image capture chip is arranged in the recessed space of the carrier body, and the image capture chip includes a plurality of chip conductive pads. The lens assembly is arranged on the carrier body. Among them, the plurality of second conductive pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive pads of the image capture chip are respectively electrically connected to the plurality of second conductive pads through the plurality of first conductive pads.

[0006] In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a portable electronic device, which uses an image capture component, and the image capture component includes a circuit substrate, a plurality of electronic components arranged on the circuit substrate, and a custom image capture module arranged on the circuit substrate. The custom image capture module includes a carrier substrate, an image capture chip and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads arranged on the carrier body, a plurality of second conductive pads arranged on the carrier body, and a plurality of conductive circuits arranged inside the carrier body, and the carrier body has a through opening and a recessed space connected to the through opening. The image capture chip is arranged in the recessed space of the carrier body, and the image capture chip includes an image sensing area and a plurality of chip conductive pads electrically connected to the plurality of first conductive pads respectively. The lens assembly includes a lens bracket arranged on the carrier body and a lens structure carried by the lens bracket. Among them, the plurality of second conductive pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive pads of the image capture chip are electrically connected to the plurality of second conductive pads respectively through the plurality of first conductive pads.

[0007] One of the beneficial effects of the present invention is that the portable electronic device and its customized image capture module provided by the present invention can be realized through the technical scheme of "the carrier substrate includes a carrier body, a plurality of first conductive pads and a plurality of second conductive pads, and the carrier body has a recessed space", "the image capture chip is arranged in the recessed space of the carrier body, and the image capture chip includes a plurality of chip conductive pads" and "the plurality of second conductive pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive pads of the image capture chip are respectively electrically connected to the plurality of second conductive pads through the plurality of first conductive pads". When the customized image capture module is partially arranged in a accommodating space of a circuit substrate and is located between two electronic components, the plurality of second conductive pads of the carrier substrate can be respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of welding objects.

[0008] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a front view schematic diagram of the custom image extraction module according to the first embodiment of the present invention.

[0010] Figure 2 FIG. 4 is a bottom view of a custom image extraction module according to a first embodiment of the present invention.

[0011] Figure 3FIG. 4 is a schematic diagram of an exploded view of an image capture component according to the first embodiment of the present invention.

[0012] Figure 4 It is a top view schematic diagram of a circuit substrate carrying two electronic components according to the first embodiment of the present invention.

[0013] Figure 5 FIG. 1 is a schematic diagram of the combination of the image capture component according to the first embodiment of the present invention.

[0014] Figure 6 It is a front view schematic diagram of a custom image extraction module according to a second embodiment of the present invention.

[0015] Figure 7 FIG. 4 is a bottom view of a custom image extraction module according to a second embodiment of the present invention.

[0016] Figure 8 FIG. 4 is a schematic diagram of an exploded view of an image capture component according to a second embodiment of the present invention.

[0017] Fig. 9 FIG. 1 is a top view of a circuit substrate carrying two electronic components according to a second embodiment of the present invention.

[0018] Fig.10 FIG. 4 is a schematic diagram of an assembly of an image capture component according to a second embodiment of the present invention.

[0019] Fig.11 FIG. 4 is a three-dimensional schematic diagram of a portable electronic device according to a third embodiment of the present invention.

[0020] The reference numerals are as follows:

[0021] Z: Portable electronic devices

[0022] C: Image Extraction Component

[0023] P: Circuit board

[0024] P100:Substrate body

[0025] P1000: Accommodation space

[0026] P101: Substrate conductive pad

[0027] E: Electronic components

[0028] M: Custom image extraction module

[0029] 1: Carrier substrate

[0030] 10: Bearing body

[0031] 1001: Upper surface

[0032] 1002: Lower surface

[0033] 1002N: No occupied area

[0034] 1002L: Second left area

[0035] 1002R: Second right area

[0036] 100:Through opening

[0037] 100L: First left area

[0038] 100R: First right area

[0039] 101: Sunken Space

[0040] 11: First conductive pad

[0041] 11L: First left conductive pad

[0042] 11R: First right conductive pad

[0043] 12: Second conductive pad

[0044] 12L: Second left conductive pad

[0045] 12R: Second right conductive pad

[0046] 13: Conductive circuit

[0047] 2: Image extraction chip

[0048] 20: Image sensing area

[0049] 200L: Left area

[0050] 200R: Right area

[0051] 21: Chip conductive pad

[0052] 21L: Left chip conductive pad

[0053] 21R: Right chip conductive pad

[0054] W: Conductive wire

[0055] B: Conductor

[0056] 3: Lens assembly

[0057] 31: Lens bracket

[0058] 32: Lens structure

[0059] 4: Filter components

[0060] S: Support

[0061] D: Distance

[0062] L: Length DETAILED DESCRIPTION

[0063] The following is an explanation of the implementation methods of the "portable electronic device and its custom image extraction module" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0064] Cooperate Figures 1 to 11 As shown, the present invention provides a custom image capture module M, an image capture component C using the custom image capture module M, and a portable electronic device Z using the image capture component C. The custom image capture module M includes a carrier substrate 1, an image capture chip 2, and a lens assembly 3. The carrier substrate 1 includes a carrier body 10, a plurality of first conductive pads 11, and a plurality of second conductive pads 12, and the carrier body 10 has a recessed space 101. The image capture chip 2 is disposed in the recessed space 101 of the carrier body 10, and the image capture chip 2 includes a plurality of chip conductive pads 21. The lens assembly 3 is disposed on the carrier body 10. Furthermore, the plurality of second conductive pads 12 are exposed from the bottom end of the carrier body 10, and the plurality of chip conductive pads 21 of the image capture chip 2 can be electrically connected to the plurality of second conductive pads 12 respectively through the plurality of first conductive pads 11. Thus, when the custom image extraction module M is partially disposed in a housing space P1000 of a circuit substrate P and located between two electronic components E, the plurality of second conductive pads 12 of the carrier substrate 1 can be electrically connected to the plurality of substrate conductive pads P101 of the circuit substrate P through a plurality of solders.

[0065] [First embodiment]

[0066] See also Figure 1 and Figure 2 As shown, the first embodiment of the present invention provides a customized image capture module M, which includes: a carrier substrate 1 , an image capture chip 2 and a lens assembly 3 .

[0067] First, if Figure 1As shown, the carrier substrate 1 includes a carrier body 10, a plurality of first conductive pads 11 arranged on the carrier body 10, a plurality of second conductive pads 12 arranged on the carrier body 10, and a plurality of conductive circuits 13 arranged inside (or outside) the carrier body 10, and the carrier body 10 has a through opening 100 and a recessed space 101 connected to the through opening 100.

[0068] Furthermore, with Figure 1 and Figure 2 As shown, the plurality of first conductive pads 11 can be divided into a plurality of first left conductive pads 11L and a plurality of first right conductive pads 11R. The plurality of first left conductive pads 11L can be arranged on a first left region 100L in the recessed space 101, and the plurality of first right conductive pads 11R can be arranged on a first right region 100R in the recessed space 101, and the first left region 100L and the first right region 100R are two opposite and corresponding pad arrangement regions. Furthermore, the plurality of second conductive pads 12 can be divided into a plurality of second left conductive pads 12L and a plurality of second right conductive pads 12R. The plurality of second left conductive pads 12L can be arranged on a second left region 1002L at the bottom end of the carrier body 10, and the plurality of second right conductive pads 12R can be arranged on a second right region 1002R at the bottom end of the carrier body 10, and the second left region 1002L and the second right region 1002R are two opposite and corresponding pad arrangement regions. It is worth noting that, except for the first left conductive pads 11L and the first right conductive pads 11R, there are no other conductive pads in the recessed space 101 of the carrier substrate 1. In addition, except for the second left conductive pads 12L and the second right conductive pads 12R, there are no other conductive pads on the bottom of the carrier body 10. In other words, all conductive pads (e.g., the first conductive pads 11) in the recessed space 101 are only distributed on the first left area 100L and the first right area 100R, and all conductive pads (e.g., the second conductive pads 12) on the bottom of the carrier body 10 are only distributed on the second left area 1002L and the second right area 1002R, thereby effectively reducing the space occupied by the width direction of the carrier body 10.

[0069] Furthermore, if Figure 1As shown, the image capture chip 2 is disposed in the recessed space 101 of the carrier body 10, and the image capture chip 2 includes an image sensing area 20 and a plurality of chip conductive pads 21 respectively electrically connected to the plurality of first conductive pads 11. For example, the image capture chip 2 will be completely accommodated in the recessed space 101 of the carrier body 10, and will not protrude outside the recessed space 101 of the carrier body 10 (that is, the top of the carrier body 10 will be higher than the top of the image capture chip 2). In addition, the image capture chip 2 can be a complementary metal oxide semiconductor (CMOS) chip or a charge coupled device (CCD) chip. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0070] Furthermore, with Figure 1 and Figure 2 As shown, the plurality of chip conductive pads 21 can be divided into a plurality of left chip conductive pads 21L and a plurality of right chip conductive pads 21R. The plurality of left chip conductive pads 21L can be arranged in a left area 200L of the image acquisition chip 2, and the plurality of right chip conductive pads 21R can be arranged in a right area 200R of the image acquisition chip 2, and the left area 200L and the right area 200R are two opposite and corresponding pad setting areas. It is worth noting that, except for the plurality of left chip conductive pads 21L and the plurality of right chip conductive pads 21R, there are no other conductive pads on the image acquisition chip 2. That is to say, all the conductive pads (such as the plurality of chip conductive pads 21) on the image acquisition chip 2 will only be distributed and arranged on the left area 200L and the right area 200R, thereby effectively reducing the space occupied by the width direction of the image acquisition chip 2.

[0071] In addition, if Figure 1As shown, the lens assembly 3 includes a lens holder 31 disposed on the carrier body 10 and a lens structure 32 carried by the lens holder 31. Further, the lens holder 31 can be disposed on an upper surface 1001 of the carrier body 10, and the recessed space 101 can be recessed from the upper surface 1001 of the carrier body 10 to the inside, so that the recessed space 101 faces the lens structure 32. In addition, a plurality of first conductive pads 11 are disposed in the recessed space 101 and face the lens assembly 3, a plurality of second conductive pads 12 are disposed on a lower surface 1002 of the carrier body 10 and face away from the lens assembly 3, and a plurality of chip conductive pads 21 face the lens structure 32. For example, the lens holder 31 includes a brake (not shown) that can drive the lens structure 32 to move, and the lens structure 32 can be composed of a plurality of optical lenses. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0072] It is worth mentioning that Figure 1 As shown, the custom image capture module M of the first embodiment of the present invention further includes a filter component 4. The filter component 4 can be disposed above the image sensing area 20 of the image capture chip 2 through a plurality of supports S, and the filter component 4 is disposed between the image capture chip 2 and the lens structure 32.

[0073] It is worth noting that Figure 1 As shown, the plurality of chip conductive pads 21 are respectively electrically connected to the plurality of first conductive pads 11 through a plurality of conductive wires W (eg, metal wires formed by wire bonding). Figure 2 As shown, the area of ​​the second conductive pad 12 is larger than the area of ​​the first conductive pad 11, and the minimum distance D between one side of the second conductive pad 12 and one side of the carrier body 10 is smaller than the length L of the second conductive pad 12. In addition, there is a non-occupied area 1002N between the side of the second conductive pad 12 and the side of the carrier body 10, and there are no pads or electronic components in the non-occupied areas 1002N.

[0074] Cooperate Figure 1 as well as Figures 3 to 5As shown, the first embodiment of the present invention provides an image capture component C. The image capture component C includes a circuit substrate P, a plurality of electronic components E arranged on the circuit substrate P, and a custom image capture module M arranged on the circuit substrate P, and the custom image capture module M includes a carrier substrate 1, an image capture chip 2, and a lens assembly 3. Furthermore, the circuit substrate P includes a substrate body P100 and a plurality of substrate conductive pads P101 arranged on the substrate body P100, and the substrate body P100 has a accommodating space P1000 recessed from an upper surface of the substrate body P100 to the inside. In addition, the plurality of substrate conductive pads P101 are arranged in the accommodating space P1000 of the substrate body P100, and the plurality of electronic components E are arranged on the upper surface of the substrate body P100. Thus, as Figure 5 As shown, when the custom image extraction module M is partially disposed in the accommodating space P1000 of the circuit substrate P and is located between two electronic components E, a plurality of second conductive pads 12 (including a plurality of left chip conductive pads 21L and a plurality of right chip conductive pads 21R) can be electrically connected to a plurality of substrate conductive pads P101 of the circuit substrate P respectively through a plurality of soldering objects (not shown, such as solder balls, solder paste or any conductive material).

[0075] Thus, since the multiple second conductive pads 12 are exposed from the bottom end of the carrier body 10, and the multiple chip conductive pads 21 of the image extraction chip 2 can be electrically connected to the multiple second conductive pads 12 respectively through the multiple first conductive pads 11, when the custom image extraction module M is partially disposed in the accommodating space P1000 of the circuit substrate P and is located between two electronic components E, the multiple second conductive pads 12 of the carrier substrate 1 can be electrically connected to the multiple substrate conductive pads P101 of the circuit substrate P respectively through multiple solders. Therefore, as long as the multiple second conductive pads 12 of the supporting substrate 1 and the multiple substrate conductive pads P101 of the circuit substrate P can generate a corresponding electrical connection relationship, even if the present invention uses different types (for example, different models, different sizes) of image capture chips 2 or different types (for example, different models, different sizes) of lens assemblies 3, different types of image capture chips 2 or different types of lens assemblies 3 can still be used in the custom image capture module M, so the custom image capture module M of the present invention can customize the image capture chip 2 or lens assembly 3 according to different usage requirements.

[0076] [Second embodiment]

[0077] See also Figures 6 to 10As shown, the second embodiment of the present invention provides a custom image capture module M and an image capture component C using the custom image capture module M, and the custom image capture module M includes a carrier substrate 1, an image capture chip 2 and a lens component 3. Figures 6 to 10 Respectively Figures 1 to 5 As can be seen from the comparison, the biggest difference between the second embodiment of the present invention and the first embodiment is that: first, the recessed space 101 is recessed from the lower surface 1002 of the carrier body 10 to the inside, so that the recessed space 101 faces away from the lens structure 32. In addition, a plurality of first conductive pads 11 can be arranged in the recessed space 101 and blocked by the carrier body 10, so that the plurality of first conductive pads 11 cannot face the lens assembly 3. In addition, a plurality of chip conductive pads 21 face the recessed space 101 and face the first left area 100L and the first right area 100R located in the recessed space 101, and the plurality of chip conductive pads 21 are respectively electrically connected to the plurality of first conductive pads 11 through a plurality of conductors B (such as solder balls, solder paste or any kind of conductive material). Furthermore, the filter component 4 is arranged between the image capture chip 2 and the lens structure 32 and is partially accommodated in the through opening 100, thereby effectively shortening the overall height of the custom image capture module M.

[0078] It is worth noting that Fig.10 As shown, since the image capture chip 2 will be completely accommodated in the recessed space 101 of the carrier body 10 and will not protrude from the recessed space 101 of the carrier body 10 (that is, the bottom end of the carrier body 10 will be lower than the bottom end of the image capture chip 2), when the custom image capture module M is set on the circuit substrate P, the image capture chip 2 can be protected by the carrier body 10 and will not hit the circuit substrate P.

[0079] Thus, since the multiple second conductive pads 12 are exposed from the bottom end of the carrier body 10, and the multiple chip conductive pads 21 of the image extraction chip 2 can be electrically connected to the multiple second conductive pads 12 respectively through the multiple first conductive pads 11, when the custom image extraction module M is partially disposed in the accommodating space P1000 of the circuit substrate P and is located between two electronic components E, the multiple second conductive pads 12 of the carrier substrate 1 can be electrically connected to the multiple substrate conductive pads P101 of the circuit substrate P respectively through multiple solders.

[0080] [Third embodiment]

[0081] See also Fig.11 As shown, the third embodiment of the present invention provides a portable electronic device Z, and the portable electronic device Z uses an image capture component C. Figure 5 or Fig.10As shown, the image capture component C includes a circuit substrate P, a plurality of electronic components E disposed on the circuit substrate P, and a custom image capture module M disposed on the circuit substrate P, and the custom image capture module M includes a carrier substrate 1, an image capture chip 2, and a lens component 3. For example, the portable electronic device Z can be a notebook computer, a tablet computer, or a smart phone, but the present invention is not limited to this example.

[0082] [Beneficial Effects of Embodiments]

[0083] One of the beneficial effects of the present invention is that the portable electronic device Z and its customized image extraction module M provided by the present invention can be realized through the technical scheme of "the carrier substrate 1 includes a carrier body 10, a plurality of first conductive pads 11 and a plurality of second conductive pads 12, and the carrier body 10 has a recessed space 101", "the image extraction chip 2 is arranged in the recessed space 101 of the carrier body 10, and the image extraction chip 2 includes a plurality of chip conductive pads 21" and "the plurality of second conductive pads 12 are exposed from the bottom end of the carrier body 10, and the plurality of chip conductive pads 21 of the image extraction chip 2 are respectively electrically connected to the plurality of second conductive pads 12 through the plurality of first conductive pads 11". When the customized image extraction module M is partially arranged in a accommodating space P1000 of a circuit substrate P and is located between two electronic components E, the plurality of second conductive pads 12 of the carrier substrate 1 can be respectively electrically connected to the plurality of substrate conductive pads P101 of the circuit substrate P through a plurality of welding objects.

[0084] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A custom image extraction module, characterized in that: The custom image extraction module comprises: A carrier substrate, the carrier substrate comprising a carrier body, a plurality of first conductive pads disposed on the carrier body, a plurality of second conductive pads disposed on the carrier body, and a plurality of conductive circuits disposed inside the carrier body, the carrier body having a through opening and a recessed space connected to the through opening; an image acquisition chip, the image acquisition chip being disposed in the recessed space of the carrier body, the image acquisition chip comprising an image sensing area and a plurality of chip conductive pads respectively electrically connected to the plurality of first conductive pads; and A lens assembly, the lens assembly comprising a lens holder disposed on the carrying body and a lens structure carried by the lens holder; Wherein, a plurality of the second conductive pads are exposed from the bottom end of the carrier body, and a plurality of the chip conductive pads of the image acquisition chip are respectively electrically connected to a plurality of the second conductive pads through a plurality of the first conductive pads; When the custom image extraction module is partially disposed in a containing space of a circuit substrate and located between two electronic components, the plurality of second conductive pads of the carrier substrate are respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate.

2. The custom image extraction module according to claim 1, characterized in that: The image acquisition chip is completely accommodated in the recessed space of the carrier body; wherein the plurality of first conductive pads are divided into a plurality of first left conductive pads and a plurality of first right conductive pads, the plurality of first left conductive pads are arranged on a first left area in the recessed space, and the plurality of first right conductive pads are arranged on a first right area in the recessed space; wherein the plurality of second conductive pads are divided into a plurality of second left conductive pads and a plurality of second right conductive pads, the plurality of second left conductive pads are arranged on a second left area of ​​the bottom end of the carrier body, and the plurality of second right conductive pads are arranged on a second right area of ​​the bottom end of the carrier body; wherein the plurality of chip conductive pads The electric pads are divided into a plurality of left-side chip conductive pads and a plurality of right-side chip conductive pads, wherein the plurality of left-side chip conductive pads are arranged in a left area of ​​the image acquisition chip, and the plurality of right-side chip conductive pads are arranged in a right area of ​​the image acquisition chip; wherein, except for the plurality of first left-side conductive pads and the plurality of first right-side conductive pads, there are no other conductive pads in the recessed space of the carrier substrate; wherein, except for the plurality of second left-side conductive pads and the plurality of second right-side conductive pads, there are no other conductive pads on the bottom end of the carrier body; wherein, except for the plurality of left-side chip conductive pads and the plurality of right-side chip conductive pads, there are no other conductive pads on the image acquisition chip.

3. The custom image extraction module according to claim 1, characterized in that: The custom image capture module further includes: a filter component, which is arranged above the image sensing area of ​​the image capture chip through a plurality of supports, and the filter component is arranged between the image capture chip and the lens structure; wherein the lens support is arranged on an upper surface of the carrier body, and the recessed space is recessed from the upper surface of the carrier body to the inside so that the recessed space faces the lens structure; wherein a plurality of the first conductive pads are arranged in the recessed space and face the lens component, and a plurality of the second conductive pads are arranged on a lower surface of the carrier body, and the area of ​​the second conductive pads is greater than the area of ​​the first conductive pads; wherein a plurality of the chip conductive pads face the lens structure, and a plurality of the chip conductive pads are respectively electrically connected to a plurality of the first conductive pads through a plurality of conductive wires; wherein the minimum distance between a side end of the second conductive pad and a side end of the carrier body is less than the length of the second conductive pad, and there is an unoccupied area between the side end of the second conductive pad and the side end of the carrier body.

4. The custom image extraction module according to claim 1, characterized in that: The custom image capture module further includes: a filter component, which is arranged above the image sensing area of ​​the image capture chip through a plurality of supports, and the filter component is arranged between the image capture chip and the lens structure and is partially accommodated in the through opening; wherein the lens holder is arranged on an upper surface of the carrier body, and the recessed space is recessed inward from a lower surface of the carrier body so that the recessed space faces away from the lens structure; wherein a plurality of the first conductive pads are arranged in the recessed space and are shielded by the carrier body And cannot face the lens assembly, a plurality of second conductive pads are arranged on the lower surface of the carrier body, and the area of ​​the second conductive pads is larger than the area of ​​the first conductive pads; wherein, a plurality of chip conductive pads face the recessed space, and a plurality of chip conductive pads are respectively electrically connected to a plurality of first conductive pads through a plurality of conductors; wherein the minimum distance between one side end of the second conductive pad and one side end of the carrier body is less than the length of the second conductive pad, and there is an unoccupied area between the side end of the second conductive pad and the side end of the carrier body.

5. A custom image extraction module, characterized in that: The custom image extraction module comprises: A carrier substrate, the carrier substrate comprising a carrier body, a plurality of first conductive pads and a plurality of second conductive pads, the carrier body having a recessed space; an image acquisition chip, the image acquisition chip being disposed in the recessed space of the carrier body, the image acquisition chip comprising a plurality of chip conductive pads; and A lens assembly, wherein the lens assembly is arranged on the carrying body; The plurality of second conductive pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive pads of the image capture chip are electrically connected to the plurality of second conductive pads through the plurality of first conductive pads.

6. A portable electronic device, wherein the portable electronic device uses an image capture component, wherein the image capture component comprises a circuit substrate, a plurality of electronic components disposed on the circuit substrate, and a custom image capture module disposed on the circuit substrate, wherein: The custom image extraction module comprises: A carrier substrate, the carrier substrate comprising a carrier body, a plurality of first conductive pads disposed on the carrier body, a plurality of second conductive pads disposed on the carrier body, and a plurality of conductive circuits disposed inside the carrier body, the carrier body having a through opening and a recessed space connected to the through opening; an image acquisition chip, the image acquisition chip being disposed in the recessed space of the carrier body, the image acquisition chip comprising an image sensing area and a plurality of chip conductive pads respectively electrically connected to the plurality of first conductive pads; and A lens assembly, the lens assembly comprising a lens holder disposed on the carrying body and a lens structure carried by the lens holder; The plurality of second conductive pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive pads of the image capture chip are electrically connected to the plurality of second conductive pads through the plurality of first conductive pads.

7. The portable electronic device according to claim 6, wherein: The image extraction chip is completely accommodated in the recessed space of the carrier body; wherein the circuit substrate includes a substrate body and a plurality of substrate conductive pads arranged on the substrate body, and the substrate body has a accommodating space recessed from an upper surface of the substrate body to the inside; wherein a plurality of the substrate conductive pads are arranged in the accommodating space of the substrate body, and a plurality of the electronic components are arranged on the upper surface of the substrate body; wherein, when the custom image extraction module is partially arranged in the accommodating space of the circuit substrate and is located between two of the electronic components, the plurality of the second conductive pads of the carrier substrate are respectively electrically connected to the plurality of the substrate conductive pads of the circuit substrate.

8. The portable electronic device according to claim 6, wherein: The plurality of first conductive pads are divided into a plurality of first left conductive pads and a plurality of first right conductive pads, the plurality of first left conductive pads are arranged on a first left area in the recessed space, and the plurality of first right conductive pads are arranged on a first right area in the recessed space; wherein, the plurality of second conductive pads are divided into a plurality of second left conductive pads and a plurality of second right conductive pads, the plurality of second left conductive pads are arranged on a second left area of ​​the bottom end of the carrier body, and the plurality of second right conductive pads are arranged on a second right area of ​​the bottom end of the carrier body; wherein, the plurality of chip conductive pads are divided into a plurality of left chip conductive pads pads and a plurality of right-side chip conductive pads, the plurality of left-side chip conductive pads are arranged in a left area of ​​the image acquisition chip, and the plurality of right-side chip conductive pads are arranged in a right area of ​​the image acquisition chip; wherein, except for the plurality of first left-side conductive pads and the plurality of first right-side conductive pads, there are no other conductive pads in the recessed space of the carrier substrate; wherein, except for the plurality of second left-side conductive pads and the plurality of second right-side conductive pads, there are no other conductive pads on the bottom end of the carrier body; wherein, except for the plurality of left-side chip conductive pads and the plurality of right-side chip conductive pads, there are no other conductive pads on the image acquisition chip.

9. The portable electronic device according to claim 6, wherein: The custom image capture module further includes: a filter component, which is arranged above the image sensing area of ​​the image capture chip through a plurality of supports, and the filter component is arranged between the image capture chip and the lens structure; wherein the lens support is arranged on an upper surface of the carrier body, and the recessed space is recessed from the upper surface of the carrier body to the inside so that the recessed space faces the lens structure; wherein a plurality of the first conductive pads are arranged in the recessed space and face the lens component, and a plurality of the second conductive pads are arranged on a lower surface of the carrier body, and the area of ​​the second conductive pads is greater than the area of ​​the first conductive pads; wherein a plurality of the chip conductive pads face the lens structure, and a plurality of the chip conductive pads are respectively electrically connected to a plurality of the first conductive pads through a plurality of conductive wires; wherein the minimum distance between a side end of the second conductive pad and a side end of the carrier body is less than the length of the second conductive pad, and there is an unoccupied area between the side end of the second conductive pad and the side end of the carrier body.

10. The portable electronic device according to claim 6, wherein: The custom image capture module further includes: a filter component, which is arranged above the image sensing area of ​​the image capture chip through a plurality of supports, and the filter component is arranged between the image capture chip and the lens structure and is partially accommodated in the through opening; wherein the lens holder is arranged on an upper surface of the carrier body, and the recessed space is recessed inward from a lower surface of the carrier body so that the recessed space faces away from the lens structure; wherein a plurality of the first conductive pads are arranged in the recessed space and are shielded by the carrier body And cannot face the lens assembly, a plurality of second conductive pads are arranged on the lower surface of the carrier body, and the area of ​​the second conductive pads is larger than the area of ​​the first conductive pads; wherein, a plurality of chip conductive pads face the recessed space, and a plurality of chip conductive pads are respectively electrically connected to a plurality of first conductive pads through a plurality of conductors; wherein the minimum distance between one side end of the second conductive pad and one side end of the carrier body is less than the length of the second conductive pad, and there is an unoccupied area between the side end of the second conductive pad and the side end of the carrier body.

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