Optical adhesive film structure, spliced ​​display module and method for manufacturing display module

By setting alignment marks on the release film of the optical diaphragm structure, the problem of accumulated alignment tolerance of the display panel in the spliced ​​display module is solved, and a spliced ​​display module with low cost manufacturing and high optical performance is realized.

CN114709193BActive Publication Date: 2025-03-28AU OPTRONICS CORP
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Patent Information

Application Number
CN202210347775.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-12-08
Filing Date
2022-04-01
Publication Date
2025-03-28
Estimated Expiration
2042-04-01

AI Technical Summary

Technical Problem

When splicing multiple display panels, cumulative alignment tolerances are prone to occur, resulting in increased manufacturing costs.

Method used

An optical diaphragm structure with alignment marks is adopted, and these marks are arranged on the release film, and a plurality of display panels of the spliced ​​display module are used for alignment positioning.

Benefits of technology

Through the use of alignment marks, accumulated alignment tolerances are avoided, manufacturing costs are reduced, and the optical characteristics of the spliced ​​display module are improved.

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Abstract

An optical adhesive film sheet structure, a spliced ​​display module and a manufacturing method of the display module. An optical adhesive film sheet structure with an alignment function is provided, the optical adhesive film sheet structure comprises an optical adhesive layer and a release film. The release film is arranged on the optical adhesive layer. The release film has a plurality of marks on a first film surface away from the optical adhesive layer, and the marks are recessed into the release film relative to the first film surface and do not penetrate the release film.
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Description

Technical Field

[0001] The invention relates to an optical adhesive film structure, a spliced ​​display module and a method for manufacturing the display module. Background Art

[0002] With the development of display technology, people's demand for display devices is increasing, and the scope of application is becoming more diverse. For example, in large exhibition halls or department stores, more and more large-size display devices are set up to display public information or provide advertisements. In order to reduce the installation and maintenance costs of these large display devices, spliced ​​display devices composed of multiple display panels have become one of the common installation methods for such large display billboards. However, splicing multiple display panels will have the problem of cumulative alignment tolerance. How to avoid cumulative alignment tolerance, or even avoid cumulative tolerance at a lower manufacturing cost, has become an urgent problem to be solved in the manufacture of spliced ​​display devices. Summary of the invention

[0003] The present invention provides an optical film structure, a spliced ​​display module having the optical film structure, and a manufacturing method of the display module. The optical film structure has an alignment mark, and multiple display panels in the spliced ​​display module will not accumulate alignment tolerances, and the display module can be manufactured with a method with lower manufacturing cost.

[0004] According to one embodiment of the present invention, an optical adhesive film sheet structure with an alignment function is provided, comprising an optical adhesive layer and a release film. The release film is disposed on the optical adhesive layer. The release film has a plurality of marks on a first film surface away from the optical adhesive layer, and the marks are recessed into the release film relative to the first film surface and do not penetrate the release film.

[0005] According to another embodiment of the present invention, a spliced ​​display module is provided, comprising the above-mentioned optical adhesive film structure and a plurality of display panels. The display panels are arranged on the optical adhesive layer. The optical adhesive layer is arranged between the display panels and the release film, and the display panels are arranged corresponding to the markings respectively.

[0006] According to another embodiment of the present invention, a method for manufacturing a display module is provided, including configuring an optical adhesive film structure, wherein the optical adhesive film structure has a stacked optical adhesive layer and a release film; configuring at least one mark on a first film surface of the release film away from the optical adhesive layer, wherein the at least one mark is recessed into the release film relative to the first film surface and does not penetrate the release film; and configuring at least one display panel on the optical adhesive layer, such that the optical adhesive layer is configured between the at least one display panel and the release film, and the at least one display panel corresponds to the at least one mark configuration.

[0007] Based on the above, the optical film structure provided by the embodiment of the present invention has an alignment mark. The multiple display panels in the spliced ​​display module are aligned using the alignment mark without accumulating alignment tolerance. In addition, by setting the alignment mark on the optical film structure, the display module can be manufactured at a lower manufacturing cost.

[0008] In order to make the above features and advantages of the present invention more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figures 1A to 1D is a schematic diagram of a method for manufacturing a display module according to an embodiment of the present invention.

[0010] Figure 2 yes Figures 1A to 1C A partial cross-sectional view of the release film shown.

[0011] Figure 3 is a schematic cross-sectional view of a spliced ​​display module according to an embodiment of the present invention.

[0012] Description of reference numerals:

[0013] 100: Optical film structure

[0014] 101: Release film

[0015] 101M: Mark

[0016] 101S, 102B, 102S: membrane surface

[0017] 102: Optical adhesive layer

[0018] 200, 300, 500: spliced ​​display module

[0019] 201, 501: Display panel

[0020] 201L: Luminous surface

[0021] 202, 502: Circuit board

[0022] 203, 503: Light-emitting element

[0023] 203R, 203G, 203B: Light Emitting Diode

[0024] 204, 504: Encapsulation layer

[0025] 301: Translucent substrate

[0026] 401: Basal layer

[0027] 502B: Carrier board

[0028] 502E: Circuit layer

[0029] 505: Through hole

[0030] 506: Flexible circuit board

[0031] A1, B1, C1, D1: Width DETAILED DESCRIPTION

[0032] Reference Figures 1A to 1D , which is a schematic diagram showing a method for manufacturing a display module according to an embodiment of the present invention.

[0033] Reference Figure 1A According to the manufacturing method of the display module of the present embodiment, an optical adhesive film sheet structure 100 is configured. The optical adhesive film sheet structure 100 includes a release film 101 and an optical adhesive layer 102. The release film 101 is configured on the optical adhesive layer 102. The release film 101 has a plurality of marks 101M on a film surface 101S away from the optical adhesive layer 102. The marks 101M are recessed into the release film 101 relative to the film surface 101S and do not penetrate the release film 101 to avoid damaging the optical adhesive layer 102 and affecting the optical properties of the optical adhesive layer 102.

[0034] Reference Figure 1B According to the manufacturing method of the display module of this embodiment, a plurality of display panels 201 are arranged on the optical adhesive layer 102 to form a spliced ​​display module 200. The spliced ​​display module 200 includes an optical adhesive film sheet structure 100 and a plurality of display panels 201. The display panels 201 are arranged on the optical adhesive layer 102. The optical adhesive layer 102 is arranged between the display panels 201 and the release film 101, and the display panels 201 are arranged corresponding to the marks 101M respectively.

[0035] In the process of placing the display panel 201 on the optical adhesive layer 102, the mark 101M is used as an alignment mark, and each display panel 201 is positioned according to the corresponding mark 101M. Compared with the spliced ​​display module in the prior art that does not have an alignment mark, each display panel 201 in the spliced ​​display module 200 provided in this embodiment is positioned respectively by the corresponding mark 101M, thereby avoiding the accumulation of alignment tolerance.

[0036] It should be noted that although Figures 1A to 1D It is shown in a cross-sectional schematic diagram. In actual application, a plurality of marks 101M are disposed on the film surface 101S in a two-dimensional array, and a plurality of display panels 201 are disposed on the optical adhesive layer 102 in a corresponding two-dimensional array.

[0037] Specifically, the optical adhesive layer 102 in this embodiment can be, for example, an optical clear adhesive (OCA). In the prior art, optical clear adhesive is used to bond different layer structures in the display module and effectively reduce ambient light reflection. The embodiment of the present invention uses a method of setting a mark 101M on the release film 101, so that the optical adhesive film sheet structure 100 from which the release film 101 has not been removed can provide a positioning function in the subsequent process of splicing multiple display panels 201, thereby increasing the functionality of the optical adhesive film sheet structure 100 in the process. Furthermore, the embodiment of the present invention uses the existing release film 101 in the optical adhesive film sheet structure 100 to set the mark 101M, without adding an additional film layer to set the mark 101M, without adding additional costs, and improving process accuracy.

[0038] Refer to Figure 1B Each display panel 201 includes a circuit substrate 202, a plurality of light-emitting elements 203, and a packaging adhesive layer 204. The light-emitting elements 203 are light-emitting diodes, and include red light-emitting diodes 203R, green light-emitting diodes 203G, and blue light-emitting diodes 203B. The light-emitting elements 203 are arranged in an array between the circuit substrate 202 and the optical adhesive layer 102. The packaging adhesive layer 204 is configured to cover the light-emitting elements 203. The packaging adhesive layer 204 of each display panel 201 is bonded to the film surface 102B of the optical adhesive layer 102, and the light-emitting surface 201L of each display panel 201 is coplanar with the film surface 102B of the optical adhesive layer 102, so that the light-emitting surfaces 201L of each display panel 201 in the spliced ​​display module 200 are coplanar with each other, thereby improving the uniformity of the spliced ​​display module 200 in terms of brightness and chromaticity.

[0039] Next, refer to Figure 1C to Figure 1D According to the manufacturing method of the display module of the present embodiment, the release film 101 is removed from the film surface 102S of the optical adhesive layer 102, and the film surface 102S of the optical adhesive layer 102 is bonded to the transparent substrate 301 to form a spliced ​​display module 300. The spliced ​​display module 300 includes a transparent substrate 301, a plurality of display panels 201, and an optical adhesive layer 102 disposed between the transparent substrate 301 and the plurality of display panels 201 and used to bond the transparent substrate 301 and the plurality of display panels 201. The transparent substrate 301 can be, for example, a glass substrate, a sapphire substrate, or a flexible substrate including materials such as polyethylene terephthalate (PET) and polyimide (PI).

[0040] Reference Figure 2 , which shows Figures 1A to 1CThe partial cross-sectional view of the release film shown in FIG. In this embodiment, the manufacturing method of the display module further includes irradiating the film surface 101S of the release film 101 with a laser to set a plurality of marks 101M. The marks 101M are recessed into the release film 101 relative to the film surface 101S and do not penetrate the release film 101. The marks 101M can be any pattern, and the width is larger as it is closer to the film surface 101S, such as Figure 2 In addition, the mark 101M may also include a heat-affected zone formed by the heat energy of the laser. The heat-affected zone is a preset structure. The surface structure may be destroyed or the film layer may be disintegrated or modified due to the heat energy. The widths C1 and D1 of the heat-affected zone may be substantially the same.

[0041] In order to fully illustrate the various embodiments of the present invention, other embodiments of the present invention will be described below. It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the previous embodiments, and the following embodiments will not be repeated.

[0042] Reference Figure 3 , which shows a cross-sectional schematic diagram of a spliced ​​display module according to an embodiment of the present invention. The spliced ​​display module 500 includes a base layer 401, an optical adhesive layer 102, and a plurality of display panels 501. The base layer 401 may be Figure 1B The release film 101 or Figure 1D The display panel 501 includes a circuit substrate 502, a plurality of light emitting elements 503 (for ease of understanding, Figure 3 Only one light emitting element 503) and a packaging glue layer 504 are shown.

[0043] The circuit substrate 502 includes a carrier 502B and a circuit layer 502E. The carrier 502B is flexible and may include materials such as PET or PI. The light emitting element 503 is disposed on the side of the circuit substrate 502 facing the optical adhesive layer 102. The display panel 501 utilizes chip on film (COF) technology to integrate the driver chip of the display panel 501 on the flexible circuit board 506. The through hole 505 penetrates the circuit substrate 502, and a conductive metal is disposed in the through hole 505. The light emitting element 503 is electrically connected to the flexible circuit board 506 through the conductive metal in the through hole 505.

[0044] In summary, the optical film structure provided by the embodiment of the present invention has an alignment mark. The multiple display panels in the spliced ​​display module are aligned using the alignment mark without accumulating alignment tolerances. In addition, by setting the alignment mark on the existing release film of the optical film structure, the display module can be manufactured at a lower manufacturing cost.

Claims

1. A spliced ​​display module, comprising: An optical film structure having an alignment function and comprising: an optical adhesive layer; and A release film, disposed on the optical adhesive layer; The release film has a plurality of marks on a first film surface away from the optical adhesive layer, and the marks are recessed into the release film relative to the first film surface and do not penetrate the release film; and A plurality of display panels are disposed on the optical adhesive layer. The optical adhesive layer is disposed between the display panels and the release film, and the display panels are respectively disposed corresponding to the markings. The marks are arranged on the first film surface in a two-dimensional array form, and the display panels are configured on the optical adhesive layer in a corresponding two-dimensional array form. 2 . The spliced ​​display module as claimed in claim 1 , wherein each display panel comprises a circuit substrate and a plurality of light emitting elements, and the light emitting elements are disposed between the circuit substrate and the optical adhesive layer. 3 . The spliced ​​display module as claimed in claim 2 , wherein each display panel further comprises a packaging adhesive layer configured to cover the light emitting elements, and the packaging adhesive layer is configured between the light emitting elements and the optical adhesive layer. 4 . The spliced ​​display module as claimed in claim 1 , wherein a light emitting surface of each display panel is coplanar with a second film surface of the optical adhesive layer away from the release film.

5. A method for manufacturing a display module, comprising: An optical adhesive film structure is provided, wherein the optical adhesive film structure comprises an optical adhesive layer and a release film which are stacked; Disposing at least one mark on a first film surface of the release film away from the optical adhesive layer, wherein the at least one mark is recessed into the release film relative to the first film surface and does not penetrate the release film; and At least one display panel is disposed on the optical adhesive layer, so that the optical adhesive layer is disposed between the at least one display panel and the release film, and the at least one display panel is disposed corresponding to the at least one mark, The marks are arranged on the first film surface in a two-dimensional array form, and the display panels are configured on the optical adhesive layer in a corresponding two-dimensional array form.

6. The method for manufacturing a display module according to claim 5, further comprising: The at least one mark is used as an alignment mark, and the at least one display panel is arranged on the optical adhesive layer so that the at least one display panel corresponds to the at least one mark.

7. The method for manufacturing a display module according to claim 5, further comprising: The first film surface of the release film is irradiated with laser to set the at least one mark.

8. The method for manufacturing a display module according to claim 5, further comprising: Disposing at least one light-emitting element and a packaging adhesive layer covering the at least one light-emitting element on a circuit substrate to form the at least one display panel; as well as The packaging adhesive layer is bonded to a second film surface of the optical adhesive layer away from the release film.

9. The method for manufacturing a display module according to claim 8, further comprising: removing the release film from the optical adhesive layer; as well as The optical adhesive layer is bonded to a light-transmitting substrate.

Citation Information

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