A composite heat dissipation structure for computer chips with olefin carbon materials

Abstract

This invention discloses a composite heat dissipation structure for a computer chip using an AFG olefin carbon material, comprising, from top to bottom, a flexible copper film, an AFG olefin carbon layer, a thermally conductive insulating adhesive, a curing adhesive, and a polytetrafluoroethylene (PTFE) protective layer. The AFG olefin carbon layer contains an array of several downwardly recessed waist-shaped structures. The flexible copper film fills the interior of these waist-shaped structures, which include a first bend protruding towards the center and a second bend protruding to both sides. By adding waist-shaped structures to the AFG olefin carbon layer, placing a flexible copper film above the waist-shaped structures for heat conduction, using thermally conductive insulating adhesive below the waist-shaped structures for heat conduction, and using curing adhesive in the middle of the waist-shaped structures to enhance structural strength, the heat dissipation structure achieves maximum thermal conductivity and heat dissipation capacity while maintaining sufficient strength, thus meeting the composite heat dissipation requirements of computer chips.

Description

Technical Field

[0001] This invention relates to a composite heat dissipation structure for computer chips using olefinic carbon materials. Background Technology

[0002] With increasing demands for miniaturization and high computational power, integrated chips are operating at higher frequencies, and the heat dissipation structures used for integrated chips are evolving from traditional thermally conductive silicone to graphene with stronger thermal conductivity, as well as AFG olefin carbon materials.

[0003] Composite heat dissipation structures used for computer chips are currently mainly based on air cooling and water cooling. However, regardless of whether it is air cooling or water cooling, although their cooling methods are different, their fundamental principle is still to effectively conduct heat off the surface of the chip and expel the heat from the chassis in a timely manner through a powerful and effective heat dissipation structure.

[0004] When dissipating heat, the current structure often uses a pure copper layer for heat conduction. However, pure copper has disadvantages such as high weight and high cost. Furthermore, with the miniaturization of chips, pure copper can no longer meet the heat dissipation requirements of existing chips.

[0005] Meanwhile, AFG olefin carbon and graphene materials have been gradually applied to miniaturized electronic devices such as mobile phones. However, how to increase the contact area between AFG olefin carbon materials and heat sources and heat dissipation components has become the research and development focus of existing AFG olefin carbon applications in heat dissipation structures.

[0006] AFG graphene-carbon materials are novel materials formed by planting metal ions on the surface of graphene or graphene-like materials, and they have excellent thermal conductivity.

[0007] Because the heat dissipation capacity of AFG olefin carbon materials is similar to that of a highway, its thermal conductivity is far superior to that of metal materials. However, since AFG olefin carbon materials do not have electronic thermal conductivity, their ability to absorb and dissipate heat is poor. This is similar to the fact that the existence of toll booths on a highway weakens the heat dissipation capacity of AFG olefin carbon materials. To address this issue, current research and development often focuses on two directions: one is to use copper-based composites, and the other is to increase the contact area. Summary of the Invention

[0008] To address the shortcomings of existing technologies, a composite heat dissipation structure for computer chips using olefinic carbon materials is proposed.

[0009] The present invention provides a composite heat dissipation structure for a computer chip with olefin carbon material, comprising, from top to bottom, a soft copper film, an AFG olefin carbon layer, a thermally conductive insulating adhesive, a curing adhesive, and a polytetrafluoroethylene protective layer; the AFG olefin carbon layer has a plurality of downwardly recessed waist-shaped structures arranged in an array, the soft copper film filling the interior of the waist-shaped structures, and the waist-shaped structures including a first bending portion protruding towards the center and a second bending portion protruding to both sides.

[0010] To ensure the overall strength of the heat dissipation structure, and to increase the contact area between the AFG olefin carbon layer and the thermally conductive insulating layer, the lowest point of the thermally conductive insulating layer is higher than the center point of the second bend, the lowest point of the cured adhesive is lower than the center point of the second bend, and the lowest point of the cured adhesive is higher than the lowest point of the second bend.

[0011] To prevent the AFG olefin carbon layer from being excessively bent, which could lead to internal structural breakage, the radius of the first bend is smaller than the radius of the second bend, and the angle of each bend in the first and second bends is greater than 90 degrees.

[0012] Furthermore, the curing adhesive is an epoxy resin thermosetting adhesive.

[0013] In order to fill the waist-shaped structure on the AFG olefin carbon layer as much as possible with copper material during use, and to ensure sufficient contact between the copper material and the AFG olefin carbon layer, the lamination method of the soft copper film and the AFG olefin carbon layer is as follows:

[0014] S1. Select ultra-thin copper foil of less than 0.1mm, cover it on the surface of the afg olefin carbon layer in sequence, and fully compress it;

[0015] S2. The copper foil is melted by using high-temperature hot air and then extruded a second time until the copper foil completely covers the surface of the afg olefin carbon layer.

[0016] S3. After the copper foil has cooled, cover the surface of the copper foil with a new copper foil;

[0017] S4. Use high-temperature hot air to completely cover the surface of the original copper foil layer with the new copper foil layer.

[0018] S5. Repeat S3 and S4 until the thickness of the soft copper film layer reaches the design standard.

[0019] S6. After full coverage is completed, high-temperature hot pressing is performed to remove pores in the soft copper film.

[0020] Furthermore, the curing adhesive is bonded to the thermally conductive insulating adhesive under high temperature curing, thereby improving the overall strength.

[0021] To improve the contact thermal conductivity, there are no air bubbles between the thermally conductive insulating adhesive and the afg olefin carbon layer.

[0022] Beneficial effects:

[0023] By adding a waist-shaped structure to the AFG olefin carbon layer, placing a soft copper film above the waist-shaped structure for heat conduction, using thermally conductive insulating adhesive below the waist-shaped structure for heat conduction, and using a curing adhesive in the middle of the waist-shaped structure to enhance structural strength, the heat dissipation structure can achieve maximum heat conduction and heat dissipation capacity while maintaining a certain strength, thereby meeting the composite heat dissipation requirements of computer chips. Attached Figure Description

[0024] Figure 1 It is a composite heat dissipation structure for computer chips containing olefinic carbon materials;

[0025] Figure 2 This is a schematic diagram of the internal structure of a composite heat dissipation structure for a computer chip.

[0026] 1. Soft copper film 2. AFG olefin carbon layer 3. Thermally conductive insulating adhesive 4. Curing adhesive 5. Polytetrafluoroethylene protective layer. Detailed Implementation

[0027] To enhance understanding of the present invention, the present invention will be further described in detail below with reference to embodiments and accompanying drawings. These embodiments are only used to explain the present invention and do not constitute a limitation on the scope of protection of the present invention.

[0028] Implementation example:

[0029] A computer chip composite heat dissipation structure with olefin carbon material includes, from top to bottom, a soft copper film, an AFG olefin carbon layer, a thermally conductive insulating adhesive, a curing adhesive, and a polytetrafluoroethylene protective layer; the AFG olefin carbon layer has a plurality of downwardly recessed waist-shaped structures arranged in an array, the soft copper film fills the interior of the waist-shaped structures, and the waist-shaped structures include a first bend protruding towards the center and a second bend protruding to both sides.

[0030] The lamination method for the soft copper film and the afg olefin carbon layer is as follows:

[0031] S1. Select ultra-thin copper foil of less than 0.1mm, cover it on the surface of the afg olefin carbon layer in sequence, and fully compress it;

[0032] S2. The copper foil is melted by using high-temperature hot air and then extruded a second time until the copper foil completely covers the surface of the afg olefin carbon layer.

[0033] S3. After the copper foil has cooled, cover the surface of the copper foil with a new copper foil;

[0034] S4. Use high-temperature hot air to completely cover the surface of the original copper foil layer with the new copper foil layer.

[0035] S5. Repeat S3 and S4 until the thickness of the soft copper film layer reaches the design standard.

[0036] S6. After full coverage is completed, high-temperature hot pressing is performed to remove pores in the soft copper film.

[0037] To ensure the overall strength of the heat dissipation structure, and to increase the contact area between the AFG olefin carbon layer and the thermally conductive insulating layer, the lowest point of the thermally conductive insulating layer is higher than the center point of the second bend, the lowest point of the cured adhesive is lower than the center point of the second bend, and the lowest point of the cured adhesive is higher than the lowest point of the second bend.

[0038] To prevent the AFG olefin carbon layer from being excessively bent, which could lead to internal structural breakage, the radius of the first bend is smaller than the radius of the second bend, and the angle of each bend in the first and second bends is greater than 90 degrees.

[0039] As a further improvement, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A computer chip composite heat sink structure having an olefin-carbon material, characterized by, It comprises, from top to bottom, a soft copper film, an afg alkene carbon layer, a heat-conducting insulating glue, a cured glue and a polytetrafluoroethylene protective layer; the afg alkene carbon layer is provided with a plurality of downwardly concave waist-shaped structures arranged in an array, the soft copper film is filled in the inside of the waist-shaped structures, and the waist-shaped structure comprises a first bending part protruding to the center and a second bending part protruding to both sides. The lowermost end of the heat-conducting insulating glue is higher than the center point of the second bending part, the lowermost end of the cured glue is lower than the center point of the second bending part, and the lowermost end of the cured glue is higher than the lowermost end of the second bending part.

2. The computer chip composite heat sink structure with olefin-carbon material of claim 1, wherein, The radius of the first bending part is smaller than the radius of the second bending part.

3. The computer chip composite heat sink structure with olefin-carbon material of claim 1, wherein, The angle of each bending part in the first bending part and the second bending part is greater than 90 degrees.

4. The computer chip composite heat sink structure with olefin-carbon material of claim 1, wherein, The cured glue is an epoxy resin heat-cured glue.

5. The computer chip composite heat sink structure with olefin-carbon material of claim 1, wherein, The covering mode of the soft copper film and the afg alkene carbon layer is as follows: S1, an ultra-thin copper foil with a thickness of less than 0.1 mm is selected and is covered on the surface of the afg alkene carbon layer in sequence and is fully extruded; S2, the copper foil is melted by using a high-temperature hot air mode and is extruded for the second time until the copper foil completely covers the surface of the afg alkene carbon layer; S3, after the copper foil is cooled, a new copper foil is covered on the surface of the copper foil; S4, the new copper foil layer is completely covered on the surface of the original copper foil layer by using a high-temperature hot air blowing mode; S5, S3 and S4 are repeated until the thickness of the soft copper film layer reaches the design standard; S6, after the covering is completed, high-temperature hot pressing treatment is performed to remove pores in the soft copper film.

6. The computer chip composite heat sink structure with olefin-carbon material of claim 1, wherein, The cured glue is adhered below the heat-conducting insulating glue by high-temperature curing and improves the overall strength.

7. The computer chip composite heat sink structure with olefin-carbon material of claim 1, wherein, There is no bubble between the heat-conducting insulating glue and the afg alkene carbon layer.

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