Device alignment, testing apparatus with fine pitch and method of aligning devices

Abstract

The structure of the present application includes: a base plate (40) forming a vacuum hole (41) at the installation site of a device (30), in the state of loading the device (30), with the application of vacuum pressure, the loaded device (30) is attracted by the vacuum pressure with a slight movement; a clamp plate (20) fixedly arranged on the upper part of the base plate (40), the number of opening parts (21) of the device (30) loaded is formed in the same way as the number of the device (30) loaded on the base plate (40); the base plate position adjusting device (50) makes the position of the device (30) loaded on the base plate (40) move slightly along the X-Y-θ direction, so that it is located on the opening part (21) formed on the clamp plate (20).

Description

TECHNICAL FIELD

[0001] The present invention relates to a device alignment and testing apparatus and a device alignment method for fine-pitch devices such as BGA (Ball Grid Array) or TSOP (Thin Small Outline Package) having small bumps and narrow pitches, which are accurately aligned after device production to perform performance testing on a handler, and more particularly to a device alignment and testing apparatus and a device alignment method for fine-pitch devices, which simultaneously aligns devices loaded on a base plate after loading all the base plate devices to be tested on the base plate, and simultaneously contacts the ball terminals of the devices to the terminals of a tester to perform testing. BACKGROUND

[0002] Generally, semiconductor devices such as ICs (electronic components) are inspected for electrical characteristics in their manufacturing processes, and then inspected for defects, and the electrical characteristics of the semiconductor devices are inspected by electrically connecting the terminals of a test board including semiconductor device ball terminals and a printed circuit board (PCB) and then testing for a predetermined time, and the qualified products are shipped, and the unqualified products are retested or discarded.

[0003] Conventionally, the devices to be tested are inserted into a carrier, and then individually moved to the tester side to test the electrical characteristics of the devices.

[0004] Further, the electrical testing of the devices is performed by electrically contacting the ball terminals of the devices mounted in the carrier and probes supported by a socket assembly, and at this time, the configuration interval between the very small ball terminals and the probes is very small, and the alignment precision is very high, but the arrangement of the ball terminals and the probes is formed by the mutual arrangement of the alignment holes of the carrier and the alignment pins of the socket guide.

[0005] PRIOR ART DOCUMENT

[0006] (Patent Document 0001) Korean Registered Patent Gazette 10-146990 (registered on January 19, 2014);

[0007] (Patent Document 0002) Korean Registered Patent Gazette 10-1779172 (registered on September 11, 2017). SUMMARY

[0008] TECHNICAL PROBLEM

[0009] However, the conventional alignment apparatus has various problems as follows.

[0010] First, the devices located in the loading part are loaded into the carrier by the loading separator, the carrier loaded with the devices is sequentially moved to the tester side, after the test is performed for a set time, the carrier with the devices tested is moved to the unloading part, and the devices are screened into the qualified products and unqualified products by the unloading separator according to the test results, so that the compactness and simplicity of the equipment cannot be realized.

[0011] Second, the operation of combining and separating the carrier and the socket guide is repeatedly performed during the test, the alignment pin and the alignment hole are repeatedly combined and separated, the idle degree of the alignment pin and the alignment hole is increased, and the mismatch or offset of the ball terminal and the probe is caused.

[0012] Third, when the electrical test is performed on several thousand or more devices, the high-priced devices are easily damaged due to the collision between the devices and the probes, or the ball terminal of the damaged device is left in the equipment, so that the replacement or repair is performed in the state that the electrical test is temporarily stopped, and thus the operation rate of the high-priced equipment is reduced.

[0013] The present application is created to solve the problems as described above, and aims to improve the structure, load all the devices to be tested through the opening parts formed on the jig plate to the upper surface of the base plate to which the vacuum pressure is applied, move the base plate along the X-Y-θ axis direction by the base plate position adjusting device, and automatically align the positions of the plurality of devices at the same time.

[0014] Another object of the present application is to align the positions of the plurality of devices, move the base plate to the tester side in the state that the plurality of devices are adsorbed to the base plate by the vacuum pressure, connect the ball terminals of the plurality of devices adsorbed to the base plate to the terminals of the tester, and further perform the electrical test, and classify the qualified products and unqualified products according to the results.

[0015] Technical solution

[0016] To achieve the object, according to the embodiment of the present application, a device alignment device with a small pitch is provided, preferably comprising: a base plate, vacuum holes are respectively formed at the installation sites of the devices, the loaded devices are attracted by the vacuum pressure with a slight movement in the state that the vacuum pressure is applied; a jig plate, fixedly arranged on the upper part of the base plate, the number of opening parts in which the devices are loaded is the same as the number of the devices loaded on the base plate; a base plate position adjusting device, moving the positions of the devices loaded on the base plate along the X-Y-θ direction with a slight movement, so that the devices are located in the opening parts formed on the jig plate; in the state that the devices are loaded in each opening part formed on the jig plate and attracted to the base plate, the base plate is slightly moved along the X-Y-θ direction by the base plate position adjusting device, and then the plurality of devices are aligned at the same time.

[0017] According to an embodiment of the present application, there is provided a device testing apparatus having a fine pitch, preferably comprising: a frame; a loading portion and an unloading portion provided at both ends of the frame; a jig plate provided with a plurality of opening portions for loading devices at the loading portion; an aligner for aligning a plurality of devices loaded in the opening portions of the jig plate; a Z-axis motor for raising and lowering the aligner; a guide rail provided through the loading portion and the unloading portion; a conveyor to which the Z-axis motor is fixed and which moves horizontally along the guide rail; and a tester for testing the performance of the plurality of devices aligned by the aligner.

[0018] According to still another embodiment of the present application, there is provided an aligning method of a device having a fine pitch, preferably comprising: a step of sequentially loading devices into a plurality of opening portions formed in a jig plate and onto a base plate having a vacuum hole; a step of attracting the loaded devices with a vacuum pressure that is minutely movable, while the devices are loaded in the base plate, as the vacuum pressure is applied; a step of minutely moving the base plate in an X-Y-θ direction by a base plate position adjusting device, so that each of the devices is guided to both edges of the opening portion and is further aligned; and a step of simultaneously aligning the devices loaded in the base plate.

[0019] Advantages

[0020] According to the present application, there are advantages in that,

[0021] First, after sequentially loading the devices into the base plate, the devices attracted to the base plate are covered with the opening portions of the jig plate in the state of being attracted with the vacuum pressure that is minutely movable, and the base plate is minutely moved in the X-Y-θ direction by the base plate position adjusting device, so that the plurality of devices are simultaneously aligned, thereby maximizing the operation rate of the equipment.

[0022] Second, the plurality of devices are simultaneously electrically connected to the tester for testing, without using other carriers, thereby preventing the phenomenon of misalignment or offset of the ball terminals of the devices and the probes, and maximizing the testing efficiency of the high-priced equipment.

[0023] Third, the height positioning force and the friction force of the base plate position adjusting device are reduced, thereby maximizing the precision of the alignment. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a perspective view showing an embodiment of the present application;

[0025] Figure 2 is a bottom perspective view of Figure 1 ;

[0026] Figure 3a and Figure 3b is a bottom perspective view of Figure 1a plan view of a state where the jig plate and the base plate are removed;

[0027] Figure 4 is a perspective view showing another embodiment of the present application;

[0028] Figure 5a and Figure 5b is Figure 4 a front view and a plan view of

[0029] Figure 6a is a plan view of a state where a device is put into the opening part of the jig plate of the present application and is seated on the base plate;

[0030] Figure 6b is a view of a state where the base plate of the present application is slightly moved in the X-Y-θ direction, and the alignment of the device is completed through the opening part formed on the jig plate;

[0031] Figure 7 is a flow chart illustrating the alignment method of the present application. DETAILED DESCRIPTION

[0032] The technical solutions in the preferred embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings, so that those skilled in the art can easily implement the embodiments based on the embodiments in the present application. The embodiments described are part of the embodiments of the present application, but not all of the embodiments. The drawings of the figures are schematic and do not conform to the scale. The relative sizes and ratios of the parts in the figures are exaggerated or reduced for the clarity of the figures, and any size is only an example and is not limited. The same structure, element or accessory appearing in two or more figures is denoted by the same reference numeral for its similar features.

[0033] Figure 1 is a perspective view showing an embodiment of the present application, Figure 2 is Figure 1 a bottom perspective view of Figure 3a and Figure 3b is a plan view of a state where the jig plate and the base plate in Figure 1 are removed, and the present application is that a plurality of vacuum holes 41 are formed on the upper surface of the base plate 40 on which the devices 30 to be tested are loaded by a loading device (omitted from the drawing) such as a handler as shown in Figure 6a , so that the devices 30 are attracted by vacuum pressure, and when the devices loaded on the base plate 40 are aligned, the devices 30 are attracted by primary vacuum pressure (about 5-50 mmHg) to complete the alignment, and after the alignment, the devices 30 are attracted by secondary vacuum pressure (about 50-100 mmHg) to prevent the aligned devices 30 from moving between the transfer of the base plate 40.

[0034] According to an embodiment of the present application, the base plate 40 is square, but various shapes such as rectangular or circular can be used according to the needs.

[0035] The inside of the base plate 40 is provided with a heater and a cooling pipe (not shown), and before the device 30 is loaded on the base plate 40, the temperature of the base plate 40 is maintained at a constant temperature according to the test conditions of the device 30, or is heated to about 50 to 170°C, or is cooled to about 0 to -55°C.

[0036] Because the base plate 40 even if using the material with the smallest expansion coefficient (for example, ceramic, etc.), but assuming that the base plate 40 is 300 mm on a side, with heating and cooling, about in the range of 0.3 mm expands or shrinks, therefore before the device 30 is loaded on the base plate 40, the temperature of the base plate 40 is adjusted according to the test conditions, so that the error caused by the expansion or shrinkage of the base plate 40 becomes minimal.

[0037] The upper portion of the base plate 40 is provided with a jig plate 20 having the same number of opening portions 21 as the number of devices 30 loaded on the base plate 40 for aligning the devices 30, and through each of the opening portions 21, the device 30 to be tested is loaded on the base plate 40, and then is attracted by a vacuum suction in a slightly movable manner, and then the base plate 40 is slightly moved along the X-Y-θ direction by a base plate position adjusting device 50 located at the lower portion of the base plate 40, so that the plurality of devices 30 are aligned at the same time.

[0038] At this time, the jig plate 40 is suspended in a cantilevered manner from the frame 10 or the like as shown in other embodiments. Figure 5a As shown, it is easy to understand that the jig plate 40 is suspended in a cantilevered manner from the frame 10 or the like by the support 22.

[0039] According to an embodiment of the present application, the base plate position adjusting device 50 for slightly moving the base plate 40 along the X-Y-θ direction is as shown in Figure 3a and Figure 3b As shown, the setting plate 51 is provided in a vertically movable manner, a pair of X-axis motors 52a, 52b are provided facing the setting plate 51, a Y-axis motor 53 is provided on the setting plate 51 at a right angle with the X-axis motors, a movable plate 54 is provided to be slightly movable along the X-Y-θ direction by the X-axis motors 52a, 52b and the Y-axis motor 53, four cross rollers 55 are provided between the setting plate 51 and the movable plate 54 to allow the movable plate 54 to move in the X-Y-θ direction, and an axle 56 is provided to rotatably connect the movable plate 54 to each of the cross rollers 55.

[0040] The cross roller 55 is composed of an X-axis, a Y-axis, and a multi-stage plate having an LM guide rail (not shown).

[0041] But as the base plate position adjustment device 50 shown in an embodiment of the present application is a well-known product produced by MISUMI Co. (model: AA-300-3S).

[0042] Those of ordinary skill in the art will understand that the base plate position adjustment device 50 can still be modified into various forms for use.

[0043] Figure 4 is a perspective view showing another embodiment of the present application, Figure 5a and Figure 5b is Figure 4 a front view and a plan view of the frame 10, one end (left side of the drawing) of which is provided with a loading part 60 where the devices 30 to be tested are sequentially loaded onto the base plate 40, the other end (right side of the drawing) of which is provided with an unloading part 70 where the devices 30, which have completed testing at the testing part 80, are classified into good products and defective products according to the test results, and the testing part 80 where the aligned devices 30 are simultaneously tested is provided between the loading part 60 and the unloading part 70, and a tester 81 for simultaneously testing the devices 30 aligned on the base plate 40 is provided at the upper part of the testing part 80.

[0044] At the loading part 60, the jig plate 20 provided with a plurality of opening parts 21 is provided in a cantilever form by a support 22 fixed to the frame 10, and an aligner 100 for aligning the devices 30 loaded through the opening parts 21 is provided at the lower part of the jig plate 20, and the aligner 100 is raised and lowered by a Z-axis motor 102 provided on a conveyor 101 horizontally moving along a guide rail 110.

[0045] In this state, the aligner 100 is raised and lowered at the loading part 60, the testing part 80, and the unloading part 70 by driving of the Z-axis motor 102.

[0046] In another embodiment of the present application, the aligner 100 is composed of a vacuum hole 41 formed at the installation site of the device 30, a base plate position adjustment device 50 for minutely moving the position of the device 30 loaded on the base plate 40 along the X-Y-θ direction by applying vacuum pressure to the base plate 40 minutely moving the loaded device 30 by vacuum pressure in the state where the device 30 is loaded on each opening part 21 formed on the jig plate 20 and is attracted by the base plate 40, and minutely moving the base plate 40 along the X-Y-θ direction by the base plate position adjustment device 50 in the state where the device 30 loaded on each opening part 21 formed on the jig plate 20 is attracted by the base plate 40, and simultaneously aligning a plurality of devices 30.

[0047] Even if only the loading part 60, the testing part 80, and the unloading part 70 are provided on the frame 10, the multiple devices 30 attracted and aligned by the base plate 40 can be electrically tested in the testing part 80, but the time for testing the devices 30 in the testing part 80 is longer than the time for loading and aligning the multiple devices 30 on the base plate 40, so it is further preferable that a device flushing part 90 for flushing the devices is also provided to prevent the multiple devices 30 attracted by the base plate 40 from being exposed to air.

[0048] If the devices 30 are exposed to air, frost is generated due to temperature difference, or oxidation occurs, and then stains are generated on the terminals of the devices, and further, problems of visual defects or contact defects occur.

[0049] The device flushing part 90 is composed of a cover 91 for sealing the multiple devices 30 aligned on the base plate 40 after the base plate 40 is raised by a Z-axis motor 102, and a supply pipe 92 for supplying nitrogen (N2) to the inside of the cover 91, as shown in Figure 5a

[0050] The effects of the present application will be described below.

[0051] Figure 7 is a flowchart for explaining the alignment method of the present application, and the base plate 40 is raised to the upper dead point, and then kept at a constant temperature under the testing conditions of the devices 30, or heated to about 50-170°C, or cooled to about 0- -55°C, in a state of being located just below the jig plate 20 at a predetermined interval (lower than the height of the devices), as shown in Figure 3a or Figure 5a

[0052] As described above, the devices 30 are sorted by the sorter in the loading part (not shown) under the condition that the base plate 40 is kept at an appropriate temperature according to the testing conditions of the devices 30, and then sequentially placed in the vacuum holes 41 of the base plate 40 through the opening part 21 formed on the jig plate 20, and then attracted by the vacuum device (not shown) connected to the vacuum holes 41 with a vacuum pressure of about 5-50 mmHg (S100 step, S200 step).

[0053] The devices 30 can be attracted each time they are placed in the vacuum holes 41 of the base plate 40 by the sorter, but it is preferable that the devices 30 are attracted all at once in the state that the devices 30 are loaded on each of the vacuum holes 41 of the base plate 40, so that the number of components can be significantly reduced, and it is advantageous for control, thereby saving production cost.

[0054] The devices 30 placed in the vacuum holes 41 of the base plate 40 through the opening part 21 formed on the jig plate 20 can have an arbitrary posture, as shown in Figure 6a ​​​

[0055] As described above, after the loading section 60 is separated from the device 30 to be tested by the sorter, all of the devices 30 are loaded into the seating holes 41 of the base plate 40 through the respective opening sections 21 formed in the jig plate 20, and are attracted by a vacuum pressure of about 5 to 50 mmHg that is slightly movable. Then, the two X-axis motors 52a, 52b as the base plate position adjusting device 50 are driven in the same direction, and the movable plate 54 is moved in the X-axis direction. The Y-axis motor 53 is driven in the forward and reverse directions, and the movable plate 54 is moved in the Y-axis direction. Then, the two X-axis motors 52a, 52b are driven in the opposite directions, and the movable plate 54 is slightly moved in the θ direction. Thus, as shown in FIG. 6, the base plate 40 is moved in the X-Y-θ directions, and is closely attached to the two sides of the opening section 21. Further, the plurality of devices 30 are simultaneously aligned (S300 step). Figure 6b As described above, when the devices 30 are slightly moved and aligned in the X-Y-θ directions by the base plate position adjusting device 50, it is preferable that the position of the devices is corrected in a state in which the bottom surface of the jig plate 20 is separated from the upper surface of the base plate 40.

[0056] Since the movable plate 54 is slightly moved in the X-Y-axis directions by the cross roller 55, and is slightly rotated in the θ direction by the shaft 56, the above can be achieved.

[0057] As described above, when the devices 30 are slightly moved and aligned in the X-Y-θ directions by the base plate position adjusting device 50, it is preferable that the position of the devices is corrected in a state in which the bottom surface of the jig plate 20 is separated from the upper surface of the base plate 40.

[0058] Since the movable plate 54 is slightly moved in the X-Y-axis directions by the cross roller 55, and is slightly rotated in the θ direction by the shaft 56, the above can be achieved.

[0059] After the position of the devices 30 attracted to all of the vacuum holes 41 of the base plate 40 is corrected and aligned by the above operation, the devices are attracted by a vacuum pressure of about 50 to 100 mmHg, and thus the change in the position of the devices 30 due to vibration or the like is prevented when the devices are moved (S400 step).

[0060] After the devices are attracted to the base plate 40 by a vacuum pressure of about 50 to 100 mmHg, the inner surface of the opening section 21 is separated from the devices 30 that are aligned by driving the X and Y-axis motors 52a, 53, and the base plate 40 is lowered to the lower stop point by driving the Z-axis motor 102 provided in the conveyer 101.

[0061] After the base plate 40 is lowered to the lower dead point, the conveyer 101 is moved to the testing section 80 by the control section (not shown) and stopped, and then the base plate 40 is raised to the upper dead point by the re-activation of the Z-axis motor 102, so that the bump terminals of the device 30 attracted to the base plate 40 are simultaneously connected to the terminals of the tester 81, and the electrical test of the device 30 is performed for a predetermined time (S600 step).

[0062] While the testing section 80 is testing the electrical characteristics of the device 30 for a predetermined time, the loading section 60 loads the next device to be tested on a new base plate 40a, and aligns the plurality of devices on the base plate 40a as described above. The time for aligning the plurality of devices on the base plate 40a is shorter than the time for testing the device 30 in the testing section 81.

[0063] Therefore, the surface of the device is covered with frost or oxidized while the device is left as it is in the state of being aligned on the base plate 40a. Therefore, after the conveyer 101a is moved to the device flushing section 90, the base plate 40a is raised to the upper dead point by the Z-axis motor 102, and then sealed by the cover 91, and nitrogen gas is supplied through the supply pipe 92 to perform the flushing (S500 step).

[0064] After the testing section 80 performs the electrical test of the device 30 attracted to the base plate 40, the base plate 40 is lowered to the lower dead point again by the Z-axis motor 102, and then the conveyer 101 is moved to the unloading section 70, and then the tested device is sorted by another sorter, and then the good and bad products are unloaded (S700 step).

[0065] As described above, after the device to be tested is placed on the vacuum holes 41 of the base plate 40 through the opening 21 formed in the jig plate 20 in the unloading section, the plurality of devices are aligned simultaneously by the jig plate 20, and therefore it can be understood that the above-described unified operation can be performed.

[0066] Although the present application has been described in detail with reference to the accompanying drawings, it is understood that modifications can be made to the technical solutions or necessary features described in the above embodiments by those skilled in the art, and these modifications do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions described in the embodiments of the present application.

[0067] Therefore, the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the scope of the present application. The protection scope of the present application should be interpreted according to the scope of the claims below, and any modification or modification form within the same scope should belong to the scope of the claims of the present application.

[0068] Symbol explanation

[0069] 10: frame; 20: jig plate;

[0070] 21: opening part; 30: device;

[0071] 40: base plate; 41: vacuum hole;

[0072] 50: base plate position adjusting device; 51: setting plate;

[0073] 52a, 52b: X-axis motor; 53: Y-axis motor;

[0074] 54: movable plate; 55: cross roller;

[0075] 56: shaft; 60: loading part;

[0076] 70: unloading part; 80: testing part;

[0077] 81: tester; 90: device rinsing part;

[0078] 91: cover; 92: supply pipe;

[0079] 100: aligner; 101: conveyer;

[0080] 102: Z-axis motor; 110: guide rail.

Claims

1. A device alignment apparatus with fine pitch, comprising: a base plate (40) having vacuum holes (41) formed at positions where devices (30) are to be placed, and a vacuum pressure of 5 to 50 mmHg is applied to the devices (30) loaded in the base plate (40) to attract the devices (30) to the base plate (40); a jig plate (20) fixedly provided on an upper portion of the base plate (40) and having opening portions (21) formed in the same number as the devices (30) loaded in the base plate (40); and a base plate position adjustment apparatus (50) for slightly moving the devices (30) loaded in the base plate (40) in X-Y-θ directions to position the devices (30) in the opening portions (21) formed in the jig plate (20) in a four-side closed manner. In a state where the devices (30) are loaded in the opening portions (21) formed in the jig plate (20) and attracted to the base plate (40), the base plate (40) is slightly moved in the X-Y-θ directions as a whole by the base plate position adjustment apparatus (50), and the devices (30) are passively guided by inner edges of the opening portions (21) to inner sides of the opening portions (21), whereby the devices (30) are aligned at the same time.

2. The device alignment apparatus with fine pitch according to claim 1, wherein the base plate position adjustment apparatus (50) includes a setting plate (51) provided to be vertically movable; a pair of X-axis motors (52a, 52b) provided to face the setting plate (51); a Y-axis motor (53) provided to be perpendicular to the X-axis motors (52a, 52b) and to the setting plate (51); a movable plate (54) provided to be slightly movable in the X-Y-θ directions by the X-axis motors (52a, 52b) and the Y-axis motor (53); four cross rollers (55) provided between the setting plate (51) and the movable plate (54) to move the movable plate (54) in the X-Y directions; and a shaft (56) rotatably connecting the movable plate (54) to the cross rollers (55).

3. The device alignment apparatus with fine pitch according to claim 1, wherein the base plate (40) has a heater and a cooling pipe provided therein.

4. A device testing apparatus with fine pitch, comprising: a base plate (40) having vacuum holes (41) formed at positions where devices (30) are to be placed, and a vacuum pressure of 5 to 50 mmHg is applied to the devices (30) loaded in the base plate (40) to attract the devices (30) to the base plate (40); a jig plate (20) fixedly provided on an upper portion of the base plate (40) and having opening portions (21) formed in the same number as the devices (30) loaded in the base plate (40); a base plate position adjustment apparatus (50) for slightly moving the devices (30) loaded in the base plate (40) in X-Y-θ directions to position the devices (30) in the opening portions (21) formed in the jig plate (20) in a four-side closed manner; and a testing apparatus (60) for testing the devices (30) positioned in the opening portions (21) of the jig plate (20). The structure includes: a frame (10); a loading section (60) and an unloading section (70) provided at both ends of the frame (10); a plurality of four-edge closed opening sections (21) formed on the loading section (60) and a jig plate (20) on which devices (30) are loaded; an aligner (100) for aligning a plurality of devices (30) loaded in the opening sections (21) of the jig plate (20); a Z-axis motor (102) for raising and lowering the aligner (100); a guide rail (110) provided through the loading section (60) and the unloading section (70); a conveyor (101) horizontally moving along the guide rail (110) with the Z-axis motor (102) fixed; and a tester (81) for testing the performance of a plurality of devices (30) aligned by the aligner (100). The structure of the aligner (100) includes: a base plate (40) in which vacuum holes (41) are formed at the positions where the devices (30) are to be placed, and in which the devices (30) loaded in the state are attracted by vacuum pressure of 5-50 mmHg when the vacuum pressure is applied; and a base plate position adjusting device (50) for slightly moving the position of the devices (30) loaded on the base plate (40) in the X-Y-θ direction so as to be positioned on the opening sections (21) formed on the jig plate (20). In the state in which the devices (30) are loaded on each of the opening sections (21) formed on the jig plate (20) and are attracted to the base plate (40), the base plate (40) is slightly moved as a whole in the X-Y-θ direction by the base plate position adjusting device (50), the devices (30) are passively guided to the inner edges of the opening sections (21) by the inner edges of each of the opening sections (21), and a plurality of devices (30) are simultaneously aligned.

5. The device testing apparatus with fine pitch according to claim 4, wherein A device flushing section (90) is further provided between the loading section (60) and the testing section (80).

6. The device testing apparatus with fine pitch according to claim 5, wherein The device flushing section (90) includes: a cover (91) for sealing the base plate (40) on which the devices (30) are aligned; and a supply pipe (92) for supplying nitrogen gas to the inside of the cover (91).

7. A method of aligning devices having fine pitch, characterized by, The method includes the steps of: loading the devices (30) on the base plate (40) having the vacuum holes (41) through each of the four-edge closed opening sections (21) formed on the jig plate (20); attracting the devices (30) loaded on the base plate (40) by vacuum pressure of 5-50 mmHg when the vacuum pressure is applied in the state in which the devices (30) are loaded on the base plate (40); slightly moving the base plate (40) as a whole in the X-Y-θ direction by the base plate position adjusting device (50), passively guiding each of the devices (30) to the inner edges of the opening sections (21) by the inner edges of each of the opening sections (21), and further aligning the devices (30); simultaneously aligning the devices (30) loaded on the base plate (40).

8. The device alignment method with fine pitch according to claim 7, wherein, the alignment of the device (30) is further followed by a step of attracting the device (30) with a secondary pressure to prevent the device (30) from moving.

9. The device alignment method with fine pitch according to claim 8, wherein, the secondary pressure is 50-100 mmHg.

10. The device alignment method with fine pitch according to claim 7, wherein, after the position of the device (30) is aligned by the jig plate (20), the device (30) is moved away from both sides of the opening (21), and then the base plate (40) is lowered.

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